LSBI5232 [LIGITEK]
RECTANGLE TYPE LED LAMPS; 回型LED灯
| 型号： | LSBI5232 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | RECTANGLE TYPE LED LAMPS |
| 文件： | 总6页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
RECTANGLE TYPE LED LAMPS
Pb
Lead-Free Parts
LSBI5232
DATA SHEET
DOC. NO : QW0905-LSBI5232
REV.
: A
DATE
: 10 - Feb. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSBI5232
1/5
Package Dimensions
2.0
5.0
7.0
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
0
100% 75% 50% 25%
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/5
PART NO. LSBI5232
Absolute Maximum Ratings at Ta=25 ℃
Ratings
SBI
Symbol
Parameter
UNIT
IF
IFP
30
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
70
Power Dissipation
PD
Ir
120
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
50
μA
V
500
ESD
Topr
Tstg
-20 ~ +80
-30 ~ +100
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V) @20mA(mcd)
Luminous
intensity
Viewing
angle
2θ 1/2
(deg)
Peak
wave
length
λPnm
Spectral
halfwidth
△λnm
Dominant
wave
length
COLOR
MATERIAL
InGaN/SiC
PART NO
λDnm
Typ.
3.8
Typ.
Max.
4.7
Lens
Min.
Emitted
Blue
65
LSBI5232
White Diffused
5.0 10.0
146
465
430
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI5232
Page 3/5
Typical Electro-Optical Characteristics Curve
SBI CHIP
Fig.2 Relative Intensity vs. Wavelength
Fig.1 Forward current vs. Forward Voltage
30
25
20
15
10
5
1.0
0.5
0
0
1
2
3
4
5
680
380 430 480 530 580 630
Wavelength (nm)
Forward Voltage(V)
Fig.3 Relative Intensity vs. Forward Current
125
Fig.4 Relative Intensity vs. Lead Temperature
10
100
75
50
25
0
1
0
20 25 30 35 45
40
0
15
10
5
0
25
50
75
100
Lead Temperature (℃)
Forward Current (mA DC)
Fig.5 Forward Current vs. Ambient Temperature
40
30
20
10
0
25
50
75
100
0
Ambient Temperature (℃)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI5232
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
120°
5°/sec
max
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/4
PART NO. LSBI5232
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
相关型号：
©2020 ICPDF网 联系我们和版权申明