PGB1040805NR [LITTELFUSE]
PGB1 Series Lead-Free 0805 ESD Suppressor; PGB1系列无铅0805 ESD抑制器
| 型号： | PGB1040805NR |
| 厂家： | 
LITTELFUSE |
| 描述： | PGB1 Series Lead-Free 0805 ESD Suppressor |
| 文件： | 总2页 (文件大小：166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS Pb
PGB1 Series Lead-Free 0805 ESD Suppressor
Product Overview
PulseGuard ESD Suppressors help protect sensitive electronic
equipment against electrostatic discharge (ESD). They supplement the
on-chip protection of integrated circuitry and are best suited for low-
voltage, high-speed applications where low capacitance is important.
Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI and DVI can benefit from this new technology. PulseGuard
suppressors use polymer composite materials to suppress fast-rising
ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E),
while adding virtually no capacitance to the circuit.
Features
• Lead-Free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• 4-lines of protection
• Bi-directional
Reference Dimensions:
• Withstands multiple ESD strikes
• Based on industry standard 2012 package
• Compatible with pick-and-place processes
• Available in 1,000 and 5,000 piece reels (EIA-RS481)
Reflow Solder
2.03 (.080") TYP
0.71 (.028")
1.27
0.74
(.050")
(.029")
Typical Applications
• HDTV Hardware
1.27
(.050") TYP
0.203
(.008") TYP
0.51 (.020")
0.635 (.025")
0.74
• Laptop/Desktop Computers
• Network Hardware
• Computer Peripherals
• Digital Cameras
0.127
(.005") TYP
0.279
(.011")
(.029")
Sn
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
• External Storage
• Set-Top Boxes
0.406 (.016") TYP
Ordering Information
Equivalent Circuit
6
CATALOG NUMBER
PGB1040805MR
PGB1040805NR
PIECES PER REEL
1
1,000
5,000
2
5
Design Consideration
Because of the fast rise-time of the ESD transient, placement of
PulseGuard suppressors is a key design consideration. To achieve
optimal ESD suppression, the devices should be placed on the circuit
board as close to the source of the ESD transient as possible. Install
PulseGuard suppressors directly behind the connector so that they are
the first board-level circuit component encountered by the ESD transient.
They are connected from signal/data line to ground.
3
4
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PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS Pb
PGB1 Series Lead-Free 0805 ESD Suppressor
Capacitance vs. Frequency
Electrical Characteristics
ESD Capability
** Note: 1,000 fF = 1 pF
70
IEC 61000-4-2 Direct Discharge ....................................................8kV
IEC 61000-4-2 Air Discharge .......................................................15kV
Trigger Voltage1 .....................................................................500 V, typical
Clamping Voltage1..................................................................150V, typical
Rated Voltage ........................................................................24VDC, max
Capacitance2................................................................................0.055 pF
Response Time1................................................................................< 1ns
Leakage Current3 .............................................................................< 1nA
ESD Pulse Withstand4 ..........................................1,000 pulses, minimum
60
50
40
4
0.5
1.0
1.5
2.0
Notes:
Frequency (GHz)
1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct
discharge method.
2. Capacitance measured at 1MHZ.
3. Leakage current measured at 6VDC.
4. Pulse Withstand- some shifting in characteristics may occur when tested
over multiple pulses at a very rapid rate.
Carrier Tape Specifications
Parts are delivered on 7" (178mm) reel, paper carrier tape
Environmental Specifications
Operating Temperature: -65°C to +125°C.
Moisture Resistance, steady state: MIL-STD-833, method 1004.7,
85% RH, 85°C, 1000hrs.
Tt
Ds
Dd
Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C,
30 min cycle, 10 cycles.
+
+
+
+
Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz,
1 min. cycle, 2grs each in X-Y-Z)
Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer)
Tw
+
+
+
Ph
Pd
Solder leach resistance and terminal adhesion: Per EIA-576
test
Pw
Ps
Ct
Physical Specifications
Materials:
Body: Glass Epoxy
Terminations: 100% Copper/Nickel/Tin
Solderability: MIL-STD-202, Method 208 (95% coverage)
Soldering Parameters:
Wave Solder – 260°C, 10 seconds maximum.
Reflow Solder – 260°C, 30 seconds maximum.
DESCRIPTION
MEASUREMENT (MM)
Ct - Cover tape thickness
Dd - Drive hole diameter
Ds - Drive hole spacing
Pd - Pocket depth
0.06
1.50
4.00
0.58
2.21
4.00
1.45
0.65
8.00
Packaging Specifications
8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per
reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR.
Ph - Pocket height
Ps - Pocket spacing
Pw - Pocket width
Tt - Carrier tape thickness
Tw - Carrier tape width
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相关型号：
PGB20201
PULSE-GUARD® ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD).
LITTELFUSE
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