LDT4032-621H [LEIDITECH]
SMD Disc Varisttors;
| 型号： | LDT4032-621H |
| 厂家： | 
Leiditech |
| 描述： | SMD Disc Varisttors |
| 文件： | 总7页 (文件大小：524K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LDT4032 Series
SMD Disc Varisttors
FEATURES
Improved component design in a compact case
High surge current capability of up to 3.5 kA
Superior performance at high temperature
White package design without shadow in LED lighting
application
SMD mountable disk varistors, suitable for lead-free
reflow / wave soldering
APPLICATIONS
Power supplies for telecommunication systems
Protection for LED circuits
Protection for consumer, industrial equipment
Protection for automotive electronics
APPLICABLE STANDARDS
UL1449
IEC61051-1, -2, -2-2, IEC60950-1 Annex Q
GB/T10193, GB/T10194, GB4943.1, GB8898
IEC61000-4-5
TYPE CODE DESIGNATION
H
4032
-
471
LDT
High absorption
Varistor voltage V1mA: 47×101=470 V
Tolerance of varistor voltage at 1 mA: ±10%(V1mA
:
Leiditech: logo
)
4032: 40/100’’×32/100’’(10.4mm×8.2mm)
GENERALTECHNICALDATA
Parameter
Operating temperature
Storage temperature
Electric strength
Value
-55 to +125
-55 to +150
≥2.5
Unit
℃
℃
kVRMS
MΩ
Insulation resistance
≥100
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Rev 2.0 :12.01.2019
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LDT4032 Series
ELECTRICAL CHARACTERISTICS
(Ta=125℃)
Energy
Continuous Voltage
Max
Peak Current (8/20 μs)
Max
(2 ms)
Rated
Max
SMD Types
(EIA Case 40×32
in inch)
Power
(1 time)
(2 times)
(1 time)
VRMS
[V]
VDC
[V]
[A]
[A]
[J]
35
[mW]
400
2500
1500
LDT4032 - 271H
LDT4032 - 391H
LDT4032 - 431H
LDT4032 - 471H
LDT4032 - 511H
LDT4032 - 561H
LDT4032 - 621H
LDT4032 - 681H
175
250
275
300
320
350
385
420
225
320
350
385
420
460
505
560
2500
2500
2500
2500
2500
2500
2500
1500
1500
1500
1500
1500
1500
1500
400
400
400
400
400
400
400
50
55
60
67
67
67
67
(Ta=25℃)
Clamping
Capacitance
Max
Varistor Voltage
at 1 mA
Voltage at Class
Current
Class Current
(8/20 μs)
SMD Types
(EIA Case 40×32
in inch)
(8/20 μs)
(±10%)
(at 1 kHz)
[V]
[V]
455
650
710
775
845
930
1120
[A]
25
25
25
25
25
25
25
[pF]
350
300
270
230
210
200
170
LDT4032 - 271H
LDT4032 - 391H
LDT4032 - 431H
LDT4032 - 471H
LDT4032 - 511H
LDT4032 - 561H
LDT4032 - 681H
270
390
430
470
510
560
680
2/7
Rev 2.0 :12.01.2019
www.leiditech.com
LDT4032 Series
SOLDERING GUIDELINES
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
The components are suitable for reflow soldering per JEDEC J-STD-020C.
- Wave soldering
10s
300
℃
Normal curve
Limit curve
250
235
℃
~260
1st wave
approx. 200K/s
100 ~130
℃
2nd wave
5K/s
200
150
100
50
2K/s
℃
℃
Forced
cooling
2K/s
0
0
50
100
150
200
s
250
Time
Temperature characteristics at component terminal with dual-wave soldering
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Rev 2.0 :12.01.2019
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LDT4032 Series
- Reflow soldering
tp
T
P
L
Critical Zone
to T
Ramp-up
T
L
P
T
tL
T
S(max)
Ramp-down
T
S(min)
t
s
Preheat
25
time to peak temperatue
(t 25 ℃ to peak)
Time
Profile feature
Sn-Pb assembly
3℃/sec. Max
+100℃
Pb-Free assembly
3℃/sec. Max
+150℃
Average ramp-up rate (TSmax to Tp)
-Temperature min. (Ts(min)
-Temperature max.(Ts(max)
-Time (tSmin to tSmax
Ts(max) to TL - Ramp-up Rate
)
Preheat
)
+150℃
+200℃
)
60-120 secs.
3℃/sec. Max
+183℃
60-180 secs.
3℃/sec. Max
+217℃
-Temperature min. (TL)
-Time (tL)
Time maintained
above
60-150 secs.
+220℃ to +240℃
60-150 secs.
+240℃ to +260℃
20 secs. to 40 secs.
6℃/sec. max.
8 min. max.
Peak classification temperature (Tp)
Time within 5℃of actual peak temperature (tp) 10 secs. to 30 secs.
Ramp-down rate
6℃/sec. max.
Time 25℃ to peak temperature
6 min. max.
Notes: All temperature refer to topside of the package, measured on the package body surface
Maximum number of reflow cycles: 3
STORAGE CONDITION
- As far as possible, the components should be employed within 24 months after delivery
from Kangtai Semiconductor.
- They should be left in their original packing to avoid soldering problems due to oxidized
contacts.
- Storage temperature: − 25 up to + 45°C.
- Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year.
4/7
Rev 2.0 :12.01.2019
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LDT4032 Series
DIMENSIONAL DRAWINGS
Dimensions
Inches
Ref.
Millimeters
Typ.
10.4
8.0
Typ.
Min.
10.1
7.7
Max. Min.
Max.
l
10.7 0.398 0.409 0.421
8.3 0.303 0.315 0.327
d
B
h
d
e
4.5
4.2
4.8 0.165
1.8 0.047
0.3
0.189
0.071
0.012
0.177
0.059
1.2
1.5
RECOMMENDED SOLDER PAD LAYOUT
Dimensions
D
Inches
Ref.
Millimeters
C
Typ.
Typ.
0.138
0.110
Min.
Max. Min.
Max.
3.5
2.8
A
B
C
D
6.5
0.265
0.476
B
12.1
TEMPERATUREDERATINGCURVE
Max. current, energy, operating voltage and average power
dissipation depending on ambient temperature
110
100
90
80
70
60
50
40
30
20
10
0
-60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ambient temperature [℃]
5/7
Rev 2.0 :12.01.2019
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LDT4032 Series
TAPING AND PACKAGING SPECIFICATION ACCORDING TO IEC 60286-3
P
0
T
P
D
2
0
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Tape end (trailer)
40 min.
empty cavities
Leader
25 min.
300 mm
empty cavities
cover tape
6/7
Rev 2.0 :12.01.2019
www.leiditech.com
LDT4032 Series
- Dimensions of packing
Dimension
Definition
Symbol
Millimeters
Typ.
inches
Typ.
Min.
8.2
10.6
-
Max.
8.6
11.0
-
Min.
0.323
0.417
-
Max.
0.339
0.433
-
A
0
Compartment width
Compartment length
Sprocket hole diameter
Sprocket hole pitch
8.4
0.331
0.425
0.059
0.157
B
0
10.8
1.5
D
0
P
0
3.9
4.0
4.1
0.154
0.161
Distance center hole to center
compartment
P
2
1.95
11.9
2.00
12.0
2.05
12.1
0.077
0.469
0.079
0.472
0.081
0.476
Pitch of the component
compartments
P
1
Tape width
W
E
15.7
1.65
16.0
1.75
16.3
1.85
0.618
0.065
0.630
0.069
0.642
0.073
Distance edge to center of hole
Distance center hole to center
compartment
F
7.45
7.50
7.55
0.293
0.295
0.297
Distance compartment to edge
Overall thickness
G
0.75
-
-
0.295
-
-
T
2
-
-
-
5.5
0.3
-
-
-
0.217
0.012
-
Thickness tape
T
A
-
-
-
Reel diameter
328
330
16.4
-
12.91
12.99
0.646
-
W
1
Reel width (inside)
Reel width (outside)
-
-
17.9
22.4
-
-
0.705
0.882
W
2
1) Quantity of taping packing(pcs): 1000
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
7/7
Rev 2.0 :12.01.2019
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