LHR3330 [LIGITEK]

SUPER BRIGHT ROUND TYPE LED LAMPS; SUPER BRIGHT ROUND型LED灯


型号：	LHR3330
厂家：	LIGITEK ELECTRONICS CO., LTD.
描述：	SUPER BRIGHT ROUND TYPE LED LAMPS SUPER BRIGHT ROUND型LED灯
文件：	总5页 (文件大小：70K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

SUPER BRIGHT ROUND TYPE LED LAMPS

LHR3330

DATA SHEET

DOC. NO : QW0905-LHR3330

REV.

: A

DATE

: 18 - Oct - 2005

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

PART NO. LHR3330

1/4

Package Dimensions

5.0 5.9

7.6

8.6

1.5MAX

□0.5

TYP

25.0MIN

1.0MIN

2.54TYP

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.

2.Specifications are subject to change without notice.

Directivity Radiation

0°

-30°

30°

-60°

60°

100% 75% 50% 25%

25% 50% 75% 100%

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

PART NO. LHR3330

2/4

Absolute Maximum Ratings at Ta=25 ℃

Ratings

Symbol

Parameter

UNIT

IFP

Forward Current

Peak Forward Current

Duty 1/10@10KHz

100

μA

Power Dissipation

100

Reverse Current @5V

Operating Temperature

Storage Temperature

Topr

Tstg

-40 ~ +85

-40 ~ +100

℃

Max 260℃for 5 sec Max

Soldering Temperature

Tsol

(2mm from body)

Typical Electrical & Optical Characteristics (Ta=25 ℃)

Forward

voltage

@20mA(V)

Viewing

Peak

wave

length

λPnm

Luminous

intensity

@20mA(mcd)

Spectral

halfwidth

△λnm

angle

2θ1/2

(deg)

COLOR

PART NO

LHR3330

MATERIAL

GaAlAs

Typ.

Emitted

Red

Lens

Red Diffused

Min. Max. Min.

660

2.4 160 300

1.5

Note : 1.The forward voltage data did not including ±0.1V testing tolerance.

2. The luminous intensity data did not including ±15% testing tolerance.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LHR3330

Page3/4

Typical Electro-Optical Characteristics Curve

HR CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

3.0

1000

2.5

2.0

1.5

100

1.0

0.5

1.0

0.1

1.0

2.0

3.0

4.0

5.0

1.0

100

1000

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

3.0

2.5

2.0

1.5

1.0

0.5

1.2

1.1

1.0

0.9

0.8

-40

-20

-0

100

-40

-20

-0

100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

1.0

0.5

600

650

700

750

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

PART NO. LHR3330

4/4

Reliability Test:

Reference

Description

Test Item

Test Condition

Standard

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Operating Life Test

The purpose of this is the resistance of

the device which is laid under ondition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Low Temperature

Storage Test

1.Ta=-40℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

JIS C 7021: B-12

1.Ta=65℃±5℃

2.RH=90 %~95%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hous.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

Solder Resistance

Test

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solderability Test

相关型号：