LAMXO640E [LATTICE]
LA-MachXO Automotive Family Data Sheet; LA-汽车的MachXO系列数据手册型号: | LAMXO640E |
厂家: | LATTICE SEMICONDUCTOR |
描述: | LA-MachXO Automotive Family Data Sheet |
文件: | 总77页 (文件大小:875K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LA-MachXO Automotive Family Data Sheet
DS1003 Version 01.5, November 2007
LA-MachXO Automotive Family Data Sheet
Introduction
April 2006
Data Sheet DS1003
• Programmable sysIO™ buffer supports wide
range of interfaces:
Features
■ Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single chip, no external configuration memory
required
− LVCMOS 3.3/2.5/1.8/1.5/1.2
− LVTTL
− PCI
− LVDS, Bus-LVDS, LVPECL, RSDS
• Excellent design security, no bit stream to
intercept
• Reconfigure SRAM based logic in milliseconds
• SRAM and non-volatile memory programmable
through JTAG port
■ sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide, and phase shifting
■ System Level Support
• IEEE Standard 1149.1 Boundary Scan
• Onboard oscillator
• Supports background programming of
non-volatile memory
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
power supply
• IEEE 1532 compliant in-system programming
■ AEC-Q100 Tested and Qualified
■ Sleep Mode
• Allows up to 100x static current reduction
■ TransFR™ Reconfiguration (TFR)
Introduction
• In-field logic update while system operates
The LA-MachXO automotive device family is optimized
to meet the requirements of applications traditionally
addressed by CPLDs and low capacity FPGAs: glue
logic, bus bridging, bus interfacing, power-up control,
and control logic. These devices bring together the best
features of CPLD and FPGA devices on a single chip in
AEC-Q100 tested and qualified versions.
■ High I/O to Logic Density
• 256 to 2280 LUT4s
• 73 to 271 I/Os with extensive package options
• Density migration supported
• Lead free/RoHS compliant packaging
■ Embedded and Distributed Memory
• Up to 27.6 Kbits sysMEM™ Embedded Block
RAM
The devices use look-up tables (LUTs) and embedded
block memories traditionally associated with FPGAs for
flexible and efficient logic implementation. Through non-
volatile technology, the devices provide the single-chip,
• Up to 7.5 Kbits distributed RAM
• Dedicated FIFO control logic
■ Flexible I/O Buffer
Table 1-1. LA-MachXO Automotive Family Selection Guide
Device
LAMXO256E/C
LAMXO640E/C
LAMXO1200E
LAMXO2280E
LUTs
256
640
1200
6.25
9.2
1
2280
7.5
27.6
3
Dist. RAM (Kbits)
EBR SRAM (Kbits)
2.0
6.0
0
0
Number of EBR SRAM Blocks (9 Kbits)
Voltage
0
0
V
1.2/1.8/2.5/3.3V
1.2/1.8/2.5/3.3V
1.2
1
1.2
2
CC
Number of PLLs
0
0
Max. I/O
78
159
211
271
Packages
100-pin Lead-Free TQFP (14x14 mm)
144-pin Lead-Free TQFP (20x20 mm)
256-ball Lead-Free ftBGA (17x17 mm)
324-ball Lead-Free ftBGA (19x19 mm)
78
74
73
73
113
159
113
211
113
211
271
© 2006 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1-1
DS1003 Introduction_01.0
Introduction
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
high-security, instant-on capabilities traditionally associated with CPLDs. Finally, advanced process technology and
careful design will provide the high pin-to-pin performance also associated with CPLDs.
The ispLEVER® design tools from Lattice allow complex designs to be efficiently implemented using the LA-
MachXO automotive family of devices. Popular logic synthesis tools provide synthesis library support for LA-
MachXO. The ispLEVER tools use the synthesis tool output along with the constraints from its floor planning tools
to place and route the design in the LA-MachXO device. The ispLEVER tool extracts the timing from the routing
and back-annotates it into the design for timing verification.
1-2
LA-MachXO Automotive Family Data Sheet
Architecture
February 2007
Data Sheet DS1003
Architecture Overview
The LA-MachXO family architecture contains an array of logic blocks surrounded by Programmable I/O (PIO).
Some devices in this family have sysCLOCK PLLs and blocks of sysMEM™ Embedded Block RAM (EBRs). Fig-
ures 2-1, 2-2, and 2-3 show the block diagrams of the various family members.
The logic blocks are arranged in a two-dimensional grid with rows and columns. The EBR blocks are arranged in a
column to the left of the logic array. The PIO cells are located at the periphery of the device, arranged into Banks.
The PIOs utilize a flexible I/O buffer referred to as a sysIO interface that supports operation with a variety of inter-
face standards. The blocks are connected with many vertical and horizontal routing channel resources. The place
and route software tool automatically allocates these routing resources.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and the Programmable Functional
unit without RAM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM, ROM, and register func-
tions. The PFF block contains building blocks for logic, arithmetic, ROM, and register functions. Both the PFU and
PFF blocks are optimized for flexibility, allowing complex designs to be implemented quickly and effectively. Logic
blocks are arranged in a two-dimensional array. Only one type of block is used per row.
In the LA-MachXO family, the number of sysIO Banks varies by device. There are different types of I/O Buffers on
different Banks. See the details in later sections of this document. The sysMEM EBRs are large, dedicated fast
memory blocks; these blocks are found only in the larger devices. These blocks can be configured as RAM, ROM
or FIFO. FIFO support includes dedicated FIFO pointer and flag “hard” control logic to minimize LUT use.
The LA-MachXO architecture provides up to two sysCLOCK™ Phase Locked Loop (PLL) blocks on larger devices.
These blocks are located at either end of the memory blocks. The PLLs have multiply, divide, and phase shifting
capabilities that are used to manage the frequency and phase relationships of the clocks.
Every device in the family has a JTAG Port that supports programming and configuration of the device as well as
access to the user logic.The LA-MachXO devices are available for operation from 3.3V, 2.5V, 1.8V, and 1.2V power
supplies, providing easy integration into the overall system.
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
2-1
DS1003 Architecture_01.2
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-1. Top View of the LA-MachXO1200 Device1
PIOs Arranged into
sysIO Banks
Programmable
Functional Units
with RAM (PFUs)
sysMEM Embedded
Block RAM (EBR)
Programmable
Functional Units
without RAM (PFFs)
sysCLOCK
PLL
JTAG Port
1. Top view of the LA-MachXO2280 device is similar but with higher LUT count, two PLLs, and three EBR blocks.
Figure 2-2. Top View of the LA-MachXO640 Device
PIOs Arranged into
sysIO Banks
Programmable
Function Units
without RAM (PFFs)
Programmable
Function Units
with RAM (PFUs)
JTAG Port
2-2
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-3. Top View of the LA-MachXO256 Device
Programmable Function
Units without RAM (PFFs)
JTAG Port
PIOs Arranged
into sysIO Banks
Programmable
Function
Units with
RAM (PFUs)
PFU Blocks
The core of the LA-MachXO devices consists of PFU and PFF blocks. The PFUs can be programmed to perform
Logic, Arithmetic, Distributed RAM, and Distributed ROM functions. PFF blocks can be programmed to perform
Logic, Arithmetic, and Distributed ROM functions. Except where necessary, the remainder of this data sheet will
use the term PFU to refer to both PFU and PFF blocks.
Each PFU block consists of four interconnected Slices, numbered 0-3 as shown in Figure 2-4. There are 53 inputs
and 25 outputs associated with each PFU block.
Figure 2-4. PFU Diagram
From
Routing
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
LUT4 &
CARRY
FCIN
FCO
Slice 3
Slice 0
Slice 1
Slice 2
D
D
D
D
FF/
D
D
FF/
D
D
FF/
FF/
FF/
FF/
FF/
FF/
Latch
Latch
Latch
Latch
Latch
Latch
Latch
Latch
To
Routing
Slice
Each Slice contains two LUT4 lookup tables feeding two registers (programmed to be in FF or Latch mode), and
some associated logic that allows the LUTs to be combined to perform functions such as LUT5, LUT6, LUT7, and
LUT8. There is control logic to perform set/reset functions (programmable as synchronous/asynchronous), clock
select, chip-select, and wider RAM/ROM functions. Figure 2-5 shows an overview of the internal logic of the Slice.
The registers in the Slice can be configured for positive/negative and edge/level clocks.
2-3
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
There are 14 input signals: 13 signals from routing and one from the carry-chain (from the adjacent Slice/PFU).
There are 7 outputs: 6 to the routing and one to the carry-chain (to the adjacent Slice/PFU). Table 2-1 lists the sig-
nals associated with each Slice.
Figure 2-5. Slice Diagram
To Adjacent Slice/PFU
Slice
OFX1
F1
A1
B1
C1
D1
CO
F
Fast Connection
to I/O Cell*
LUT4 &
CARRY
D
SUM
FF/
Latch
Q1
CI
To
From
Routing
Routing
M1
M0
OFX0
LUT
Expansion
Mux
Fast Connection
to I/O Cell*
CO
A0
B0
F0
C0
LUT4 &
CARRY
F
D0
OFX0
SUM
D
FF/
Latch
Q0
CI
Control Signals
selected and
inverted per
CE
CLK
LSR
Slice in routing
From Adjacent Slice/PFU
Notes:
Some inter-Slice signals are not shown.
* Only PFUs at the edges have fast connections to the I/O cell.
Table 2-1. Slice Signal Descriptions
Function
Input
Type
Signal Names
Description
Data signal
A0, B0, C0, D0 Inputs to LUT4
A1, B1, C1, D1 Inputs to LUT4
Input
Data signal
Input
Multi-purpose
Control signal
Control signal
Control signal
Inter-PFU signal
Data signals
Data signals
Data signals
Data signals
Inter-PFU signal
M0/M1
CE
Multipurpose Input
Clock Enable
Input
Input
LSR
Local Set/Reset
System Clock
Fast Carry In1
Input
CLK
Input
FCIN
F0, F1
Q0, Q1
OFX0
OFX1
FCO
Output
Output
Output
Output
Output
LUT4 output register bypass signals
Register Outputs
Output of a LUT5 MUX
Output of a LUT6, LUT7, LUT82 MUX depending on the Slice
Fast Carry Out1
1. See Figure 2-4 for connection details.
2. Requires two PFUs.
2-4
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Modes of Operation
Each Slice is capable of four modes of operation: Logic, Ripple, RAM, and ROM. The Slice in the PFF is capable of
all modes except RAM. Table 2-2 lists the modes and the capability of the Slice blocks.
Table 2-2. Slice Modes
Logic
Ripple
RAM
SP 16x2
N/A
ROM
PFU Slice
PFF Slice
LUT 4x2 or LUT 5x1
LUT 4x2 or LUT 5x1
2-bit Arithmetic Unit
2-bit Arithmetic Unit
ROM 16x1 x 2
ROM 16x1 x 2
Logic Mode: In this mode, the LUTs in each Slice are configured as 4-input combinatorial lookup tables (LUT4). A
LUT4 can have 16 possible input combinations. Any logic function with four inputs can be generated by program-
ming this lookup table. Since there are two LUT4s per Slice, a LUT5 can be constructed within one Slice. Larger
lookup tables such as LUT6, LUT7, and LUT8 can be constructed by concatenating other Slices.
Ripple Mode: Ripple mode allows the efficient implementation of small arithmetic functions. In ripple mode, the fol-
lowing functions can be implemented by each Slice:
• Addition 2-bit
• Subtraction 2-bit
• Add/Subtract 2-bit using dynamic control
• Up counter 2-bit
• Down counter 2-bit
• Ripple mode multiplier building block
• Comparator functions of A and B inputs
- A greater-than-or-equal-to B
- A not-equal-to B
- A less-than-or-equal-to B
Two additional signals, Carry Generate and Carry Propagate, are generated per Slice in this mode, allowing fast
arithmetic functions to be constructed by concatenating Slices.
RAM Mode: In this mode, distributed RAM can be constructed using each LUT block as a 16x2-bit memory.
Through the combination of LUTs and Slices, a variety of different memories can be constructed.
The ispLEVER design tool supports the creation of a variety of different size memories. Where appropriate, the
software will construct these using distributed memory primitives that represent the capabilities of the PFU.
Table 2-3 shows the number of Slices required to implement different distributed RAM primitives. Figure 2-6 shows
the distributed memory primitive block diagrams. Dual port memories involve the pairing of two Slices. One Slice
functions as the read-write port, while the other companion Slice supports the read-only port. For more information
on RAM mode in LA-MachXO devices, please see details of additional technical documentation at the end of this
data sheet.
Table 2-3. Number of Slices Required For Implementing Distributed RAM
SPR16x2
DPR16x2
Number of Slices
1
2
Note: SPR = Single Port RAM, DPR = Dual Port RAM
2-5
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-6. Distributed Memory Primitives
SPR16x2
DPR16x2
AD0
AD1
AD2
AD3
RAD0
RAD1
RAD2
RAD3
WAD0
WAD1
WAD2
WAD3
DO0
DO1
DI0
DI1
WRE
DI0
DI1
WCK
WRE
RDO0
RDO1
WDO0
WDO1
CK
ROM16x1
AD0
AD1
AD2
AD3
DO0
ROM Mode:The ROM mode uses the same principal as the RAM modes, but without the Write port. Pre-loading is
accomplished through the programming interface during configuration.
PFU Modes of Operation
Slices can be combined within a PFU to form larger functions. Table 2-4 tabulates these modes and documents the
functionality possible at the PFU level.
Table 2-4. PFU Modes of Operation
Logic
Ripple
RAM
ROM
LUT 4x8 or
MUX 2x1 x 8
SPR16x2 x 4
DPR16x2 x 2
2-bit Add x 4
ROM16x1 x 8
LUT 5x4 or
MUX 4x1 x 4
SPR16x4 x 2
DPR16x4 x 1
2-bit Sub x 4
2-bit Counter x 4
2-bit Comp x 4
ROM16x2 x 4
ROM16x4 x 2
ROM16x8 x 1
LUT 6x 2 or
MUX 8x1 x 2
SPR16x8 x 1
LUT 7x1 or
MUX 16x1 x 1
Routing
There are many resources provided in the LA-MachXO devices to route signals individually or as buses with
related control signals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing)
segments.
The inter-PFU connections are made with three different types of routing resources: x1 (spans two PFUs), x2
(spans three PFUs) and x6 (spans seven PFUs). The x1, x2, and x6 connections provide fast and efficient connec-
tions in the horizontal and vertical directions.
2-6
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
The ispLEVER design tool takes the output of the synthesis tool and places and routes the design. Generally, the
place and route tool is completely automatic, although an interactive routing editor is available to optimize the
design.
Clock/Control Distribution Network
The LA-MachXO automotive family of devices provides global signals that are available to all PFUs. These signals
consist of four primary clocks and four secondary clocks. Primary clock signals are generated from four 16:1 muxes
as shown in Figure 2-7 and Figure 2-8. The available clock sources for the LA-MachXO256 and LA-MachXO640
devices are four dual function clock pins and 12 internal routing signals. The available clock sources for the LA-
MachXO1200 and LA-MachXO2280 devices are four dual function clock pins, up to nine internal routing signals
and up to six PLL outputs.
Figure 2-7. Primary Clocks for LA-MachXO256 and LA-MachXO640 Devices
12
4
Primary Clock 0
Primary Clock 1
16:1
16:1
Primary Clock 2
Primary Clock 3
16:1
16:1
Routing Clock
Pads
2-7
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-8. Primary Clocks for LA-MachXO1200 and LA-MachXO2280 Devices
Up to 9
Up to 6
4
Primary Clock 0
Primary Clock 1
16:1
16:1
16:1
Primary Clock 2
Primary Clock 3
16:1
Routing Clock
PLL
Pads Outputs
Four secondary clocks are generated from four 16:1 muxes as shown in Figure 2-9. Four of the secondary clock
sources come from dual function clock pins and 12 come from internal routing.
Figure 2-9. Secondary Clocks for LA-MachXO Devices
12
4
16:1
16:1
Secondary (Control)
Clocks
16:1
16:1
Routing Clock
Pads
2-8
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
sysCLOCK Phase Locked Loops (PLLs)
The LA-MachXO1200 and LA-MachXO2280 provide PLL support. The source of the PLL input divider can come
from an external pin or from internal routing. There are four sources of feedback signals to the feedback divider:
from CLKINTFB (internal feedback port), from the global clock nets, from the output of the post scalar divider, and
from the routing (or from an external pin).There is a PLL_LOCK signal to indicate that the PLL has locked on to the
input clock signal. Figure 2-10 shows the sysCLOCK PLL diagram.
The setup and hold times of the device can be improved by programming a delay in the feedback or input path of
the PLL which will advance or delay the output clock with reference to the input clock. This delay can be either pro-
grammed during configuration or can be adjusted dynamically. In dynamic mode, the PLL may lose lock after
adjustment and not relock until the t
parameter has been satisfied. Additionally, the phase and duty cycle block
LOCK
allows the user to adjust the phase and duty cycle of the CLKOS output.
The sysCLOCK PLLs provide the ability to synthesize clock frequencies. Each PLL has four dividers associated
with it: input clock divider, feedback divider, post scalar divider, and secondary clock divider. The input clock divider
is used to divide the input clock signal, while the feedback divider is used to multiply the input clock signal.The post
scalar divider allows the VCO to operate at higher frequencies than the clock output, thereby increasing the fre-
quency range. The secondary divider is used to derive lower frequency outputs.
Figure 2-10. PLL Diagram
Dynamic Delay Adjustment
LOCK
RST
Input Clock
Divider
(CLKI)
Post Scalar
Divider
(CLKOP)
Phase/Duty
Select
Voltage
Controlled
Oscillator
CLKOS
Delay
Adjust
CLKI
(from routing or
external pin)
CLKOP
CLKOK
Secondary
Clock
Divider
Feedback
Divider
(CLKFB)
CLKFB
(from Post Scalar
Divider output,
clock net,
(CLKOK)
routing/external
pin or CLKINTFB
port
CLKINTFB
(internal feedback)
Figure 2-11 shows the available macros for the PLL. Table 2-5 provides signal description of the PLL Block.
Figure 2-11. PLL Primitive
RST
CLKOP
CLKI
CLKFB
CLKOS
CLKOK
LOCK
DDA MODE
DDAIZR
EHXPLLC
DDAILAG
CLKINTFB
DDAIDEL[2:0]
2-9
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Table 2-5. PLL Signal Descriptions
Signal
I/O
Description
CLKI
I
I
Clock input from external pin or routing
PLL feedback input from PLL output, clock net, routing/external pin or internal feedback from
CLKINTFB port
CLKFB
RST
I
O
O
O
O
O
I
“1” to reset the input clock divider
CLKOS
PLL output clock to clock tree (phase shifted/duty cycle changed)
PLL output clock to clock tree (No phase shift)
PLL output to clock tree through secondary clock divider
“1” indicates PLL LOCK to CLKI
CLKOP
CLKOK
LOCK
CLKINTFB
DDAMODE
DDAIZR
DDAILAG
DDAIDEL[2:0]
Internal feedback source, CLKOP divider output before CLOCKTREE
Dynamic Delay Enable. “1”: Pin control (dynamic), “0”: Fuse Control (static)
Dynamic Delay Zero. “1”: delay = 0, “0”: delay = on
Dynamic Delay Lag/Lead. “1”: Lag, “0”: Lead
I
I
I
Dynamic Delay Input
For more information on the PLL, please see details of additional technical documentation at the end of this data
sheet.
sysMEM Memory
The LA-MachXO1200 and LA-MachXO2280 devices contain sysMEM Embedded Block RAMs (EBRs). The EBR
consists of a 9-Kbit RAM, with dedicated input and output registers.
sysMEM Memory Block
The sysMEM block can implement single port, dual port, pseudo dual port, or FIFO memories. Each block can be
used in a variety of depths and widths as shown in Table 2-6.
Table 2-6. sysMEM Block Configurations
Memory Mode
Configurations
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
256 x 36
Single Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
True Dual Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
256 x 36
Pseudo Dual Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
256 x 36
FIFO
2-10
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Bus Size Matching
All of the multi-port memory modes support different widths on each of the ports. The RAM bits are mapped LSB
word 0 to MSB word 0, LSB word 1 to MSB word 1 and so on. Although the word size and number of words for
each port varies, this mapping scheme applies to each port.
RAM Initialization and ROM Operation
If desired, the contents of the RAM can be pre-loaded during device configuration. By preloading the RAM block
during the chip configuration cycle and disabling the write controls, the sysMEM block can also be utilized as a
ROM.
Memory Cascading
Larger and deeper blocks of RAMs can be created using EBR sysMEM Blocks. Typically, the Lattice design tools
cascade memory transparently, based on specific design inputs.
Single, Dual, Pseudo-Dual Port and FIFO Modes
Figure 2-12 shows the five basic memory configurations and their input/output names. In all the sysMEM RAM
modes, the input data and address for the ports are registered at the input of the memory array. The output data of
the memory is optionally registered at the memory array output.
Figure 2-12. sysMEM Memory Primitives
ADA[12:0]
DIA[17:0]
CLKA
CEA
RSTA
WEA
CSA[2:0]
DOA[17:0]
ADB[12:0]
DIB[17:0]
CEB
CLKB
RSTB
WEB
CSB[2:0]
DOB[17:0]
AD[12:0]
DI[35:0]
CLK
DO[35:0]
CE
EBR
EBR
RST
WE
CS[2:0]
True Dual Port RAM
Single Port RAM
ADW[12:0]
DI[35:0]
CLKW
CEW
ADR[12:0]
DO[35:0]
AD[12:0]
CLK
DO[35:0]
CE
EBR
ROM
EBR
WE
RST
CS[2:0]
CER
RST
CS[2:0]
CLKR
Pseudo-Dual Port RAM
DO[35:0]
CLKR
RSTB
RE
RCE
FF
DI[35:0]
CLKW
RSTA
WE
EBR
CEW
AF
EF
AE
FIFO
2-11
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
The EBR memory supports three forms of write behavior for single or dual port operation:
1. Normal – data on the output appears only during the read cycle. During a write cycle, the data (at the current
address) does not appear on the output. This mode is supported for all data widths.
2. WriteThrough – a copy of the input data appears at the output of the same port.This mode is supported for all
data widths.
3. Read-Before-Write – when new data is being written, the old contents of the address appears at the output.
This mode is supported for x9, x18 and x36 data widths.
FIFO Configuration
The FIFO has a write port with Data-in, CEW, WE and CLKW signals. There is a separate read port with Data-out,
RCE, RE and CLKR signals. The FIFO internally generates Almost Full, Full, Almost Empty and Empty Flags. The
Full and Almost Full flags are registered with CLKW. The Empty and Almost Empty flags are registered with CLKR.
The range of programming values for these flags are in Table 2-7.
Table 2-7. Programmable FIFO Flag Ranges
Flag Name
Programming Range
1 to (up to 2N-1)
1 to Full-1
Full (FF)
Almost Full (AF)
Almost Empty (AE)
Empty (EF)
1 to Full-1
0
N = Address bit width
The FIFO state machine supports two types of reset signals: RSTA and RSTB. The RSTA signal is a global reset
that clears the contents of the FIFO by resetting the read/write pointer and puts the FIFO flags in their initial reset
state. The RSTB signal is used to reset the read pointer. The purpose of this reset is to retransmit the data that is in
the FIFO. In these applications it is important to keep careful track of when a packet is written into or read from the
FIFO.
Memory Core Reset
The memory array in the EBR utilizes latches at the A and B output ports. These latches can be reset asynchro-
nously. RSTA and RSTB are local signals, which reset the output latches associated with Port A and Port B respec-
tively. The Global Reset (GSRN) signal resets both ports. The output data latches and associated resets for both
ports are as shown in Figure 2-13.
2-12
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-13. Memory Core Reset
SET
Q
Memory Core
Port A[17:0]
Port B[17:0]
LCLR
Output Data
Latches
SET
D
Q
LCLR
RSTA
RSTB
GSRN
Programmable Disable
For further information on the sysMEM EBR block, see the details of additional technical documentation at the end
of this data sheet.
EBR Asynchronous Reset
EBR asynchronous reset or GSR (if used) can only be applied if all clock enables are low for a clock cycle before the
reset is applied and released a clock cycle after the reset is released, as shown in Figure 2-14. The GSR input to the
EBR is always asynchronous.
Figure 2-14. EBR Asynchronous Reset (Including GSR) Timing Diagram
Reset
Clock
Clock
Enable
If all clock enables remain enabled, the EBR asynchronous reset or GSR may only be applied and released after
the EBR read and write clock inputs are in a steady state condition for a minimum of 1/f
(EBR clock). The reset
MAX
release must adhere to the EBR synchronous reset setup time before the next active read or write clock edge.
If an EBR is pre-loaded during configuration, the GSR input must be disabled or the release of the GSR during
device Wake Up must occur before the release of the device I/Os becoming active.
These instructions apply to all EBR RAM, ROM and FIFO implementations. For the EBR FIFO mode, the GSR sig-
nal is always enabled and the WE and RE signals act like the clock enable signals in Figure 2-14. The reset timing
rules apply to the RPReset input vs the RE input and the RST input vs. the WE and RE inputs. Both RST and
RPReset are always asynchronous EBR inputs.
Note that there are no reset restrictions if the EBR synchronous reset is used and the EBR GSR input is disabled.
2-13
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
PIO Groups
On the LA-MachXO devices, PIO cells are assembled into two different types of PIO groups, those with four PIO
cells and those with six PIO cells. PIO groups with four IOs are placed on the left and right sides of the device while
PIO groups with six IOs are placed on the top and bottom. The individual PIO cells are connected to their respec-
tive sysIO buffers and PADs.
On all LA-MachXO devices, two adjacent PIOs can be joined to provide a complementary Output driver pair. The I/
O pin pairs are labeled as "T" and "C" to distinguish between the true and complement pins.
The LA-MachXO1200 and LA-MachXO2280 devices contain enhanced I/O capability. All PIO pairs on these larger
devices can implement differential receivers. In addition, half of the PIO pairs on the left and right sides of these
devices can be configured as LVDS transmit/receive pairs. PIOs on the top of these larger devices also provide PCI
support.
Figure 2-15. Group of Four Programmable I/O Cells
This structure is used on the
left and right of MachXO devices
PADA "T"
PIO A
PADB "C"
PIO B
Four PIOs
PADC "T"
PIO C
PADD "C"
PIO D
Figure 2-16. Group of Six Programmable I/O Cells
This structure is used on the top
and bottom of MachXO devices
PADA "T"
PIO A
PADB "C"
PIO B
PADC "T"
PIO C
Six PIOs
PADD "C"
PIO D
PADE "T"
PIO E
PADF "C"
PIO F
PIO
The PIO blocks provide the interface between the sysIO buffers and the internal PFU array blocks. These blocks
receive output data from the PFU array and a fast output data signal from adjacent PFUs. The output data and fast
2-14
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
output data signals are multiplexed and provide a single signal to the I/O pin via the sysIO buffer. Figure 2-17
shows the LA-MachXO PIO logic.
The tristate control signal is multiplexed from the output data signals and their complements. In addition a global
signal (TSALL) from a dedicated pad can be used to tristate the sysIO buffer.
The PIO receives an input signal from the pin via the sysIO buffer and provides this signal to the core of the device.
In addition there are programmable elements that can be utilized by the design tools to avoid positive hold times.
Figure 2-17. LA-MachXO PIO Block Diagram
From Routing
From Routing
TS
TSALL
TO
sysIO
Buffer
Fast Output
Data signal
DO
PAD
1
Input
Data Signal
2
3
Programmable
Delay Elements
4+-
Note: Buffer 1 tracks with V
Buffer 2 tracks with V
CCAUX
CCIO.
From Complementary
Pad
Buffer 3 tracks with internal 1.2V V
Buffer 4 is available in MachXO1200 and MachXO2280 devices only.
.
REF
sysIO Buffer
Each I/O is associated with a flexible buffer referred to as a sysIO buffer. These buffers are arranged around the
periphery of the device in groups referred to as Banks. The sysIO buffers allow users to implement the wide variety
of standards that are found in today’s systems including LVCMOS, TTL, BLVDS, LVDS and LVPECL.
In the LA-MachXO devices, single-ended output buffers and ratioed input buffers (LVTTL, LVCMOS and PCI) are
powered using V
. In addition to the Bank V
supplies, the LA-MachXO devices have a V core logic power
CCIO
CCIO CC
supply, and a V
input buffers.
supply that powers up a variety of internal circuits including all the differential and referenced
CCAUX
LA-MachXO256 and LA-MachXO640 devices contain single-ended input buffers and single-ended output buffers
with complementary outputs on all the I/O Banks.
LA-MachXO1200 and LA-MachXO2280 devices contain two types of sysIO buffer pairs.
1. Top and Bottom sysIO Buffer Pairs
The sysIO buffer pairs in the top and bottom Banks of the device consist of two single-ended output drivers and
two sets of single-ended input buffers (for ratioed or absolute input levels). The I/O pairs on the top and bottom
2-15
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
of the devices also support differential input buffers. PCI clamps are available on the top Bank I/O buffers. The
PCI clamp is enabled after V , V , and V are at valid operating levels and the device has been con-
CC CCAUX
CCIO
figured.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
2. Left and Right sysIO Buffer Pairs
The sysIO buffer pairs in the left and right Banks of the device consist of two single-ended output drivers and
two sets of single-ended input buffers (supporting ratioed and absolute input levels). The devices also have a
differential driver per output pair. The referenced input buffer can also be configured as a differential input
buffer. In these Banks the two pads in the pair are described as “true” and “comp”, where the true pad is asso-
ciated with the positive side of the differential I/O, and the comp (complementary) pad is associated with the
negative side of the differential I/O.
Typical I/O Behavior During Power-up
The internal power-on-reset (POR) signal is deactivated when V and V
have reached satisfactory levels.
CC
CCAUX
After the POR signal is deactivated, the FPGA core logic becomes active. It is the user’s responsibility to ensure
that all V Banks are active with valid input logic levels to properly control the output logic states of all the I/O
CCIO
Banks that are critical to the application. The default configuration of the I/O pins in a blank device is tri-state with a
weak pull-up to VCCIO. The I/O pins will maintain the blank configuration until VCC, VCCAUX and VCCIO have
reached satisfactory levels at which time the I/Os will take on the user-configured settings.
The V and V
supply the power to the FPGA core fabric, whereas the V
supplies power to the I/O buff-
CC
CCAUX
CCIO
ers. In order to simplify system design while providing consistent and predictable I/O behavior, the I/O buffers
should be powered up along with the FPGA core fabric. Therefore, V supplies should be powered up before or
CCIO
together with the V and V
supplies
CC
CCAUX
Supported Standards
The LA-MachXO sysIO buffer supports both single-ended and differential standards. Single-ended standards can
be further subdivided into LVCMOS and LVTTL. The buffer supports the LVTTL, LVCMOS 1.2, 1.5, 1.8, 2.5, and
3.3V standards. In the LVCMOS and LVTTL modes, the buffer has individually configurable options for drive
strength, bus maintenance (weak pull-up, weak pull-down, bus-keeper latch or none) and open drain. BLVDS and
LVPECL output emulation is supported on all devices.The LA-MachXO1200 and LA-MachXO2280 support on-chip
LVDS output buffers on approximately 50% of the I/Os on the left and right Banks. Differential receivers for LVDS,
BLVDS and LVPECL are supported on all Banks of LA-MachXO1200 and LA-MachXO2280 devices. PCI support is
provided in the top Banks of the LA-MachXO1200 and LA-MachXO2280 devices. Table 2-8 summarizes the I/O
characteristics of the devices in the LA-MachXO family.
Tables 2-9 and 2-10 show the I/O standards (together with their supply and reference voltages) supported by the
LA-MachXO devices. For further information on utilizing the sysIO buffer to support a variety of standards please
see the details of additional technical documentation at the end of this data sheet.
2-16
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Table 2-8. I/O Support Device by Device
LA-MachXO256
LA-MachXO640
LA-MachXO1200
LA-MachXO2280
Number of I/O Banks
Type of Input Buffers
2
4
8
8
Single-ended
(all I/O Banks)
Single-ended
(all I/O Banks)
Single-ended
(all I/O Banks)
Single-ended
(all I/O Banks)
Differential Receivers
(all I/O Banks)
Differential Receivers
(all I/O Banks)
Single-ended buffers
with complementary
Single-ended buffers
with complementary
Single-ended buffers
with complementary
Single-ended buffers
with complementary
outputs (all I/O Banks) outputs (all I/O Banks) outputs (all I/O Banks) outputs (all I/O Banks)
Types of Output Buffers
Differential buffers with Differential buffers with
true LVDS outputs (50% true LVDS outputs (50%
on left and right side)
on left and right side)
Differential Output
Emulation Capability
All I/O Banks
No
All I/O Banks
No
All I/O Banks
All I/O Banks
PCI Support
Top side only
Top side only
Table 2-9. Supported Input Standards
VCCIO (Typ.)
Input Standard
3.3V
2.5V
1.8V
1.5V
1.2V
Single Ended Interfaces
LVTTL
√
√
√
√
√
√
√
√
√
√
√
√
√
√
√
√
LVCMOS33
LVCMOS25
LVCMOS18
LVCMOS15
√
√
LVCMOS12
PCI1
√
√
√
√
√
√
√
Differential Interfaces
BLVDS2, LVDS2, LVPECL2, RSDS2
√
√
√
1. Top Banks of LA-MachXO1200 and LA-MachXO2280 devices only.
2. LA-MachXO1200 and LA-MachXO2280 devices only.
2-17
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Table 2-10. Supported Output Standards
Output Standard
Single-ended Interfaces
LVTTL
Drive
V
(Typ.)
CCIO
4mA, 8mA, 12mA, 16mA
4mA, 8mA, 12mA, 14mA
4mA, 8mA, 12mA, 14mA
4mA, 8mA, 12mA, 14mA
4mA, 8mA
3.3
LVCMOS33
3.3
2.5
1.8
1.5
1.2
—
LVCMOS25
LVCMOS18
LVCMOS15
LVCMOS12
2mA, 6mA
LVCMOS33, Open Drain
LVCMOS25, Open Drain
LVCMOS18, Open Drain
LVCMOS15, Open Drain
LVCMOS12, Open Drain
PCI333
4mA, 8mA, 12mA, 14mA
4mA, 8mA, 12mA, 14mA
4mA, 8mA, 12mA, 14mA
4mA, 8mA
—
—
—
2mA, 6mA
—
N/A
3.3
Differential Interfaces
LVDS1, 2
BLVDS, RSDS2
N/A
N/A
N/A
2.5
2.5
3.3
LVPECL2
1. LA-MachXO1200 and LA-MachXO2280 devices have dedicated LVDS buffers.
2. These interfaces can be emulated with external resistors in all devices.
3. Top Banks of LA-MachXO1200 and LA-MachXO2280 devices only.
sysIO Buffer Banks
The number of Banks vary between the devices of this family. Eight Banks surround the two larger devices, the LA-
MachXO1200 and LA-MachXO2280 (two Banks per side). The LA-MachXO640 has four Banks (one Bank per
side). The smallest member of this family, the LA-MachXO256, has only two Banks.
Each sysIO buffer Bank is capable of supporting multiple I/O standards. Each Bank has its own I/O supply voltage
(V
) which allows it to be completely independent from the other Banks. Figure 2-18, Figure 2-18, Figure 2-20
CCIO
and Figure 2-21 shows the sysIO Banks and their associated supplies for all devices.
2-18
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-18. LA-MachXO2280 Banks
1
1
35
1
36
1
Bank 0
Bank 1
VCCIO2
GND
VCCIO7
GND
34
1
34
1
VCCIO6
GND
VCCIO3
GND
33
1
33
Bank 5
Bank 4
31
1
35
Figure 2-19. LA-MachXO1200 Banks
1
1
24
1
30
1
Bank 0
Bank 1
VCCIO2
GND
VCCIO7
GND
26
1
26
1
VCCIO6
GND
VCCIO3
GND
28
1
28
Bank 5
Bank 4
20
1
29
2-19
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-20. LA-MachXO640 Banks
1
1
42
1
Bank 0
VCCO3
GND
VCCO1
GND
40
1
40
37
Bank 2
Figure 2-21. LA-MachXO256 Banks
VCCO0
GND
1
1
Bank 0
41
37
Bank 1
GND
V CCO1
Hot Socketing
The LA-MachXO automotive devices have been carefully designed to ensure predictable behavior during power-
up and power-down. Leakage into I/O pins is controlled to within specified limits. This allows for easy integration
2-20
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
with the rest of the system. These capabilities make the LA-MachXO ideal for many multiple power supply and
hot-swap applications.
Sleep Mode
The LA-MachXO “C” devices (V
= 1.8/2.5/3.3V) have a sleep mode that allows standby current to be reduced
CC
dramatically during periods of system inactivity. Entry and exit to Sleep mode is controlled by the SLEEPN pin.
During Sleep mode, the logic is non-operational, registers and EBR contents are not maintained, and I/Os are tri-
stated. Do not enter Sleep mode during device programming or configuration operation. In Sleep mode, power sup-
plies are in their normal operating range, eliminating the need for external switching of power supplies. Table 2-11
compares the characteristics of Normal, Off and Sleep modes.
Table 2-11. Characteristics of Normal, Off and Sleep Modes
Characteristic
SLEEPN Pin
Normal
High
Off
Sleep
Low
—
0
Static Icc
Typical <10mA
<10µA
Typical <100uA
<10µA
I/O Leakage
<1mA
Power Supplies VCC/VCCIO/VCCAUX
Logic Operation
Normal Range
User Defined
User Defined
Operational
Maintained
0
Normal Range
Non operational
Tri-state
Non Operational
Tri-state
I/O Operation
JTAG and Programming circuitry
EBR Contents and Registers
Non-operational
Non-maintained
Non-operational
Non-maintained
SLEEPN Pin Characteristics
The SLEEPN pin behaves as an LVCMOS input with the voltage standard appropriate to the VCC supply for the
device. This pin also has a weak pull-up, along with a Schmidt trigger and glitch filter to prevent false triggering. An
external pull-up to VCC is recommended when Sleep Mode is not used to ensure the device stays in normal oper-
ation mode. Typically, the device enters sleep mode several hundred nanoseconds after SLEEPN is held at a valid
low and restarts normal operation as specified in the Sleep Mode Timing table. The AC and DC specifications por-
tion of this data sheet shows a detailed timing diagram.
Oscillator
Every LA-MachXO device has an internal CMOS oscillator. The oscillator can be routed as an input clock to the
clock tree or to general routing resources. The oscillator frequency can be divided by internal logic. There is a ded-
icated programming bit to enable/disable the oscillator. The oscillator frequency ranges from 16MHz to 26MHz.
Configuration and Testing
The following section describes the configuration and testing features of the LA-MachXO automotive family of
devices.
IEEE 1149.1-Compliant Boundary Scan Testability
All LA-MachXO devices have boundary scan cells that are accessed through an IEEE 1149.1 compliant test
access port (TAP). This allows functional testing of the circuit board, on which the device is mounted, through a
serial scan path that can access all critical logic nodes. Internal registers are linked internally, allowing test data to
be shifted in and loaded directly onto test nodes, or test data to be captured and shifted out for verification.The test
access port consists of dedicated I/Os: TDI, TDO, TCK and TMS. The test access port shares its power supply with
one of the VCCIO Banks (LA-MachXO256: V
; LA-MachXO640: V
; LA-MachXO1200 and LA-
CCIO1
CCIO2
MachXO2280: V
) and can operate with LVCMOS3.3, 2.5, 1.8, 1.5, and 1.2 standards.
CCIO5
For more details on boundary scan test, please see information regarding additional technical documentation at
the end of this data sheet.
2-21
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Device Configuration
All LA-MachXO devices contain a test access port that can be used for device configuration and programming.
The non-volatile memory in the LA-MachXO can be configured in two different modes:
• In IEEE 1532 mode via the IEEE 1149.1 port. In this mode, the device is off-line and I/Os are controlled by
BSCAN registers.
• In background mode via the IEEE 1149.1 port. This allows the device to remain operational in user mode
while reprogramming takes place.
The SRAM configuration memory can be configured in three different ways:
• At power-up via the on-chip non-volatile memory.
• After a refresh command is issued via the IEEE 1149.1 port.
• In IEEE 1532 mode via the IEEE 1149.1 port.
Figure 2-22 provides a pictorial representation of the different programming modes available in the LA-MachXO
devices. On power-up, the SRAM is ready to be configured with IEEE 1149.1 serial TAP port using IEEE 1532 pro-
tocols.
Leave Alone I/O
When using IEEE 1532 mode for non-volatile memory programming, SRAM configuration, or issuing a refresh
command, users may specify I/Os as high, low, tristated or held at current value. This provides excellent flexibility
for implementing systems where reconfiguration or reprogramming occurs on-the-fly.
TransFR (Transparent Field Reconfiguration)
TransFR (TFR) is a unique Lattice technology that allows users to update their logic in the field without interrupting
system operation using a single ispVM command. See Lattice technical note #TN1087, Minimizing System Inter-
ruption During Configuration Using TransFR Technology, for details.
Security
The LA-MachXO automotive devices contain security bits that, when set, prevent the readback of the SRAM con-
figuration and non-volatile memory spaces. Once set, the only way to clear the security bits is to erase the memory
space.
For more information on device configuration, please see details of additional technical documentation at the end
of this data sheet.
AEC-Q100 Tested and Qualified
The Automotive Electronics Council (AEC) consists of two committees: the Quality Systems Committee and the
Component Technical Committee. These committees are composed of representatives from sustaining and other
associate members. The AEC Component Technical Committee is the standardization body for establishing stan-
dards for reliable, high quality electronic components. In particular, the AEC-Q100 specification “Stress Test for
Qualification for Integrated Circuits” defines qualification and re-qualification requirements for electronic compo-
nents. Components meeting these specifications are suitable for use in the harsh automotive environment without
additional component-level qualification testing. Lattice's LA-ispMACH 4000V and LA-MachXO devices completed
and passed the requirements of the AEC-Q100 specification.
2-22
Architecture
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Figure 2-22. LA-MachXO Configuration and Programming
ISP 1149.1 TAP Port
Port
Background
1532
Mode
Configure in milliseconds
Program in seconds
Power-up
Refresh
Non-Volatile
Memory Space
SRAM Memory
Space
Download in
microseconds
Density Shifting
The LA-MachXO family has been designed to enable density migration in the same package. Furthermore, the
architecture ensures a high success rate when performing design migration from lower density parts to higher den-
sity parts. In many cases, it is also possible to shift a lower utilization design targeted for a high-density device to a
lower density device. However, the exact details of the final resource utilization will impact the likely success in
each case.
2-23
LA-MachXO Automotive Family Data Sheet
DC and Switching Characteristics
November 2007
Data Sheet DS1003
Absolute Maximum Ratings1, 2, 3
LCMXO E (1.2V)
LCMXO C (1.8V/2.5V/3.3V)
Supply Voltage V . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 1.32V . . . . . . . . . . . . . . . -0.5 to 3.75V
CC
Supply Voltage V
. . . . . . . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
CCAUX
Output Supply Voltage V
. . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
CCIO
I/O Tristate Voltage Applied 4 . . . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
Dedicated Input Voltage Applied4 . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 4.25V
Storage Temperature (ambient). . . . . . . . . . . . . . . -65 to 150°C . . . . . . . . . . . . . . . -65 to 150°C
Junction Temp. (Tj) . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C . . . . . . . . . . . . . . . . . . . +125°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
2. Compliance with the Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. Overshoot and undershoot of -2V to (V
+ 2) volts is permitted for a duration of <20ns.
IHMAX
Recommended Operating Conditions1
Symbol
Parameter
Min.
1.14
1.71
3.135
1.14
-40
Max.
1.26
Units
V
Core Supply Voltage for 1.2V Devices
V
CC
Core Supply Voltage for 1.8V/2.5V/3.3V Devices
Auxiliary Supply Voltage
3.465
3.465
3.465
125
V
3
V
V
t
V
CCAUX
2
I/O Driver Supply Voltage
V
CCIO
Junction Temperature Automotive Operation
Junction Temperature, Flash Programming, Automotive
oC
oC
JAUTO
t
-40
125
JFLASHAUTO
1. Like power supplies must be tied together. For example, if V
and V are both 2.5V, they must also be the same supply. 3.3V V
CC CCIO
CCIO
and 1.2V V
should be tied to V
or 1.2V V respectively.
CCIO
CCAUX CC
2. See recommended voltages by I/O standard in subsequent table.
3. V must reach minimum V value before V reaches 2.5V.
CC
CC
CCAUX
LA-MachXO256 and LA-MachXO640 Hot Socketing Specifications1, 2, 3
Symbol
Parameter
Condition
Min.
Typ.
Max
Units
I
Input or I/O leakage Current
0 ≤ V ≤ V (MAX)
—
—
+/-1000
µA
DK
IN
IH
1. Insensitive to sequence of V
V
and V
. However, assumes monotonic rise/fall rates for V
V
and V
CC, CCAUX,
CCIO
CC, CCAUX, CCIO.
2. 0 ≤ V ≤ V (MAX), 0 ≤ V
≤ V
(MAX) and 0 ≤ V
≤ V
(MAX).
CC
CC
CCIO
CCIO
CCAUX
CCAUX
3. I is additive to I
I
or I
.
DK
PU, PD
BH
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
3-1
DS1003 DC and Switching_01.3
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO1200 and LA-MachXO2280 Hot Socketing Specifications1, 2, 3, 4
Symbol
Non-LVDS General Purpose sysIOs
Input or I/O Leakage Current
LVDS General Purpose sysIOs
Parameter
Condition
Min.
Typ.
Max.
Units
I
0 ≤ V ≤ V (MAX.)
—
—
+/-1000
µA
DK
IN
IH
V
V
≤ V
—
—
—
+/-1000
—
µA
IN
IN
CCIO
I
Input or I/O Leakage Current
DK_LVDS
> V
35
mA
CCIO
1. Insensitive to sequence of V
V
and V
. However, assumes monotonic rise/fall rates for V
V
and V
CC, CCAUX,
CCIO
CC, CCAUX, CCIO.
2. 0 ≤ V ≤ V (MAX), 0 ≤ V
≤ V
(MAX), and 0 ≤ V
≤ V
(MAX).
CC
CC
CCIO
CCIO
CCAUX
CCAUX
3. I is additive to I
I
or I
.
DK
PU, PW
BH
4. LVCMOS and LVTTL only.
DC Electrical Characteristics
Over Recommended Operating Conditions
Symbol
Parameter
Condition
- 0.2V)
CCIO
Min.
Typ.
Max.
Units
µA
µA
µA
µA
µA
µA
µA
µA
V
0 ≤ V ≤ (V
—
—
—
—
—
—
—
—
—
—
10
40
IN
1, 4, 5
I
I
Input or I/O Leakage
IL, IH
(V
- 0.2V) < V ≤ 3.6V
—
CCIO
IN
CCIO
I
I
I
I
I
I
I/O Active Pull-up Current
0 ≤ V ≤ 0.7 V
-30
30
-150
150
—
PU
IN
I/O Active Pull-down Current
Bus Hold Low sustaining current
Bus Hold High sustaining current
V
V
V
(MAX) ≤ V ≤ V (MAX)
IN IH
PD
IL
= V (MAX)
30
BHLS
BHHS
BHLO
IN
IN
IL
= 0.7V
-30
—
—
CCIO
Bus Hold Low Overdrive current 0 ≤ V ≤ V (MAX)
150
-150
IN
IH
Bus Hold High Overdrive current 0 ≤ V ≤ V (MAX)
—
BHHO
IN
IH
3
V
Bus Hold trip Points
I/O Capacitance2
0 ≤ V ≤ V (MAX)
V
(MAX)
V
(MIN)
BHT
IN
IH
IL
IH
V
V
= 3.3V, 2.5V, 1.8V, 1.5V, 1.2V,
CCIO
CC
C1
C2
—
—
8
8
—
—
pf
pf
= Typ., V = 0 to V (MAX)
IO
IH
V
V
= 3.3V, 2.5V, 1.8V, 1.5V, 1.2V,
Dedicated Input Capacitance2
CCIO
CC
= Typ., V = 0 to V (MAX)
IO
IH
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is not measured
with the output driver active. Bus maintenance circuits are disabled.
2. T 25°C, f = 1.0MHz
A
3. Please refer to V and V in the sysIO Single-Ended DC Electrical Characteristics table of this document.
IL
IH
4. Not applicable to SLEEPN pin.
5. When V is higher than V , a transient current typically of 30ns in duration or less with a peak current of 6mA can occur on the high-to-
IH
CCIO
low transition. For LA-MachXO1200 and LA-MachXO2280 true LVDS output pins, V must be less than or equal to V
.
IH
CCIO
3-2
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Supply Current (Sleep Mode)1, 2
Symbol
Parameter
Device
Typ.3
12
12
1
Max.
25
Units
µA
LCMXO256C
LCMXO640C
LCMXO256C
LCMXO640C
I
Core Power Supply
CC
25
µA
15
µA
I
I
Auxiliary Power Supply
Bank Power Supply4
CCAUX
1
25
µA
All LCMXO ‘C’ Devices
2
30
µA
CCIO
1. Assumes all inputs are configured as LVCMOS and held at the VCCIO or GND.
2. Frequency = 0MHz.
3. T = 25°C, power supplies at nominal voltage.
A
4. Per Bank.
Supply Current (Standby)1, 2, 3, 4
Over Recommended Operating Conditions
Symbol
Parameter
Device
LCMXO256C
Typ.5
7
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
LCMXO640C
LCMXO256E
LCMXO640E
LCMXO1200E
LCMXO2280E
LCMXO256E/C
LCMXO640E/C
LCMXO1200E
LCMXO2280E
All devices
9
4
I
Core Power Supply
CC
6
10
12
5
7
Auxiliary Power Supply
= 3.3V
I
I
CCAUX
V
12
13
2
CCAUX
Bank Power Supply6
CCIO
1. For further information on supply current, please see details of additional technical documentation at the end of this data sheet.
2. Assumes all outputs are tristated, all inputs are configured as LVCMOS and held at V
or GND.
CCIO
3. Frequency = 0MHz.
4. User pattern = blank.
5. T = 25oC, power supplies at nominal voltage.
J
6. Per Bank. V
= 2.5V. Does not include pull-up/pull-down.
CCIO
3-3
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Initialization Supply Current1, 2, 3, 4
Over Recommended Operating Conditions
Symbol
Parameter
Device
Typ.5
13
17
10
14
18
20
10
13
24
25
2
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
LCMXO256C
LCMXO640C
LCMXO256E
LCMXO640E
LCMXO1200E
LCMXO2280E
LCMXO256E/C
LCMXO640E/C
LCMXO1200E
LCMXO2280E
All devices
I
Core Power Supply
CC
Auxiliary Power Supply
I
I
CCAUX
V
= 3.3V
CCAUX
Bank Power Supply6
CCIO
1. For further information on supply current, please see details of additional technical documentation at the end of this data sheet.
2. Assumes all I/O pins are held at V
3. Frequency = 0MHz.
or GND.
CCIO
4. Typical user pattern.
5. T = 25oC, power supplies at nominal voltage.
J
6. Per Bank, V
= 2.5V. Does not include pull-up/pull-down.
CCIO
3-4
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Programming and Erase Flash Supply Current1, 2, 3, 4
Symbol
Parameter
Device
LCMXO256C
Typ.5
9
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
LCMXO640C
LCMXO256E
LCMXO640E
LCMXO1200E
LCMXO2280E
LCMXO256E/C
LCMXO640E/C
LCMXO1200E
LCMXO2280E
All devices
11
6
I
Core Power Supply
CC
8
12
14
8
10
15
16
2
Auxiliary Power Supply
I
I
CCAUX
V
= 3.3V
CCAUX
Bank Power Supply6
CCIO
1. For further information on supply current, please see details of additional technical documentation at the end of this data sheet.
2. Assumes all I/O pins are held at V
3. Typical user pattern.
or GND.
CCIO
4. JTAG programming is at 25MHz.
5. T = 25°C, power supplies at nominal voltage.
J
6. Per Bank. V
= 2.5V. Does not include pull-up/pull-down.
CCIO
3-5
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
sysIO Recommended Operating Conditions
V
(V)
CCIO
Standard
LVCMOS 3.3
LVCMOS 2.5
LVCMOS 1.8
LVCMOS 1.5
LVCMOS 1.2
LVTTL
PCI3
LVDS1, 2
LVPECL1
BLVDS1
Min.
3.135
2.375
1.71
Typ.
3.3
2.5
1.8
1.5
1.2
3.3
3.3
2.5
3.3
2.5
2.5
Max.
3.465
2.625
1.89
1.425
1.14
1.575
1.26
3.135
3.135
2.375
3.135
2.375
2.375
3.465
3.465
2.625
3.465
2.625
2.625
RSDS1
1. Inputs on chip. Outputs are implemented with the addition of external resistors.
2. MachXO1200 and MachXO2280 devices have dedicated LVDS buffers
3. Input on the top bank of the MachXO1200 and MachXO2280 only.
3-6
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
sysIO Single-Ended DC Electrical Characteristics
V
V
IH
1
1
IL
Input/Output
Standard
V
Max.
V
Min.
I
I
OH
OL
OH
(V)
OL
Min. (V) Max. (V)
Min. (V)
Max. (V)
(V)
(mA)
(mA)
-14, -12, -8, -4
-0.1
0.4
0.2
0.4
0.4
0.2
0.4
0.2
0.4
0.2
0.4
0.2
0.4
0.2
0.4
0.2
V
V
- 0.4 16, 12, 8, 4
CCIO
CCIO
LVCMOS 3.3
-0.3
0.8
0.8
0.7
2.0
2.0
1.7
3.6
- 0.2
0.1
16
2.4
-16
LVTTL
-0.3
3.6
V
V
V
V
V
V
V
V
V
V
V
V
- 0.4
- 0.2
12, 8, 4
0.1
-12, -8, -4
-0.1
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
CCIO
- 0.4 16, 12, 8, 4
- 0.2 0.1
- 0.4 16, 12, 8, 4
-14, -12, -8, -4
-0.1
LVCMOS 2.5
LVCMOS 1.8
LVCMOS 1.5
-0.3
-0.3
-0.3
-0.3
3.6
3.6
3.6
3.6
-14, -12, -8, -4
-0.1
0.35V
0.65V
CCIO
CCIO
- 0.2
- 0.4
- 0.2
- 0.4
- 0.2
- 0.4
- 0.2
0.1
8, 4
0.1
6, 2
0.1
6, 2
0.1
1.5
-8, -4
0.35V
0.65V
CCIO
CCIO
-0.1
-6, -2
LVCMOS 1.2
(“C” Version)
0.42
0.78
-0.1
-6, -2
LVCMOS 1.2
(“E” Version)
-0.3
-0.3
0.35V
0.65V
3.6
3.6
CC
CC
-0.1
PCI
0.3V
0.5V
0.1V
0.9V
-0.5
CCIO
CCIO
CCIO
CCIO
1. The average DC current drawn by I/Os between GND connections, or between the last GND in an I/O Bank and the end of an I/O Bank, as
shown in the logic signal connections table shall not exceed n * 8mA. Where n is the number of I/Os between Bank GND connections or
between the last GND in a Bank and the end of a Bank.
3-7
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
sysIO Differential Electrical Characteristics
LVDS
Over Recommended Operating Conditions
Parameter
Symbol
Parameter Description
Input Voltage
Test Conditions
Min.
0
Typ.
—
Max.
2.4
Units
V
V
V
V
INP, INM
Differential Input Threshold
Input Common Mode Voltage
Input current
+/-100
—
—
mV
V
THD
100mV ≤ V
V
V
V
/2
/2
/2
1.2
1.2
1.2
—
1.8
THD
THD
THD
THD
THD
V
200mV ≤ V
350mV ≤ V
Power on
1.9
V
CM
2.0
V
THD
I
—
+/-10
1.60
—
µA
V
IN
V
V
V
Output high voltage for V or V
R = 100 Ohm
—
1.38
1.03
350
OH
OL
OD
OP
OM
T
Output low voltage for V or V
R = 100 Ohm
0.9V
250
V
OP
OM
T
Output voltage differential
(V - V ), R = 100 Ohm
450
mV
OP
OM
T
Change in V between high and
low
OD
ΔV
—
—
50
mV
OD
V
Output voltage offset
(V - V )/2, R = 100 Ohm
1.125
—
1.25
—
1.375
50
V
OS
OP
OM
T
ΔV
Change in V between H and L
mV
OS
OS
V
= 0V Driver outputs
OD
I
Output short circuit current
—
—
6
mA
OSD
shorted
LVDS Emulation
LA-MachXO automotive devices can support LVDS outputs via emulation (LVDS25E), in addition to the LVDS sup-
port that is available on-chip on certain devices. The output is emulated using complementary LVCMOS outputs in
conjunction with resistors across the driver outputs on all devices. The scheme shown in Figure 3-1 is one possible
solution for LVDS standard implementation. Resistor values in Figure 3-1 are industry standard values for 1% resis-
tors.
Figure 3-1. LVDS Using External Resistors (LVDS25E)
VCCIO = 2.5
158
8mA
Zo = 100
+
100
VCCIO = 2.5
8mA
140
-
158
On-chip
Off-chip
Off-chip
On-chip
Emulated
LVDS
Buffer
Note: All resistors are 1%.
The LVDS differential input buffers are available on certain devices in the LA-MachXO family.
3-8
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Table 3-1. LVDS DC Conditions
Over Recommended Operating Conditions
Parameter
Description
Typical
20
Units
Ω
Z
Output impedance
OUT
R
R
R
Driver series resistor
Driver parallel resistor
Receiver termination
Output high voltage
Output low voltage
294
Ω
S
121
Ω
P
100
Ω
T
V
V
V
V
1.43
1.07
0.35
1.25
100
V
OH
OL
OD
CM
BACK
V
Output differential voltage
Output common mode voltage
Back impedance
V
V
Z
Ω
I
DC output current
3.66
mA
DC
BLVDS
The LA-MachXO automotive family supports the BLVDS standard through emulation. The output is emulated using
complementary LVCMOS outputs in conjunction with a parallel external resistor across the driver outputs. The
input standard is supported by the LVDS differential input buffer on certain devices. BLVDS is intended for use
when multi-drop and bi-directional multi-point differential signaling is required. The scheme shown in Figure 3-2 is
one possible solution for bi-directional multi-point differential signals.
Figure 3-2. BLVDS Multi-point Output Example
Heavily loaded backplane, effective Zo ~ 45 to 90 ohms differential
2.5V
16mA
2.5V
16mA
80
80
45-90 ohms
45-90 ohms
80
2.5V
16mA
2.5V
16mA
80
80
80
80
. . .
+
-
+
-
-
-
2.5V
2.5V
2.5V
16mA
2.5V
16mA
16mA
16mA
3-9
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Table 3-2. BLVDS DC Conditions1
Over Recommended Operating Conditions
Nominal
Symbol
Description
Output impedance
Zo = 45 Zo = 90
Units
ohm
ohm
ohm
V
Z
100
45
100
90
OUT
R
R
Left end termination
Right end termination
Output high voltage
TLEFT
TRIGHT
OH
45
90
V
V
V
V
1.375
1.125
0.25
1.25
11.2
1.48
1.02
0.46
1.25
10.2
Output low voltage
V
OL
Output differential voltage
Output common mode voltage
DC output current
V
OD
V
CM
I
mA
DC
1. For input buffer, see LVDS table.
LVPECL
The LA-MachXO automotive family supports the differential LVPECL standard through emulation. This output stan-
dard is emulated using complementary LVCMOS outputs in conjunction with a parallel resistor across the driver
outputs on all the devices. The LVPECL input standard is supported by the LVDS differential input buffer on certain
devices. The scheme shown in Figure 3-3 is one possible solution for point-to-point signals.
Figure 3-3. Differential LVPECL
VCCIO = 3.3V
100 ohms
16mA
+
VCCIO = 3.3V
150 ohms
100 ohms
-
100 ohms
Off-chip
16mA
Transmission line, Zo = 100 ohm differential
Off-chip
On-chip
On-chip
Table 3-3. LVPECL DC Conditions1
Over Recommended Operating Conditions
Symbol
Description
Output impedance
Nominal
100
Units
Z
ohm
ohm
ohm
V
OUT
R
R
Driver parallel resistor
Receiver termination
Output high voltage
Output low voltage
150
P
T
100
V
V
V
V
2.03
1.27
0.76
1.65
85.7
12.7
OH
V
OL
Output differential voltage
Output common mode voltage
Back impedance
V
OD
V
CM
Z
ohm
mA
BACK
I
DC output current
DC
1. For input buffer, see LVDS table.
3-10
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
For further information on LVPECL, BLVDS and other differential interfaces please see details of additional techni-
cal documentation at the end of the data sheet.
RSDS
The LA-MachXO automotive family supports the differential RSDS standard. The output standard is emulated
using complementary LVCMOS outputs in conjunction with a parallel resistor across the driver outputs on all the
devices. The RSDS input standard is supported by the LVDS differential input buffer on certain devices. The
scheme shown in Figure 3-4 is one possible solution for RSDS standard implementation. Use LVDS25E mode with
suggested resistors for RSDS operation. Resistor values in Figure 3-4 are industry standard values for 1% resis-
tors.
Figure 3-4. RSDS (Reduced Swing Differential Standard)
VCCIO = 2.5V
294
8mA
Zo = 100
+
VCCIO = 2.5V
121
100
-
294
8mA
On-chip
Off-chip
Off-chip
On-chip
Emulated
RSDS Buffer
Table 3-4. RSDS DC Conditions
Parameter
Description
Typical
20
Units
ohm
ohm
ohm
ohm
V
Z
Output impedance
OUT
R
R
R
Driver series resistor
Driver parallel resistor
Receiver termination
Output high voltage
Output low voltage
294
S
121
P
100
T
V
V
V
V
1.35
1.15
0.20
1.25
101.5
3.66
OH
OL
OD
CM
BACK
V
Output differential voltage
Output common mode voltage
Back impedance
V
V
Z
ohm
mA
I
DC output current
DC
3-11
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Typical Building Block Function Performance1
Pin-to-Pin Performance (LVCMOS25 12mA Drive)
Function
Basic Functions
-3 Timing
Units
16-bit decoder
4:1 MUX
9.4
6.3
7.1
ns
ns
ns
16:1 MUX
Register-to-Register Performance
Function
Basic Functions
16:1 MUX
-3 Timing
Units
348
209
277
143
MHz
MHz
MHz
MHz
16-bit adder
16-bit counter
64-bit counter
Embedded Memory Functions (1200 and 2280 Devices Only)
256x36 Single Port RAM
512x18 True-Dual Port RAM
Distributed Memory Functions
16x2 Single Port RAM
203
203
MHz
MHz
310
229
186
224
194
MHz
MHz
MHz
MHz
MHz
64x2 Single Port RAM
128x4 Single Port RAM
32x2 Pseudo-Dual Port RAM
64x4 Pseudo-Dual Port RAM
1. The above timing numbers are generated using the ispLEVER design tool. Exact performance may vary with device and
tool version. The tool uses internal parameters that have been characterized but are not tested on every device.
Rev. A 0.19
Derating Logic Timing
Logic Timing provided in the following sections of the data sheet and the ispLEVER design tools are worst case
numbers in the operating range. Actual delays may be much faster.The ispLEVER design tool from Lattice can pro-
vide logic timing numbers at a particular temperature and voltage.
3-12
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO External Switching Characteristics1
Over Recommended Operating Conditions
-3
Parameter
Description
Device
Min. Max. Units
General I/O Pin Parameters (Using Global Clock without PLL)1
LCMXO256
LCMXO640
—
—
—
—
—
—
—
—
1.8
1.5
4.9
4.9
5.1
5.1
5.6
5.7
6.1
6.1
—
ns
ns
t
t
t
t
f
t
Best Case t Through 1 LUT
PD
PD
LCMXO1200
LCMXO2280
LCMXO256
LCMXO640
LCMXO1200
LCMXO2280
LCMXO256
LCMXO640
ns
ns
ns
ns
Best Case Clock to Output - From PFU
Clock to Data Setup - To PFU
CO
ns
ns
ns
—
ns
SU
LCMXO1200 1.6
LCMXO2280 1.5
—
ns
—
ns
LCMXO256
LCMXO640
-0.3
-0.1
—
ns
—
ns
Clock to Data Hold - To PFU
H
LCMXO1200 0.0
LCMXO2280 -0.4
—
ns
—
ns
LCMXO256
LCMXO640
LCMXO1200
LCMXO2280
LCMXO256
LCMXO640
LCMXO1200
LCMXO2280
—
—
—
—
—
—
—
—
500
500
500
500
240
240
260
260
MHz
MHz
MHz
MHz
ps
Clock Frequency of I/O and PFU Register
Global Clock Skew Across Device
MAX_IO
ps
SKEW_PRI
ps
ps
1. General timing numbers based on LVCMOS2.5V, 12 mA.
Rev. A 0.19
3-13
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO Internal Timing Parameters1
Over Recommended Operating Conditions
-3
Parameter
Description
Min. Max. Units
PFU/PFF Logic Mode Timing
t
t
t
t
t
t
t
t
t
t
LUT4 delay (A to D inputs to F output)
LUT6 delay (A to D inputs to OFX output)
Set/Reset to output of PFU
—
—
0.39
0.62
1.26
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
LUT4_PFU
LUT6_PFU
LSR_PFU
SUM_PFU
HM_PFU
—
Clock to Mux (M0,M1) input setup time
Clock to Mux (M0,M1) input hold time
Clock to D input setup time
0.15
-0.07
0.18
-0.04
—
—
—
SUD_PFU
HD_PFU
Clock to D input hold time
—
Clock to Q delay, D-type register configuration
Clock to Q delay latch configuration
D to Q throughput delay when latch is enabled
0.56
0.74
0.77
CK2Q_PFU
LE2Q_PFU
LD2Q_PFU
—
—
PFU Dual Port Memory Mode Timing
t
t
t
t
t
t
t
Clock to Output
—
0.56
—
ns
ns
ns
ns
ns
ns
ns
CORAM_PFU
SUDATA_PFU
HDATA_PFU
Data Setup Time
-0.25
0.39
-0.65
0.99
-0.30
0.47
Data Hold Time
—
Address Setup Time
Address Hold Time
—
SUADDR_PFU
HADDR_PFU
SUWREN_PFU
HWREN_PFU
—
Write/Read Enable Setup Time
Write/Read Enable Hold Time
—
—
PIO Input/Output Buffer Timing
t
t
Input Buffer Delay
Output Buffer Delay
—
—
1.06
1.80
ns
ns
IN_PIO
OUT_PIO
EBR Timing (1200 and 2280 Devices Only)
Clock to output from Address or Data with no output
register
t
—
3.14
ns
CO_EBR
t
t
t
t
t
t
t
t
t
Clock to output from EBR output Register
Setup Data to EBR Memory
—
0.75
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
COO_EBR
-0.37
0.57
-0.37
0.57
-0.23
0.36
0.27
-0.18
SUDATA_EBR
HDATA_EBR
SUADDR_EBR
HADDR_EBR
SUWREN_EBR
HWREN_EBR
SUCE_EBR
Hold Data to EBR Memory
—
Setup Address to EBR Memory
Hold Address to EBR Memory
—
—
Setup Write/Read Enable to EBR Memory
Hold Write/Read Enable to EBR Memory
Clock Enable Setup Time to EBR Output Register
Clock Enable Hold Time to EBR Output Register
—
—
—
—
HCE_EBR
Reset To Output Delay Time from EBR Output Regis-
ter
t
—
1.44
ns
RSTO_EBR
PLL Parameters (1200 and 2280 Devices Only)
t
t
Reset Recovery to Rising Clock
Reset Signal Setup Time
—
1.00
—
ns
ns
RSTREC
1.00
RSTSU
1. Internal parameters are characterized but not tested on every device.
Rev. A 0.19
3-14
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO Family Timing Adders1, 2, 3
Over Recommended Operating Conditions
Buffer Type
Input Adjusters
Description
-3
Units
LVDS254
BLVDS254
LVPECL334
LVDS
0.61
0.61
0.59
0.01
0.01
0.00
0.10
0.19
0.56
0.01
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
BLVDS
LVPECL
LVTTL
LVTTL33
LVCMOS33
LVCMOS 3.3
LVCMOS 2.5
LVCMOS 1.8
LVCMOS 1.5
LVCMOS 1.2
PCI
LVCMOS25
LVCMOS18
LVCMOS15
LVCMOS12
PCI334
Output Adjusters
LVDS25E
LVDS254
LVDS 2.5 E
-0.18
-0.30
-0.04
0.05
0.05
0.08
-0.01
0.70
0.05
0.08
-0.01
0.70
0.07
0.13
0.00
0.47
0.15
0.06
-0.08
0.09
0.22
0.07
0.36
0.07
2.59
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
LVDS 2.5
BLVDS25
BLVDS 2.5
LVPECL33
LVPECL 3.3
LVTTL33_4mA
LVTTL33_8mA
LVTTL33_12mA
LVTTL33_16mA
LVCMOS33_4mA
LVCMOS33_8mA
LVCMOS33_12mA
LVCMOS33_14mA
LVCMOS25_4mA
LVCMOS25_8mA
LVCMOS25_12mA
LVCMOS25_14mA
LVCMOS18_4mA
LVCMOS18_8mA
LVCMOS18_12mA
LVCMOS18_14mA
LVCMOS15_4mA
LVCMOS15_8mA
LVCMOS12_2mA
LVCMOS12_6mA
PCI334
LVTTL 4mA drive
LVTTL 8mA drive
LVTTL 12mA drive
LVTTL 16mA drive
LVCMOS 3.3 4mA drive
LVCMOS 3.3 8mA drive
LVCMOS 3.3 12mA drive
LVCMOS 3.3 14mA drive
LVCMOS 2.5 4mA drive
LVCMOS 2.5 8mA drive
LVCMOS 2.5 12mA drive
LVCMOS 2.5 14mA drive
LVCMOS 1.8 4mA drive
LVCMOS 1.8 8mA drive
LVCMOS 1.8 12mA drive
LVCMOS 1.8 14mA drive
LVCMOS 1.5 4mA drive
LVCMOS 1.5 8mA drive
LVCMOS 1.2 2mA drive
LVCMOS 1.2 6mA drive
PCI33
1. Timing adders are characterized but not tested on every device.
2. LVCMOS timing is measured with the load specified in Switching Test Conditions table.
3. All other standards tested according to the appropriate specifications.
4. I/O standard only available in LCMXO1200 and LCMXO2280 devices.
Rev. A 0.19
3-15
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
sysCLOCK PLL Timing
Over Recommended Operating Conditions
Parameter
Descriptions
Input Clock Frequency (CLKI, CLKFB)
Conditions
Min.
25
Max.
420
420
210
840
—
Units
MHz
MHz
MHz
MHz
MHz
f
f
f
f
f
IN
Output Clock Frequency (CLKOP, CLKOS)
K-Divider Output Frequency (CLKOK)
PLL VCO Frequency
25
OUT
OUT2
VCO
PFD
0.195
420
25
Phase Detector Input Frequency
AC Characteristics
t
t
Output Clock Duty Cycle
Default duty cycle selected3
45
—
55
0.05
+/-120
0.02
+/-200
—
%
UI
DT
PH
4
Output Phase Accuracy
Fout ≥ 100MHz
—
ps
1
t
Output Clock Period Jitter
OPJIT
Fout < 100MHz
—
UIPP
ps
t
t
t
t
t
t
t
t
t
Input Clock to Output Clock Skew
Output Clock Pulse Width
PLL Lock-in Time
Divider ratio = integer
At 90% or 10%3
—
SK
1
ns
W
2
—
150
450
+/-200
10
µs
LOCK
PA
Programmable Delay Unit
Input Clock Period Jitter
External Feedback Delay
Input Clock High Time
Input Clock Low Time
RST Pulse Width
100
—
ps
ps
IPJIT
—
ns
FBKDLY
HI
90% to 90%
10% to 10%
0.5
0.5
10
—
ns
—
ns
LO
—
ns
RST
1. Jitter sample is taken over 10,000 samples of the primary PLL output with a clean reference clock.
2. Output clock is valid after t for PLL reset and dynamic delay adjustment.
LOCK
3. Using LVDS output buffers.
4. CLKOS as compared to CLKOP output.
Rev. A 0.19
LA-MachXO “C” Sleep Mode Timing
Symbol
Parameter
Device
Min.
—
Typ.
Max
Units
t
t
SLEEPN Low to Power Down
All
—
—
—
—
—
400
400
600
—
ns
µs
µs
ns
ns
PWRDN
LCMXO256
LCMXO640
All
—
SLEEPN High to Power Up
PWRUP
—
t
t
SLEEPN Pulse Width
400
—
WSLEEPN
SLEEPN Pulse Rejection
All
100
WAWAKE
Rev. A 0.19
Power Down Mode
I/O
tPWRUP
tPWRDN
SLEEPN
tWSLEEPN or tWAWAKE
3-16
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Flash Download Time
Symbol
Parameter
LCMXO256
Min.
—
Typ.
—
Max.
0.4
Units
ms
Minimum V or V
(later of the two supplies)
to Device I/O Active
CC
CCAUX
LCMXO640
LCMXO1200
LCMXO2280
—
—
0.6
ms
t
REFRESH
—
—
0.8
ms
—
—
1.0
ms
JTAG Port Timing Specifications
Over Recommended Operating Conditions
Symbol
Parameter
Min.
—
40
20
20
8
Max.
Units
MHz
ns
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
TCK [BSCAN] clock frequency
25
—
—
—
—
—
—
10
10
10
—
—
25
25
25
MAX
TCK [BSCAN] clock pulse width
BTCP
TCK [BSCAN] clock pulse width high
ns
BTCPH
BTCPL
BTS
TCK [BSCAN] clock pulse width low
ns
TCK [BSCAN] setup time
ns
TCK [BSCAN] hold time
10
50
—
—
—
8
ns
BTH
TCK [BSCAN] rise/fall time
mV/ns
ns
BTRF
TAP controller falling edge of clock to output valid
TAP controller falling edge of clock to output disabled
TAP controller falling edge of clock to output enabled
BSCAN test capture register setup time
BTCO
ns
BTCODIS
BTCOEN
BTCRS
BTCRH
BUTCO
BTUODIS
BTUPOEN
ns
ns
BSCAN test capture register hold time
25
—
—
—
ns
BSCAN test update register, falling edge of clock to output valid
BSCAN test update register, falling edge of clock to output disabled
BSCAN test update register, falling edge of clock to output enabled
ns
ns
ns
Rev. A 0.19
Figure 3-5. JTAG Port Timing Waveforms
TMS
TDI
t
t
BTH
BTS
t
t
BTCP
t
BTCPL
BTCPH
TCK
TDO
t
t
BTCODIS
t
BTCO
BTCOEN
Valid Data
Valid Data
t
BTCRH
t
BTCRS
Data to be
captured
from I/O
Data Captured
t
t
t
BTUPOEN
BUTCO
BTUODIS
Data to be
driven out
to I/O
Valid Data
Valid Data
3-17
DC and Switching Characteristics
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Switching Test Conditions
Figure 3-6 shows the output test load that is used for AC testing. The specific values for resistance, capacitance,
voltage, and other test conditions are shown in Figure 3-5.
Figure 3-6. Output Test Load, LVTTL and LVCMOS Standards
VT
R1
DUT
Test Point
CL
Table 3-5. Test Fixture Required Components, Non-Terminated Interfaces
Test Condition
R
C
Timing Ref.
V
T
1
L
LVTTL, LVCMOS 3.3 = 1.5V
—
—
—
—
—
LVCMOS 2.5 = V
LVCMOS 1.8 = V
LVCMOS 1.5 = V
LVCMOS 1.2 = V
/2
/2
/2
/2
CCIO
CCIO
CCIO
CCIO
LVTTL and LVCMOS settings (L -> H, H -> L)
0pF
0pF
∞
LVTTL and LVCMOS 3.3 (Z -> H)
LVTTL and LVCMOS 3.3 (Z -> L)
Other LVCMOS (Z -> H)
V
OL
1.5
V
OH
V
V
/2
/2
V
OL
CCIO
188
Other LVCMOS (Z -> L)
V
OH
CCIO
LVTTL + LVCMOS (H -> Z)
LVTTL + LVCMOS (L -> Z)
V
- 0.15
- 0.15
V
OL
OH
V
V
OH
OL
Note: Output test conditions for all other interfaces are determined by the respective standards.
3-18
LA-MachXO Automotive Family Data Sheet
Pinout Information
November 2007
Data Sheet DS1003
Signal Descriptions
Signal Name
I/O
Descriptions
General Purpose
[Edge] indicates the edge of the device on which the pad is located. Valid edge designa-
tions are L (Left), B (Bottom), R (Right), T (Top).
[Row/Column Number] indicates the PFU row or the column of the device on which the
PIO Group exists. When Edge is T (Top) or (Bottom), only need to specify Row Number.
When Edge is L (Left) or R (Right), only need to specify Column Number.
P[Edge] [Row/Column
Number]_[A/B/C/D/E/F]
[A/B/C/D/E/F] indicates the PIO within the group to which the pad is connected.
I/O
Some of these user programmable pins are shared with special function pins. When not
used as special function pins, these pins can be programmed as I/Os for user logic.
During configuration of the user-programmable I/Os, the user has an option to tri-state the
I/Os and enable an internal pull-up resistor. This option also applies to unused pins (or
those not bonded to a package pin). The default during configuration is for user-program-
mable I/Os to be tri-stated with an internal pull-up resistor enabled.
Global RESET signal (active low). Dedicated pad, when not in use it can be used as an I/O
pin.
GSRN
TSALL
I
I
TSALL is a dedicated pad for the global output enable signal. When TSALL is high all the
outputs are tristated. It is a dual function pin. When not in use, it can be used as an I/O pin.
NC
—
—
—
No connect.
GND
GND - Ground. Dedicated pins.
VCC - The power supply pins for core logic. Dedicated pins.
V
V
V
CC
VCCAUX - the Auxiliary power supply pin. This pin powers up a variety of internal circuits
including all the differential and referenced input buffers. Dedicated pins.
—
—
CCAUX
CCIOx
V
- The power supply pins for I/O Bank x. Dedicated pins.
CCIO
Sleep Mode pin - Active low sleep pin. When this pin is held high, the device operates nor-
SLEEPN1
I
mally. This pin has a weak internal pull-up, but when unused, an external pull-up to V is
CC
recommended. When driven low, the device moves into Sleep mode after a specified time.
PLL and Clock Functions (Used as user programmable I/O pins when not used for PLL or clock pins)
Reference clock (PLL) input Pads: [LOC] indicates location. Valid designations are ULM
(Upper PLL) and LLM (Lower PLL). T = true and C = complement.
[LOC][0]_PLL[T, C]_IN
—
Optional feedback (PLL) input Pads: [LOC] indicates location. Valid designations are ULM
(Upper PLL) and LLM (Lower PLL). T = true and C = complement.
[LOC][0]_PLL[T, C]_FB
PCLK [n]_[1:0]
—
—
Primary Clock Pads, n per side.
Test and Programming (Dedicated pins)
TMS
TCK
TDI
I
I
Test Mode Select input pin, used to control the 1149.1 state machine.
Test Clock input pin, used to clock the 1149.1 state machine.
I
Test Data input pin, used to load data into the device using an 1149.1 state machine.
Output pin -Test Data output pin used to shift data out of the device using 1149.1.
TDO
O
1. Applies to LA-MachXO “C” devices only. NC for “E” devices.
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
4-1
DS1003 Pinouts_01.3
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Pin Information Summary
LAMXO256C/E
LAMXO640C/E
Pin Type
100 TQFP
100 TQFP
144 TQFP
256 ftBGA
Single Ended User I/O
Differential Pair User I/O1
78
38
6
74
17
6
113
159
43
79
Muxed
6
6
TAP
4
4
4
4
Dedicated (Total Without Supplies)
5
5
5
5
4
VCC
2
2
4
2
VCCAUX
1
1
2
Bank0
3
2
2
4
Bank1
3
2
2
4
VCCIO
Bank2
—
—
8
2
2
4
Bank3
2
2
4
GND
NC
10
0
12
18
0
0
52
Bank0
41/20
37/18
—
—
18/5
21/4
14/2
21/6
29/10
30/11
24/9
30/13
42/21
40/20
36/18
40/20
Bank1
Single Ended/Differential I/O
per Bank
Bank2
Bank3
1. These devices support emulated LVDS outputs. LVDS inputs are not supported.
LAMXO1200E
LAMXO2280E
Pin Type
100 TQFP
144 TQFP
256 ftBGA
100 TQFP
144 TQFP
256 ftBGA
324 ftBGA
Single Ended User I/O
Differential Pair User I/O1
73
27
6
113
48
6
211
73
30
6
113
47
6
211
271
105
105
134
Muxed
6
6
6
TAP
4
4
4
4
4
4
4
Dedicated (Total Without Supplies)
5
5
5
5
5
5
5
VCC
4
4
4
2
4
4
6
VCCAUX
2
2
2
2
2
2
2
2
2
2
Bank0
1
1
1
1
Bank1
Bank2
Bank3
Bank4
Bank5
Bank6
Bank7
1
1
2
1
1
2
2
1
1
2
1
1
2
2
1
1
2
1
1
2
2
VCCIO
1
1
2
1
1
2
2
1
1
2
1
1
2
2
1
1
2
1
1
2
2
1
1
2
1
1
2
2
GND
NC
8
12
0
18
8
12
0
18
24
0
0
0
0
0
Bank0
Bank1
Bank2
Bank3
Bank4
Bank5
Bank6
Bank7
10/3
8/2
10/4
11/5
8/3
5/2
10/3
11/5
14/6
15/7
15/7
15/7
14/5
10/4
15/6
15/6
26/13
28/14
26/13
28/14
27/13
22/11
28/14
26/13
9/3
9/3
10/4
11/5
8/3
5/2
10/4
11/5
13/6
16/7
15/7
15/7
14/4
10/4
15/6
15/6
24/12
30/15
26/13
28/14
29/14
20/10
28/14
26/13
34/17
36/18
34/17
34/17
35/17
30/15
34/17
34/17
Single Ended/Differential I/O
per Bank
1. These devices support on-chip LVDS buffers for left and right I/O Banks.
4-2
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Power Supply and NC
Signal
100 TQFP1
144 TQFP1
VCC
LAMXO256/640: 35, 90
LAMXO1200/2280: 17, 35, 66, 91
21, 52, 93, 129
VCCIO0
LAMXO256: 60, 74, 92
LAMXO640: 80, 92
LAMXO1200/2280: 94
LAMXO640: 117, 135
LAMXO1200/2280: 135
VCCIO1
VCCIO2
VCCIO3
LAMXO256: 10, 24, 41
LAMXO640: 60, 74
LAMXO640: 82, 98
LAMXO1200/2280: 117
LAMXO1200/2280: 80
LAMXO256: None
LAMXO640: 29, 41
LAMXO1200/2280: 70
LAMXO640: 38, 63
LAMXO1200/2280: 98
LAMXO256: None
LAMXO640: 10, 24
LAMXO1200/2280: 56
LAMXO640: 10, 26
LAMXO1200/2280: 82
VCCIO4
VCCIO5
VCCIO6
VCCIO7
VCCAUX
GND2
LAMXO256/640: None
LAMXO1200/2280: 44
LAMXO640: None
LAMXO1200/2280: 63
LAMXO256/640: None
LAMXO1200/2280: 27
LAMXO640: None
LAMXO1200/2280: 38
LAMXO256/640: None
LAMXO1200/2280: 20
LAMXO640: None
LAMXO1200/2280: 26
LAMXO256/640: None
LAMXO1200/2280: 6
LAMXO640: None
LAMXO1200/2280: 10
LAMXO256/640: 88
LAMXO1200/2280: 36, 90
53, 128
LAMXO256: 40, 84, 62, 75, 93, 12, 25, 42
LAMXO640: 40, 84, 81, 93, 62, 75, 30, 42, 12, 25
LAMXO1200/2280: 9, 41, 59, 83, 100, 76, 50, 26
16, 59, 88, 123, 118, 136, 83, 99, 37, 64, 11, 27
NC3
1. Pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise.
2. All grounds must be electrically connected at the board level. For fpBGA and ftBGA packages, the total number of GND balls is less than the actual number of
GND logic connections from the die to the common package GND plane.
3. NC pins should not be connected to any active signals, VCC or GND.
4-3
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Power Supply and NC (Cont.)
Signal
256 ftBGA1
324 ftBGA1
F14, G11, G9, H7, L7, M9
G8, G7
VCC
G7, G10, K7, K10
VCCIO0
VCCIO1
VCCIO2
VCCIO3
VCCIO4
VCCIO5
VCCIO6
VCCIO7
LAMXO640: F8, F7, F9, F10
LAMXO1200/2280: F8, F7
LAMXO640: H11, G11, K11, J11
LAMXO1200/2280: F9, F10
G12, G10
J12, H12
L12, K12
M12, M11
M8, R9
LAMXO640: L9, L10, L8, L7
LAMXO1200/2280: H11, G11
LAMXO640: K6, J6, H6, G6
LAMXO1200/2280: K11, J11
LAMXO640: None
LAMXO1200/2280: L9, L10
LAMXO640: None
LAMXO1200/2280: L8, L7
LAMXO640: None
LAMXO1200/2280: K6, J6
M7, K7
LAMXO640: None
LAMXO1200/2280: H6, G6
H6, J7
VCCAUX
GND2
T9, A8
M10, F9
A1, A16, F11, G8, G9, H7, H8, H9, H10, J7, J8, J9, E14, F16, H10, H11, H8, H9, J10, J11, J4, J8, J9,
J10, K8, K9, L6, T1, T16
K10, K11, K17, K8, K9, L10, L11, L8, L9, N2, P14,
P5, R7
NC3
LAMXO640: E4, E5, F5, F6, C3, C2, G4, G5, H4, H5, —
K5, K4, M5, M4, P2, P3, N5, N6, M7, M8, N10, N11,
R15, R16, P15, P16, M11, L11, N12, N13, M13, M12,
K12, J12, F12, F13, E12, E13, D13, D14, B15, A15,
C14, B14, E11, E10, E7, E6, D4, D3, B3, B2
LAMXO1200: None
LAMXO2280: None
1. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order ascending horizontally.
2. All grounds must be electrically connected at the board level. For fpBGA and ftBGA packages, the total number of GND balls is less than the actual number of
GND logic connections from the die to the common package GND plane.
3. NC pins should not be connected to any active signals, VCC or GND.
4-4
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO256 and LA-MachXO640 Logic Signal Connections:
100 TQFP
LAMXO256
LAMXO640
Ball
Dual
Ball
Dual
Pin Number Function
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
Function
Differential
Function
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
-
Function
Differential
1
PL2A
PL2B
PL3A
PL3B
PL3C
PL3D
PL4A
PL4B
PL5A
VCCIO1
PL5B
GNDIO1
PL5C
PL5D
PL6A
PL6B
PL7A
PL7B
PL7C
PL7D
PL8A
PL8B
PL9A
VCCIO1
GNDIO1
TMS
T
C
T
C
T
C
T
C
T
PL2A
PL2C
PL2B
T
T
2
3
C
C
T
4
PL2D
PL3A
5
6
PL3B
C
T
7
PL3C
PL3D
PL4A
8
C
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
VCCIO3
PL4C
GNDIO3
PL4D
PL5B
C
T
T
C
T
C
T
C
T
C
T
C
T
C
GSRN
TSALL
GSRN
TSALL
PL7B
PL8C
PL8D
PL9A
T
C
PL9C
PL10A
PL10C
PL11A
PL11C
VCCIO3
GNDIO3
TMS
TMS
TCK
TMS
TCK
PL9B
TCK
C
PB2C
TCK
PB2A
PB2B
TDO
T
VCCIO2
GNDIO2
TDO
C
TDO
TDI
TDO
TDI
PB2C
TDI
T
PB4C
TDI
PB2D
VCC
C
PB4E
VCC
PB3A
PB3B
PB3C
PB3D
GND
1
1
1
1
-
PCLK1_1**
PCLK1_0**
T
C
T
PB5B
PB5D
PB6B
PB6C
GND
2
2
2
2
-
PCLK2_1**
PCLK2_0**
C
VCCIO1
1
VCCIO2
2
4-5
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO256 and LA-MachXO640 Logic Signal Connections:
100 TQFP (Cont.)
LAMXO256
LAMXO640
Ball
Dual
Ball
Dual
Pin Number Function
Bank
1
1
1
1
1
1
-
Function
Differential
Function
Bank
2
2
2
2
2
2
-
Function
Differential
42
43
44
45
46
47
48*
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
GNDIO1
PB4A
PB4B
PB4C
PB4D
PB5A
SLEEPN
PB5C
PB5D
PR9B
PR9A
PR8B
PR8A
PR7D
PR7C
PR7B
PR7A
PR6B
VCCIO0
PR6A
GNDIO0
PR5D
PR5C
PR5B
PR5A
PR4B
PR4A
PR3D
PR3C
PR3B
PR3A
PR2B
VCCIO0
GNDIO0
PR2A
PT5C
PT5B
GNDIO2
PB8B
T
C
T
PB8C
T
PB8D
C
C
PB9A
PB9C
T
SLEEPN
SLEEPN
PB9D
SLEEPN
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
T
C
C
T
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
C
PB9F
PR11D
PR11B
PR11C
PR11A
PR10D
PR10C
PR10B
PR10A
PR9D
C
C
T
T
C
T
C
T
C
T
C
T
C
T
C
VCCIO1
PR9B
T
GNDIO1
PR7B
C
T
C
T
C
T
C
T
C
T
C
PR6C
PR6B
PR5D
PR5B
PR4D
PR4B
PR3D
PR3B
PR2D
PR2B
VCCIO1
GNDIO1
PT9F
T
C
T
PT9E
C
T
PT9C
PT5A
PT9A
PT4F
C
T
VCCIO0
GNDIO0
PT7E
PT4E
PT4D
C
4-6
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO256 and LA-MachXO640 Logic Signal Connections:
100 TQFP (Cont.)
LAMXO256
LAMXO640
Ball
Dual
Function
Ball
Function
Dual
Function
Pin Number Function
Bank
Differential
Bank
Differential
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PT4C
GND
0
-
T
PT7A
GND
0
-
PT4B
PT4A
PT3D
VCCAUX
PT3C
VCC
0
0
0
-
PCLK0_1**
PCLK0_0**
C
T
PT6B
PT5B
PT5A
VCCAUX
PT4F
0
0
0
-
PCLK0_1**
PCLK0_0**
C
T
C
0
-
T
0
-
VCC
PT3B
VCCIO0
GNDIO0
PT3A
PT2F
0
0
0
0
0
0
0
0
0
0
C
PT3F
0
0
0
0
0
0
0
0
0
0
VCCIO0
GNDIO0
PT3B
PT3A
PT2F
T
C
T
C
T
C
T
C
T
PT2E
PT2D
PT2C
PT2B
PT2A
C
T
PT2E
PT2B
PT2C
PT2A
C
T
* NC for “E” devices.
** Primary clock inputs are single-ended.
4-7
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO1200 and LA-MachXO2280 Logic Signal Connections:
100 TQFP
LAMXO1200
LAMXO2280
Pin
Ball
Dual
Ball
Dual
Number
Function
Bank
7
7
7
7
7
7
7
7
-
Function
Differential
Function
Bank
7
7
7
7
7
7
7
7
-
Function
Differential
1
PL2A
PL2B
T
C
T
PL2A
PL2B
LUM0_PLLT_FB_A
LUM0_PLLC_FB_A
LUM0_PLLT_IN_A
LUM0_PLLC_IN_A
T
C
T
2
3
PL3C
PL3C
4
PL3D
C
PL3D
C
5
PL4B
PL4B
6
VCCIO7
PL6A
VCCIO7
PL7A
7
T*
T*
8
PL6B
GSRN
C*
PL7B
GSRN
C*
9
GND
GND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PL7C
7
7
7
7
6
6
6
-
T
C
T
PL9C
7
7
7
7
6
6
6
-
T
C
T
PL7D
PL9D
PL8C
PL10C
PL10D
PL11C
PL13A
PL13B
VCC
PL8D
C
C
PL9C
PL10A
PL10B
VCC
T*
T*
C*
C*
PL11B
PL11C
VCCIO6
PL13C
PL14A
PL14B
PL15A
PL15B
6
6
6
6
6
6
6
6
PL14D
PL14C
VCCIO6
PL16C
PL17A
PL17B
PL18A
PL18B
6
6
6
6
6
6
6
6
C
T
TSALL
TSALL
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T*
C*
T*
C*
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T*
C*
T*
C*
GNDIO6
GNDIO5
GNDIO6
GNDIO5
26**
-
-
27
28
29
30
31
32
33
34
35
36
37
38
39
40
VCCIO5
TMS
5
5
5
5
5
5
5
5
-
VCCIO5
TMS
5
5
5
5
5
5
5
5
-
TMS
TCK
TMS
TCK
TCK
TCK
PB3B
PB4A
PB4B
TDO
PB3B
PB4A
PB4B
TDO
T
T
C
C
TDO
TDI
TDO
TDI
TDI
TDI
VCC
VCC
VCCAUX
PB6E
PB6F
PB7B
PB7F
-
VCCAUX
PB8E
PB8F
PB10F
PB10B
-
5
5
4
4
T
5
5
4
4
T
C
C
PCLK4_1***
PCLK4_0***
PCLK4_1***
PCLK4_0***
4-8
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO1200 and LA-MachXO2280 Logic Signal Connections:
100 TQFP (Cont.)
LAMXO1200
LAMXO2280
Pin
Number
Ball
Function
Dual
Function
Ball
Function
Dual
Function
Bank
Differential
Bank
Differential
41
42
43
44
45
46
47
48
49
GND
PB9A
-
GND
PB12A
PB12B
VCCIO4
PB13A
PB13B
NC
-
4
4
4
4
4
-
T
4
4
4
4
4
-
T
PB9B
C
C
VCCIO4
PB10A
PB10B
NC
T
T
C
C
NC
NC
PB11A
PB11B
4
4
T
PB16A
PB16B
4
4
T
C
C
GNDIO3
GNDIO4
GNDIO3
GNDIO4
50**
-
-
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
PR16B
PR15B
PR15A
PR14B
PR14A
VCCIO3
PR12B
PR12A
GND
3
3
3
3
3
3
3
3
-
PR19B
PR18B
PR18A
PR17B
PR17A
VCCIO3
PR15B
PR15A
GND
3
3
3
3
3
3
3
3
-
C*
T*
C*
T*
C*
T*
C*
T*
C*
T*
C*
T*
PR10B
PR10A
PR9B
3
3
3
3
2
2
-
C*
T*
C*
T*
C*
T*
PR13B
PR13A
PR11B
PR11A
PR10B
PR10A
VCC
3
3
3
3
2
2
-
C*
T*
C*
T*
C*
T*
PR9A
PR8B
PR8A
VCC
PR6C
PR6B
2
2
2
2
2
2
2
2
2
PR8C
2
2
2
2
2
2
2
2
2
C*
T*
PR8B
C*
T*
PR6A
PR8A
VCCIO2
PR4D
PR4B
VCCIO2
PR5D
C*
T*
C
PR5B
C*
T*
C*
T*
PR4A
PR5A
PR2B
PR3B
PR2A
T
PR3A
GNDIO1
GNDIO2
GNDIO1
GNDIO2
76**
-
-
77
78
79
PT11C
PT11B
PT11A
1
1
1
PT15C
PT14B
PT14A
1
1
1
C
T
C
T
4-9
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO1200 and LA-MachXO2280 Logic Signal Connections:
100 TQFP (Cont.)
LAMXO1200
LAMXO2280
Pin
Number
Ball
Function
Dual
Function
Ball
Function
Dual
Function
Bank
Differential
Bank
Differential
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
VCCIO1
PT9E
PT9A
GND
1
1
1
-
VCCIO1
PT12D
PT12C
GND
1
1
1
-
C
T
PT8B
PT8A
PT7D
PT6F
1
1
1
0
0
0
-
C
T
PT11B
PT11A
PT10B
PT9B
1
1
1
1
0
0
-
C
T
PCLK1_1***
PCLK1_0***
PCLK1_1***
PCLK1_0***
PT6D
PT6C
VCCAUX
VCC
C
T
PT8F
C
T
PT8E
VCCAUX
VCC
-
-
PT5B
PT4B
VCCIO0
PT3D
PT3C
PT3B
PT2B
PT2A
0
0
0
0
0
0
0
0
PT6D
0
0
0
0
0
0
0
0
PT6F
VCCIO0
PT4B
C
T
C
T
PT4A
PT3B
C
T
PT2B
C
T
PT2A
GNDIO0
GNDIO7
GNDIO0
GNDIO7
100**
-
-
*Supports true LVDS outputs.
**Double bonded to the pin.
*** Primary clock inputs are single-ended.
4-10
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 144 TQFP
LAMXO640
LAMXO1200
LAMXO2280
Pin
Ball
Dual
Function
Ball
Dual
Function
Ball
Dual
Function
Number Function Bank
Differential Function Bank
Differential Function Bank
Differential
1
PL2A
PL2C
PL2B
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
-
T
T
PL2A
PL2B
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
-
T
C
PL2A
PL2B
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
-
LUM0_PLLT_FB_A
LUM0_PLLC_FB_A
T
C
2
3
C
T
PL3A
T*
C*
T
PL3A
T*
C*
T
4
PL3A
PL3B
PL3B
5
PL2D
PL3B
C
C
T
PL3C
PL3C
LUM0_PLLT_IN_A
LUM0_PLLC_IN_A
6
PL3D
C
PL3D
C
7
PL3C
PL3D
PL4A
PL4A
T*
C*
PL4A
T*
C*
8
C
PL4B
PL4B
9
PL4C
PL4C
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VCCIO3
GNDIO3
PL4D
PL5A
VCCIO7
GNDIO7
PL5C
VCCIO7
GNDIO7
PL6C
T
PL6A
T*
PL7A
T*
PL5B
GSRN
C
PL6B
GSRN
C*
PL7B
GSRN
C*
PL5D
GND
PL6D
PL7D
GND
GND
PL6C
PL6D
PL7A
3
3
3
3
-
T
C
T
PL7C
7
7
6
6
-
T
C
PL9C
7
7
6
6
-
T
C
PL7D
PL9D
PL10A
PL10B
VCC
T*
C*
PL13A
PL13B
VCC
T*
C*
PL7B
C
VCC
PL8A
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
T
PL11A
PL11B
PL11C
PL12B
VCCIO6
GNDIO6
PL13D
PL14A
PL14B
PL14C
PL14D
PL15A
PL15B
PL16A
PL16B
GNDIO5
VCCIO5
TMS
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
T*
PL13D
PL14D
PL14C
PL15B
VCCIO6
GNDIO6
PL16D
PL17A
PL17B
PL17C
PL17D
PL18A
PL18B
PL19A
PL19B
GNDIO5
VCCIO5
TMS
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
PL8B
C
C*
C
T
PL8C
PL9C
VCCIO3
GNDIO3
PL9D
PL10A
PL10B
PL10C
PL11A
PL10D
PL11C
PL11B
PL11D
GNDIO2
VCCIO2
TMS
TSALL
TSALL
TSALL
T
C
T
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
T*
C*
T
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
T*
C*
T
C
T
T
C
C
C
T
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T*
C*
T
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T*
C*
T
C
C
C
C
TMS
TCK
TMS
TCK
TMS
TCK
PB2C
PB3A
TCK
PB2C
PB2D
TCK
T
PB2A
PB2B
TCK
T
T
C
C
PB3B
PB3C
PB3D
PB4A
TDO
C
T
C
T
PB3A
PB3B
PB4A
PB4B
TDO
T
C
T
PB3A
PB3B
PB4A
PB4B
TDO
T
C
T
C
C
TDO
TDO
TDO
PB4B
PB4C
PB4D
C
T
PB4D
PB5A
PB5B
PB4D
PB5A
PB5B
T
T
C
C
C
4-11
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 144 TQFP (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Pin
Ball
Dual
Function
Ball
Dual
Function
Ball
Dual
Function
Number Function Bank
Differential Function Bank
Differential Function Bank
Differential
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70**
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TDI
VCC
2
-
TDI
TDI
VCC
5
-
TDI
TDI
VCC
5
-
TDI
VCCAUX
PB5A
-
VCCAUX
PB6F
-
VCCAUX
PB8F
-
2
2
2
2
2
-
T
5
4
4
4
4
-
5
4
4
4
4
-
PB5B
PCLKT2_1***
PCLKT2_0***
C
PB7B
PCLK4_1***
PCLK4_0***
PB10F
PB10C
PB10D
PB10B
GND
PCLK4_1***
PCLK4_0***
PB5D
PB6A
PB7C
T
T
T
PB7D
C
C
PB6B
C
PB7F
GND
GND
PB7C
PB7E
2
2
2
2
2
2
2
2
2
2
-
PB9A
4
4
4
4
4
4
4
4
4
4
-
T
PB12A
PB12B
PB12E
VCCIO4
GNDIO4
PB13A
PB13B
PB13C
PB13D
PB14D
NC
4
4
4
4
4
4
4
4
4
4
-
T
PB9B
C
C
PB8A
PB9E
VCCIO2
GNDIO2
PB8C
PB8D
PB9A
VCCIO4
GNDIO4
PB10A
PB10B
PB10C
PB10D
PB10F
NC
T
C
T
T
C
T
C
T
T
C
T
PB9C
PB9B
C
C
SLEEPN
PB9D
PB9F
SLEEPN
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C
PB11C
PB11D
PR16B
PR16A
PR15B
PR15A
PR14D
PR14C
PR14B
PR14A
PR13D
VCCIO3
GNDIO3
PR12B
PR12A
PR11B
PR11A
GND
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
-
T
C
PB16C
PB16D
PR20B
PR20A
PR19B
PR19A
PR17D
PR17C
PR17B
PR17A
PR16D
VCCIO3
GNDIO3
PR15B
PR15A
PR14B
PR14A
GND
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
-
T
C
C
T
PR11D
PR11B
PR11C
PR10D
PR11A
PR10B
PR10C
PR10A
PR9D
VCCIO1
GNDIO1
PR9A
PR8C
PR8A
PR7D
GND
C
C
T
C
T
C
T
T
C
T
C*
T*
C
C
T
C
T
T
C*
T*
C*
T*
C*
T*
C*
T*
C*
T*
C*
T*
PR7B
PR7A
PR6D
PR6C
VCC
1
1
1
1
-
C
T
C
T
PR10B
PR10A
PR8B
3
3
2
2
-
C*
T*
C*
T*
PR13B
PR13A
PR10B
PR10A
VCC
3
3
2
2
-
C*
T*
C*
T*
PR8A
VCC
PR5D
PR5B
PR4D
PR4B
VCCIO1
GNDIO1
PR4A
1
1
1
1
1
1
1
PR6B
2
2
2
2
2
2
2
C*
T*
C*
T*
PR8B
2
2
2
2
2
2
2
C*
T*
C*
T*
PR6A
PR8A
PR5B
PR7B
C
T
PR5A
PR7A
VCCIO2
GNDIO2
PR4C
VCCIO2
GNDIO2
PR5C
4-12
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 144 TQFP (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Pin
Ball
Dual
Function
Ball
Dual
Function
Ball
Dual
Function
Number Function Bank
Differential Function Bank
Differential Function Bank
Differential
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
PR3D
PR3C
PR3B
PR2D
PR3A
PR2B
PR2C
PR2A
PT9F
PT9D
PT9E
PT9B
PT9C
PT9A
PT8C
PT8B
VCCIO0
GNDIO0
PT8A
PT7E
PT7C
PT7A
GND
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-
C
T
C
C
T
C
T
T
C
C
T
C
T
T
PR4B
PR4A
PR3D
PR3C
PR3B
PR3A
PR2B
PR2A
PT11D
PT11C
PT11B
PT11A
PT10F
PT10E
PT10D
PT10C
VCCIO1
GNDIO1
PT9F
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C*
T*
C
T
PR5B
PR5A
PR4D
PR4C
PR4B
PR4A
PR3B
PR3A
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
PT14B
PT14A
VCCIO1
GNDIO1
PT12F
PT12E
PT12D
PT12C
GND
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C*
T*
C
T
C*
T*
C
T
C*
T*
C*
T*
C
C
T
T
C
T
C
T
C
T
C
T
C
T
C
C
T
T
C
T
C
T
C
T
C
T
PT9E
PT9B
PT9A
GND
PT6B
PT6A
PT5C
PT5B
VCCAUX
VCC
0
0
0
0
-
PCLK0_1***
PCLK0_0***
C
T
PT7D
PT7B
1
1
1
0
-
PCLK1_1***
PCLK1_0***
PT10B
PT9D
1
1
1
1
-
PCLK1_1***
PCLK1_0***
C
T
C
T
PT7A
PT9C
PT6F
PT9B
VCCAUX
VCC
VCCAUX
VCC
-
-
-
PT4D
PT4B
PT4A
PT3F
PT3D
VCCIO0
GNDIO0
PT3B
PT2F
PT3A
PT2D
PT2E
PT2B
PT2C
PT2A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PT5D
PT5C
PT5B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C
T
C
T
PT7B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C
T
C
T
PT7A
PT6D
PT5A
PT6E
T
PT4B
PT6F
C
VCCIO0
GNDIO0
PT3D
PT3C
PT3B
VCCIO0
GNDIO0
PT4B
C
C
T
C
T
C
T
T
C
T
C
T
C
T
C
T
T
C
C
T
PT4A
PT3B
PT3A
PT3A
PT2D
PT2C
PT2B
PT2D
C
T
PT2C
PT2B
C
T
PT2A
PT2A
*Supports true LVDS outputs.
**NC for “E” devices.
***Primary clock inputs arer single-ended.
4-13
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
GND
GNDIO3
3
3
GND GNDIO7
VCCIO7 VCCIO7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
-
GND GNDIO7
VCCIO7 VCCIO7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
-
VCCIO3 VCCIO3
E4
E5
F5
F6
F3
F4
E3
E2
C3
C2
B1
C1
NC
NC
E4
E5
F5
F6
F3
F4
E3
E2
C3
C2
B1
C1
PL2A
PL2B
PL3A
PL3B
PL3C
PL3D
PL4A
PL4B
PL4C
PL4D
PL5A
PL5B
T
C
E4
E5
F5
F6
F3
F4
E3
E2
C3
C2
B1
C1
PL2A
PL2B
PL3A
PL3B
PL3C
PL3D
PL4A
PL4B
PL4C
PL4D
PL5A
PL5B
LUM0_PLLT_FB_A
LUM0_PLLC_FB_A
T
C
NC
T**
C**
T
T**
C**
T
NC
PL3A
PL3B
PL2C
PL2D
NC
3
3
3
3
T
C
T
LUM0_PLLT_IN_A
LUM0_PLLC_IN_A
C
C
T**
C**
T
T**
C**
T
C
NC
C
C
PL2A
PL2B
3
3
3
3
3
3
3
3
3
3
T
T**
C**
T**
C**
C
VCCIO3 VCCIO3
VCCIO7 VCCIO7
VCCIO7 VCCIO7
GND
D2
D1
F2
G2
E1
F1
G4
G5
GND
G3
H3
H4
H5
-
GNDIO3
PL3C
PL3D
PL5A
PL5B
PL4A
PL4B
NC
GND
D2
GNDIO7
PL5C
PL5D
PL6A
PL6B
PL6C
PL6D
PL7A
PL7B
GND
GND
D2
GNDIO7
PL6C
PL6D
PL7A
PL7B
PL7C
PL7D
PL8A
PL8B
GND
T
C
T
T
C
T
C
D1
D1
F2
T**
C**
T
F2
T**
C**
T
GSRN
C
T
G2
E1
GSRN
G2
E1
GSRN
C
F1
C
F1
C
G4
G5
GND
G3
H3
T**
C**
G4
G5
GND
G3
H3
T**
C**
NC
GND
PL4C
PL4D
NC
-
3
3
T
PL7C
PL7D
PL8A
PL8B
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
T
PL8C
PL8D
PL9A
PL9B
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
T
C
C
C
H4
T**
C**
H4
T**
C**
NC
H5
H5
-
VCCIO7 VCCIO7
VCCIO7 VCCIO7
-
-
GND
G1
H1
H2
J2
GNDIO7
PL8C
PL8D
PL9A
GND
G1
H1
H2
J2
GNDIO7
PL10C
PL10D
PL11A
PL11B
PL11C
PL11D
PL12A
G1
H1
H2
J2
PL5C
PL5D
PL6A
PL6B
PL7C
PL7D
PL6C
-
3
3
3
3
3
3
3
T
C
T
C
T
C
T
T
C
T
C
T**
C**
T
T**
C**
T
PL9B
J3
J3
PL9C
PL9D
PL10A
J3
K3
J1
K3
J1
C
K3
J1
C
T**
T**
-
VCCIO6 VCCIO6
VCCIO6 VCCIO6
-
-
GND
K1
K2
L2
GNDIO6
PL10B
PL10C
PL10D
PL11A
PL11B
PL11D
PL11C
PL12A
PL12B
PL12C
PL12D
GND
K1
K2
L2
GNDIO6
PL12B
PL12C
PL12D
PL13A
PL13B
PL14D
PL14C
PL15A
PL15B
PL15C
PL15D
K1
K2
L2
L1
M1
P1
N1
L3
M3
M2
N2
PL6D
PL9A
PL9B
PL7A
PL7B
PL8D
PL8C
PL10A
PL10B
PL9C
PL9D
3
3
3
3
3
3
3
3
3
3
3
3
3
C
T
C
T
C
C
T
T
C
T
C
C**
T
C**
T
C
C
L1
T**
C**
C
L1
T**
C**
C
M1
P1
N1
L3
M1
P1
N1
L3
TSALL
TSALL
T
TSALL
T
T**
C**
T
T**
C**
T
M3
M2
N2
M3
M2
N2
C
C
VCCIO3 VCCIO3
GND GNDIO3
VCCIO6 VCCIO6
GND GNDIO6
VCCIO6 VCCIO6
GND GNDIO6
4-14
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
J4
J5
PL8A
PL8B
PL11A
PL11B
-
3
3
3
3
-
T
C
T
J4
J5
PL13A
PL13B
PL13C
PL13D
-
6
6
6
6
-
T**
C**
T
J4
J5
PL16A
PL16B
PL16C
PL16D
GND
6
6
6
6
-
T**
C**
T
R1
R2
-
R1
R2
-
R1
R2
GND
K5
K4
L5
C
C
C
K5
K4
L5
L4
M5
M4
N4
N3
NC
K5
K4
L5
L4
M5
M4
N4
N3
PL14A
PL14B
PL14C
PL14D
PL15A
PL15B
PL16A
PL16B
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
-
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
T**
C**
T
PL17A
PL17B
PL17C
PL17D
PL18A
PL18B
PL19A
PL19B
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
-
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
T**
C**
T
NC
PL10C
PL10D
NC
3
3
T
C
C
L4
C
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T**
C**
T
M5
M4
N4
N3
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T**
C**
T
NC
PL11C
PL11D
3
3
3
3
2
2
2
T
C
C
C
VCCIO3 VCCIO3
VCCIO6 VCCIO6
VCCIO6 VCCIO6
GND
GND
GNDIO3
GNDIO2
GND
GND
GNDIO6
GNDIO5
GND
GND
GNDIO6
GNDIO5
VCCIO2 VCCIO2
VCCIO5 VCCIO5
VCCIO5 VCCIO5
P4
P2
P3
N5
R3
N6
T2
TMS
NC
TMS
TCK
P4
P2
P3
N5
R3
N6
T2
TMS
PB2A
PB2B
PB2C
TCK
TMS
TCK
P4
P2
P3
N5
R3
N6
T2
TMS
PB2A
PB2B
PB2C
TCK
TMS
TCK
T
C
T
T
C
T
NC
NC
TCK
2
NC
PB2D
PB3A
PB3B
PB3C
PB3D
PB4A
PB4B
PB4C
TDO
C
T
C
T
C
T
C
T
PB2D
PB3A
PB3B
PB3C
PB3D
PB4A
PB4B
PB4C
TDO
C
T
C
T
C
T
C
T
PB2A
PB2B
PB2C
PB2D
PB3A
PB3B
PB3C
TDO
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
T
C
T
C
T
C
T
T3
T3
T3
R4
R5
P5
P6
T5
R4
R5
P5
P6
T5
R4
R5
P5
P6
T5
M6
T4
TDO
M6
T4
TDO
M6
T4
TDO
PB3D
PB4A
GNDIO2
C
T
PB4D
PB5A
GNDIO5
C
T
PB4D
PB5A
GNDIO5
C
T
R6
GND
R6
GND
R6
GND
VCCIO2 VCCIO2
VCCIO5 VCCIO5
VCCIO5 VCCIO5
T6
N7
T8
T7
M7
M8
T9
R7
R8
-
PB4B
TDI
C
T6
N7
T8
T7
M7
M8
T9
R7
R8
PB5B
TDI
C
T6
N7
T8
T7
M7
M8
T9
R7
R8
PB5B
TDI
C
TDI
TDI
TDI
PB4C
PB4D
NC
T
PB5C
PB5D
PB6A
PB6B
VCCAUX
PB6C
PB6D
T
C
T
PB6A
PB6B
PB7C
PB7D
VCCAUX
PB8C
PB8D
T
C
T
C
NC
C
C
VCCAUX
PB4E
PB4F
-
-
2
2
T
5
5
5
5
5
5
4
4
4
4
4
T
5
5
5
5
4
4
4
4
4
4
4
T
C
C
C
VCCIO5 VCCIO5
VCCIO5 VCCIO5
-
-
GND
P7
GNDIO5
PB6E
PB6F
PB7A
PB7B
PB7D
PB7C
PB7F
GND
P7
GNDIO5
PB9A
P7
P8
N8
N9
P10
P9
M9
PB5C
PB5D
PB5A
PB5B
PB7B
PB7A
PB6B
2
2
2
2
2
2
2
T
C
T
T
C
T
T
C
T
P8
P8
PB9B
N8
N8
PB10E
PB10F
PB10D
PB10C
PB10B
PCLK2_1****
PCLK2_0****
C
C
T
N9
PCLK4_1****
PCLK4_0****
4-15
C
C
T
N9
PCLK4_1****
PCLK4_0****
C
C
T
P10
P9
P10
P9
C
M9
C
M9
C
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
-
-
VCCIO4 VCCIO4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
-
VCCIO4 VCCIO4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
-
-
-
GND
M10
R9
GNDIO4
PB7E
PB8A
PB8B
PB8C
PB8D
PB8E
PB8F
GND
M10
R9
GNDIO4
PB10A
PB11C
PB11D
PB12A
PB12B
PB12C
PB12D
M10
R9
PB6A
PB6C
PB6D
PB7C
PB7D
NC
2
2
2
2
2
T
T
C
T
C
T
T
C
T
C
T
C
T
T
C
T
C
T
C
R10
T10
T11
N10
N11
R10
T10
T11
N10
N11
R10
T10
T11
N10
N11
NC
VCCIO2 VCCIO2
2
2
2
2
2
2
2
2
2
-
VCCIO4 VCCIO4
VCCIO4 VCCIO4
GND
R11
R12
P11
P12
T13
T12
R13
R14
GND
T14
T15
GNDIO2
PB7E
PB7F
PB8A
PB8B
PB8C
PB8D
PB9A
PB9B
GND
GND
R11
R12
P11
P12
T13
T12
R13
R14
GND
T14
T15
P13
P14
R15
R16
P15
P16
GNDIO4
PB9A
GND
R11
R12
P11
P12
T13
T12
R13
R14
GND
T14
T15
P13
P14
R15
R16
P15
P16
GNDIO4
PB13A
PB13B
PB13C
PB13D
PB14A
PB14B
PB14C
PB14D
GND
T
C
T
T
C
T
T
C
T
PB9B
PB9C
PB9D
PB9E
C
T
C
T
C
T
C
T
PB9F
C
T
C
T
PB10A
PB10B
GND
C
C
C
-
PB9C
PB9D
2
2
-
T
PB10C
PB10D
NC
4
4
-
T
PB15A
PB15B
NC
4
4
-
T
C
C
C
P13*** SLEEPN
SLEEPN
P14
R15
R16
P15
P16
PB9F
NC
2
PB10F
PB11A
PB11B
PB11C
PB11D
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
PB15D
PB16A
PB16B
PB16C
PB16D
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
T
C
T
T
C
T
NC
NC
NC
C
C
VCCIO2 VCCIO2
2
2
1
1
VCCIO4 VCCIO4
VCCIO4 VCCIO4
GND
GND
GNDIO2
GNDIO1
GND
GND
GNDIO4
GNDIO3
GND
GND
GNDIO4
GNDIO3
VCCIO1 VCCIO1
VCCIO3 VCCIO3
VCCIO3 VCCIO3
M11
L11
N12
N13
M13
M12
N14
N15
L13
L12
M14
NC
NC
M11
L11
N12
N13
M13
M12
N14
N15
L13
L12
M14
PR16B
PR16A
PR15B
PR15A
PR14D
PR14C
PR14B
PR14A
PR13D
PR13C
PR13B
C
T
M11
L11
N12
N13
M13
M12
N14
N15
L13
L12
M14
PR20B
PR20A
PR18B
PR18A
PR17D
PR17C
PR17B
PR17A
PR16D
PR16C
PR16B
C
T
NC
C**
T**
C
C**
T**
C
NC
NC
NC
T
T
PR11D
PR11C
PR11B
PR11A
PR10B
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
C
T
C**
T**
C
C**
T**
C
C
T
T
T
C
C**
C**
VCCIO1 VCCIO1
VCCIO3 VCCIO3
VCCIO3 VCCIO3
GND
L14
N16
M16
M15
L15
L16
K16
K13
GNDIO1
PR10A
PR10D
PR10C
PR9D
GND
L14
N16
M16
M15
L15
L16
K16
K13
GNDIO3
PR13A
PR12D
PR12C
PR12B
PR12A
PR11D
PR11C
PR11B
GND
L14
N16
M16
M15
L15
L16
K16
K13
GNDIO3
PR16A
PR15D
PR15C
PR15B
PR15A
PR14D
PR14C
PR14B
T
C
T
T**
C
T**
C
T
T
C
T
C**
T**
C
C**
T**
C
PR9C
PR9B
C
T
PR9A
T
T
PR8D
C
C**
C**
4-16
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
J13
GND
K14
J14
K15
J15
-
PR8C
GND
PR8B
PR8A
PR7D
PR7C
-
1
-
T
J13
GND
K14
J14
PR11A
GND
3
-
T**
J13
GND
K14
J14
PR14A
GND
3
-
T**
1
1
1
1
C
T
C
T
PR10D
PR10C
PR10B
PR10A
GNDIO3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
-
C
T
PR13D
PR13C
PR13B
PR13A
GNDIO3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
-
C
T
K15
J15
C**
T**
K15
J15
C**
T**
GND
GND
-
-
VCCIO3 VCCIO3
VCCIO3 VCCIO3
K12
J12
J16
H16
H15
G15
H14
G14
GND
NC
K12
J12
PR9D
PR9C
PR9B
PR9A
PR8D
PR8C
PR8B
PR8A
GNDIO2
C
T
K12
J12
PR11D
PR11C
PR11B
PR11A
PR10D
PR10C
PR10B
PR10A
GNDIO2
C
T
NC
PR7B
PR7A
PR6B
PR6A
PR5D
PR5C
GNDIO1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C
T
C
T
C
T
J16
C**
T**
C
J16
C**
T**
C
H16
H15
G15
H14
G14
GND
H16
H15
G15
H14
G14
GND
T
T
C**
T**
C**
T**
VCCIO1 VCCIO1
VCCIO2 VCCIO2
VCCIO2 VCCIO2
H13
H12
G13
G12
G16
F16
F15
E15
E16
D16
PR6D
PR6C
PR4D
PR4C
PR5B
PR5A
PR4B
PR4A
PR3B
PR3A
C
T
C
T
C
T
C
T
C
T
H13
H12
G13
G12
G16
F16
F15
E15
E16
D16
PR7D
PR7C
PR7B
PR7A
PR6D
PR6C
PR6B
PR6A
PR5D
PR5C
C
T
H13
H12
G13
G12
G16
F16
F15
E15
E16
D16
PR9D
PR9C
PR9B
PR9A
PR7D
PR7C
PR7B
PR7A
PR6D
PR6C
C
T
C**
T**
C
C**
T**
C
T
T
C**
T**
C
C**
T**
C
T
T
VCCIO1 VCCIO1
VCCIO2 VCCIO2
VCCIO2 VCCIO2
GND
D15
C15
C16
B16
F14
E14
-
GNDIO1
PR2D
PR2C
PR2B
PR2A
PR3D
PR3C
-
GND
D15
C15
C16
B16
F14
E14
-
GNDIO2
PR5B
PR5A
PR4D
PR4C
PR4B
PR4A
-
GND
D15
C15
C16
B16
F14
E14
GND
F12
F13
E12
E13
D13
D14
GNDIO2
PR6B
PR6A
PR5D
PR5C
PR5B
PR5A
GND
C
T
C
T
C
T
C**
T**
C
C**
T**
C
T
T
C**
T**
C**
T**
F12
F13
E12
E13
D13
D14
NC
F12
F13
E12
E13
D13
D14
PR3D
PR3C
PR3B
PR3A
PR2B
PR2A
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
C
T
PR4D
PR4C
PR4B
PR4A
PR3B
PR3A
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
C
NC
T
NC
C**
T**
C
C**
T**
C**
T**
NC
NC
NC
T
VCCIO0 VCCIO0
0
0
0
0
VCCIO2 VCCIO2
VCCIO2 VCCIO2
GND
GND
GNDIO0
GNDIO0
GND
GND
GNDIO2
GNDIO1
GND
GND
GNDIO2
GNDIO1
VCCIO0 VCCIO0
VCCIO1 VCCIO1
VCCIO1 VCCIO1
B15
A15
C14
B14
C13
B13
NC
NC
B15
A15
C14
B14
C13
B13
PT11D
PT11C
PT11B
PT11A
PT10F
PT10E
C
T
C
T
C
T
B15
A15
C14
B14
C13
B13
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
C
T
C
T
C
T
NC
NC
PT9F
PT9E
0
0
C
T
4-17
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
E11
E10
D12
D11
A14
A13
C12
C11
-
NC
NC
E11
E10
D12
D11
A14
A13
C12
C11
PT10D
PT10C
PT10B
PT10A
PT9F
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C
T
C
T
C
T
C
T
E11
E10
D12
D11
A14
A13
C12
C11
PT15B
PT15A
PT14D
PT14C
PT14B
PT14A
PT13D
PT13C
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C
T
C
T
C
T
C
T
PT9D
PT9C
PT7F
PT7E
PT8B
PT8A
-
0
0
0
0
0
0
C
T
C
T
C
T
PT9E
PT9D
PT9C
VCCIO1 VCCIO1
VCCIO1 VCCIO1
-
-
GND
B12
B11
A12
A11
GND
B10
B9
GNDIO1
PT9B
PT9A
PT8F
PT8E
GND
GND
B12
B11
A12
A11
GND
B10
B9
GNDIO1
PT12D
PT12C
PT12B
PT12A
GND
B12
B11
A12
A11
GND
B10
B9
PT7B
PT7A
PT7D
PT7C
GND
PT5D
PT5C
PT8D
PT8C
-
0
0
0
0
-
C
T
C
T
C
T
C
T
C
T
C
T
0
0
0
0
C
T
C
T
PT8D
PT8C
PT8B
PT8A
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
-
C
T
C
T
PT11B
PT11A
PT10F
PT10E
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
-
C
T
C
T
D10
D9
D10
D9
D10
D9
-
VCCIO1 VCCIO1
VCCIO1 VCCIO1
-
-
GND
C10
C9
GNDIO1
PT7F
PT7E
PT7D
PT7C
PT7B
PT7A
PT6F
PT6E
GND
C10
C9
GNDIO1
PT10D
PT10C
PT10B
PT10A
PT9D
C10
C9
PT6D
PT6C
PT6B
PT6A
PT9B
PT9A
PT5B
PT5A
0
0
0
0
0
0
0
0
0
0
0
0
-
C
T
C
T
C
T
C
T
C
T
C
T
C
T
C
T
C
T
C
T
C
T
C
T
A9
PCLK0_1****
PCLK0_0****
A9
PCLK1_1****
PCLK1_0****
A9
PCLK1_1****
PCLK1_0****
A10
E9
A10
E9
A10
E9
E8
E8
E8
PT9C
D7
D7
D7
PT9B
D8
D8
D8
PT9A
VCCIO0 VCCIO0
VCCIO0 VCCIO0
VCCIO0 VCCIO0
GND
C8
B8
A8
A7
A6
B7
B6
C6
C7
A5
A4
E7
E6
B5
B4
D5
D6
C4
C5
-
GNDIO0
PT4F
PT4E
VCCAUX
PT4D
PT4C
PT4B
PT4A
PT3C
PT3D
PT3E
PT3F
NC
GND
C8
B8
A8
A7
A6
B7
B6
C6
C7
A5
A4
E7
E6
B5
B4
D5
D6
C4
C5
-
GNDIO0
PT6D
PT6C
VCCAUX
PT6B
PT6A
PT5F
PT5E
PT5C
PT5D
PT5A
PT5B
PT4C
PT4D
PT3F
PT3E
PT3D
PT3C
PT4A
PT4B
-
GND
C8
B8
A8
A7
A6
B7
B6
C6
C7
A5
A4
E7
E6
B5
B4
D5
D6
C4
C5
GND
D4
D3
GNDIO0
PT8D
PT8C
VCCAUX
PT7D
PT7C
PT7B
PT7A
PT6A
PT6B
PT6C
PT6D
PT6E
PT6F
PT5D
PT5C
PT5B
PT5A
PT4A
PT4B
GND
C
T
C
T
C
T
0
0
0
0
0
0
0
0
C
T
C
T
T
C
T
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-
C
T
C
T
T
C
T
C
T
C
C
T
C
T
T
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-
C
T
C
T
T
C
T
C
T
C
C
T
C
T
T
C
NC
PT3B
PT3A
PT2D
PT2C
PT2E
PT2F
-
0
0
0
0
0
0
-
C
T
C
T
T
C
D4
D3
NC
D4
D3
PT2D
PT2C
0
0
C
T
PT3D
PT3C
0
0
C
T
NC
4-18
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO640, LA-MachXO1200 and LA-MachXO2280 Logic Signal
Connections: 256 ftBGA (Cont.)
LAMXO640
LAMXO1200
LAMXO2280
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Ball
Ball
Dual
Function
Number Function Bank
Differential Number Function Bank
Differential Number Function Bank
Differential
A3
A2
B3
B2
PT2B
PT2A
NC
0
0
C
T
A3
A2
B3
B2
PT3B
PT3A
PT2B
PT2A
0
0
0
0
0
0
-
C
T
C
T
A3
A2
B3
B2
PT3B
PT3A
PT2D
PT2C
0
0
0
0
0
0
-
C
T
C
T
NC
VCCIO0 VCCIO0
0
0
-
VCCIO0 VCCIO0
VCCIO0 VCCIO0
GND
A1
GNDIO0
GND
GND
A1
GNDIO0
GND
GND
A1
GNDIO0
GND
A16
F11
G8
G9
H7
GND
-
A16
F11
G8
G9
H7
GND
-
A16
F11
G8
G9
H7
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
GND
-
H8
GND
-
H8
GND
-
H8
GND
-
H9
GND
-
H9
GND
-
H9
GND
-
H10
J7
GND
-
H10
J7
GND
-
H10
J7
GND
-
GND
-
GND
-
GND
-
J8
GND
-
J8
GND
-
J8
GND
-
J9
GND
-
J9
GND
-
J9
GND
-
J10
K8
GND
-
J10
K8
GND
-
J10
K8
GND
-
GND
-
GND
-
GND
-
K9
GND
-
K9
GND
-
K9
GND
-
L6
GND
-
L6
GND
-
L6
GND
-
T1
GND
-
T1
GND
-
T1
GND
-
T16
G7
G10
K7
GND
-
T16
G7
G10
K7
GND
-
T16
G7
G10
K7
GND
-
VCC
-
VCC
-
VCC
-
VCC
-
VCC
-
VCC
-
VCC
-
VCC
-
VCC
-
K10
H6
VCC
-
K10
H6
VCC
-
K10
H6
VCC
-
VCCIO3
VCCIO3
VCCIO3
VCCIO3
VCCIO2
VCCIO2
VCCIO2
VCCIO2
VCCIO1
VCCIO1
VCCIO1
VCCIO1
VCCIO0
VCCIO0
VCCIO0
VCCIO0
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
VCCIO7
VCCIO7
VCCIO6
VCCIO6
VCCIO5
VCCIO5
VCCIO4
VCCIO4
VCCIO3
VCCIO3
VCCIO2
VCCIO2
VCCIO1
VCCIO1
VCCIO0
VCCIO0
7
7
6
6
5
5
4
4
3
3
2
2
1
1
0
0
VCCIO7
VCCIO7
VCCIO6
VCCIO6
VCCIO5
VCCIO5
VCCIO4
VCCIO4
VCCIO3
VCCIO3
VCCIO2
VCCIO2
VCCIO1
VCCIO1
VCCIO0
VCCIO0
7
7
6
6
5
5
4
4
3
3
2
2
1
1
0
0
G6
K6
G6
K6
G6
K6
J6
J6
J6
L8
L8
L8
L7
L7
L7
L9
L9
L9
L10
K11
J11
H11
G11
F9
L10
K11
J11
H11
G11
F9
L10
K11
J11
H11
G11
F9
F10
F8
F10
F8
F10
F8
F7
F7
F7
* LCMXO640 only.
** Supports true LVDS outputs.
*** NC for “E” devices.
**** Primary clock inputs are single-ended.
4-19
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA
LAMXO2280
Ball Number
GND
VCCIO7
D4
Ball Function
GNDIO7
VCCIO7
PL2A
Bank
7
7
7
7
7
7
7
7
7
7
7
-
Dual Function
Differential
LUM0_PLLT_FB_A
LUM0_PLLC_FB_A
T
C
F5
PL2B
B3
PL3A
T*
C*
T
C3
PL3B
E4
PL3C
LUM0_PLLT_IN_A
LUM0_PLLC_IN_A
G6
PL3D
C
A1
PL4A
T*
C*
T
B1
PL4B
F4
PL4C
VCC
E3
VCC
PL4D
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
-
C
T*
C*
T
D2
PL5A
D3
PL5B
G5
PL5C
F3
PL5D
C
C2
PL6A
T*
VCCIO7
GND
C1
VCCIO7
GNDIO7
PL6B
C*
T
H5
PL6C
G4
PL6D
C
E2
PL7A
T*
C*
T
D1
PL7B
GSRN
J6
PL7C
H4
PL7D
C
F2
PL8A
T*
C*
E1
PL8B
GND
J3
GND
PL8C
7
7
7
7
7
7
7
7
7
7
7
7
T
C
J5
PL8D
G3
PL9A
T*
C*
T
H3
PL9B
K3
PL9C
K5
PL9D
C
F1
PL10A
VCCIO7
GNDIO7
PL10B
PL10C
PL10D
T*
VCCIO7
GND
G1
C*
T
K4
K6
C
4-20
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
G2
Ball Function
PL11A
PL11B
PL11C
PL11D
PL12A
VCCIO6
GNDIO6
PL12B
PL12C
PL12D
PL13A
PL13B
PL13C
VCC
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
-
Dual Function
Differential
T*
C*
T
H2
L3
L5
C
H1
T*
VCCIO6
GND
J2
C*
T
L4
L6
C
K2
T*
C*
T
K1
J1
VCC
L2
PL13D
PL14D
PL14C
PL14B
PL14A
PL15A
PL15B
PL15C
PL15D
VCCIO6
GNDIO6
PL16A
PL16B
PL16C
PL16D
GND
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
-
C
C
M5
M3
TSALL
T
L1
C*
T*
T*
C*
T
M2
M1
N1
M6
M4
C
VCCIO6
GND
P1
T*
C*
T
P2
N3
N4
C
GND
T1
PL17A
PL17B
PL17C
PL17D
PL18A
PL18B
PL19A
PL19B
PL20A
VCCIO6
GNDIO6
GNDIO5
VCCIO5
6
6
6
6
6
6
6
6
6
6
6
5
5
LLM0_PLLT_FB_A
LLM0_PLLC_FB_A
T*
C*
T
R1
P3
N5
C
R3
LLM0_PLLT_IN_A
LLM0_PLLC_IN_A
T*
C*
T
R2
P4
N6
C
U1
T
VCCIO6
GND
GND
VCCIO5
4-21
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
T2
Ball Function
PL20B
TMS
Bank
6
5
5
5
5
5
5
5
5
-
Dual Function
Differential
C
P6
TMS
V1
PB2A
PB2B
PB2C
TCK
T
C
T
U2
T3
N7
TCK
R4
PB2D
PB3A
PB3B
VCC
C
T
R5
T4
C
VCC
R6
PB3C
PB3D
PB4A
PB4B
PB4C
TDO
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
-
T
C
T
C
T
P7
U3
T5
V2
N8
TDO
V3
PB4D
PB5A
GNDIO5
VCCIO5
PB5B
PB5C
PB5D
TDI
C
T
T6
GND
VCCIO5
U4
C
T
P8
T7
C
V4
TDI
R8
PB6A
PB6B
PB6C
PB6D
PB7A
VCC
T
C
T
C
T
N9
U5
V5
U6
VCC
V6
PB7B
PB7C
PB7D
PB8A
PB8B
VCCAUX
PB8C
PB8D
VCCIO5
GNDIO5
PB8E
PB8F
PB9A
5
5
5
5
5
-
C
T
P9
T8
C
T
U7
V7
C
M10
U8
5
5
5
5
5
5
4
T
V8
C
VCCIO5
GND
T9
T
C
T
U9
V9
4-22
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
V10
Ball Function
PB9B
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
-
Dual Function
PCLK4_1**
Differential
C
T
N10
PB9C
R10
PB9D
C
C
T
P10
PB10F
PB10E
PB10D
PB10C
PB10B
VCCIO4
GNDIO4
PB10A
PB11A
PB11B
GND
T10
U10
C
T
V11
U11
PCLK4_0**
C
VCCIO4
GND
T11
T
T
C
U12
R11
GND
T12
PB11C
PB11D
PB12A
PB12B
PB12C
PB12D
PB12E
VCCIO4
GNDIO4
PB12F
PB13A
PB13B
PB13C
PB13D
PB14A
PB14B
PB14C
GND
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
-
T
C
T
C
T
C
T
P11
V12
V13
R12
N11
U13
VCCIO4
GND
V14
C
T
C
T
C
T
C
T
T13
P12
R13
N12
V15
U14
V16
GND
T14
PB14D
PB15A
PB15B
NC
4
4
4
-
C
T
U15
V17
C
P13
T15
PB15D
PB16A
PB16B
PB16C
PB16D
VCCIO4
GNDIO4
4
4
4
4
4
4
4
U16
T
C
T
V18
N13
R14
C
VCCIO4
GND
4-23
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
GND
VCCIO3
P15
Ball Function
GNDIO3
VCCIO3
PR20B
PR20A
PR19B
PR19A
PR18B
PR18A
PR17D
PR17C
PR17B
VCC
Bank
3
3
3
3
3
3
3
3
3
3
3
-
Dual Function
Differential
C
T
N14
N15
C
M13
R15
T
C*
T*
C
T16
N16
M14
U17
T
C*
VCC
U18
PR17A
PR16D
PR16C
PR16B
VCCIO3
GNDIO3
PR16A
PR15D
PR15C
PR15B
PR15A
PR14D
PR14C
PR14B
PR14A
GND
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
-
T*
C
R17
R16
T
P16
C*
VCCIO3
GND
P17
T*
C
L13
M15
T17
T
C*
T*
C
T18
L14
L15
T
R18
C*
T*
P18
GND
K15
PR13D
PR13C
PR13B
PR13A
PR12D
PR12C
PR12B
PR12A
GNDIO3
VCCIO3
PR11D
PR11C
PR11B
PR11A
PR10D
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
C
T
K13
N17
C*
T*
C
N18
K16
K14
T
M16
L16
C*
T*
GND
VCCIO3
J16
C
T
J14
M17
L17
C*
T*
C
J15
4-24
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
J13
Ball Function
PR10C
PR10B
PR10A
GNDIO2
VCCIO2
PR9D
Bank
2
2
2
2
2
2
2
2
2
2
-
Dual Function
Differential
T
M18
L18
C*
T*
GND
VCCIO2
H16
C
T
H14
PR9C
K18
PR9B
C*
T*
C
J18
PR9A
J17
PR8D
VCC
H18
VCC
PR8C
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
-
T
C*
T*
C
H17
PR8B
G17
PR8A
H13
PR7D
H15
PR7C
T
G18
PR7B
C*
T*
C
F18
PR7A
G14
PR6D
G16
PR6C
T
VCCIO2
GND
E18
VCCIO2
GNDIO2
PR6B
C*
T*
C
F17
PR6A
G13
PR5D
G15
PR5C
T
E17
PR5B
C*
T*
E16
PR5A
GND
F15
GND
PR4D
2
2
2
2
2
2
2
2
2
2
2
2
1
1
C
T
E15
PR4C
D17
PR4B
C*
T*
C
D18
PR4A
B18
PR3D
C18
PR3C
T
C16
PR3B
C*
T*
C
D16
PR3A
C17
PR2B
D15
PR2A
T
VCCIO2
GND
GND
VCCIO1
VCCIO2
GNDIO2
GNDIO1
VCCIO1
4-25
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
E13
Ball Function
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
PT15B
PT15A
VCC
Bank
1
1
1
1
1
1
1
1
-
Dual Function
Differential
C
T
C
T
C
T
C
T
C15
F13
D14
A18
B17
A16
A17
VCC
D13
F12
PT14D
PT14C
PT14B
PT14A
PT13D
PT13C
PT13B
PT13A
VCCIO1
GNDIO1
PT12F
PT12E
PT12D
PT12C
PT12B
PT12A
PT11D
GND
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
C
T
C
T
C
T
C
T
C14
E12
C13
B16
B15
A15
VCCIO1
GND
B14
C
T
A14
D12
F11
C
T
B13
C
T
A13
C12
GND
B12
C
PT11C
PT11B
PT11A
PT10F
PT10E
VCCIO1
GNDIO1
PT10D
PT10C
PT10B
PT10A
PT9D
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
T
C
T
C
T
E11
D11
C11
A12
VCCIO1
GND
F10
C
T
D10
B11
PCLK1_1***
PCLK1_0***
C
T
A11
E10
C
T
C10
D9
PT9C
PT9B
C
T
E9
PT9A
B10
PT8F
C
4-26
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
A10
VCCIO0
GND
A9
Ball Function
PT8E
Bank
0
0
0
0
0
0
-
Dual Function
Differential
T
VCCIO0
GNDIO0
PT8D
PT8C
PT8B
C
T
C9
B9
C
F9
VCCAUX
PT8A
A8
0
0
0
-
T
C
T
B8
PT7D
PT7C
VCC
C8
VCC
A7
PT7B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-
C
T
B7
PT7A
A6
PT6A
T
B6
PT6B
C
T
D8
PT6C
PT6D
PT6E
F8
C
T
C7
E8
PT6F
C
C
D7
PT5D
VCCIO0
GNDIO0
PT5C
PT5B
VCCIO0
GND
E7
T
C
T
T
C
T
C
T
A5
C6
PT5A
B5
PT4A
A4
PT4B
D6
PT4C
PT4D
PT4E
F7
B4
GND
C5
GND
PT4F
0
0
0
0
0
0
0
0
0
0
0
-
C
C
T
F6
PT3D
PT3C
PT3B
E5
E6
C
T
D5
PT3A
A3
PT2D
PT2C
PT2B
C
T
C4
A2
C
T
B2
PT2A
VCCIO0
GND
E14
VCCIO0
GNDIO0
GND
4-27
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
F16
H10
H11
H8
Ball Function
GND
Bank
Dual Function
Differential
-
-
GND
GND
-
GND
-
H9
GND
-
J10
J11
J4
GND
-
GND
-
GND
-
J8
GND
-
J9
GND
-
K10
K11
K17
K8
GND
-
GND
-
GND
-
GND
-
K9
GND
-
L10
L11
L8
GND
-
GND
-
GND
-
L9
GND
-
N2
GND
-
P14
P5
GND
-
GND
-
R7
GND
-
F14
G11
G9
VCC
-
VCC
-
VCC
-
H7
VCC
-
L7
VCC
-
M9
VCC
-
H6
VCCIO7
VCCIO7
VCCIO6
VCCIO6
VCCIO5
VCCIO5
VCCIO4
VCCIO4
VCCIO3
VCCIO3
VCCIO2
VCCIO2
VCCIO1
VCCIO1
7
7
6
6
5
5
4
4
3
3
2
2
1
1
J7
M7
K7
M8
R9
M12
M11
L12
K12
J12
H12
G12
G10
4-28
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
LA-MachXO2280 Logic Signal Connections: 324 ftBGA (Cont.)
LAMXO2280
Ball Number
Ball Function
VCCIO0
Bank
Dual Function
Differential
G8
0
0
G7
VCCIO0
* Supports true LVDS outputs.
** Primary clock inputs are single-ended.
4-29
Pinout Information
LA-MachXO Automotive Family Data Sheet
Lattice Semiconductor
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1090 - Power Estimation and Management for MachXO Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-30
LA-MachXO Automotive Family Data Sheet
Ordering Information
April 2006
Data Sheet DS1003
Part Number Description
LAMXO XXXX X – X XXXXXX X
Device Family
LA-MachXO Automotive Crossover PLD
Grade
E = Automotive
Logic Capacity
256 LUTs = 256
640 LUTs = 640
1200 LUTs = 1200
2280 LUTs = 2280
Package
TN100 = 100-pin Lead-Free TQFP
TN144 = 144-pin Lead-Free TQFP
FTN256 = 256-ball Lead-Free ftBGA
FTN324 = 324-ball Lead-Free ftBGA
Supply Voltage
C = 1.8V/2.5V/3.3V
E = 1.2V
Speed
3 = -3 Speed Grade
Note: Parts dual marked as described.
Ordering Information
Part Number
LUTs
Supply Voltage
1.8V/2.5V/3.3V
1.8V/2.5V/3.3V
1.8V/2.5V/3.3V
1.8V/2.5V/3.3V
1.2V
I/Os
78
Grade
-3
Package
Pins
100
100
144
256
100
100
144
256
100
144
256
100
144
256
324
Temp.
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
AUTO
LAMXO256C-3TN100E
LAMXO640C-3TN100E
LAMXO640C-3TN144E
LAMXO640C-3FTN256E
LAMXO256E-3TN100E
LAMXO640E-3TN100E
LAMXO640E-3TN144E
LAMXO640E-3FTN256E
LAMXO1200E-3TN100E
LAMXO1200E-3TN144E
LAMXO1200E-3FTN256E
LAMXO2280E-3TN100E
LAMXO2280E-3TN144E
LAMXO2280E-3FTN256E
LAMXO2280E-3FTN324E
256
Lead-Free TQFP
Lead-Free TQFP
Lead-Free TQFP
Lead-Free ftBGA
Lead-Free TQFP
Lead-Free TQFP
Lead-Free TQFP
Lead-Free ftBGA
Lead-Free TQFP
Lead-Free TQFP
Lead-Free ftBGA
Lead-Free TQFP
Lead-Free TQFP
Lead-Free ftBGA
Lead-Free ftBGA
640
74
-3
640
113
159
78
-3
640
-3
256
-3
640
1.2V
74
-3
640
1.2V
113
159
73
-3
640
1.2V
-3
1200
1200
1200
2280
2280
2280
2280
1.2V
-3
1.2V
113
211
73
-3
1.2V
-3
1.2V
-3
1.2V
113
211
271
-3
1.2V
-3
1.2V
-3
© 2006 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
5-1
DS1003 Ordering Information_01.0
LA-MachXO Automotive Family Data Sheet
Supplemental Information
November 2007
Data Sheet DS1003
For Further Information
A variety of technical notes for the LA-MachXO family are available on the Lattice web site at www.latticesemi.com.
• MachXO sysIO Usage Guide (TN1091)
• MachXO sysCLOCK PLL Design and Usage Guide (TN1089)
• MachXO Memory Usage Guide (TN1092)
• Power Estimation and Management for MachXO Devices (TN1090)
• MachXO JTAG Programming and Configuration User’s Guide (TN1086)
• Minimizing System Interruption During Configuration Using TransFR Technology (TN1087)
• MachXO Density Migration (TN1097)
• IEEE 1149.1 Boundary Scan Testability in Lattice Devices
For further information on interface standards refer to the following web sites:
• JEDEC Standards (LVTTL, LVCMOS): www.jedec.org
• PCI: www.pcisig.com
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
6-1
DS1003 Further Information_01.1
LA-MachXO Automotive Family Data Sheet
Revision History
November 2007
Data Sheet DS1003
Revision History
Date
Version
Section
—
Change Summary
April 2006
May 2006
01.0
Initial release.
01.1
Pinout Information
Removed [LOC][0]_PLL_RST from Signal Descriptions table.
PCLK footnote added to appropriate pins in Logic Signal Connections
tables.
November 2006
01.2
DC and Switching
Characteristics
Corrections to MachXO “C” Sleep Mode Timing table - value for
t
(400ns) changed from max. to min. Value for t
WSLEEPN
WAWAKE
(100ns) changed from min. to max.
Added Flash Download Time table.
EBR Asynchronous Reset section added.
December 2006
01.3
Architecture
Pinout Information
Architecture
Power Supply and NC table: Pin/Ball orientation footnotes added.
Updated EBR Asynchronous Reset section.
February 2007
November 2007
01.4
01.5
DC and Switching
Characteristics
Updated sysIO Single-Ended DC Electrical Characteristics table.
Added JTAG Port Timing Waveforms diagram.
Added Thermal Management text section.
Updated title list.
Pinout Information
Supplemental
Information
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
7-1
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