SP1305-02HTG [LITTELFUSE]

SP1305 30pF, 30kV TVS Diode Array;
SP1305-02HTG
型号: SP1305-02HTG
厂家: LITTELFUSE    LITTELFUSE
描述:

SP1305 30pF, 30kV TVS Diode Array

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®Diodes)  
General Purpose ESD Protection -
SP1305  
RoHS  
GREEN  
Pb  
SP1305 30pF, 30kV TVS Diode Array  
Description  
The SP1305TVS Diode Array is designed to protect  
sensitive equipment from damage due to electrostatic  
discharge (ESD), electrical fast transients (EFT), and  
lightning induced surges.  
The SP1305 can absorb repetitive ESD strikes above the  
maximum level specified in the IEC 61000-4-2 international  
standard without performance degradation and safely  
dissipate up to 5A of 8/20μs induced surge current (IEC  
61000-4-5, 2nd Edition) with very low clamping voltages.  
Pinout and Functional Block Diagram  
Features  
• ESD, IEC 61000-4-2,  
30kV contact, 30kV air  
• Low clamping voltage  
• Low leakage current  
• AEC-Q101 qualified  
• EFT, IEC 61000-4-4, 50A  
(5/50ns)  
• Moisture Sensitivity Level  
(MSL-1)  
1
• Lightning, 5A (8/20μs as  
defined in IEC 61000-4-5  
2nd Edition)  
• Halogen free, lead free  
and RoHS compliant  
3
2
Applications  
• Industrial equipment  
• Legacy ports (RS-232,  
RS-485)  
Test and medical  
equipment  
• Security and alarm  
system  
• Point-of-Sale terminals  
• Motor controls  
Life Support Note:  
Not Intended for Use in Life Support or Life Saving Applications  
The products shown herein are not designed for use in life sustaining or life saving  
applications unless otherwise expressly indicated.  
©2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 04/11/19  
®Diodes)  
General Purpose ESD Protection -
SP1305  
Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
5.0  
Units  
A
IPP  
Peak Pulse Current (tp=8/20μs)  
OperatingTemperature  
StorageTemperature  
TOP  
-40 to 125  
-55 to 150  
°C  
TSTOR  
°C  
Notes:  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and  
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Electrical Characteristics (TOP=25ºC)  
Parameter  
Symbol  
VRWM  
VBR  
Test Conditions  
IR=1μA, Pin1 or Pin2 to Pin3  
IR=1mA, Pin1 or Pin2 to Pin3  
VR=5V  
Min  
6
Typ  
Max  
5
Units  
V
Reverse Standoff Voltage  
Breakdown Voltage  
7
V
Reverse Leakage Current  
ILEAK  
0.1  
8.6  
11  
0.5  
10  
μA  
V
IPP=1A, tp=8/20µs, Pin1 or Pin2 to Pin3  
IPP=5A, tp=8/20µs, Pin1 or Pin2 to Pin3  
Clamp Voltage1  
VC  
13.5  
V
Dynamic Resistance2  
RDYN  
TLP, tp=100ns, Pin1 or Pin2 to Pin3  
0.24  
IEC 61000-4-2 (Contact Discharge)  
Pin1 or Pin2 to Pin3  
30  
30  
kV  
ESD Withstand Voltage1  
Diode Capacitance1  
VESD  
IEC 61000-4-2 (Air Discharge)  
Pin1 or Pin2 to Pin3  
kV  
pF  
Reverse Bias=0V, f=1MHz;  
Pin1 or Pin2 to Pin3  
CI/O-GND  
30  
40  
Note:  
1
Parameter is guaranteed by design and/or component characterization.  
Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns  
2
Capacitance vs. Reverse Bias (Pin1 or Pin2 to Pin3)  
ClampingVoltage vs. Peak Pulse Current  
40.0  
16.0  
14.0  
12.0  
10.0  
8.0  
30.0  
20.0  
10.0  
0.0  
6.0  
4.0  
2.0  
0.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
2.0  
3.0  
4.0  
5.0  
Bias Voltage (V)  
Peak Pulse Current-IPP (A)  
©2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 04/11/19  
®Diodes)  
General Purpose ESD Protection -
SP1305  
NegativeTransmission Line Pulsing (TLP) Plot  
PositiveTransmission Line Pulsing (TLP) Plot  
0
-5  
40  
35  
30  
25  
20  
15  
10  
5
-10  
-15  
-20  
-25  
-30  
-35  
-40  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
-14  
-12  
-10  
-8  
-6  
-4  
-2  
0
TLP Voltage (V)  
TLP Voltage (V)  
8/20μs PulseWaveform  
Power Derating Curve  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
30%  
20%  
10%  
0%  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
25  
50  
75  
100  
125  
150  
0.0  
5.0  
10.0  
15.0  
20.0  
25.0  
30.0  
o
(
Time (μs)  
Ambient Temperature - T  
C)  
A
IEC 61000-4-2 +8kV Contact ESD ClampingVoltage  
IEC 61000-4-2 -8kV Contact ESD ClampingVoltage  
©2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 04/11/19  
®Diodes)  
General Purpose ESD Protection -
SP1305  
Soldering Parameters  
Reflow Condition  
Pb – Free assembly  
tP  
TP  
-Temperature Min (Ts(min)  
)
150°C  
Critical Zone  
TL to TP  
Ramp-up  
Pre Heat -Temperature Max (Ts(max)  
-Time (min to max) (ts)  
)
200°C  
TL  
TS(max)  
tL  
60 – 180 secs  
Average ramp up rate (Liquidus) Temp (TL)  
to peak  
Ramp-down  
3°C/second max  
Preheat  
TS(min)  
TS(max) toTL - Ramp-up Rate  
3°C/second max  
217°C  
tS  
-Temperature (TL) (Liquidus)  
Reflow  
25  
-Temperature (tL)  
60 – 150 seconds  
260+0/-5 °C  
time to peak temperature  
Time  
PeakTemperature (TP)  
Time within 5°C of actual peak  
Temperature (tp)  
20 – 40 seconds  
Product Characteristics  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
260°C  
Lead Plating  
MatteTin  
Time 25°C to peakTemperature (TP)  
Do not exceed  
Lead Material  
Copper Alloy  
Lead Coplanarity  
Substrate Material  
0.004 inches(0.102mm)  
Silicon  
Part Marking System  
Body Material  
Flammability  
Molded Compound  
UL Recognized compound meeting  
flammability rating V-0  
ALF*  
Part Numbering System  
SP 1305 02 H T G  
TVS Diode Arrays  
G= Green  
®
Ordering Information  
(SPA Diodes)  
T= Tape & Reel  
Part Number  
Package  
SOT23-3  
Min. Order Qty.  
3000  
Series  
SP1305-02HTG  
Package  
H: SOT23-3  
Number of  
Channels  
©2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 04/11/19  
®Diodes)  
General Purpose ESD Protection -
SP1305  
Package Dimensions — SOT23-3  
D
θ
Package  
Pins  
SOT23-3  
3
JEDEC  
TO-236  
Millimeters  
Nom  
Inches  
Nom  
0.039  
-
0.017  
0.116  
0.094  
0.051  
0.037 BSC  
0.075 BSC  
0.018  
Min  
0.90  
0.03  
0.37  
2.80  
2.10  
1.20  
Max  
1.10  
0.09  
0.51  
3.04  
2.64  
1.40  
Min  
Max  
0.043  
0.004  
0.020  
0.120  
0.104  
0.055  
A
A1  
b
1.00  
-
0.44  
2.95  
2.40  
1.30  
0.95 BSC  
1.90 BSC  
0.45  
0.25 BSC  
-
0.035  
0.001  
0.015  
0.110  
0.083  
0.047  
Pin1  
Bottom View  
b x 3  
e
e1  
D
Top View  
E
E1  
e
Detail A  
e1  
L
0.30  
0°  
0.55  
8°  
0.012  
0°  
0.022  
8°  
L1  
θ
0.010 BSC  
-
L
L
Detail A  
Side View  
θ1  
7°TYP  
7°TYP  
0.60  
1.30  
2.50  
Recommended soldering pad layout (unit :mm)  
Drawing# : H01-B  
Embossed CarrierTape & Reel Specification — SOT23-3  
Millimeters  
Inches  
Symbol  
Min  
1.65  
3.40  
1.90  
1.40  
3.90  
7.70  
3.90  
3.05  
2.67  
1.12  
0.22  
Max  
1.85  
3.60  
2.10  
1.60  
4.10  
8.30  
4.10  
3.25  
2.87  
1.32  
0.24  
Min  
Max  
0.073  
0.142  
0.083  
0.063  
0.161  
0.327  
0.161  
0.128  
0.113  
0.052  
0.009  
E
F
0.065  
0.134  
0.075  
0.055  
0.154  
0.303  
0.154  
0.120  
0.105  
0.044  
0.009  
P2  
D
P0  
W
P
8mmTAPE AND REEL  
GENERAL INFORMATION  
1. 3000 PIECES PER REEL.  
2. ORDER IN MULTIPLES OF FULL REELS ONLY.  
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.  
ACCESS HOLE  
A0  
B0  
K0  
t
SOT23-3 (8mm POCKET PITCH)  
14.4mm  
13mm  
60mm  
180mm  
USER DIRECTION OF FEED  
PIN 1  
8.4mm  
Disclaimer Noꢀce - Informaꢀon furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and  
test each product selected for their own applicaꢀons. Liꢁelfuse products are not designed for, and may not be used in, all applicaꢀons.  
Read complete Disclaimer Noꢀce at hꢁp://www.liꢁelfuse.com/disclaimer-electronics.  
©2019 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 04/11/19  

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