EFM205 [LRC]

Surface Mount Glass Passivated Super Fast Rectifiers Reverse Voltage 50 to 600V Forward Current 2.0A;
EFM205
型号: EFM205
厂家: LESHAN RADIO COMPANY    LESHAN RADIO COMPANY
描述:

Surface Mount Glass Passivated Super Fast Rectifiers Reverse Voltage 50 to 600V Forward Current 2.0A

二极管
文件: 总9页 (文件大小:187K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EFM201 thru EFM208  
Surface Mount Glass Passivated Super Fast Rectifiers  
Reverse Voltage 50 to 600V Forward Current 2.0A  
FEATURES  
* Plastic package has Underwriters Laboratory  
Flammability Classification 94V-0  
* High temperature metallurgically  
bonded construction  
* For use in high frequency rectifier circuits  
* Fast switching for high efficiency  
* Cavity-free glass passivated junction  
* Capable of meeting environmental standards  
of MIL-S-19500  
* 2.0 A operation at TA=75°C with no thermal runaway  
* Typical IR less than 1.0µA  
* High temperature soldering guaranteed:  
260°C/10 seconds  
Mechanical Data  
Case: JEDEC DO-214AA / SMB molded plastic over glass Die  
Terminals: Plated axial leads, solderable per  
MIL-STD-750, Method 2026  
We declare that the material of product compliance  
with ROHS requirements  
Polarity: Color band denotes cathode end  
Mounting Position: Any  
Weight: 0.098 g  
Handling precautin:None  
Electrical Characteristic  
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
EFM  
201  
EFM  
202  
EFM  
203  
EFM  
204  
EFM  
205  
EFM  
206  
EFM  
207  
EFM  
208  
Parameter Symbol  
symbol  
Unit  
EFM  
201  
EFM  
202  
EFM  
203  
EFM  
204  
EFM  
205  
EFM  
206  
EFM  
207  
EFM  
208  
Device marking code  
VRRM  
VRSM  
VDC  
Maximum repetitive peak reverse voltage  
Maximum RSM voltage  
50  
35  
50  
100  
70  
150  
105  
150  
200  
140  
200  
300  
210  
300  
400  
280  
400  
500  
350  
500  
600  
420  
600  
V
V
V
Maximum DC blocking voltage  
100  
Maximum average forward rectified current  
at TA = 75°C  
2.0  
IF(AV)  
IFSM  
A
A
Peak forward surge current 8.3ms single half sine-wave  
superimposed on rated load (JEDEC Method)  
50  
55  
Typical thermal resistance (Note 2)  
RθJA  
°C/W  
°C  
50 to +150  
Operating junction and storage temperature range  
TJ, TSTG  
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
EFM  
201  
EFM  
202  
EFM  
203  
EFM  
204  
EFM  
205  
EFM  
206  
EFM  
207  
EFM  
208  
Parameter Symbol  
symbol  
Unit  
V
VF  
0.95  
1.25  
1.7  
Maximum instantaneous forward voltage at 2.0A  
5.0  
100  
Maximum DC reverse current TA = 25°C  
at rated DC blocking voltage TA = 125°C  
IR  
µA  
35  
Typical reverse recovery time (Note 1)  
Typical junction capacitance at 4.0V, 1MHz  
NOTES:  
trr  
ns  
15.0  
CJ  
PF  
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A  
2. 8.0mm2 (.013mm thick) land areas  
EFM201 thru EFM208  
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )  
Fig. 2 Maximum Non-repetitive Peak  
Fig. 1 Forward Current Derating Curve  
Forward Surge Current  
100  
60 Hz  
TJ = TJ max  
Resistive or  
Inductive Load  
8.3ms Single Half Sine-wave  
(JEDEC Method)  
2.0  
1.0  
80  
60  
40  
20  
0
0.375" (9.5mm) Lead Length  
0
1
10  
100  
0
25  
50 75 100 125 150 175  
Ambient Temperature, °C  
Number of Cycles at 60Hz  
Fig 3. Typical Instantaneous Forward  
Fig 4. Typical Reverse Characteristics  
Characteristics  
100  
10  
100  
TJ = 25°C  
Pulse width = 300µs  
1% Duty Cycle  
Tj=125  
10  
1.0  
0.1  
1.0  
Tj=25℃  
0.1  
0.01  
0.01  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
0
20  
40  
60  
80  
100  
Instantaneous Forward Voltage (V)  
Percent of Rated Peak Reverse Voltage (%)  
Fig 5. typical transient thermal  
Fig 6. Typical Junction Capacitance  
impedance  
100  
10  
20  
10  
TJ = 25°C  
f = 1.0 MHz  
Vsig = 50mVp-p  
1.0  
0.1  
1.0  
0.1  
0.01  
0.1  
1.0  
10  
100  
1
10  
t,Pulse duration,sec  
Reverse Voltage (V)  
EFM201 thru EFM208  
3. dimension:  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
2 页  
SMD产品通用包装材料规格以及包装产品数量  
General packaging materials spec. and quantity  
1.1 卷装 reel  
A.卷盘规格reel spec  
单位:mm  
规格  
A
B
C
W
卷数量  
2K  
SMA 7"卷盘  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
177.0±2.0 54.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
13.2±0.2  
13.2±0.2  
13.5±0.5  
17.0±0.5  
5K  
3K  
3K  
B. 13"卷盘内盒 inner box  
单位:mm  
A
B
C
尺寸  
335±5.0  
335±2.0  
40±1.0  
按以上包装方式,产品包装数量:quant i t y  
规格  
盒数量  
10K  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
6K  
6K  
文件编号: WI - 258  
文件编号: WI - 258  
标题Ti t i l e:  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
3 页  
C. 7"卷盘盒 box  
单位:mm  
A
B
C
尺寸  
188±2.0  
188±2.0  
138±2.0  
按以上包装方式,产品包装数量:quant i t y  
盒数量  
16K  
7"卷盘  
D. 卷盘外reel carton  
单位:mm  
A
B
C
尺寸  
350±2.0  
340±2.0  
350±2.0  
按以上包装方式,产品包装数量:  
规格  
每箱数量  
80K  
SMA 7"卷盘  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
80K  
48K  
36K  
1.2 编带规格 tape spec  
A. Cover tape  
单位:mm  
B
A
SMA  
9.30±0.10  
0.068±0.005  
SMB  
SMC  
13.30±0.10  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
4 页  
B. 带  
t
Do  
Po  
P2  
类型  
W
SMA  
SMC  
SMB  
B'  
12±0.3  
16±0.3  
12±0. 3  
P1  
E
4±0.1  
8±0.1  
8±0. 1  
1.75±0.1  
5.5±.05  
1.55±0.05  
1.5±0.1  
4±0.1  
1.75±0.1  
7.5±.05  
1.55±0.05  
1.55±0.05  
4±0.1  
1. 75±0. 1  
5. 5±0. 05  
1. 55±0. 05  
1. 55±0. 05  
4±0. 1  
F
D0  
D1  
P0  
P2  
10P0  
A0  
B0  
K0  
T
D1  
P1  
A'  
A
B
SEC.:B-B'  
2±0.05  
2±0.05  
2±0. 05  
40±0.2  
40±0.2  
40±0. 2  
2.79±0.1  
5.33±0.1  
2.36±0.1  
0.25±0.05  
6.05±0.1  
8.31±0.1  
2.54±0.1  
0.25±0.05  
3. 8±0. 1  
5. 4±0. 1  
2. 45±0. 1  
0. 25±0. 05  
Ao  
产品负极端( 编  
带有孔一边)  
SEC.:A-A'  
2SMD产品通用包装规范 General spec of SMD  
5.2.1国内客户domestic  
A. 7"卷盘reel  
所有标签贴在卷盘负极 al l t he l abel on cat hode si de  
C
A
C
A:LRC标签;  
B:ROHS标签  
C:卤标签 HF label  
B. 13"卷盘  
所有标签贴在卷盘负极 al l t he l abel o产品才贴HF onl y)  
A
C
C
A
A:LRC标签;  
B:ROHS标签 C:卤标签产品才贴HF only)  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
5 页  
C. 标签要求label spec:  
LRC标签label  
LRC产品t ype  
产品数量 quant i t y  
******  
******  
产品LOT  
******  
******  
产品生产日期  
dat e  
ROHS标签  
卤标签 HF l abel  
Green  
2.2 国外客户  
overseas  
所有标签贴在卷盘负极 al l t he l abel on cat hode si de  
A
C
7"卷盘盒 inner box  
13"卷盘内盒inner box  
C
C
A
A:LRC标签;  
B: ROHS标签  
C: 卤标签HF l abel  
产品才贴HF onl y)  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
6 页  
LRC标签label  
TYPE:******  
MARK:******  
Q'TY:******  
DATE:******  
LRC产品号  
印字型号  
产品数量  
产品生产日期  
ROHS标签  
卤标签 HF l abel  
Green  
注意事项NOTE:  
1. 13"卷盘内盒装产品,热缩膜包装;13"reelinner box must be packed by shrink film  
2. 有编带产品卷装完成后,白色胶编带粘牢;  
every tape after packingmust be fixed by white adhesive tape  
3.1产品出厂检验报告 testing report of the OQC  
每批出货时要附上出厂检验报告 ever y l ot must wi t h t est r epor t  
3.2尾箱  
码每批只允许出现一个尾,对于料,缓冲材料对空余部分,  
证物在受到一定的外作用力下明显移动且物碰撞。  
The same coding is only one ending for each batch box materials for the mantissa to  
be good filled with cushioning material.  
EFM201 thru EFM208  
5. Update Record  
更新记录  
第一版  
更新作者  
周杰  
更新日期  
2011- 3- 4  
2011- 4- 18  
版次  
1
增加包装规范  
周杰  
1. 1  

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