LM1265HP101MGD [LEIDITECH]

Carbonyl Powder;


型号：	LM1265HP101MGD
厂家：	Leiditech
描述：	Carbonyl Powder
文件：	总6页 (文件大小：1042K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM1265H-Series(G)-D

1. Features

1. Carbonyl Powder.

2. Compact design.

Halogen

3. High current，low DCR，high efficiency.

4. Very low acoustic noise and very low leakage flux noise.

5. High reliability.

Pb-free

Halogen-free

6. 100% Lead(Pb)-Free and RoHS compliant.

7. AEC-Q200 Grade 1 qualified (–40℃ to +125℃ ambient)

2. Applications

Note PC power system，incl. IMVP-6

DC/DC converter .

3. Dimensions

330

1150

leadframe

Recommend PC Board Pattern

1R5

1150

non-leadframe

Series

LM1265HP

Type

A(mm)

A'(mm)

B(mm)

C(mm)

D(mm)

E(mm)

4.7±0.3

L(mm) G(mm) H(mm)

14.2

8.0

5.0

leadframe

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness

at 0.15mm and above.

13.5±0.5 12.5±0.3 12.5±0.3 6.2±0.3

2.3±0.3

non-leadframe

4. Part Numbering

1265

330

A: Series

B: Dimension

C: Type

BxC

HP:H:Carbonyl Powder,P:PAD broaden.

D: Inductance

E: Inductance Tolerance

330=33uH

M=±20%.

F: 印 D/C

印字:黑色.330 及 D/C 1150 (11 年,50 週期)(依實際生產日期而定)

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LM1265H-Series(G)-D

5. Specification

Inductance

L0 (uH)±20%

@ 0 A

DCR

(mΩ) Typ.

@25℃

DCR

(mΩ) Max.

@25℃

I rms (A)

Typ.

I sat (A)

Typ.

Part Number

Type

non-leadframe

leadframe

LM1265HP-R15MG-D

LM1265HP-R22MG-D

LM1265HP-R30MG-D

LM1265HP-R33MG-D

LM1265HP-R36MG-D

LM1265HP-R40MG-D

LM1265HP-R47MG-D

LM1265HP-R50MG-D

LM1265HP-R56MG-D

LM1265HP-R68MG-D

LM1265HP-R82MG-D

LM1265HP-1R0MG-D

LM1265HP-1R2MG-D

LM1265HP-1R5MG-D

LM1265HP-1R8MG-D

LM1265HP-2R2MG-D

LM1265HP-2R7MG-D

LM1265HP-3R3MG-D

LM1265HP-4R7MG-D

LM1265HP-5R6MG-D

LM1265HP-6R8MG-D

LM1265HP-8R2MG-D

LM1265HP-100MG-D

LM1265HP-130MG-D

LM1265HP-150MG-D

LM1265HP-220MG-D

LM1265HP-330MG-D

LM1265HP-470MG-D

LM1265HP-680MG-D

LM1265HP-101MG-D

0.15

0.22

0.30

0.33

0.36

0.40

0.47

0.50

0.56

0.68

0.82

1.00

1.20

1.50

1.80

2.20

2.70

3.30

4.70

5.60

6.80

8.20

10.0

13.0

15.0

22.0

33.0

47.0

68.0

100

13.5

12.5

11.5

10.5

10.0

118

112

15.5

0.49

0.47

0.6

0.60

0.72

0.8

0.9

1.0

1.2

1.25

1.2

1.5

1.9

2.3

2.4

3.0

4.0

4.2

5.5

6.8

8.4

0.65

0.7

0.9

0.92

1.05

1.25

1.5

1.7

1.9

2.5

3.6

leadframe

3.8

leadframe

4.3

leadframe

5.7

leadframe

7.0

leadframe

8.5

leadframe

9.5

11.5

15.5

16.5

leadframe

13.2

leadframe

23.2

32.5

leadframe

6.5

4.8

4.2

9.5

7.8

5.5

leadframe

110

145

130

165

leadframe

Note:

1. Test frequency : Ls : 100KHz /1.0V.

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40℃

5. Saturation Current (Isat) will cause L0 to drop approximately 20%.

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

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LM1265H-Series(G)-D

6. Material List

Items

Materials

Items

Materials

Core Carbonyl Powder.

Wire Polyester Wire or equivalent.

Solder 100% Pb free solder

Clip 100% Pb free solder(Ni+Sn---Plating)

Ink

Halogen-free ketone

Ink

Halogen-free ketone

paint Epoxy resin

7. Reliability and Test Condition

Item

Performance

Test Condition

Operating temperature

-40~+125℃ (Including self - temperature rise)

1. -10~+40℃,50~60%RH (Product with taping)

2. -40~+125℃(on board)

Storage temperature

Electrical Performance Test

HP4284A,CH11025,CH3302,CH1320,CH1320S

LCR Meter.

Inductance

Refer to standard electrical characteristics list.

DCR

CH16502,Agilent33420A Micro-Ohm Meter.

Saturation DC Current (Isat) will cause L0

to drop △ L(%)

Saturation Current (Isat)

Approximately △ L20%.

Approximately △ T40℃

Heat Rated Current (Irms) will cause the coil temperature rise

△ T(℃) without core loss.

1.Applied the allowed DC current

Heat Rated Current (Irms)

2.Temperature measured by digital surface thermometer

Reliability Test

Preconditioning:

Run

through

reflow

for

times.( IPC/JEDEC

J-STD-020DClassification Reflow Profiles)

Temperature： 125±2 ℃(Inductor)

Life Test

Applied current：rated current

Duration：1000±12hrs

Measured at room temperature after placing for 24±2 hrs

Preconditioning:

Run

through

reflow

for

times.( IPC/JEDEC

J-STD-020DClassification Reflow Profiles

Load Humidity

Humidity：85±2﹪ R.H,

Temperature：85℃±2 ℃

Duration：1000hrs Min. with 100% rated current

Measured at room temperature after placing for 24±2 hrs

Preconditioning: Run through IR reflow for

times.( IPC/JEDEC J-STD-020DClassification Reflow

Profiles

1. Baked at50℃ for 25hrs, measured at room temperature

after placing for 4 hrs.

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and

keep 3 hours, cool down to 25℃ in 2.5hrs.

Moisture Resistance

RDC：within ±15% of initial value and shall not

exceed the specification value

3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and

keep 3 hours, cool down to 25℃ in

2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs

4. Keep at 25℃ 80-100%RH for 15min and vibrate at the

frequency of 10 to 55 Hz to 10 Hz, measure at

room temperature after placing for 1~2 hrs.

Preconditioning:

Run

through

reflow

for

times.( IPC/JEDEC J-STD-020DClassification

Reflow Profiles

Condition for 1 cycle

Thermal

shock

Step1：-40±2℃ 30±5min

Step2：25±2℃ ≦ 0.5min

Step3：125±2℃ 30±5min

Number of cycles： 500

Measured at room temperature after placing for 24±2 hrs

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LM1265H-Series(G)-D

Oscillation Frequency: 10～2K～10Hz for 20 minutes

Equipment： Vibration checker

Total Amplitude:1.52mm±10%

Vibration

Testing Time : 12 hours(20 minutes, 12 cycles each of 3

orientations)。

Item

Performance

Test Condition

Peak

value

(g’s)

Normal

duration (D)

(ms)

Velocity

change

(Vi)ft/sec

Wave

form

Type

Shock

Appearance：No damage.

SMD

Lead

Half-sine

11.3

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

Shall be mounted on a FR4 substrate of the

following dimensions: >=0805:40x100x1.2mm

<0805:40x100x0.8mm

Bending depth: >=0805:1.2mm

<0805:0.8mm

exceed the specification value

Bending

duration of 10 sec.

Preheat: 150℃,60sec.。

Solder: Sn96.5% Ag3% Cu0.5%

More than 95% of the terminal electrode should

Temperature: 245±5℃。

be covered with solder。

Solderability

Flux for lead free: Rosin. 9.5%。

Dip time: 4±1sec。

Depth: completely cover the termination

Number of heat cycles: 1

Temperature

Resistance

to Soldering

Heat

Time(s)

10 ±1

ramp/immersion

(°C)

and emersion rate

260 ±5(solder

temp)

25mm/s ±6 mm/s

Preconditioning:

Run

through

reflow

for

times.( IPC/JEDEC J-STD-020DClassification

Reflow Profiles

With the component mounted on a PCB with the device to

be tested, apply a force

(>0805:1kg , <=0805:0.5kg)to the side of a device being

tested. This force shall be

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

applied for 60 +1 seconds. Also the force shall be applied

gradually as not to apply a

exceed the specification value

shock to the component being tested.

Terminal

Strength

Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours

of recovery under the standard condition.

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LM1265H-Series(G)-D

8. Soldering and Mounting

(1) Soldering

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for

re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air

soldering tools.

(2) Solder re-flow:

Recommended temperature profiles for re-flow soldering in Figure 1.

(3) Soldering Iron:

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that

a soldering iron must be employed the following precautions are recommended.

‧

Preheat circuit and products to 150℃

‧

Never contact the ceramic with the iron tip

‧

Use a 20 watt soldering iron with tip diameter of 1.0mm

‧

355℃ tip temperature (max)

‧

1.0mm tip diameter (max)

‧

Limit soldering time to 4~5sec.

Reflow Soldering

Iron Soldering

PRE-HEATING

SOLDERING

NATURAL

COOLING

PRE-HEATING

SOLDERING

NATURAL

COOLING

within 4~5s

TP(260℃ / 10s max.)

350

150

217

60~150s

200

150

60~180s

480s max.

Gradual cooling

Over 60s

TIME(sec.)

TIME( sec.)

Iron Soldering times: 1 times max.

Fig.2

Reflow times: 3 times max.

Fig.1

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LM1265H-Series(G)-D

9. Packaging Information

(1) Reel Dimension

COVER TAPE

2.0∮0.5

Type

A(mm) B(mm) C(mm) D(mm)

13”x24mm

24.4+2/-0

13+0.5/-0.2

330

100±2

EMBOSSED CARRIER

(2) Tape Dimension

Series Size Bo(mm) Bz(mm) Ao(mm) Az(mm) Ko(mm) P(mm) W(mm) F(mm)

t(mm)

1265

14.1±0.1

13.0±0.1

12.9±0.1

7.0±0.1

16.0±0.1

24±0.3

11.5±0.1

0.35±0.05

(3) Packaging Quantity

1265

Chip / Reel

Inner box

Carton

500

1000

4000

(4) Tearing Off Force

The force for tearing off cover tape is 10 to 130 grams in the arrow

direction under the following conditions(referenced

ANSI/EIA-481-C-2003 of 4.11 stadnard).

Top cover tape

Room Temp.

Room Humidity

(%)

Room atm

(hPa)

Tearing Speed

mm/min

(℃)

Base tape

5~35

45~85

860~1060

300

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

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LM1265HP101MGD [LEIDITECH]

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