450-0162C [LSTD]
Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module;型号: | 450-0162C |
厂家: | Laird Connectivity |
描述: | Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module 局域网 WLAN 无线局域网 |
文件: | 总80页 (文件大小:3110K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Sterling-LWB5 Module
Datasheet
Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module
FEATURES
DESCRIPTION
The Sterling-LWB5 is a high performance 2.4 GHz
and 5 GHz WLAN and Bluetooth Smart Ready
combo module based on latest-generation silicon
(Cypress’s BCM43353). With an industrial
temperature rating, broad country certifications,
and the availability of two different package styles,
the Sterling-LWB5 provides significant flexibility to
meet various end user application needs.
•
•
IEEE 802.11 a/b/g/n/ac (single stream n)
Typical WLAN Transmit Power:
o
o
o
+16 dBm, 11 Mbps, CCK (b)
+13 dBm, 54 Mbps, OFDM (g)
+11 dBm, HT20 MCS7 (n)
•
Typical WLAN Sensitivity:
o
o
o
-87 dBm, 8% PER,11 Mbps (b)
-73 dBm, 10% PER, 54 Mbps (g)
-71 dBm, 10% PER, MCS7 (n)
The on-module chip antenna package style for the
Sterling-LWB5 eliminates complexity for design
integration, simplifies manufacturing assembly with
larger pin outs, and features an advanced chip
antenna that offers greater resistance to de-tuning
than typical trace or chip antennas.
•
Bluetooth 2.1+EDR, Bluetooth 3.0,
Bluetooth 4.2 (Bluetooth Low Energy)
•
•
WLAN and Bluetooth coexistence
Available in two footprint styles:
o Easy to Integrate: 15.5 mm x 21 mm
o Miniature footprint: 10 mm x 10 mm
Available with integrated chip antenna or
U.FL connector for external antenna
Operating voltage: VBAT = 3.20V to 3.60V
VDDIO = 1.71V to 1.89V
•
•
•
•
Operating temperature: -40 to +85o C
Compact design based on Cypress
BCM43353 SoC
•
EMC Compliance: FCC (USA), IC (Canada), &
ETSI (Europe)
•
•
BT SIG QDID: 97564
REACH and RoHS compliant
The module includes the MAC, Baseband and Radio
to support WLAN applications and an independent,
high-speed UART is provided for the Bluetooth host
interface. In addition, the latest Linux and Android
drivers are supported directly by LSR and Cypress.
Need to get to market quickly? Not an expert in
802.11. Need a custom antenna? Would you like to
own the design? Would you like a custom design?
Not quite sure what you need? Do you need help
with your host board? LSR Design Services will be
happy to develop custom hardware or software, or
assist with integrating the design. Contact us at
sales@lsr.com or call us at 262-375-4400.
APPLICATIONS
•
•
•
Security & Building Automation
Internet of Things / M2M Connectivity
Smart Gateways
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
TABLE OF CONTENTS
FEATURES ................................................................................................................................... 1
APPLICATIONS ............................................................................................................................ 1
DESCRIPTION .............................................................................................................................. 1
MODULE VARIANTS .................................................................................................................... 5
FUNCTIONAL FEATURES .............................................................................................................. 8
WLAN Features...................................................................................................................................................... 8
Bluetooth Features ................................................................................................................................................ 8
Wireless Security System Features ........................................................................................................................ 8
ORDERING INFORMATION .......................................................................................................... 9
MODULE ACCESSORIES.............................................................................................................. 10
APPLICABLE DOCUMENTS ......................................................................................................... 10
BLOCK DIAGRAMS..................................................................................................................... 11
SIP MODULE FOOTPRINT AND PIN DEFINITIONS ........................................................................ 14
SIP MODULE PIN DESCRIPTIONS................................................................................................ 15
U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS...................................... 18
U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS.............................................................. 19
MODULE POWER STATES .......................................................................................................... 21
MODULE PIN I/O STATES........................................................................................................... 22
ELECTRICAL SPECIFICATIONS ..................................................................................................... 25
Absolute Maximum Ratings................................................................................................................................. 25
Recommended Operating Conditions .................................................................................................................. 25
General Characteristics........................................................................................................................................ 26
WLAN Power Consumption.................................................................................................................................. 27
Bluetooth Power Consumption............................................................................................................................ 28
Power Supply Requirements................................................................................................................................ 28
Power Supply Sequencing.................................................................................................................................... 29
The information in this document is subject to change without notice.
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Datasheet
CRYSTAL OSCILLATOR REQUIREMENTS...................................................................................... 33
WLAN RF Characteristics...................................................................................................................................... 36
Bluetooth RF Characteristics................................................................................................................................ 43
WLAN HOST INTERFACE ............................................................................................................ 44
SDIO Interface ..................................................................................................................................................... 44
BLUETOOTH UART HOST INTERFACE.......................................................................................... 47
Overview ............................................................................................................................................................. 47
Soldering Recommendations ............................................................................................................................... 49
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 49
CLEANING ................................................................................................................................. 50
OPTICAL INSPECTION ................................................................................................................ 50
REWORK................................................................................................................................... 50
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 50
Shipping............................................................................................................................................................... 50
Handling .............................................................................................................................................................. 50
Moisture Sensitivity Level (MSL).......................................................................................................................... 50
Storage ................................................................................................................................................................ 50
Repeated Reflow Soldering.................................................................................................................................. 51
AGENCY CERTIFICATIONS .......................................................................................................... 52
AGENCY STATEMENTS............................................................................................................... 52
Federal Communication Commission Interference Statement ............................................................................. 52
Industry Canada Statements................................................................................................................................ 53
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 54
OEM LABELING REQUIREMENTS FOR END-PRODUCT................................................................. 55
OEM END PRODUCT USER MANUAL STATEMENTS..................................................................... 56
EUROPE .................................................................................................................................... 57
CE Notice ............................................................................................................................................................. 57
Declaration of Conformity (DOC) ......................................................................................................................... 57
BLUETOOTH SIG QUALIFICATION............................................................................................... 57
The information in this document is subject to change without notice.
330-0208-R2.1
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Sterling-LWB5 Module
Datasheet
Overview ............................................................................................................................................................. 57
Qualification Steps When Referencing a Laird Controller Subsystem Design ....................................................... 58
Additional Assistance........................................................................................................................................... 58
CHIP ANTENNA PERFORMANCE................................................................................................. 59
Summary of Antenna Performance...................................................................................................................... 59
2.4 GHz Radiated Performance ............................................................................................................................ 60
5 GHz Radiated Performance ............................................................................................................................... 66
BASE SIP MODULE MECHANICAL DATA...................................................................................... 72
BASE SIP MODULE PCB FOOTPRINT ........................................................................................... 73
BASE SIP MODULE TAPE AND REEL PACKAGING......................................................................... 74
U.FL AND CHIP ANTENNA MECHANICAL DATA........................................................................... 75
U.FL AND CHIP ANTENNA PCB FOOTPRINT ................................................................................ 76
U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING.............................................................. 77
DEVICE MARKINGS.................................................................................................................... 78
Rev 1 Devices....................................................................................................................................................... 78
Rev 2 Devices....................................................................................................................................................... 79
CONTACTING LSR ...................................................................................................................... 80
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
MODULE VARIANTS
The LSR Sterling-LWB5 Module is available in three different versions. Depending on the user’s antenna and
footprint needs, there is a variant to suite most application requirements. LSR recommends that for simplicity of
both the host PCB design, as well as the manufacturing process, that either the Chip Antenna or RF Connector
version of the modules be used in your design.
•
450-0162 - Base SIP Module
This module variant is supplied in a compact, 84 pin, LGA footprint. Unlike the other module variants, it
requires the addition of either an off-module antenna or RF connector, as well as the associated
matching components. In order to benefit from the EMC certifications on the module, strictly following
the layout in the module application guide is required. This requires adherence to the PCB stack-up and
layout around the antenna. The footprint of this module may require additional care during reflow and
PCB assembly.
Figure 1 Sterling-LWB5 Base SIP Module (450-0162)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
•
450-0168 – U.FL Module
This module variant integrates the 450-0162 Base SIP Module, a U.FL RF connector, and all associated RF
matching components on a PCB. This integrated approach not only provides a U.FL connector for
connections to external antennas, but also simplifies and reduces the cost of the end users host board
by simplifying the module PCB footprint.
Figure 2 Sterling-LWB5 U.FL Module (450-0168)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
•
450-0169 - Chip Antenna Module
This module variant integrates the 450-0162 Base SIP Module, a chip antenna, and all associated RF
matching components on a PCB. This integrated approach not only provides an external antenna
solution, but also simplifies and reduces the cost of the end users host board by simplifying the module
PCB footprint
Figure 3 Sterling-LWB5 Chip Antenna Module (450-0169)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
FUNCTIONAL FEATURES
WLAN Features
•
IEEE 802.11 a/b/g/n/ac 1x1 2.4 GHz Radio
o
o
o
o
Internal Power Amplifier (PA)
Internal Low Noise Amplifier(LNA)
Internal T/R Switch
Simultaneous BT/WLAN reception with a single antenna.
•
•
•
•
Media Access Controller (MAC)
Physical Layer (PHY)
Baseband Processor
Standards
o
IEEE 802.11a, 802.11b, 802.11g, 802.11n (single stream), 802.11ac
Bluetooth Features
•
•
•
•
•
Class 2 power amplifier with Class 2 capability
HCI Interface using High Speed UART
PCM for Audio Data
Standards
Bluetooth 2.1+EDR, Bluetooth 3.0, Bluetooth 4.2 (Bluetooth Low Energy)
Wireless Security System Features
Supported modes:
•
o
o
o
o
o
o
o
o
o
o
o
Open (no security)
WEP
WPA Personal
WPA2 Personal
WMM
WMM-PS (U-APSD)
WMM-SA
WAPI
AES (Hardware Accelerator)
TKIP (host-computed)
CKIP (SW Support)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
ORDERING INFORMATION
Order Number
Description
450-0168C
450-0168R
450-0169C
450-0169R
450-0162C
450-0162R
450-0171
Sterling-LWB5 U.FL Module (Cut Tape)
Sterling-LWB5 U.FL Module (Tape and Reel, SPQ = 1000)
Sterling-LWB5 Chip Antenna Module (Cut Tape)
Sterling-LWB5 Chip Antenna Module (Tape and Reel, SPQ = 1000)
Sterling-LWB5 Base SIP Module (Cut Tape)
Sterling-LWB5 Base SIP Module (Tape and Reel, SPQ = 1000)
Sterling-LWB5 SD Development Board, U.FL
450-0172
Sterling-LWB5 SD Development Board, Chip Antenna
Table 1 Orderable Sterling-LWB5 Part Numbers
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
MODULE ACCESSORIES
Order Number
Description
2.4 GHz and 5.5 GHz Dipole Antenna with
Reverse Polarity SMA Connector
001-0009
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
080-0001
001-0016
2.4 GHz and 5.5GHz FlexPIFA Antenna
Johanson
2450AD14A5500T
2.4/5.5 GHz Chip Antenna
Table 2 Module Accessories
APPLICABLE DOCUMENTS
•
•
Sterling-LWB5 Module Application Guide (330-0209)
Sterling-LWB5 SD Card User Guide (330-0245)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
BLOCK DIAGRAMS
Figure 4 Sterling-LWB5 Base SIP Module Block Diagram
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
Figure 5 Sterling-LWB5 U.FL Module Block Diagram
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
Figure 6 Sterling-LWB5 Chip Antenna Module Block Diagram
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
SIP MODULE FOOTPRINT AND PIN DEFINITIONS
Note that the following footprint and pin definition applies to the Sterling-LWB5 Base SIP Module (450-0162).
There are two module footprints depending on which variant of the module is being used, so it is important to
make certain you are using the correct version on your design.
Figure 7 Sterling-LWB5 SIP Module Pinout (Top View)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
SIP MODULE PIN DESCRIPTIONS
Module
Name
Pin
I/O Type
Description
1
GND
GND
-
GROUND
2
-
GROUND
3
GND
-
GROUND
4
GND
-
GROUND
5
GND
-
GROUND
6
RF_SW_CTRL_9
RF_SW_CTRL_8
GND
O
External RF SW control
External RF SW control
GROUND
7
O
8
-
9
GND
-
GROUND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
GND
-
GROUND
GND
-
-
GROUND
GND
GROUND
GPIO_3
I/O
I/O
I/O
-
LTE Coexistence GPIO for 3-wire
LTE Coexistence GPIO
LTE Coexistence GPIO
GROUND
GPIO_5
GPIO_4
GND
WLAN_HOST_WAKE/GPIO_0
GND
O
Output from WLAN to wake module
GROUND
GND
I
SDIO_CLK
GND
WLAN SDIO clock
-
GROUND
SDIO_CMD
SDIO_DATA_0
SDIO_DATA_1
SDIO_DATA_2
SDIO_DATA_3
GND
I
WLAN SDIO command line
WLAN SDIO data line 0
WLAN SDIO data line 1
WLAN SDIO data line 2
WLAN SDIO data line 3
GROUND
I/O
I/O
I/O
I/O
-
LPO IN
I
32.768KHz Input
WL_REG_ON
I
PMU power up to the WLAN section
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
Module
Pin
Name
I/O Type
Description
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
BT_REG_ON
GND
I
PMU power up to the Bluetooth section
-
GROUND
GND
-
GROUND
SR_VLX
O
CBUCK switching regulator output
GROUND
GND
-
VIN_LDO
GND
I
CBUCK switching regulator input
GROUND
-
VBAT
I
Power VBAT
VBAT
I
Power VBAT
GND
-
GROUND
VDDIO
I
I/O Power Supply
GROUND
GND
-
BT_PCM_IN
BT_PCM_CLK
BT PCM SYNC
BT_PCM_OUT
GND
I
I/O
I/O
O
-
Bluetooth PCM data input
Bluetooth PCM clock
Bluetooth PCM Sync signal
Bluetooth PCM data output
GROUND
BT_HOST_WAKE
BT_DEV_WAKE
GND
O
I
Output from Bluetooth to wake Host
Input from Host to wake Bluetooth
GROUND
-
BT_UART_CTS
BT_UART_RTS
BT_UART_RXD
BT_UART_TXD
GND
I
Bluetooth UART clear to send
Bluetooth UART request to send
Bluetooth UART serial Input
Bluetooth UART serial output
GROUND
O
I
O
-
GND
-
GROUND
GND
-
GROUND
GND
-
GROUND
GND
-
GROUND
GND
-
GROUND
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
Module
Pin
Name
I/O Type
Description
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
5G/2G_ANT
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
I/O
-
2.4G/5GHz RF signal input/output
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port,
RF = Bi-directional RF Port, GND = Ground
Table 3 Sterling-LWB5 SIP Module Pin Descriptions
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS
Note that the following footprint and pin definitions apply to the Sterling-LWB5 U.FL and Chip Antenna variants
of the module (450-0168 and 450-0169). There are two module footprints depending on which variant of the
module is being used, so it is important to make certain you are using the correct version on your design.
Figure 8 Sterling-LWB5 U.FL and Chip Antenna Module Pinout (Top View)
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS
Module
Name
I/O Type
Description
Pin
1
2
GND
BT_PCM_SYNC
BT_PCM_IN
BT_PCM_OUT
VBAT
GND
DIO
DI
GROUND
PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)
PCM DATA INPUT SENSING
PCM DATA OUTPUT
3
4
DO
PI
5
WIFI AND BLUETOOTH POWER SUPPLY
GROUND
6
GND
GND
DO
DO
DIO
DIO
DIO
7
RF_SW_CTRL_9
RF_SW_CTRL_8
GPIO_3
External RF SW control
8
External RF SW control
9
PROGRAMMABLE GPIO PIN
PROGRAMMABLE GPIO PIN
PROGRAMMABLE GPIO PIN.
10
11
GPIO_5
GPIO_4
USED BY PMU TO POWER UP OR POWER DOWN THE
INTERNAL REGULATORS USED BY THE WLAN SECTION.
12
13
WLREG_ON
DI
GPIO_0/
WLAN_HOST_WAKE
DO
PROGRAMMABLE GPIO PIN.
14
15
16
GND
NC
GND
NC
GROUND
NO CONNECT
NO CONNECT
NC
NC
17
NC
NC
NO CONNECT
18
19
20
GND
GND
DI
GROUND
LPO_IN
VDDIO
EXTERNAL SLEEP CLOCK INPUT
DC SUPPLY FOR I/O
PI
USED BY PMU TO POWER UP OR POWER DOWN THE
INTERNAL REGULATORS USED BY THE BLUETOOTH
SECTION.
21
BT_REG_ON
DI
22
23
24
25
SDIO_DATA_0
SDIO_DATA_1
GND
DIO
DIO
GND
DIO
SDIO DATA LINE 0
SDIO DATA LINE 1
GROUND
SDIO_DATA_2
SDIO DATA LINE 2
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
Module
Pin
Name
I/O Type
Description
26
27
28
29
30
31
32
33
34
35
36
37
SDIO_CMD
SDIO_DATA_3
GND
DIO
DIO
GND
DIO
GND
DO
DI
SDIO COMMAND LINE
SDIO DATA LINE 3
GROUND
SDIO_CLK
GND
SDIO CLOCK LINE
GROUND
BT_UART_RTS
BT_UART_CTS
BT_UART_TXD
BT_UART_RXD
NC
Bluetooth UART request-to-send
Bluetooth UART clear-to-send
Bluetooth UART transmit output
Bluetooth UART Receive input
NO CONNECT
DO
DI
NC
NC
NC
NO CONNECT
NC
NC
NO CONNECT
PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE
(INPUT)
38
BT_PCM_CLK
DIO
39
40
41
42
43
44
45
46
47
BT_DEV_WAKE
DI
Input from Host to wake Bluetooth
BT_HOST_WAKE
GND
DO
Output from Bluetooth to wake Host
GND
GND
GND
GND
GND
GND
GND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GND
GND
GND
GND
GND
GND
PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port, GND = Ground
Table 4 Sterling-LWB5 U.FL and Chip Antenna Module Pin Descriptions
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
MODULE POWER STATES
The Sterling-LWB5 WLAN power states are described as follows:
• Active mode - All WLAN blocks in the Sterling-LWB5 are powered up and fully functional with active carrier sensing and
frame transmission and receiving. All required regulators are enabled and put in the most efficient mode based on the load
current. Clock speeds are dynamically adjusted by the PMU sequencer.
• Doze mode - The radio, analog domains, and most of the linear regulators are powered down. The rest of the BCM43353
remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator) are shut down to reduce active power to the
minimum. The 32.768 kHz LPO clock is available only for the PMU sequencer. This condition is necessary to allow the PMU
sequencer to wake up the chip and transition to Active mode. In Doze mode, the primary power consumed is due to
leakage current.
• Deep-sleep mode - Most of the chip, including both analog and digital domains, and most of the regulators are powered
off. Logic states in the digital core are saved and preserved into a retention memory in the always-ON domain before the
digital core is powered off. Upon a wake-up event triggered by the PMU timers, an external interrupt, or a host resume
through the SDIO bus, logic states in the digital core are restored to their pre-deep-sleep settings to avoid lengthy HW
reinitialization.
• Power-down mode - The BCM43353 is effectively powered off by shutting down all internal regulators. The chip is
brought out of this mode by external logic re-enabling the internal regulators.
The information in this document is subject to change without notice.
330-0208-R2.1
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Sterling-LWB5 Module
Datasheet
MODULE PIN I/O STATES
Keeper
(b)
Active Mode
Low Power
State/Sleep (All
Power Present)
Power Down(c)
WL_REG_ON =0
BT_REG_ON = 0
Out of Reset: (VDD_VIO is present)
Pin #
Name
WL_REG_ON =1
BT_REG_ON = 1
WL_REG_ON =1
BT_REG_ON = 0
WL_REG_ON =0
BT_REG_ON = 1
450-0168 &
450-0162
(SiP)
450-0169
(Antenna
Modules)
(before SW download)
43
41
44
2
3
4
BT_PCM_SYNC
BT_PCM_IN
Y
Y
Input No Pull(d)
Input No Pull(d)
Input No Pull(d) High –Z No Pull(d)
Input No Pull(d) High –Z No Pull(d)
Output
Input; PD
Input; PD
TBD
Input, No Pull,
High-Z
TBD
Y
Y
Input No Pull(d)
Input No Pull(d) High –Z No Pull(d)
Output
Input; PD
Input; PD
BT_PCM_OUT
TBD
TBD
Input/Output:
PU, PD, NoPull
(Programmable) (Programmable)
Input/Output:
PU, PD, NoPull
High –Z No Pull(f)
High –Z No Pull(f)
High –Z No Pull(f)
Input; PD
13
14
9
WIFI_GPIO_3
WIFI_GPIO_5
Default PD
Default PD
Y
Y
Input/Output:
PU, PD, NoPull
(Programmable) (Programmable)
Input/Output:
PU, PD, NoPull
Input; PD
Input; PD
TBD
TBD
10
Default PD
Default PD
Input/Output:
PU, PD, NoPull
(Programmable) (Programmable)
Input/Output:
PU, PD, NoPull
Input, NoPull
Input, NoPull
15
28
17
11
12
13
WIFI_GPIO_4
WLREG_ON
Default NoPull
Default NoPull
N
Y
Input; PD (pull-
down can be
disabled)
Input; PD (pull-
down can be
disabled)
Input; PD (of
200K)
Input; PD (of
200K)
Input; PD (of
200K)
TBD
TBD
Input/Output:
PU, PD, NoPull
(Programmable) (Programmable)
Default PD Default PD
Input/Output:
PU, PD, NoPull
High –Z No Pull(f)
Input; PD
Input; PD
WIFI_GPIO_0/
WLAN_HOST_WAKE
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 22 of 80
Sterling-LWB5 Module
Datasheet
Keeper
(b)
Active Mode
Low Power
State/Sleep (All
Power Present)
Power Down(c)
WL_REG_ON =0
BT_REG_ON = 0
Out of Reset: (VDD_VIO is present)
Pin #
Name
WL_REG_ON =1
BT_REG_ON = 1
WL_REG_ON =1
BT_REG_ON = 0
WL_REG_ON =0
BT_REG_ON = 1
450-0168 &
450-0162
(SiP)
450-0169
(Antenna
Modules)
(before SW download)
N
Input; PD (pull-
down can be
disabled)
Input; PD (pull-
down can be
disabled)
Input; PD (of
200K)
Input; PD (of
200K)
Input; PD (of
200K)
TBD
29
21
BT_REG_ON
N
N
N
N
N
SDIO MODE ->
PullUp
SDIO MODE ->
Input PullUp
High-Z, NoPull
High-Z, NoPull
High-Z, NoPull
High-Z, NoPull
High-Z, NoPull
SDIO MODE -
>Input PullUP
SDIO MODE ->
Input PullUP
TBD
TBD
TBD
TBD
TBD
22
23
24
21
25
22
23
25
26
27
SDIO_D0
SDIO_D1
SDIO_D2
SDIO_CMD
SDIO_D3
SDIO MODE ->
PullUp
SDIO MODE ->
Input PullUp
SDIO MODE -
>Input PullUP
SDIO MODE ->
Input PullUP
SDIO MODE ->
PullUp
SDIO MODE ->
Input PullUp
SDIO MODE -
>Input PullUP
SDIO MODE ->
Input PullUP
SDIO MODE ->
PullUp
SDIO MODE ->
Input PullUp
SDIO MODE -
>Input PullUP
SDIO MODE ->
Input PullUP
SDIO MODE ->
PullUp
SDIO MODE ->
Input PullUp
SDIO MODE -
>Input PullUP
SDIO MODE ->
Input PullUP
N
Y
Y
Y
Input: NoPull
Output:NoPull
Input:NoPull
Output:NoPull
Input: NoPull
Output:NoPull
Input:NoPull
Output:NoPull
High-Z, NoPull
High-Z,NoPull
High-Z,NoPull
High-Z,NoPull
Input, NoPull
Input; PU
Input; PU
Input; PU
Input, NoPull
Input; PU
Input; PU
Input; PU
19
50
49
29
31
32
SDIO_CK
TBD
TBD
TBD
TBD
BT_UART_RTS
BT_UART_CTS
52
33
BT_UART_TXD
Y
Y
Input:PU
Input:NoPull
High-Z,NoPull
Input; PU
Output
Input; PU
Input; PD
TBD
TBD
51
42
34
38
BT_UART_RXD
BT_PCM_CLK
Input No Pull(d)
Input No Pull(d)
High –Z NoPull
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 23 of 80
Sterling-LWB5 Module
Datasheet
Keeper
(b)
Active Mode
Low Power
State/Sleep (All
Power Present)
Power Down(c)
WL_REG_ON =0
BT_REG_ON = 0
Out of Reset: (VDD_VIO is present)
Pin #
Name
WL_REG_ON =1
BT_REG_ON = 1
WL_REG_ON =1
BT_REG_ON = 0
WL_REG_ON =0
BT_REG_ON = 1
450-0168 &
450-0162
(SiP)
450-0169
(Antenna
Modules)
(before SW download)
Y
Y
I/O:
PU,PD,NoPull
(Programmable) (Programmable)
Input:
PU,PD,NoPull
High-Z,NoPull
High-Z, NoPull
Input; PD
Input; PU
Input; PD
Input; PD
TBD
TBD
47
46
39
40
BT_DEV_WAKE
BT_HOST_WAKE
I/O:
PU,PD,NoPull
I/O:
PU,PD,NoPull
(Programmable) (Programmable)
Table 5 I/O States
The following notations are used:
•
•
•
•
•
•
I = Input signal
O = Output signal
I/O = Input/Output signal
PU = Pulled Up
PD = Pulled Down
NoPull = Neither pulled up nor pulled down
Notes:
a. PU = Pulled Up, PD = Pulled Down.
b. N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in the power-down state. If there is no keeper, and it is an input and there is
NoPull, then the pad should be driven to prevent leakage due to floating pad, for example, SDIO_CLK.
c. In the Power-down state (xx_REG_ON = 0): High-Z; NoPull => The pad is disabled because power is not supplied.
d. Depending on whether the PCM interface is enabled and the configuration is master or slave mode, it can be either an output or input.
e. Depending on whether the I2S interface is enabled and configuration is master or slave mode, it can be either an input or output.
f. The GPIO pull states for the active and low-power states are hardware defaults. They can all be subsequently programmed as a pull-up or pull-down.
The information in this document is subject to change without notice.
330-0208-R2.1
Copyright © 2016-2018 LSR
Page 24 of 80
Sterling-LWB5 Module
Datasheet
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Wi-Fi power supply (VBAT)
DIO Power Supply (VDDIO)
Voltage on digital pins
Operating temperature
Storage temperature
3.2
1.71
-0.5
-40
3.6
1.89
1.89
+85
+85
V
V
V
ºC
ºC
-40
Table 6 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Typical
Unit
VBAT
3.3
1.8
1.8
25
V
V
VDDIO
Voltage on digital pins
V
Ambient temperature range
ºC
Table 7 Recommended Operating Conditions
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 25 of 80
Sterling-LWB5 Module
Datasheet
General Characteristics
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
Typical
Max
Unit
Logic input low, VIL
Logic input high, VIH
Logic output low, VOL
Logic output high, VOH
VDDIO = 1.8V
VDDIO = 1.8V
-
-
-
-
-
0.35x VDD_VIO
V
V
V
V
0.65x VDD_VIO
-
-
0.45
-
VDDIO = 1.8V, 2mA
VDDIO = 1.8V, 2mA
VDDIO-0.45
Table 8 DC Characteristics General Purpose I/O
RF Characteristics
Parameter
Min
Typical
Max
Unit
2.4 GHz RF frequency range
5 GHz RF frequency range
WLAN RF data rate
2400
5180
1
2472
5835
433.3
2480
MHz
MHz
Mbps
MHz
802.11ac and 802.11a/b/g/n
BT RF frequency Range
BT data rate
2402
Bluetooth 4.2 + EDR
Table 9 2.4 GHz RF Characteristics
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 26 of 80
Sterling-LWB5 Module
Datasheet
WLAN Power Consumption
2.4 GHZ
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typical
Max
Unit
Sleep (idle, unassociated)
-
-
-
-
-
-
-
-
-
-
-
-
5
-
-
-
-
-
-
-
-
-
-
-
-
uA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
uA
11b TX Current
11g TX Current
11g TX Current
11n TX Current
11n TX Current
11n TX Current
11b RX Current
11g RX Current
11n RX Current
11n RX Current
Power Down (OFF) Mode
11 Mbps, 20 MHz
6 Mbps, 20 MHz
320
260
230
235
205
185
55
54 Mbps, 20 MHz
MCS0, 20 MHz
MCS7, 20 MHz
MCS7, 40 MHz
11 Mbps, 20 MHz
54 Mbps, 20 MHz
MCS7, 20 MHz
MCS7, 40 MHz
55
55
70
5
Table 10 2.4GHz WLAN Power Consumption
5 GHZ
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typical
Max
Unit
Sleep (idle, unassociated)
-
-
-
-
-
-
-
-
-
-
-
-
5
-
-
-
-
-
-
-
-
-
-
-
-
uA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
uA
11a TX Current
11n TX Current
11n TX Current
11ac TX Current
11ac TX Current
11a RX Current
11n RX Current
11n RX Current
11ac RX Current
11ac RX Current
Power Down Mode
54 Mbps, 20 MHz
MCS7, 20 MHz
275
250
215
210
215
70
MCS7, 40 MHz
MCS9, 40 MHz
MCS9, 80 MHz
54 Mbps, 20 MHz
MCS7, 20 MHz
MCS7, 40 MHz
MCS9, 40 MHz
MCS9, 80 MHz
70
85
85
110
5
Table 11 5GHz WLAN Power Consumption
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 27 of 80
Sterling-LWB5 Module
Datasheet
Bluetooth Power Consumption
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typical
Max
Unit
Sleep
-
-
-
-
-
-
5
-
-
-
-
-
-
uA
mA
mA
mA
mA
uA
DM5/DH5 TX
1 Mbps
3 Mbps
1 Mbps
3 Mbps
46
44
23
23
5
3DM5/3DH5 TX
DM5/DH5 RX
3DM5/3DH5 RX
Power Down Mode
BLE TX
BLE RX
-
-
34
22
-
-
mA
mA
Table 12 Bluetooth Power Consumption
Power Supply Requirements
Power Supply Requirements
Min
Typical
Max
Unit
VDDIO
1.71
1.8
<1
3.3
-
1.89
-
V
VDDIO Current
VBAT
-
mA
V
3.2
3.6
350
VBAT Current
-
mA
Table 13 Power Supply Requirements
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 28 of 80
Sterling-LWB5 Module
Datasheet
Power Supply Sequencing
WLAN Boot-Up Sequence
Figure 9 WLAN Boot-Up Sequence
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 29 of 80
Sterling-LWB5 Module
Datasheet
Figure 10 Bluetooth Boot-UP Sequence
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 30 of 80
Sterling-LWB5 Module
Datasheet
Control Signal Sequencing
The Sterling-LWB5 has two signals that allow host to control power consumption by enabling or disabling the
WLAN, Bluetooth and internal regulator blocs. The timing values indicated are minimum required values; longer
delays are also acceptable.
• WL_REG_ON: Used by the Power Management Unit (PMU) to power up the WLAN section. It is also OR-gated
with the BT_REG_ON input to control the internal DWM-W097 regulators. When this pin is high, the regulators
are enabled, and the WLAN section is out of reset. When this pin is low the WLAN section is in reset. If both
WL_REG_ON and BT_REG_ON pins are low, the regulators are disabled.
• BT_REG_ON: Used by the Power Management Unit (PMU) (OR-gated with WL_REG_ON) to power up the
internal DWM-W097 regulators. If both the BT_REG_ON and WL_REG_ON pins are low, the regulators are
disabled. When this pin is low the Bluetooth section is in reset.
Note:
For both pins, there should be at least a 10ms time delay between consecutive toggles (when both signals have
been driven low). This is to allow timer for the CBUCK regulator to discharge. If this delay is not followed, then
there may be a VDDIO in-rush current on the order of 36mA during next PMU cold start. The Sterling-LWB5 has
an internal power on reset (POR) circuit. The device will be held in reset for a maximum of 110ms after VBAT
and VDDIO have both passed the POR threshold. Wait at least 150ms after VBAT and VDDIO are available
before initiating SDIO access.
The information in this document is subject to change without notice.
330-0208-R2.1
Copyright © 2016-2018 LSR
Page 31 of 80
Sterling-LWB5 Module
Datasheet
Calibration Current Profile
Although the Max continuous supply current to the module is <320 mA, when providing power to the module, a
power source capable of supplying 750 mA peak current for a duration of ~20 msec is required by the module
transmitter during calibration.
Figure 11 shows the current profile of the Sterling-LWB5 module during calibration. If current is limited to
<750mA during this process, the module will fail to calibrate.
Figure 11 Module RF Calibration Current Profile
The information in this document is subject to change without notice.
330-0208-R2.1
Copyright © 2016-2018 LSR
Page 32 of 80
Sterling-LWB5 Module
Datasheet
CRYSTAL OSCILLATOR REQUIREMENTS
32.768 KHz Oscillator
Frequency Accuracy
Duty Cycle
± 200 ppm
30% - 70%
Input Signal Amplitude
Signal Type
200 – 3300 mV, p-p
Square or Sine Wave
<10,000 ppm
Clock Jitter
Table 14 Oscillator Requirements
Note: A 32.768 KHz crystal is required in order for the module to be fully functional. The module will not boot
without it.
The information in this document is subject to change without notice.
330-0208-R2.1
Copyright © 2016-2018 LSR
Page 33 of 80
Sterling-LWB5 Module
Datasheet
Figure 12 WLAN = ON, Bluetooth = ON
Figure 13 WLAN = OFF, Bluetooth = OFF
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 34 of 80
Sterling-LWB5 Module
Datasheet
Figure 14 WLAN = ON, Bluetooth = OFF
Figure 15 WLAN = OFF, Bluetooth = ON
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 35 of 80
Sterling-LWB5 Module
Datasheet
WLAN RF Characteristics
2.4 GHz WLAN Transmitter Characteristics (TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps BPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet, 20 MHz
1 Mbps DSSS (b) TX Output Power
-
16
-
dBm
2 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet, 20 MHz
2 Mbps DSSS (b) TX Output Power
-
16
-
dBm
5.5 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet, 20 MHz
5.5 Mbps DSSS (b) TX Output Power
11 Mbps DSSS (b) TX Output Power
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
16
16
13
13
13
13
13
13
13
13
11
11
11
11
11
11
11
11
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
11 Mbps CCK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet, 20 MHz
6 Mbps BPSK 802.11(g) Mask Compliance
-5 dB EVM RMS power over TX packet, 20 MHz
6 Mbps OFDM (g) TX Output Power
9 Mbps BPSK 802.11(g) Mask Compliance
-8 dB EVM RMS power over TX packet, 20 MHz
9 Mbps OFDM (g) TX Output Power
12 Mbps QPSK 802.11(g) Mask Compliance
-10 dB EVM RMS power over TX packet, 20 MHz
12 Mbps OFDM (g) TX Output Power
18 Mbps OFDM (g) TX Output Power
24 Mbps OFDM (g) TX Output Power
36 Mbps OFDM (g) TX Output Power
48 Mbps OFDM (g) TX Output Power
54 Mbps OFDM (g) TX Output Power
MCS0 OFDM (n) TX Output Power, 20 MHz
MCS1 OFDM (n) TX Output Power, 20 MHz
MCS2 OFDM (n) TX Output Power, 20 MHz
MCS3 OFDM (n) TX Output Power, 20 MHz
MCS4 OFDM (n) TX Output Power, 20 MHz
MCS5 OFDM (n) TX Output Power, 20 MHz
MCS6 OFDM (n) TX Output Power, 20 MHz
MCS7 OFDM (n) TX Output Power, 20 MHz
18 Mbps QPSK 802.11(g) Mask Compliance
-13 dB EVM RMS power over TX packet, 20 MHz
24 Mbps 16-QAM 802.11(g) Mask Compliance
-16 dB EVM RMS power over TX packet, 20 MHz
36 Mbps 16-QAM 802.11(g) Mask Compliance
-19 dB EVM RMS power over TX packet, 20 MHz
48 Mbps 64-QAM 802.11(g) Mask Compliance
-22 dB EVM RMS power over TX packet, 20 MHz
54 Mbps 64-QAM 802.11(g) Mask Compliance
-25 dB EVM RMS power over TX packet, 20 MHz
6.5 Mbps BPSK 802.11(n) Mask Compliance
-5 dB EVM RMS power over TX packet, 20 MHz
13 Mbps QPSK 802.11(n) Mask Compliance
-10 dB EVM RMS power over TX packet, 20 MHz
19.5 Mbps QPSK 802.11(n) Mask Compliance
-13 dB EVM RMS power over TX packet, 20 MHz
26 Mbps 16-QAM 802.11(n) Mask Compliance
-16 dB EVM RMS power over TX packet, 20 MHz
39 Mbps 16-QAM 802.11(n) Mask Compliance
-19 dB EVM RMS power over TX packet, 20 MHz
52 Mbps 64-QAM 802.11(n) Mask Compliance
-22 dB EVM RMS power over TX packet, 20 MHz
58.5 Mbps 64-QAM 802.11(n) Mask Compliance
-25 dB EVM RMS power over TX packet, 20 MHz
65 Mbps 64-QAM 802.11(n) Mask Compliance
-27 dB EVM RMS power over TX packet, 20 MHz
Table 15 2.4 GHz WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 36 of 80
Sterling-LWB5 Module
Datasheet
5 GHz WLAN Transmitter Characteristics
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min Typ Max
Unit
6 Mbps BPSK 802.11(a) Mask Compliance
-5 dB EVM RMS power over TX packet, 20 MHz
6 Mbps OFDM (a) TX Output Power
9 Mbps OFDM (a) TX Output Power
12 Mbps OFDM (a) TX Output Power
18 Mbps OFDM (a) TX Output Power
24 Mbps OFDM (a) TX Output Power
36 Mbps OFDM (a) TX Output Power
48 Mbps OFDM (a) TX Output Power
54 Mbps OFDM (a) TX Output Power
-
-
-
-
-
-
-
-
15
15
15
15
15
15
15
15
-
-
-
-
-
-
-
-
dBm
9 Mbps BPSK 802.11(a) Mask Compliance
-8 dB EVM RMS power over TX packet, 20 MHz
dBm
dBm
dBm
dBm
dBm
dBm
dBm
12 Mbps QPSK 802.11(a) Mask Compliance
-10 dB EVM RMS power over TX packet, 20 MHz
18 Mbps QPSK 802.11(a) Mask Compliance
-13 dB EVM RMS power over TX packet, 20 MHz
24 Mbps 16-QAM 802.11(a) Mask Compliance
-16 dB EVM RMS power over TX packet, 20 MHz
36 Mbps 16-QAM 802.11(a) Mask Compliance
-19 dB EVM RMS power over TX packet, 20 MHz
48 Mbps 64-QAM 802.11(a) Mask Compliance
-22 dB EVM RMS power over TX packet, 20 MHz
54 Mbps 64-QAM 802.11(a) Mask Compliance
-25 dB EVM RMS power over TX packet, 20 MHz
6.5 Mbps BPSK 802.11(n/ac) Mask Compliance
-5 dB EVM RMS power over TX packet, 20 MHz
MCS0 OFDM (n/ac) TX Output Power
MCS1 OFDM (n/ac) TX Output Power
MCS2 OFDM (n/ac) TX Output Power
MCS3 OFDM (n/ac) TX Output Power
MCS4 OFDM (n/ac) TX Output Power
MCS5 OFDM (n/ac) TX Output Power
MCS6 OFDM (n/ac) TX Output Power
MCS7 OFDM (n/ac) TX Output Power
MCS8 OFDM (ac) TX Output Power
-
-
-
-
-
-
-
-
-
13
13
13
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
13 Mbps QPSK 802.11(n/ac) Mask Compliance
-10 dB EVM RMS power over TX packet, 20 MHz
19.5 Mbps QPSK 802.11(n/ac) Mask Compliance
-13 dB EVM RMS power over TX packet, 20 MHz
26 Mbps 16-QAM 802.11(n/ac) Mask Compliance
-16 dB EVM RMS power over TX packet, 20 MHz
39 Mbps 16-QAM 802.11(n/ac) Mask Compliance
-19 dB EVM RMS power over TX packet, 20 MHz
52 Mbps 64-QAM 802.11(n/ac) Mask Compliance
-22 dB EVM RMS power over TX packet, 20 MHz
58.5 Mbps 64-QAM 802.11(n/ac) Mask Compliance
-25 dB EVM RMS power over TX packet, 20 MHz
65 Mbps 64-QAM 802.11(n/ac) Mask Compliance
-27 dB EVM RMS power over TX packet, 20 MHz
78 Mbps 64-QAM 802.11(n/ac) Mask Compliance
-30 dB EVM RMS power over TX packet, 20 MHz
13.5/29.3 Mbps BPSK 802.11(ac) Mask Compliance
-5 dB EVM RMS power over TX packet, 40/80 MHz
MCS0 OFDM (ac) TX Output Power
MCS1 OFDM (ac) TX Output Power
-
-
9.5
9.5
-
-
dBm
dBm
27/58.5 Mbps QPSK 802.11(ac) Mask Compliance
-10 dB EVM RMS power over TX packet, 40/80 MHz
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 37 of 80
Sterling-LWB5 Module
Datasheet
Parameter
Test Conditions
Min Typ Max
Unit
40.5/87.8 Mbps QPSK 802.11(ac) Mask Compliance
-13 dB EVM RMS power over TX packet, 40/80 MHz
MCS2 OFDM (ac) TX Output Power
-
-
-
-
-
-
-
-
9.5
8.5
9.5
9.5
9.5
9.5
9.5
9.5
-
-
-
-
-
-
-
-
dBm
54/117 Mbps 16-QAM 802.11(ac) Mask Compliance
-16 dB EVM RMS power over TX packet, 40/80 MHz
MCS3 OFDM (ac) TX Output Power
MCS4 OFDM (ac) TX Output Power
MCS5 OFDM (n) TX Output Power
MCS6 OFDM (n) TX Output Power
MCS7 OFDM (n) TX Output Power
MCS8 OFDM (n) TX Output Power
MCS9 OFDM (n) TX Output Power
dBm
dBm
dBm
dBm
dBm
dBm
dBm
81/175.5 Mbps 16-QAM 802.11(ac) Mask Compliance
-19 dB EVM RMS power over TX packet, 40/80 MHz
108/234 Mbps 64-QAM 802.11(ac) Mask Compliance
-22 dB EVM RMS power over TX packet, 40/80 MHz
121.5/263.3 Mbps 64-QAM 802.11(ac) Mask Compliance
-25 dB EVM RMS power over TX packet, 40/80 MHz
135/292.5 Mbps 64-QAM 802.11(ac) Mask Compliance
-27 dB EVM RMS power over TX packet, 40/80 MHz
162/351Mbps 256-QAM 802.11(ac) Mask Compliance
-30 dB EVM RMS power over TX packet, 40/80 MHz
180/390 Mbps 256-QAM 802.11(ac) Mask Compliance
-32 dB EVM RMS power over TX packet, 40/80 MHz
Table 16 5 GHz WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
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Sterling-LWB5 Module
Datasheet
2.4 GHz WLAN Receiver Characteristics
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps DSSS (b) RX Sensitivity
2 Mbps DSSS (b) RX Sensitivity
5.5 Mbps DSSS (b) RX Sensitivity
11 Mbps DSSS (b) RX Sensitivity
8% PER, 20 MHz
8% PER, 20 MHz
8% PER, 20 MHz
8% PER, 20 MHz
-
-
-
-
-93
-91
-90
-87
-
-
-
-
dBm
dBm
dBm
dBm
6 Mbps OFDM (g) RX Sensitivity
9 Mbps OFDM (g) RX Sensitivity
12 Mbps OFDM (g) RX Sensitivity
18 Mbps OFDM (g) RX Sensitivity
24 Mbps OFDM (g) RX Sensitivity
36 Mbps OFDM (g) RX Sensitivity
48 Mbps OFDM (g) RX Sensitivity
54 Mbps OFDM (g) RX Sensitivity
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
-
-
-
-
-
-
-
-
-90
-89
-87
-85
-82
-78
-74
-73
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
-
-
-
-
-
-
-
-
-90
-88
-85
-82
-78
-74
-72
-71
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
802.11b RX Overload Level – 20 MHz
802.11g RX Overload Leve l – 20 MHz
802.11n RX Overload Level – 20 MHz
8% PER, 11 Mbps
10% PER, 54 Mbps
10% PER, MCS7
-10
-20
-20
-
-
-
-
-
-
dBm
dBm
dBm
Table 17 2.4 GHz WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
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Sterling-LWB5 Module
Datasheet
5 GHz WLAN Receiver Characteristics
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typ
Max
Unit
6 Mbps OFDM (a) RX Sensitivity
9 Mbps OFDM (a) RX Sensitivity
12 Mbps OFDM (a) RX Sensitivity
18 Mbps OFDM (a) RX Sensitivity
24 Mbps OFDM (a) RX Sensitivity
36 Mbps OFDM (a) RX Sensitivity
48 Mbps OFDM (a) RX Sensitivity
54 Mbps OFDM (a) RX Sensitivity
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
-
-
-
-
-
-
-
-
-90
-89
-87
-85
-82
-78
-74
-73
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
-
-
-
-
-
-
-
-
-90
-87
-85
-82
-78
-74
-73
-71
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
-
-
-
-
-
-
-
-
-88
-85
-82
-79
-76
-71
-70
-68
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 40 of 80
Sterling-LWB5 Module
Datasheet
Parameter
Test Conditions
Min
Typ
Max
Unit
802.11(ac) MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS1 (13 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS3 (26 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS4 (39 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS5 (52 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS6 (58.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS7 (65 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS8 (78 Mbps) OFDM (n) RX Sensitivity
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
10% PER, 20 MHz
-
-
-
-
-
-
-
-
-
-89
-87
-85
-82
-78
-74
-72
-71
-65
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
802.11(ac) MCS0 (13.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS1 (27 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS2 (40.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS3 (54 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS4 (81 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS5 (108 Mbps OFDM (n) RX Sensitivity
802.11(ac) MCS6 (121.5 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS7 (135 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS8 (162 Mbps) OFDM (n) RX Sensitivity
802.11(ac) MCS9 (180 Mbps) OFDM (n) RX Sensitivity
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
10% PER, 40 MHz
-
-
-
-
-
-
-
-
-
-
-88
-85
-82
-79
-76
-71
-70
-67
-64
-61
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
MCS0 (29.3 Mbps) OFDM (n) RX Sensitivity
MCS1 (58.5 Mbps) OFDM (n) RX Sensitivity
MCS2 (87.8 Mbps) OFDM (n) RX Sensitivity
MCS3 (117 Mbps) OFDM (n) RX Sensitivity
MCS4 (175.5 Mbps) OFDM (n) RX Sensitivity
MCS5 (234 Mbps) OFDM (n) RX Sensitivity
MCS6 (263.3 Mbps) OFDM (n) RX Sensitivity
MCS7 (292.5 Mbps) OFDM (n) RX Sensitivity
MCS8 (351 Mbps) OFDM (n) RX Sensitivity
MCS9 (390 Mbps) OFDM (n) RX Sensitivity
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
10% PER, 80 MHz
-
-
-
-
-
-
-
-
-
-
-84
-81
-78
-75
-72
-68
-65
-64
-59
-56
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 41 of 80
Sterling-LWB5 Module
Datasheet
Parameter
Test Conditions
Min
Typical
Max
Unit
802.11a RX Overload Level – 20 MHz
802.11n RX Overload Level– 20 MHz
802.11n RX Overload Level– 40 MHz
802.11ac RX Overload Level – 20 MHz
802.11ac RX Overload Level– 40 MHz
802.11ac RX Overload Level– 80 MHz
10% PER, All Rates
10% PER, All Rates
10% PER, All Rates
10% PER, All Rates
10% PER, All Rates
10% PER, All Rates
-30
-30
-30
-30
-30
-30
-
-
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
Table 18 5 GHz WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
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Page 42 of 80
Sterling-LWB5 Module
Datasheet
Bluetooth RF Characteristics
Bluetooth Transmitter Characteristics
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typical
Max
Unit
Transmit Frequency
Tamb = +25°C, 3.3V
Tamb = +25°C, 3.3V
Tamb = +25°C, 3.3V
Tamb = +25°C, 3.3V
Tamb = +25°C, 3.3V
2402
-
2480
MHz
dBm
dBm
dB
Bluetooth 1 Mbps GFSK Transmit Power
Bluetooth EDR Transmit Power
-
-
8
7
-
-
Bluetooth EDR Relative Transmit Power
Bluetooth Low Energy (BLE) Transmit Power
-4
-
1
-
6
dBm
Table 19 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V)
Parameter
Test Conditions
Min
Typical
Max
Unit
Receive Frequency
Tamb = +25°C, 3.3V
BER=0.1%
2402
-
2480
MHz
dBm
dBm
dBm
dBm
Bluetooth 1 Mbps GFSK Sensitivity
Bluetooth 2 Mbps EDR Sensitivity
Bluetooth 3 Mbps EDR Sensitivity
Bluetooth Low Energy (BLE) Sensitivity
-
-
-
-
-88
-90
-84.5
-92
-
-
-
-
BER=0.01%
BER=0.01%
Tamb = +25°C, 3.3V
Table 20 Bluetooth Receiver RF Characteristics
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 43 of 80
Sterling-LWB5 Module
Datasheet
WLAN HOST INTERFACE
SDIO Interface
The Sterling-LWB5 module SDIO interface supports SDIO Version 3.0, including the UHS-1 modes.
PIN
4 Bit Mode
1 Bit Mode
18
19
20
21
15
17
DATA0
DATA1
DATA
IRQ
DATA2
RW
DATA3
N/C
CLK
CLK
CMD
CMD
Table 21 SDIO Pins
DC Characteristics – SDIO Interface Pins
Parameter
Test Conditions
Min
Typical
Max
Unit
Logic input low, VIL
Logic input high, VIH
Logic output low, VOL
Logic output high, VOH
VDDIO = 1.8V
VDDIO = 1.8V
-
1.27
-
-
-
-
-
0.58
V
V
V
V
-
0.45
-
VDDIO = 1.8V, 2mA
VDDIO = 1.8V, 2mA
1.4
Figure 16 DC Characteristics SDIO I/O
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Sterling-LWB5 Module
Datasheet
Figure 17 Signal Connections to SDIO Host (SD 4-Bit Mode)
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Sterling-LWB5 Module
Datasheet
Figure 18 Signal Connections to SDIO Host (SD 1-Bit Mode)
The information in this document is subject to change without notice.
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Page 46 of 80
Sterling-LWB5 Module
Datasheet
BLUETOOTH UART HOST INTERFACE
Overview
The Sterling-LWB5 uses a single UART for Bluetooth. The UART is a standard 4-wire interface (RX, TX, RTS, and
CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate
detection capability that returns a baud rate selection. Alternatively, the baud rate may be selected through a
vendor-specific UART HCI command. The UART also supports the 3-wire UART Transport Layer which reduces
the number of signal lines required by eliminating the CTS and RTS signals.
Figure 19 UART Connection from Sterling-LWB5 to Host
DC Characteristics – SDO Interface Pins
Parameter
Test Conditions
Min
Typ
Max
Unit
Input high voltage
Input low voltage
VDDIO = 1.8V
VDDIO = 1.8V
VDDIO = 1.8V
VDDIO = 1.8V
1.7
-
-
-
-
-
V
V
V
V
0.63
0.45
Output high voltage @2mA
Output low voltage @2mA
1.4
-
Table 22 Bluetooth (UART) DC Characteristics
The information in this document is subject to change without notice.
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Page 47 of 80
Sterling-LWB5 Module
Datasheet
Figure 20 UART Timing
The information in this document is subject to change without notice.
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Copyright © 2016-2018 LSR
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Sterling-LWB5 Module
Datasheet
Soldering Recommendations
Reflow for Lead Free Solder Paste
•
•
•
•
Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an
overall process development.
It is important to provide a solder reflow profile that matches the solder paste supplier's
recommendations.
Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor
solderability.
All solder paste suppliers recommend an ideal reflow profile to give the best solderability.
Recommended Reflow Profile for Lead Free Solder
Figure 21 Recommended Soldering Profile
Note: The quality of solder joints on the surface mount pads where they contact the host board should
meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section
8.2.1 “Bottom Only Terminations.”
The information in this document is subject to change without notice.
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Copyright © 2016-2018 LSR
Page 49 of 80
Sterling-LWB5 Module
Datasheet
CLEANING
SHIPPING, HANDLING, AND STORAGE
In general, cleaning the populated modules is
strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning
process.
Shipping
Bulk orders of the Sterling-LWB5 SIP module are
delivered in reels of 1000. Bulk orders for the U.FL
and chip antenna modules are delivered in reels of
1000.
•
Cleaning with water can lead to capillary effects
where water is absorbed into the gap between
the host board and the module. The
combination of soldering flux residuals and
encapsulated water could lead to short circuits
between neighboring pads. Water could also
damage any stickers or labels.
Handling
The Sterling-LWB5 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may damage the module
permanently.
•
•
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux residuals
into the RF shield, which is not accessible for
post-washing inspection. The solvent could also
damage any stickers or labels.
Moisture Sensitivity Level (MSL)
Ultrasonic cleaning could damage the module
permanently.
Per J-STD-020, devices rated as MSL 4 and not
stored in a sealed bag with desiccant pack should be
baked prior to use.
OPTICAL INSPECTION
Devices are packaged in a Moisture Barrier Bag with
a desiccant pack and Humidity Indicator Card (HIC).
Devices that will be subjected to reflow should
reference the HIC and J-STD-033 to determine if
baking is required.
After soldering the Module to the host board,
consider optical inspection to check the following:
•
Proper alignment and centering of the module
over the pads.
•
•
Proper solder joints on all pads.
If baking is required, refer to J-STD-033 for bake
procedure.
Excessive solder or contacts to neighboring
pads, or vias.
Storage
REWORK
Per J-STD-033, the shelf life of devices in a Moisture
Barrier Bag is 12 months at <40ºC and <90% room
humidity (RH).
The Sterling-LWB5 module can be unsoldered from
the host board if the Moisture Sensitivity Level
(MSL) requirements are met as described in this
datasheet.
Do not store in salty air or in an environment with a
high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
Never attempt a rework on the module
itself, e.g. replacing individual
components. Such actions will terminate
warranty coverage.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
330-0208-R2.1 Copyright © 2016-2018 LSR
Page 50 of 80
Sterling-LWB5 Module
Datasheet
Repeated Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice.
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Copyright © 2016-2018 LSR
Page 51 of 80
Sterling-LWB5 Module
Datasheet
AGENCY CERTIFICATIONS
FCC ID: TFB-1004, 15.247
IC ID: 5969A-1004, RSS 247
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in
a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
The information in this document is subject to change without notice.
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Copyright © 2016-2018 LSR
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Sterling-LWB5 Module
Datasheet
Industry Canada Statements
This Device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
This device has been designed to operate with the antenna(s) listed below and having a maximum gain of
2.0/2.0 dBi (LSR Dipole), 2.5/3.0 dBi (LSR FlexPIFA), and 1.0/4.0 dBi (Johanson Chip). Antennas not included in
this list or having a gain greater than 2.0/2.0 dBi, 2.5/3.0 dBi, and 1.0/4.0 dBi are strictly prohibited for use with
this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LSR 001-0009 center-fed 2.4 GHz and 5.5 GHz dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA
connector cable.
2) LSR 001-0016 2.4 GHz and 5.5 GHz FlexPIFA antenna.
3) Johanson Technology 2450AD14A5500 chip antenna.
Cet appareil est conforme avec Industrie Canada, exempts de licence standard RSS (s). L'opération est soumise
aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit
accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de
l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une
communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0/2,0
dBi (LSR Dipole), 2,5/3,0 dBi (LSR FlexPIFA), et 1,0/4,0 dBi (Johanson Chip). Antennes pas inclus dans cette liste
ou présentant un gain supérieure à 2,0/2,0 dBi, 2,5/3,0 dBi, et 1,0/4,0 dBi sont strictement interdits pour une
utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1) Antenne LSR 001-0009 centre-alimenté 2,4 GHz et 5,5 GHz dipôle et LSR 080-0001 U.FL à Inverse câble
connecteur SMA à polarité.
2) LSR 001-0016 2,4 GHZ et 5,5 GHz antenne FlexPIFA.
3) Antenne de puce Johanson Technology 2450AD14A5500.
The information in this document is subject to change without notice.
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Copyright © 2016-2018 LSR
Page 53 of 80
Sterling-LWB5 Module
Datasheet
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The Sterling-LWB5 Module has been certified for integration into products only by OEM integrators under the
following conditions:
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the
antenna must be installed to provide a separation distance of at least 70 mm from all persons and operating in
conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product
procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC peripheral
requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-
location with another transmitter), then the FCC and Industry Canada authorizations are no longer
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In
these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
Le module de Sterling-LWB5 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale /
exposition non contrôlée, l'antenne doit être installé pour fournir une distance de séparation d'au moins 70 mm
de toutes les personnes et fonctionnant conjointement avec une autre antenne ou émetteur, sauf en conformité
avec la FCC procédures de produits multi- émetteurs.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil
numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines
configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada
l'autorisation.
The information in this document is subject to change without notice.
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OEM LABELING REQUIREMENTS FOR END-PRODUCT
The Sterling-LWB5 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC
certification numbers are not visible when the module is installed inside another device, as such the end device
into which the module is installed must display a label referring to the enclosed module. The final end product
must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-1004”
“Contains Transmitter Module IC: 5969A-1004”
or
“Contains FCC ID: TFB-1004”
“Contains IC: 5969A-1004”
The OEM of the Sterling-LWB5 Module must only use the approved antenna(s) listed above, which have been
certified with this module.
Le module de Sterling-LWB5 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la
FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre
appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant
référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-1004"
“Contient Module émetteur IC: 5969A-1004"
ou
“Contient FCC ID: TFB-1004"
“Contient IC: 5969A-1004"
Les OEM du module Sterling-LWB5 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce
module.
The information in this document is subject to change without notice.
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OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not to provide information to the end user regarding how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location:
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the
antenna(s) used for this transmitter must be installed to provide a separation distance of at least 70 mm from all
persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC
multi-transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en
vue:
Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale /
exposition non contrôlée, l'antenne(s) utilisée pour ce transmetteur doit être installé pour fournir une distance
de séparation d'au moins 70 mm de toutes les personnes et fonctionnant conjointement avec une autre
antenne ou émetteur, sauf en conformité avec les procédures de produits multi- émetteur FCC.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice.
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EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of Conformity
(DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Website.
BLUETOOTH SIG QUALIFICATION
Overview
The Sterling LWB5 module is listed on the Bluetooth SIG website as a qualified Controller Subsystem.
Design Name
Owner
Declaration ID
Link to listing on the SIG website
450-0162
Laird
D035148
Sterling LWB5 450-0162 (Base Module)
450-0169
450-0168
450-0171
450-0172
Laird
Laird
Laird
Laird
D035148
D035148
D035148
D035148
Sterling LWB5 450-0169 (Chip Antenna Module)
Sterling LWB5 450-0168 (U.FL Module)
Sterling LWB5 450-0171 (U.FL Dev Board)
Sterling LWB5 450-0171 (Chip Antenna Dev Board)
It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing
Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification
process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification
Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.org
The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on
your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document, (login is required to views this document):
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
The information in this document is subject to change without notice.
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Qualification Steps When Referencing a Laird Controller Subsystem Design
To qualify your product when referencing a Laird Controller Subsystem design, follow these steps:
1.
To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm
Note: A user name and password are required to access this site.
2.
3.
4.
5.
In step 1, select the option, New Listing and Reference a Qualified Design.
Enter 97564 in the Controller Subsystem table entry.
Enter your complimentary Host Subsystem and optional Profile Subsystem in the table entry.
Select your pre-paid Declaration ID from the drop-down menu or go to the Purchase Declaration ID page.
Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until
the SIG invoice is paid.
6.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help
document accessible from the site.
Your new design will be listed on the SIG website and you can print your Certificate and DoC.
For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
If you require assistance with the qualification process please contact our recommended Bluetooth Qualification
Expert (BQE), Steve Flooks, steve.flook@eurexuk.com.
Additional Assistance
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit
Support Centre: http://ews-support.lairdtech.com
Email: wireless.support@lairdtech.com
Phone: Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Web: http://www.lairdtech.com/bluetooth
The information in this document is subject to change without notice.
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CHIP ANTENNA PERFORMANCE
Summary of Antenna Performance
Item
Channel Frequency (MHz) Ptx (dBm) TRP (dBm) Power Gain (dB) Expected Power Gain (dB)
1
2
3
4
5
6
1
6
11
36
100
165
2412
2437
2462
5180
5500
5825
12.4
12.1
11.9
10.6
11.8
11.1
10.6
10.4
9.6
7.2
7.6
-1.8
-1.7
-2.3
-3.3
-4.2
-8.0
-3.5
-3.5
-3.5
-2.5
-2.5
-2.5
3.1
Item Channel Frequency (MHz) Ptx (dBm) Peak EIRP (dBm) Peak Gain (dB) Expected Peak Gain (dB)
1
2
3
4
5
6
1
6
11
36
100
165
2412
2437
2462
5180
5500
5825
12.4
12.1
11.9
10.6
11.8
11.1
13.6
13.3
12.2
9.9
10.6
6.3
1.2
1.2
0.4
-0.7
-1.2
-4.8
1.0
1.0
1.0
4.0
4.0
4.0
Table 23 Typical Antenna Performance
The information in this document is subject to change without notice.
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2.4 GHz Radiated Performance
Channel 1: 2412 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 2412.0 (MHz)
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 2412.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 2412.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
90
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 2412.0 (MHz)
min: -10.8 (dBm)
max: +13.6 (dBm)
avg: 9.8 (dBm)
EIRP Summary (dBm) at 2412.0 (MHz)
min: -22.8 (dBm)
max: +9.8 (dBm)
avg: 2.8 (dBm)
EIRP Summary (dBm) at 2412.0 (MHz)
min: -0.6 (dBm)
max: +13.7 (dBm)
avg: 10.6 (dBm)
Figure 22 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 23 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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Channel 6: 2437 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 2437.0 (MHz)
90
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 2437.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 2437.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 2437.0 (MHz)
min: -9.9 (dBm)
max: +13.3 (dBm)
avg: 9.6 (dBm)
EIRP Summary (dBm) at 2437.0 (MHz)
min: -20.8 (dBm)
max: +10.3 (dBm)
avg: 2.7 (dBm)
EIRP Summary (dBm) at 2437.0 (MHz)
min: -1.9 (dBm)
max: +13.4 (dBm)
avg: 10.4 (dBm)
Figure 24 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 25 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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Channel 11: 2462 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 2462.0 (MHz)
90
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 2462.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 2462.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 2462.0 (MHz)
min: -8.5 (dBm)
max: +12.2 (dBm)
avg: 8.7 (dBm)
EIRP Summary (dBm) at 2462.0 (MHz)
min: -23.2 (dBm)
max: +9.7 (dBm)
avg: 2.1 (dBm)
EIRP Summary (dBm) at 2462.0 (MHz)
min: -3.8 (dBm)
max: +12.3 (dBm)
avg: 9.6 (dBm)
Figure 26 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 27 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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5 GHz Radiated Performance
Channel 36: 5180 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 5180.0 (MHz)
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 5180.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 5180.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
90
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 5180.0 (MHz)
min: -12.8 (dBm)
max: +9.9 (dBm)
avg: 6.4 (dBm)
EIRP Summary (dBm) at 5180.0 (MHz)
min: -33.7 (dBm)
max: +6.7 (dBm)
avg: -0.4 (dBm)
EIRP Summary (dBm) at 5180.0 (MHz)
min: -2.2 (dBm)
max: +10.3 (dBm)
avg: 7.2 (dBm)
Figure 28 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 29 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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Channel 100: 5500 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 5500.0 (MHz)
90
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 5500.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 5500.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 5500.0 (MHz)
min: -11.6 (dBm)
max: +10.6 (dBm)
avg: 6.5 (dBm)
EIRP Summary (dBm) at 5500.0 (MHz)
min: -23.1 (dBm)
max: +9.6 (dBm)
avg: 1.2 (dBm)
EIRP Summary (dBm) at 5500.0 (MHz)
min: -0.1 (dBm)
max: +11.5 (dBm)
avg: 7.6 (dBm)
Figure 30 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 31 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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Channel 165: 5825 MHz
EIRP Azimuth Cut
EIRP (dBm) - Vertical Polarization at 5825.0 (MHz)
90
Theta (deg)
EIRP (dBm)
120
-
Horizontal Polarization at 5825.0 (MHz)
Theta (deg)
Total EIRP (dBm) at 5825.0 (MHz)
Theta (deg)
15
30
45
15
30
45
15
30
45
90
20
90
20
20
120
60
60
120
60
60
60
60
10
75
90
10
75
90
10
0
75
90
105
120
135
150
165
105
120
135
150
165
105
120
135
150
165
0
0
-10
-20
150
30
150
30
150
30
-10
-10
-20
-20
180
0
180
0
180
0
210
330
210
330
210
330
240
300
240
300
240
300
270
270
270
EIRP Summary (dBm) at 5825.0 (MHz)
min: -7.6 (dBm)
max: +6.3 (dBm)
avg: 2.2 (dBm)
EIRP Summary (dBm) at 5825.0 (MHz)
min: -26.1 (dBm)
max: +4.7 (dBm)
avg: -4.2 (dBm)
EIRP Summary (dBm) at 5825.0 (MHz)
min: -3.7 (dBm)
max: +6.9 (dBm)
avg: 3.1 (dBm)
Figure 32 Vertical, Horizontal, and Total Patterns
The information in this document is subject to change without notice.
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3D Plots:
Figure 33 Vertical, Horizontal, and Total Plots
The information in this document is subject to change without notice.
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BASE SIP MODULE MECHANICAL DATA
Figure 34 Base SIP Module Mechanical Dimensions
The information in this document is subject to change without notice.
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BASE SIP MODULE PCB FOOTPRINT
Figure 35 Base SIP Module Footprint (Top View)
The information in this document is subject to change without notice.
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BASE SIP MODULE TAPE AND REEL PACKAGING
Figure 36 Base SIP Module Tape and Reel Specification
Note: (Module must be in this Orientation when Feeding Tape)
The information in this document is subject to change without notice.
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U.FL AND CHIP ANTENNA MECHANICAL DATA
Figure 37 U.FL and Chip Antenna Mechanical Dimensions
The information in this document is subject to change without notice.
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U.FL AND CHIP ANTENNA PCB FOOTPRINT
Figure 38 U.FL and Chip Antenna PCB Footprint
Note: All Pads .762mm x .762mm Square. Solder Mask and Paste Mask to be adjusted according to end user’s
assembly process.
The information in this document is subject to change without notice.
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U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING
Figure 39 U.FL and Chip Antenna Modules Tape and Reel Specification
Note: Module must be in this Orientation when Feeding Tape.
The information in this document is subject to change without notice.
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DEVICE MARKINGS
Rev 1 Devices
▪
Initial Release
The shield on the 450-0162, 450-0168, and 450-0169 modules contains the following information:
•
•
LSR Model: Sterling-LWB5 (All Caps and Trademark (TM) only on the SiP Module)
Part Number and Revision:
o
Part Number: 450-0162, 450-0168, or 450-0169
R1 = Revision 1
o
•
•
•
•
•
•
FCC ID: TFB-1004
IC: 5969A-1004
SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day)
XXXXX = Incremental Serial Number
2D Barcode Format is Data Matrix Standard
Pin 1 Marking
The information in this document is subject to change without notice.
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Rev 2 Devices
▪
Added Trademark (TM) Logo to part numbers 450-0168 and 450-0169.
The information in this document is subject to change without notice.
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CONTACTING LSR
Headquarters
LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: (262) 375-4400
Fax: (262) 375-4248
Website
www.lsr.com
forum.lsr.com
sales@lsr.com
Technical Support
Sales Contact
© Copyright 2018 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed
to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential
uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall
not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms
and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a
tradename herein, Laird means Laird Limited due to the acquisition by Advent or one or more subsidiaries of Laird Limited.
LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird.
Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party
intellectual property right.
If the intent is to apply this module to products related to the control and safety of transportation units
(vehicles, trains, etc.), traffic signaling units, disaster-preventive & burglar-proof units, or the like, you
are requested to inform our sales team of such a use in advance.
The information in this document is subject to change without notice.
330-0208-R2.1
Copyright © 2016-2018 LSR
Page 80 of 80
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