LTC3459EDCBPBF [Linear]
10V Micropower Synchronous Boost Converter; 10V微功率同步升压转换器
| 型号： | LTC3459EDCBPBF |
| 厂家： | 
Linear |
| 描述： | 10V Micropower Synchronous Boost Converter |
| 文件： | 总12页 (文件大小：226K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LTC3459
10V Micropower
Synchronous Boost Converter
FEATURES
DESCRIPTION
TheLTC®3459isalowcurrent,highefficiencysynchronous
boost converter intended for low power, size constrained
portable applications. The LTC3459 can be powered from
a single lithium ion battery, a 2- to 3-cell stack of alkaline
or nickel batteries, or any low impedance voltage source
between 1.5V and 5.5V. The output is programmable via
an external divider between 2.5V and 10V. Although the
n
Small Solution Size
n
>85% Efficiency over Wide Load Range
n
Internal Synchronous Rectifier
n
V Range: 1.5V to 5.5V
IN
n
5V at 30mA from 3.3V Input
n
3.3V at 20mA from 2 AA Cell Input
n
Programmable Output Voltages Up to 10V
Burst Mode® Operation
n
part is primarily intended for boost applications, V
maintain regulation below V (at reduced efficiency).
will
OUT
n
Inrush Current Limiting
Output Disconnect in Shutdown
IN
n
The LTC3459 offers Burst Mode operation with a fixed
peak current, providing high conversion efficiency over
a wide range of load currents. During start-up, inductor
current is controlled preventing the inrush surge current
found in many boost converters. In shutdown the output
is disconnected from the input and quiescent current is
reduced to <1μA.
n
Ultralow Quiescent (10μA) and Shutdown (<1μA)
Currents
n
Low Profile 2mm × 2mm DFN, 2mm × 3mm DFN or
SOT-23 Package
APPLICATIONS
The LTC3459 is offered in low profile 6-pin 2mm × 2mm
DFN, 2mm × 3mm DFN or SOT-23 (ThinSOTTM) packages,
allowing a tiny footprint for the total solution.
, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology
Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
n
General Purpose Micropower Boost
n
Digital Cameras
n
PDAs
LCD Bias
Small OLED Displays
Supercap Charging
n
n
n
TYPICAL APPLICATION
5V to 8V Converter
Efficiency
100
V
V
= 5V
IN
OUT
= 8V
22μH
90
80
70
60
50
SW
V
OUT
8V
5V
V
V
OUT
IN
30mA
2M
47pF
LTC3459
OFF ON
SHDN
GND
FB
1μF
4.7μF
365k
3459 TA01a
0.01
0.1
1
10
100
I
(mA)
LOAD
3459 TA01b
3459fc
1
LTC3459
ABSOLUTE MAXIMUM RATINGS
Referred to GND (Note 1)
Storage Temperature Range.................. –65°C to 150°C
Reflow Temperature.............................................. 260°C
Lead Temperature, S6 Package
V , FB Voltage ........................................... –0.3V to 7V
OUT
IN
V
, SHDN Voltage ................................. –0.3V to 10V
SW Voltage .............................................. –0.3V to 12V
Operating Temperature Range
(Soldering, 10 sec) .......................................... 300°C
(Notes 2, 3) ......................................... –40°C to 85°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
TOP VIEW
6
5
4
SW
GND
FB
V
1
2
3
6
5
4
V
IN
SHDN
1
2
3
IN
SW 1
GND 2
FB 3
6 V
5 V
IN
7
V
7
V
OUT
GND
SW
OUT
OUT
SHDN
FB
4 SHDN
S6 PACKAGE
DC PACKAGE
DCB PACKAGE
6-LEAD PLASTIC TSOT-23
6-LEAD (2mm s 2mm) PLASTIC DFN
6-LEAD (2mm × 3mm) PLASTIC DFN
T
= 125°C, θ = 192°C/W
JMAX
JA
T
JMAX
= 125°C, θ = 64°C/W
JA
EXPOSED PAD (PIN 7) IS GND, MUST BE SOLDERED TO PCB
T
= 125°C, θ = 102°C/W
JA
EXPOSED PAD (PIN 7) IS GND, MUST BE SOLDERED TO PCB
JMAX
ORDER INFORMATION
LEAD FREE FINISH
LTC3459EDC#PBF
LTC3459EDCB#PBF
LTC3459ES6#PBF
TAPE AND REEL
PART MARKING
LDTG
PACKAGE DESCRIPTION
TEMPERATURE RANGE
–40°C to 85°C
LTC3459EDC#TRPBF
LTC3459EDCB#TRPBF
LTC3459ES6#TRPBF
Low Profile (2mm × 2mm) Plastic DFN
Low Profile (2mm × 3mm) Plastic DFN
Low Profile SOT-23
LDMM
–40°C to 85°C
LTAHA
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3459fc
2
LTC3459
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.3V, VOUT = 5V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
IN
l
Input Voltage Range
1.5
5.5
20
1
V
μA
μA
V
V
V
Quiescent Current
Shutdown Current
SHDN = V
10
IN
IN
CC
SHDN = GND
0.1
OUT
l
Programmable Voltage Range
2.5
10
4
V
μA
μA
V
OUT
V
OUT
Quiescent Supply Current
Shutdown Current
SHDN = V
2
CC
SHDN = GND
0.1
1
Reference
l
l
Feedback Voltage
V
= 3.3V, V
= 7.5V
OUT
1.19
1.22
10
1.25
50
V
IN
FB Input Leakage Current
Converter Performance
Measured on FB
nA
Peak Switch Current (V = 3.3V)
L = 22μH
60
75
400
0
90
mA
ns
IN
t
Timer (V = 3.3V, V
= 5V)
Varies by 1/(V
L = 22μH
– V )
225
550
OFF
IN
OUT
OUT
IN
Zero Current Comparator Threshold
Main NMOS Switch
On-Resistance
mA
V
V
= 5V
2.8
Ω
OUT
Leakage Current
= 10V, V
= 10V
0.01
1
μA
SWITCH
OUT
Main PMOS Switch
On-Resistance
V
V
= 5V
4.2
Ω
OUT
Leakage Current
= 5V, V
= 5V, V
= 0V
OUT
0.02
2
1
μA
IN
SWITCH
Logic Inputs
SHDN Threshold (Rising Edge)
SHDN Hysteresis
0.3
V
mV
nA
80
0
SHDN Input Leakage Current
SHDN = 3.3V
50
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3459E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
3459fc
3
LTC3459
TYPICAL PERFORMANCE CHARACTERISTICS
(TA = 25°C, unless otherwise noted).
VIN and VOUT Quiescent Current
vs Temperature
Minimum ROUT vs VIN
Maximum POUT vs VIN
16
4000
400
350
300
250
200
150
100
50
V
V
= 3.3V
= 5V
V
V
V
V
= 10V
= 7.5V
= 5V
V
V
V
V
= 10V
= 7.5V
= 5V
IN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
14
12
3500
3000
= 3.3V
= 3.3V
L = 22μH
L = 22μH
I
IN
10
8
2500
2000
1500
1000
500
6
4
I
OUT
2
0
0
0
–20
0
40
60
80
–40
20
2
2.5
3.5
(V)
4
4.5
5
5.5
1.5
3
3.5
(V)
4.5
5
5.5
1.5
2
2.5
3
4
TEMPERATURE (°C)
V
V
IN
IN
3459 G03
3459 G01
3459 G02
Switching Frequency
vs VIN at Various VOUTs
N-Channel and P-Channel
MOSFET RDS(ON) vs Temperature
VOUT Regulation vs VIN and COUT
6
5
4
3
3.0
2.5
2.0
1.5
1.0
0.5
2.0
1.5
V
= 5V
V
V
V
V
= 10V
= 7.5V
= 5V
OUT
4.7μF
10μF
22μF
47μF
OUT
OUT
OUT
OUT
= 3.3V
PCH
1.0
L = 22μH
V
= 5V
OUT
L = 22μH
0.5
NCH
0
–0.5
–1.0
–1.5
–2.0
2
1
0
40
TEMPERATURE (°C)
80
–40 –20
0
20
60
3.5
(V)
1.5
2
2.5
3
4
4.5
5
5.5
3.5
(V)
4
1.5
2
2.5
3
4.5
5
5.5
V
V
IN
IN
3459 G06
3459 G04
3459 G05
Shutdown Threshold Voltage
vs Temperature
Burst Cycle
Switch Pin Waveform
1.2
1.0
0.8
0.6
SW
CURRENT
50mA/DIV
SHDN RISING
SHDN FALLING
SW
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
0.4
0.2
0
3459 G08
3459 G09
V
V
= 3.3V
OUT
1μs/DIV
V
V
= 3.3V
OUT
100ns/DIV
IN
IN
= 5V
= 5V
L = 22μH
L = 22μH
40
TEMPERATURE (°C)
80
–40 –20
0
20
60
3459 G07
3459fc
4
LTC3459
TYPICAL PERFORMANCE CHARACTERISTICS
(TA = 25°C, unless otherwise noted).
VOUT AC Ripple
Burst Cycle
Burst Cycle
V
OUT
50mV/DIV
SW
CURRENT
50mA/DIV
SW
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
3459 G11
3459 G10
3459 G12
V
= 5V
1μs/DIV
V
V
= 3.3V
= 5V
5μs/DIV
V
V
= 2V
1μs/DIV
250μs/DIV
3459 G17
IN
V
IN
OUT
L = 22μH
IN
OUT
= 10V
= 10V
OUT
L = 22μH
L = 22μH
C
C
= 4.7μF
= 47pF
OUT
FF
VOUT Regulated Below
VIN Burst Cycle
Shorted Output
Start-Up
V
OUT
VOLTAGE
50mA/DIV
SW
CURRENT
50mA/DIV
SW
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
INDUCTOR
CURRENT
50mA/DIV
INPUT
CURRENT
50mA/DIV
3459 G15
3459 G13
3459 G14
V
V
= 3.6V
= 0V TO 8V
V
V
= 5V
= 3.5V
1μs/DIV
V
V
= 5V
500ns/DIV
IN
OUT
IN
OUT
IN
OUT
= 0V
L = 22μH
= 2.2μF
L = 22μH
L = 22μH
C
IN
Load Steps
Load Steps
V
V
OUT
OUT
AC RIPPLE
50mV/DIV
AC RIPPLE
50mV/DIV
WITH 5kΩ
(TRACE 2
WITH 50kΩ
(TRACE 2
GROUNDED)
TO 500Ω
(TRACE 2 = 5V)
GROUNDED)
TO 500Ω
(TRACE 2 = 5V)
3459 G16
V
V
= 3.6V
OUT
L = 22μH
100μs/DIV
V
V
= 3.6V
OUT
L = 22μH
100μs/DIV
IN
IN
= 8V
= 8V
C
C
= 4.7μF
C
C
= 4.7μF
OUT
FF
OUT
= 47pF
FF
= 47pF
3459fc
5
LTC3459
PIN FUNCTIONS (DC/DCB/S6 Packages)
V (Pin 1/Pin 6/Pin 6): Input Supply Pin. Bypass V with
GND(Pin5/Pin5/Pin2):SignalandPowerGround.Provide
IN
IN
a low ESR, ESL ceramic capacitor of at least 1μF.
a short, direct PCB path between GND and the (–) side of
the filter capacitors on V and V
.
IN
OUT
V
(Pin 2/Pin 2/Pin 5): Regulated Output Voltage of
OUT
the Boost Regulator. Bypass V
with a low ESR, ESL
SW (Pin 6/Pin 4/Pin 1): Switch Pin. Connect a 15μH to
OUT
ceramic capacitor between 2.2μF and 10μF. V
increases with smaller capacitors.
ripple
33μHinductorbetweenSWandV .KeepPCBtracelengths
OUT
IN
as short and wide as possible to reduce EMI and voltage
overshoot. If the inductor current falls to zero, the internal
P-channel MOSFET synchronous rectifier is turned off to
prevent reverse charging of the inductor.
SHDN(Pin3/Pin1/Pin4):MasterShutdownInput.Driving
SHDN low disables all IC functions and reduces quiescent
current from the battery to less than 1μA. This pin must
be pulled above 1V to enable the IC.
Exposed Pad (Pin 7/Pin 7, DC and DCB Packages Only):
Ground. The Exposed Pad must be soldered to PCB.
FB(Pin4/Pin3/Pin3):InputtotheBurstModeComparator.
An external resistor divider connected between V
GND and this pin sets the output voltage to:
,
OUT
V
= 1.22(1 + R1/R2)
OUT
BLOCK DIAGRAM
V
CC
SW
V
–
IN
V
SELECT
t
OFF
t
OFF
V
OUT
TIMER
+
I
PEAK
Q
SD
R
SW1
I
V
BEST
ZO
QB
I
ZERO
DETECT
Q
S
P/~N
I
V
OUT
FB
QB RD
THERMAL
SD
SLEEP
DELAY
P-DRIVE
V
SELECT
S
Q
ZO
R1
R2
RD QB
–
+
V
CC
V
BEST
HYSTCOMP
I
PEAK
DETECT
V
CC
N-DRIVE
REFOK
N-DRIVE
SDB
REFERENCE
P-DRIVE
SD
SD
SDB
GND
OFF ON
SHDN
3459 BD
3459fc
6
LTC3459
OPERATION
Operation
converter disconnects V
from V during shutdown to
OUT IN
avoid loading the input power source.
The LTC3459 synchronous boost converter utilizes a
Burst Mode control technique to achieve high efficiency
over a wide dynamic range. A 2.5% accurate comparator
Peak Current Overshoot
The LTC3459’s peak current comparator has a delay of ap-
proximately 100ns from the time inductor current reaches
currentlimituntiltheinternalN-channelMOSFETturnsoff.
This delay causes the peak current to overshoot based on
is used to monitor the output voltage (V ), if V
is
OUT
OUT
above the comparator threshold, no switching occurs and
only quiescent current (10μA) is drawn from the power
source.WhenV dropsbelowthecomparatorthreshold,
OUT
the inductor value and V , as follows (Figure 2 is based
IN
switchingcommencesandtheoutputcapacitorischarged.
During the on time of the switching period, inductor cur-
rent is ramped through an internal N-channel MOSFET to
GND until a peak current (75mA) is detected. A P-channel
on a 65mA initial I ).
LIMIT
V
IN
IPEAK = ILIMIT + 100ns
(
)
L
MOSFET connects the inductor to V
during the off time
OUT
delivering energy to the load. The off time is controlled by
an internal timer which is proportional to 1/(V – V ).
t
Timer
OFF
OUT
IN
The LTC3459’s t timer is designed to keep the inductor
OFF
AnticrossconductioncircuitryensurestheN-andP-chan-
currentcontinuousduringaBurstModeswitchingpacket,
therebyincreasingcurrentcapabilityattheoutput.Alarger
inductorvaluewillhavelowerpeak-to-peakcurrentripple,
increasing the available current to the load. This improve-
nel switches are never on simultaneously.
Only three power components and two feedback resistors
arerequiredtocompletethedesignoftheboostconverter,
an external Schottky diode is not required. The high op-
erating frequency allows the use of low value, low profile
inductors and tiny external ceramic capacitors. The boost
ment is offset somewhat by the reduced I
overshoot.
PEAK
The t timer is designed to maintain a relatively constant
OFF
peak-to-peak current in the inductor despite V changes.
IN
~50mV
P-P
V
OUT
AC
RIPPLE
I
PEAK
~100mA
t
t
t
t
OFF
OFF
P
OFF
P
OFF
P
N
P
N
N
N
P
N
N
BURST ON
I
WAIT
SLEEP
BURST ON
ZERO
3459 F01
Figure 1. Inductor Current and VOUT Ripple Waveforms
110
100
90
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
15μH
22μH
80
33μH
70
60
50
1.5
4
4.5
2
2.5
3
3.5
5
5.5
7.5
3459 F03
0.5
4.5
– V (V)
6.5
1.5 2.5 3.5
V
5.5
8.5
3459 F02
V
(V)
IN
OUT
IN
Figure 2. Typical IPEAK Values
Figure 3. tOFF Times
3459fc
7
LTC3459
OPERATION
This is accomplished by varying the t
period by ap-
OFF
0.8pF •1.25V
VOUT – V
proximately 1/(V
– V ). Due to propagation delays
tOFF ≈ 100ns +
OUT
IN
IN
and a 0.6μA bias current in the timer, the t time can be
0.6μA +
OFF
500k
more accurately predicted as follows:
If V
is less than V , the t delay is fixed at approxi-
OUT
IN
OFF
mately 750ns.
APPLICATIONS INFORMATION
Inductor Selection
Capacitor Selection
Aninductorwithaminimumvalueof15μHisrecommended
for use with the LTC3459. Values larger than 15μH will
result in lower ripple current and switching frequency.
High frequency ferrite core materials are strongly recom-
mended. Some inductors meeting these requirements are
listed in Table 1.
The boost converter requires two capacitors. The input
capacitorshouldbeanX5Rtypeofatleast1.0μF. TheV
OUT
capacitor should also be an X5R type between 2.2μF and
10μF. A larger capacitor should be used if lower peak-to-
peak output ripple and better line regulation is desired.
Table 2. Capacitor Vendor Information
Table 1. Example Inductors
SUPPLIER
AVX
PHONE
WEBSITE
L
(μH)
DCR (Ω)/ DIMENSIONS
MAX
CONTACT
(803) 448-9411
(714) 852-2001
(408) 573-4150
(847) 803-6100
www.avxcorp.com
www.murata.com
VENDOR/PART
Chip Inductors
I
(mA)
(mm)
INFORMATION
Murata
Taiyo Yuden
TDK
www.t-yuden.com
www.component.tdk.com
Murata
www.murata.com
LQH31C
22
3/160
3.2 × 1.6 × 1.8
LQH32C-Low Profile 22
0.7/250 3.2 × 2.5 × 1.6
Taiyo Yuden
www.t-yuden.com
PCB Layout Guidelines
LB2016
15
22
33
0.7/130 2.0 × 1.6 × 1.6 (408) 573-4150
1/105
The high speed operation of the LTC3459 demands care-
ful attention to board layout. You will not get advertised
performance with a careless layout. Figure 4 shows the
recommended component placement for the TSOT ver-
sion of the part. A large ground pin copper area will help
to lower the chip temperature.
1.7/85
Toko
LLB2520
www.tokoam.com
1.7/180 2.5 × 2.0 × 1.6 (847) 297-0070
15
22
33
2.5/160
3.8/130
Coilcraft
DO3314
www.coilcraft.com
15 0.86/650 3.3 × 3.3 × 1.4 (847) 639-6400
RECOMMENDED COMPONENT
PLACEMENT. TRACES CARRYING
CURRENT ARE DIRECT. TRACE
AREA AT FB PIN IS SMALL. LEAD
LENGTH TO BATTERY IS SHORT
22
15
22
1.2/500
0.4/700 6.5 × 5.3 × 2.0
0.5/500
DO1606T
33 0.74/450
1
2
3
SW
V
6
5
4
Sumida
www.sumida.com
IN
V
IN
CMD4D06
15
22
33
0.5/400 6.6 × 5.8 × 0.8 (847) 956-0666
GND V
OUT
0.8/300
1.3/240
CDRJ2D1BLD
FB SHDN
SHDN
15 0.175/350 3.2 × 3.2 × 2.0
22 0.255/300
33 0.37/240
V
OUT
3459 F04
Figure 4. Recommended Component
Placement for a Single-Layer Board
3459fc
8
LTC3459
TYPICAL APPLICATIONS
Very low operating quiescent current and synchronous
operationallowforgreaterthan85%conversionefficiency
in many applications. Lower output voltages will result in
The LTC3459 is designed to control peak inductor current
when V is greater than or less than V . This allows
IN
OUT
current to be controlled during start-up in a boost applica-
tion, for example, or V to be regulated below V when
lower efficiencies since the N- and P-channel R
s
OUT
IN
DS(ON)
powered from a fresh battery. Peak current control makes
the LTC3459 an ideal candidate for charging a back-up
source such as a SuperCap. Figure 5 shows an application
where the LTC3459 is used to charge a two-farad, 5V Su-
perCapfroma3.3Vinput. ANiCdbatterycouldbecharged
by the LTC3459 as well, but that application may require
additional circuitry for proper charge termination.
will increase. The switching frequency and output power
capability of the LTC3459 are also dependant on input and
output voltages.
Charging a SuperCap®
SuperCaps have become a popular alternative to NiCd
batteries as back-up power sources in portable equip-
ment. Capacitance values of one farad and higher are
achievable in small package sizes with leakage currents
in the low microamps. SuperCaps are typically charged
at low currents for several minutes until they reach the
required back-up voltage.
When V
is less than ~3.5V, the body of the internal
OUT
synchronous P-channel MOSFET rectifier is connected to
V , and the SW pin rises a diode above V when current
IN
IN
is delivered to the load. While efficiency is compromised
in this mode of operation, current to the SuperCap is
5V from Li-Ion Input
100
90
80
70
60
50
15μH*
V
= 5V
OUT
V
= 4.2V
= 2.5V
IN
SW
V
V
OUT
IN
V
V
OUT
IN
5V
2.5V TO 4.2V
47pF
1M
LTC3459
V
IN
+
Li-Ion
BATTERY
1μF
4.7μF
OFF ON
SHDN
GND
FB
332k
3459 TA04a
*COILCRAFT DO3314
0.01
0.1
1
10
100
I
(mA)
LOAD
3459 TA04b
10V from 3.3V or 5V Input
100
90
80
70
60
50
33μH*
SW
V
= 10V
OUT
V
= 5V
IN
V
V
OUT
IN
V
V
OUT
IN
3.3V TO 5V
10V
47pF
2M
LTC3459
V
= 3.3V
IN
4.7μF
1μF
OFF ON
SHDN
GND
FB
280k
3459 TA05a
*COILCRAFT DO3314
0.01
0.1
1
10
100
I
(mA)
LOAD
3459 TA05b
3459fc
9
LTC3459
TYPICAL APPLICATIONS
L1
controlled, preventing any damaging effects of inrush
current. Proper heat sinking of the package is required in
thisapplicationasthediemaydissipate100mWto200mW
SW
V
OUT
V
V
OUT
IN
5V
during initial charging. When V
is greater than ~3.5V,
1μF
OFF ON
1M
1μF
OUT
LTC3459
SHDN
GND
+
normal boost mode operation and efficiency begin, with
the P-channel MOSFET acting as a synchronous switch.
Average input current is a constant 50mA during charg-
ing, where the current delivered to the SuperCap varies
somewhat with duty cycle. Once the SuperCap is charged
to 5V, the LTC3459 begins to regulate and the input cur-
rent is reduced to the amount required to support the load
and/or self discharge of the SuperCap.
3.3V
C
OUT
2F
FB
332k
3459 F05
C
: MAXWELL TECHNOLOGIES ULTRACAP PC5-5, 2F, 5V
L1: 33μH, 1.7Ω TAIYO YUDEN LB2016
OUT
Figure 5. Charging a SuperCap from a 3.3V Source
PACKAGE DESCRIPTION
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
R = 0.115
TYP
0.56 p 0.05
(2 SIDES)
0.38 p 0.05
4
6
0.675 p0.05
2.50 p0.05
0.61 p0.05
(2 SIDES)
2.00 p0.10
(4 SIDES)
1.15 p0.05
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
PIN 1
PACKAGE
OUTLINE
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
3
1
0.25 p 0.05
0.25 p 0.05
0.50 BSC
0.50 BSC
0.75 p0.05
0.200 REF
1.37 p0.05
(2 SIDES)
1.42 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3459fc
10
LTC3459
PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
R = 0.115
TYP
2.00 0.10
(2 SIDES)
0.40 0.10
R = 0.05
4
6
TYP
0.70 0.05
PACKAGE
OUTLINE
1.65 0.05
(2 SIDES)
3.00 0.10
(2 SIDES)
1.65 0.10
(2 SIDES)
3.55 0.05
2.15 0.05
PIN 1 BAR
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
(DCB6) DFN 0405
TOP MARK
(SEE NOTE 6)
3
1
0.25 0.05
0.25 0.05
0.50 BSC
0.50 BSC
0.75 0.05
0.200 REF
1.35 0.10
(2 SIDES)
1.35 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD
PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
2.90 BSC
(NOTE 4)
0.62
MAX
0.95
REF
1.22 REF
1.50 – 1.75
(NOTE 4)
2.80 BSC
1.4 MIN
3.85 MAX 2.62 REF
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.30 – 0.45
6 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.20 BSC
DATUM ‘A’
0.01 – 0.10
1.00 MAX
0.30 – 0.50 REF
1.90 BSC
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302 REV B
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3. DIMENSIONS ARE INCLUSIVE OF PLATING
3459fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LTC3459
TYPICAL APPLICATION
3.3V from a 2 AA Alkaline Input
L1
15μH
100
V
= 3.3V
OUT
SW
90
80
70
60
50
V
V
OUT
3.3V
IN
V
V
V = 3V
IN
IN
OUT
1.8V TO 3V
C1
C2
R1
+
+
2.2μF
LTC3459
SHDN
GND
47pF
604k
V
= 1.8V
2 AA
CELLS
IN
C3
4.7μF
OFF ON
FB
R2
365k
3459 TA06a
C1: TDK C1608X5R1A225MT
C2: TDK C0603COG1E470J
C3: TDK C2012X5ROJ475K
L1: COILCRAFT DO3314-153MXB
R1: PANASONIC ERJ3EKF6043V
R2: PANASONIC ERJ3EKF3653V
0.01
0.1
1
10
100
I
(mA)
LOAD
3459 TA06b
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
V : 2.75V to 18V, V
LT1310
LT1613
1.5A I , 4.5MHz, High Efficiency Step-Up DC/DC Converter
= 35V, I = 12mA, I < 1μA, MS10E
OUT(MAX) Q SD
SW
IN
550mA I , 1.4MHz, High Efficiency Step-Up DC/DC Converter V : 0.9V to 10V, V
= 34V, I = 3mA, I < 1μA, ThinSOT
Q SD
SW
IN
OUT(MAX)
= 34V, I = 20μA, I < 1μA, ThinSOT
OUT(MAX) Q SD
LT1615/
LT1615-1
300mA/80mA I , Constant Off-Time, High Efficiency
V : 1.2V to 15V, V
IN
SW
Step-Up DC/DC Converter
LT1618
1.5A I , 1.4MHz, High Efficiency Step-Up DC/DC Converter
V : 1.6V to 18V, V
= 35V, I = 1.8mA, I < 1μA, MS10
OUT(MAX) Q SD
= 34V, I = 20μA, I < 1μA, MS10
OUT(MAX) Q SD
SW
IN
LT1944 (Dual) Dual Output 350mA I , Constant Off-Time, High Efficiency
V : 1.2V to 15V, V
IN
SW
Step-Up DC/DC Converter
LT1945 (Dual) Dual Output Pos/Neg 350mA I , Constant Off-Time,
V : 1.2V to 15V, V
= 34V, I = 20μA, I < 1μA, MS10
OUT(MAX) Q SD
SW
IN
High Efficiency Step-Up DC/DC Converter
LT1946/
LT1946A
1.5A I , 1.2MHz/2.7MHz, High Efficiency Step-Up
V : 2.45V to 16V, V
= 34V, I = 3.2mA, I < 1μA, MS8
OUT(MAX) Q SD
SW
IN
DC/DC Converter
LT1949/
LT1949-1
550mA I , 600kHz/1.1MHz, High Efficiency Step-Up
V : 1.5V to 12V, V
= 28V, I = 4.5mA, I < 25μA,
OUT(MAX) Q SD
SW
IN
DC/DC Converter
SO-8, MS8
LT1961
1.5A I , 1.25MHz, High Efficiency Step-Up DC/DC Converter
V : 3V to 25V, V
= 35V, I = 0.9mA, I < 6μA, MS8E
OUT(MAX) Q SD
SW
IN
LTC3400/
LTC3400B
600mA I , 1.2MHz, Synchronous Step-Up DC/DC Converter
V : 0.5V to 5V, V
= 5V, I = 19μA/300μA, I < 1μA, ThinSOT
OUT(MAX) Q SD
SW
IN
LTC3401
LTC3402
LTC3425
1A I , 3MHz, Synchronous Step-Up DC/DC Converter
V : 0.5V to 5V, V
= 6V, I = 38μA, I < 1μA, MS10
Q SD
SW
IN
OUT(MAX)
= 6V, I = 38μA, I < 1μA, MS10
OUT(MAX) Q SD
2A I , 3MHz, Synchronous Step-Up DC/DC Converter
V : 0.5V to 5V, V
IN
SW
5A I , 8MHz, 4-Phase Synchronous Step-Up DC/DC
V : 0.5V to 4.5V, V
IN
= 5.25V, I = 12μA, I < 1μA,
OUT(MAX) Q SD
SW
Converter, QFN32
LTC3429
600mA, 500kHz, Synchronous Step-Up DC/DC Converter with
Output Disconnect and Soft-Start
V : 0.5V to 5V, V
= 5V, I = 20μA/300μA, I < 1μA, ThinSOT
Q SD
IN
OUT(MAX)
LT3460
LT3464
320mA I , 1.3MHz, High Efficiency Step-Up DC/DC Converter V : 0.5V to 5V, V
= 5V, I = 20μA/300μA, I < 1μA, ThinSOT
Q SD
SW
IN
OUT(MAX)
85mA I , Constant Off-Time, High Efficiency Step-Up DC/DC
V : 2.3V to 10V, V
IN
= 34V, I = 25μA, I < 1μA, ThinSOT
OUT(MAX) Q SD
SW
Converter with Integrated Schottky/Output Disconnect
3459fc
LT 1208 REV C • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
12
●
●
© LINEAR TECHNOLOGY CORPORATION 2007
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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