LURF2043S-PF [LIGITEK]
SUPER BRIGHT ROUND TYPE LED LAMPS; SUPER BRIGHT ROUND型LED灯![LURF2043S-PF](http://pdffile.icpdf.com/pdf1/p00147/img/icpdf/LURF2_816991_icpdf.jpg)
型号: | LURF2043S-PF |
厂家: | ![]() |
描述: | SUPER BRIGHT ROUND TYPE LED LAMPS |
文件: | 总6页 (文件大小:109K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LURF2043S-PF
DATA SHEET
DOC. NO : QW0905-LURF2043S-PF
REV.
: A
DATE
: 01 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LURF2043S-PF
1/5
Package Dimensions
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURF2043S-PF
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
URF(S)
Symbol
Parameter
UNIT
50
90
IF
IFP
Forward Current
mA
mA
mW
μA
V
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
120
PD
Ir
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
10
2000
-40 ~ +85
ESD
Topr
℃
℃
Tstg
Storage Temperature
-40 ~ +100
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
PART NO
MATERIAL
AlGaInP
λDnm
Typ.
Lens
Emitted
Min. Max. Min.
1.7
Water Clear
LURF2043S-PF
Red
625
20
2.6 2200 4000
30
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO. LURF2043S-PF
Typical Electro-Optical Characteristics Curve
URFS CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Luminous Intensity vs. Forward Current
6.0
5.0
4.0
150
100
50
0
3.0
2.0
1.0
0.0
0
50
100
150
0
0.5
1.0
1.5
2.0
2.5
3.0
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Luminous Intensity vs. Temperature
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURF2043S-PF
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
120°
5°/sec
max
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LURF2043S-PF
5/5
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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