LTC1608CG [Linear]

High Speed, 16-Bit, 500ksps Sampling A/D Converter with Shutdown; 高速, 16位, 500KSPS采样A / D转换器,带有关断
LTC1608CG
型号: LTC1608CG
厂家: Linear    Linear
描述:

High Speed, 16-Bit, 500ksps Sampling A/D Converter with Shutdown
高速, 16位, 500KSPS采样A / D转换器,带有关断

转换器
文件: 总20页 (文件大小:1003K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC1608  
High Speed, 16-Bit, 500ksps  
Sampling A/D Converter  
with Shutdown  
U
FEATURES  
DESCRIPTIO  
The LTC®1608 is a 500ksps, 16-bit sampling A/D con-  
verter that draws only 270mW from ±5V supplies. This  
high performance device includes a high dynamic range  
sample-and-hold, a precision reference and a high speed  
parallel output. Two digitally selectable power shutdown  
modes provide power savings for low power systems.  
A Complete, 500ksps 16-Bit ADC  
90dB S/(N+D) and –100dB THD (Typ)  
Power Dissipation: 270mW (Typ)  
No Pipeline Delay  
No Missing Codes Over Temperature  
Nap (7mW) and Sleep (10µW) Shutdown Modes  
Operates with Internal 15ppm/°C Reference  
or External Reference  
The LTC1608’s full-scale input range is ±2.5V. Outstand-  
ing AC performance includes 90dB S/(N+D) and 100dB  
THD at a sample rate of 500ksps.  
True Differential Inputs Reject Common Mode Noise  
5MHz Full Power Bandwidth  
±2.5V Bipolar Input Range  
36-Pin SSOP Package  
Theuniquedifferentialinputsample-and-holdcanacquire  
single-ended or differential input signals up to its 15MHz  
bandwidth. The 68dB common mode rejection allows  
users to eliminate ground loops and common mode noise  
by measuring signals differentially from the source.  
Pin Compatible with the LTC1604  
U
APPLICATIO S  
The ADC has µP compatible,16-bit parallel output port.  
Thereisnopipelinedelayinconversionresults. Aseparate  
convert start input and a data ready signal (BUSY) ease  
connections to FlFOs, DSPs and microprocessors.  
Telecommunications  
Digital Signal Processing  
Multiplexed Data Acquisition Systems  
High Speed Data Acquisition  
Spectrum Analysis  
Imaging Systems  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Circuitry in the LTC1608 is covered under US Patent #5,764,175  
U
TYPICAL APPLICATIO  
5V 10µF  
2.2µF  
10µF  
5V 10µF  
10Ω  
+
+
+
3
36  
10  
35  
9
LTC1608 4096 Point FFT  
V
REF  
AV  
AV  
DD  
DV  
DD  
DGND  
DD  
SHDN  
CS  
0
33  
32  
31  
30  
27  
f
f
= 500kHz  
SAMPLE  
= 98.754kHz  
LTC1608  
IN  
CONTROL  
LOGIC  
–20  
µP  
CONTROL  
LINES  
SINAD = 86.7dB  
THD = –92.6dB  
CONVST  
RD  
REFCOMP  
7.5k  
AND  
4
2.5V  
REF  
1.75X  
–40  
–60  
TIMING  
+
BUSY  
22µF  
OV  
DD  
29  
28  
5V OR  
+
3V  
–80  
10µF  
+
OGND  
A
1
2
IN  
+
–100  
–120  
–140  
DIFFERENTIAL  
ANALOG INPUT  
±2.5V  
16-BIT  
SAMPLING  
ADC  
OUTPUT  
BUFFERS  
B15 TO B0  
16-BIT  
PARALLEL  
BUS  
A
IN  
D15 TO D0  
11 TO 26  
1608 TA01  
AGND AGND AGND AGND  
V
SS  
34  
50  
100  
250  
0
150  
200  
5
6
7
8
FREQUENCY (kHz)  
1608 TA02  
10µF  
+
–5V  
1
LTC1608  
W W U W  
U W  
U
ABSOLUTE AXI U RATI GS  
AVDD = DVDD = OVDD = VDD (Notes 1, 2)  
PACKAGE/ORDER I FOR ATIO  
TOP VIEW  
ORDER  
+
Supply Voltage (VDD)................................................ 6V  
Negative Supply Voltage (VSS) ............................... 6V  
Total Supply Voltage (VDD to VSS) .......................... 12V  
Analog Input Voltage  
(Note 3) ......................... (VSS – 0.3V) to (VDD + 0.3V)  
VREF Voltage (Note 4) ................. 0.3V to (VDD + 0.3V)  
REFCOMP Voltage (Note 4) ......... 0.3V to (VDD + 0.3V)  
Digital Input Voltage (Note 4) ....................0.3V to 10V  
Digital Output Voltage.................. 0.3V to (VDD + 0.3V)  
Power Dissipation............................................. 500mW  
Operating Temperature Range .................... 0°C to 70°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
A
A
1
2
3
4
5
6
7
8
9
36 AV  
35 AV  
PART NUMBER  
IN  
DD  
IN  
DD  
V
34  
V
SS  
REF  
LTC1608CG  
LTC1608ACG  
REFCOMP  
AGND  
33 SHDN  
32 CS  
AGND  
31 CONV  
30 RD  
AGND  
AGND  
29 OV  
DD  
DV  
28 OGND  
27 BUSY  
26 D0  
25 D1  
24 D2  
23 D3  
22  
DD  
DGND 10  
D15 (MSB) 11  
D14 12  
D13 13  
D12 14  
D11  
15  
D4  
D10 16  
D9 17  
21 D5  
20 D6  
19 D7  
D8 18  
G PACKAGE  
36-LEAD PLASTIC SSOP  
TJMAX = 125°C, θJA = 95°C/W  
Consult factory for parts specified with wider operating temperature ranges.  
U
CO VERTER  
CHARACTERISTICS  
The denotes specifications that apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. With Internal Reference (Notes 5, 6), unless otherwise noted.  
LTC1608  
TYP  
LTC1608A  
TYP  
PARAMETER  
CONDITIONS  
MIN  
MAX  
MIN  
MAX  
UNITS  
Bits  
Resolution (No Missing Codes)  
Integral Linearity Error  
Transition Noise  
Offset Error  
15  
16  
±1  
0.7  
16  
16  
±0.5  
0.7  
(Note 7)  
(Note 8)  
(Note 9)  
(Note 9)  
±4  
±2  
LSB  
LSB  
RMS  
±0.05 ±0.125  
±0.05 ±0.125  
% FSR  
Offset Tempco  
0.5  
0.5  
ppm/°C  
Full-Scale Error  
Internal Reference  
External Reference  
±0.125 ±0.25  
±0.25  
±0.125 ±0.25  
±0.25  
%
%
Full-Scale Tempco  
I
(Reference) = 0, Internal Reference  
OUT  
±15  
±15  
ppm/°C  
U
U
The denotes specifications that apply over the full operating temperature range, otherwise  
A ALOG I PUT  
specifications are at TA = 25°C.  
SYMBOL PARAMETER  
CONDITIONS  
4.75 V 5.25V, 5.25 V 4.75V,  
MIN  
TYP  
MAX  
UNITS  
V
Analog Input Range (Note 2)  
±2.5  
V
IN  
DD  
SS  
+
V
(A , A ) AV  
SS  
IN IN DD  
I
Analog Input Leakage Current  
Analog Input Capacitance  
CS = High  
±1  
µA  
IN  
C
Between Conversions  
During Conversions  
43  
5
pF  
pF  
IN  
t
t
t
Sample-and-Hold Acquisition Time  
380  
1.5  
5
ns  
ns  
ACQ  
AP  
Sample-and-Hold Acquisition Delay Time  
Sample-and-Hold Acquisition Delay Time Jitter  
Analog Input Common Mode Rejection Ratio  
ps  
jitter  
RMS  
+
CMRR  
2.5V < (A = A ) < 2.5V  
68  
dB  
IN  
IN  
2
LTC1608  
U W  
TA = 25°C (Note 5)  
DY A IC ACCURACY  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
S/N  
Signal-to-Noise Ratio  
5kHz Input Signal  
100kHz Input Signal  
90  
88  
dB  
dB  
S/(N + D)  
THD  
Signal-to-(Noise + Distortion) Ratio  
5kHz Input Signal  
100kHz Input Signal (Note 10)  
90  
84  
dB  
dB  
Total Harmonic Distortion  
Up to 5th Harmonic  
5kHz Input Signal  
100kHz Input Signal  
100  
91  
dB  
dB  
SFDR  
IMD  
Spurious Free Dynamic Range  
Intermodulation Distortion  
100kHz Input Signal  
94  
88  
5
dB  
dB  
f
= 29.37kHz, f = 32.446kHz  
IN2  
IN1  
Full Power Bandwidth  
MHz  
kHz  
Full Linear Bandwidth (S/(N + D) 84dB)  
350  
U U  
U
I TER AL REFERE CE CHARACTERISTICS TA = 25°C (Note 5)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
2.500  
±15  
MAX  
UNITS  
V
V
REF  
V
REF  
V
REF  
Output Voltage  
Output Tempco  
Line Regulation  
I
I
= 0  
= 0  
2.475  
2.515  
OUT  
OUT  
ppm/°C  
4.75 V 5.25V  
5.25V V 4.75V  
0.01  
0.01  
LSB/V  
LSB/V  
DD  
SS  
V
REF  
Output Resistance  
0 ≤  
I
1mA  
OUT  
7.5  
kΩ  
REFCOMP Output Voltage  
I
= 0  
4.375  
V
OUT  
U
U
DIGITAL I PUTS A D DIGITAL OUTPUTS The denotes specifications that apply over the full  
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
High Level Input Voltage  
Low Level Input Voltage  
Digital Input Current  
Digital Input Capacitance  
High Level Output Voltage  
V
V
V
= 5.25V  
= 4.75V  
= 0V to V  
2.4  
V
V
IH  
IL  
DD  
DD  
IN  
0.8  
I
±10  
µA  
pF  
IN  
DD  
C
V
5
IN  
V
DD  
V
DD  
= 4.75V, I  
= 4.75V, I  
= 10µA  
= 400µA  
4.5  
V
V
OH  
OUT  
OUT  
4.0  
V
Low Level Output Voltage  
V
V
= 4.75V, I  
= 4.75V, I  
= 160µA  
= 1.6mA  
0.05  
0.10  
V
V
OL  
DD  
DD  
OUT  
OUT  
0.4  
±10  
15  
I
Hi-Z Output Leakage D15 to D0  
Hi-Z Output Capacitance D15 to D0  
Output Source Current  
V
OUT  
= 0V to V , CS High  
µA  
pF  
OZ  
DD  
C
OZ  
CS High (Note 11)  
I
I
V
OUT  
V
OUT  
= 0V  
–10  
10  
mA  
mA  
SOURCE  
SINK  
Output Sink Current  
= V  
DD  
3
LTC1608  
W U  
POWER REQUIRE E TS The denotes specifications that apply over the full operating temperature range,  
otherwise specifications are at TA = 25°C. (Note 5)  
SYMBOL  
PARAMETER  
CONDITIONS  
(Notes 12, 13)  
(Note 12)  
MIN  
4.75  
TYP  
MAX  
5.25  
UNITS  
V
V
Positive Supply Voltage  
Negative Supply Voltage  
V
V
DD  
SS  
4.75  
5.25  
I
Positive Supply Current  
Nap Mode  
CS = RD = 0V  
22  
1.5  
1
35  
2.4  
100  
mA  
mA  
µA  
DD  
CS = 0V, SHDN = 0V  
CS = 5V, SHDN = 0V  
Sleep Mode  
I
Negative Supply Current  
Nap Mode  
CS = RD = 0V  
32  
1
1
49  
100  
100  
mA  
µA  
µA  
SS  
CS = 0V, SHDN = 0V  
CS = 5V, SHDN = 0V  
Sleep Mode  
P
Power Dissipation  
Nap Mode  
CS = RD = 0V  
270  
7.5  
0.01  
420  
12  
1
mW  
mW  
mW  
D
CS = 0V, SHDN = 0V  
CS = 5V, SHDN = 0V  
Sleep Mode  
W U  
TI I G CHARACTERISTICS  
The denotes specifications that apply over the full operating temperature range,  
otherwise specifications are at TA = 25°C. (Note 5)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
500  
1.0  
TYP  
600  
1.45  
MAX  
UNITS  
kHz  
µs  
f
t
t
t
t
t
t
t
t
t
Maximum Sampling Frequency  
Conversion Time  
SMPL(MAX)  
1.8  
400  
2
CONV  
Acquisition Time  
(Notes 11, 14)  
ns  
ACQ  
Throughput Time (Acquisition + Conversion)  
CS to RD Setup Time  
1.67  
µs  
ACQ+CONV(MIN)  
(Notes 11, 12, 15)  
(Notes 11, 12)  
(Notes 11, 12)  
CS = Low (Note 12)  
(Note 12)  
0
ns  
1
2
3
4
5
6
CSto CONVSTSetup Time  
SHDNto CSSetup Time  
SHDNto CONVSTWake-Up Time  
CONVST Low Time  
10  
10  
ns  
ns  
400  
ns  
40  
ns  
CONVST to BUSY Delay  
C = 25pF  
L
36  
60  
ns  
ns  
80  
t
Data Ready Before BUSY↑  
ns  
ns  
7
32  
200  
–5  
t
t
t
Delay Between Conversions  
Wait Time RDAfter BUSY↑  
Data Access Time After RD↓  
(Note 12)  
(Note 12)  
ns  
ns  
8
9
C = 25pF  
L
25  
45  
30  
40  
50  
ns  
ns  
10  
C = 100pF (Note 11)  
L
60  
75  
ns  
ns  
t
Bus Relinquish Time  
50  
60  
ns  
ns  
11  
t
t
t
RD Low Time  
(Note 12)  
(Note 12)  
t
ns  
ns  
ns  
12  
13  
14  
10  
CONVST High Time  
40  
Aperture Delay of Sample-and-Hold  
2
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 2: All voltage values are with respect to ground with DGND, OGND  
Note 3: When these pin voltages are taken below V or above V , they  
SS DD  
will be clamped by internal diodes. This product can handle input currents  
greater than 100mA below V or above V without latchup.  
SS  
DD  
and AGND wired together unless otherwise noted.  
4
LTC1608  
ELECTRICAL CHARACTERISTICS  
Note 4: When these pin voltages are taken below V , they will be clamped  
Note 10: Signal-to-Noise Ratio (SNR) is measured at 5kHz and distortion  
is measured at 100kHz. These results are used to calculate Signal-to-Nosie  
Plus Distortion (SINAD).  
SS  
by internal diodes. This product can handle input currents greater than  
100mA below V without latchup. These pins are not clamped to V  
.
SS  
DD  
Note 5: V = 5V, V = 5V, f  
otherwise specified.  
= 500kHz, and t = t = 5ns unless  
Note 11: Guaranteed by design, not subject to test.  
Note 12: Recommended operating conditions.  
DD  
SS  
SMPL  
r
f
Note 6: Linearity, offset and full-scale specification apply for a single-  
Note 13: The falling CONVST edge starts a conversion. If CONVST returns  
high at a critical point during the conversion it can create small errors. For  
best performance ensure that CONVST returns high either within 250ns  
after conversion start or after BUSY rises.  
Note 14: The acquisition time would go up to 400ns and the conversion  
time would go up to 1.8µs. However, the throughput time (acquisition +  
conversion) is guaranteed by test to be 2µs max.  
+
ended A input with A grounded.  
IN  
IN  
Note 7: Integral nonlinearity is defined as the deviation of a code from a  
straight line passing through the actual endpoints of the transfer curve.  
The deviation is measured from the center of the quantization band.  
Note 8: Typical RMS noise at the code transitions.  
Note 9: Bipolar offset is the offset voltage measured from 0.5LSB when  
the output code flickers between 0000 0000 0000 0000 and 1111 1111  
1111 1111.  
Note 15: If RDprecedes CS, the output enable will be gated by CS.  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Integral Nonlinearity  
vs Output Code  
Differential Nonlinearity  
vs Output Code  
S/(N + D) vs Input Frequency  
and Amplitude  
1.0  
0.8  
2.0  
1.5  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 0dB  
IN  
0.6  
1.0  
V
V
= –20dB  
= –40dB  
IN  
IN  
0.4  
0.5  
0.2  
0
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.5  
–1.0  
–1.5  
–2.0  
0
16384  
32767  
–32768  
–16384  
0
16384  
32767  
1k  
10k  
FREQUENCY (Hz)  
100k  
1M  
–32768  
–16384  
CODE  
CODE  
1608 G01  
1608 G02  
1608 G03  
Signal-to-Noise Ratio  
vs Input Frequency  
Spurious-Free Dynamic Range  
vs Input Frequency  
Distortion vs Input Frequency  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–110  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–110  
THD  
3RD  
2ND  
10k  
FREQUENCY (Hz)  
1k  
10k  
100k  
1M  
10k  
INPUT FREQUENCY (Hz)  
1k  
100k  
1M  
1k  
100k  
1M  
INPUT FREQUENCY (Hz)  
1608 G04  
1608 G05  
1608 G06  
5
LTC1608  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Power Supply Feedthrough  
vs Ripple Frequency  
Input Common Mode Rejection  
vs Input Frequency  
Intermodulation Distortion  
0
–20  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
f
= 500kHz  
= 10mV  
RIPPLE  
f
f
f
= 500kHz  
SAMPLE  
V
SAMPLE  
IN1  
IN2  
= 96.56kHz  
–20  
= 99.98kHz  
–40  
–40  
–60  
–60  
–80  
–80  
–100  
–120  
–140  
–100  
–120  
–140  
A
VDD  
V
SS  
1k  
10k  
100k  
1M  
50  
100  
150  
250  
1k  
10k  
100k  
1M  
0
200  
INPUT FREQUENCY (Hz)  
INPUT FREQUENCY (Hz)  
FREQUENCY (kHz)  
1608 G08  
1608 G07  
1608 G14a  
U
U
U
PI FU CTIO S  
AIN+ (Pin 1): Positive Analog Input. The ADC converts the  
OGND (Pin 28): Digital Ground for Output Drivers.  
difference voltage between AIN+ and AINwith a differen-  
OVDD (Pin 29): Digital Power Supply for Output Drivers.  
Bypass to OGND with 10µF tantalum in parallel with 0.1µF  
ceramic.  
+
tial range of ±2.5V. AIN has a ±2.5V input range when  
AIN is grounded.  
AIN(Pin2):NegativeAnalogInput. Canbegrounded, tied  
RD (Pin 30): Read Input. A logic low enables the output  
drivers when CS is low.  
+
to a DC voltage or driven differentially with AIN  
.
VREF (Pin3):2.5VReferenceOutput.BypasstoAGNDwith  
2.2µF tantalum in parallel with 0.1µF ceramic.  
CONVST (Pin 31): Conversion Start Signal. This active  
low signal starts a conversion on its falling edge when CS  
is low.  
REFCOMP (Pin 4):4.375V (Nominal) Reference Compen-  
sation Pin. Bypass to AGND with 22µF tantalum in parallel  
with 0.1µF ceramic. This is not recommended for use as  
an external reference due to part-to-part output voltage  
variations and glitches that occur during the conversion.  
CS(Pin32):TheChipSelectInput.MustbelowfortheADC  
to recognize CONVST and RD inputs.  
SHDN (Pin 33): Power Shutdown. Drive this pin low with  
CS low for nap mode. Drive this pin low with CS high for  
sleep mode.  
AGND(Pins5to8):AnalogGrounds. Tietoanalogground  
plane.  
VSS (Pin 34): 5V Negative Supply. Bypass to AGND with  
10µF tantalum in parallel with 0.1µF ceramic.  
DVDD (Pin 9): 5V Digital Power Supply. Bypass to DGND  
with 10µF tantalum in parallel with 0.1µF ceramic.  
AVDD (Pin 35): 5V Analog Power Supply. Bypass to AGND  
with 10µF tantalum in parallel with 0.1µF ceramic.  
DGND (Pin 10): Digital Ground for Internal Logic. Tie to  
analog ground plane.  
AVDD (Pin 36): 5V Analog Power Supply. Bypass to AGND  
with 10µF tantalum in parallel with 0.1µF ceramic and  
connect this pin to Pin 35 with a 10resistor.  
D15 to D0 (Pins 11 to 26): Three-State Data Outputs. D15  
is the Most Significant Bit.  
BUSY (Pin 27): The BUSY output shows the converter  
status. It is low when a conversion is in progress. Data is  
valid on the rising edge of BUSY.  
6
LTC1608  
U
U
W
FU CTIO AL BLOCK DIAGRA  
10µF  
2.2µF  
10µF  
5V 10µF  
5V  
10Ω  
+
+
+
3
10  
36  
DD  
35  
9
V
AV  
AV  
DD  
DV  
DGND  
REF  
DD  
SHDN  
CS  
33  
32  
31  
30  
27  
CONTROL  
LOGIC  
µP  
CONVST  
RD  
CONTROL  
LINES  
REFCOMP  
7.5k  
AND  
4
2.5V  
REF  
1.75X  
TIMING  
+
4.375V  
BUSY  
22µF  
OV  
DD  
29  
28  
5V OR  
+
3V  
10µF  
+
OGND  
1
2
A
IN  
+
DIFFERENTIAL  
ANALOG INPUT  
±2.5V  
16-BIT  
SAMPLING  
ADC  
OUTPUT  
BUFFERS  
B15 TO B0  
16-BIT  
PARALLEL  
BUS  
A
IN  
D15 TO D0  
11 TO 26  
AGND AGND AGND AGND  
V
SS  
34  
1608 BD  
5
6
7
8
10µF  
+
–5V  
TEST CIRCUITS  
Load Circuits for Access Timing  
Load Circuits for Output Float Delay  
5V  
5V  
1k  
1k  
DN  
DN  
DN  
DN  
1k  
1k  
C
L
C
C
L
C
L
L
(A) Hi-Z TO V AND V TO V  
OH OL OH  
(B) Hi-Z TO V AND V TO V  
OL OH  
(A) V TO Hi-Z  
OH  
(B) V TO Hi-Z  
OL  
OL  
1608 TC01  
1608 TC02  
W U U  
U
APPLICATIO S I FOR ATIO  
CONVERSION DETAILS  
During the conversion, the internal differential 16-bit  
capacitive DAC output is sequenced by the SAR from the  
Most Significant Bit (MSB) to the Least Significant Bit  
The LTC1608 uses a successive approximation algorithm  
and internal sample-and-hold circuit to convert an analog  
signaltoa16-bitparalleloutput. TheADCiscompletewith  
a sample-and-hold, a precision reference and an internal  
clock. The control logic provides easy interface to micro-  
processors and DSPs. (Please refer to the Digital Interface  
section for the data format.)  
+
(LSB). Referring to Figure 1, the AIN and AIN inputs are  
acquired during the acquire phase and the comparator  
offset is nulled by the zeroing switches. In this acquire  
phase,adurationof480nswillprovideenoughtimeforthe  
sample-and-hold capacitors to acquire the analog signal.  
Duringtheconvertphase,thecomparatorzeroingswitches  
open, putting the comparator into compare mode. The  
input switches connect the CSMPL capacitors to ground,  
transferring the differential analog input charge onto the  
summing junctions. This input charge is successively  
Conversion start is controlled by the CS and CONVST  
inputs. At the start of the conversion, the successive  
approximation register (SAR) resets. Once a conversion  
cycle has begun, it cannot be restarted.  
7
LTC1608  
APPLICATIO S I FOR ATIO  
W U U  
U
3V Input/Output Compatible  
C
SMPL  
SAMPLE  
+
A
IN  
The LTC1608 operates on ±5V supplies, which makes the  
device easy to interface to 5V digital systems. This device  
can also talk to 3V digital systems: the digital input pins  
(SHDN, CS, CONVST and RD) of the LTC1608 recognize  
3V or 5V inputs. The LTC1608 has a dedicated output  
supply pin (OVDD) that controls the output swings of the  
digital output pins (D0 to D15, BUSY) and allows the part  
to talk to either 3V or 5V digital systems. The output is  
two’s complement binary.  
HOLD  
ZEROING SWITCHES  
HOLD  
C
SMPL  
SAMPLE  
A
IN  
HOLD  
HOLD  
+C  
DAC  
DAC  
+
–C  
COMP  
+V  
DAC  
Power Shutdown  
–V  
DAC  
The LTC1608 provides two power shutdown modes, Nap  
and Sleep, to save power during inactive periods. The Nap  
mode reduces the power by 95% and leaves only the  
digital logic and reference powered up. The wake-up time  
from Nap to active is 200ns. In Sleep mode, all bias  
currents are shut down and only leakage current remains  
(about 1µA). Wake-up time from Sleep mode is much  
longer since the reference circuit must power up and  
settle. Sleep mode wake-up time is dependent on the  
value of the capacitor connected to the REFCOMP (Pin 4).  
The wake-up time is 80ms with the recommended 22µF  
capacitor.  
16  
D15  
D0  
OUTPUT  
LATCHES  
SAR  
1608 F01  
Figure 1. Simplified Block Diagram  
compared with the binary-weighted charges supplied by  
the differential capacitive DAC. Bit decisions are made by  
the high speed comparator. At the end of a conversion, the  
differential DAC output balances the AIN and AIN input  
charges. The SAR contents (a 16-bit data word) which  
represent the difference of AIN and AIN are loaded into  
the 16-bit output latches.  
+
+
Shutdown is controlled by Pin 33 (SHDN). The ADC is in  
shutdown when SHDN is low. The shutdown mode is  
selected with Pin 32 (CS). When SHDN is low, CS low  
selects nap and CS high selects sleep.  
DIGITAL INTERFACE  
The A/D converter is designed to interface with micropro-  
cessors as a memory mapped device. The CS and RD  
control inputs are common to all peripheral memory  
interfacing. A separate CONVST is used to initiate a con-  
version.  
SHDN  
t
3
CS  
1608 F02a  
Internal Clock  
Figure 2a. Nap Mode to Sleep Mode Timing  
The A/D converter has an internal clock that runs the A/D  
conversion.Theinternalclockisfactorytrimmedtoachieve  
a typical conversion time of 1.45µs and a maximum  
conversion time of 1.8µs over the full temperature range.  
No external adjustments are required. The guaranteed  
maximumacquisitiontimeis400ns.Inaddition,athrough-  
put time (acquisition + conversion) of 2µs and a minimum  
sampling rate of 500ksps are guaranteed.  
SHDN  
t
4
CONVST  
1608 F02b  
Figure 2b. SHDN to CONVST Wake-Up Timing  
8
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
(e.g., CONVST low time >tCONV), accuracy is unaffected.  
For best results, keep t5 less than 500ns or greater than  
CS  
CONVST  
RD  
t
2
tCONV  
.
Figures 5 through 9 show several different modes of  
operation. In modes 1a and 1b (Figures 5 and 6), CS and  
RDarebothtiedlow.ThefallingedgeofCONVSTstartsthe  
conversion. The data outputs are always enabled and data  
can be latched with the BUSY rising edge. Mode 1a shows  
operationwithanarrowlogiclowCONVSTpulse. Mode1b  
shows a narrow logic high CONVST pulse.  
t
1
1608 F03  
Figure 3. CS top CONVST Setup Timing  
4
3
2
1
0
In mode 2 (Figure 7) CS is tied low. The falling edge of  
CONVST signal starts the conversion. Data outputs are in  
three-stateuntilreadbytheMPUwiththeRDsignal. Mode  
2 can be used for operation with a shared data bus.  
t
t
ACQ  
CONV  
In slow memory and ROM modes (Figures 8 and 9), CS is  
tied low and CONVST and RD are tied together. The MPU  
starts the conversion and reads the output with the com-  
bined CONVST-RD signal. Conversions are started by the  
MPU or DSP (no external sample clock is needed).  
750  
1000  
0
250  
500  
1250  
1500 1750  
2000  
CONVST LOW TIME, t (ns)  
5
In slow memory mode, the processor applies a logic low  
to RD (= CONVST), starting the conversion. BUSY goes  
low, forcing the processor into a wait state. The previous  
conversion result appears on the data outputs. When the  
conversion is complete, the new conversion results  
appear on the data outputs; BUSY goes high, releasing the  
processor and the processor takes RD (=CONVST) back  
high and reads the new conversion data.  
1608 F04  
Figure 4. Change in DNL vs CONVST Low Time. Be Sure the  
CONVST Pulse Returns High Early in the Conversion or After  
the End of Conversion  
Timing and Control  
Conversion start and data read operations are controlled  
by three digital inputs: CONVST, CS and RD. A falling edge  
applied to the CONVST pin will start a conversion after the  
ADC has been selected (i.e., CS is low). Once initiated, it  
cannot be restarted until the conversion is complete.  
Converter status is indicated by the BUSY output. BUSY is  
low during a conversion.  
In ROM mode, the processor takes RD (=CONVST) low,  
startingaconversionandreadingthepreviousconversion  
result. Aftertheconversioniscomplete, theprocessorcan  
read the new result and initiate another conversion.  
DIFFERENTIAL ANALOG INPUTS  
Driving the Analog Inputs  
We recommend using a narrow logic low or narrow logic  
high CONVST pulse to start a conversion as shown in  
Figures 5 and 6. A narrow low or high CONVST pulse  
prevents the rising edge of the CONVST pulse from upset-  
ting the critical bit decisions during the conversion time.  
Figure 4 shows the change of the differential nonlinearity  
error versus the low time of the CONVST pulse. As shown,  
if CONVST returns high early in the conversion (e.g.,  
CONVST low time <300ns), accuracy is unaffected. Simi-  
larly, if CONVST returns high after the conversion is over  
The differential analog inputs of the LTC1608 are easy to  
drive.Theinputsmaybedrivendifferentiallyorasasingle-  
endedinput(i.e.,theAINinputisgrounded).TheAIN+ and  
AIN inputs are sampled at the same instant. Any un-  
wanted signal that is common mode to both inputs will be  
reduced by the common mode rejection of the sample-  
and-hold circuit. The inputs draw only one small current  
9
LTC1608  
APPLICATIO S I FOR ATIO  
W U U  
U
t
CONV  
CS = RD = 0  
t
5
CONVST  
t
t
8
6
BUSY  
DATA  
t
7
DATA (N – 1)  
D15 TO D0  
DATA N  
D15 TO D0  
DATA (N + 1)  
D15 TO D0  
1608 F05  
Figure 5. Mode 1a. CONVST Starts a Conversion. Data Outputs Always Enabled  
(CONVST =  
)
t
CS = RD = 0  
CONVST  
t
8
CONV  
t
t
5
13  
t
t
6
6
BUSY  
DATA  
t
7
DATA (N – 1)  
D15 TO D0  
DATA N  
D15 TO D0  
DATA (N + 1)  
D15 TO D0  
1608 F06  
Figure 6. Mode 1b. CONVST Starts a Conversion. Data Outputs Always Enabled  
(CONVST =  
)
t
13  
t
t
t
8
CS = 0  
CONV  
5
CONVST  
BUSY  
RD  
t
6
t
t
11  
9
t
12  
t
10  
DATA N  
D15 TO D0  
DATA  
1608 F07  
Figure 7. Mode 2. CONVST Starts a Conversion. Data is Read by RD  
10  
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
t
t
8
CS = 0  
CONV  
RD = CONVST  
t
t
11  
6
BUSY  
DATA  
t
t
7
10  
DATA (N – 1)  
D15 TO D0  
DATA N  
D15 TO D0  
DATA N  
D15 TO D0  
DATA (N + 1)  
D15 TO D0  
1608 F08  
Figure 8. Mode 2. Slow Memory Mode Timing  
t
t
8
CONV  
CS = 0  
RD = CONVST  
t
t
11  
6
BUSY  
t
10  
DATA (N – 1)  
D15 TO D0  
DATA N  
D15 TO D0  
DATA  
1608 F09  
Figure 9. ROM Mode Timing  
10  
1
spike while charging the sample-and-hold capacitors at  
the end of conversion. During conversion, the analog  
inputs draw only a small leakage current. If the source  
impedance of the driving circuit is low, then the LTC1608  
inputs can be driven directly. As source impedance in-  
creases so will acquisition time (see Figure 10). For  
minimum acquisition time with high source impedance, a  
buffer amplifier should be used. The only requirement is  
that the amplifier driving the analog input(s) must settle  
after the small current spike before the next conversion  
starts (settling time must be 200ns for full throughput  
rate).  
0.1  
0.01  
1
10  
100  
1k  
10k  
SOURCE RESISTANCE ()  
1608 F10  
Choosing an Input Amplifier  
Figure 10. tACQ vs Source Resistance  
Choosing an input amplifier is easy if a few requirements  
are taken into consideration. First, to limit the magnitude  
of the voltage spike seen by the amplifier from charging  
the sampling capacitor, choose an amplifier that has a  
lowoutputimpedance(<100)attheclosed-loopband-  
width frequency. For example, if an amplifier is used in a  
gainof+1andhasaunity-gainbandwidthof50MHz,then  
the output impedance at 50MHz should be less than  
100. The second requirement is that the closed-loop  
bandwidth must be greater than 15MHz to ensure  
adequate small-signal settling for full throughput rate. If  
slower op amps are used, more settling time can be  
provided by increasing the time between conversions.  
11  
LTC1608  
W U U  
U
APPLICATIO S I FOR ATIO  
The best choice for an op amp to drive the LTC1608 will  
dependontheapplication. Generallyapplicationsfallinto  
two categories: AC applications where dynamic specifi-  
cations are most critical and time domain applications  
where DC accuracy and settling time are most critical.  
The following list is a summary of the op amps that are  
suitable for driving the LTC1608. More detailed informa-  
tion is available in the Linear Technology databooks, the  
LinearViewTM CD-ROM and on our web site at:  
minimize noise. A simple 1-pole RC filter is sufficient for  
manyapplications.Forexample,Figure11showsa3000pF  
capacitor from AIN+ to ground and a 100source resistor  
to limit the input bandwidth to 530kHz. The 3000pF  
capacitor also acts as a charge reservoir for the input  
sample-and-hold and isolates the ADC input from sam-  
pling glitch sensitive circuitry. High quality capacitors and  
resistors should be used since these components can add  
distortion. NPO and silver mica type dielectric capacitors  
haveexcellentlinearity.Carbonsurfacemountresistorscan  
also generate distortion from self heating and from damage  
that may occur during soldering. Metal film surface mount  
resistors are much less susceptible to both problems.  
www.linear-tech. com.  
LT®1007: Low Noise Precision Amplifier. 2.7mA supply  
current, ±5V to ±15V supplies, gain bandwidth product  
8MHz, DC applications.  
100  
LT1097:LowCost, LowPowerPrecisionAmplifier. 300µA  
supply current, ±5V to ±15V supplies, gain bandwidth  
product 0.7MHz, DC applications.  
1
+
ANALOG INPUT  
A
A
V
IN  
3000pF  
2
3
4
5
IN  
LTC1608  
LT1227:140MHzVideoCurrentFeedbackAmplifier.10mA  
supply current, ±5V to ±15V supplies, low noise and low  
distortion.  
REF  
REFCOMP  
AGND  
22µF  
LT1360: 37MHz Voltage Feedback Amplifier. 3.8mA sup-  
ply current, ±5V to ±15V supplies, good AC/DC specs.  
1608 F11  
LT1363: 50MHz Voltage Feedback Amplifier. 6.3mA sup-  
ply current, good AC/DC specs.  
Figure 11. RC Input Filter  
Input Range  
LT1364/LT1365: Dual and Quad 50MHz Voltage Feedback  
Amplifiers. 6.3mA supply current per amplifier, good  
AC/DC specs.  
The±2.5VinputrangeoftheLTC1608isoptimizedforlow  
noise and low distortion. Most op amps also perform well  
over this same range, allowing direct coupling to the  
analog inputs and eliminating the need for special transla-  
tion circuitry.  
LT1468: 90MHz, 22V/µs 16-Bit Accurate Operational  
Amplifier. 3.8mA supply current, excellent DC specs and  
very low distortion performance to 100kHz.  
Some applications may require other input ranges. The  
LTC1608differentialinputsandreferencecircuitrycanac-  
commodate other input ranges often with little or no addi-  
tional circuitry. The following sections describe the refer-  
enceandinputcircuitryandhowtheyaffecttheinputrange.  
LT1469: Dual 90MHz, 22V/µs 16-Bit Accurate Operational  
Amplifier. 4.1mA supply current, excellent DC specs and  
very low distortion performance to 100kHz.  
Input Filtering  
The noise and the distortion of the input amplifier and  
other circuitry must be considered since they will add to  
the LTC1608 noise and distortion. The small-signal band-  
width of the sample-and-hold circuit is 15MHz. Any noise  
ordistortionproductsthatarepresentattheanaloginputs  
will be summed over this entire bandwidth. Noisy input  
circuitry should be filtered prior to the analog inputs to  
Internal Reference  
The LTC1608 has an on-chip, temperature compensated,  
curvature corrected, bandgap reference that is factory  
trimmedto2.500V.Itisconnectedinternallytoareference  
amplifier and is available at VREF (Pin 3) (see Figure 12a).  
LinearView is a trademark of Linear Technology Corporation.  
12  
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
1
2
3
4
5
R1  
7.5k  
+
A
A
V
IN  
V
ANALOG INPUT  
2V TO 2.7V  
3
REF  
BANDGAP  
REFERENCE  
2.500V  
DIFFERENTIAL  
IN  
LTC1608  
REFCOMP  
4
REFERENCE  
AMP  
2V TO 2.7V  
4.375V  
LTC1450  
REF  
R2  
12k  
REFCOMP  
AGND  
22µF  
22µF  
R3  
16k  
AGND  
5
LTC1608  
1608 F13  
1608 F12a  
Figure 13. Driving VREF with a DAC  
Figure 12a. LTC1608 Reference Circuit  
Differential Inputs  
5V  
1
2
3
+
A
A
V
IN  
The LTC1608 has a unique differential sample-and-hold  
circuit that allows rail-to-rail inputs. The ADC will always  
ANALOG  
INPUT  
V
IN  
IN  
LT1019A-2.5  
+
convert the difference of AIN – AIN independent of the  
common mode voltage (see Figure 15a). The common  
mode rejection holds up to extremely high frequencies  
(see Figure 14a). The only requirement is that both inputs  
can not exceed the AVDD or VSS power supply voltages.  
Integral nonlinearity errors (INL) and differential nonlin-  
earity errors (DNL) are independent of the common mode  
voltage, however, the bipolar zero error (BZE) will vary.  
The change in BZE is typically less than 0.1% of the  
common mode voltage. Dynamic performance is also  
affected by the common mode voltage. THD will degrade  
astheinputsapproacheitherpowersupplyrail,from96dB  
with a common mode of 0V to 86dB with a common mode  
of 2.5V or 2.5V.  
V
OUT  
REF  
LTC1608  
4
REFCOMP  
+
22µF  
0.1µF  
5
AGND  
1608 F12b  
Figure 12b. Using the LT1019-2.5 as an External Reference  
A 7.5k resistor is in series with the output so that it can be  
easily overdriven by an external reference or other  
circuitry (see Figure 12b). The reference amplifier gains  
the voltage at the VREF pin by 1.75 to create the required  
internal reference voltage. This provides buffering  
between the VREF pin and the high speed capacitive DAC.  
Thereferenceamplifiercompensationpin(REFCOMP, Pin  
4) must be bypassed with a capacitor to ground. The  
reference amplifier is stable with capacitors of 22µF or  
greater.Usinga0.1µFceramicinparallelisrecommended.  
80  
70  
60  
50  
40  
30  
20  
10  
0
The VREF pin can be driven with a DAC or other means  
showninFigure13.Thisisusefulinapplicationswherethe  
peak input signal amplitude may vary. The input span of  
the ADC can then be adjusted to match the peak input  
signal, maximizing the signal-to-noise ratio. The filtering  
of the internal LTC1608 reference amplifier will limit  
the bandwidth and settling time of this circuit. A settling  
time of 20ms should be allowed for after a reference  
adjustment.  
1k  
10k  
100k  
1M  
INPUT FREQUENCY (Hz)  
1608 G14a  
Figure 14a. CMRR vs Input Frequency  
13  
LTC1608  
W U U  
U
APPLICATIO S I FOR ATIO  
Differential inputs allow greater flexibility for accepting  
different input ranges. Figure 14b shows a circuit that  
converts a 0V to 5V analog input signal with only an  
additional buffer that is not in the signal path.  
011...111  
011...110  
000...001  
000...000  
111...111  
111...110  
1
2
+
ANALOG INPUT  
A
A
IN  
IN  
0V TO  
5V  
3
+
V
REF  
100...001  
100...000  
±2.5V  
LTC1608  
(FS – 1LSB)  
INPUT VOLTAGE (A – A  
FS – 1LSB  
+
)
IN  
4
IN  
REFCOMP  
AGND  
1608 F15a  
22µF  
5
Figure 15a. LTC1608 Transfer Characteristics  
1608 F14b  
ANALOG  
INPUT  
1
2
+
A
A
IN  
Figure 14b. Selectable 0V to 5V or ±2.5V Input Range  
IN  
R1  
LTC1662  
R2  
100Ω  
40.2k  
Full-Scale and Offset Adjustment  
CS/LD  
SCK  
SDI  
V
OUTA  
GND  
V
CC  
OUTB  
LTC1608  
Figure 15a shows the ideal input/output characteristics  
for the LTC1608. The code transitions occur midway  
between successive integer LSB values (i.e., FS +  
0.5LSB, FS + 1.5LSB, FS + 2.5LSB,... FS – 1.5LSB,  
FS – 0.5LSB). The output is two’s complement binary with  
1LSB = FS – (FS)/65536 = 5V/65536 = 76.3µV.  
3
R3  
1.5M  
V
REF  
5V  
REF  
V
+
2.2µF  
4
5
REFCOMP  
AGND  
+
0.1µF  
80.6k  
1%  
22µF  
–5V  
OFFSET ADJ RANGE: ±0.125%  
FULL-SCALE ADJ RANGE: ±0.25%  
1608 F15b  
In applications where absolute accuracy is important,  
offset and full-scale errors can be adjusted to zero. Offset  
error must be adjusted before full-scale error. Figure 15b  
shows the extra components required for full-scale error  
adjustment. Zero offset is achieved by adjusting the offset  
Figure 15b. Offset and Full-Scale Adjust Circuit  
groundplaneisrequired.Layoutshouldensurethatdigital  
andanalogsignallinesareseparatedasmuchaspossible.  
Particular care should be taken not to run any digital track  
alongsideananalogsignaltrackorunderneaththeADC.The  
analog input should be screened by AGND.  
applied to the AIN input. For zero offset error, apply  
+
38µV (i.e., 0.5LSB) at AIN and adjust the offset at the  
AINinput by varying the output voltage of pin VOUTA from  
the LTC1662 until the output code flickers between 0000  
0000 0000 0000 and 1111 1111 1111 1111. For full-scale  
adjustment,aninputvoltageof2.499886V(FS/21.5LSBs)  
An analog ground plane separate from the logic system  
ground should be established under and around the ADC.  
Pin 5 to Pin 8 (AGNDs), Pin 10 (ADC’s DGND) and all other  
analog grounds should be connected to this single analog  
ground point. The REFCOMP bypass capacitor and the  
DVDD bypass capacitor should also be connected to this  
analog ground plane. No other digital grounds should be  
connected to this analog ground plane. Low impedance  
analog and digital power supply common returns are  
essential to low noise operation of the ADC and the foil  
width for these tracks should be as wide as possible. In  
+
is applied to AIN and the output voltage of pin VOUTB is  
adjusted until the output code flickers between 0111 1111  
1111 1110 and 0111 1111 1111 1111.  
BOARD LAYOUT AND GROUNDING  
Wire wrap boards are not recommended for high resolu-  
tion or high speed A/D converters. To obtain the best per-  
formance from the LTC1608, a printed circuit board with  
14  
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
applications where the ADC data outputs and control  
signals are connected to a continuously active micropro-  
cessor bus, it is possible to get errors in the conversion  
results. These errors are due to feedthrough from the  
microprocessor to the successive approximation com-  
parator. The problem can be eliminated by forcing the  
microprocessor into a WAIT state during conversion or by  
using three-state buffers to isolate the ADC data bus. The  
traces connecting the pins and bypass capacitors must be  
kept short and should be made as wide as possible.  
EXAMPLE LAYOUT  
Figures 17a, 17b, 17c, 17d and 17e show the schematic  
and layout of an evaluation board. The layout demon-  
stratestheproperuseofdecouplingcapacitorsandground  
plane with a 4-layer printed circuit board.  
DC PERFORMANCE  
The noise of an ADC can be evaluated in two ways: signal-  
to-noise raio (SNR) in frequency domain and histogram in  
time domain. The LTC1608 excels in both. Figure 19a  
demonstrates that the LTC1608 has an SNR of over 90dB  
in frequency domain. The noise in the time domain histo-  
gram is the transition noise associated with a high resolu-  
tion ADC which can be measured with a fixed DC signal  
applied to the input of the ADC. The resulting output codes  
are collected over a large number of conversions. The  
shape of the distribution of codes will give an indication of  
the magnitude of the transition noise. In Figure 18, the  
distribution of output codes is shown for a DC input that  
hasbeendigitized4096times.ThedistributionisGaussian  
and the RMS code transition noise is about 0.66LSB. This  
correspondstoanoiselevelof90.9dBrelativetofullscale.  
Adding to that the theoretical 98dB of quantization error  
for 16-bit ADC, the resultant corresponds to an SNR level  
of 90.1dB which correlates very well to the frequency  
domain measurements in Dynamic Performance section.  
The LTC1608 has differential inputs to minimize noise  
coupling. CommonmodenoiseontheAIN+ andAINleads  
will be rejected by the input CMRR. The AINinput can be  
+
used as a ground sense for the AIN input; the LTC1608  
+
will hold and convert the difference voltage between AIN  
and AIN. The leads to AIN+ (Pin 1) and AIN(Pin 2) should  
be kept as short as possible. In applications where this is  
not possible, the AIN and AIN traces should be run side  
by side to equalize coupling.  
+
SUPPLY BYPASSING  
High quality, low series resistance ceramic, 10µF or 22µF  
bypasscapacitorsshouldbeusedattheVDD andREFCOMP  
pins as shown in Figure 16 and in the Typical Application  
on the first page of this data sheet. Surface mount ceramic  
capacitors such as Taiyo Yuden’s LMK325BJ106MN and  
LMK432BJ226MM provide excellent bypassing in a small  
board space. Alternatively, 10µF tantalum capacitors in  
parallel with 0.1µF ceramic capacitors can be used. By-  
pass capacitors must be located as close to the pins as  
possible. The traces connecting the pins and the bypass  
capacitorsmustbekeptshortandshouldbemadeaswide  
as possible.  
DYNAMIC PERFORMANCE  
The LTC1608 has excellent high speed sampling capabil-  
ity. Fast fourier transform (FFT) test techniques are used  
to test the ADC’s frequency response, distortions and  
1
+
DIGITAL  
SYSTEM  
LTC1608  
AV AV  
A
IN  
A
IN  
V
V
DV  
DGND OV  
10  
OGND  
28  
REFCOMP AGND  
REF  
SS  
DD  
DD  
DD  
9
DD  
29  
ANALOG  
INPUT  
CIRCUITRY  
2
3
4
5, 6, 7, 8 34  
36  
35  
+
2.2µF  
10µF  
22µF  
10µF 10µF 10µF  
10µF  
1608 F16  
Figure 16. Power Supply Grounding Practice  
15  
LTC1608  
W U U  
U
APPLICATIO S I FOR ATIO  
E5  
3V  
E2  
–5V  
C28  
C8  
0.1µF  
R6  
JP1  
OV  
DD  
+
22µF  
10Ω  
E1  
5V  
OV  
DD  
+
+
C13  
22µF  
C12  
22µF  
U5  
C7  
1µF  
E6  
GND  
TC7SH08FUTE85L  
5V  
J2  
CONVERT  
START  
E3  
REF  
R2  
R1  
R4 10k  
U1 LTC1608  
R3  
R5  
V
JP3  
C6  
1µF  
1
2
3
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
10k  
51k  
5V  
10Ω  
+
10k  
+
A
A
A
A
AV  
IN  
IN  
IN  
DD1  
C1  
0.1µF  
J1  
CONN20  
C11  
2.2µF  
AV  
IN  
DD2  
C5 1µF  
E7  
GND  
1
3
5
7
9
OV  
DD  
V
V
SS  
REF  
U2 MC74HC574ADT  
C10 22µF 4  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
CLK  
MSB  
REFCOMP SHDN  
OE  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
V
CC  
5
6
7
2
AGND  
AGND  
AGND  
AGND  
CS  
CONV  
RD  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
3
11  
4
OV  
DD  
C9  
1µF  
5V  
8
9
C4 1µF  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
39  
5
OV  
DD  
E4  
GND  
6
DV  
OGND  
BUSY  
D0  
DD  
10  
11  
12  
13  
14  
15  
16  
17  
18  
7
DGND  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
8
9
D1  
10  
D2  
GND CLK  
D3  
D4  
C3 0.1µF  
OV  
D5  
DD  
U3 74HC574  
D6  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
V
CC  
D8  
D7  
LSB  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
3
4
5
6
5V  
C21  
0.1µF  
C27  
100pF  
7
8
R7  
50Ω  
9
J3  
IN  
3
2
8
OV  
+
DD  
+
A
10  
+
1
U4A  
LT1469  
R17  
10k  
A
C14  
1000pF  
IN  
GND CLK  
(U1-1)  
JP2  
R11  
50Ω  
R13  
50Ω  
C20  
0.1µF  
4
U6  
C25  
100pF  
–5V  
R8 402Ω  
C15 10pF  
C17  
10pF  
TC7SH04F  
C24  
100pF  
C26  
1000pF  
C18  
10pF  
R15  
100Ω  
C16 10pF  
R9  
6
402Ω  
R14  
50Ω  
R12  
50Ω  
7
U4B  
LT1469  
A
IN  
R10  
50Ω  
(U1-2)  
J4  
IN  
5
C22  
100pF  
C23  
100pF  
+
A
R16  
10k  
C19  
1000pF  
Figure 17a. LTC1608 Suggested Evaluation Circuit Schematic  
16  
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
Figure 17b. Suggested Evaluation Circuit Board.  
Component Side Silkscreen and Signal Traces  
Figure 17c. Suggested Evaluation Circuit Board.  
Bottom Side Showing Signal Traces  
ANALOG GROUND PLANE  
DIGITAL GROUND PLANE  
ANALOG GROUND PLANE  
DIGITAL GROUND PLANE  
Figure 17d. Suggested Evaluation Circuit Board. Inner Layer 1  
Showing Separate Analog and Digital Ground Planes  
Figure 17e. Suggested Evaluation Circuit Board. Inner Layer 2  
Showing Separate Analog and Digital Ground Planes  
2500  
2000  
1500  
1000  
500  
noise at the rated throughput. By applying a low distortion  
sine wave and analyzing the digital output using an FFT  
algorithm, the ADC’s spectral content can be examined for  
frequenciesoutsidethefundamental. Figures19aand19b  
show typical LTC1608 FFT plots.  
Signal-to-Noise Ratio  
The signal-to-noise plus distortion ratio [S/(N + D)] is the  
ratio between the RMS amplitude of the fundamental  
input frequency to the RMS amplitude of all other fre-  
quency components at the A/D output. The output is band  
limited to frequencies from above DC and below half the  
sampling frequency. Figure 19a shows a typical spectral  
content with a 500kHz sampling rate and a 3kHz input.  
0
–4  
–5  
–3 –2 –1  
0
1
2
3
4
5
CODE  
1608 F18  
Figure 18. Histogram for 4096 Conversions  
17  
LTC1608  
W U U  
U
APPLICATIO S I FOR ATIO  
98  
92  
86  
80  
74  
68  
62  
56  
50  
16  
0
15  
14  
13  
12  
11  
10  
9
–20  
–40  
–60  
–80  
–100  
–120  
–140  
8
1k  
10k  
100k  
1M  
50  
100  
150  
250  
0
200  
FREQUENCY (Hz)  
FREQUENCY (kHz)  
1608 F20  
1608 F19a  
Figure 20. Effective Bits and Signal/(Noise + Distortion)  
vs Input Frequency  
Figure 19a. This FFT of the LTC1608’s Conversion of a  
Full-Scale 3kHz Sine Wave Shows Outstanding Response  
with a Very Low Noise Floor When Sampling at 500ksps  
Total Harmonic Distortion  
0
Total harmonic distortion (THD) is the ratio of the RMS  
sumofallharmonicsoftheinputsignaltothefundamental  
itself. The out-of-band harmonics alias into the frequency  
band between DC and half the sampling frequency. THD is  
expressed as:  
–20  
–40  
–60  
–80  
V22 + V32 + V42 +...Vn2  
THD = 20Log  
–100  
–120  
–140  
V1  
where V1 is the RMS amplitude of the fundamental fre-  
quency and V2 through Vn are the amplitudes of the  
secondthroughnthharmonics.THDvsInputFrequencyis  
shown in Figure 21. The LTC1608 has good distortion  
performance up to the Nyquist frequency and beyond.  
50  
100  
150  
250  
0
200  
FREQUENCY (kHz)  
1608 F19b  
Figure 19b. Even with Inputs at 100kHz, the  
LTC1608’s Dynamic Linearity Remains Robust  
The dynamic performance is excellent for input frequen-  
cies up to and beyond the Nyquist limit of 250kHz.  
Intermodulation Distortion  
If the ADC input signal consists of more than one spectral  
component, the ADC transfer function nonlinearity can  
produce intermodulation distortion (IMD) in addition to  
THD. IMD is the change in one sinusoidal input caused by  
the presence of another sinusoidal input at a different  
frequency.  
Effective Number of Bits  
The effective number of bits (ENOBs) is a measurement of  
the resolution of an ADC and is directly related to the  
S/(N + D) by the equation:  
ENOB = [S/(N + D) – 1.76]/6.02  
Iftwopuresinewavesoffrequenciesfaandfbareapplied  
where ENOB is the effective number of bits of resolution to the ADC input, nonlinearities in the ADC transfer  
and S/(N + D) is expressed in dB. At the maximum function can create distortion products at the sum and  
samplingrateof500kHz, theLTC1608maintainsabove14 difference frequencies of mfa ±nfb, where m and n = 0,  
bits up to the Nyquist input frequency of 250kHz (refer to 1, 2, 3, etc. Forexample, the2ndorderIMDtermsinclude  
Figure 20).  
18  
LTC1608  
W U U  
APPLICATIO S I FOR ATIO  
U
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–110  
(fa ± fb). If the two input sine waves are equal in  
magnitude, the value (in decibels) of the 2nd order IMD  
products can be expressed by the following formula:  
Amplitude at (fa ± fb)  
IMD fa± fb = 20Log  
(
)
Amplitude at fa  
THD  
3RD  
2ND  
Peak Harmonic or Spurious Noise  
The peak harmonic or spurious noise is the largest spec-  
tral component excluding the input signal and DC. This  
value is expressed in decibels relative to the RMS value of  
a full-scale input signal.  
10k  
INPUT FREQUENCY (Hz)  
1k  
100k  
1M  
1608 F21  
Figure 21. Distortion vs Input Frequency  
Full-Power and Full-Linear Bandwidth  
0
The full-power bandwidth is that input frequency at which  
the amplitude of the reconstructed fundamental is  
reduced by 3dB for a full-scale input signal.  
–20  
–40  
–60  
The full-linear bandwidth is the input frequency at which  
the S/(N + D) has dropped to 84dB (13.66 effective bits).  
The LTC1608 has been designed to optimize input band-  
width, allowingtheADCtoundersampleinputsignalswith  
frequenciesabovetheconverter’sNyquistFrequency. The  
noise floor stays very low at high frequencies; S/(N + D)  
becomes dominated by distortion at frequencies far  
beyond Nyquist.  
–80  
–100  
–120  
–140  
50  
100  
150  
250  
0
200  
FREQUENCY (kHz)  
1608 F22  
Figure 22. Intermodulation Distortion Plot  
U
PACKAGE DESCRIPTIO  
G Package  
36-Lead Plastic SSOP (5.3mm)  
(Reference LTC DWG # 05-08-1640)  
12.67 – 12.93*  
(.499 – .509)  
5.20 – 5.38**  
(.205 – .212)  
1.73 – 1.99  
(.068 – .078)  
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19  
0° – 8°  
7.65 – 7.90  
(.301 – .311)  
.65  
(.0256)  
BSC  
.13 – .22  
.55 – .95  
(.005 – .009)  
(.022 – .037)  
.05 – .21  
(.002 – .008)  
.25 – .38  
(.010 – .015)  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS  
MILLIMETERS  
2. DIMENSIONS ARE IN  
(INCHES)  
G36 SSOP 0501  
5
7
8
1
2
3
4
6
9 10 11 12 13 14 15 16 17 18  
3. DRAWING NOT TO SCALE  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED .152mm (.006") PER SIDE  
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
19  
LTC1608  
U
TYPICAL APPLICATIO  
Using the LTC1608 and Two LTC1391s as an 8-Channel Differential 16-Bit ADC System  
5V  
2.2µF  
10µF  
5V 10µF  
5V 10µF  
10Ω  
36  
+
+
+
+
+
LTC1391  
3
35  
10  
9
1µF  
16  
15  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
8
+
+
DV  
DD  
V
AV  
AV  
DGND  
REF  
DD  
DD  
CH0  
CH0  
V
SHDN 33  
CS 32  
CH1  
CH2  
CH3  
CH4  
CH5  
CH6  
CH7  
D
–5V  
1µF  
LTC1608  
CONTROL  
LOGIC  
AND  
TIMING  
V
µP  
CONTROL  
LINES  
CONVST 31  
RD 30  
7.5k  
REFCOMP  
4
D
OUT  
2.5V  
REF  
1.75X  
+
4.375V  
D
IN  
BUSY 27  
22µF  
CS  
OV  
DD  
29  
5V OR  
3V  
10µF  
CLK  
+
+
A
IN  
1
+
OGND 28  
CH7  
CH0  
GND  
+
3000pF  
3000pF  
16-BIT  
SAMPLING  
ADC  
OUTPUT  
BUFFERS  
B15 TO B0  
16-BIT  
PARALLEL  
BUS  
5V  
A
D15 TO D0  
2
IN  
LTC1391  
1µF  
11 TO 26  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
+
AGND AGND AGND AGND V  
SS  
34  
V
CH0  
CH1  
CH2  
CH3  
CH4  
CH5  
CH6  
CH7  
1608 TA03  
5
6
7
8
D
–5V  
10µF  
+
V
+
–5V  
D
OUT  
D
D
IN  
IN  
µP  
CONTROL  
LINES  
CS  
CS  
CLK  
CLK  
GND  
CH7  
RELATED PARTS  
SAMPLING ADCs  
PART NUMBER  
LTC1410  
LTC1415  
LTC1418  
LTC1419  
LTC1604  
LTC1605  
LTC1606  
DESCRIPTION  
COMMENTS  
12-Bit, 1.25Msps, ±5V ADC  
71.5dB SINAD at Nyquist, 150mW Dissipation  
55mW Power Dissipation, 72dB SINAD  
15mW, Serial/Parallel ±10V  
12-Bit, 1.25Msps, Single 5V ADC  
14-Bit, 200ksps, Single 5V ADC  
Low Power 14-Bit, 800ksps ADC  
16-Bit, 333ksps, ±5V ADC  
True 14-Bit Linearity, 81.5dB SINAD, 150mW Dissipation  
90dB SINAD, 220mW Power Dissipation, Pin Compatible with LTC1608  
±10V Inputs, 55mW, Byte or Parallel I/O, Pin Compatible with LTC1606  
±10V Inputs, 75mW, Byte or Parallel I/O, Pin Compatible with LTC1605  
16-Bit, 100ksps, Single 5V ADC  
16-Bit, 250ksps, Single 5V ADC  
DACs  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC1595  
16-Bit Serial Multiplying I  
16-Bit Serial Multiplying I  
DAC in SO-8  
DAC  
±1LSB Max INL/DNL, Low Glitch, DAC8043 16-Bit Upgrade  
±1LSB Max INL/DNL, Low Glitch, AD7543/DAC8143 16-Bit Upgrade  
±1LSB Max INL/DNL, Low Glitch, 4 Quadrant Resistors  
Low Power, Low Gritch, 4-Quadrant Multiplication  
OUT  
LTC1596  
OUT  
LTC1597/LTC1591  
LTC1650  
16-Bit/14-Bit Parallel, Multiplying DACs  
16-Bit Serial V DAC  
OUT  
1608f LT/TP 0601 2K • PRINTED IN USA  
20 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
(408)432-1900 FAX:(408)434-0507 www.linear-tech.com  
LINEAR TECHNOLOGY CORPORATION 2000  

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