LFD4K5-6A-XX-F2-PF [LIGITEK]
FOUR DIGIT LED DISPLAY (0.39 Inch); 四位LED显示（ 0.39英寸）
| 型号： | LFD4K5-6A-XX-F2-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | FOUR DIGIT LED DISPLAY (0.39 Inch) |
| 文件： | 总9页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
FOUR DIGIT LED DISPLAY (0.39 Inch)
Pb
Lead-Free Parts
LFD4K5/6A-XX/F2-PF
DATA SHEET
DOC. NO : QW0905-LFD4K5/6A-XX/F2-PF
REV.
: A
DATE
: 05 - Jan. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD4K5/6A-XX/F2-PF
Page 1/8
Package Dimensions
7.0(0.276")
40.18(1.582")
L1
DIG.1
DIG.2
DIG.3
DIG.4
L3
12.8
(0.504")
10.0
(0.39")
10.5±0.5
L2
DP
ψ 1.2
ψ0.51
TYP
17.5MIN
A
2.54*13=33.02
F
B
G
LFD4K5/6A-XX/F2-PF
LIGITEK
E
C
DP
D
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
2/8
PART NO.LFD4K5/6A-XX/F2-PF
Page
Internal Circuit Diagram
LFD4K5A-XX/F2-PF
LFD4K6A-XX/F2-PF
14
13
12
11
10
9
8
7
14
13
A
B
C
D
E
F
G
DP
DIG.1
A
B
C
D
E
F
G
DP
DIG.1
12
11
10
9
8
7
5
5
A
B
DIG.2
A
B
DIG.2
C
C
D
E
D
E
4
4
F
F
G
DP
G
DP
A
B
DIG.3
A
B
DIG.3
C
C
D
E
D
E
2
2
F
F
G
DP
G
DP
A
B
DIG.4
A
B
DIG.4
C
C
D
E
D
E
1
1
F
F
G
DP
G
DP
L1
L2
L3
L1
L2
L3
3
3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LFD4K5/6A-XX/F2-PF
PART NO.
Page 3/8
Electrical Connection
PIN NO.1
1
LFD4K5A-XX/F2-PF
PIN NO.1
1
LFD4K6A-XX/F2-PF
Common Cathode Dig.4
Common Anode Dig.4
Common Anode Dig.3
Anode L1,L2,L3
Common Cathode Dig.3
Cathode L1,L2,L3
2
3
2
3
Common Cathode Dig.2
Common Anode Dig.2
Common Anode Dig.1
4
4
Common Cathode Dig.1
NO CONNECT
5
5
NO CONNECT
Cathode DP
Cathode G
6
6
Anode DP
Anode G
7
7
8
8
Anode F
Cathode F
9
9
Anode E
Cathode E
10
11
12
13
10
11
12
13
Anode D
Cathode D
Anode C,L3
Anode B,L2
Anode A,L1
Cathode C,L3
Cathode B,L2
Cathode A,L1
14
14
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.
LFD4K5/6A-XX/F2-PF
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
9UG
30
Symbol
Parameter
UNIT
Forward Current Per Chip
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
60
75
Power Dissipation Per Chip
mW
PD
μA
Reverse Current Per Any Chip
Electrostatic Discharge( * )
Ir
10
ESD
Topr
μA
℃
2000
Operating Temperature
Storage Temperature
-25 ~ +85
-25 ~ +85
Tstg
℃
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λD
△λ
(nm) (nm)
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
Material Emitted
Min.
1.7
Common
Cathode
LFD4K5A-XX/F2-PF
LFD4K6A-XX/F2-PF
AIGaINP Green
574
20
2.1 2.6 7.2 12.8
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/8
PART NO.LFD4K5/6A-XX/F2-PF
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Dominant Wavelength
Iv
mcd
nm
λD
△λ
Ir
Spectral Line Half-Width
nm
μA
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/8
PART NO.
LFD4K5/6A-XX/F2-PF
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
2.5
2.0
100
1.5
1.0
10
1.0
0.5
0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.5
1.1
1.0
0.9
1.0
0.5
0
0.8
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/8
PART NO.
LFD4K5/6A-XX/F2-PF
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LFD4K5/6A-XX/F2-PF
PART NO.
Page 8/8
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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