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001-0014 [LSTD]

Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module;
001-0014
型号： 001-0014
厂家： Laird Connectivity    Laird Connectivity
描述：

Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module

局域网 WLAN 无线局域网
文件： 总66页 (文件大小：1784K)
中文：  中文翻译
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Sterling-LWB Module  
Datasheet  
Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module  
FEATURES  
DESCRIPTION  
The Sterling-LWB is a high performance 2.4 GHz  
WLAN and Bluetooth combo module based on  
latest-generation silicon (Broadcom’s BCM4343W).  
With an industrial temperature rating, broad  
country certifications, and the availability of three  
different package styles, the Sterling-LWB provides  
significant flexibility to meet various end user  
application needs.  
•
•
IEEE 802.11 b/g/n (single stream n)  
Typical WLAN Transmit Power:  
o
o
o
+17.5 dBm, 11 Mbps, CCK (b)  
+14.0 dBm, 54 Mbps, OFDM (g)  
+12.5 dBm, HT20 MCS7 (n)  
•
Typical WLAN Sensitivity:  
o
o
o
-88 dBm, 8% PER,11 Mbps (b)  
-75 dBm, 10% PER, 54 Mbps (g)  
-72 dBm, 10% PER, MCS7 (n)  
The on-module chip antenna package style for the  
Sterling-LWB eliminates complexity for design  
integration, simplifies manufacturing assembly with  
larger pin outs, and features an advanced chip  
antenna that offers greater resistance to de-tuning  
than typical trace or chip antennas.  
•
•
•
Bluetooth v4.2 BR /DR/LE  
WLAN and Bluetooth coexistence  
Available in two footprint styles:  
o Easy to Integrate: 15.5 mm x 21 mm  
o Miniature footprint: 10 mm x 10 mm  
Available with integrated chip antenna or  
U.FL connector for external antenna  
Operating voltage: 3.0V to 3.6V  
Operating temperature: -40o to +85o C  
Storage temperature: -40° to +125°C  
Compact design based on Broadcom  
BCM4343W SoC  
•
•
•
•
•
•
Worldwide acceptance: FCC (USA), IC  
(Canada), ETSI (Europe), Giteki (Japan), and  
RCM (AU/NZ)  
BT SIG QDID: 85005  
REACH and RoHS compliant  
The module includes the MAC, Baseband and Radio  
to support WLAN applications and an independent,  
high-speed UART is provided for the Bluetooth host  
interface. In addition, the latest Linux and Android  
drivers are supported directly by LSR and  
Broadcom.  
•
APPLICATIONS  
•
•
•
Security & Building Automation  
Internet of Things / M2M Connectivity  
Smart Gateways  
Need to get to market quickly? Not an expert in  
802.11. Need a custom antenna? Would you like to  
own the design? Would you like a custom design?  
Not quite sure what you need? Do you need help  
with your host board? LSR Design Services will be  
happy to develop custom hardware or software or  
assist with integrating the design. Contact us at  
sales@lsr.com or call us at 262-375-4400.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 1 of 66  
 
 
 
Sterling-LWB Module  
Datasheet  
TABLE OF CONTENTS  
FEATURES ................................................................................................................................... 1  
APPLICATIONS ............................................................................................................................ 1  
DESCRIPTION .............................................................................................................................. 1  
TABLE OF CONTENTS................................................................................................................... 2  
MODULE VARIANTS .................................................................................................................... 5  
FUNCTIONAL FEATURES .............................................................................................................. 8  
WLAN Features...................................................................................................................................................... 8  
Bluetooth Features ................................................................................................................................................ 8  
Wireless Security System Features ........................................................................................................................ 8  
ORDERING INFORMATION .......................................................................................................... 9  
MODULE ACCESSORIES................................................................................................................ 9  
APPLICABLE DOCUMENTS ......................................................................................................... 10  
BLOCK DIAGRAMS..................................................................................................................... 11  
BASE SIP MODULE FOOTPRINT AND PIN DEFINITIONS ............................................................... 14  
BASE SIP MODULE PIN DESCRIPTIONS ....................................................................................... 15  
U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS...................................... 20  
U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS.............................................................. 21  
MODULE POWER STATES .......................................................................................................... 23  
U.FL AND CHIP ANTENNA MODULE PIN I/O STATES ................................................................... 24  
GENERAL CHARACTERISTICS...................................................................................................... 27  
WLAN Power Consumption.................................................................................................................................. 29  
Bluetooth Power Consumption............................................................................................................................ 29  
Power Supply Requirements................................................................................................................................ 30  
Calibration Current Profile................................................................................................................................... 31  
CRYSTAL OSCILLATOR REQUIREMENTS...................................................................................... 32  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 2 of 66  
 
Sterling-LWB Module  
Datasheet  
CONTROL SIGNAL TIMING DIAGRAMS....................................................................................... 33  
WLAN RF Characteristics...................................................................................................................................... 35  
Bluetooth RF Characteristics................................................................................................................................ 37  
WLAN HOST INTERFACE ............................................................................................................ 38  
SDIO Interface ..................................................................................................................................................... 38  
BLUETOOTH UART HOST INTERFACE.......................................................................................... 40  
Overview ............................................................................................................................................................. 40  
Soldering Recommendations ............................................................................................................................... 41  
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 41  
WIFI MAC IDS/BLUETOOTH MAC IDS......................................................................................... 42  
CLEANING ................................................................................................................................. 43  
OPTICAL INSPECTION ................................................................................................................ 43  
REWORK................................................................................................................................... 43  
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 43  
Shipping............................................................................................................................................................... 43  
Handling .............................................................................................................................................................. 43  
Moisture Sensitivity Level (MSL).......................................................................................................................... 43  
Storage ................................................................................................................................................................ 43  
Repeated Reflow Soldering.................................................................................................................................. 44  
AGENCY CERTIFICATIONS .......................................................................................................... 45  
AGENCY STATEMENTS............................................................................................................... 45  
Federal Communication Commission Interference Statement ............................................................................. 45  
Industry Canada Statements................................................................................................................................ 46  
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 47  
OEM LABELING REQUIREMENTS FOR END-PRODUCT................................................................. 48  
OEM END PRODUCT USER MANUAL STATEMENTS..................................................................... 49  
EUROPE .................................................................................................................................... 50  
CE Notice ............................................................................................................................................................. 50  
Declaration of Conformity (DOC) ......................................................................................................................... 50  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 3 of 66  
Sterling-LWB Module  
Datasheet  
AUSTRALIA ............................................................................................................................... 50  
RCM..................................................................................................................................................................... 50  
BLUETOOTH SIG QUALIFICATION............................................................................................... 51  
Overview ............................................................................................................................................................. 51  
Qualification Steps When Referencing a Laird Controller Subsystem Design ....................................................... 51  
Additional Assistance........................................................................................................................................... 52  
BASE SIP MODULE MECHANICAL DATA...................................................................................... 53  
BASE SIP MODULE PCB FOOTPRINT ........................................................................................... 54  
BASE SIP MODULE RECOMMENDED SOLDER STENCIL ................................................................ 55  
BASE SIP MODULE TAPE AND REEL PACKAGING......................................................................... 56  
U.FL AND CHIP ANTENNA MECHANICAL DATA........................................................................... 57  
U.FL AND CHIP ANTENNA PCB FOOTPRINT ................................................................................ 58  
U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING.............................................................. 59  
DEVICE MARKINGS.................................................................................................................... 60  
SiP Module .......................................................................................................................................................... 60  
Antenna Option Modules .................................................................................................................................... 62  
CONTACTING LSR ...................................................................................................................... 66  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 4 of 66  
Sterling-LWB Module  
Datasheet  
MODULE VARIANTS  
The LSR Sterling-LWB Module is available in three different versions. Depending on the user’s antenna and  
footprint needs, there is a variant to suite most application requirements. LSR recommends that for simplicity of  
both the host PCB design, as well as the manufacturing process, that either the Chip Antenna or RF Connector  
version of the modules be used in your design.  
•
450-0159 - Base SiP Module  
This module variant is supplied in a compact, 151 pin, 0.5 mm pitch LGA footprint. Unlike the other  
module variants, it requires the addition of either an off module antenna or RF connector, as well as the  
associated matching components. In order to benefit from the EMC certifications on the module,  
strictly following the layout in the module application guide is required. This requires adherence to the  
PCB stack-up and layout around the antenna. The footprint of this module may require additional care  
during reflow and PCB assembly.  
Figure 1 Sterling-LWB Base SiP Module (450-0159)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 5 of 66  
Sterling-LWB Module  
Datasheet  
•
450-0148 – U.FL Module  
This module variant integrates the 450-0159 Base SiP Module, a U.FL RF connector, and all associated RF  
matching components on a PCB. This integrated approach not only provides a U.FL connector for  
connections to external antennas, but also simplifies and reduces the cost of the end users host board  
by simplifying the module PCB footprint.  
Figure 2 Sterling-LWB U.FL Module (450-0148)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 6 of 66  
Sterling-LWB Module  
Datasheet  
•
450-0152 - Chip Antenna Module  
This module variant integrates the 450-0159 Base SiP Module, a chip antenna, and all associated RF  
matching components on a PCB. This integrated approach not only provides an external antenna  
solution, but also simplifies and reduces the cost of the end users host board by simplifying the module  
PCB footprint.  
Figure 3 Sterling-LWB Chip Antenna Module (450-0152)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 7 of 66  
Sterling-LWB Module  
Datasheet  
FUNCTIONAL FEATURES  
WLAN Features  
•
IEEE 802.11b/g/n 1x1 2.4 GHz Radio  
o
o
o
o
Internal Power Amplifier (PA)  
Internal Low Noise Amplifier(LNA)  
Internal T/R Switch  
Simultaneous BT/WLAN reception with a single antenna.  
•
•
•
•
Media Access Controller (MAC)  
Physical Layer (PHY)  
Baseband Processor  
Standards  
o
IEEE 802.11b, 802.11g, 802.11n (single stream)  
Bluetooth Features  
•
•
•
•
Class 2 power amplifier with Class 2 capability  
HCI Interface using High Speed UART  
PCM for Audio Data  
Bluetooth v4.2 BR /DR/LE  
Wireless Security System Features  
Supported modes:  
•
o
o
o
o
o
o
o
o
o
o
o
Open (no security)  
WEP  
WPA Personal  
WPA2 Personal  
WMM  
WMM-PS (U-APSD)  
WMM-SA  
WAPI  
AES (Hardware Accelerator)  
TKIP (host-computed)  
CKIP (SW Support)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 8 of 66  
Sterling-LWB Module  
Datasheet  
ORDERING INFORMATION  
Order Number  
Description  
Sterling-LWB U.FL Module (Cut Tape)  
450-0148C  
450-0148R  
450-0152C  
450-0152R  
450-0159C  
450-0159R  
450-0155  
450-0156  
450-0173  
Sterling-LWB U.FL Module (Tape and Reel, SPQ = 1000)  
Sterling-LWB Chip Antenna Module (Cut Tape)  
Sterling-LWB Chip Antenna Module (Tape and Reel, SPQ = 1000)  
Sterling-LWB Base SiP Module (Cut Tape)  
Sterling-LWB Base SiP Module (Tape and Reel, SPQ = 1000)  
Sterling-LWB SD Development Board, U.FL  
Sterling-LWB SD Development Board, Chip Antenna  
Sterling-LWB Development Board, WICED  
Table 1 Orderable Sterling-LWB Part Numbers  
MODULE ACCESSORIES  
Order Number  
Description  
2.4 GHz Dipole Antenna with Reverse Polarity  
SMA Connector  
001-0001  
U.FL to Reverse Polarity SMA Bulkhead Cable  
105mm  
080-0001  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 9 of 66  
Sterling-LWB Module  
Datasheet  
001-0014  
2.4 GHz FlexPIFA Antenna  
001-0015  
2.4 GHz FlexNotch Antenna  
2.4 GHz Metal FlexPIFA Antenna w/U.FL  
Cable, 100mm  
001-0030  
Table 2 Module Accessories  
APPLICABLE DOCUMENTS  
•
•
•
•
Sterling-LWB Module User Guide (330-0192)  
Sterling-LWB SD Card User Guide (330-0245)  
Sterling-LWB i.MX6 UltraLite Eval Kit Linux Integration User Guide (330-0201)  
Sterling-LWB WICED Board User Guide (330-0234)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 10 of 66  
Sterling-LWB Module  
Datasheet  
BLOCK DIAGRAMS  
Figure 4 Sterling-LWB Base SiP Module Block Diagram  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 11 of 66  
Sterling-LWB Module  
Datasheet  
Figure 5 Sterling-LWB U.FL Module Block Diagram  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 12 of 66  
Sterling-LWB Module  
Datasheet  
Figure 6 Sterling-LWB Chip Antenna Module Block Diagram  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 13 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE FOOTPRINT AND PIN DEFINITIONS  
Note that the following footprint and pin definition applies to the Sterling-LWB Base SiP Module (450-0159).  
There are two module footprints depending on which variant of the module is being used, so it is important to  
make certain you are using the correct version on your design.  
Figure 7 Sterling-LWB Base SiP Module Pinout (Top View)  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 14 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE PIN DESCRIPTIONS  
Module  
Name  
Pin  
I/O Type  
Description  
1
2
ANT  
RF  
RF TRANSMITTER OUTPUT AND RECEIVE INPUT  
GROUND  
GND  
GND  
3
VDD_3V3_WIFI_PA  
PI  
WIFI PA POWER SUPPLY  
WIFI PA POWER SUPPLY  
GROUND  
4
VDD_3V3_WIFI_PA  
PI  
5
GND  
NC  
GND  
NO CONNECT (DO NOT CONNECT)  
GROUND  
6
-
7
GND  
NC  
GND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
8
-
9
NC  
-
10  
11  
12  
13  
14  
15  
16  
17  
18  
GND  
NC  
GND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
-
NC  
-
NC  
-
NC  
-
GND  
-
GND  
NC  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
-
GND  
GND  
EXTERNAL SYSTEM CLOCK REQUEST – USED WHEN THE SYSTEM  
CLOCK IS NOT PROVIDED BY A DEDICATED CRYSTAL  
19  
CLK_REQ  
DO  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
BT_GPIO_3  
DIO  
-
WPT_INTb TO WIRELESS CHARGING PMU  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
-
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
DI  
32K_PWM_IN  
GND  
EXTERNAL SLEEP CLOCK INPUT  
GROUND  
GND  
PI  
VDD3V3_WiFi_IO  
GND  
DC SUPPY FOR WIFI AND I/O  
GROUND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NC  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 15 of 66  
Sterling-LWB Module  
Datasheet  
Module  
Pin  
Name  
I/O Type  
Description  
NO CONNECT (DO NOT CONNECT)  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
NC  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
-
-
NC  
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
-
GND  
GND  
DIO  
GND  
PI  
SDIO_D3  
SDIO DATA LINE 3  
GND  
GROUND  
VDD3V3_WIFI  
WIFI POWER SUPPLY  
WIFI POWER SUPPLY  
GROUND  
VDD3V3_WIFI  
PI  
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
-
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
GND  
-
GND  
DIO  
DIO  
DO  
GND  
-
BT_PCM_CLK  
BT_DEV_WAKE  
BT_HOST_WAKE  
GND  
PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
DEV_WAKE OR GENERAL-PURPOSE I/O SIGNAL  
HOST_WAKE OR GENERAL-PURPOSE I/O SIGNAL  
GROUND  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
GND  
-
GND  
GROUND  
NO CONNECT (DO NOT CONNECT)  
NC  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 16 of 66  
Sterling-LWB Module  
Datasheet  
Module  
Pin  
Name  
I/O Type  
Description  
NO CONNECT (DO NOT CONNECT)  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
NC  
GND  
NC  
-
GND  
GROUND  
NO CONNECT (DO NOT CONNECT)  
GROUND  
-
GND  
NC  
GND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
-
NC  
-
NC  
-
GND  
GND  
GND  
GND  
NC  
GND  
GND  
GROUND  
GND  
GROUND  
GND  
GROUND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
-
NC  
-
NC  
-
GND  
NC  
GND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
-
-
-
-
-
-
-
-
-
-
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
USED BY PMU TO POWER UP OR POWER DOWN THE INTERNAL  
REGULATORS USED BY THE WLAN SECTION  
88  
WL_REG_ON  
DI  
89  
90  
91  
92  
93  
WIFI_GPIO_1  
DIO  
PROGRAMMABLE GPIO PIN  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
NC  
-
GND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
-
-
NC  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 17 of 66  
Sterling-LWB Module  
Datasheet  
Module  
Pin  
Name  
I/O Type  
Description  
94  
GND  
SDIO_D0  
SDIO_D1  
SDIO_D2  
SDIO_CMD  
GND  
GND  
DIO  
DIO  
DIO  
DIO  
GND  
DI  
GROUND  
95  
SDIO DATA LINE 0  
SDIO DATA LINE 1  
SDIO DATA LINE 2  
SDIO COMMAND LINE  
GROUND  
96  
97  
98  
99  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
125  
SDIO_CLK  
GND  
SDIO CLOCK INPUT  
GROUND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NC  
NC  
-
NC  
-
BT_I2S_CLK  
NC  
DIO  
-
I2S CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
I2S_WS; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
I2S DATA OUTPUT  
NC  
-
NC  
-
BT_I2S_WS  
BT_I2S_D0  
NC  
DIO  
DIO  
-
NO CONNECT (DO NOT CONNECT)  
GROUND  
GND  
GND  
GND  
GND  
GND  
GND  
-
GND  
GROUND  
GND  
GROUND  
GND  
GROUND  
GND  
GROUND  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
-
NC  
-
GND  
GND  
-
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
NC  
-
GND  
GND  
DIO  
-
WIFI_GPIO_4  
NC  
PROGRAMMABLE GPIO PIN  
NO CONNECT (DO NOT CONNECT)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 18 of 66  
Sterling-LWB Module  
Datasheet  
Module  
Pin  
Name  
I/O Type  
Description  
PROGRAMMABLE GPIO PIN  
126  
127  
128  
129  
130  
WIFI_GPIO_2  
WIFI_GPIO_3  
NC  
DIO  
DIO  
-
PROGRAMMABLE GPIO PIN  
NO CONNECT (DO NOT CONNECT)  
BT_GPIO_4  
BT_GPIO_5  
DIO  
DIO  
BSC_SDA TO/FROM WIRELESS CHARGING PMU.  
BSC_SCL FROM WIRELESS CHARGING PMU.  
PROGRAMMABLE GPIO PIN. THIS PIN BECOMES AN OUTPUT  
PIN WHEN IT IS USED AS WLAN_HOST_WAKE/ OUT-OF-BAND  
SIGNAL.  
131  
WIFI_GPIO_0  
DIO  
132  
133  
134  
135  
GND  
NC  
GND  
-
GROUND  
NO CONNECT (DO NOT CONNECT)  
GROUND  
GND  
GND  
GND  
GND  
GROUND  
USED BY PMU TO POWER UP OR POWER DOWN THE INTERNAL  
REGULATORS USED BY THE BLUETOOTH SECTION  
136  
BT_REG_ON  
DI  
NO CONNECT (DO NOT CONNECT)  
UART REQUEST-TO-SEND  
UART CLEAR-TO-SEND  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
NC  
BT_UART_RTS_L  
BT_UART_CTS_L  
BT_UART_TXD  
BT_UART_RXD  
NC  
-
DO  
DI  
DO  
DI  
UART TRANSMIT OUTPUT  
UART RECEIVE INPUT  
NO CONNECT (DO NOT CONNECT)  
NO CONNECT (DO NOT CONNECT)  
PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
PCM DATA OUTPUT  
-
NC  
-
BT_PCM_SYNC  
BT_PCM_OUT  
BT_PCM_IN  
NC  
DIO  
DO  
DI  
PCM DATA INPUT SENSING  
NO CONNECT (DO NOT CONNECT)  
GROUND  
-
GND  
GND  
GND  
-
GND  
GROUND  
NO CONNECT (DO NOT CONNECT)  
GROUND  
NC  
GND  
GND  
PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port, RF = Bi-directional RF Port, GND = Ground  
Table 3 Sterling-LWB Module Pin Descriptions  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 19 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS  
Note that the following footprint and pin definitions apply to the Sterling-LWB U.FL and Chip Antenna variants of  
the module (450-0148 and 450-0152). There are two module footprints depending on which variant of the  
module is being used, so it is important to make certain you are using the correct version on your design.  
Figure 8 Sterling-LWB U.FL and Chip Antenna Module Pinout (Top View)  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 20 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS  
Module  
Pin  
Name  
I/O Type  
Description  
1
2
GND  
GND  
DIO  
DI  
GROUND  
BT_PCM_SYNC  
BT_PCM_IN  
BT_PCM_OUT  
VDD_3V3  
PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
PCM DATA INPUT SENSING  
PCM DATA OUTPUT  
3
4
DO  
5
PI  
WIFI AND BLUETOOTH POWER SUPPLY  
GROUND  
6
GND  
GND  
DIO  
DIO  
DIO  
DIO  
7
WIFI_GPIO_4  
WIFI_GPIO_3  
WIFI_GPIO_2  
WIFI_GPIO_1  
PROGRAMMABLE GPIO PIN  
PROGRAMMABLE GPIO PIN  
PROGRAMMABLE GPIO PIN  
PROGRAMMABLE GPIO PIN  
8
9
10  
PROGRAMMABLE GPIO PIN. THIS PIN BECOMES AN OUTPUT  
WHEN IT IS USED AS WLAN_HOST_WAKE/ OUT-OF-BAND  
SIGNAL.  
11  
WIFI_GPIO_0  
DIO  
USED BY PMU TO POWER UP OR POWER DOWN THE INTERNAL  
REGULATORS USED BY THE WLAN SECTION.  
12  
13  
WL_REG_ON  
CLK_REQ  
DI  
EXTERNAL SYSTEM CLOCK REQUEST – USED WHEN THE SYSTEM  
CLOCK IS NOT PROVIDED BY A DEDICATED CRYSTAL  
DO  
14  
15  
16  
GND  
GND  
DIO  
DIO  
GROUND  
BT_GPIO_3  
BT_GPIO_4  
PROGRAMMABLE GPIO PIN  
PROGRAMMABLE GPIO PIN  
17  
BT_GPIO_5  
DIO  
PROGRAMMABLE GPIO PIN  
18  
19  
20  
GND  
GND  
DI  
GROUND  
32KHZ_OSC_IN  
VDD_VIO  
EXTERNAL SLEEP CLOCK INPUT  
DC SUPPLY FOR I/O  
PI  
USED BY PMU TO POWER UP OR POWER DOWN THE INTERNAL  
REGULATORS USED BY THE BLUETOOTH SECTION.  
21  
BT_REG_ON  
DI  
22  
23  
24  
25  
26  
27  
SDIO_D0  
SDIO_D1  
GND  
DIO  
DIO  
GND  
DIO  
DIO  
DIO  
SDIO DATA LINE 0  
SDIO DATA LINE 1  
GROUND  
SDIO_D2  
SDIO_CMD  
SDIO_D3  
SDIO DATA LINE 2  
SDIO COMMAND LINE  
SDIO DATA LINE 3  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 21 of 66  
Sterling-LWB Module  
Datasheet  
Module  
Pin  
Name  
I/O Type  
Description  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
GND  
SDIO_CLK  
GND  
GND  
DIO  
GND  
DO  
GROUND  
SDIO CLOCK LINE  
GROUND  
BT_UART_RTS_L  
BT_UART_CTS_L  
BT_UART_TXD  
BT_UART_RXD  
BT_I2S_CLK  
BT_I2S_D0  
BT_I2S_WS  
BT_PCM_CLK  
BT_DEV_WAKE  
BT_HOST_WAKE  
GND  
BT UART REQUEST-TO-SEND  
BT UART CLEAR-TO-SEND  
BT UART TRANSMIT OUTPUT  
BT UART RECEIVE INPUT  
DI  
DO  
DI  
DIO  
DO  
I2S CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
I2S DATA OUTPUT  
DIO  
DIO  
DIO  
DO  
I2S_WS; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)  
DEV_WAKE OR GENERAL-PURPOSE I/O SIGNAL  
HOST_WAKE OR GENERAL-PURPOSE I/O SIGNAL  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GND  
GND  
GND  
GND  
GND  
GND  
PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port, GND = Ground  
Table 4 Sterling-LWB U.FL and Chip Antenna Module Pin Descriptions  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 22 of 66  
Sterling-LWB Module  
Datasheet  
MODULE POWER STATES  
The Sterling-LWB WLAN power states are described as follows:  
• Active mode- All WLAN blocks in the Sterling-LWB are powered up and fully functional with active carrier sensing and  
frame transmission and receiving. All required regulators are enabled and put in the most efficient mode based on the load  
current. Clock speeds are dynamically adjusted by the PMU sequencer.  
• Doze mode- The radio, analog domains, and most of the linear regulators are powered down. The rest of the BCM4343W  
remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator) are shut down to reduce active power to the  
minimum. The 32.768 kHz LPO clock is available only for the PMU sequencer. This condition is necessary to allow the PMU  
sequencer to wake up the chip and transition to Active mode. In Doze mode, the primary power consumed is due to  
leakage current.  
• Deep-sleep mode- Most of the chip, including analog and digital domains, and most of the regulators are powered off.  
Logic states in the digital core are saved and preserved to retention memory in the always-on domain before the digital  
core is powered off. To avoid lengthy hardware re-initialization, the logic states in the digital core are restored to their pre-  
deep-sleep settings when a wake-up event is triggered by an external interrupt, a host resume through the SDIO bus, or by  
the PMU timers.  
• Power-down mode—The BCM4343W is effectively powered off by shutting down all internal regulators. The chip is  
brought out of this mode by external logic re-enabling the internal regulators.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 23 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA MODULE PIN I/O STATES  
Out of Reset: (VDD_VIO is present)  
WL_REG_ON =1 WL_REG_ON =1 WL_REG_ON =0  
Low Power  
State/Sleep (All  
Power Present)  
Power Down(c)  
WL_REG_ON =0  
BT_REG_ON = 0  
Keeper  
(b)  
Pin #  
Name  
Active Mode  
BT_REG_ON = any  
BT_REG_ON = 0  
BT_REG_ON = 1  
2
3
4
7
8
BT_PCM_SYNC  
BT_PCM_IN  
Y
Y
Y
Y
Y
Input No Pull(d)  
Input No Pull(d)  
Input No Pull(d)  
TBD  
Input No Pull(d)  
Input No Pull(d)  
Input No Pull(d)  
Active Mode  
High –Z No Pull  
High –Z No Pull  
High –Z No Pull  
-
-
-
Input,PD  
Input,PD  
Input,PD  
Input,PD  
Input,PD  
Input,PU  
Input,PU  
BT_PCM_OUT  
WIFI_GPIO_4  
WIFI_GPIO_3  
Input,PD  
High –Z No Pull(f) Input,GCI GPIO[1] PU  
High –Z No Pull(f) Input,GCI GPIO[0] PU  
Active Mode  
Active Mode  
TBD  
Active Mode  
Input,GCI GPIO[7]  
Input, Strap,  
NoPull  
9
WIFI_GPIO_2  
WIFI_GPIO_1  
WIFI_GPIO_0  
Y
Y
Y
TBD  
TBD  
TBD  
Active Mode  
Active Mode  
Active Mode  
High –Z No Pull(f)  
Active Mode  
Active Mode  
Active Mode  
NoPull  
10  
11  
High –Z No Pull(f)  
High –Z No Pull(f)  
Input,PD  
Input, Strap, PD  
Input,NoPull  
Input,SDIO OOB Int.  
NoPull  
Input; PD (pull-  
down can be  
disabled)  
Input; PD (pull-  
down can be  
disabled)  
Input; PD (of  
200K)  
Input; PD  
(200K)  
12  
13  
21  
WL_REG_ON  
CLK_REQ  
N
Y
Input; PD (200K)  
-
Open drain or  
push-pull (Active  
high)  
Open drain or  
push-pull (Active  
high)  
Open drain,  
(Active high)  
Open drain,  
(Active high)  
Open drain,  
(Active high)  
PD  
Input; PD (pull-  
down can be  
disabled)  
Input; PD (pull-  
down can be  
disabled)  
Input; PD (of  
200K)  
Input; PD  
(200K)  
BT_REG_ON  
N
Input; PD (200K)  
Input; PD (200K)  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
22  
23  
SDIO_D0  
SDIO_D1  
N
N
SDIO MODE ->PullUP  
SDIO MODE ->PullUP  
Input,PU  
Input,PU  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 24 of 66  
Sterling-LWB Module  
Datasheet  
Out of Reset: (VDD_VIO is present)  
Low Power  
State/Sleep (All  
Power Present)  
Power Down(c)  
WL_REG_ON =0  
BT_REG_ON = 0  
Keeper  
(b)  
Pin #  
Name  
Active Mode  
WL_REG_ON =1 WL_REG_ON =1 WL_REG_ON =0  
BT_REG_ON = any  
BT_REG_ON = 0  
BT_REG_ON = 1  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
25  
26  
27  
29  
SDIO_D2  
SDIO_CMD  
SDIO_D3  
N
N
N
N
SDIO MODE ->PullUP  
Input,PU  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->PullUP  
SDIO MODE ->PullUP  
SDIO MODE ->NoPull  
Input,PU  
Input,PU  
Input  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO MODE ->  
NoPull  
SDIO_CLK  
31  
32  
33  
34  
35  
36  
37  
38  
BT_UART_RTS_L  
BT_UART_CTS_L  
BT_UART_TXD  
BT_UART_RXD  
BT_I2S_CLK  
Y
Y
Y
Y
Y
Y
Y
Y
Output:NoPull  
Input:NoPull  
Output:NoPull  
Input:NoPull  
High-Z,NoPull  
High-Z,NoPull  
High-Z,NoPull  
High-Z,NoPull  
High-Z,NoPull  
High-Z,NoPull  
High-Z,NoPull  
High –Z NoPull  
-
-
-
-
-
-
-
-
Input:PU  
Input:PU  
Input:PU  
Input:PU  
Input,PD  
Input,PD  
Input,PD  
Input,PD  
Output:NoPull  
Input:NoPull  
Output:NoPull  
Input:NoPull  
Output: Drive Low  
Input,PD  
Output:NoPull  
Input:PU  
Output:NoPull  
Input:NoPull  
Input:NoPull(e)  
Input:NoPull(e)  
Input:NoPull(e)  
Input No Pull(d)  
Input:NoPull(e)  
Input:NoPull(e)  
Input:NoPull(e)  
Input No Pull(d)  
BT_I2S_D0  
BT_I2S_WS  
Input,PD  
BT_PCM_CLK  
Input,PD  
I/O: PU,PD,NoPull  
(Programmable)  
I/O: PU,PD,NoPull  
(Programmable)  
39  
40  
BT_DEV_WAKE  
BT_HOST_WAKE  
Y
Y
High-Z,NoPull  
High-Z,NoPull  
-
-
Input,PD  
Input,PD  
Input,PD  
I/O: PU,PD,NoPull  
(Programmable)  
I/O: PU,PD,NoPull  
(Programmable)  
Ouput, Drive Low  
Table 5 I/O States  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 25 of 66  
Sterling-LWB Module  
Datasheet  
The following notations are used:  
•
•
•
•
•
•
I: Input signal  
O: Output signal  
I/O: Input/Output signal  
PU = Pulled up  
PD = Pulled down  
NoPull = Neither pulled up nor pulled down  
Notes:  
a. PU = pulled up, PD = pulled down.  
b. N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in the power-down state. If there is no keeper, and it is an input and there is  
NoPull, then the pad should be driven to prevent leakage due to floating pad, for example, SDIO_CLK.  
c. In the Power-down state (xx_REG_ON = 0): High-Z; NoPull => The pad is disabled because power is not supplied.  
d. Depending on whether the PCM interface is enabled and the configuration is master or slave mode, it can be either an output or input.  
e. Depending on whether the I2S interface is enabled, and configuration is master or slave mode, it can be either an input or output.  
f. The GPIO pull states for the active and low-power states are hardware defaults. They can all be subsequently programmed as a pull-up or pull-down.  
g. Strap state enables Serial Wire Debugging.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 26 of 66  
Sterling-LWB Module  
Datasheet  
GENERAL CHARACTERISTICS  
General  
Characteristic  
Description  
Model Name  
Sterling-LWB  
Product Description  
WiFi and Bluetooth Wireless Module  
10 mm x 10 mm x 1.2 mm (W*L*T)  
15.5 mm x 21 mm x 2 mm (W*L*T)  
-40°C to 85°C  
Dimension (SiP Module)  
Dimension (Antenna Option Module)  
Operating temperature  
Storage temperature  
-40°C to 125°C  
Weight  
0.9 g ± 0.1g  
Table 6 General Characteristics  
DC Characteristics – General Purpose I/O  
Parameter  
Test Conditions  
VDD_VIO = 1.8V  
Min  
Typical  
Max  
Unit  
Logic input low, VIL  
Logic input high, VIH  
Logic output low, VOL  
Logic output high, VOH  
Logic input low, VIL  
Logic input high, VIH  
Logic output low, VOL  
Logic output high, VOH  
-
-
-
-
-
-
-
-
-
0.35x VDD_VIO  
V
V
V
V
V
V
V
V
VDD_VIO = 1.8V  
VDD_VIO = 1.8V 2mA  
VDD_VIO = 1.8V 2mA  
VDD_VIO = 3.3V  
0.65x VDD_VIO  
-
-
0.45  
VDD_VIO-0.45  
-
0.80  
-
--  
VDD_VIO = 3.3V  
2.00  
VDD_VIO = 3.3 2mA  
VDD_VIO = 3.3 2mA  
-
0.40  
-
VDD_VIO-0.40  
Table 7 DC Characteristics General Purpose I/O  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 27 of 66  
Sterling-LWB Module  
Datasheet  
DC Characteristics – SDO Interface Pins  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Unit  
Logic input low, VIL  
Logic input high, VIH  
Logic output low, VOL  
Logic output high, VOH  
Logic input low, VIL  
Logic input high, VIH  
Logic output low, VOL  
Logic output high, VOH  
VDD_VIO = 1.8V  
VDD_VIO = 1.8V  
-
-
-
-
-
-
-
-
-
0.58  
V
V
V
V
V
V
V
V
1.27  
-
VDD_VIO = 1.8V 2mA  
VDD_VIO = 1.8V 2mA  
VDD_VIO = 3.3V  
-
0.45  
1.4  
-
0.625x VDD_VIO  
-
VDD_VIO = 3.3V  
-
0.25x VDD_VIO  
0.125x VDD_VIO  
-
VDD_VIO = 3.3 @ 2mA  
VDD_VIO = 3.3 @ 2mA  
-
0.75x VDD_VIO  
Figure 9 DC Characteristics SDIO I/O  
RF Characteristics  
Parameter  
Min  
Typical  
Max  
Unit  
RF frequency range  
RF data rate  
2400  
1
2500  
65  
MHz  
802.11 b/g/n rates supported  
Table 8 RF Characteristics  
Mbps  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 28 of 66  
Sterling-LWB Module  
Datasheet  
WLAN Power Consumption  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Unit  
Power Down Mode  
Sleep (idle, unassociated)  
IEEE Power Save DTIM 1  
11b TX Current  
Tamb = +25°C, VDD3V3 = VDD_VIO = 3.3V  
Tamb = +25°C, VDD3V3 = VDD_VIO = 3.3V  
Tamb = +25°C, VDD3V3 = VDD_VIO = 3.3V  
11 Mbps, Tamb = +25°C, 3.3V  
6 Mbps, Tamb = +25°C, 3.3V  
-
-
-
-
-
-
-
-
-
-
-
4
-
-
-
-
-
-
-
-
-
-
-
uA  
uA  
80  
2
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
290  
245  
215  
230  
200  
35  
11g TX Current  
11g TX Current  
54 Mbps, Tamb = +25°C, 3.3V  
MCS0, Tamb = +25°C, 3.3V  
11n TX Current  
11n TX Current  
MCS7, Tamb = +25°C, 3.3V  
11b RX Current  
11 Mbps, Tamb = +25°C, 3.3V  
54 Mbps, Tamb = +25°C, 3.3V  
MCS7, Tamb = +25°C, 3.3V  
11g RX Current  
35  
11n RX Current  
35  
Table 9 WLAN Power Consumption  
Bluetooth Power Consumption  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Unit  
Power Down Mode  
GFSK TX Current  
EDR TX Current  
GFSK RX Current  
EDR RX Current  
BLE TX Current  
BLE RX Current  
Tamb = +25°C, VDD3V3 = VDD_VIO = 3.3V  
-
-
-
-
-
-
-
4
uA  
mA  
mA  
mA  
mA  
mA  
mA  
-
-
-
-
-
-
-
Constant Transmit, DH5, PRBS9 Tamb = +25°C, 3.3V  
Constant Transmit, 2DH5,3DH5, PRBS9 Tamb = +25°C, 3.3V  
Constant Receive, DH5 Tamb = +25°C, 3.3V  
Constant Receive, 2DH5, 3DH5 Tamb = +25°C, 3.3V  
Tamb = +25°C, 3.3V  
50  
43  
25  
25  
44  
25  
Tamb = +25°C, 3.3V  
Table 10 WLAN Power Consumption  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 29 of 66  
Sterling-LWB Module  
Datasheet  
Power Supply Requirements  
Power Supply Requirements  
Min  
Typical  
Max  
Unit  
VDD_VIO  
1.8  
-
3.3  
300  
3.6  
-
V
uA  
V
VDD_VIO Current  
VDD_3V3  
3.0  
-
3.3  
3.6  
-
VDD_3V3 Current  
See Note*  
mA  
Table 11 Power Supply Requirements  
* Note: See WLAN and Bluetooth Power Consumption Table for various steady-state operating values. This value is the typical peak current required for the Radio  
Transmitter Calibration Mode. See Current Waveform in Calibration Current Profile shown below.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 30 of 66  
Sterling-LWB Module  
Datasheet  
Calibration Current Profile  
Although the Max continuous supply current to the module is <300 mA, when providing power to the module, a  
power source capable of supplying 600 mA peak current for a duration of ~20 mSec is required by the module  
transmitter during calibration.  
Module calibration occurs:  
(1) When the Module is initially powered up.  
(2) The module is reset.  
(3) When the radio is initialized.  
(4) Every 2 minutes after the radio is initialized.  
Note: Radio calibration will not occur while the module is in modes Doze, Deep Sleep, Power Down or if  
the radio is not initialized.  
Figure 10 shows the current profile of the Sterling-LWB module during calibration. If current is limited to  
<600mA during this process, the module will fail to calibrate.  
Figure 10 Module RF Calibration Current Profile  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 31 of 66  
 
Sterling-LWB Module  
Datasheet  
CRYSTAL OSCILLATOR REQUIREMENTS  
32.768 KHz Oscillator  
Frequency Accuracy  
Duty Cycle  
± 200 ppm  
30% - 70%  
Input Signal Amplitude  
Signal Type  
200 – 3300 mV, p-p  
Square or Sine Wave  
<10,000 ppm  
Clock Jitter  
Table 12 Oscillator Requirements  
Note: A 32.768 KHz crystal is required in order for the module to be fully functional. The module will not boot  
without it.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 32 of 66  
Sterling-LWB Module  
Datasheet  
CONTROL SIGNAL TIMING DIAGRAMS  
Figure 11 WLAN = ON, Bluetooth = ON  
Figure 12 WLAN = OFF, Bluetooth = OFF  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 33 of 66  
Sterling-LWB Module  
Datasheet  
Figure 13 WLAN = ON, Bluetooth = OFF  
Figure 14 WLAN = OFF, Bluetooth = ON  
Note: For both the WL_REG_ON and BT_REG_ON pins, there should be at least a 10 ms time delay between consecutive  
toggles (where both signals have been driven low). This is to allow time for the CBUCK regulator to discharge. If this delay is  
not followed, then there may be a VDDIO in-rush current on the order of 36 mA during the next PMU cold start.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 34 of 66  
Sterling-LWB Module  
Datasheet  
WLAN RF Characteristics  
WLAN Transmitter Characteristics (TA = +25°C, VCC = 3.3 V)  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
1 Mbps BPSK 802.11(b) Mask Compliance  
35% EVM RMS power over TX packet  
1 Mbps DSSS (b) TX Output Power  
-
17.5  
-
dBm  
2 Mbps QPSK 802.11(b) Mask Compliance  
35% EVM RMS power over TX packet  
2 Mbps DSSS (b) TX Output Power  
-
17.5  
-
dBm  
5.5 Mbps QPSK 802.11(b) Mask Compliance  
35% EVM RMS power over TX packet  
5.5 Mbps DSSS (b) TX Output Power  
11 Mbps DSSS (b) TX Output Power  
6 Mbps OFDM (g) TX Output Power  
9 Mbps OFDM (g) TX Output Power  
12 Mbps OFDM (g) TX Output Power  
18 Mbps OFDM (g) TX Output Power  
24 Mbps OFDM (g) TX Output Power  
36 Mbps OFDM (g) TX Output Power  
48 Mbps OFDM (g) TX Output Power  
54 Mbps OFDM (g) TX Output Power  
MCS0 OFDM (n) TX Output Power  
MCS1 OFDM (n) TX Output Power  
MCS2 OFDM (n) TX Output Power  
MCS3 OFDM (n) TX Output Power  
MCS4 OFDM (n) TX Output Power  
MCS5 OFDM (n) TX Output Power  
MCS6 OFDM (n) TX Output Power  
MCS7 OFDM (n) TX Output Power  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
17.5  
17.5  
14.0  
14.0  
14.0  
14.0  
14.0  
14.0  
14.0  
14.0  
12.5  
12.5  
12.5  
12.5  
12.5  
12.5  
12.5  
12.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
11 Mbps CCK 802.11(b) Mask Compliance  
35% EVM RMS power over TX packet  
6 Mbps BPSK 802.11(g) Mask Compliance  
-5 dB EVM RMS power over TX packet  
9 Mbps BPSK 802.11(g) Mask Compliance  
-8 dB EVM RMS power over TX packet  
12 Mbps QPSK 802.11(g) Mask Compliance  
-10 dB EVM RMS power over TX packet  
18 Mbps QPSK 802.11(g) Mask Compliance  
-13 dB EVM RMS power over TX packet  
24 Mbps 16-QAM 802.11(g) Mask Compliance  
-16 dB EVM RMS power over TX packet  
36 Mbps 16-QAM 802.11(g) Mask Compliance  
-19 dB EVM RMS power over TX packet  
48 Mbps 64-QAM 802.11(g) Mask Compliance  
-22 dB EVM RMS power over TX packet  
54 Mbps 64-QAM 802.11(g) Mask Compliance  
-25 dB EVM RMS power over TX packet  
6.5 Mbps BPSK 802.11(n) Mask Compliance  
-5 dB EVM RMS power over TX packet  
13 Mbps QPSK 802.11(n) Mask Compliance  
-10 dB EVM RMS power over TX packet  
19.5 Mbps QPSK 802.11(n) Mask Compliance  
-13 dB EVM RMS power over TX packet  
26 Mbps 16-QAM 802.11(n) Mask Compliance  
-16 dB EVM RMS power over TX packet  
39 Mbps 16-QAM 802.11(n) Mask Compliance  
-19 dB EVM RMS power over TX packet  
52 Mbps 64-QAM 802.11(n) Mask Compliance  
-22 dB EVM RMS power over TX packet  
58.5 Mbps 64-QAM 802.11(n) Mask Compliance  
-25 dB EVM RMS power over TX packet  
65 Mbps 64-QAM 802.11(n) Mask Compliance  
-27 dB EVM RMS power over TX packet  
Table 13 WLAN Transmitter RF Characteristics  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 35 of 66  
Sterling-LWB Module  
Datasheet  
WLAN Receiver Characteristics  
(TA = +25°C, VCC = 3.3 V)  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
-94  
-93  
-91  
-88  
1 Mbps DSSS (b) RX Sensitivity  
2 Mbps DSSS (b) RX Sensitivity  
5.5 Mbps DSSS (b) RX Sensitivity  
11 Mbps DSSS (b) RX Sensitivity  
8% PER  
8% PER  
8% PER  
8% PER  
-
-
-
-
-
-
-
-
dBm  
dBm  
dBm  
dBm  
-90  
-89  
-87  
-85  
-83  
-80  
-76  
-75  
6 Mbps OFDM (g) RX Sensitivity  
9 Mbps OFDM (g) RX Sensitivity  
12 Mbps OFDM (g) RX Sensitivity  
18 Mbps OFDM (g) RX Sensitivity  
24 Mbps OFDM (g) RX Sensitivity  
36 Mbps OFDM (g) RX Sensitivity  
48 Mbps OFDM (g) RX Sensitivity  
54 Mbps OFDM (g) RX Sensitivity  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
-89  
-86  
-84  
-82  
-79  
-75  
-73  
-72  
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity  
MCS1 (13 Mbps) OFDM (n) RX Sensitivity  
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity  
MCS3 26 Mbps OFDM (n) RX Sensitivity  
MCS4 39 Mbps OFDM (n) RX Sensitivity  
MCS5 52 Mbps OFDM (n) RX Sensitivity  
MCS6 58.5 Mbps OFDM (n) RX Sensitivity  
MCS7 65 Mbps OFDM (n) RX Sensitivity  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
10% PER  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
-10  
-20  
-20  
11b RX Overload Level  
11g RX Overload Level  
11n RX Overload Level  
8% PER, 11 Mbps  
10% PER, 54 Mbps  
10% PER, MCS7  
-
-
-
-
-
-
dBm  
dBm  
dBm  
Table 14 WLAN Receiver RF Characteristics  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 36 of 66  
Sterling-LWB Module  
Datasheet  
Bluetooth RF Characteristics  
Bluetooth Transmitter GFSK & EDR Characteristics (TA=25°C, VBAT=3.3 V)  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Bluetooth Spec  
Unit  
GFSK RF Output Power  
EDR RF Output Power  
Power Control Step Size  
EDR Relative Power  
-
-
8.5  
4.0  
4
-
-
dBm  
dBm  
dB  
2
-4  
8
1
2-8  
-4/+1  
dB  
Table 15 Bluetooth  
Bluetooth Receiver GFSK & EDR Characteristics (TA=25°C, VBAT=3.3 V)  
Parameter  
GFSK Sensitivity  
Test Conditions  
Min  
Typical  
Max  
Bluetooth Spec  
Unit  
BER=0.1%  
BER=0.01%  
BER=0.01%  
BER=0.1%  
BER=0.01%  
BER=0.01%  
-
-
-
-
-
-
-90  
-92  
-87  
-20  
-20  
-20  
-
-
-
-
-
-
-70  
-70  
-70  
-20  
-
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
EDR 2 Mbps Sensitivity  
EDR 3 Mbps Sensitivity  
GFSK Maximum Input Level  
EDR 2 Maximum Input Level  
EDR 3 Maximum Input Level  
-
Table 16 Bluetooth  
BLE Transmitter Characteristics (TA=25°C, VBAT=3.3 V)  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Bluetooth Spec  
Unit  
GFSK RF Output Power  
Power Control Step Size  
-
7.5  
4
-
dBm  
dB  
2
8
2-8  
Table 17 Bluetooth  
BLE Receiver Characteristics (TA=25°C, VBAT=3.3 V)  
Parameter  
GFSK Sensitivity  
GMSK Maximum Input Level  
Test Conditions  
Min  
Typical  
Max  
Bluetooth Spec  
Unit  
PER = 30.8%  
PER = 30.8%  
-
-
-94  
-20  
-
-
-70  
-20  
dBm  
dBm  
Table 18 Bluetooth  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 37 of 66  
Sterling-LWB Module  
Datasheet  
WLAN HOST INTERFACE  
SDIO Interface  
Overview  
The Sterling-LWB Module WLAN section supports SDIO version 2.0. for both 1-bit (25 Mbps) and 4-bit modes  
(100 Mbps), as well as high speed 4-bit mode (50 MHz clocks—200 Mbps).  
Figure 15 Signal Connections to SDIO Host (SD 4-Bit Mode)  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 38 of 66  
Sterling-LWB Module  
Datasheet  
Figure 16 Signal Connections to SDIO Host (SD 1-Bit Mode)  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 39 of 66  
Sterling-LWB Module  
Datasheet  
BLUETOOTH UART HOST INTERFACE  
Overview  
The Sterling-LWB uses a single UART for Bluetooth. The UART is a standard 4-wire interface (RX, TX, RTS, and  
CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate  
detection capability that returns a baud rate selection. The baud rate may be selected through a vendor-specific  
UART HCI command to a value other than the default rate of 115.2 kbps.  
Figure 17 UART Connection from Sterling-LWB to Host  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 40 of 66  
Sterling-LWB Module  
Datasheet  
Soldering Recommendations  
Reflow for Lead Free Solder Paste  
•
•
•
•
Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an  
overall process development.  
It is important to provide a solder reflow profile that matches the solder paste supplier's  
recommendations.  
Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor  
solderability.  
All solder paste suppliers recommend an ideal reflow profile to give the best solderability.  
Recommended Reflow Profile for Lead Free Solder  
Figure 18 Recommended Soldering Profile  
Note: The quality of solder joints on the surface mount pads where they contact the host board should  
meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section  
8.2.1 “Bottom Only Terminations.”  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 41 of 66  
Sterling-LWB Module  
Datasheet  
WIFI MAC IDS/BLUETOOTH MAC IDS  
LSR has procured a block of IEEE MAC Address from the IEEE association. The MAC addresses are six (6) bytes in  
length and the three (3) Most Significant Bytes (MSBs) are the OUI, which is used to identify the company to  
which the block of IEEE addresses was assigned. LSR’s OUI is 00:25:CA.  
For the Sterling-LWB, the WiFi MAC ID and Bluetooth MAC ID is preprogrammed during production for each  
module. The Bluetooth MAC ID is the WiFi MAC ID plus one.  
Example:  
WiFi MAC ID  
Bluetooth MAC ID  
00:25:CA:07:00:02  
00:25:CA:07:00:04  
00:25:CA:07:00:06  
00:25:CA:07:00:08  
Module 1  
Module 2  
Module 3  
Module 4  
00:25:CA:07:00:01  
00:25:CA:07:00:03  
00:25:CA:07:00:05  
00:25:CA:07:00:07  
Table 19 Example MAC ID Assignments  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 42 of 66  
Sterling-LWB Module  
Datasheet  
CLEANING  
SHIPPING, HANDLING, AND STORAGE  
In general, cleaning the populated modules is  
strongly discouraged. Residuals under the module  
cannot be easily removed with any cleaning  
process.  
Shipping  
Bulk orders of the Sterling-LWB base module are  
delivered in reels of 2000. Bulk orders for the  
antenna option PCBAs are delivered in reels of  
1000.  
•
Cleaning with water can lead to capillary effects  
where water is absorbed into the gap between  
the host board and the module. The  
combination of soldering flux residuals and  
encapsulated water could lead to short circuits  
between neighboring pads. Water could also  
damage any stickers or labels.  
Handling  
The Sterling-LWB modules contain a highly sensitive  
electronic circuitry. Handling without proper ESD  
protection may damage the module permanently.  
•
•
Cleaning with alcohol or a similar organic  
solvent will likely flood soldering flux residuals  
into the RF shield, which is not accessible for  
post-washing inspection. The solvent could also  
damage any stickers or labels.  
Moisture Sensitivity Level (MSL)  
Per J-STD-020, devices rated as MSL 4 and not  
stored in a sealed bag with desiccant pack should be  
baked prior to use.  
Ultrasonic cleaning could damage the module  
permanently.  
OPTICAL INSPECTION  
Devices are packaged in a Moisture Barrier Bag with  
a desiccant pack and Humidity Indicator Card (HIC).  
Devices that will be subjected to reflow should  
reference the HIC and J-STD-033 to determine if  
baking is required.  
After soldering the Module to the host board,  
consider optical inspection to check the following:  
•
Proper alignment and centering of the module  
over the pads.  
If baking is required, refer to J-STD-033 for bake  
procedure.  
•
•
Proper solder joints on all pads.  
Excessive solder or contacts to neighboring  
pads, or vias.  
Storage  
REWORK  
Per J-STD-033, the shelf life of devices in a Moisture  
Barrier Bag is 12 months at <40C and <90% room  
humidity (RH).  
The Sterling-LWB module can be unsoldered from  
the host board if the Moisture Sensitivity Level  
(MSL) requirements are met as described in this  
datasheet.  
Do not store in salty air or in an environment with a  
high concentration of corrosive gas, such as Cl2,  
H2S, NH3, SO2, or NOX.  
Do not store in direct sunlight.  
Never attempt a rework on the module  
itself, e.g. replacing individual  
components. Such actions will terminate  
warranty coverage.  
The product should not be subject to excessive  
mechanical shock.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 43 of 66  
Sterling-LWB Module  
Datasheet  
Repeated Reflow Soldering  
Only a single reflow soldering process is encouraged for host boards.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 44 of 66  
Sterling-LWB Module  
Datasheet  
AGENCY CERTIFICATIONS  
FCC ID: TFB-1003, 15.247  
IC ID: 5969A-1003, RSS 247  
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489  
Giteki: 209-J00212  
RCM: Compliant to standards EN 300 328 V1.9.1, AS/NZS 4268: 2012-A1:2013, and EN 55022:2010/AC:2011  
AGENCY STATEMENTS  
Federal Communication Commission Interference Statement  
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part  
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a  
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not  
installed and used in accordance with the instructions, may cause harmful interference to radio  
communications. However, there is no guarantee that interference will not occur in a particular installation. If  
this equipment does cause harmful interference to radio or television reception, which can be determined by  
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the  
following measures:  
•
•
•
•
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help.  
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This  
device may not cause harmful interference, and (2) this device must accept any interference received, including  
interference that may cause undesired operation.  
FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for  
compliance could void the user's authority to operate this equipment.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 45 of 66  
Sterling-LWB Module  
Datasheet  
Industry Canada Statements  
This Device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the  
following two conditions: (1) this device may not cause interference, and (2) this device must accept any  
interference, including interference that may cause undesired operation of the device.  
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the  
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.  
This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0  
dBi (LSR Dipole), 2.0 dBi (LSR FlexPIFA), 2.0 dBi (LSR FlexNotch), 2.0 dBi (LSR mFlexPIFA), and 1.5 dBi (Johanson  
Chip). Antennas not included in this list or having a gain greater than 2.0 dBi, 2.0 dBi, 2.0 dBi, 2.0 dBi, and 1.5  
dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.  
List of all Antennas Acceptable for use with the Transmitter  
1) LSR 001-0001 center-fed 2.4 GHz dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector  
cable.  
2) LSR 001-0014 2.4 GHz FlexPIFA antenna.  
3) LSR 001-0015 2.4 GHz FlexNotch antenna.  
4) LSR 001-0030 2.4 GHz Metal FlexPIFA (mFlexPIFA) antenna.  
5) Johanson Technology 2450AT18D0100 chip antenna.  
Cet appareil est conforme avec Industrie Canada, exempts de licence standard RSS (s). L'opération est soumise  
aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit  
accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de  
l'appareil.  
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de  
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une  
communication réussie.  
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0 dBi  
(LSR Dipole), 2,0 dBi (LSR FlexPIFA), 2,0 dBi (LSR FlexNotch), 2,0 dBi (LSR mFlexPIFA), et 1,5 dBi (Johanson Chip).  
Antennes pas inclus dans cette liste ou présentant un gain supérieure à 2,0 dBi, 2,0 dBi, 2,0 dBi, 2,0 dBi, et 1,5  
dBi sont strictement interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50  
ohms.  
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur  
1) Antenne LSR 001-0001 2.4 GHz de centre-dipôle alimenté et LSR 080-0001 U.FL inverser câble connecteur SMA à  
polarité.  
2) LSR 001-0014 antenne FlexPIFA 2,4 GHz w/U.FL câble.  
3) LSR 001-0015 antenne FlexNotch 2,4 GHz w/U.FL câble.  
4) LSR 001-0030 antenne Métal FlexPIFA (mFlexPIFA) 2,4 GHz.  
5) Antenne de puce Johanson Technology 2450AT18D0100.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 46 of 66  
Sterling-LWB Module  
Datasheet  
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS  
The Sterling-LWB Module has been certified for integration into products only by OEM integrators under the  
following conditions:  
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the  
antenna must be installed to provide a separation distance of at least 29mm from all persons and operating in  
conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product  
procedures.  
As long as the two conditions above are met, further transmitter testing will not be required.  
However, the OEM integrator is still responsible for testing their end-product for any additional compliance  
requirements required with this module installed (for example, digital device emissions, PC peripheral  
requirements, etc.).  
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-  
location with another transmitter), then the FCC and Industry Canada authorizations are no longer  
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In  
these circumstances, the OEM integrator will be responsible for re-evaluating the end product  
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.  
Le module de Sterling-LWB a été certifié pour l'intégration dans des produits uniquement par des  
intégrateurs OEM dans les conditions suivantes:  
Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale /  
exposition non contrôlée, l'antenne doit être installé pour fournir une distance de séparation d'au moins 29mm  
de toutes les personnes et fonctionnant conjointement avec une autre antenne ou émetteur, sauf en conformité  
avec la FCC procédures de produits multi- émetteurs.  
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas  
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les  
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil  
numérique, les exigences de périphériques PC, etc.)  
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines  
configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations  
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut  
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer  
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada  
l'autorisation.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 47 of 66  
Sterling-LWB Module  
Datasheet  
OEM LABELING REQUIREMENTS FOR END-PRODUCT  
The Sterling-LWB module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC  
certification numbers are not visible when the module is installed inside another device, as such the end device  
into which the module is installed must display a label referring to the enclosed module. The final end product  
must be labeled in a visible area with the following:  
“Contains Transmitter Module FCC ID: TFB-1003”  
“Contains Transmitter Module IC: 5969A-1003”  
or  
“Contains FCC ID: TFB-1003”  
“Contains IC: 5969A-1003”  
The OEM of the Sterling-LWB Module must only use the approved antenna(s) listed above, which have been  
certified with this module.  
Le module de Sterling-LWB est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la  
FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre  
appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant  
référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:  
“Contient Module émetteur FCC ID: TFB-1003"  
“Contient Module émetteur IC: 5969A-1003"  
ou  
“Contient FCC ID: TFB-1003"  
“Contient IC: 5969A-1003"  
Les OEM du module Sterling-LWB ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce  
module.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 48 of 66  
Sterling-LWB Module  
Datasheet  
OEM END PRODUCT USER MANUAL STATEMENTS  
The OEM integrator should not to provide information to the end user regarding how to install or remove this RF  
module or change RF related parameters in the user manual of the end product.  
The user manual for the end product must include the following information in a prominent location:  
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the  
antenna(s) used for this transmitter must be installed to provide a separation distance of at least 29mm from all  
persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC  
multi-transmitter product procedures.  
Other user manual statements may apply.  
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de  
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.  
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en  
vue:  
Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale /  
exposition non contrôlée, l'antenne(s) utilisée pour ce transmetteur doit être installé pour fournir une distance  
de séparation d'au moins 29mm de toutes les personnes et fonctionnant conjointement avec une autre antenne  
ou émetteur, sauf en conformité avec les procédures de produits multi- émetteur FCC.  
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 49 of 66  
Sterling-LWB Module  
Datasheet  
EUROPE  
CE Notice  
This device has been tested and certified for use in the European Union. See the Declaration of Conformity  
(DOC) for specifics.  
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU  
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and  
Telecommunications Terminal Equipment (R&TTE) Directive.  
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.  
Declaration of Conformity (DOC)  
This DOC can be downloaded from the LSR Website.  
AUSTRALIA  
RCM  
Radiocommunications (Short Range Devices) Standard 2014 (Amnt 1:2015)  
Radiocommunications (Low Interference Potential Device) Class License 2015  
AS/NZS 4268: 2012-A1:2013  
EN 300328 V1.9.1  
Report No.: 316052 (316051), Dated: 21 July 2016, LS Research  
Radiocommunications (Electromagnetic Compatibility) Standard 2008  
EN 55022 : 2010/AC :2011  
Information Technology Equipment – Radio disturbance characteristics – Limits and methods measurement  
Report No. : TR 316051 B, dated : 6 July 2016, LS Research  
Radiocommunications (Electromagnetic Radiation – Human Exposure) Standard 2014  
Maximum Exposure Levels to Radio Frequency Fields – 3 KHz to 300 GHz (2002) RPS 3, ARPANSA  
Category B Exemption – Fixed Station Exemption, ARPANSA Schedule 5, General Public Exposure, <20mW Mean Power,  
Or no antenna near the body (>20cm from unaware user) and mean output power does not exceed Table 2 threshold  
for testing.  
Table 20 AU/NZS Certification  
If this device is used in a product, the OEM has responsibility to verify compliance of the final end product to the  
Australia/New Zealand (RCM) Standards. All end-products require their own certification (SDoc). You will not be  
able to leverage the module certification and ship product into the country.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 50 of 66  
Sterling-LWB Module  
Datasheet  
BLUETOOTH SIG QUALIFICATION  
Overview  
The Sterling-LWB module is listed on the Bluetooth SIG website as a qualified Controller Subsystem.  
Design Name  
Owner  
Declaration ID  
Link to listing on the SIG website  
450-0159  
450-0148  
450-0152  
Laird  
Laird  
Laird  
D031500  
D031500  
D031500  
Sterling-LWB 450-0159  
Sterling-LWB 450-0148  
Sterling-LWB 450-0152  
Table 21 Sterling-LWB Declaration ID  
It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing  
Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification  
process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification  
Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.org  
The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/  
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new  
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on  
your membership status, please refer to the following webpage:  
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees  
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG  
document, (login is required to views this document):  
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486  
Qualification Steps When Referencing a Laird Controller Subsystem Design  
To qualify your product when referencing a Laird Controller Subsystem design, follow these steps:  
1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm  
Note: A user name and password are required to access this site.  
2. In step 1, select the option, New Listing and Reference a Qualified Design.  
3. Enter 85005 in the Controller Subsystem table entry.  
4. Enter your complimentary Host Subsystem and optional Profile Subsystem in the table entry.  
5. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 51 of 66  
Sterling-LWB Module  
Datasheet  
Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot  
proceed until the SIG invoice is paid.  
6. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help  
document accessible from the site.  
Your new design will be listed on the SIG website and you can print your Certificate and SDoC.  
For further information please refer to the following training material:  
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates  
Additional Assistance  
Please contact your local sales representative or our support team for further assistance:  
Laird Technologies Connectivity Products Business Unit  
Support Centre: http://ews-support.lairdtech.com  
Email: wireless.support@lairdtech.com  
Phone: Americas: +1-800-492-2320  
Europe: +44-1628-858-940  
Hong Kong: +852 2923 0610  
Web: http://www.lairdtech.com/bluetooth  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 52 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE MECHANICAL DATA  
Figure 19 Base SiP Module Mechanical Dimensions  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 53 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE PCB FOOTPRINT  
©
Figure 20 Base SiP Module Footprint (Top View)  
Note:  
Three Pad Sizes  
Solder Mask  
Type A  
Type B  
Type C  
-
-
-
0.524 x 0.524 mm  
0.35 x 0.40mm  
2.8 x 2.8 mm  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 54 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE RECOMMENDED SOLDER STENCIL  
Figure 21 – Base SiP Module Recommended Solder Stencil (Top View)  
Note: Solder Mask and Paste Mask to be adjusted according to end users assembly process  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 55 of 66  
Sterling-LWB Module  
Datasheet  
BASE SIP MODULE TAPE AND REEL PACKAGING  
(Module must be in this Orientation when Feeding Tape)  
Figure 22 Base SiP Module Tape and Reel Specification  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 56 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA MECHANICAL DATA  
Figure 23 U.FL and Chip Antenna Mechanical Dimensions  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 57 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA PCB FOOTPRINT  
Figure 24 U.FL and Chip Antenna Host PCB Footprint  
Note: All Pads .762mm x .762mm Square. Solder Mask and Paste Mask to be adjusted according to end users  
assembly process  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 58 of 66  
Sterling-LWB Module  
Datasheet  
U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING  
(Module must be in this Orientation when Feeding Tape)  
Figure 25 U.FL and Chip Antenna Modules Tape and Reel Specification  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 59 of 66  
Sterling-LWB Module  
Datasheet  
DEVICE MARKINGS  
SiP Module  
Rev 1 Devices  
•
Initial Release  
The shield on the 450-0159 modules contains the following information:  
•
•
•
•
Pin 1 Indicator  
LSR  
MODEL: STERLING-LWB  
Part Number and Revision:  
o
o
P/N: 450-0159  
R1 = Revision 1  
•
•
•
•
•
FCC ID: TFB-1003  
IC: 5969A-1003  
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)  
XXXXX = Incremental Serial Number  
2D Barcode Format is Data Matrix Standard  
•
•
•
Giteki Logo  
Giteki Symbol of Radio Certification: R in the Square Box  
XXX-YYYYYY = Giteki Certification Type Number: 209-J00212. 209 is the CAB ID assigned by the Minister  
of MIC. J00212 is the Certification Number assigned by the CAB.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 60 of 66  
Sterling-LWB Module  
Datasheet  
Rev 2 Devices  
•
•
Added RCM (C-Tick) (Australia/New Zealand Certification) Logo  
Added TM (Trademark) Logo  
The shield on the 450-0159 modules contains the following information:  
•
•
•
•
Pin 1 Indicator  
LSR  
MODEL: STERLING-LWB  
Part Number and Revision:  
o
o
P/N: 450-0159  
R1 = Revision 1  
•
•
•
•
•
FCC ID: TFB-1003  
IC: 5969A-1003  
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)  
XXXXX = Incremental Serial Number  
2D Barcode Format is Data Matrix Standard  
•
•
•
Giteki Logo  
Giteki Symbol of Radio Certification: R in the Square Box  
XXX-YYYYYY = Giteki Certification Type Number: 209-J00212. 209 is the CAB ID assigned by the Minister  
of MIC. J00212 is the Certification Number assigned by the CAB.  
•
•
RCM Logo (Australia/New Zealand Certification)  
TM = Trademark Logo  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 61 of 66  
Sterling-LWB Module  
Datasheet  
Antenna Option Modules  
Rev 1 Devices  
•
Initial Release  
The shield on the 450-0148 & 450-0152 modules contains the following information:  
•
•
•
LSR  
M/N: STERLING-LWB  
Part Number and Revision:  
o
o
P/N: 450-0148 or 450-0152  
R1 = Revision 1  
•
•
•
•
•
FCC ID: TFB-1003  
IC: 5969A-1003  
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)  
XXXXX = Incremental Serial Number  
2D Barcode Format is Data Matrix Standard  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 62 of 66  
Sterling-LWB Module  
Datasheet  
Rev 2 Devices  
Updated the label to include Giteki marking information.  
•
The shield on the 450-0148 & 450-0152 modules contains the following information:  
•
•
•
LSR  
M/N: STERLING-LWB  
Part Number and Revision:  
o
o
P/N: 450-0148 or 450-0152  
R2 = Revision 2  
•
•
•
•
•
FCC ID: TFB-1003  
IC: 5969A-1003  
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)  
XXXXX = Incremental Serial Number  
2D Barcode Format is Data Matrix Standard  
•
•
•
Giteki Logo  
Giteki Symbol of Radio Certification: R in the Square Box  
Giteki Certification Type Number: 209-J00212. 209 is the CAB ID assigned by the Minister of MIC. J00212  
is the Certification Number assigned by the CAB.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 63 of 66  
Sterling-LWB Module  
Datasheet  
Rev 3 Devices  
Updated the label to include RCM (C-Tick) marking information.  
•
The shield on the 450-0148 & 450-0152 modules contains the following information:  
•
•
•
LSR  
M/N: STERLING-LWB  
Part Number and Revision:  
o
o
P/N: 450-0148 or 450-0152  
R3 = Revision 3  
•
•
•
•
•
FCC ID: TFB-1003  
IC: 5969A-1003  
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)  
XXXXX = Incremental Serial Number  
2D Barcode Format is Data Matrix Standard  
•
•
•
Giteki Logo  
Giteki Symbol of Radio Certification: R in the Square Box  
Giteki Certification Type Number: 209-J00212. 209 is the CAB ID assigned by the Minister of MIC. J00212  
is the Certification Number assigned by the CAB.  
•
•
RCM Logo (Australia/New Zealand Certification)  
TM = Trademark Logo  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 64 of 66  
Sterling-LWB Module  
Datasheet  
Rev 4 Devices  
• Internal Update to MRP System  
•
All label information is the same as Rev 3  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 65 of 66  
Sterling-LWB Module  
Datasheet  
CONTACTING LSR  
Headquarters  
LS Research, LLC  
W66 N220 Commerce Court  
Cedarburg, WI 53012-2636  
USA  
Tel: (262) 375-4400  
Fax: (262) 375-4248  
Website  
www.lsr.com  
forum.lsr.com  
sales@lsr.com  
Technical Support  
Sales Contact  
© Copyright 2018 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed  
to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and  
application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential  
uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird  
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall  
not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms  
and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a  
tradename herein, Laird means Laird Limited due to the acquisition by Advent or one or more subsidiaries of Laird Limited.  
LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird.  
Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party  
intellectual property right.  
The information in this document is subject to change without notice.  
330-0190-R7.1  
Copyright © 2016-2018 LSR  
Page 66 of 66  

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