LMY100505T-471Y-N [LEIDITECH]

This specification applies to MULTILAYER FERRITE CHIP BEADS;
LMY100505T-471Y-N
型号: LMY100505T-471Y-N
厂家: Leiditech    Leiditech
描述:

This specification applies to MULTILAYER FERRITE CHIP BEADS

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中文:  中文翻译
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LMY Series  
This specification applies to MULTILAYER FERRITE CHIP BEADS  
1 Scope:  
Part Numbering: Product Identification  
2
LM  
Rating:  
3
4
Operating Temperature:  
(Including self - temperature rise)  
Storage Temperature: -55℃~125℃(after PCB)  
,Humidity  
(before PCB)  
Marking:  
Standard Testing Condition  
5
Unless otherwise specified  
Temperature Ordinary Temperature(15 to 35 )  
In case of doubt  
20±2  
Humidity  
Ordinary Humidity(25 to 85% RH)  
60 to 70 % RH  
1/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
Configuration and Dimensions:  
6
7
ELECTRICAL CHARACTERISTICS:  
Rated  
Current  
(mA)Max.  
Impedance  
Impedance  
Test Freq.  
(MHZ)  
RDC  
Part No.  
() 25%  
() 40%  
()Max.  
LMY100505T-221Y-N  
LMY100505T-301Y-N  
LMY100505T-471Y-N  
LMY100505T-601Y-N  
LMY100505T-102Y-N  
220  
300  
270  
450  
100/1000  
100/1000  
100/1000  
100/1000  
100/1000  
0.55  
0.55  
0.6  
450  
350  
300  
300  
250  
470  
650  
600  
1000  
1400  
0.7  
1000  
1.1  
NOTE: tolerance Y= 25%  
1.Operating temperature range  
(Including self - temperature rise)  
2.Rate Current : Applied the current to coils, the temperature rise shall not be more than 30  
3.Impedance Test OSC @200mV  
"-N" FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER)  
2/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
HFY100505T Series  
8.1 Construction:  
8
8.2 Material List:  
3/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
9
Reliability Of Ferrite Multilayer Chip Bead  
1-1.Mechanical Performance  
No Item  
1-1-1 Flexure Strength  
Test Method  
Test device shall be soldered on the substrate  
Specification  
The forces applied on the right  
conditions must not damage Substrate Dimension: 100x40x1.6mm  
the terminal electrode and the Deflection: 2.0mm  
ferrite  
Keeping Time: 30sec  
*For 100505, substrate dimension is 100x40x0.8mm  
Test device shall be soldered on the substrate  
Oscillation Frequency: 10 to 55 to 10Hz for 1min  
Amplitude: 1.5mm  
1-1-2 Vibration  
Time: 2hrs for each axis (X, Y & Z), total 6hrs  
Pre-heating: 150 , 1min  
1-1-3 Resistance to Soldering Heat Appearance: No damage  
More than 75% of the terminal Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)  
electrode should be covered  
with solder.  
Solder Temperature: 260 5  
Immersion Time: 10 1sec  
Impedance : within 30% of  
initial value  
1-1-4 Solder ability  
The electrodes shall be at  
Pre-heating: 150 , 1min  
least 95% covered with new Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)  
solder coating  
Solder Temperature: 245 5 (Pb-Free)  
Immersion Time: 4 1sec  
1-1-5 Terminal Strength Test  
No split termination  
Chip  
Test device shall be soldered on the substrate,  
then apply a force in the direction of the arrow.  
Force : 5N  
F
Keeping Time: 10 1sec  
Mounting Pad  
1-2.Environmental Performance  
Test Method  
No Item  
1-2-1 Temperature Cycle  
Specification  
Appearance: No damage  
Impedance: within 30% of  
initial value  
One cycle:  
Step  
Time (min)  
Temperature (  
-55 3  
)
1
30  
3
2
25 2  
3
125 3  
30  
3
4
25 2  
Total: 100cycles  
Measured after exposure in the room condition for 24hrs  
Temperature: 40 2  
1-2-2 Humidity Resistance  
Relative Humidity: 90 ~ 95% / Time: 1000hrs  
Measured after exposure in the room condition for 24hrs  
Temperature: 125 3 / Relative Humidity: 0%  
Applied Current: Rated Current /Time: 1000hrs  
Measured after exposure in the room condition for 24hrs  
Temperature: -55 3  
1-2-3 High  
Temperature Resistance  
1-2-4 Low  
Temperature Resistance  
Relative Humidity: 0% / Time: 1000hrs  
Measured after exposure in the room condition for 24hrs  
4/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
5/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
11  
PACKAGING  
11.1 Packaging -Cover tape  
The force for tearing off cover tape is 10 to 100 grams in the arrow direction.  
11.2 Packaging Quantity  
11.3 Reel Dimensions  
6/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
11  
PACKAGING  
11.4 Tape Dimensions in mm  
12  
Recommended Pattern  
13  
Note:  
1. Please make sure that your product is has been evaluated and confirmed against your specifications  
when our product is mounted to your product.  
2. Do not knock nor drop.  
3. All the items and parameters in this product specification have been prescribed on the premise that  
our product is used for the purpose,under the condition and in the environment agreed upon between  
you and us. You are requested not to use our product deviating from such agreement.  
4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950)  
7/8  
Rev :01.06.2018  
www.leiditech.com  
LMY Series  
Curve: LMY100505T-102Y-N  
14  
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
Tel : +86- 021 50828806  
Fax : +86- 021 50477059  
8/8  
Rev :01.06.2018  
www.leiditech.com  

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