LHR2043/TRS-1 [LIGITEK]
Visible LED;
| 型号： | LHR2043/TRS-1 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Visible LED |
| 文件： | 总6页 (文件大小：84K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LHR2043/TRS-X
DATA SHEET
DOC. NO : QW0905-LHR2043/TRS-X
REV.
: A
DATE
: 23 - Mar.- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043/TRS-X
Page 1/5
Package Dimensions
ΔH
P2
H2
H1
W2
L
W0
W1 W3
P1
F
P
D
T
LHR2043
3.0
4.2
4.0
5.2
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
2/5
LHR2043/TRS-X
PART NO.
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UNIT
HR
Symbol
Parameter
IF
IFP
30
Forward Current
mA
Peak Forward Current
Duty 1/10@10KHz
100
100
mA
mW
μA
Power Dissipation
PD
Ir
Reverse Current @5V
10
Topr
Tstg
Operating Temperature
Storage Temperature
Soldering Temperature
-40 ~ +85
-40 ~ +100
℃
℃
Max 260℃for 5 sec Max
Tsol
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
Luminous
intensity
Peak
wave
length
λPnm
Viewing
Spectral
halfwidth
△λnm
angle
2θ1/2
(deg)
COLOR
@
mA(V) @20mA(mcd)
20
PART NO
MATERIAL
GaAlAs
Typ.
350
Emitted
Red
Lens
Water Clear
Min. Max. Min.
220
660
20
30
1.5
2.4
LHR2043/TRS-X
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043/TRS-X
Page 3/5
‧ Dimensions Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
mm
inch
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
-------
-------
-------
D
F
3.8
2.3
0.15
0.09
-------
4.2
3.0
2.0
0.17
0.12
0.08
-------
△H
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
-------
0.69
0.85
1.0
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
TRS-1
TRS-2
TRS-3
TRS-4
TRS-5
TRS-6
TRS-7
TRS-8
TRS-9
TRS-10
-------
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
Feed Hole To Bottom Of Component
H1
0.79
0.76
1.42
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
-------
-------
-------
-------
-------
-------
-------
-------
W0
11.0
13.0
5.8
0.43
0.51
0.23
0.3
Feed Hole Pitch
P
12.4
4.4
0.49
0.17
0.2
Lead Location
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
5.1
7.7
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
17.5
0.69
19.0
REMARK:TRS=Tape And Reel Straight Leads
‧ Package Dimensions
‧ Dimensions Symbol Information
Specification
Symbol
Description
minimum
maxmum
D3
inch
inch
mm
mm
D2
T1
MARKING
D1
Reel Diameter
D
78.2
34.9
28.6
13.8
3.08
1.37
1.13
0.54
380
102
14.96
4.02
3.46
1.5
Core Diameter
D1
D2
D3
T2
T1
Hub Recess Inside Diameter
Arbor Hole Diameter
88.0
38.1
57.2
50.0
D
T2
Overall Reel Thickness
2.25
1.97
Iside Reel Flange Thickness
30.0
1.18
Quantity/Reel
2000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LHR2043/TRS-X
Page4/5
PART NO.
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
2.5
2.0
1.5
100
10
1.0
0.5
1.0
0.1
0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.5
1.0
0.5
1.1
1.0
0.9
0.8
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
0°
1.0
0.5
0
-30°
30°
-60°
-60°
100% 75% 50% 25%
0
25% 50% 75%100%
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LHR2043/TRS-X
5/5
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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