1956EFE-5 [Linear]

High Voltage, 1.5A, 500kHz Step-Down; 高电压, 1.5A , 500kHz的降压型
1956EFE-5
型号: 1956EFE-5
厂家: Linear    Linear
描述:

High Voltage, 1.5A, 500kHz Step-Down
高电压, 1.5A , 500kHz的降压型

文件: 总28页 (文件大小:288K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1956/LT1956-5  
High Voltage, 1.5A,  
500kHz Step-Down  
Switching Regulators  
U
FEATURES  
DESCRIPTIO  
The LT®1956/LT1956-5 are 500kHz monolithic buck  
switching regulators with an input voltage capability up to  
60V. Ahighefficiency1.5A, 0.2switchisincludedonthe  
diealongwithallthenecessaryoscillator,controlandlogic  
circuitry. A current mode architecture provides fast tran-  
sient response and good loop stability.  
Wide Input Range: 5.5V to 60V  
1.5A Peak Switch Current  
Small 16-Pin SSOP or Thermally Enhanced  
TSSOP Package  
Saturating Switch Design: 0.2Ω  
Peak Switch Current Maintained Over  
Full Duty Cycle Range  
Special design techniques and a new high voltage process  
achieve high efficiency over a wide input range. Efficiency  
ismaintainedoverawideoutputcurrentrangebyusingthe  
output to bias the circuitry and by utilizing a supply boost  
capacitor to saturate the power switch. Patented circuitry  
maintains peak switch current over the full duty cycle  
range*.Ashutdownpinreducessupplycurrentto25µAand  
the device can be externally synchronized from 580kHz to  
700kHz with a logic level input.  
Constant 500kHz Switching Frequency  
Effective Supply Current: 2.5mA  
Shutdown Current: 25µA  
1.2V Feedback Reference (LT1956)  
5V Fixed Output (LT1956-5)  
Easily Synchronizable  
Cycle-by-Cycle CUurrent Limiting  
APPLICATIO S  
The LT1956/LT1956-5 are available in fused-lead 16-pin  
SSOP and thermally enhanced TSSOP packages.  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
*U.S. PATENT NO. 6,498,466  
High Voltage, Industrial and Automotive  
Portable Computers  
Battery-Powered Systems  
Battery Chargers  
Distributed Power Systems  
U
TYPICAL APPLICATIO  
5V Buck Converter  
Efficiency vs Load Current  
MMSD914TI  
100  
V
= 12V  
IN  
L = 18µH  
6
V
OUT  
= 5V  
0.1µF  
V
IN  
90  
80  
70  
60  
50  
BOOST  
10µH  
V
5V  
1A  
OUT  
12V  
(TRANSIENTS  
TO 60V)  
4
2
V
IN  
SW  
V
OUT  
= 3.3V  
2.2µF†  
100V  
CERAMIC  
10MQ060N  
LT1956-5  
22µF  
6.3V  
CERAMIC  
15  
14  
10  
12  
SHDN  
BIAS  
SYNC  
GND  
FB  
V
C
1, 8, 9, 16 11  
0
0.25  
0.50  
0.75  
1.00  
1.25  
220pF  
4.7k  
LOAD CURRENT (A)  
1956 TA02  
4700pF  
UNITED CHEMI-CON THCS50EZA225ZT  
1956 TA01  
1956f  
1
LT1956/LT1956-5  
W W  
U W  
ABSOLUTE AXI U RATI GS  
(Note 1)  
Input Voltage (VIN) ................................................. 60V  
BOOST Pin Above SW ............................................ 35V  
BOOST Pin Voltage ................................................. 68V  
SYNC, SENSE Voltage (LT1956-5) ........................... 7V  
SHDN Voltage ........................................................... 6V  
BIAS Pin Voltage .................................................... 30V  
FB Pin Voltage/Current (LT1956)................... 3.5V/2mA  
Operating Junction Temperature Range  
LT1956EFE/LT1956EFE-5/LT1956EGN/LT1956EGN-5  
(Notes 8, 10) ..................................... 40°C to 125°C  
LT1956IFE/LT1956IFE-5/LT1956IGN/LT1956IGN-5  
(Notes 8, 10) ..................................... 40°C to 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
U W  
U
PACKAGE/ORDER I FOR ATIO  
TOP VIEW  
TOP VIEW  
ORDER PART  
NUMBER  
ORDER PART  
GND  
SW  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
NUMBER  
GND  
SW  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
SHDN  
SYNC  
NC  
SHDN  
SYNC  
NC  
LT1956EGN  
LT1956IGN  
LT1956EGN-5  
LT1956IGN-5  
LT1956EFE  
LT1956IFE  
LT1956EFE-5  
LT1956IFE-5  
V
IN  
V
IN  
NC  
BOOST  
NC  
FB/SENSE  
NC  
BOOST  
NC  
FB/SENSE  
V
C
V
C
BIAS  
GND  
BIAS  
GND  
FE PART MARKING  
GN PART MARKING  
GND  
GND  
1956EFE  
1956IFE  
1956EFE-5  
1956IFE-5  
1956  
FE PACKAGE  
16-LEAD PLASTIC TSSOP  
GN PACKAGE  
16-LEAD PLASTIC SSOP  
1956I  
19565  
1956I5  
TJMAX = 125°C, θJA = 45°C/ W, θJC (PAD) = 10°C/ W  
TJMAX = 125°C, θJA = 85°C/ W, θJC (PIN 8) = 25°C/ W  
EXPOSED BACKSIDE MUST BE SOLDERED  
TO GROUND PLANE  
FOUR CORNER PINS SOLDERED  
TO GROUND PLANE  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
VIN = 15V, VC = 1.5V, SHDN = 1V, Boost o/c, SW o/c, unless otherwise noted.  
PARAMETER  
CONDITIONS  
5.5V V 60V  
MIN  
TYP  
MAX  
UNITS  
Reference Voltage (LT1956)  
1.204 1.219 1.234  
1.195  
V
V
IN  
V
+ 0.2 V V – 0.2  
1.243  
OL  
C
OH  
SENSE Voltage (LT1956-5)  
5.5V V 60V  
4.94  
4.90  
5
5.06  
5.10  
V
V
IN  
V
+ 0.2 V V – 0.2  
OL  
C OH  
SENSE Pin Resistance (LT1956-5)  
FB Input Bias Current (LT1956)  
Error Amp Voltage Gain  
9.5  
13.8  
0.5  
19  
kΩ  
µA  
1.5  
(Notes 2, 9)  
dl (V ) = ±10µA (Note 9)  
200  
400  
V/V  
Error Amp g  
1500  
1000  
2000  
3000  
3200  
µMho  
µMho  
m
C
V to Switch g  
1.7  
225  
225  
0.9  
A/V  
µA  
µA  
V
C
m
EA Source Current  
EA Sink Current  
FB = 1V or V  
= 4.1V  
125  
100  
400  
450  
SENSE  
FB = 1.4V or V  
Duty Cycle = 0  
SHDN = 1V  
= 5.7V  
SENSE  
V Switching Threshold  
C
V High Clamp  
C
2.1  
V
1956f  
2
LT1956/LT1956-5  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
VIN = 15V, VC = 1.5V, SHDN = 1V, Boost o/c, SW o/c, unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
2
MAX  
UNITS  
Switch Current Limit  
Switch On Resistance  
V Open, Boost = V + 5V, FB = 1V or V  
C
= 4.1V  
1.5  
3
A
IN  
SENSE  
I
= 1.5A, Boost = V + 5V (Note 7)  
0.2  
0.3  
0.4  
SW  
IN  
Maximum Switch Duty Cycle  
Switch Frequency  
FB = 1V or V  
= 4.1V  
82  
75  
90  
90  
%
%
SENSE  
V Set to Give DC = 50%  
C
460  
430  
500  
540  
570  
kHz  
kHz  
f
f
Line Regulation  
5.5V V 60V  
0.05  
0.8  
0.15  
%/V  
V
SW  
SW  
IN  
Shifting Threshold  
Df = 10kHz  
Minimum Input Voltage  
Minimum Boost Voltage  
Boost Current (Note 5)  
(Note 3)  
4.6  
2
5.5  
3
V
V
(Note 4) I 1.5A  
SW  
Boost = V + 5V, I = 0.5A  
Boost = V + 5V, I = 1.5A  
12  
42  
25  
70  
mA  
mA  
IN  
SW  
IN  
SW  
Input Supply Current (I  
)
(Note 6) V  
= 5V  
1.4  
2.9  
25  
2.2  
4.2  
mA  
mA  
VIN  
BIAS  
BIAS  
Output Supply Current (I  
)
(Note 6) V  
= 5V  
BIAS  
Shutdown Supply Current  
SHDN = 0V, V 60V, SW = 0V, V Open  
75  
200  
µA  
µA  
IN  
C
Lockout Threshold  
V Open  
C
2.30  
2.42  
2.53  
V
Shutdown Thresholds  
V Open, Shutting Down  
V Open, Starting Up  
C
0.15  
0.25  
0.37  
0.45  
0.6  
0.6  
V
V
C
Minimum SYNC Amplitude  
SYNC Frequency Range  
SYNC Input Resistance  
1.5  
2.2  
V
kHz  
kΩ  
580  
700  
20  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
Note 7: Switch on resistance is calculated by dividing V to SW voltage by  
the forced current (1.5A). See Typical Performance Characteristics for the  
graph of switch voltage at other currents.  
Note 8: The LT1956EFE/LT1956EFE-5/LT1956EGN/LT1956EGN-5 are  
guaranteed to meet performance specifications from 0°C to 125°C  
junction temperature. Specifications over the –40°C to 125°C operating  
junction temperature range are assured by design, characterization and  
correlation with statistical process controls. The LT1956IFE/LT1956IFE-5/  
LT1956IGN/LT1956IGN-5 are guaranteed over the full 40°C to 125°C  
operating junction temperature range.  
IN  
of a device may be impaired.  
Note 2: Gain is measured with a V swing equal to 200mV above the low  
C
clamp level to 200mV below the upper clamp level.  
Note 3: Minimum input voltage is not measured directly, but is guaranteed  
by other tests. It is defined as the voltage where internal bias lines are still  
regulated so that the reference voltage and oscillator remain constant.  
Actual minimum input voltage to maintain a regulated output will depend  
upon output voltage and load current. See Applications Information.  
Note 4: This is the minimum voltage across the boost capacitor needed to  
guarantee full saturation of the internal power switch.  
Note 9: Transconductance and voltage gain refer to the internal amplifier  
exclusive of the voltage divider. To calculate gain and transconductance,  
refer to the SENSE pin on fixed voltage parts. Divide values shown by the  
Note 5: Boost current is the current flowing into the BOOST pin with the  
pin held 5V above input voltage. It flows only during switch on time.  
ratio V /1.219.  
OUT  
Note 6: Input supply current is the quiescent current drawn by the input  
pin when the BIAS pin is held at 5V with switching disabled. Bias supply  
current is the current drawn by the BIAS pin when the BIAS pin is held at  
5V. Total input referred supply current is calculated by summing input  
Note 10: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
supply current (I ) with a fraction of supply current (I  
):  
BIAS  
VIN  
I
= I + (I  
)(V /V )  
BIAS OUT IN  
TOTAL  
VIN  
with V = 15V, V  
= 5V, I = 1.4mA, I  
= 2.9mA, I  
= 2.4mA.  
IN  
OUT  
VIN  
BIAS  
TOTAL  
1956f  
3
LT1956/LT1956-5  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
Switch Peak Current Limit  
FB Pin Voltage and Current  
SHDN Pin Bias Current  
2.5  
2.0  
1.5  
1.0  
1.234  
1.229  
1.224  
1.219  
2.0  
1.5  
250  
200  
150  
100  
12  
CURRENT REQUIRED TO FORCE SHUTDOWN  
(FLOWS OUT OF PIN). AFTER SHUTDOWN,  
CURRENT DROPS TO A FEW µA  
TYPICAL  
VOLTAGE  
CURRENT  
1.0  
0.5  
0
GUARANTEED MINIMUM  
1.214  
1.209  
1.204  
AT 2.38V STANDBY THRESHOLD  
(CURRENT FLOWS OUT OF PIN)  
6
0
0
20  
40  
60  
80  
100  
50  
100 125  
–50 –25  
0
25  
75  
50  
100 125  
–50 –25  
0
25  
75  
DUTY CYCLE (%)  
JUNCTION TEMPERATURE (°C)  
JUNCTION TEMPERATURE (°C)  
1956 G01  
1956 G02  
1956 G03  
Lockout and Shutdown  
Thresholds  
Shutdown Supply Current  
Shutdown Supply Current  
300  
250  
40  
35  
30  
25  
20  
15  
10  
5
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
V
= 0V  
SHDN  
LOCKOUT  
V
IN  
= 60V  
200  
150  
V
IN  
= 15V  
100  
50  
0
START-UP  
SHUTDOWN  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0
10  
20  
30  
40  
50  
60  
–50  
–25  
0
25  
50  
75  
100  
125  
SHUTDOWN VOLTAGE (V)  
INPUT VOLTAGE (V)  
JUNCTION TEMPERATURE (°C)  
1956 G06  
1956 G05  
1956 G04  
Error Amplifier Transconductance  
Error Amplifier Transconductance  
Frequency Foldback  
3000  
2500  
2000  
1500  
1000  
500  
200  
150  
100  
50  
625  
2500  
2000  
1500  
1000  
500  
SWITCHING  
FREQUENCY  
PHASE  
GAIN  
500  
375  
250  
125  
0
V
C
C
OUT  
12pF  
R
OUT  
200k  
–3  
V
2 • 10  
(
)
FB  
ERROR AMPLIFIER EQUIVALENT CIRCUIT  
= 50Ω  
0
FB PIN  
CURRENT  
R
LOAD  
1k  
–50  
0
100  
10k  
100k  
1M  
10M  
–25  
0
25  
50  
75  
100  
125  
0
0.2  
0.4  
0.8  
1.0  
1.2  
–50  
0.6  
(V)  
FREQUENCY (Hz)  
JUNCTION TEMPERATURE  
V
FB  
1956 G08  
1956 G07  
1956 G09  
1956f  
4
LT1956/LT1956-5  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Minimum Input Voltage with 5V  
Output  
Switching Frequency  
BOOST Pin Current  
575  
550  
525  
500  
475  
450  
425  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
45  
40  
35  
30  
25  
20  
15  
10  
5
V
= 5V  
OUT  
L = 18µH  
MINIMUM INPUT  
VOLTAGE TO START  
MINIMUM INPUT  
VOLTAGE TO RUN  
0
–50  
–25  
0
25  
50  
75  
100  
125  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
LOAD CURRENT (A)  
1
0
0.5  
1
1.5  
JUNCTION TEMPERATURE (°C)  
SWITCH CURRENT (A)  
1956 G10  
1956 G11  
1956 G12  
Switch Minimum ON Time  
vs Temperature  
VC Pin Shutdown Threshold  
Switch Voltage Drop  
2.1  
1.9  
450  
400  
350  
300  
250  
200  
150  
100  
50  
600  
500  
400  
300  
200  
100  
0
T = 125°C  
J
1.7  
1.5  
1.3  
1.1  
0.9  
T = 25°C  
J
T = –40°C  
J
0.7  
0
0
0.5  
1
1.5  
–50  
–25  
0
25  
50  
75  
100  
125  
50  
100 125  
–50 –25  
0
25  
75  
SWITCH CURRENT (A)  
JUNCTION TEMPERATURE (°C)  
JUNCTION TEMPERATURE (°C)  
1766 G14  
1956 G15  
1956 G13  
1956f  
5
LT1956/LT1956-5  
U
U
U
PI FU CTIO S  
VC (Pin 11) The VC pin is the output of the error amplifier  
and the input of the peak switch current comparator. It is  
normally used for frequency compensation, but can also  
serve as a current clamp or control loop override. VC sits  
at about 1V for light loads and 2V at maximum load. It can  
be driven to ground to shut off the regulator, but if driven  
high, current must be limited to 4mA.  
GND (Pins 1, 8, 9, 16): The GND pin connections act as  
the reference for the regulated output, so load regulation  
will suffer if the “ground” end of the load is not at the same  
voltage as the GND pins of the IC. This condition will occur  
when load current or other currents flow through metal  
pathsbetweentheGNDpinsandtheloadground.Keepthe  
paths between the GND pins and the load ground short  
anduseagroundplanewhenpossible.FortheFEpackage,  
the exposed pad should be soldered to the copper GND  
plane underneath the device. (See Applications Informa-  
tion—Layout Considerations.)  
FB/SENSE (Pin 12): The feedback pin is used to set the  
output voltage using an external voltage divider that gen-  
erates 1.22V at the pin for the desired output voltage. The  
5V fixed output voltage parts have the divider included on  
the chip and the FB pin is used as a SENSE pin, connected  
directly to the 5V output. Three additional functions are  
performed by the FB pin. When the pin voltage drops  
below 0.6V, switch current limit is reduced and the exter-  
nal SYNC function is disabled. Below 0.8V, switching  
frequency is also reduced. See Feedback Pin Functions in  
Applications Information for details.  
SW (Pin 2): The switch pin is the emitter of the on-chip  
power NPN switch. This pin is driven up to the input pin  
voltage during switch on time. Inductor current drives the  
switch pin negative during switch off time. Negative volt-  
age is clamped with the external catch diode. Maximum  
negative switch voltage allowed is 0.8V.  
NC (Pins 3, 5, 7, 13): No Connection.  
SYNC (Pin 14): The SYNC pin is used to synchronize the  
internal oscillator to an external signal. It is directly logic  
compatible and can be driven with any signal between  
10% and 90% duty cycle. The synchronizing range is  
equal to initial operating frequency up to 700kHz. See  
Synchronizing in Applications Information for details. If  
unused, this pin should be tied to ground.  
VIN (Pin 4): This is the collector of the on-chip power NPN  
switch. VIN powers the internal control circuitry when a  
voltage on the BIAS pin is not present. High dI/dt edges  
occur on this pin during switch turn on and off. Keep the  
path short from the VIN pin through the input bypass  
capacitor, through the catch diode back to SW. All trace  
inductanceonthispathwillcreateavoltagespikeatswitch  
off, adding to the VCE voltage across the internal NPN.  
SHDN (Pin 15): The SHDN pin is used to turn off the  
regulator and to reduce input current to a few microam-  
peres. This pin has two thresholds: one at 2.38V to disable  
switching and a second at 0.4V to force complete mi-  
cropower shutdown. The 2.38V threshold functions as an  
accurate undervoltage lockout (UVLO); sometimes used  
to prevent the regulator from delivering power until the  
input voltage has reached a predetermined level.  
BOOST (Pin 6): The BOOST pin is used to provide a drive  
voltage, higher than the input voltage, to the internal  
bipolarNPNpowerswitch. Withoutthisaddedvoltage, the  
typical switch voltage loss would be about 1.5V. The  
additional BOOST voltage allows the switch to saturate  
and voltage loss approximates that of a 0.2FET struc-  
ture, but with much smaller die area.  
If the SHDN pin functions are not required, the pin can  
either be left open (to allow an internal bias current to lift  
the pin to a default high state) or be forced high to a level  
not to exceed 6V.  
BIAS (Pin 10): The BIAS pin is used to improve efficiency  
when operating at higher input voltages and light load  
current. Connecting this pin to the regulated output volt-  
age forces most of the internal circuitry to draw its oper-  
ating current from the output voltage rather than the input  
supply. This architecture increases efficiency especially  
when the input voltage is much higher than the output.  
Minimumoutputvoltagesettingforthismodeofoperation  
is 3V.  
1956f  
6
LT1956/LT1956-5  
W
BLOCK DIAGRA  
The LT1956 is a constant frequency, current mode buck  
converter. This means that there is an internal clock and  
twofeedbackloopsthatcontrolthedutycycleofthepower  
switch. In addition to the normal error amplifier, there is a  
current sense amplifier that monitors switch current on a  
cycle-by-cycle basis. A switch cycle starts with an oscilla-  
tor pulse which sets the RS flip-flop to turn the switch on.  
When switch current reaches a level set by the inverting  
input of the comparator, the flip-flop is reset and the  
switch turns off. Output voltage control is obtained by  
using the output of the error amplifier to set the switch  
current trip point. This technique means that the error  
amplifier commands current to be delivered to the output  
rather than voltage. A voltage fed system will have low  
phase shift up to the resonant frequency of the inductor  
and output capacitor, then an abrupt 180° shift will occur.  
The current fed system will have 90° phase shift at a much  
lower frequency, but will not have the additional 90° shift  
until well beyond the LC resonant frequency. This makes  
itmucheasiertofrequencycompensatethefeedbackloop  
and also gives much quicker transient response.  
Most of the circuitry of the LT1956 operates from an  
internal 2.9V bias line. The bias regulator normally draws  
power from the regulator input pin, but if the BIAS pin is  
connected to an external voltage higher than 3V, bias  
powerwillbedrawnfromtheexternalsource(typicallythe  
regulated output voltage). This will improve efficiency if  
the BIAS pin voltage is lower than regulator input voltage.  
High switch efficiency is attained by using the BOOST pin  
to provide a voltage to the switch driver which is higher  
than the input voltage, allowing switch to be saturated.  
This boosted voltage is generated with an external capaci-  
tor and diode. Two comparators are connected to the  
shutdownpin. Onehasa2.38Vthresholdforundervoltage  
lockout and the second has a 0.4V threshold for complete  
shutdown.  
V
4
IN  
R
LIMIT  
R
SENSE  
+
2.9V BIAS  
REGULATOR  
INTERNAL  
CC  
BIAS  
10  
V
CURRENT  
COMPARATOR  
SLOPE COMP  
Σ
SYNC 14  
BOOST  
6
ANTISLOPE COMP  
SHUTDOWN  
COMPARATOR  
500kHz  
OSCILLATOR  
+
S
Q1  
POWER  
SWITCH  
R
DRIVER  
CIRCUITRY  
S
FLIP-FLOP  
R
0.4V  
5.5µA  
2
SW  
SHDN 15  
+
FREQUENCY  
FOLDBACK  
LOCKOUT  
COMPARATOR  
×1  
Q2  
FOLDBACK  
CURRENT  
LIMIT  
V
C(MAX)  
CLAMP  
Q3  
ERROR  
AMPLIFIER  
= 2000µMho  
CLAMP  
+
12  
FB  
g
m
11  
1.22V  
2.38V  
V
C
GND  
1, 8, 9, 16  
1956 F01  
Figure 1. LT1956 Block Diagram  
1956f  
7
LT1956/LT1956-5  
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U
APPLICATIO S I FOR ATIO  
FEEDBACK PIN FUNCTIONS  
current through the diode and inductor is equal to the  
short-circuit current limit of the switch (typically 2A for  
the LT1956, folding back to less than 1A). Minimum  
switch on time limitations would prevent the switcher  
from attaining a sufficiently low duty cycle if switching  
frequency were maintained at 500kHz, so frequency is  
reducedbyabout5:1whenthefeedbackpinvoltagedrops  
below 0.8V (see Frequency Foldback graph). This does  
not affect operation with normal load conditions; one  
simply sees a shift in switching frequency during start-up  
as the output voltage rises.  
The feedback (FB) pin on the LT1956 is used to set output  
voltage and provide several overload protection features.  
The first part of this section deals with selecting resistors  
to set output voltage and the remaining part talks about  
foldback frequency and current limiting created by the FB  
pin. Please read both parts before committing to a final  
design. The 5V fixed output voltage part (LT1956-5) has  
internaldividerresistorsandtheFBpinisrenamedSENSE,  
connected directly to the output.  
The suggested value for the output divider resistor (see  
Figure 2) from FB to ground (R2) is 5k or less, and a  
formula for R1 is shown below. The output voltage error  
caused by ignoring the input bias current on the FB pin is  
less than 0.25% with R2 = 5k. A table of standard 1%  
values is shown in Table 1 for common output voltages.  
Please read the following section if divider resistors are  
increased above the suggested values.  
In addition to lower switching frequency, the LT1956 also  
operates at lower switch current limit when the feedback  
pin voltage drops below 0.6V. Q2 in Figure 2 performs this  
function by clamping the VC pin to a voltage less than its  
normal 2.1V upper clamp level. This foldback current limit  
greatly reduces power dissipation in the IC, diode and in-  
ductor during short-circuit conditions. External synchro-  
nization is also disabled to prevent interference with fold-  
back operation. Again, it is nearly transparent to the user  
under normal load conditions. The only loads that may be  
affected are current source loads which maintain full load  
current with output voltage less than 50% of final value. In  
theseraresituationsthefeedbackpincanbeclampedabove  
0.6Vwithanexternaldiodetodefeatfoldbackcurrentlimit.  
Caution: clamping the feedback pin means that frequency  
shifting will also be defeated, so a combination of high in-  
putvoltageanddeadshortedoutputmaycausetheLT1956  
to lose control of current limit.  
R2 V  
1.22  
1.22  
(
)
OUT  
R1=  
Table 1  
OUTPUT  
VOLTAGE  
(V)  
R1  
% ERROR AT OUTPUT  
R2  
(NEAREST 1%) DUE TO DISCRETE 1%  
(kΩ  
)
(k  
)
RESISTOR STEPS  
+0.32  
3
3.3  
5
4.99  
4.99  
4.99  
4.75  
4.47  
4.32  
4.12  
4.12  
7.32  
8.45  
15.4  
18.7  
24.9  
30.9  
36.5  
46.4  
0.43  
0.30  
6
+0.38  
The internal circuitry which forces reduced switching  
frequency also causes current to flow out of the feedback  
pin when output voltage is low. The equivalent circuitry is  
shown in Figure 2. Q1 is completely off during normal  
operation. If the FB pin falls below 0.8V, Q1 begins to  
conduct current and reduces frequency at the rate of  
approximately 3.5kHz/µA. To ensure adequate frequency  
foldback (under worst-case short-circuit conditions), the  
external divider Thevinin resistance must be low enough  
to pull 115µA out of the FB pin with 0.44V on the pin (RDIV  
3.8k). The net result is that reductions in frequency and  
current limit are affected by output voltage divider imped-  
ance. Although divider impedance is not critical, caution  
should be used if resistors are increased beyond the  
8
+0.20  
10  
12  
15  
0.54  
+0.24  
0.27  
More Than Just Voltage Feedback  
Thefeedbackpinisusedformorethanjustoutputvoltage  
sensing. It also reduces switching frequency and current  
limit when output voltage is very low (see the Frequency  
Foldback graph in Typical Performance Characteristics).  
This is done to control power dissipation in both the IC  
andintheexternaldiodeandinductorduringshort-circuit  
conditions. A shorted output requires the switching regu-  
lator to operate at very low duty cycles, and the average  
suggested values and short-circuit conditions will occur  
1956f  
8
LT1956/LT1956-5  
W U U  
APPLICATIO S I FOR ATIO  
U
V
SW  
LT1956  
L1  
TO FREQUENCY  
SHIFTING  
OUTPUT  
5V  
1.4V  
Q1  
ERROR  
AMPLIFIER  
1.2V  
+
R1  
R4  
2k  
R3  
1k  
FB  
+
C1  
BUFFER  
R2  
Q2  
TO SYNC CIRCUIT  
V
GND  
C
1956 F02  
Figure 2. Frequency and Current Limit Foldback  
with high input voltage. High frequency pickup will in-  
crease and the protection accorded by frequency and  
current foldback will decrease.  
V
USING  
OUT  
22µF CERAMIC  
OUTPUT  
10mV/DIV  
CAPACITOR  
V
USING  
OUT  
CHOOSING THE INDUCTOR  
100µF, 0.08Ω  
TANTALUM  
OUTPUT  
10mV/DIV  
For most applications, the output inductor will fall into the  
range of 5µH to 30µH. Lower values are chosen to reduce  
physical size of the inductor. Higher values allow more  
output current because they reduce peak current seen by  
the LT1956 switch, which has a 1.5A limit. Higher values  
also reduce output ripple voltage.  
CAPACITOR  
V
V
= 12V  
OUT  
L = 15µH  
1µs/DIV  
1956 F03  
IN  
= 5V  
Figure 3. LT1956 Output Ripple Voltage Waveforms.  
Ceramic vs Tantalum Output Capacitors  
Output ripple voltage is determined by ripple current  
(ILP-P) through the inductor and the high frequency  
impedance of the output capacitor. At high frequencies,  
the impedance of the tantalum capacitor is dominated by  
its effective series resistance (ESR).  
When choosing an inductor you will need to consider  
output ripple voltage, maximum load current, peak induc-  
tor current and fault current in the inductor. In addition,  
other factors such as core and copper losses, allowable  
component height, EMI, saturation and cost should also  
be considered. The following procedure is suggested as a  
way of handling these somewhat complicated and con-  
flicting requirements.  
Tantalum Output Capacitor  
The typical method for reducing output ripple voltage  
when using a tantalum output capacitor is to increase the  
inductor value (to reduce the ripple current in the induc-  
tor). The following equations will help in choosing the  
requiredinductorvaluetoachieveadesirableoutputripple  
voltage level. If output ripple voltage is of less importance,  
the subsequent suggestions in Peak Inductor and Fault  
Current and EMI will additionally help in the selection of  
the inductor value.  
Output Ripple Voltage  
Figure 3 shows a comparison of output ripple voltage for  
the LT1956 using either a tantalum or ceramic output  
capacitor. It can be seen from Figure 3 that output ripple  
voltagecanbesignificantlyreducedbyusingtheceramic  
outputcapacitor;thesignificantdecreaseinoutputripple  
voltage is due to the very low ESR of ceramic capacitors.  
1956f  
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APPLICATIO S I FOR ATIO  
Peak-to-peak output ripple voltage is the sum of a triwave  
(created by peak-to-peak ripple current (ILP-P) times ESR)  
and a square wave (created by parasitic inductance (ESL)  
and ripple current slew rate). Capacitive reactance is  
assumed to be small compared to ESR or ESL.  
ceramic capacitor. Although this reduction of ESR re-  
moves a useful zero in the overall loop response, this zero  
can be replaced by inserting a resistor (RC) in series with  
the VC pin and the compensation capacitor CC. (See  
Ceramic Capacitors in Applications Information.)  
Peak Inductor Current and Fault Current  
dI  
dt  
VRIPPLE = I  
LP-P)(  
ESR + ESL Σ  
) (  
(
)
To ensure that the inductor will not saturate, the peak in-  
ductorcurrentshouldbecalculatedknowingthemaximum  
load current. An appropriate inductor should then be cho-  
sen. In addition, a decision should be made whether or not  
the inductor must withstand continuous fault conditions.  
where:  
ESR = equivalent series resistance of the output  
capacitor  
ESL = equivalent series inductance of the output  
capacitor  
If maximum load current is 0.5A, for instance, a 0.5A  
inductor may not survive a continuous 2A overload condi-  
tion. Dead shorts will actually be more gentle on the  
inductor because the LT1956 has frequency and current  
limit foldback.  
dI/dt = slew rate of inductor ripple current = VIN/L  
Peak-to-peak ripple current (ILP-P) through the inductor  
and into the output capacitor is typically chosen to be  
between 20% and 40% of the maximum load current. It is  
approximated by:  
Peak inductor and switch current can be significantly  
higher than output current, especially with smaller induc-  
tors and lighter loads, so don’t omit this step. Powdered  
V
V – V  
IN OUT  
(
=
OUT )(  
)
ILP-P  
Table 2  
V
f L  
IN)( )( )  
(
VENDOR/  
PART NO.  
VALUE  
H)  
I
DCR  
(Ohms)  
HEIGHT  
(mm)  
DC(MAX)  
(
µ
(Amps)  
Example: with VIN = 12V, VOUT = 5V, L = 15µH, ESR =  
0.080and ESL = 10nH, output ripple voltage can be  
approximated as follows:  
Coiltronics  
UP1B-100  
10  
22  
22  
33  
15  
1.9  
1.2  
2.0  
1.7  
1.5  
0.111  
0.254  
0.062  
0.092  
0.175  
5.0  
5.0  
6.0  
6.0  
5.0  
UP1B-220  
UP2B-220  
5 12 5  
( )(  
)
ILP-P  
=
= 0.389A  
UP2B-330  
12 15 10–6 500 10–6  
( )  
(
)(  
)
UP1B-150  
dI  
Σ
12  
Coilcraft  
=
= 106 • 0.8  
15 106  
D01813P-153HC  
D01813P-103HC  
D53316P-223  
D53316P-333  
LP025060B-682  
Sumida  
15  
10  
22  
33  
1.5  
1.9  
1.6  
1.4  
1.3  
0.170  
0.111  
0.207  
0.334  
0.165  
5.0  
5.0  
dt  
VRIPPLE = 0.389 0.08 + 10 109 106 0.8  
(
)(  
)
(
)
(
)(  
)
5.1  
= 0.031+ 0.008 = 39mVP-P  
5.1  
6.8  
1.65  
To reduce output ripple voltage further requires an in-  
crease in the inductor value with the trade-off being a  
physically larger inductor with the possibility of increased  
component height and cost.  
CDRH4D28-4R7  
CDRH5D28-100  
CDRH6D28-150  
CDRH6D28-180  
CDRH6D28-220  
CDRH6D38-220  
4.7  
10  
15  
18  
22  
22  
1.32  
1.30  
1.40  
1.32  
1.20  
1.30  
0.072  
0.065  
0.084  
0.095  
0.128  
0.096  
3.0  
3.0  
3.0  
3.0  
3.0  
4.0  
Ceramic Output Capacitor  
An alternative way to further reduce output ripple voltage  
is to reduce the ESR of the output capacitor by using a  
1956f  
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APPLICATIO S I FOR ATIO  
U
current without affecting the frequency compensation it  
provides.  
iron cores are forgiving because they saturate softly,  
whereas ferrite cores saturate abruptly. Other core mate-  
rials fall somewhere in between. The following formula  
assumes continuous mode of operation, but errs only  
slightly on the high side for discontinuous mode, so it can  
be used for all conditions.  
Maximum load current would be equal to maximum  
switch current for an infinitely large inductor, but with  
finite inductor size, maximum load current is reduced by  
one half of peak-to-peak inductor current (ILP-P). The  
following formula assumes continuous mode operation,  
implying that the term on the right is less than one half  
of IP.  
VOUT V – V  
ILP-P  
2
(
)
IN  
OUT  
IPEAK = IOUT  
EMI  
+
= IOUT +  
2•V • f •L  
IN  
IOUT(MAX) Continuous Mode  
Decide if the design can tolerate an “open” core geometry  
like a rod or barrel, which have high magnetic field  
radiation, or whether it needs a closed core like a toroid to  
prevent EMI problems. This is a tough decision because  
the rods or barrels are temptingly cheap and small and  
there are no helpful guidelines to calculate when the  
magnetic field radiation will be a problem.  
V
+ V V – V  
2 V f L  
( )( IN)( )( )  
– V  
ILP-P  
2
(
F)(  
)
OUT  
IN  
OUT F  
= IP –  
= IP –  
For VOUT = 5V, VIN(MAX) = 8V, VF(DI) = 0.63V, f = 500kHz  
and L = 10µH:  
5 + 0.63 8 – 5 – 0.63  
(
)(  
)
IOUT(MAX) = 1.5 –  
2 8 500103 1010–6  
( )( )  
Additional Considerations  
(
)(  
)
After making an initial choice, consider additional factors  
such as core losses and second sourcing, etc. Use the  
experts in Linear Technology’s Applications department if  
you feel uncertain about the final choice. They have  
experience with a wide range of inductor types and can tell  
you about the latest developments in low profile, surface  
mounting, etc.  
= 1.5 – 0.17 = 1.33A  
Note that there is less load current available at the higher  
inputvoltagebecauseinductorripplecurrentincreases.At  
VIN = 15V and using the same set of conditions:  
5 + 0.63 15 – 5 – 0.63  
(
)(  
)
IOUT(MAX) = 1.5 –  
2 15 500103 1010–6  
( )( )  
(
)(  
)
MAXIMUM OUTPUT LOAD CURRENT  
= 1.5 – 0.35 = 1.15A  
Maximum load current for a buck converter is limited by  
themaximumswitchcurrentrating(IP).Thecurrentrating  
fortheLT1956is1.5A. Unlikemostcurrentmodeconvert-  
ers, the LT1956 maximum switch current limit does not  
fall off at high duty cycles. Most current mode converters  
suffer a drop off of peak switch current for duty cycles  
above 50%. This is due to the effects of slope compensa-  
tion required to prevent subharmonic oscillations in cur-  
rent mode converters. (For detailed analysis, see Applica-  
tion Note 19.)  
To calculate peak switch current with a given set of  
conditions, use:  
ILP-P  
2
ISW(PEAK) = IOUT  
= IOUT  
+
+
V
OUT  
+ V V – V  
2 V f L  
( )( IN)( )( )  
– V  
OUT F  
(
F)(  
)
IN  
Reduced Inductor Value and Discontinuous Mode  
The LT1956 is able to maintain peak switch current limit  
over the full duty cycle range by using patented circuitry to  
cancel the effects of slope compensation on peak switch  
If the smallest inductor value is of the most importance to  
a converter design, in order to reduce inductor size/cost,  
discontinuous mode may yield the smallest inductor  
1956f  
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solution. The maximum output load current in discontinu-  
ous mode, however, must be calculated and is defined  
later in this section.  
load current is required, the inductor value must be  
increased. If IOUT(MAX) no longer meets the discontinuous  
mode criteria, use the IOUT(MAX) equation for continuous  
mode; the LT1956 is designed to operate well in both  
modes of operation, allowing a large range of inductor  
values to be used.  
Discontinuous mode is entered when the output load  
current is less than one-half of the inductor ripple current  
(ILP-P). In this mode, inductor current falls to zero before  
the next switch turn-on (see Figure 8). Buck converters  
will be in discontinuous mode for output load current  
given by:  
SHORT-CIRCUIT CONSIDERATIONS  
For a ground short-circuit fault on the regulated output,  
the maximum input voltage for the LT1956 is typically  
limited to 25V. If a greater input voltage is required,  
increasing the resistance in series with the inductor may  
suffice (see short-circuit calculations at the end of this  
section). Alternatively, the 1.5A LT1766 can be used since  
it is identical to the LT1956 but runs at a lower frequency  
of 200kHz, allowing higher sustained input voltage capa-  
bility during output short circuit.  
IOUT Discontinous Mode  
(VOUT + V )(V VOUT – V )  
F
IN  
F
<
(2)(V )(f)(L)  
IN  
The inductor value in a buck converter is usually chosen  
large enough to keep inductor ripple current (ILP-P) low;  
this is done to minimize output ripple voltage and maxi-  
mize output load current. In the case of large inductor  
values, as seen in the equation above, discontinuous  
mode will be associated with “light loads.”  
The LT1956 is a current mode controller. It uses the VC  
node voltage as an input to a current comparator which  
turns off the output switch on a cycle-by-cycle basis as  
peak switch current is reached. The internal clamp on the  
VC node, nominally 2V, then acts as an output switch peak  
current limit. This action becomes the switch current limit  
specification. The maximum available output power is  
then determined by the switch current limit.  
When choosing small inductor values, however, discon-  
tinuous mode will occur at much higher output load  
currents. The limit to the smallest inductor value that can  
be chosen is set by the LT1956 peak switch current (IP)  
and the maximum output load current required given by:  
A potential controllability problem could occur under  
short-circuit conditions. If the power supply output is  
short circuited, the feedback amplifier responds to the low  
output voltage by raising the control voltage, VC, to its  
peak current limit value. Ideally, the output switch would  
be turned on, and then turned off as its current exceeded  
thevalueindicatedbyVC.However,thereisfiniteresponse  
time involved in both the current comparator and turnoff  
of the output switch. These result in a minimum on time  
tON(MIN). When combined with the large ratio of VIN to  
(VF + I • R), the diode forward voltage plus inductor I • R  
voltage drop, the potential exists for a loss of control.  
Expressed mathematically the requirement to maintain  
control is:  
IOUT(MAX) DiscontinuousMode  
2
2
IP  
IP (f)(L)(V )  
IN  
=
=
2(ILP-P) 2(VOUT + V )(V – VOUT V )  
F
IN  
F
Example: For VIN = 15V, VOUT = 5V, VF = 0.63V, f = 500kHz  
and L = 4µH  
IOUT(MAX) Discontinuous Mode  
1.52(500103)(4 106)(15)  
2(5 + 0.63)(15 – 5 – 0.63)  
=
IOUT(MAX) Discontinuous Mode = 0.639A  
What has been shown here is that if high inductor ripple  
current and discontinuous mode operation can be toler-  
ated, small inductor values can be used. If a higher output  
VF +I•R  
f • tON  
V
IN  
1956f  
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U
capacitor may potentially be starting from 0V. This re-  
quires that the part obey the overall duty cycle demanded  
by the loop, related to VIN and VOUT, as the output voltage  
rises to its target value. It is recommended that for [VIN/  
(VOUT + VF)] ratios > 4, a soft-start circuit should be used  
tocontroltheoutputcapacitorchargerateduringstart-up  
or during recovery from an output short circuit, thereby  
adding additional control over peak inductor current. See  
Buck Converter with Adjustable Soft-Start later in this  
data sheet.  
where:  
f = switching frequency  
tON = switch minimum on time  
VF = diode forward voltage  
VIN = input voltage  
I • R = inductor I • R voltage drop  
If this condition is not observed, the current will not be  
limited at IPK, but will cycle-by-cycle ratchet up to some  
higher value. Using the nominal LT1956 clock frequency  
of 500KHz, a VIN of 12V and a (VF + I • R) of say 0.7V, the  
maximum tON to maintain control would be approximately  
116ns, an unacceptably short time.  
OUTPUT CAPACITOR  
The LT1956 will operate with either ceramic or tantalum  
output capacitors. The output capacitor is normally cho-  
sen by its effective series resistance (ESR), because this  
is what determines output ripple voltage. The ESR range  
for typical LT1956 applications using a tantalum output  
capacitoris0.05to0.2. Atypicaloutputcapacitorisan  
AVX type TPS, 100µF at 10V, with a guaranteed ESR less  
than 0.1. This is a “D” size surface mount solid tantalum  
capacitor. TPS capacitors are specially constructed and  
tested for low ESR, so they give the lowest ESR for a given  
volume. The value in microfarads is not particularly criti-  
cal, and values from 22µF to greater than 500µF work well,  
but you cannot cheat mother nature on ESR. If you find a  
tiny 22µF solid tantalum capacitor, it will have high ESR,  
and output ripple voltage will be terrible. Table 3 shows  
some typical solid tantalum surface mount capacitors.  
The solution to this dilemma is to slow down the oscillator  
when the FB pin voltage is abnormally low thereby indicat-  
ing some sort of short-circuit condition. Oscillator fre-  
quency is unaffected until FB voltage drops to about 2/3 of  
its normal value. Below this point the oscillator frequency  
decreasesroughlylinearlydowntoalimitofabout100kHz.  
Thisloweroscillatorfrequencyduringshort-circuitcondi-  
tions can then maintain control with the effective mini-  
mum on time. Even with frequency foldback, however, the  
LT1956 will not survive a permanent output short at the  
absolute maximum voltage rating of VIN = 60V; this is  
defined solely by internal semiconductor junction break-  
down effects.  
For the maximum input voltage allowed during an output  
short to ground, the previous equation defining minimum  
on-time can be used. Assuming VF (D1 catch diode) =  
0.63V at 1A (short-circuit current is folded back to typical  
switch current limit • 0.5), I (inductor) • DCR = 1A • 0.128  
= 0.128V (L = CDRH6D28-22), typical f = 100kHz (folded  
back) and typical minimum on-time = 300ns, the maxi-  
mum allowable input voltage during an output short to  
ground is typically:  
Table 3. Surface Mount Solid Tantalum Capacitor ESR  
and Ripple Current  
E CASE SIZE  
ESR (MAX,  
)
RIPPLE CURRENT (A)  
AVX TPS, Sprague 593D  
D CASE SIZE  
0.1 to 0.3  
0.1 to 0.3  
0.2 (typ)  
0.7 to 1.1  
AVX TPS, Sprague 593D  
C CASE SIZE  
0.7 to 1.1  
0.5 (typ)  
AVX TPS  
VIN = (0.63V + 0.128V)/(100kHz • 300ns)  
VIN(MAX) = 25V  
Unlike the input capacitor, RMS ripple current in the  
output capacitor is normally low enough that ripple cur-  
rent rating is not an issue. The current waveform is  
triangular with a typical value of 125mARMS. The formula  
to calculate this is:  
Increasing the DCR of the inductor will increase the maxi-  
mumVIN allowedduringanoutputshorttogroundbutwill  
also drop overall efficiency during normal operation.  
Every time the converter wakes up from shutdown or  
undervoltage lockout to begin switching, the output  
1956f  
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is to prevent excessive ripple causing dips below the mini-  
mum operating voltage resulting in erratic operation.  
Output capacitor ripple current (RMS):  
0.29 V  
OUT )(  
=
V – V  
IN OUT  
(
)
Depending on how the LT1956 circuit is powered up you  
may need to check for input voltage transients.  
IRIPPLE(RMS)  
L f V  
( )( )(  
)
IN  
The input voltage transients may be caused by input  
voltage steps or by connecting the LT1956 converter to an  
already powered up source such as a wall adapter. The  
sudden application of input voltage will cause a large  
surge of current in the input leads that will store energy in  
the parasitic inductance of the leads. This energy will  
causetheinputvoltagetoswingabovetheDClevelofinput  
power source and it may exceed the maximum voltage  
rating of input capacitor and LT1956.  
Ceramic Capacitors  
Ceramic capacitors are generally chosen for their good  
high frequency operation, small size and very low ESR  
(effective series resistance). Their low ESR reduces  
outputripplevoltagebutalsoremovesausefulzerointhe  
loop frequency response, common to tantalum capaci-  
tors. To compensate for this, a resistor RC can be placed  
in series with the VC compensation capacitor CC. Care  
must be taken however, since this resistor sets the high  
frequency gain of the error amplifier, including the gain  
at the switching frequency. If the gain of the error  
amplifier is high enough at the switching frequency,  
output ripple voltage (although smaller for a ceramic  
output capacitor) may still affect the proper operation of  
the regulator. A filter capacitor CF in parallel with the  
RC/CC network is suggested to control possible ripple at  
the VC pin. The LT1956 can be stabilized for VOUT = 5V at  
1A using a 22µF ceramic output capacitor and VC com-  
ponent values of CC = 4700pF, RC = 4.7k and CF = 220pF.  
The easiest way to suppress input voltage transients is to  
addasmallaluminumelectrolyticcapacitorinparallelwith  
the low ESR input capacitor. The selected capacitor needs  
to have the right amount of ESR in order to critically  
dampen the resonant circuit formed by the input lead  
inductance and the input capacitor. The typical values of  
ESRwillfallintherangeof0.5to2andcapacitancewill  
fall in the range of 5µF to 50µF.  
If tantalum capacitors are used, values in the 22µF to  
470µF range are generally needed to minimize ESR and  
meet ripple current and surge ratings. Care should be  
taken to ensure the ripple and surge ratings are not  
exceeded. The AVX TPS and Kemet T495 series are surge  
rated. AVX recommends derating capacitor operating  
voltage by 2 for high surge applications.  
INPUT CAPACITOR  
Step-down regulators draw current from the input supply  
in pulses. The rise and fall times of these pulses are very  
fast. The input capacitor is required to reduce the voltage  
ripple this causes at the input of LT1956 and force the  
switching current into a tight local loop, thereby minimiz-  
ing EMI. The RMS ripple current can be calculated from:  
CATCH DIODE  
HighestefficiencyoperationrequirestheuseofaSchottky  
type diode. DC switching losses are minimized due to its  
low forward voltage drop, and AC behavior is benign due  
to its lack of a significant reverse recovery time. Schottky  
diodes are generally available with reverse voltage ratings  
ofupto60Vandeven100V, andarepricecompetitivewith  
other types.  
VOUT V – V  
(
)
IN  
OUT  
IRIPPLE(RMS)CIN = IOUT  
2
V
IN  
Ceramiccapacitorsareidealforinputbypassing.At500kHz  
switching frequency, the energy storage requirement of  
the input capacitor suggests that values in the range of  
2.2µF to 10µF are suitable for most applications. If opera-  
tionisrequiredclosetotheminimuminputrequiredbythe  
output of the LT1956, a larger value may be required. This  
The use of so-called “ultrafast” recovery diodes is gener-  
ally not recommended. When operating in continuous  
mode, the reverse recovery time exhibited by “ultrafast”  
diodes will result in a slingshot type effect. The power  
1956f  
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internalswitchwillrampupVIN currentintothediodeinan  
attempt to get it to recover. Then, when the diode has  
finallyturnedoff,sometensofnanosecondslater,theVSW  
node voltage ramps up at an extremely high dV/dt, per-  
haps 5 to even 10V/ns! With real world lead inductances,  
the VSW node can easily overshoot the VIN rail. This can  
result in poor RFI behavior and if the overshoot is severe  
enough, damage the IC itself.  
A 0.1µF boost capacitor is recommended for most appli-  
cations. Almost any type of film or ceramic capacitor is  
suitable, but the ESR should be <1to ensure it can be  
fully recharged during the off time of the switch. The  
capacitor value is derived from worst-case conditions of  
1800ns on time, 42mA boost current and 0.7V discharge  
ripple. The boost capacitor value could be reduced under  
less demanding conditions, but this will not improve  
circuitoperationorefficiency.Underlowinputvoltageand  
low load conditions, a higher value capacitor will reduce  
discharge ripple and improve start-up operation.  
The suggested catch diode (D1) is an International Recti-  
fier 10MQ060N Schottky. It is rated at 1.5A average  
forward current and 60V reverse voltage. Typical forward  
voltage is 0.63V at 1A. The diode conducts current only  
during switch off time. Peak reverse voltage is equal to  
regulatorinputvoltage.Averageforwardcurrentinnormal  
operation can be calculated from:  
SHUTDOWN FUNCTION AND UNDERVOLTAGE  
LOCKOUT  
Figure 4 shows how to add undervoltage lockout (UVLO)  
to the LT1956. Typically, UVLO is used in situations where  
the input supply is current limited, or has a relatively high  
source resistance. A switching regulator draws constant  
power from the source, so source current increases as  
source voltage drops. This looks like a negative resistance  
loadtothesourceandcancausethesourcetocurrentlimit  
or latch low under low source voltage conditions. UVLO  
prevents the regulator from operating at source voltages  
where these problems might occur.  
ID(AVG) = IOUT (1 – DC)  
This formula will not yield values higher than 1.5A with  
maximum load current of 1.5A. The only reason to  
consider a larger diode is the worst-case condition of a  
high input voltage and shorted output. With a shorted  
condition, diode current will increase to a typical value of  
2A, determined by peak switch current limit. This is safe  
forshortperiodsoftime, butitwouldbeprudenttocheck  
with the diode manufacturer if continuous operation  
under these conditions must be tolerated.  
Threshold voltage for lockout is about 2.38V. A 5.5µA bias  
currentflowsout ofthepinatthisthreshold. Theinternally  
generated current is used to force a default high state on  
the shutdown pin if the pin is left open. When low shut-  
down current is not an issue, the error due to this current  
can be minimized by making RLO 10k or less. If shutdown  
currentisanissue, RLO canberaisedto100k, buttheerror  
due to initial bias current and changes with temperature  
should be considered.  
BOOST PIN  
For most applications, the boost components are a 0.1µF  
capacitor and an MMSD914TI diode. The anode is typi-  
callyconnectedtotheregulatedoutputvoltagetogenerate  
avoltageapproximatelyVOUT aboveVIN todrivetheoutput  
stage. However, the output stage discharges the boost  
capacitor during the on time of the switch. The output  
driver requires at least 3V of headroom throughout this  
period to keep the switch fully saturated. If the output  
voltageislessthan3V,itisrecommendedthatanalternate  
boostsupplyisused. Theboostdiodecanbeconnectedto  
the input, although, care must be taken to prevent the 2×  
VIN boost voltage from exceeding the BOOST pin absolute  
maximum rating. The additional voltage across the switch  
driver also increases power loss, reducing efficiency. If  
available, an independent supply can be used with a local  
bypass capacitor.  
RLO = 10k to 100k 25k suggested  
(
)
RLO V 2.38V  
(
)
IN  
RHI =  
2.38V RLO 5.5µA  
(
)
VIN = minimum input voltage  
Keep the connections from the resistors to the shutdown  
pin short and make sure that interplane or surface capaci-  
tance to the switching nodes are minimized. If high  
resistor values are used, the shutdown pin should be  
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R
FB  
L1  
LT1956  
OUTPUT  
V
SW  
2.38V  
+
IN  
INPUT  
STANDBY  
R
HI  
5.5µA  
+
SHDN  
C1  
+
TOTAL  
SHUTDOWN  
R
C2  
LO  
0.4V  
GND  
1956 F04  
Figure 4. Undervoltage Lockout  
bypassed with a 1000pF capacitor to prevent coupling  
problems from the switch node. If hysteresis is desired in  
the undervoltage lockout point, a resistor RFB can be  
added to the output node. Resistor values can be calcu-  
lated from:  
SYNCHRONIZING  
The SYNC input must pass from a logic level low, through  
the maximum synchronization threshold with a duty cycle  
between 10% and 90%. The input can be driven directly  
from a logic level output. The synchronizing range is equal  
to initial operating frequency up to 700kHz. This means  
that minimum practical sync frequency is equal to the  
worst-case high self-oscillating frequency (570kHz), not  
the typical operating frequency of 500kHz. Caution should  
be used when synchronizing above 662kHz because at  
highersyncfrequenciestheamplitudeoftheinternalslope  
compensation used to prevent subharmonic switching is  
reduced. This type of subharmonic switching only occurs  
at input voltages less than twice output voltage. Higher  
inductor values will tend to eliminate this problem. See  
Frequency Compensation section for a discussion of an  
entirely different cause of subharmonic switching before  
assuming that the cause is insufficient slope compensa-  
tion. Application Note 19 has more details on the theory  
of slope compensation.  
RLO V 2.38 V/V  
+1 + ∆V  
(
)
[
IN  
OUT  
]
RHI =  
2.38 RLO 5.5µA  
(
)
R = R  
V
/
V  
(
)
(
)
FB  
HI  
OUT  
25k suggested for RLO  
VIN = Input voltage at which switching stops as input  
voltage descends to trip level  
V = Hysteresis in input voltage level  
Example: output voltage is 5V, switching is to stop if input  
voltage drops below 12V and should not restart unless  
input rises back to 13.5V. V is therefore 1.5V and  
VIN = 12V. Let RLO = 25k.  
25k 12 2.38 1.5/5 +1 + 1.5  
(
)
)
[
]
RHI =  
At power-up, when VC is being clamped by the FB pin (see  
Figure2,Q2),thesyncfunctionisdisabled.Thisallowsthe  
frequency foldback to operate in the shorted output con-  
dition. During normal operation, switching frequency is  
controlledbytheinternaloscillatoruntiltheFBpinreaches  
0.8V, after which the SYNC pin becomes operational. If no  
synchronization is required, this pin should be connected  
2.38 – 25k 5.5µA  
(
25k 10.41  
(
)
=
= 116k  
2.24  
RFB = 116k 5/1.5 = 387k  
(
)
to ground.  
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LAYOUT CONSIDERATIONS  
LT1956  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
L1  
5V  
As with all high frequency switchers, when considering  
layout, care must be taken in order to achieve optimal  
electrical, thermal and noise performance. For maximum  
efficiency, switch rise and fall times are typically in the  
nanosecond range. To prevent noise both radiated and  
conducted, the high speed switching current path, shown  
in Figure 5, must be kept as short as possible. This is  
implementedinthesuggestedlayoutofFigure6. Shorten-  
ingthispathwillalsoreducetheparasitictraceinductance  
of approximately 25nH/inch. At switch off, this parasitic  
inductance produces a flyback spike across the LT1956  
switch. When operating at higher currents and input  
voltages, with poor layout, this spike can generate volt-  
ages across the LT1956 that may exceed its absolute  
maximum rating. A ground plane should always be used  
under the switcher circuitry to prevent interplane coupling  
and overall noise.  
V
IN  
C3  
D1 C1  
LOAD  
1956 F05  
Figure 5. High Speed Switching Path  
The VC and FB components should be kept as far away as  
possible from the switch and boost nodes. The LT1956  
pinout has been designed to aid in this. The ground for  
these components should be separated from the switch  
current path. Failure to do so will result in poor stability or  
subharmonic like oscillation.  
CONNECT TO  
GROUND PLANE  
GND  
L1  
FOR THE FE PACKAGE,  
SOLDER THE EXPOSED  
C1  
PAD TO THE COPPER  
GROUND PLANE  
MINIMIZE LT1956  
C3-D1 LOOP  
D2  
UNDERNEATH THE DEVICE  
V
OUT  
D1  
C3  
C2  
GND  
GND  
SW  
GND  
SHDN  
SYNC  
KELVIN SENSE  
V
OUT  
V
IN  
LT1956  
FB  
R2  
V
C
BOOST  
GND  
R1  
C
FB  
BIAS  
GND  
C
F
V
IN  
R
C
KEEP FB AND V COMPONENTS  
C
AWAY FROM HIGH FREQUENCY,  
HIGH CURRENT COMPONENTS  
C
C
PLACE FEEDTHROUGH AROUND  
GROUND PINS (4 CORNERS) FOR  
GOOD THERMAL CONDUCTIVITY  
1956 F06  
Figure 6. Suggested Layout  
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a >100MHz oscilloscope must be used, and waveforms  
should be observed on the leads of the package. This  
switch off spike will also cause the SW node to go below  
ground. The LT1956 has special circuitry inside which  
mitigates this problem, but negative voltages over 0.8V  
lasting longer than 10ns should be avoided. Note that  
100MHz oscilloscopes are barely fast enough to see the  
details of the falling edge overshoot in Figure 7.  
Board layout also has a significant effect on thermal resis-  
tance. For the GN package, Pins 1, 8, 9 and 16, GND, are  
a continuous copper plate that runs under the LT1956 die.  
This is the best thermal path for heat out of the package.  
Reducing the thermal resistance from Pins 1, 8, 9 and 16  
onto the board will reduce die temperature and increase  
the power capability of the LT1956. This is achieved by  
providing as much copper area as possible around these  
pins. Addingmultiplesolderfilledfeedthroughsunderand  
around these four corner pins to the ground plane will also  
help. Similar treatment to the catch diode and coil termi-  
nations will reduce any additional heating effects. For the  
FE package, the exposed pad should be soldered to the  
copper ground plane underneath the device.  
A second, much lower frequency ringing is seen during  
switch off time if load current is low enough to allow the  
inductor current to fall to zero during part of the switch off  
time(seeFigure8).Switchanddiodecapacitanceresonate  
with the inductor to form damped ringing at 1MHz to 10  
MHz. This ringing is not harmful to the regulator and it has  
not been shown to contribute significantly to EMI. Any  
attempt to damp it with a resistive snubber will degrade  
efficiency.  
PARASITIC RESONANCE  
Resonance or “ringing” may sometimes be seen on the  
switch node (see Figure 7). Very high frequency ringing  
following switch rise time is caused by switch/diode/input  
capacitor lead inductance and diode capacitance. Schot-  
tky diodes have very high “Q” junction capacitance that  
can ring for many cycles when excited at high frequency.  
Iftotalleadlengthfortheinputcapacitor, diodeandswitch  
path is 1 inch, the inductance will be approximately 25nH.  
At switch off, this will produce a spike across the NPN  
output device in addition to the input voltage. At higher  
currents this spike can be in the order of 10V to 20V or  
higher with a poor layout, potentially exceeding the abso-  
lute max switch voltage. The path around switch, catch  
diode and input capacitor must be kept as short as  
possibletoensurereliableoperation.Whenlookingatthis,  
THERMAL CALCULATIONS  
Power dissipation in the LT1956 chip comes from four  
sources: switch DC loss, switch AC loss, boost circuit  
current,andinputquiescentcurrent.Thefollowingformu-  
las show how to calculate each of these losses. These  
formulas assume continuous mode operation, so they  
should not be used for calculating efficiency at light load  
currents.  
Switch loss:  
2
RSW OUT  
I
V
OUT  
(
) (  
)
PSW  
=
+ tEFF(1/2) I  
V
f
(
OUT)( IN)( )  
V
IN  
SWITCH NODE  
VOLTAGE  
SW RISE  
SW FALL  
10V/DIV  
0.2A/DIV  
2V/DIV  
INDUCTOR  
CURRENT AT  
IOUT = 0.1A  
V
IN = 25V  
500ns/DIV  
1956 F08  
VOUT = 5V  
50ns/DIV  
1956 F07  
L = 15µH  
Figure 8. Discontinuous Mode Ringing  
Figure 7. Switch Node Resonance  
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Boost current loss:  
(V )(V VOUT)(ILOAD  
)
F
IN  
PDIODE  
=
2
V
IN  
VOUT  
I
/36  
OUT  
(
)
PBOOST  
=
VF = Forward voltage of diode (assume 0.63V at 1A)  
V
IN  
Quiescent current loss:  
(0.63)(12 5)(1)  
PDIODE  
=
= 0.37W  
12  
P = V 0.0015 + V 0.003  
OUT  
(
)
(
)
Q
IN  
Notice that the catch diode’s forward voltage contributes  
a significant loss in the overall system efficiency. A larger,  
low VF diode can improve efficiency by several percent.  
RSW = switch resistance (0.3) hot  
tEFF = effective switch current/voltage overlap time  
= (tr + tf + tIr + tIf)  
tr = (VIN/1.2)ns  
tf = (VIN/1.7)ns  
tIr = tIf = (IOUT/0.05)ns  
f = switch frequency  
PINDUCTOR = (ILOAD)(LDCR  
)
L
DCR = inductor DC resistance (assume 0.1)  
PINDUCTOR = (1)(0.1) = 0.1W  
Typical thermal resistance of the board is 10°C/W. Taking  
the catch diode and inductor power dissipation into ac-  
count and using the example calculations for LT1956 dis-  
sipation, the LT1956 die temperature will be estimated as:  
Example: with VIN = 12V, VOUT = 5V and IOUT = 1A:  
0.3 1 2 5  
(
)( ) ( )  
PSW  
=
+ 57•109 1/2 1 12 500 •103  
(
)
)
( )( )  
(
(
)
12  
TJ = TA + (θJA • PTOT) + (10 • [PDIODE + PINDUCTOR])  
= 0.125 + 0.171= 0.296W  
With the GN16 package (θJA = 85°C/W), at an ambient  
temperature of 70°C:  
2
5 1/36  
( )  
(
)
PBOOST  
=
= 0.058W  
TJ = 70 + (85 • 0.39) + (10 • 0.47) = 108°C  
12  
P =12 0.0015 +5 0.003 = 0.033W  
(
)
(
)
Q
With the TSSOP package (θJA = 45°C/W) at an ambient  
temperature of 70°C:  
Total power dissipation in the IC is given by:  
PTOT = PSW + PBOOST + PQ  
TJ = 70 + (45 • 0.37) + (10 • 0.47) = 91°C  
Die temperature can peak for certain combinations of  
VIN,VOUT andloadcurrent.WhilehigherVIN givesgreater  
switch AC losses, quiescent and catch diode losses, a  
lower VIN may generate greater losses due to switch DC  
losses. Ingeneral, themaximumandminimumVIN levels  
shouldbecheckedwithmaximumtypicalloadcurrentfor  
calculation of the LT1956 die temperature. If a more  
accurate die temperature is required, a measurement of  
theSYNCpinresistance(toGND)canbeused. TheSYNC  
pin resistance can be measured by forcing a voltage no  
greater than 0.5V at the pin and monitoring the pin  
current over temperature in a oven. This should be done  
with minimal device power (low VIN and no switching  
[VC = 0V]) in order to calibrate SYNC pin resistance with  
ambient (oven) temperature.  
= 0.296W + 0.058W + 0.033W = 0.39W  
Thermal resistance for the LT1956 packages is influenced  
by the presence of internal or backside planes.  
SSOP (GN16) Package: With a full plane under the GN16  
package, thermal resistance will be about 85°C/W.  
TSSOP(ExposedPad)Package:Withafullplaneunderthe  
TSSOP package, thermal resistance (θJA) will be about  
45°C/W.  
To calculate die temperature, use the proper thermal  
resistance (θJA) number for the desired package an add in  
worst-case ambient temperature:  
TJ = TA + (θJA • PTOT  
)
When estimating ambient, remember the nearby catch  
diode and inductor will also be dissipating power.  
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Note: Some of the internal power dissipation in the IC, due  
to BOOST pin voltage, can be transferred outside of the IC  
to reduce junction temperature by increasing the voltage  
drop in the path of the boost diode D2 (see Figure 9). This  
reduction of junction temperature inside the IC will allow  
higher ambient temperature operation for a given set of  
conditions.BOOSTpincircuitrydissipatespowergivenby:  
A zener, D4, placed in series with D2 (see Figure 9), drops  
voltage to C2.  
Example:  
The BOOST pin power dissipation for a 20V input to 12V  
output conversion at 1A is given by:  
12• 1/36 •12  
(
)
P
=
= 0.2W  
BOOST  
VOUT • I /36 V  
(
)
20  
SW  
C2  
PDISS (BOOST Pin)=  
V
IN  
If a 7V zener is placed in series with D2, then power  
dissipation becomes:  
Typically, VC2 (the boost voltage across the capacitor C2)  
equals VOUT. This is because diodes D1 and D2 can be  
considered almost equal, where:  
12• 1/36 5  
(
)
P
=
= 0.084W  
BOOST  
20  
VC2 = VOUT – VF(D2) – [–VF(D1)] = VOUT  
.
For an FE package with thermal resistance of 45°C/W,  
ambient temperature savings would be:  
Hence, the equation for boost circuitry power dissipation  
given in the previous Thermal Calculations section, is  
stated as:  
T (ambient) savings = 0.116W • 45°C/W = 5°C  
For a GN package with thermal resistance of 85°C/W,  
VOUT • I /36 V  
(
)
SW  
OUT  
ambient temperature savings would be:  
PDISS(BOOST)  
=
V
IN  
T (ambient) savings = 0.116W • 85°C/W = 10°C  
Here it can be seen that boost power dissipation increases  
as the square of VOUT. It is possible, however, to reduce  
VC2 below VOUT to save power dissipation by increasing  
the voltage drop in the path of D2. Care should be taken  
that VC2 does not fall below the minimum 3.3V boost  
voltage required for full saturation of the internal power  
switch.Foroutputvoltagesof5V,VC2 isapproximately5V.  
During switch turn on, VC2 will fall as the boost capacitor  
C2isdischargedbytheBOOSTpin.InthepreviousBOOST  
Pin section, the value of C2 was designed for a 0.7V droop  
in VC2 (= VDROOP). Hence, an output voltage as low as 4V  
would still allow the minimum 3.3V for the boost function  
using the C2 capacitor calculated.  
The 7V zener should be sized for excess of 0.116W  
operation. The tolerances of the zener should be consid-  
ered to ensure minimum VBOOST exceeds 3.3V + VDROOP  
.
D2  
D2  
D4  
BOOST  
LT1956  
C2  
L1  
V
V
OUT  
V
SW  
IN  
IN  
C3  
SHDN  
BIAS  
+
R1  
C1  
SYNC  
GND  
FB  
R2  
If a target output voltage of 12V is required, however, an  
excess of 8V is placed across the boost capacitor which is  
not required for the boost function but still dissipates  
additional power.  
V
C
D1  
R
C
C
F
C
C
What is required is a voltage drop in the path of D2 to  
achieve minimal power dissipation while still maintaining  
minimum boost voltage across C2.  
1956 F09  
Figure 9. BOOST Pin, Diode Selection  
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Input Voltage vs Operating Frequency Considerations  
circuits, read the Layout Considerations section first.  
Common layout errors that appear as stability problems  
are distant placement of input decoupling capacitor and/  
or catch diode, and connecting the VC compensation to a  
ground track carrying significant switch current. In addi-  
tion, the theoretical analysis considers only first order  
non-ideal component behavior. For these reasons, it is  
important that a final stability check is made with produc-  
tion layout and components.  
TheabsolutemaximuminputsupplyvoltagefortheLT1956  
is specified at 60V. This is based on internal semiconduc-  
tor junction breakdown effects. The practical maximum  
input supply voltage for the LT1956 may be less than 60V  
due to internal power dissipation or switch minimum on  
time considerations.  
For the extreme case of an output short-circuit fault to  
ground, see the section Short-Circuit Considerations.  
The LT1956 uses current mode control. This alleviates  
many of the phase shift problems associated with the  
inductor. The basic regulator loop is shown in Figure 10.  
The LT1956 can be considered as two gm blocks, the error  
amplifier and the power stage.  
A detailed theoretical basis for estimating internal power  
dissipation is given in the Thermal Calculations section.  
Thiswillallowafirstpasscheckofwhetheranapplication’s  
maximum input voltage requirement is suitable for the  
LT1956. Be aware that these calculations are for DC input  
voltages and that input voltage transients as high as 60V  
are possible if the resulting increase in internal power  
dissipation is of insufficient time duration to raise die  
temperature significantly. For the FE package, this means  
high voltage transients on the order of hundreds of milli-  
seconds are possible. If LT1956 (FE package) thermal  
calculations show power dissipation is not suitable for the  
given application, the LT1766 (FE package) is a recom-  
mended alternative since it is identical to the LT1956 but  
runs cooler at 200kHz.  
Figure 11 shows the overall loop response. At the VC pin,  
the frequency compensation components used are:  
RC = 2.2k, CC = 0.022µF and CF = 220pF. The output  
capacitor used is a 100µF, 10V tantalum capacitor with  
typical ESR of 100m.  
TheESRofthetantalumoutputcapacitorprovidesauseful  
zerointheloopfrequencyresponseformaintainingstabil-  
ity. This ESR, however, contributes significantly to the  
ripple voltage at the output (see Output Ripple Voltage in  
the Applications Information section). It is possible to  
reduce capacitor size and output ripple voltage by replac-  
ing the tantalum output capacitor with a ceramic output  
capacitor because of its very low ESR. The zero provided  
by the tantalum output capacitor must now be reinserted  
back into the loop. Alternatively, there may be cases  
where, even with the tantalum output capacitor, an addi-  
tional zero is required in the loop to increase phase margin  
for improved transient response.  
Switch minimum on time is the other factor that may limit  
the maximum operational input voltage for the LT1956 if  
pulse-skipping behavior is not allowed. For the LT1956,  
pulse-skipping may occur for VIN/(VOUT + VF) ratios > 4.  
(VF = Schottky diode D1 forward voltage drop, Figure 5.)  
If the LT1766 is used, the ratio increases to 10. Pulse-  
skippingistheregulator’swayofmissingswitchpulsesto  
maintain output voltage regulation. Although an increase  
in output ripple voltage can occur during pulse-skipping,  
a ceramic output capacitor can be used to keep ripple  
voltage to a minimum (see output ripple voltage compari-  
son for tantalum vs ceramic output capacitors, Figure 3).  
Azerocanbeaddedintotheloopbyplacingaresistor(RC)  
attheVC pininserieswiththecompensationcapacitor,CC,  
or by placing a capacitor (CFB) between the output and the  
FB pin.  
When using RC, the maximum value has two limitations.  
First, thecombinationofoutputcapacitorESRandRC may  
stopthelooprollingoffaltogether. Second, iftheloopgain  
is not rolled off sufficiently at the switching frequency,  
output ripple will perturb the VC pin enough to cause  
unstable duty cycle switching similar to subharmonic  
FREQUENCY COMPENSATION  
Before starting on the theoretical analysis of frequency  
response,thefollowingshouldberemembered—theworse  
the board layout, the more difficult the circuit will be to  
stabilize. This is true of almost all high frequency analog  
1956f  
21  
LT1956/LT1956-5  
W U U  
U
APPLICATIO S I FOR ATIO  
80  
60  
180  
150  
120  
90  
LT1956  
CURRENT MODE  
POWER STAGE  
SW  
GAIN  
OUTPUT  
ERROR  
g
m
= 2mho  
40  
AMPLIFIER  
C
FB  
R1  
R
FB  
TANTALUM CERAMIC  
20  
g
=
m
2000µmho  
PHASE  
ESR  
ESL  
+
R
200k  
1.22V  
O
0
60  
LOAD  
+
C1  
C1  
GND  
V
C
–20  
–40  
30  
R2  
0
R
C
10  
100  
1k  
10k  
100k  
1M  
C
F
FREQUENCY (Hz)  
1956 F11  
C
C
V
= 12V  
R
C
C
= 2.2k  
= 22nF  
= 220pF  
IN  
C
C
F
1956 F10  
V
= 5V  
OUT  
LOAD  
I
= 500mA  
= 100µF, 10V, 0.1Ω  
C
OUT  
Figure 10. Model for Loop Response  
Figure 11. Overall Loop Response  
oscillations. If needed, an additional capacitor (CF) can be  
addedacrosstheRC/CC networkfromtheVC pintoground  
to further suppress VC ripple voltage.  
CONVERTER WITH BACKUP OUTPUT REGULATOR  
In systems with a primary and backup supply, for ex-  
ample, a battery powered device with a wall adapter input,  
the output of the LT1956 can be held up by the backup  
supply with the LT1956 input disconnected. In this condi-  
tion, the SW pin will source current into the VIN pin. If the  
SHDN pin is held at ground, only the shut down current of  
25µAwillbepulledviatheSWpinfromthesecondsupply.  
With the SHDN pin floating, the LT1956 will consume its  
quiescentoperatingcurrentof1.5mA. TheVIN pinwillalso  
source current to any other components connected to the  
input line. If this load is greater than 10mA or the input  
could be shorted to ground, a series Schottky diode must  
be added, as shown in Figure 12. With these safeguards,  
the output can be held at voltages up to the VIN absolute  
maximum rating.  
With a tantalum output capacitor, the LT1956 already  
includes a resistor (RC) and filter capacitor (CF) at the VC  
pin (see Figures 10 and 11) to compensate the loop over  
the entire VIN range (to allow for stable pulse skipping for  
high VIN-to-VOUT ratios 4). A ceramic output capacitor  
can still be used with a simple adjustment to the resistor  
RC for stable operation (see Ceramic Capacitors section  
for stabilizing LT1956). If additional phase margin is  
required, a capacitor (CFB) can be inserted between the  
output and FB pin but care must be taken for high output  
voltage applications. Sudden shorts to the output can  
create unacceptably large negative transients on the FB  
pin.  
For VIN-to-VOUT ratios < 4, higher loop bandwidths are  
possiblebyreadjustingthefrequencycompensationcom-  
ponents at the VC pin.  
BUCK CONVERTER WITH ADJUSTABLE SOFT-START  
Large capacitive loads or high input voltages can cause  
high input currents at start-up. Figure 13 shows a circuit  
that limits the dv/dt of the output at start-up, controlling  
the capacitor charge rate. The buck converter is a typical  
configuration with the addition of R3, R4, CSS and Q1.  
As the output starts to rise, Q1 turns on, regulating switch  
When checking loop stability, the circuit should be oper-  
ated over the application’s full voltage, current and tem-  
peraturerange.Properloopcompensationmaybeobtained  
byempiricalmethodsasdescribedinApplicationNotes19  
and 76.  
1956f  
22  
LT1956/LT1956-5  
W U U  
APPLICATIO S I FOR ATIO  
U
MMSD914TI  
C2  
0.1µF  
D3  
L1  
18µH  
10MQ060N  
BOOST  
LT1956  
REMOVABLE  
INPUT  
V
SW  
IN  
5V, 1A  
R3  
ALTERNATE  
SUPPLY  
BIAS  
54k  
R1  
SHDN  
SYNC  
GND  
15.4k  
FB  
C1  
100µF  
10V  
+
D1  
10MQ060N  
R2  
4.99k  
V
C
R4  
25k  
C3  
2.2µF  
C
R
C
2.2k  
F
220pF  
C
C
0.022µF  
1956 F12  
Figure 12. Dual Source Supply with 25µA Reverse Leakage  
D2  
MMSD914TI  
C2  
0.1µF  
L1  
18µH  
BOOST  
BIAS  
SW  
OUTPUT  
5V  
1A  
INPUT  
12V  
V
IN  
C3  
2.2µF  
CERAMIC  
+
R1  
15.4k  
C1  
100µF  
D1  
LT1956  
SHDN  
FB  
R2  
4.99k  
SYNC GND  
V
C
C
SS  
R3  
2k  
15nF  
Q1  
C
R
C
2.2k  
F
1766 F13  
220pF  
C
R4  
47k  
C
0.022µF  
Figure 13. Buck Converter with Adjustable Soft-Start  
current via the VC pin to maintain a constant dv/dt at the  
output. Output rise time is controlled by the current  
through CSS defined by R4 and Q1’s VBE. Once the output  
is in regulation, Q1 turns off and the circuit operates  
normally. R3 is transient protection for the base of Q1.  
The ramp is linear and rise times in the order of 100ms are  
possible. Since the circuit is voltage controlled, the ramp  
rate is unaffected by load characteristics and maximum  
outputcurrentisunchanged. Variantsofthiscircuitcanbe  
used for sequencing multiple regulator outputs.  
R4 CSS VOUT  
( )( )(  
)
DUAL POLARITY OUTPUT CONVERTER  
RiseTime =  
VBE  
The circuit in Figure 14a generates both positive and  
negative 5V outputs with all components under 3mm  
height. The topology for the 5V output is a standard buck  
converter. The –5V output uses a second inductor L2,  
diode D3 and output capacitor C6. The capacitor C4  
1956f  
Using the values shown in Figure 10,  
47 •103 1510–9  
5
( )  
(
)(  
)
Rise Time =  
= 5ms  
0.7  
23  
LT1956/LT1956-5  
APPLICATIO S I FOR ATIO  
W U U  
U
D2  
MMSD914TI  
C2  
0.1µF  
L1*  
V
BOOST  
LT1956  
IN  
15µH  
9V TO 12V  
(TRANSIENTS  
TO 36V)  
V
**  
OUT1  
5V  
V
SW  
FB  
IN  
R1  
15.4k  
SHDN  
C5  
C3  
+
10µF  
6.3V  
CER  
2.2µF  
50V  
SYNC  
GND  
R2  
4.99k  
V
C
CERAMIC  
D1  
R
C
F
220pF  
C
B0540W  
2.2k  
C
C
3300pF  
GND  
C4  
+
+
C6  
10µF  
6.3V CER  
10µF  
6.3V  
CER  
L2*  
*SUMIDA CDRH4D28-150  
**SEE FIGURE 14c FOR V  
, V  
OUT1 OUT2  
**†  
LOAD CURRENT RELATIONSHIP  
V
OUT2  
IF LOAD CAN GO TO ZERO, AN OPTIONAL  
PRELOAD OF 500CAN BE  
–5V  
D3  
B0540W  
1956 F14a  
USED TO IMPROVE REGULATION  
Figure 14a. Dual Polarity Output Converter  
5.30  
5.25  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
V
LOAD CURRENT  
750mA  
OUT1  
V
LOAD CURRENT  
OUT1  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
4.85  
4.80  
4.75  
750mA  
V
LOAD CURRENT  
250mA  
OUT1  
V
LOAD CURRENT  
OUT1  
500mA  
V
LOAD CURRENT  
OUT1  
250mA  
0
0
0
0
400  
600  
0
100  
V
200  
300  
400  
500  
600  
200  
800  
100  
200  
300  
400  
500  
LOAD CURRENT (mA)  
V
OUT1  
LOAD CURRENT (mA)  
OUT2  
V
LOAD CURRENT (mA)  
OUT2  
1956 F15b  
1956 F14c  
1956 F14d  
Figure 14b. VOUT2 (–5V) Maximum  
Allowable Load Current vs VOUT1  
(5V) Load Current  
Figure 14c. VOUT2 (–5V) Output  
Voltage vs Load Current  
Figure 14d. Dual Polarity Output  
Converter Efficiency  
transformer becomes available to provide a better height/  
cost solution, refer to the dual output SEPIC circuit de-  
scription in Design Note 100 for correct transformer  
connection.  
couples energy to L2 and ensures equal voltages across  
L2 and L1 during steady state. Instead of using a trans-  
former for L1 and L2, uncoupled inductors were used  
becausetheyrequirelessheightthanasingletransformer,  
can be placed separately in the circuit layout for optimized  
space savings and reduce overall cost. This is true even  
whentheuncoupledinductorsaresized(twicethevalueof  
inductance of the transformer) in order to keep ripple  
current comparable to the transformer solution. If a single  
During switch on-time, in steady state, the voltage across  
both L1 and L2 is positive and equal; with energy (and  
current) ramping up in each inductor. The current in L2 is  
provided by the coupling capacitor C4. During switch off-  
time, current ramps downward in each inductor. The  
1956f  
24  
LT1956/LT1956-5  
W U U  
APPLICATIO S I FOR ATIO  
U
currentinL2andC4flowsviathecatchdiodeD3, charging  
the negative output capacitor C6. If the negative output is  
not loaded enough, it can go severely unregulated (be-  
come more negative). Figure 14b shows the maximum  
allowable –5V output load current (vs load current on the  
5V output) that will maintain the –5V output within 3%  
tolerance. Figure 14c shows the –5V output voltage regu-  
lation vs its own load current when plotted for three  
separate load currents on the 5V output. The efficiency of  
the dual output converter circuit shown in Figure 14a is  
given in Figure 14d.  
(V )(VOUT  
)
IN  
IP –  
(VOUT )(V – 0.3)  
IN  
2(VOUT + V )(f)(L)  
IN  
IMAX  
=
(VOUT + V – 0.3)(VOUT + VF)  
IN  
IP = maximum rated switch current  
VIN = minimum input voltage  
OUT = output voltage  
VF = catch diode forward voltage  
0.3 = switch voltage drop at 1.5A  
V
Example: with VIN(MIN) = 5.5V, VOUT = 12V, L = 15µH,  
VF = 0.63V, IP = 1.5A: IMAX = 0.36A.  
POSITIVE-TO-NEGATIVE CONVERTER  
INDUCTOR VALUE  
The circuit in Figure 15 is a positive-to-negative topology  
using a grounded inductor. It differs from the standard  
approach in the way the IC chip derives its feedback signal  
because the LT1956 accepts only positive feedback sig-  
nals. Thegroundpinmustbetiedtotheregulatednegative  
output. A resistor divider to the FB pin, then provides the  
proper feedback voltage for the chip.  
The criteria for choosing the inductor is typically based on  
ensuring that peak switch current rating is not exceeded.  
This gives the lowest value of inductance that can be used,  
but in some cases (lower output load currents) it may give  
a value that creates unnecessarily high output ripple  
voltage.  
The difficulty in calculating the minimum inductor size  
needed is that you must first decide whether the switcher  
will be in continuous or discontinuous mode at the critical  
point where switch current reaches 1.5A. The first step is  
to use the following formula to calculate the load current  
above which the switcher must use continuous mode. If  
your load current is less than this, use the discontinuous  
mode formula to calculate minimum inductor needed. If  
load current is higher, use the continuous mode formula.  
Thefollowingequationcanbeusedtocalculatemaximum  
load current for the positive-to-negative converter:  
D2  
MMSD914TI  
C2  
0.1µF  
L1*  
7µH  
BOOST  
V
IN  
SW  
FB  
V
IN  
12V  
R1  
36.5k  
LT1956  
C3  
2.2µF  
25V  
GND  
V
C
Output current where continuous mode is needed:  
+
C1  
100µF  
20V TANT  
D1  
C
C
10MQO60N  
C
F
(V )2(IP)2  
R2  
IN  
4.12k  
R
C
ICONT >  
OUTPUT**  
–12V, 0.25A  
1956 F15  
4(V + VOUT)(V + VOUT + V )  
IN  
IN  
F
* INCREASE L1 TO 10µH OR 18µH FOR HIGHER CURRENT APPLICATIONS.  
Minimum inductor discontinuous mode:  
SEE APPLICATIONS INFORMATION  
** MAXIMUM LOAD CURRENT DEPENDS ON MINIMUM INPUT VOLTAGE  
AND INDUCTOR SIZE. SEE APPLICATIONS INFORMATION  
2(VOUT)(IOUT  
(f)(IP)2  
)
LMIN  
=
Figure 15. Positive-to-Negative Converter  
1956f  
25  
LT1956/LT1956-5  
U
PACKAGE DESCRIPTIO  
Minimum inductor continuous mode:  
The output capacitor ripple current for the positive-to-  
negative converter is similar to that for a typical buck  
regulator—it is a triangular waveform with peak-to-peak  
valueequaltothepeak-to-peaktriangularwaveformofthe  
inductor. The low output ripple design in Figure 14 places  
theinputcapacitorbetweenVIN andtheregulatednegative  
output. This placement of the input capacitor significantly  
reduces the size required for the output capacitor (versus  
placing the input capacitor between VIN and ground).  
(V )(VOUT  
)
IN  
LMIN  
=
(VOUT + VF)  
2(f)(V + VOUT ) IP – IOUT 1+  
IN  
V
IN  
For a 12V to –12V converter using the LT1956 with peak  
switch current of 1.5A and a catch diode of 0.63V:  
(12)2(1.5)2  
4(12 +12)(12 +12 + 0.63)  
ICONT  
>
= 0.370A  
The peak-to-peak ripple current in both the inductor and  
output capacitor (assuming continuous mode) is:  
For a load current of 0.25A, this says that discontinuous  
mode can be used and the minimum inductor needed is  
found from:  
DC • V  
IN  
IP-P  
=
f L  
V
OUT + V  
F
DC = Duty Cycle =  
2(12)(0.25)  
(500 103)(1.5)2  
LMIN  
=
= 5.3µH  
V
OUT + V + V  
IN F  
IP-P  
ICOUT (RMS) =  
In practice, the inductor should be increased by about  
30% over the calculated minimum to handle losses and  
variations in value. This suggests a minimum inductor of  
7µH for this application.  
12  
Theoutputripplevoltageforthisconfigurationisaslowas  
the typical buck regulator based predominantly on the  
inductor’s triangular peak-to-peak ripple current and the  
ESR of the chosen capacitor (see Output Ripple Voltage in  
Applications Information).  
Ripple Current in the Input and Output Capacitors  
Positive-to-negative converters have high ripple current  
in the input capacitor. For long capacitor lifetime, the  
RMS value of this current must be less than the high  
frequency ripple current rating of the capacitor. The  
followingformulawillgiveanapproximatevalueforRMS  
ripple current. This formula assumes continuous mode  
and large inductor value. Small inductors will give some-  
what higher ripple current, especially in discontinuous  
mode. The exact formulas are very complex and appear  
in Application Note 44, pages 29 and 30. For our pur-  
poses here I have simply added a fudge factor (ff). The  
value for ff is about 1.2 for higher load currents and L  
15µH. It increases to about 2.0 for smaller inductors at  
lower load currents.  
Diode Current  
Average diodecurrentisequaltoloadcurrent. Peak diode  
current will be considerably higher.  
Peak diode current:  
ContinuousMode =  
(V + VOUT  
)
(V )(VOUT)  
IN  
IN  
IOUT  
+
V
IN  
2(L)(f)(V + VOUT)  
IN  
2(IOUT)(VOUT  
(L)(f)  
)
DiscontinuousMode =  
Keep in mind that during start-up and output overloads,  
average diode current may be much higher than with  
normalloads.Careshouldbeusedifdiodesratedlessthan  
1A are used, especially if continuous overload conditions  
must be tolerated.  
VOUT  
V
IN  
Capacitor IRMS = (ff)(IOUT  
)
ff = 1.2 to 2.0  
1956f  
26  
LT1956/LT1956-5  
U
PACKAGE DESCRIPTIO  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663)  
Exposed Pad Variation BB  
4.90 – 5.10*  
(.193 – .201)  
3.58  
(.141)  
3.58  
(.141)  
16 1514 13 12 1110  
9
6.60 ±0.10  
4.50 ±0.10  
2.94  
(.116)  
SEE NOTE 4  
2.94  
(.116)  
6.40  
BSC  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT  
1.10  
(.0433)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0° – 8°  
0.65  
(.0256)  
BSC  
0.45 – 0.75  
0.09 – 0.20  
0.05 – 0.15  
(.018 – .030)  
(.0036 – .0079)  
(.002 – .006)  
0.195 – 0.30  
(.0077 – .0118)  
FE16 (BB) TSSOP 0203  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
1956f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
27  
LT1956/LT1956-5  
U
PACKAGE DESCRIPTIO  
GN Package  
16-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
.189 – .196*  
(4.801 – 4.978)  
.045 ±.005  
.009  
(0.229)  
REF  
16 15 14 13 12 11 10 9  
.254 MIN  
.150 – .165  
.229 – .244  
.150 – .157**  
(5.817 – 6.198)  
(3.810 – 3.988)  
.0165 ±.0015  
.0250 TYP  
RECOMMENDED SOLDER PAD LAYOUT  
1
2
3
4
5
6
7
8
.015 ± .004  
(0.38 ± 0.10)  
× 45°  
.053 – .068  
(1.351 – 1.727)  
.004 – .0098  
(0.102 – 0.249)  
.007 – .0098  
(0.178 – 0.249)  
0° – 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.0250  
(0.635)  
BSC  
.008 – .012  
(0.203 – 0.305)  
NOTE:  
1. CONTROLLING DIMENSION: INCHES  
INCHES  
2. DIMENSIONS ARE IN  
(MILLIMETERS)  
GN16 (SSOP) 0502  
3. DRAWING NOT TO SCALE  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
RELATED PARTS  
PART NUMBER DESCRIPTION  
COMMENTS  
LT1074/LT1076/ Step-Down Switching Regulators  
LT1076HV  
Up to 64V Input, 100kHz, 5A and 2A  
LT1082  
LT1370  
LT1371  
1A High Voltage/Efficiency Switching Voltage Regulator  
Up to 75V Input, 60kHz Operation  
Up to 42V, 6A, 500kHz Switch  
Up to 35V, 3A, 500kHz Switch  
High Efficiency DC/DC Converter  
High Efficiency DC/DC Converter  
LT1375/LT1376 1.5A, 500kHz Step-Down Switching Regulators  
Operation Up to 25V Input, Synchronizable (LT1375),  
N8, S8, S16  
LT1616  
LT1676  
LT1765  
600mA, 1.4MHz Step-Down Switching Regulator  
3.6V to 25V V , 6-Lead ThinSOTTM  
IN  
Wide Input Range, High Efficiency, Step-Down Switching Regulator 7.4V to 60V V , 100kHz Operation, 700mA Internal Switch, S8  
IN  
Monolithic 3A, 1.25MHz Step-Down Regulator  
V : 3V to 25V; V = 1.2V; S8, TSSOP-16E  
IN  
REF  
Exposed Pad  
LT1766  
Wide Input Range, High Efficiency, Step-Down Switching Regulator 5.5V to 60V Input, 200kHz Operation, 1.5A Internal Switch,  
TSSOP-16E  
LT1767  
LT1776  
Monolithic 1.5A, 1.25MHz Step-Down Regulator  
V : 3V to 25V; V = 1.2V; MS8  
IN REF  
Wide Input Range, High Efficiency, Step-Down Switching Regulator Up to 7.4V to 60V, 200kHz Operation, 700mA Internal Switch,  
TSSOP-16E  
LT1777  
Low Noise Buck Regulator  
Operation Up to 48V, Controlled Voltage  
and Current Slew Rates, S16  
ThinSOT is a trademark of Linear Technology Corporation.  
1956f  
LT/TP 0303 2K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2001  

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SI9136_11

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VISHAY

SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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