LTST-C191TGKT [LITEON]

Property of Lite-On Only; 精简版，关于财产只有


型号：	LTST-C191TGKT
厂家：	LITE-ON TECHNOLOGY CORPORATION
描述：	Property of Lite-On Only 精简版，关于财产只有光电
文件：	总11页 (文件大小：540K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Features

* Meet ROHS, Green Product.

* Super Thin (0.55H mm) Chip LED.

* Package In 8mm Tape On 7" Diameter Reels.

* EIA STD package.

* I.C. compatible.

* Compatible With Automatic Placement Equipment.

* Compatible With Infrared And Vapor Phase Reflow Solder Process.

Package Dimensions

Part No.

Lens

Source Color

InGaN Green

LTST-C191TGKT

Water Clear

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

℃

Absolute Maximum Ratings At Ta=25

Parameter

LTST-C191TGKT

Unit

Power Dissipation

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

100

DC Forward Current

0.25

mA/°C

Derating Linear From 50°C

Reverse Voltage

-20°C to + 80°C

Operating Temperature Range

Storage Temperature Range

Wave Soldering Condition

Infrared Soldering Condition

Vapor Phase Soldering Condition

-30°C to + 100°C

260°C For 5 Seconds

215°C For 3 Minutes

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Suggestion Profile:

(1) Suggestion IR Reflow Profile For Normal Process

(2) Suggestion IR Reflow Profile For Pb Free Process

Recom m ended Profile Betw een Assem ble And Heat-Resistance Line

The Profile is available that m ust to use SnAg

solder paste

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

℃

Electrical Optical Characteristics At Ta=25

Part No.

LTST-

Parameter

Luminous Intensity

Viewing Angle

Symbol

Min.

Typ.

Max.

450.0

Unit

mcd

deg

Test Condition

IF = 20mA

Note 1

C191TGKT

71.0

C191TGKT

130

530

525

Note 2 (Fig.6)

1/2

Measurement

@Peak (Fig.1)

Peak Emission Wavelength

Dominant Wavelength

Spectral Line Half-Width

Forward Voltage

IF = 20mA

Note 3

Δλ

2.80

3.20

3.60

IF = 20mA

VR = 5V

Reverse Current

Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE eye-response curve.

1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength,

d is derived from the CIE chromaticity diagram and represents the

single wavelength which defines the color of the device.

4. Caution in ESD:

Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic

glove when handling the LED. All devices, equipment and machinery must be properly grounded.

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Bin Code List

Forward Voltage

Bin Code

Unit: V @20mA

Min.

2.80

3.00

3.20

3.40

Max.

3.00

3.20

3.40

3.60

D10

Tolerance on each Forward Voltage bin is +/-0.1 volt

Luminous Intensity

Unit : mcd @20mA

Bin Code

Min.

71.0

Max.

112.0

180.0

280.0

450.0

112.0

180.0

280.0

Tolerance on each Intensity bin is +/-15%

Dominant Wavelength

Bin Code

Unit : nm @20mA

Max.

Min.

520.0

525.0

530.0

525.0

530.0

535.0

Tolerance for each Dominate Wavelength bin is +/- 1nm

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Typical Electrical

Optical Characteristics Curves

(25 °C Ambient Temperature Unless Otherwise Noted)

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package.

If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature

for less one minute.

Suggest Soldering Pad Dimensions

Package Dimensions Of Tape And Reel

Notes:

1. All dimensions are in millimeters (inches).

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-5000 pieces per reel.

3. Minimum packing quantity is 500 pcs for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with ANSI/EIA 481-1-A-1994 specifications.

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office

equipment, communication equipment and household applications).Consult Liteon’s Sales in advance

for information on applications in which exceptional reliability is required, particularly when the failure

or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,

traffic control equipment, medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.

It is recommended that LEDs out of their original packaging are IR-reflowed within one week.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in a

sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.

LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C

for at least 24 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering

Recommended soldering conditions:

Reflow soldering

120~150°C

120 sec. Max. Pre-heat time

Wave Soldering

100°C Max.

60 sec. Max. Soldering time 3 sec. Max.

Soldering iron

Pre-heat

Pre-heat time

Peak temperature 260°C Max.

Pre-heat

Temperature 300°C Max.

Solder wave

260°C Max.

10 sec. Max.

(one time only)

Soldering time

5 sec. Max.

Soldering time

5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs

connected in parallel in an application, it is recommended that a current limiting resistor be incorporated

in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A

Circuit model B

LED

(A) Recommended circuit.

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

6. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.

Suggestions to prevent ESD damage:

ꢀ Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.

ꢀ All devices, equipment, and machinery must be properly grounded.

ꢀ Work tables, storage racks, etc. should be properly grounded.

ꢀ Use ion blower to neutralize the static charge which might have built up on surface of the LED’s

plastic lens as a result of friction between LEDs during storage and handling.

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward

voltage, or “ no lightup ” at low currents.

To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.

The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.

7. Reliability Test

Test Item

Classification

Test Condition

Reference Standard

Ta= Under Room Temperature As Per Data Sheet

Maximum Rating

*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.

MIL-STD-750D:1026

MIL-STD-883D:1005

JIS C 7021:B-1

Operation Life

High Temperature

High Humidity

Storage

IR-Reflow In-Board, 2 Times

Ta= 65±5℃,RH= 90～95%

MIL-STD-202F:103B

JIS C 7021:B-11

Endurance

Test

Test Time= 240HRS±2HRS

High Temperature Ta= 105±5℃

Storage

Test Time= 1000HRS (-24HRS,+72HRS)

MIL-STD-883D:1008

JIS C 7021:B-10

Low Temperature Ta= -55±5℃

JIS C 7021:B-12

Storage

Test Time=1000HRS (-24HRS,+72H RS)

MIL-STD-202F:107D

MIL-STD-750D:1051

MIL-STD-883D:1010

JIS C 7021:A-4

105℃ ～ 25℃ ～ -55℃ ～ 25℃

Temperature

Cycling

30mins 5mins

10 Cycles

30mins 5mins

IR-Reflow In-Board, 2 Times

85 ± 5℃ ～ -40℃ ± 5℃

MIL-STD-202F:107D

MIL-STD-750D:1051

MIL-STD-883D:1011

Thermal

Shock

10mins

10mins 10 Cycles

MIL-STD-202F:210A

MIL-STD-750D:2031

JIS C 7021:A-1

T.sol= 260 ± 5℃

Dwell Time= 10 ± 1secs

Solder

Resistance

Ramp-up rate(183℃ to Peak) +3℃/ second max

Temp. maintain at 125(±25)℃ 120 seconds max

Temp. maintain above 183℃ 60-150 seconds

Peak temperature range 235℃+5/-0℃

Time within 5°C of actual Peak Temperature (tp)

10-30 seconds

MIL-STD-750D:2031.2

J-STD-020C

IR-Reflow

Normal Process

Environmental

Test

Ramp-down rate +6℃/second max

Ramp-up rate(217℃to Peak) +3℃/ second max

Temp. maintain at 175(±25)℃180 seconds max

Temp. maintain above 217℃60-150 seconds

Peak temperature range 260℃+0/-5℃

Time within 5°C of actual Peak Temperature (tp)

20-40 seconds

MIL-STD-750D:2031.2

J-STD-020C

IR-Reflow

Pb Free Process

Ramp-down rate +6℃/second max

MIL-STD-202F:208D

MIL-STD-750D:2026

MIL-STD-883D:2003

IEC 68 Part 2-20

T.sol= 235 ± 5℃

Immersion time 2±0.5 sec

Immersion rate 25±2.5 mm/sec

Coverage ≧95% of the dipped surface

Solderability

JIS C 7021:A-2

8. Others

The appearance and specifications of the product may be modified for improvement without prior notice.

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

9. Suggested Checking List

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel

strap or conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?

5. All wrist strap or heel strap checkers calibration up to date?

Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at

static-safe workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse or recycles?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

Part No. : LTST-C191TGKT

BNS-OD-C131/A4

Page :

LTST-C191TGKT [LITEON]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E