BAS216 [LGE]
Switching Diodes; 开关二极管
| 型号： | BAS216 |
| 厂家： | 
LGE |
| 描述： | Switching Diodes |
| 文件： | 总3页 (文件大小：343K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAS216
Switching Diodes
FEATURES
Silicon epitaxial planar diode
SMD chip pattern, available in various dimension included 1206 & 0603
Leadfree and RoHS compliance components
MECHANICAL CHARACTERISTICS
Size: 0805
Weight: approx. 6mg
Marking: Cathode terminal
DIMENSIONS
Dimension/mm
0805
L
W
T
2.0±0.2
1.25±0.2
0.85±0.1
0.45±0.2
C
THERMAL CHARACTERISTICS
Parameter at Tamb=25oC
Symbol
Unit
Value
Junction Temperature
Thermal Resistance Junction to Ambient air
Storage Temperature range
Tj
RθJA
Tstg
oC
oC/W
oC
175
3751)
-65 to 175
1) Valid provided that electrodes are kept at ambient temperature.
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mail:lge@luguang.cn
BAS216
Switching Diodes
ELECTRICAL CHARACTERISTICS
Parameter at Tamb=25oC
Symbol
Unit
Value
Reverse Voltage
Peak Reverse Voltage
VR
VRM
IFM
V
V
mA
75
100
300
Forward Continuous Current
Average rectified current sin half wave
rectification with resistive load f>=50Hz
Surge Forward Current at t<1s and Tj=25oC
Power Dissipation
IF(AV)
mA
1501)
IFSM
Ptot
VF
IR
IR
mA
mW
V
500
4001)
1.0 MAX
25 MAX
5 MAX
Forward Voltage at IF=10mA
Leakage Current at VR=20V
nA
at VR=75V
μA
μA
pF
at VR=20V, Tj=150oC
IR
Ctot
50 MAX
4 MAX
Capacitance at VF=VR=0V
Voltage rise when switching ON, tested with
50mA pulses, tp=0.1µs, rise time <30ns,
fp=(5-100)kHz
Vfr
V
2.5 MAX
Reverse Recovery Time at IF =10mA to IR=1mA,
VR=6V, RL=100Ω
Rectification efficiency at f=100MHz, VRF=2V
trr
ns
%
4 MAX
ηr
45 MIN
1) Valid provided that electrodes are kept at ambient temperature.
Rectification Efficiency Measurement Circuit
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mail:lge@luguang.cn
BAS216
Switching Diodes
ENVIRONMENTAL CHARACTERISTICS
Hazardous Substance or Element/ppm
Product
BAS216
Pb
Cd
Hg
Cr6+
PBB
PBDE
<1000
<1000
<100
<1000
<1000
<1000
TEST CHARACTERISTICS
Test Item
Test Condition
Sn bath at 250±5oC for 2±0.5s
Requirement
Solderability
>95% area tin covered
VF,VZ & IR within spec;
no mechanical damage
Resistance to
Soldering Heat
Humidity Steady
State
Continue Forward
Operating Life
Hi-Temperature
Reverse Bias
Sn bath at 260±5oC for 10±2s
At 85oC 85%RH for 1000hrs
VF,VZ & IR within spec
VF,VZ & IR within spec
VF,VZ & IR within spec
VF,VZ & IR within spec
At 25oC IF =Io±10% for 1000hrs
At 150oC VR =0.8VR rated for
1000hrs
-55 ±5oC/5min to 150±5oC/5min
for 10cycles
Thermal Shock
VF,VZ & IR within spec;
no mechanical damage
Bending Strength
Bending up to 2mm for 1cycle
PACKING METHOD
Product
BAS216
Quality/Reel
5,000pcs
Reel Size
7”
Tape
Paper
APPLICATIONS
Function: Fast Switching
Soldering Condition:
Sn-Pb
Leadfree
Soldering
<3oC/s
Wave
Recommended Profile Condition
Ramp-up rate (from pre-heat stage)
Pre-heat Temperature & Time
Soldering
Soldering
△T<150oC
100-150 oC
60-120s
260±5oC
5±2oC
<3oC/s
100-150 oC
60-120s
183 oC
150-200 oC
60-180s
217 oC
Soldering Temperature & Time
60-150s
230±5oC
10-30s
60-150s
245±5oC
20-40s
Peak Temperature
260±5oC
-
Time within 5oC of peak temperature
Ramp-down rate
<6oC/s
<6oC/s
<6oC/s
-
Time 25oC to peak temperature
<6min
<8min
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
Storage Condition: Product termination solderability can degrade due to high temperature and
humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC
and ambient humidity of <80%RH, and free from chemical.
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mail:lge@luguang.cn
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