LHY32841 [LIGITEK]

SUPER BRIGHT OVAL TYPE LED LAMPS; 超亮椭圆型LED灯
LHY32841
型号: LHY32841
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

SUPER BRIGHT OVAL TYPE LED LAMPS
超亮椭圆型LED灯

文件: 总5页 (文件大小:108K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
SUPER BRIGHT OVAL TYPE LED LAMPS  
LHY32841  
DATA SHEET  
DOC. NO : QW0905-LHY32841  
REV.  
: A  
DATE  
: 16 - Feb. - 2006  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
PART NO. LHY32841  
1/4  
Package Dimensions  
3.9  
3.1  
6.3  
1.5  
MAX  
25.0MIN  
1.0MIN  
0.5  
TYP  
2.54TYP  
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Directivity Radiation  
Vertical Axis 32°  
Horizontal Axis 70 °  
0°  
-30°  
30°  
-60°  
60°  
0
100% 75% 50% 25%  
25% 50% 75%100%  
Radiation Angle(0.5):H 70 Degree/V 32 Degree  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LHY32841  
Page 2/4  
Absolute Maximum Ratings at Ta=25  
Ratings  
HY  
Symbol  
Parameter  
UNIT  
30  
IF  
IFP  
Forward Current  
mA  
mA  
mW  
μA  
V
Peak Forward Current  
Duty 1/10@10KHz  
60  
Power Dissipation  
75  
PD  
Ir  
Reverse Current @5V  
Electrostatic Discharge( * )  
Operating Temperature  
Storage Temperature  
10  
ESD  
Topr  
Tstg  
2000  
-40 ~ +85  
-40 ~ +100  
Max 260for 5 sec Max  
Soldering Temperature  
Tsol  
(2mm from body)  
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic  
glove is recommended when handing these LED. All devices, equipment and machinery must be properly  
grounded.  
*
Typical Electrical & Optical Characteristics (Ta=25 )  
Forward  
Dominant  
Luminous  
intensity  
@20mA(mcd)  
Viewing  
angle  
2θ 1/2  
(deg)  
Spectral  
voltage  
wave  
length  
λDnm  
halfwidth  
COLOR  
Lens  
@20mA(V)  
PART NO  
LHY32841  
MATERIAL  
AlGaInP  
△λnm  
Typ.  
Emitted  
Yellow  
Min. Max. Min.  
Vertical  
Axis32°  
Yellow Transparent  
595  
15  
1.7  
2.6 300 500  
Horizontal  
Axis70°  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page3/4  
PART NO. LHY32841  
Typical Electro-Optical Characteristics Curve  
HY CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
1000  
100  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
1.0  
0.1  
0.5  
0.0  
1.0  
1.5  
2.0  
2.5  
3.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
1.2  
1.1  
1.0  
0.9  
0.8  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0.0  
550  
600  
650  
500  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 4/4  
PART NO. LHY32841  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resistance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under condition  
of high temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105 ℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40 ℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65℃±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hours.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105 ℃±5&-40℃±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ℃±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ℃±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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