LM160808T-221T-N [LEIDITECH]

This specification applies to MULTILAYER FERRITE CHIP BEADS;


型号：	LM160808T-221T-N
厂家：	Leiditech
描述：	This specification applies to MULTILAYER FERRITE CHIP BEADS
文件：	总9页 (文件大小：1222K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM160808T Series

This specification applies to MULTILAYER FERRITE CHIP BEADS

1 Scope:

Part Numbering: Product Identification

Rating:

Operating Temperature:

(Including self - temperature rise)

Storage Temperature: －５５℃～１２５℃(after PCB)

,Humidity

(before PCB)

Marking:

Standard Testing Condition

Unless otherwise specified

Temperature Ordinary Temperature(15 to 35 )

In case of doubt

20±2

Humidity

Ordinary Humidity(25 to 85% RH)

60 to 70 % RH

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LM160808T Series

Configuration and Dimensions:

ELECTRICAL CHARACTERISTICS：

Rated

Current

(mA)Max.

Impedance

Test Freq.

RDC

Part No.

(Ω)

(Ω)Max.

LM160808T-100 □-N

LM160808T-300 □-N

LM160808T-600 □-N

LM160808T-700 □-N

LM160808T-101 □-N

LM160808T-121 □-N

LM160808T-181 □-N

LM160808T-221 □-N

100 MHz,200 mV

0.01

0.015

0.02

0.03

0.05

0.04

5000

4500

4000

3000

2000

2500

100

120

180

220

NOTE: □-tolerance Y= 25% / T= 30%

1.Operating temperature range

(Including self - temperature rise)

2.Rate Current : Applied the current to coils, the temperature rise shall not be more than 30

3.As for PB/UPB type. Rated Current is derated as left figure depending on the operating temprature.

"-N" FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER)

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LM160808T Series

8.1 Construction:

8.2 Material List:

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Reliability Of Ferrite Multilayer Chip Bead

1-1.Mechanical Performance

No Item

1-1-1 Flexure Strength

Test Method

Test device shall be soldered on the substrate

Specification

The forces applied on the right

conditions must not damage Substrate Dimension: 100x40x1.6mm

the terminal electrode and the Deflection: 2.0mm

ferrite

Keeping Time: 30sec

*For 100505, substrate dimension is 100x40x0.8mm

Test device shall be soldered on the substrate

Oscillation Frequency: 10 to 55 to 10Hz for 1min

Amplitude: 1.5mm

1-1-2 Vibration

Time: 2hrs for each axis (X, Y & Z), total 6hrs

Pre-heating: 150 , 1min

1-1-3 Resistance to Soldering Heat Appearance: No damage

More than 75% of the terminal Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)

electrode should be covered

with solder.

Solder Temperature: 260 5

Immersion Time: 10 1sec

Impedance : within 30% of

initial value

1-1-4 Solder ability

The electrodes shall be at

Pre-heating: 150 , 1min

least 95% covered with new Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)

solder coating

Solder Temperature: 245 5 (Pb-Free)

Immersion Time: 4 1sec

1-1-5 Terminal Strength Test

No split termination

Chip

Test device shall be soldered on the substrate,

then apply a force in the direction of the arrow.

Force : 5N

Keeping Time: 10 1sec

Mounting Pad

1-2.Environmental Performance

Test Method

No Item

1-2-1 Temperature Cycle

Specification

Appearance: No damage

Impedance: within 30% of

initial value

One cycle:

Step

Time (min)

Temperature (

-55 3

)

25 2

125 3

25 2

Total: 100cycles

Measured after exposure in the room condition for 24hrs

Temperature: 40 2

1-2-2 Humidity Resistance

Relative Humidity: 90 ~ 95% / Time: 1000hrs

Measured after exposure in the room condition for 24hrs

Temperature: 125 3 / Relative Humidity: 0%

Applied Current: Rated Current /Time: 1000hrs

Measured after exposure in the room condition for 24hrs

Temperature: -55 3

1-2-3 High

Temperature Resistance

1-2-4 Low

Temperature Resistance

Relative Humidity: 0% / Time: 1000hrs

Measured after exposure in the room condition for 24hrs

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LM160808T Series

TEST DATA FOR PREPRODUCTION SAMPLES

QF-1419

DESCRIPTION: LM160808T-221Y-N

MEAS.

Item

RDC

(Ω)

m/m

Spec Customer

Suggest

220 25%

0.04+0

1.6 0.15

0.8 0.15

0.3 0.2

200mV

Test Freq.

100MHz

180

185

181

185

190

185

183

190

186

0.034

0.035

0.033

0.036

0.034

0.035

1.58

1.57

1.59

1.58

1.56

1.58

1.57

1.58

1.59

0.76

0.78

0.79

0.78

0.77

0.76

0.78

0.76

0.71

0.72

0.76

0.73

0.75

0.73

0.72

0.33

0.34

0.32

0.33

0.34

0.33

0.3

0.33

0.31

184.6

0.0344

0.003

1.578

0.03

0.773

0.03

0.729

0.05

0.327

0.04

CUSTOMER

SAMPLE

TEST INSTRUMENT:

HP4291A RF IMPEDANCE / MATERIAL ANALYZER FOR Z

CHEN HWA 502BC / HP4338B FOR RDC

APPEARANCE AND DIMENSIONS :

SPEC : MEET ITEM 6.

TEST METHOD : VISUAL INSPECTION AND MEASURED WITH SILDE CALIPERS.

TESTING CONDITIONS :

Unless otherwise specified

ln case of doubt

20 2 ℃

60 to 70 %RH

Temperature

Humidity

Ordinary Temperature (15 to 35℃)

Ordinary Humidity (25 to 85 %RH)

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PACKAGING

11.1 Packaging -Cover tape

The force for tearing off cover tape is 10 to 100 grams in the arrow direction.

11.2 Packaging Quantity

11.3 Reel Dimensions

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LM160808T Series

PACKAGING

11.4 Tape Dimensions in mm

Recommended Pattern

Note:

1. Please make sure that your product is has been evaluated and confirmed against your specifications

when our product is mounted to your product.

2. Do not knock nor drop.

3. All the items and parameters in this product specification have been prescribed on the premise that

our product is used for the purpose,under the condition and in the environment agreed upon between

you and us. You are requested not to use our product deviating from such agreement.

4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950)

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LM160808T Series

Curve:

LM160808T-221Y-N

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

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