LHR2643-1 [LIGITEK]

SUPER BRIGHT ROUND TYPE LED LAMPS; SUPER BRIGHT ROUND型LED灯
LHR2643-1
型号: LHR2643-1
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

SUPER BRIGHT ROUND TYPE LED LAMPS
SUPER BRIGHT ROUND型LED灯

文件: 总5页 (文件大小:119K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
SUPER BRIGHT ROUND TYPE LED LAMPS  
LHR2643-1  
DATA SHEET  
DOC. NO : QW0905-LHR2643-1  
REV.  
: A  
DATE  
: 31 - Mar.- 2005  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
PART NO. LHR2643-1  
1/4  
Package Dimensions  
2.9  
3.3  
3.1  
4.3  
1.5MAX  
25.0MIN  
1.0MIN  
0.5  
TYP  
2.54TYP  
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Directivity Radiation  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
2/4  
LHR2643-1  
PART NO.  
Absolute Maximum Ratings at Ta=25 ℃  
Ratings  
UNIT  
HR  
Symbol  
Parameter  
IF  
IFP  
30  
Forward Current  
mA  
Peak Forward Current  
Duty 1/10@10KHz  
100  
100  
mA  
mW  
Power Dissipation  
PD  
Ir  
Reverse Current @5V  
10  
μA  
Topr  
Tstg  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
-40 ~ +85  
-40 ~ +100  
Max 260for 5 sec Max  
Tsol  
Typical Electrical & Optical Characteristics (Ta=25 )  
Forward  
voltage  
20  
Luminous  
intensity  
Peak  
wave  
length  
λPnm  
Viewing  
Spectral  
halfwidth  
△λnm  
angle  
2θ1/2  
(deg)  
COLOR  
@
mA(V) @20mA(mcd)  
PART NO  
MATERIAL  
GaAlAs  
Typ.  
300  
Emitted  
Red  
Lens  
Water Clear  
Max.  
2.4  
Min.  
1.5  
Min.  
120  
660  
20  
40  
LHR2643-1  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LHR2643-1  
Page3/4  
Typical Electro-Optical Characteristics Curve  
HR CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
3.0  
1000  
2.5  
2.0  
1.5  
100  
10  
1.0  
0.5  
1.0  
0.1  
0
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
1.2  
1.1  
1.0  
0.9  
0.8  
0
-40  
-20  
-0  
20  
40  
60  
80  
100  
-40  
-20  
-0  
20  
40  
60  
80  
100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0
600  
650  
700  
750  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
PART NO. LHR2643-1  
4/4  
Reliability Test:  
Reference  
Description  
Test Item  
Test Condition  
Standard  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resisance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under ondition  
of hogh temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hous.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105±5&-40±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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