CG90LSLTR [LITTELFUSE]

Gas Discharge Tube (GDT) Products; 气体放电管（ GDT ）产品


型号：	CG90LSLTR
厂家：	LITTELFUSE
描述：	Gas Discharge Tube (GDT) Products 气体放电管（ GDT ）产品
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Gas DischargeTube (GDT) Products

CG/CG2 Series

Description

Littelfuse highly reliable CG/CG2 Series GDTs provide

a high degree of surge protection in a small size ideal

for board level circuit protection.

GDTs function as switches which dissipate a

minimum amount of energy and therefore handle

currents that far surpass other types of transient

voltage protection. Their gas-ﬁlled, rugged ceramic

metal construction make them well suited to adverse

environments.

The CG/CG2 series comes in a variety of forms

including surface mount, core, straight and shaped

leads, to serve a variety of mounting methods.

Agency Approvals

The CG Series (75-110V) is ideal for protection of test

and communication equipment and other devices

in which low voltage limits and extremely low arc

voltages are required.

AGENCY

AGENCY FILE NUMBER

E128662

E320116

The CG2 Series (145V-1000V) is ideal for protecting

equipment where higher voltage limits and holdover

voltages are necessary.

2 Electrode GDT Graphical Symbol

Features

• Rugged Ceramic-Metal

construction

• Meets REA PE-80

• Available in surface

mount, and a variety of

lead options options

• Low Capacitance

(<1.5pf)

Applications

• Communication lines

and equipment

• Instrumentation circuits

• Medical electronics

• ADSL equipment

• CATV equipment

• Test equipment

• Data lines

• Telecom SLIC

protection

• Power supplies

CG/CG2 Series

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Customer should verify actual device performance in their speciﬁc applications.

Revised: January 10, 2013

Gas DischargeTube (GDT) Products

CG/CG2 Series

Electrical Characteristics

Device Speciﬁcations (at 25°C)

Impulse Impulse Insulation

Life Ratings

DC Breakdown

in Volts

Nominal Nominal

Max

Capaci-

Arc

Surge

Life

Break-

down

in Volts

Break-

down In

Volts

Resistance

Impulse

Dischage Holdover Impulse

tance Voltage

Discharge Discharge Current Voltage²Discharge

(on state

(@1MHz)

(@100V/s)

(@500A

10/1000µs)

Voltage)

@1Amp

Min

(9 cycle

@50Hz)

Current

(8/20µs)

Current

(1 Application

@ 10/350µs)

(10x1sec

(@100V/µs) (@1 Kv/µsec)

@50-60Hz)

Part

Number

MIN TYP MAX

MAX

MIN

MAX

TYP

CG75

400

450

500

600

625

700

750

800

850

1000

1200

650

600

10¹⁰

(at 50V)

CG90

90 108

52 V

4kA

CG90 SN

CG110

CG2145

600

88 110 132

116 145 174

600

80 V

CG2145 SN 120 145 174

CG2230 195 230 265

CG2230 SN 184 230 276

CG2250 213 250 288

CG2250 SN 200 250 300

CG2300 255 300 345

CG2300 SN 240 300 360

CG2350 297 350 403

CG2350 SN 280 350 420

600

700

725

10 shots

725

20 A

(@20kA)³

100 A

400

shots

800

1.5 pf

15 V

800

10¹⁰

(at 100V)

2.5kA

900

135 V

CG2420

CG2470

357 420 483

400 470 540

1000

1200

1400

1500

1600

CG2470 SN 376 470 564

CG2600 510 600 690

CG2600 SN 480 600 720

CG2800¹

CG21000¹

680 800 920

850 1000 1150 1500

10 shots

(@10kA)

10 A

65 A

NOTES:

1. Tested to UL1449 Third Edition

2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.

Product Characteristics

Glow to arc

LS, Axial:

< 0.5Amps

60-160 Volts

transition current

Device:Tin Plated 2–5 Microns

Lead Wires:Tin Plated 17.5 12.5 Microns

Construction: Ceramic Insulator

GlowVoltage

Core:

Materials

Storage and

Operational

Temperature

Device:Tin Plated 17.5 12.5 Microns.

-40 to +90

Construction: Ceramic Insulator

MS:

Device: DullTin Plated 7–9 Microns

Construction: Ceramic Insulator

Maximum Follow 230 Volts r.m.s, 200 Amps.

On Current¹

(800V and 1000V devices tested to UL1449 3rd edition)

LF Logo, Voltage and date code; Black in

positive print

Product Marking

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

CG/CG2 Series

Revised: January 10, 2013

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Device Dimensions

Leaded 'L' Type Straight Axial Devices

Leaded 'LS' Type Shaped Lead Devices

PROFILE VIEW

TOP VIEW

PROFILE VIEW

TOP VIEW

6.ꢀ7 ꢀ.ꢁ

[0.ꢀ39 0.01ꢀ2

8.1ꢀ Max.

[0.319 DIA Max.2

ꢀ.81DIA. TYP.

[0.032]

8.1ꢀDIA. MAX.

[0.319]

8.4ꢀ ꢀ.ꢁ

[0.331 0.01ꢀ2

6.ꢀ7 ꢀ.15

[0.239 0.006]

ꢀ.8ꢀ

[0.03ꢀ2

0.004

8.4 ꢀ.ꢁ

[0.331 0.01ꢀ2

ꢀ Surfaces

ꢀ.4ꢀ ꢀ.ꢀꢁ

[0.0157 0.001ꢀ2

9.85 ꢀ.ꢁꢀ

[0.388 0.01ꢀ2

11.15 ꢀ.ꢁꢀ

[0.439 0.01ꢀ2

SOLDER PAD LAYOUT

Core Devices

9.85

[0.3882

8.6ꢀ

[0.3392

TOP VIEW

PROFILE VIEW

SEMI–PROFILE VIEW

8.ꢀ0 Max.

[0.032 Max.ꢁ

6.07 0.ꢀ1

[0.239 0.00ꢀ9ꢁ

1.8ꢀ

[0.0712

1.89[0.232ꢁ

11.65

[0.4592

8 . ꢀ

0.47 0.ꢀ

[0.019 0.0039ꢁ

'MS' Type Devices

TOP VIEW

PROFILE VIEW

SEMI–PROFILE VIEW

8.30 0.ꢁ

[0.32ꢀ 0.00379

0.ꢀ

5.58 [0.2209

[0.15ꢀ 0.00ꢀ79

6.05 0.ꢀ

[0.238 0.00ꢀ79

R5.ꢀ9 [R0.2089

ꢀ

0.47 0.ꢁ

[0.017 0.00379

SOLDER PAD LAYOUT

ꢀ.ꢀ9 [0.0709

8.7ꢁ [0.3439

5.89 [0.2329

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

CG/CG2 Series

Revised: January 10, 2013

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Soldering Parameters - Reﬂow Soldering (Surface Mount Devices)

t_P

Reﬂow Condition

-Temperature Min (T_s(min)

Pb – Free assembly

T_P

Critical Zone

_Lto T_P

Ramp-up

)

150°C

T_L

Pre Heat -Temperature Max (T_s(max)

)

200°C

t_L

T_S(max)

-Time (Min to Max) (t_s)

60 – 180 secs

Ramp-down

Average ramp up rate (LiquidusTemp

(T_L) to peak

Preheat

3°C/second max

T_S(min)

t_S

T_S(max)toT_L- Ramp-up Rate

5°C/second max

217°C

-Temperature (T_L) (Liquidus)

Reﬂow

time to peak temperature

(t 25ºC to peak)

-Temperature (t_L)

60 – 150 seconds

260^+0/-5°C

Time

PeakTemperature (T_P)

Time within 5°C of actual peak

Temperature (t_p)

10 – 30 seconds

Ramp-down Rate

6°C/second max

8 minutes Max.

260°C

Time 25°C to peakTemperature (T_P)

Do not exceed

Soldering Parameters -Wave Soldering (Thru-Hole Devices)

Recommended Process Parameters:

300

280

260

240

220

200

180

160

140

120

100

Wave Parameter

Lead-Free Recommendation

Preheat:

(Typical Industry Recommendation)

(Depends on Flux ActivationTemperature)

Temperature Minimum:

Temperature Maximum:

PreheatTime:

100° C

150° C

60-180 seconds

Solder PotTemperature:

Solder DwellTime:

280° C Maximum

2-5 seconds

Time (Seconds)

Preheat Time

Cooling Time

Dwell Time

Soldering Parameters - Hand Soldering

Solder IronTemperature: 350° C +/- 5°C

HeatingTime: 5 seconds max.

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

CG/CG2 Series

Revised: January 10, 2013

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Packaging Dimensions

For 'L' Type Axial Lead Items

<1.2 Max. Lead Bend

254.0 - 356.0

[10.0 - 14.0]

<0.8 Max

Direction of Feed

0.0

15]

52.4

[2.063]

22.8

[0.898]

6.4

[0.252]

5.0 Pitch

[0.197]

Core and 'MS' Type Items

275.0

[10.83]

10x4 0.1 ꢀ 40 0.2

[10 x 0.157 0.004 ꢀ 1.575 0.008]

100.0

[3.94]

1.75 0.1

[0.069 0.004]

0.1

1.5 DIA. MAX.

[0.059]

0.4 0.05

[0.016 0.002]

76.0

[2.99]

[0.157 0.004]

25.0

[0.98]

7.5 0.1

[0.295 0.004]

8.5 0.1

[0.335 0.004]

17.7

[0.697]

16 +0.3 / -0.1

[0.630 +0.012 / -0.004]

Direction of Feed

1.5 DIA. MAX.

[0.059]

12 0.1

[0.472 0.004]

8.6 0.1

[0.339 0.004]

For 'LS' Type Shaped Lead Items

275.0

[10.82]

10x4 0.1 ꢀ 40 0.2

[10x.157 0.004 ꢀ 1.575 0.00ꢁ]

100.0

[3.93]

1.75 0.1

[0.069 0.004]

1.5 DIA. MAX.

[0.059]

0.1

0.5 0.05

[0.020 0.002]

[0.157 0.004]

76.0

[2.99]

25.0

[0.98]

1.9

[0.075]

11.5 0.1

[0.453 0.004]

11.75 0.1

[0.463 0.004]

ꢁ

0.1

24 +0.3 / -0.1

[0.945 +0.019 / -0.004]

25.7

[1.01]

[0.315 0.004]

Direction of Feed

0.5 0.01

[0.020 0.004]

1.5 DIA. MAX.

[0.059]

0.1

16 0.1

[0.630 0.004]

[0.354 0.004]

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

CG/CG2 Series

Revised: January 10, 2013

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Part Numbering System and Ordering Information

CG2 XXX XX * XX

Series

CG -- for 75, 90, or 110V

CG2 -- for 145V to 1000V

Examples:

CG75 -- A non-leaded 75V device

Breakdown Voltage

CG2230L -- A leaded 230V device

110

145

230

250

300

350

470

600

800

CG2800LTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D)

1000

Notes:

CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.

Lead Option Code

(Blank) = No Leads / Core

L = Straight Leads

LS = Shaped Leads

MS = Surface Mount

Option Code*

SN = may have different DC Breakover

Voltage Limit. Please refer to Electrical

Characteristics table for additional

information.

Packaging Option Code

(Blank) = No Leads / Core, Bulk Bag - 400 pcs

L(Blank) = Straight Lead, Tray - 50 pcs

LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel

LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel

LS(Blank) = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

CG/CG2 Series

Revised: January 10, 2013

Customer should verify actual device performance in their speciﬁc applications.

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