LMKAK10 [LEIDITECH]

Ideal for automated placement;


型号：	LMKAK10
厂家：	Leiditech
描述：	Ideal for automated placement
文件：	总4页 (文件大小：526K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LMKAK10 SERIES

Features

● Ideal for automated placement

● High surge current capability

● Meets MSL level 1, per J-STD-020, LF maximum

peak of 260 °C

● Bi-directional TVS

● Glass passivated junction

● Low clamping voltage under surge

Typical Applications

● High power DC bus protection

SMTO-218

Mechanical Data

●

ackage: SMT -218

Molding compound meets UL 94 V-0 flammability

rating, RoHS-compliant

● Terminals: Tin plated leads, solderable per

J-STD-002 and JESD22-B102

Symbol

Maximum Ratings & Thermal Characteristics :

(T_A= 25 °C unless otherwise noted)

Items

Symbol

I_PPM

Value

10000

Unit

Peak pulse current (tp= 8/20µs)

Storage temperature

Tstg

-55 ~+150

°C

Junction temperature

-55 ~+125

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Rev :01.06.2019

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LMKAK10 SERIES

ELECTRICAL CHARACTERISTICS^(T_A^=25℃)

①

I_PP

V_C@V_PP

Part Number

V_R

I_R@V_R

V_BR@I_T

I_T

Bi-Polar

μA

min(V)

max(V)

mA max(V)

110

LMKAK1058CA

LMKAK1066CA

LMKAK1076CA

LMKAK1086CA

10000

120

135

157

107

① Surge waveform: 1.2/50μs &8/20μs

V_R: Stand-off voltage -- Maximum voltage that can be applied

V_BR: Breakdown voltage

V_C: Clamping voltage -- Peak voltage measured across the suppressor at a specified V_PP

I_R: Reverse leakage current

RATINGS AND V‐I CHARACTERISTICS CURVES ^(T_A^=25℃,^{unless otherwise noted)}

FIG.2 Pulse Derating Curve

FIG.1 V-I curve characteristics

I^PP

I^T

_VCV^BRV^R

I^R

I^T

_{VR VBR}V^C

I^PP

Fig.3 Current 8/20us Waveform per IEC 6100-4-5

FIG.4: Typical VBR vs. junction temperature

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Rev :01.06.2019

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LMKAK10 SERIES

SOLDERING PARAMETERS

Pb-Free assembly

(see FIG.3)

Reflow Condition

-Temperature Min (T_s(min)

)

+150℃

FIG.3: Reflow condition

Pre

-Temperature Max(T_s(max)

-Time (Min to Max) (ts)

)

+200℃

Heat

Critical Zone

TL to TP

Ramp-up

60-180 secs.

t_L

Average ramp up rate (Liquidus Temp

(T_L)to peak)

TS(max)

3℃/sec. Max

Ramp-down

Preheat

_s(max)to T_L- Ramp-up Rate

3℃/sec. Max

+217℃

TS(min)

-Temperature(T_L)(Liquidus)

-Temperature(t_L)

time to peak temperatue

Reflow

Time

(t 25℃ to peak)

60-150 secs.

+260(+0/-5)℃

Peak Temp (T_p)

Time within 5℃of actual Peak Temp (t_p) 20-40secs

Ramp-down Rate

6℃/sec. Max

8 min. Max

+260℃

Time 25℃to Peak Temp (T_P)

Do not exceed

3/4

Rev :01.06.2019

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LMKAK10 SERIES

PACKAGE MECHANICAL DATA

■ Outline Dimensions

SMTO-218

SME

■ Suggested pad layout

Dim

Min

13.16

10.55

2.50

5.15

1.20

13.45

15.50

6.94

18.1

1.9

Max

13.76

11.05

2.90

5.65

1.40

14.60

16.05

7.24

18.5

2.1

Dim

Millimeters

18.31

10.80

13.72

2.54

2.70

5.33

2.15

0.4

0.6

1.4

1.6

0.33

0.35

0.43

0.45

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

4/4

Rev :01.06.2019

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