LHRF9353 [LIGITEK]

AXIAL TYPE LED LAMPS; 轴向型LED灯
LHRF9353
型号: LHRF9353
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

AXIAL TYPE LED LAMPS
轴向型LED灯

文件: 总8页 (文件大小:130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
AXIAL TYPE LED LAMPS  
Pb  
Lead-Free Parts  
LHRF9353  
DATA SHEET  
DOC. NO : QW0905-LHRF9353  
REV  
: B  
DATE  
: 27 - Oct. - 2008  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 1/7  
PART NO. LHRF9353  
Package Dimensions  
6.0MIN  
3.0  
6.0MIN  
0.5  
2.2  
1.54  
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Directivity Radiation  
0°  
-30°  
30°  
-60°  
60°  
0
100% 75% 50% 25%  
25% 50% 75% 100%  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 2/7  
PART NO. LHRF9353  
Absolute Maximum Ratings at Ta=25  
Absolute Maximum Ratings  
Symbol  
Parameter  
UNIT  
HRF  
30  
IF  
Forward Current  
mA  
mA  
mW  
Peak Forward Current  
Duty 1/10@10KHz  
IFP  
PD  
90  
Power Dissipation  
75  
Reverse Current @5V  
Electrostatic Discharge  
Ir  
10  
μA  
Esd  
2000  
V
Topr  
Operating Temperature  
Storage Temperature  
-40 ~ +85  
Tstg  
-40 ~ +100  
Typical Electrical & Optical Characteristics (Ta=25 )  
Dominant  
wave  
length  
Spectral  
halfwidth  
△λnm  
Forward  
voltage  
@20mA(V)  
Luminous  
intensity  
@20mA(mcd)  
Viewing  
angle  
2θ 1/2  
(deg)  
COLOR  
PART NO  
MATERIAL  
AlGaInP  
λDnm  
Typ.  
Emitted  
Red  
Lens  
Min. Max. Min.  
LHRF9353  
Water Clear  
20  
1.5  
160 300  
120  
630  
2.4  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 3/7  
PART NO. LHRF9353  
Typical Electro-Optical Characteristics Curve  
HRF CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
1000  
3.5  
3.0  
2.5  
2.0  
100  
10  
1.0  
0.1  
1.5  
1.0  
0.5  
0
1.0  
1.5  
2.0  
2.5  
3.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
0.5  
1.1  
1.0  
0.9  
0.8  
0
-40  
-20  
-0  
20  
40  
60  
80  
100  
-40  
-20  
-0  
20  
40  
60  
80  
100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0
550  
600  
650  
700  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LHRF9353  
Soldering Iron:  
Page 4/7  
Basic spec is 5 sec when 260. If temperature is higher, time should be shorter(+10℃ → -1sec).  
Power dissipation of iron should be smaller than 15W,and temperature should be controllable.  
Surface temperature of the device should be under 230 .  
Soldering heat  
Soldering heat Max. 260℃  
245±5within 5 sec  
Preheat  
120 ~ 150℃  
120 ~ 180 sec  
Reflow Temp/Time  
Temp.  
()  
220  
Rising  
Cooling  
+5/sec  
-5/sec  
Preheat  
150  
120  
Time  
60 ~ 120 sec  
5sec  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 5/7  
PART NO. LHRF9353  
Precautions For Use:  
Storage time:  
1.The operation of Temperatures and RH are : 5~35,RH<60%.  
2.Once the package is opened, the products should be used within a week.  
Otherwise, they should be kept in a damp proof box with descanting agent.  
Considering the tape life, we suggest our customers to use our products within  
a year(from production date).  
3.If opened more than one week in an atmosphere 5~ 35,RH<60%,  
they should be treated at 60℃±5 fo r 15hrs.  
Drive Method:  
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into  
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series  
with the LED.  
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd  
current should not be allowed to change by more than 40% of its desired value.  
Circuit model A  
LED  
Circuit model B  
LED  
(A) Recommended circuit.  
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.  
Cleaning:  
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.  
ESD(Electrostatic Discharge):  
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic  
glove is recommended when handing these LED. All devices, equipment and machinery must be properly  
grounded.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO.  
LG2340/L45-PF  
Page 6/7  
Soldering Condition(Pb-Free)  
1.Iron:  
Soldering Iron:30W Max  
Temperature 350°C Max  
Soldering Time:3 Seconds Max(One time only)  
Distance:2mm Min(From solder joint to body)  
2.Wave Soldering Profile  
Dip Soldering  
Preheat: 120°C Max  
Preheat time: 60seconds Max  
Ramp-up  
2°C/sec(max)  
Ramp-Down:-5°C/sec(max)  
Solder Bath:260°C Max  
Dipping Time:3 seconds Max  
Distance:2mm Min(From solder joint to body)  
Temp(°C)  
260°C3sec Max  
260°  
5°/sec  
max  
120°  
2°/sec  
25°  
0°  
max  
0
50  
150  
Time(sec)  
100  
Preheat  
60 Seconds Max  
Note: 1.Wave solder should not be made more than one time.  
2.You can just only select one of the soldering conditions as above.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 7/7  
PART NO. LHRF9353  
Reliability Test:  
Reference  
Standard  
Classification  
Test Item  
Test Condition  
1.Ta=Under Room Temperature As Per Data Sheet  
Maximum Rating.  
2.If=20mA  
MIL-STD-750D: 1026  
MIL-STD-883D: 1005  
JIS C 7021: B-1  
Operating Life Test  
3.t=1000 hrs (-24hrs, +72hrs)  
High Temperature  
Storage Test  
1.Ta=105℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883D:1008  
JIS C 7021: B-10  
Endurance  
Test  
Low Temperature  
Storage Test  
1.Ta=-40℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
High Temperature  
High Humidity  
Storage Test  
1.Ta=65℃±5℃  
2.RH=90%~95%  
3.t=1000hrs ±2hrs  
MIL-STD-202F:103B  
JIS C 7021: B-11  
1.Ta=105℃±5&-40℃±5℃  
MIL-STD-202F: 107D  
MIL-STD-750D: 1051  
MIL-STD-883D: 1011  
(10min)  
(10min)  
Thermal Shock Test  
Solderability Test  
2.total 10 cycles  
MIL-STD-202F: 208D  
MIL-STD-750D: 2026  
MIL-STD-883D: 2003  
IEC 68 Part 2-20  
1.T.Sol=235 ℃±5℃  
2.Immersion time 2 ±0.5sec  
3.Coverage 95% of the dipped surface  
JIS C 7021: A-2  
MIL-STD-202F: 107D  
MIL-STD-750D: 1051  
MIL-STD-883D: 1010  
JIS C 7021: A-4  
1.105~ 25~ -55~ 25℃  
30mins 5mins 30mins 5mins  
2.10 Cyeles  
Temperature  
Cycling  
Environmental  
Test  
Ramp-up rate(183 to Peak) +3 second max  
Temp. maintain at 125( ±25)120 seconds max  
Temp. maintain above 183 60-150 seconds  
Peak temperature range 235 +5/-0℃  
Time within 5 of actual Peak Temperature(tp)  
10-30 seconds  
MIL-STD-750D:2031.2  
J-STD-020  
IR Reflow  
Ramp-down rate +6 /second max  

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