V5.5MLN41206H [LITTELFUSE]
Varistor, 5.5V, 0.1J, Surface Mount, CHIP;
| 型号： | V5.5MLN41206H |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 5.5V, 0.1J, Surface Mount, CHIP 电阻器 非线性电阻器 |
| 文件： | 总7页 (文件大小：1246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
The MLN SurgeArray™ Suppressor is designed to help protect compo-
nents from transient voltages that exist at the circuit board level. This
device provides four independent suppressors in a single leadless chip
in order to reduce part count and placement time as well as save space
on printed circuit boards.
SurgeArray™ devices are intended to suppress ESD, EFT and other
transients in order to protect integrated circuits or other sensitive
components operating at any voltage up to 18V . SurgeArray devices
DC
are rated to the IEC 61000-4-2 human body model ESD to help products
attain EMC compliance. The array offers excellent isolation and low
crosstalk between sections.
The inherent capacitance of the SurgeArray Suppressor permits it to
function as a filter/suppressor, thereby replacing separate zener/
capacitor combinations.
The MLN array is manufactured using the Littelfuse Multilayer technology
process and is similar to the Littelfuse ML and MLE Series of discrete
leadless chips.
The MLN can also be provided in a Dual version. Contact Littelfuse
for information.
Features
Size
• RoHS Compliant
Metric
2012
EIA
• Four Individual Devices in One Chip
• ESD Rated to IEC 61000-4-2 (Level 4)
• AC Characterized for Impedance and Capacitance
• Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ)
• Low Leakage
0805
3216
1206
• Operating Voltage up to 18V
M(DC)
• -55oC to 125oC Operating Temperature Range
• Low-Profile, PCMCIA Compatible
Applications
• Data, Diagnostic I/O Ports
• Analog Signal/Sensor Lines
• Portable/Hand-Held Products
• Mobile Communications/Cellular Phones
• Computer/DSP Products
• Industrial Instruments Including Medical
180
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Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table.
Continuous:
Steady State Applied Voltage: DC Voltage Range (V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Operating Ambient Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125
V
M(DC)
OC
OC
A
Storage Temperature Range (T
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150
STG
Device Ratings and Specifications Any Single Section
o
o
MAX RATINGS (125 C)
PERFORMANCE SPECIFICATIONS (25 C)
MAXIMUM
CLAMPING
MAXIMUM
NON-
MAXIMUM
NON-
NOMINAL
VOLTAGE AT
1mA DC
CAPACITANCE
AT
1MHz (1V p-p)
TYPICAL
MAXIMUM
CONTINUOUS
WORKING
REPETITIVE REPETITIVE VOLTAGE
ESD SUPPRESSION
VOLTAGE (NOTE 1)
SURGE
CURRENT
(8/20µs)
SURGE
ENERGY
(10/1000µs)
(AT NOTED
8/20µs)
3
PART
NUMBER
CURRENT
VOLTAGE
CURRENT
(NOTE 4)
C
(NOTE 2)
8kV CONTACT 15kV AIR
(NOTE 3)
I
W
V
V
C
TM
TM
M(DC)
VN(DC)
V
N(DC)
MIN
MAX
Peak
TYP
MAX
Peak Clamp
(V)
90
(V)
5.5
5.5
9
(A)
20
30
30
30
20
30
30
(J)
0.05
0.1
(V)
(V)
140
60
(V)
40
(pF)
220
430
250
140
75
(V)
7.1
(pF)
300
520
300
175
100
125
75
(V)
10.8
NEW
NEW
V5.5MLN40805
V5.5MLN41206
V9MLN41206
19 at 1A
15.5 at 2A
23 at 2A
30 at 2A
50 at 1A
40 at 2A
50 at 1A
7.1
10.8
16.0
20.3
28.0
28.0
35.0
35
45
11.0
15.9
22.0
22.0
25.0
0.1
95
50
75
V14MLN41206
V18MLN40805
V18MLN41206
V18MLN41206L
0.1
110
260
165
200
55
85
14
18
18
18
0.05
0.1
100
63
170
100
130
100
45
0.05
95
NOTES:
1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preffered test method).
3. Corona discharge through air (represents actual ESD event)
4. Capacitance may be customized, contact Sales.
Temperature Derating
100
90
For applications exceeding 125oC ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
50
10
100
90
80
70
60
50
40
30
20
10
0
O
t
t
1
TIME
1
t
2
O
= VIRTUAL ORIGIN OFWAVE
EXAMPLE:
FOR AN 8/20µs CURRENT
1
t =TIME FROM 10% TO 90% OF PEAK
t
t
= VIRTUAL FRONT TIME = 1.25 x t
= VIRTUALTIME TO HALFVALUE
WAVEFORM:
1
8µs = t = VIRTUAL FRONT
2
1
(IMPULSE DURATION)
TIME
-55
50 60
70
80
90 100 110 120 130 140 150
o
20µs = t = VIRTUALTIME TO
2
AMBIENTTEMPERATURE ( C)
HALFVALUE
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPINGVOLTAGE
181
www. littelfuse. com
Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
™
RoHS MLN SurgeArray Suppressor
Typical Performance Curves Any Single Section
100
25
V18
V18
MAXIMUM CLAMP VOLTAGE
MAXIMUM STANDBY
20
V5.5
V14
15
V9
10
10
V5.5
5
0
0
10
100
1000
10000
1
0.00001 0.0001
0.001
0.01
0.1
1
10
100
NUMBER OF DISCHARGES
Current (A)
FIGURE 3. NOMINALVOLTAGE STABILITYTO IEC 1000-4-2
(8kV CONTACT METHOD, ONE SECTION)
FIGURE 4. V-I CHARACTERISTIC, 0805 SIZE
100
100
V18L
MAXIMUM CLAMP VOLTAGE
V18
NUMBER OF SURGES
MAXIMUM STANDBY
V14
V9
1
100
V5.5
103
10
V18L
10
V18
V14
10
V9
1
V5.5
∞
104
105
106
0.1
10
100
1000
10000
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Square Wave Impulse Duration (µs)
Current (A)
FIGURE 6. 0805 SIZE PULSE RATING FOR LONG DURATION SURGES
(ANY SINGLE SECTION)
FIGURE 5. V-I CHARACTERISTIC, 1206 SIZE
100
500
400
300
200
100
NUMBER OF SURGES
V5.5
1
100
2
10
103
10
V9
1
V14
V18
∞
104
105
106
V18L
0
0.1
0.1
1
10
100
1000
10
100
1000
10000
Frequency (MHz)
Square Wave Impulse Duration (µs)
FIGURE 7. 1206 SIZE PULSE RATING FOR LONG DURATION SURGES
(ANY SINGLE SECTION)
FIGURE 8. CAPACITANCE vs FREQUENCY
182
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Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
Typical Performance Curves Any Single Section (Continued)
10000
400E-12
350E-12
1000
300E-12
5.5V
250E-12
100
200E-12
18V
5.5V
10
150E-12
3
100E-12
18V
1
50E-12
0.1
1.0E+06
000E+0
1.0E+07
1.0E+08
Frequency (Hz)
1.0E+09
1.0E+10
1.0E+06
1.0E+07
1.0E+08
1.0E+09
Frequency (Hz)
FIGURE 10. IMPEDENCE VS FREQUENCY, 0805 SIZE
FIGURE 9. CAPACITANCE VS. FREQUENCY, 0805 SIZE
1000
100
10
1
0.1
1MHz
10MHz
100MHz
Frequency
1GHz
10GHz
FIGURE 11. CAPACITANCE VS FREQUENCY, 1206 SIZE
10000
0
-20
-40
-60
-80
1000
100
10
V5.5
V18L
V9
V18
V14
V14
V9
V18
V5.5
V18L
V
IN = 1VRMS
1
Z = 50Ω
-100
-120
0.1
0.1
1
10
Frequency (MHz)
100
1000
0.001
0.01
0.1
1
10
100
1000
Frequency (MHz)
FIGURE 12. IMPEDANCE vs FREQUENCY, 1206 SIZE
FIGURE 13. ADJACENT CHANNEL CROSSTALK
183
www. littelfuse. com
Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
Soldering Recommendations
230
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are IR Re-flow & Wave soldering. Typical profiles are
shown in Figures 14 & 15
The recommended solder for the MLN SurgeArray suppressor is a
62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also rec-
ommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled.
FIGURE 14. REFLOW SOLDER PROFILE
When using a reflow process, care should be taken to ensure that the
MLN chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solderís peak
300
temperature is essential to minimize thermal shock.
o
MAXIMUMWAVE 260
C
250
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause
of thermal shock is hot printed circuit boards being removed from the
200
solder process and subjected to cleaning solvents at room temperature.
The boards must be allowed to cool gradually to less than 50˚C before
150
SECOND PREHEAT
cleaning.
100
FIRST PREHEAT
50
0
0.0
Lead-Free (Pb-free) Soldering Recommendations
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TIME (MINUTES)
Littelfuse offers the 0805 array as the preferred solution for lead-free sol-
dering conditions.
FIGURE 15. WAVE SOLDER PROFILE
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but
there is a wide selection of pastes & fluxes available with which the nick-
el barrier parts should be compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
The reflow profile must be constrained by maximums shown in Figure16.
For Pb-free Wave soldering, Figure 15 still applies.
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
Note: the Pb-free paste, flux & profile were used for evaluation purposes
by Littelfuse, based upon industry standards & practices. There are
multiple choices of all three available, it is advised that the customer
explores the optimum combination for their process as processes vary
considerably from site to site.
PREHEAT ZONE
5.0
6.0
7.0
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
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Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
Mechanical Dimensions
T
W
X
P
L
BW
S
3
BL
Size
Units
Inch
L
W
T
BW
0.012 0.004 0.007 +0.01/- 0.002
0.30 0.1 0.18 +0.25/-0.05
0.016 0.004 0.007 +0.01/- 0.002
0.41 0.1 0.18 +0.25/-0.05
BL
P
X
S
0.080 0.008 0.050 0.008
2.03 0.2 1.27 0.2
0.126 0.008 0.063 0.008
3.2 0.2 1.6 0.2
0.038 Max
1.10 Max
0.053 Max
1.35 Max
0.020 Ref
0.508Ref
0.030 Ref
0.76 Ref
0.030 0.004 0.010 0.004
0.76 0.1 0.254 0.1
0.045 0.004 0.015 0.004
1.14 0.1 0.38 0.1
0805
Millimeter
Inch
1206
Millimeter
Recommended Pad Outline
E
D
A
B
C
TABLE 1. PAD LAYOUT DIMENSIONS
A
B
C
2.20
D
0.35
E
Size
Units
Millimeters
Inches
0.90
0.035
0.89
0.035
1.30
0.051
1.65
0.065
0.50
0.02
0.79
0.030
0805
0.087
2.54
0.014
0.46
Millimeters
Inches
1206
0.100
0.018
185
www. littelfuse. com
Multiline Transient Voltage Surge Suppressor
™
RoHS
MLN SurgeArray Suppressor
Ordering Information
VXXMLN TYPES
V
18
ML
N
4
1206
W
T
DEVICE FAMILY
PACKING OPTIONS
TVSS Device
A: 2500 Piece Bulk Pack
H: 7in (178mm) Diameter Reel (Note)
T: 13in (330mm) Diameter Reel (Note)
MAXIMUM DC
WORKING VOLTAGE
NOTE: See Standard Shipping Quantities table.
MULTILAYER DESIGNATOR
END TERMINATION OPTION
SERIES DESIGNATOR
N: Array
(1206 only)
W: Ag/P /P
d
t
DEVICE SIZE:
N: Nickel barrier (0805 only)
0805: 80mil x 50mil
1206: 120mil x 60mil
NUMBER OF SECTIONS
Tape and Reel Specifications
• Conforms to EIA - 481, Revision A
• Can be Supplied to IEC Publication 286 - 3
SYMBOL
DESCRIPTION
MILLIMETERS
A
B
K
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
Dependent on Chip Size to Minimize Rotation.
0
0
0
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
W
F
8 ±0.2
3.5 ±0.5
1.75 ±0.1
4 ±0.1
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Center
E
P
P
P
1
2
0
Axial Distance Between Drive Hole Centers and Cavity Centers
Axial Distance Between Drive Hole Centers
Drive Hole Diameter
2 ±0.1
4 ±0.1
D
D
1.55 ±0.05
1.05 ±0.05
0.3 Max
0.1 Max
0
1
Diameter of Cavity Piercing
t
t
Embossed Tape Thickness
1
Top Tape Thickness
2
NOTE: Dimensions in millimeters.
t
D
P
0
1
0
PRODUCT
IDENTIFYING
LABEL
P
2
PLASTIC CARRIER TAPE
E
F
W
K
0
B
0
EMBOSSMENT
P
A
0
1
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
t
D
TOP TAPE
2
1
Standard Shipping Quantities
DEVICE SIZE
“13” INCH REEL (“T”OPTION)
“7”INCH REEL (“H”OPTION)
BULKPACK (“A” OPTION)
0805 and 1206
10,000
2,500
2,500
186
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