LSR3330/T-PF/TBS-10 [LIGITEK]

Visible LED;


型号：	LSR3330/T-PF/TBS-10
厂家：	LIGITEK ELECTRONICS CO., LTD.
描述：	Visible LED
文件：	总7页 (文件大小：124K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

TAPE AND BOX TYPE LED LAMPS

Lead-Free Parts

LSR3330/T-PF/TBS-X

DATA SHEET

DOC. NO : QW0905-LSR3330/T-PF/TBS-X

REV.

: A

DATE

: 23 - May. - 2008

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSR3330/T-PF/TBS-X

Page 1/6

Package Dimensions

ΔH

W1 W3

- +

LSR3330/T-PF

5.0

7.6

5.9

8.6

1.5MAX

□0.5

TYP

25.0MIN

1.0MIN

2.54TYP

+ -

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.

2.Specifications are subject to change without notice.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSR3330/T-PF/TBS-X

Page

2/6

Absolute Maximum Ratings at Ta=25 ℃

Ratings

Symbol

Parameter

UNIT

IFP

Forward Current

Peak Forward Current

Duty 1/10@10KHz

100

μA

Power Dissipation

100

Reverse Current @5V

Operating Temperature

Storage Temperature

Topr

Tstg

-40 ~ +85

-40 ~ +100

℃

Typical Electrical & Optical Characteristics (Ta=25 ℃)

Forward

voltage

@ 2 mA(V)

Viewing

Peak

Luminous

intensity

@2mA(mcd)

Spectral

halfwidth

△λnm

wave

length

λPnm

angle

2θ 1/2

(deg)

COLOR

PART NO

MATERIAL

GaAlAs

Typ.

Emitted

Red

Lens

Min. Max. Min.

Red Diffused

660

2.0 9.0

1.5

LSR3330/T-PF/TBS-X

Note : 1.The forward voltage data did not including ±0.1V testing tolerance.

2. The luminous intensity data did not including ±15% testing tolerance.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSR3330/T-PF/TBS-X

Page 3/6

•Dimension Symbol Information

SPECIFICATIONS

Minimum Maximum

OPTION

CODE

SYMBOL ITEMS

SYMBOL

inch

Tape Feed Hole Diameter

Component Lead Pitch

Front-To-Rear Deflection

-------

3.8

2.3

0.15

0.09

-------

4.2

3.0

0.17

0.12

0.08

0.73

0.89

1.04

0.93

0.82

0.98

1.0

-------

△H

2.0

TBS-1

TBS-2

TBS-3

TBS-5

TBS-6

TBS-7

TBS-8

TBS-9

TBS-10

TBS-11

TBS-12

TBS-13

-------

17.5

21.5

25.5

22.5

19.9

24.0

24.5

19.0

18.4

21.0

20.5

18.0

-------

0.69

0.85

1.0

18.5

22.5

26.5

23.5

20.9

25.0

25.5

20.0

19.4

22.0

21.5

19.0

0.89

0.78

0.94

0.96

0.75

0.72

0.83

0.81

0.71

-------

Feed Hole To Bottom Of Component

0.79

0.76

0.87

0.85

0.75

1.42

0.43

0.51

0.23

0.3

Feed Hole To Overall Component Height

Lead Length After Component Height

-------

Feed Hole Pitch

12.4

4.4

0.49

0.17

0.2

-------

Lead Location

5.8

Center Of Component Location

Overall Taped Package Thickness

-------

5.1

7.7

-------

8.5

-------

0.33

0.57

1.42

9.75

15.5

4.0

0.06

0.38

0.61

0.16

0.75

-------

Feed Hole Location

Adhesive Tape Width

Adhesive Tape Position

Tape Width

-------

14.5

-------

17.5

0.69

REMARK:TBS=Tape And Box Straight Leads

• Dimensions Symbol Information

• Package Dimensions

Specification

minimum maxmum

Symbol

Description

inch

13.0

inch

13.4

10.8

2.4

Overall Length

Overall Width

330

265

340

275

10.4

1.97

Overall Thickness

Quantity/Box

2000PCS

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSR3330/T-PF/TBS-X

Page 4/6

Typical Electro-Optical Characteristics Curve

SR CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

3.0

2.5

2.0

1.5

1.0

0.5

0.0

1000

100

1.0

0.1

1.0

100

1000

1.0

2.0

3.0

4.0

5.0

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

3.0

1.2

2.5

2.0

1.5

1.0

0.5

1.1

1.0

0.9

0.8

0.0

-40

-20

100

-40

-20

80 100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

Fig.6 Directivity Radiation

1.0

0.5

0.0

0°

-30°

30°

-60°

60°

100% 75% 50% 25%

25% 50% 75% 100%

600

650

700

750

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSR3330/T-PF/TBS-X

Page 5/6

Soldering Condition

1.Iron:

Soldering Iron:30W Max

Temperature 350°C Max

Soldering Time:3 Seconds Max(One time only)

Distance:2mm Min(From solder joint to body)

2.Wave Soldering Profile

Dip Soldering

Preheat: 120°C Max

Preheat time: 60seconds Max

Ramp-up

2°C/sec(max)

Ramp-Down:-5°C/sec(max)

Solder Bath:260°C Max

Dipping Time:3 seconds Max

Distance:2mm Min(From solder joint to body)

Temp(°C)

260°C3sec Max

260°

5°/sec

max

120°

2°/sec

25°

0°

max

150

Time(sec)

100

Preheat

60 Seconds Max

Note: 1.Wave solder should not be made more than one time.

2.You can just only select one of the soldering conditions as above.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page 6/6

PART NO.

LSR3330/T-PF/TBS-X

Reliability Test:

Reference

Standard

Description

Test Item

Test Condition

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Operating Life Test

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Low Temperature

Storage Test

1.Ta=-40 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

JIS C 7021: B-12

1.Ta=65℃±5℃

2.RH=90%~95%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

Solder Resistance

Test

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solderability Test

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