SODF157SH [LRC]

Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A;
SODF157SH
型号: SODF157SH
厂家: LESHAN RADIO COMPANY    LESHAN RADIO COMPANY
描述:

Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A

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SODF151-SH thru SODF157-SH  
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers  
Reverse Voltage 50 to 1000V Forward Current 1.5A  
FEATURES  
* Plastic package has Underwriters Laboratory  
Flammability Classification 94V-0  
* High temperature metallurgically  
bonded construction  
* Cavity-free glass passivated junction  
* Capable of meeting environmental standards  
of MIL-S-19500  
* Typical IR less than 1.0µA  
* High temperature soldering guaranteed:  
260°C/10 seconds  
Mechanical Data  
Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE  
Terminals: Tin Plated, solderable per  
MIL-STD-750, Method 2026  
We declare that the material of product is  
Haloggen free (green epoxy compound)  
Polarity: Color band denotes cathode end  
Mounting Position: Any  
Weight: 0.0155 g  
Handling precautin:None  
Electrical Characteristic  
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
SOD  
SOD  
SOD  
SOD  
SOD  
SOD  
SOD  
Parameter Symbol  
symbol  
Unit  
F151-SH F152-SH F153-SH F154-SH F155-SH F156-SH F157-SH  
Device marking code  
G1  
50  
35  
50  
G2  
100  
70  
G3  
200  
140  
200  
G4  
400  
280  
400  
G5  
600  
420  
600  
G6  
800  
560  
800  
G7  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
1000  
700  
V
V
V
Maximum DC blocking voltage  
100  
1000  
Maximum average forward rectified current  
lead length at TA = 75°C(Note 2)  
1.5  
50  
IF(AV)  
A
Peak forward surge current 8.3ms single half sine-  
wave superimposed on rated load (JEDEC Method)  
IFSM  
A
150  
500  
Typical reverse recovery time (Note 1)  
Typical thermal resistance (Note 1)  
trr  
250  
ns  
110  
40  
RθJA  
RθJC  
°C/W  
55 to +150  
65 to +175  
Operating junction temperature range  
storage temperature range  
TJ  
°C  
°C  
TSTG  
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
SOD  
SOD  
SOD  
SOD  
SOD  
SOD  
SOD  
Parameter Symbol  
symbol  
Unit  
V
F151-SH F152-SH F153-SH F154-SH F155-SH F156-SH F157-SH  
VF  
1.3  
Maximum instantaneous forward voltage at 1.5A  
5.0  
100  
Maximum DC reverse current TJ= 25°C  
at rated DC blocking voltage TJ = 125°C  
IR  
µA  
15.0  
Typical junction capacitance at 4.0V, 1MHz (Note 2)  
CJ  
PF  
NOTES:  
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A  
2. 8.0mm2 (.013mm thick) land areas  
SODF151-SH thru SODF157-SH  
2. Characteristic Curves ( TA = 25°C unless otherwise noted )  
Fig. 2 Maximum Non-repetitive Peak  
Fig. 1 Forward Current Derating Curve  
Forward Surge Current  
60 Hz  
TJ = TJ max  
Resistive or  
Inductive Load  
8.3ms Single Half Sine-wave  
(JEDEC Method)  
1.5  
50  
25  
0.75  
0.375" (9.5mm) Lead Length  
0
0
1
10  
100  
0
25  
50 75 100 125 150 175  
Number of Cycles at 60Hz  
Ambient Temperature, °C  
Fig 3. Typical Instantaneous Forward  
Fig 4. Typical Reverse Characteristics  
Characteristics  
10  
100  
10  
1.0  
Tj=125  
Tj=75℃  
Tj=25℃  
0.1  
0.01  
1.0  
TJ = 25°C  
Pulse width = 300µs  
1% Duty Cycle  
0.1  
0.001  
0.01  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
0
20  
40  
60  
80  
100  
Instantaneous Forward Voltage  
Percent of Rated Peak Reverse Voltage (%)  
Fig 5. typical transient thermal  
Fig 6. Typical Junction Capacitance  
impedance  
100  
10  
100  
10  
TJ = 25°C  
f = 1.0 MHz  
Vsig = 50mVp-p  
1.0  
0.1  
1.0  
0.1  
0.01  
0.1  
1.0  
10  
100  
1
10  
100  
t,Pulse duration,sec  
Reverse Voltage (V)  
SODF151-SH thru SODF157-SH  
3. dimension:  
SOD123-FL  
Suggested solder pad layout  
Dimensions in inches and (millimeters)  
SODF151-SH thru SODF157-SH  
4.Packing information  
Unitmm  
SODF151-SH thru SODF157-SH  
Reel packing  
APPOX.  
5.Suggested thermal profile for soldering process  
1. Storage environmentTemperature=5~40Humidity=55±25%  
2. Reflow soldering of surface-mount device  
3. Reflow soldering  
SODF151-SH thru SODF157-SH  
6.High reliability test capabilities  
SODF151-SH thru SODF157-SH  
7. Update Record  
更新记录  
第一版  
更新作者  
周杰  
更新日期  
版次  
2012.12.05  
1
因为所有SOD123系列均为无卤塑料,所以取消印字下  
划线  
周杰  
周杰  
2013.01.04  
2013.03.20  
2
3
将封装SOD-123S修正为SOD123-FL  

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