HL60-010 [LEIDITECH]

Positive Thermal Coefficent Diodes;


型号：	HL60-010
厂家：	Leiditech
描述：	Positive Thermal Coefficent Diodes
文件：	总4页 (文件大小：1114K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HL60-005~500 Series

Positive Thermal Coefﬁcent Diodes

Features：



RoHS Compliant ＆ Halogen Free

Radial-leaded Devices

Cured，flame retardant epoxy polymer insulating material meets UL94V-0 requirements

Operation Current: 0.05A~5A ，Maximum Voltage: 60Vdc，Operating Temperature：-40℃ TO 85℃

Agency recognition:UL、TUV

Product Dimensions

Pig.1

Pig.2

Unit ：mm

HL60 Series

Dimensions（mm）

Lead material

Shape

Fig

Model

A(max)

B(max)

8.5

C(max)

3.0

D(typ)

5.1

Tinned metal(mm)

24AWG/Φ0.5

22AWG/Φ0.6

20 AWG/Φ0.8

HL60-005

HL60-010

HL60-017

HL60-020

HL60-025

HL60-030

HL60-040

HL60-050

HL60-065

HL60-075

HL60-090

HL60-110

HL60-135

5.0

5.5

9.5

3.0

7.4

12.7

13.0

16.2

17.8

18.4

18.0

19.6

3.0

7.4

3.0

7.4

3.0

7.4

3.0

7.8

3.0

7.8

3.0

9.7

3.0

10.4

11.7

13.0

14.5

3.0

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Rev :01.06.2018

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HL60-005~500 Series

HL60-160

HL60-185

HL60-200

HL60-250

HL60-300

HL60-375

HL60-500

16.3

17.8

21.3

28.5

21.3

22.9

26.4

33.5

3.0

5.1

20 AWG/Φ0.8

5.1

10.2

Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm.

Thermal Derating Chart-IH（A）

Maximum ambient operating temperature（℃）

Model

-40℃

-20℃

0℃

25℃

30℃

40℃

50℃

60℃

70℃

85℃

HL60 series

147%

136%

119%

100%

90%

81%

72%

63%

54%

40%

Electrical Characteristics

Vmax

V_（

Imax

A_（

P_d

Maximum Time-to-Trip

Current（A） Time（S）

Resistance（Ω）

Model

I_H(A)

I_T(A)

R_min

7.3

R_max

）

HL60-005

HL60-010

HL60-017

HL60-020

HL60-025

HL60-030

HL60-040

HL60-050

HL60-065

HL60-075

HL60-090

HL60-110

HL60-135

HL60-160

HL60-185

HL60-200

HL60-250

HL60-300

HL60-375

HL60-500

0.05

0.10

0.17

0.2

0.15

0.3

0.34

0.4

0.5

0.6

0.8

1.0

1.3

1.5

1.8

2.2

2.7

3.2

3.7

4.0

5.0

6.0

7.5

0.26

0.38

0.48

0.41

0.45

0.49

0.56

0.77

0.88

0.92

0.99

1.5

0.25

0.5

8.0

5.0

8.0

24.0

2.5

7.5

0.85

1.0

5.21

2.84

1.95

1.38

0.88

0.79

0.50

0.42

0.33

0.27

0.21

0.16

0.14

0.10

0.08

0.06

1.5

0.25

0.30

0.40

0.50

0.65

0.75

0.90

1.10

1.35

1.60

1.85

2.00

2.50

3.00

3.75

5.00

1.25

1.5

1.0

0.76

0.45

0.40

0.31

0.25

0.20

0.15

0.12

0.09

0.08

0.07

0.05

0.04

0.03

0.02

2.0

2.5

3.25

3.75

4.5

5.5

1.7

6.75

8.0

1.9

2.1

9.25

10.0

12.5

15.0

18.75

25.0

2.3

2.5

2.8

3.2

3.5

I_H=Hold current:Maximum current at which the device will not interruptin 25℃ still air.

I_T=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air.

V_max=Maximum continuousvoltage device can withstand without damage at rated current.

I_max=Maximum fault current device can withstand without damage at rated voltage.

Maximum Time-to-trip:Maximum time to trip at assigned current.

P_d=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment.

R_min=Minimum resistance of device at 25℃ prior to tripping.

R_max=Maximum resistance of device at 25℃ prior to tripping.

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Rev :01.06.2018

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HL60-005~500 Series

Marking System

Leiditech series product

Environmental Specifications

Test

Conditions

Resistance change

±8% typical

±12% typical

No change

Passive Aging

+85℃，1000hours

Humidity Aging

Thermal Shock

+85℃，85%R.H.1000hours

+125℃ to -55℃，10 Times

MIL-STD-202，Method 215F

MIL-STD-202，Method 201

SolventResistance

Vibration

No change

Solderingmethod

Wave Soldering

Soldering Temperature:245℃~260℃

Soldering Time:≤5sec

Soldering Position: Resettable fuse lead and the distance from the bottom ≥ 6mm

Manual soldering

Soldering Temperature:250℃~280℃

Soldering Time: ≤3sec

Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm

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Rev :01.06.2018

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HL60-005~500 Series

Storage

The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the

deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with

high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the

components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened

prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful

substancesare present.

Warning:

• Please read this specification before usingthe product.

• Use PPTC beyond the maximum ratings or improper use may result in device damage,electrical arcing and flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when

repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,

thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

•

Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance

of the devices.PPTC can be cleaned by standard methods.

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

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Rev :01.06.2018

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