LMD5711-2CVG-XX-P2 [LIGITEK]
DOT MATRIX LED DISPLAY(1.2Inch); 点阵LED显示屏（ 1.2Inch ）
| 型号： | LMD5711-2CVG-XX-P2 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | DOT MATRIX LED DISPLAY(1.2Inch) |
| 文件： | 总8页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DOT MATRIX LED DISPLAY(1.2Inch)
LMD5711/2CVG-XX/P2
DATA SHEET
DOC. NO : QW0905-LMD5711/2CVG-XX/P2
REV.
: A
DATE
: 02 - Mar - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LMD5711/2CVG-XX/P2
Package Dimensions
4.57X4=18.28
(0.72")
8.1
(0.319")
4.57X6=
27.42
(1.08")
31.7
(1.248")
22.86
(0.9")
22.6(0.89")
ψ3.0(0.118")
LMD5711/2CVG-XX/P2
LIGITEK
3.2±0.5
0.51
TYP.
2.54X6=
15.24(0.6")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/7
PART NO. LMD5711/2CVG-XX/P2
Internal Circuit Diagram
LMD5711CVG-XX/P2
COLUMN
1
2
3
3
4
5
6
4,11
13
10
ROW
PIN
1
2
3
4
5
6
7
9
14
8
5
12
1
7
2
LMD5712CVG-XX/P2
COLUMN
1
2
3
3
4
5
6
4,11
13
10
ROW
PIN
1
2
3
4
5
6
7
9
14
8
5
12
1
7
2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
3/7
PART NO. LMD5711/2CVG-XX/P2
Page
Electrical Connection
PIN NO.1
1
LMD5711CVG-XX/P2
PIN NO.1
1
LMD5712CVG-XX/P2
Cathode Row 5
Anode Row 5
Anode Row 7
Cathode Row 7
Anode Column 2
Anode Column 3
Cathode Row 4
Anode Column 5
Cathode Row 6
Cathode Row 3
Cathode Row 1
Anode Column 4
Anode Column 3
Cathode Row 4
Anode Column 1
Cathode Row 2
2
3
2
3
Cathode Column 2
Cathode Column 3
Anode Row 4
4
4
5
5
Cathode Column 5
Anode Row 6
6
6
7
7
Anode Row 3
8
8
Anode Row 1
9
9
Cathode Column 4
Cathode Column 3
Anode Row 4
10
11
12
13
14
10
11
12
13
14
Cathode Column 1
Anode Row 2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2CVG-XX/P2
Page 4/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
VG
Symbol
Parameter
UNIT
Forward Current Per Chip
30
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
120
IFP
Power Dissipation Per Chip
mW
PD
100
10
μA
Reverse Current Per Any Chip
Operating Temperature
Storage Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Material Emitted
Min.
1.7
Column
Cathode
Row
LMD5711CVG-XX/P2
LMD5712CVG-XX/P2
Anode
565
30
2.1 2.6 3.05 4.5
GaP
Green
Column
Anode
Row
Cathode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2CVG-XX/P2
Page 5/7
Test Condition For Each Parameter
Symbol
Vf
Unit
volt
Test Condition
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Parameter
Forward Voltage Per Chip
Luminous Intensity Per Chip
Peak Wavelength
Iv
λp
△λ
Ir
mcd
nm
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2CVG-XX/P2
Page 6/7
Typical Electro-Optical Characteristics Cur ve
VG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
3.5
3.0
2.5
2.0
1.5
10
1.0
0.5
0.0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.9
0.8
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/7
PART NO. LMD5711/2CVG-XX/P2
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
相关型号：
©2020 ICPDF网 联系我们和版权申明