LTCV107MS2 [LGE]

ceramic filter; 陶瓷滤波器
LTCV107MS2
型号: LTCV107MS2
厂家: LGE    LGE
描述:

ceramic filter
陶瓷滤波器

陶瓷滤波器
文件: 总8页 (文件大小:194K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
http://www.luguang.cn Email: lge@luguang.cn  
1. SCOPE  
This specification shall cover the characteristics of the ceramic  
fliter with the type LTCV10.7MS2. The LTCA10.7MS2 filters are small,  
high performance and very thin (1.5mm) chip devices consisting of 2  
ceramic elements for communication equipment. They are designed on  
MgTiO3 ceramic cap package.  
2. PART NO.:  
PART NUMBER CUSTOMER PART NO SPECIFICATION NO  
LTCV10.7MS2  
3. OUTLINE DRAWING AND DIMENSIONS:  
Appearance: No visible damage and dirt.  
Dimensions: According to Figure 1.  
Figure 1.  
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4. STRUCTURE  
Output/Input  
Electrode  
Cermic  
Cover  
Oscillation  
Electrode  
glue  
Cermic  
Substrate  
5. ELECTRICAL SPECIFICATIONS:  
No.  
Items  
Requirements  
Center Frequency(fo)(MHz)  
A:10.700±0.030  
B:10.670±0.030  
D:10.640±0.030  
The center point of 3dB band width is C:10.730±0.030  
defined as the center frequency and E:10.760±0.030  
identified by the letters:A,B,C,D or E.  
5.2 3dB Bandwidth(kHz)  
230±50  
5.3 20dB Bandwidth(kHz) max  
5.4 Insertion Loss (dB)  
5.5 Ripple (dB) max  
5.6 Spurious Response (dB) min  
5.7 Input/Output Impedance()  
5.8 Withstanding Voltage  
5.9 Insulation Resistance (M) min  
5.10 Operating temperature range()  
5.11 Storage temperature range()  
510  
3.5±2.0 (at minimum loss point)  
1.0 (within 3dB Bandwidth)  
35 (9MHz-12MHz)  
330  
50V DC 1 min  
100 (DC 10V)  
-25+85  
-40+85  
6. MEASUREMENT:  
Measurement Conditions: Parts shall be measured under a condition  
( Temp. 20±15,Humidity 65±20% R.H.) unless the standard  
condition(Temp.25±3,Humidity 65±5% R.H.) is regulated to  
measure.  
Test Circuit:  
Rg  
R1=280Ω±5%,R2=330±5%,Rg=50:Input  
C2=10 Pf (Including stray capacitance :Ground  
R2  
C2  
S.S.G.  
RF  
Voltmeter  
and capacitance of RF Voltmeter)  
S.S.G:Output Voltmeter  
:Output  
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7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS  
Performance  
Requirment  
NO.  
Item  
Condition of Test  
7.1 Low Temp  
Storage  
Stored in -40±3for 96 hoursand left at room Meet Table 1  
temp. for 1 hour before measurement.  
7.2 High Temp  
Storage  
Stored in 85±2for 96 hoursand left at room Meet Table 1  
temp. for 1 hour before measurement.  
7.3 Humidity  
Stored at 40±2in 9095%R.H. for 96 hours, Meet Table 1  
and left at room temp. for 1 hour before  
measurement.。  
7.4 Thermal  
Shock  
After temp. cycling of -40(30 minutes) to +85Meet Table 1  
(30 minutes) was performed 5 times, filter shall be  
measured after being placed in natural condition  
for 1 hour .  
7.5 Soldering  
Test  
Passed through the reflow oven under the  
following condition for 2 times, and left at room  
temp. for 24 hours before measurement.  
Meet Table 1  
The terminals  
shall be at  
least 95%  
covered by  
solder  
7.6 Solderability Dipped in 235±5solder bath for 3±0.5  
seconds with rosin flux.  
Temp. at the surface of  
the substrate  
Time  
Preheat 150±5℃  
60±10 sec  
10±3sec  
Peak  
235±5℃  
7.7 Drop test  
Free drop to the wood plate from the height of 70  
cm for 3 times.  
Meet Table 1  
7.8  
7.9  
Vibration  
Apply the vibration of sweep frequency 10 to Meet Table 1  
55Hz/minutes, amplitude 1.5mm, duration 2 hours  
in each direction of 3 planes.  
Mount on a glass-epoxy board( width=50 mm, Mechanical  
thickness=1.6mm),then bend it to 1mm damage such  
displacement(velocity 1mm/sec) and keep it for 5 as break shall  
Board  
Bending  
seconds.  
not occur  
Press  
20  
Press Head  
D.U.T  
Support bar  
5
45±2  
45±2  
TABLE 1  
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http://www.luguang.cn Email: lge@luguang.cn  
Item  
Specification  
Insertion Loss Drift (dB) max  
±2  
3dB Bandwidth Drift (kHz) max  
20dB Bandwidth Drift (kHz) max  
±25  
±60  
Note: The limits in the above table are referenced to the initial  
measurements.  
8. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING  
STANDARD CONDITIONS  
Recommended land pattern  
2.9±0.3  
2.9±0.3  
1.5±0.3  
1.5±0.3  
1.5±0.3  
Recommended reflow soldering standard conditions  
within 10 sec  
220~230  
200  
150  
Pre-heating  
100  
within  
within  
80-120sec.  
20-40sec  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
9. PACKAGE  
To protect the products in storage and transportationit is  
necessary to pack themouter and inner package.On paper pack, the  
following requirements are requested.  
Dimensions and Mark  
At the end of package, the warning (moisture proof, upward put)  
should be stick to it.  
Dimensions and Mark (see below)  
NO.  
1
Name  
Package  
Quantity  
Notes  
1
1
2
Certificate of approval  
Label  
3
1
4
Tying  
2
5
Adhesive tape  
Belt  
1.2m  
2.9m  
10  
6
7
Inner Box  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
Section of package  
Package is made of corrugated paper with thickness of  
0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is  
vacuum packed for plastic bag (at 300 Torr of vacuum rate).  
Quantity of package  
Per plastic reel  
Per inner box  
Per package  
4000 pieces of piezoelectric ceramic part  
1 reels  
10 inner boxes 40000 pieces of piezoelectric  
ceramic part )  
Inner Packing Dimensions  
1.UNIT: mm  
1
2
3
Label  
QC Label  
Inner Box  
Pars shall be packaged in box with hold down tape upside. Part  
No., quantity and lot No.  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
Reel  
2.0±0.5  
?13.0 0.5  
±
(Unit: mm)  
120°  
16.4min  
22.4max.  
Taping Dimensions  
4.0± 0.1  
2.0± 0.1  
1.5  
0
1.5+0.1  
0
(Unit:mm)  
Chip Filter  
8.0± 0.1  
3.5± 0.1  
Tape Characteristics  
Blank Pocket  
10 Pitches  
Blank Pocket  
10 Pitches  
lead tape  
Loaded Pocket  
......  
......  
End  
150~200mm  
Feeding direction  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
Test Condition Of Peeling Strength  
T o p T a p e  
1 0 ° M a x  
C a rrie r T a p e  
10 OTHER  
10.1 Caution of use  
10.1.1 Do not use this product with bend. Please don’t apply excess  
mechanical stress to the component and terminals at soldering.  
10.1.2 The component may be damaged when an excess stress will be  
applied.  
10.1.3 Conformal coating of the component is acceptable, However the  
resin materials ,curing temperature and other process conditions should  
be evaluated to conform stable electrical characteristics are maintained.  
10.2 Notice  
10.2.1 This specification mentions the quality of the component as a  
single unit. Please insure the component is thoroughly evaluated in your  
application circuit.  
10.2.2 Please return one of this specification after your signature of  
acceptance.  
10.2.3 When something gets doubtful with this specifications, we shall  
jointly work to get an agreement.  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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