AK6-240C [LGE]

Transient Voltage Suppression Diodes; 瞬态电压抑制二极管


型号：	AK6-240C
厂家：	LGE
描述：	Transient Voltage Suppression Diodes 瞬态电压抑制二极管二极管 AK系列
文件：	总2页 (文件大小：678K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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'PMECBL^™technology for

superior clamping factor

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times less volume than

traditional discrete

solutions

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AK6 Series

Transient Voltage Suppression Diodes

Dimensions

Features

Dimensions

Inches

Millimeters

0.950

0.095

0.236

0.145

0.570 max.

0.050

0.500 max.

0.200

0.320

24.15

2.4

6.00

for reliabilty

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C - 058C/076C

3.68

14.48 max.

1.270

12.70 max.

5.08

Agency Approvals

(ꢀꢁꢀꢆꢇꢈ$ꢉꢆꢊꢋ$

(ꢀꢁꢀꢃꢊꢆ$ꢉꢃꢌꢆ$

(ꢀꢁꢀꢄꢍꢆ$

(ꢀꢁꢀꢎꢈꢆ$ꢉꢍꢎꢆ$

8.13

9.4

13.8

7.87

AGENCY

AGENCY FILE NUMBER

E128662

0.370

0.543

0.310

L1 - 380C/430C

0.150

3.81

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Maximum Ratings andThermal Characteristics

(T_A=25^OC unless otherwise noted)

Parameter

Symbol

7BMVF

Unit

0QFSBUJOHꢀ+VODUJPOꢀBOEꢀ

StorageTemperature Range

T T₄₅₍(-)55 to 150 °C

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Current Rating¹

I_PP

Note:

1. Rated I_PPmeasured with 8 x 20ꢀS pulse.

Electrical Characteristics

Max.

Reverse

Leakage

Test

Current

I_T

Max. Clamping Voltage Max. Temp

Max.

Agency

Approval

Reverse Breakdown

Voltage (V_BR) @ I_T

Standoff

Voltage

V_CL@ I_ppPeak Pulse Coefﬁcient Capacitance

Part

Numbers

Current (I_PP) (Note 1)

OF V_BR

(%/^OC)

0 Bias 10kHz

(nF)

(V_SO) Volts (I_R) @V_SO

μA

Min Volts Max Volts

(mA)

V_CLVolts

I_PPAmps

AK6 - 058C

AK6 - 076C

AK6 - 170C

AK6 - 190C

AK6 - 240C

180

200

250

110

140

260

290

340

520

625

6,000

0.1

6.5

2.8

2.5

2.0

1.4

1.0

170

190

240

220

245

285

443

490

Note: Using 8 x 20μS wave shape as deﬁned in IEC 61000-4-5.

AK6 - 380C

AK6 - 430C

380

430

401

440

http://www.luguang.cn

mail:lge@luguang.cn

AK6 Series

Transient Voltage Suppression Diodes

Soldering Parameters

t_p

Reﬂow Condition

Lead–free assembly

T_P

Ramp-up

Critical Zone

to T

-Temperature Min (T_s(min)

)

150°C

T_L

t_L

Pre Heat -Temperature Max (T_s(max)

-Time (min to max) (t_s)

)

200°C

T_s(max)

60 – 180 secs

Ramp-down

T_s(min)

Average ramp up rate (LiquidusTemp

(T_L) to peak

t_s

3°C/second max

Preheat

T_S(max)toT_L- Ramp-up Rate

3°C/second max

217°C

25˚C

t 25˚C to Peak

-Temperature (T_L) (Liquidus)

Reﬂow

Time (t)

-Time (min to max) (t_s)

60 – 150 seconds

260^+0/-5°C

PeakTemperature (T_P)

Flow/Wave Soldering (Solder Dipping)

Time within 5°C of actual peak

Temperature (t_p)

20 – 40 seconds

PeakTemperature :

DippingTime :

Soldering :

265^OC

Ramp-down Rate

6°C/second max

8 minutes Max.

280°C

10 seconds

1 time

Time 25°C to peakTemperature (T_P)

Do not exceed

Physical Speciﬁcations

Weight

Case

Contact manufacturer

Epoxy encapsulated

Silver plated leads, solderable per

MIL-STD-202 Method 208

Terminal

Ratings and Characteristic Curves (T_A=25°C unless otherwise noted)

Peak Power Derating

120

100

125

150

AMBIENT TEMPERATURE(°C)

http://www.luguang.cn

mail:lge@luguang.cn

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