SP1013-01WTG [LITTELFUSE]
Trans Voltage Suppressor Diode, 5V V(RWM), Bidirectional, 1 Element, Silicon,;
| 型号： | SP1013-01WTG |
| 厂家： | 
LITTELFUSE |
| 描述： | Trans Voltage Suppressor Diode, 5V V(RWM), Bidirectional, 1 Element, Silicon, 局域网 二极管 |
| 文件： | 总4页 (文件大小：772K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®Diodes)
General Purpose Protection - SP1013 Series
RoHS
GREEN
Pb
SP1013 Series 30pF 30kV Bidirectional Discrete TVS
Description
The SP1013 includes back-to-back Zener diodes which
provides protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). It
measures 0.52 x 0.27mm permitting use of the standard
0201 footprints, but offering a 30% reduction in occupied
board space. The SP1013 can safely absorb repetitive ESD
strikes above the maximum level specified in IEC 61000-4-
2 international standard (Level 4, ±±kꢀ contact discharge)
without performance degradation, and the back-to-back
configuration provides symmetrical standoff voltage which
makes the component appropriate for use when AC signals
are present on the data or signal line.
Pinout
Features
• ESD, IEC 61000-4-2,
±30kꢀ contact, ±30kꢀ air
• Low capacitance of 30pF
(@ ꢀR=0ꢀ)
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Low leakage current of
5nA at 1.5ꢀ
1
ꢀ
• Lightning, IEC 61000-
4-5 2nd edition, ±A
(tP=±/20μs)
• RoHS compliant, Lead-
free, and Halogen free
Pin1
Pin2
Note: Drawing not to scale
Functional Block Diagram
Applications
• Mobile Phones
• Smart Phones
•Tablets
• Digital Cameras
• MP3/PMP
• Portable Navigation
Devices
ꢁ
ꢀ
• WearableTechnology
• Portable Medical
• Point of SaleTerminals
Additional Information
Daꢀasꢁeeꢀ
ꢀesoꢁrꢂes
Saꢀꢁꢂes
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
SP1013 Series
1
Revision: 01/30/17
®Diodes)
General Purpose Protection - SP1013 Series
Absolute Maximum Ratings
Symbol
Parameter
ꢀalue
±.0 1
Units
A
IPP
Peak Current (tp=±/20μs)
OperatingTemperature
TOP
-40 to 125
°C
TSTOR
StorageTemperature
-55 to 150
°C
Notes:
1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
-55 to 150
150
Units
°C
StorageTemperature Range
Maximum JunctionTemperature
Maximum LeadTemperature (Soldering 20-40s)
°C
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
ꢀRWM
Test Conditions
Min
7. 0
Typ
Max
5.0
Units
ꢀ
Reverse Standoff ꢀoltage
IR≤1μA with 1 pin to GND
IT=1mA with 1 pin at GND
ꢀR=1.5ꢀ with 1 pin at GND1
ꢀR=3.3ꢀ with 1 pin at GND1
ꢀR=5ꢀ with 1 pin at GND1
IPP=1A, tp=±/20µs, Fwd
Reverse Breakdown ꢀoltage
ꢀBR
ꢀ
5
nA
nA
nA
ꢀ
Leakage Current
ILEAK
10
100
9
Clamp ꢀoltage1
ꢀC
RDYN
ꢀESD
CD
IPP=2A, tp=±/20µs, Fwd
TLP tp=100ns, 1 Pin to GND
IEC 61000-4-2 (Contact Discharge)
IEC 61000-4-2 (Air Discharge)
Reverse Bias=0ꢀ, f=1MHz
9.5
0.2
ꢀ
Dynamic Resistance2
ESD Withstand ꢀoltage1
Ω
±30
±30
kꢀ
kꢀ
pF
Diode Capacitance1
30
35
Note:
1Parameter is guaranteed by design and/or component characterization.
2Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and ꢀTLP averaging window: star t1=70ns to end t2=±0ns
8/20μS PulseWaveform
Capacitance vs. Reverse Bias (1 Pin to GND)
ꢂꢂꢀꢁ
ꢂꢀꢀꢁ
ꢊꢀꢁ
ꢉꢀꢁ
ꢈꢀꢁ
ꢇꢀꢁ
ꢆꢀꢁ
ꢅꢀꢁ
ꢄꢀꢁ
ꢃꢀꢁ
ꢂꢀꢁ
ꢀꢁ
ꢆꢀꢁꢀ
ꢅꢂꢁꢀ
ꢅꢀꢁꢀ
ꢄꢂꢁꢀ
ꢄꢀꢁꢀ
ꢃꢂꢁꢀ
ꢃꢀꢁꢀ
ꢂꢁꢀ
ꢀꢋꢀ
ꢆꢋꢀ
ꢂꢀꢋꢀ
ꢂꢆꢋꢀ
ꢃꢀꢋꢀ
ꢃꢆꢋꢀ
ꢄꢀꢋꢀ
ꢀꢁꢀ
Time (μs)
ꢀ
ꢀꢁꢂ
ꢃ
ꢃꢁꢂ
ꢄ
ꢄꢁꢂ
ꢅ
ꢅꢁꢂ
ꢆ
ꢆꢁꢂ
ꢂ
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
SP1013 Series
2
Revision: 01/30/17
®Diodes)
General Purpose Protection - SP1013 Series
ClampingVoltage vs. Peak Pulse Currennt (1 Pin to GND)
Transmission Line Pulsing(TLP) Plot(1 Pin to GND)
25
20
15
10
5
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0
8
1
2
3
4
5
6
7
0
5
10
15
20
25
30
Peak Pulse Current -I
(A)
TLP Volts (V)
PP
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
TP
TL
TS(max)
TS(min)
25
Critical Zone
TL to TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
-Time (min to max) (ts)
60 – 1±0 secs
Ramp-down
Preheat
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
tS
TS(max) toTL - Ramp-up Rate
3°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
time to peak temperature
Time
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
± minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Part Marking System
Part Numbering System
–
SP 1013 01 W T G
TVS Diode Arrays
G= Green
®
(SPA Diodes)
T= Tape & Reel
Series
Package
W: Flipchip
Number of
Channels
Ordering Information
Part Number
Package
Flipchip
Marking
Min. Order Qty.
15000
SP1013-01WTG
•
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
SP1013 Series
3
Revision: 01/30/17
®Diodes)
General Purpose Protection - SP1013 Series
Package Dimensions — Flipchip
TOP VIEW
BOTTOM VIEW
0.20
0.20
0.01
0.16
F
E
0.25
G
0.14
D
Stencil opening
(0.20x0.16)
Solder Pad
(0.20x0.14)
Recommended Solder Pad Footprint
and Stencil opening
A2
A
Thickness of Stencil opening is 0.08mm
*Sizes in mm
A1
Flipchip
Min
Symbol
Millimeters
Inches
Typ
Min
Typ
Max
0.239
0.014
0.225
0.300
0.550
-
Max
A
A1
A2
D
0.1±3
0.00±
0.175
0.2±0
0.530
-
0.211
0.011
0.200
0.290
0.540
0.100
0.200
0.0072 0.00±3 0.0094
0.0003 0.0004 0.0006
0.0069 0.0079 0.00±9
0.0110 0.0114 0.011±
0.0209 0.0213 0.0217
E
F
-
-
0.0039
0.0079
-
-
G
-
-
Embossed CarrierTape & Reel Specification — Flipchip
Symbol
Millimeters
A0
B0
K0
F
0.34+/-0.03
0.60+/-0.03
0.25 + 0.03
3.50 +/- 0.05
2.00+/-0.10
±.00+/-0.10
P1
W
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
SP1013 Series
4
Revision: 01/30/17
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