LTCV107MS2 [LGE]
ceramic filter; 陶瓷滤波器型号: | LTCV107MS2 |
厂家: | LGE |
描述: | ceramic filter |
文件: | 总8页 (文件大小:194K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
http://www.luguang.cn Email: lge@luguang.cn
1. SCOPE
This specification shall cover the characteristics of the ceramic
fliter with the type LTCV10.7MS2. The LTCA10.7MS2 filters are small,
high performance and very thin (1.5mm) chip devices consisting of 2
ceramic elements for communication equipment. They are designed on
MgTiO3 ceramic cap package.
2. PART NO.:
PART NUMBER CUSTOMER PART NO SPECIFICATION NO
LTCV10.7MS2
3. OUTLINE DRAWING AND DIMENSIONS:
Appearance: No visible damage and dirt.
Dimensions: According to Figure 1.
Figure 1.
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4. STRUCTURE
Output/Input
Electrode
Cermic
Cover
Oscillation
Electrode
glue
Cermic
Substrate
5. ELECTRICAL SPECIFICATIONS:
No.
Items
Requirements
Center Frequency(fo)(MHz)
A:10.700±0.030
B:10.670±0.030
D:10.640±0.030
The center point of 3dB band width is C:10.730±0.030
defined as the center frequency and E:10.760±0.030
identified by the letters:A,B,C,D or E.
5.2 3dB Bandwidth(kHz)
230±50
5.3 20dB Bandwidth(kHz) max
5.4 Insertion Loss (dB)
5.5 Ripple (dB) max
5.6 Spurious Response (dB) min
5.7 Input/Output Impedance(Ω)
5.8 Withstanding Voltage
5.9 Insulation Resistance (MΩ) min
5.10 Operating temperature range(℃)
5.11 Storage temperature range(℃)
510
3.5±2.0 (at minimum loss point)
1.0 (within 3dB Bandwidth)
35 (9MHz-12MHz)
330
50V DC 1 min
100 (DC 10V)
-25~+85
-40~+85
6. MEASUREMENT:
Measurement Conditions: Parts shall be measured under a condition
( Temp. :20±15℃,Humidity :65±20% R.H.) unless the standard
condition(Temp.:25±3℃,Humidity :65±5% R.H.) is regulated to
measure.
Test Circuit:
Rg
R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω ①:Input
C2=10 Pf (Including stray capacitance ②:Ground
R2
C2
S.S.G.
RF
Voltmeter
and capacitance of RF Voltmeter)
S.S.G:Output Voltmeter
③:Output
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7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
Performance
Requirment
NO.
Item
Condition of Test
7.1 Low Temp
Storage
Stored in -40±3℃ for 96 hours,and left at room Meet Table 1
temp. for 1 hour before measurement.
7.2 High Temp
Storage
Stored in 85±2℃ for 96 hours,and left at room Meet Table 1
temp. for 1 hour before measurement.
7.3 Humidity
Stored at 40±2℃,in 90~95%R.H. for 96 hours, Meet Table 1
and left at room temp. for 1 hour before
measurement.。
7.4 Thermal
Shock
After temp. cycling of -40℃(30 minutes) to +85℃ Meet Table 1
(30 minutes) was performed 5 times, filter shall be
measured after being placed in natural condition
for 1 hour .
7.5 Soldering
Test
Passed through the reflow oven under the
following condition for 2 times, and left at room
temp. for 24 hours before measurement.
Meet Table 1
The terminals
shall be at
least 95%
covered by
solder
7.6 Solderability Dipped in 235±5℃ solder bath for 3±0.5
seconds with rosin flux.
Temp. at the surface of
the substrate
Time
Preheat 150±5℃
60±10 sec
10±3sec
Peak
235±5℃
7.7 Drop test
Free drop to the wood plate from the height of 70
cm for 3 times.
Meet Table 1
7.8
7.9
Vibration
Apply the vibration of sweep frequency 10 to Meet Table 1
55Hz/minutes, amplitude 1.5mm, duration 2 hours
in each direction of 3 planes.
Mount on a glass-epoxy board( width=50 mm, Mechanical
thickness=1.6mm),then bend it to 1mm damage such
displacement(velocity 1mm/sec) and keep it for 5 as break shall
Board
Bending
seconds.
not occur
Press
20
Press Head
D.U.T
Support bar
5
45±2
45±2
TABLE 1
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Item
Specification
Insertion Loss Drift (dB) max
±2
3dB Bandwidth Drift (kHz) max
20dB Bandwidth Drift (kHz) max
±25
±60
Note: The limits in the above table are referenced to the initial
measurements.
8. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
Recommended land pattern
2.9±0.3
2.9±0.3
1.5±0.3
1.5±0.3
1.5±0.3
Recommended reflow soldering standard conditions
within 10 sec
220~230℃
200
150
Pre-heating
100
within
within
80-120sec.
20-40sec
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9. PACKAGE
To protect the products in storage and transportation,it is
necessary to pack them(outer and inner package).On paper pack, the
following requirements are requested.
Dimensions and Mark
At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
NO.
1
Name
Package
Quantity
Notes
1
1
2
Certificate of approval
Label
3
1
4
Tying
2
5
Adhesive tape
Belt
1.2m
2.9m
10
6
7
Inner Box
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Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is
vacuum packed for plastic bag (at 300 Torr of vacuum rate).
Quantity of package
Per plastic reel
Per inner box
Per package
4000 pieces of piezoelectric ceramic part
1 reels
10 inner boxe(s 40000 pieces of piezoelectric
ceramic part )
Inner Packing Dimensions
1.UNIT: mm
1
2
3
Label
QC Label
Inner Box
Pars shall be packaged in box with hold down tape upside. Part
No., quantity and lot No.
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Reel
2.0±0.5
?13.0 0.5
±
(Unit: mm)
120°
16.4min
22.4max.
Taping Dimensions
4.0± 0.1
2.0± 0.1
1.5
0
1.5+0.1
0
(Unit:mm)
Chip Filter
8.0± 0.1
3.5± 0.1
Tape Characteristics
Blank Pocket
10 Pitches
Blank Pocket
10 Pitches
lead tape
Loaded Pocket
......
......
End
150~200mm
Feeding direction
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Test Condition Of Peeling Strength
T o p T a p e
1 0 ° M a x
C a rrie r T a p e
10 OTHER
10.1 Caution of use
10.1.1 Do not use this product with bend. Please don’t apply excess
mechanical stress to the component and terminals at soldering.
10.1.2 The component may be damaged when an excess stress will be
applied.
10.1.3 Conformal coating of the component is acceptable, However the
resin materials ,curing temperature and other process conditions should
be evaluated to conform stable electrical characteristics are maintained.
10.2 Notice
10.2.1 This specification mentions the quality of the component as a
single unit. Please insure the component is thoroughly evaluated in your
application circuit.
10.2.2 Please return one of this specification after your signature of
acceptance.
10.2.3 When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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