LT1175CN8-5-TR [Linear]

500mA Negative Low Dropout Micropower Regulator; 500毫安负低压差稳压器微
LT1175CN8-5-TR
型号: LT1175CN8-5-TR
厂家: Linear    Linear
描述:

500mA Negative Low Dropout Micropower Regulator
500毫安负低压差稳压器微

稳压器
文件: 总18页 (文件大小:306K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1175  
500mA Negative  
Low Dropout Micropower  
Regulator  
FeaTures  
DescripTion  
The LT®1175 is a negative micropower low dropout  
regulator. It features 45µA quiescent current, dropping  
to 10µA in shutdown. A new reference amplifier topology  
gives precision DC characteristics along with the ability to  
maintain good loop stability with an extremely wide range  
of output capacitors. Very low dropout voltage and high  
efficiency are obtained with a unique power transistor  
anti-saturation design. Adjustable and fixed 5V versions  
are available.  
n
Operating Current: 45µA  
n
Adjustable Current Limit  
n
Low Voltage Linear Dropout Characteristics  
n
Stable with Wide Range of Output Capacitors  
n
Shutdown Current: 10µA  
n
Positive or Negative Shutdown Logic  
n
Fixed 5V and Adjustable Versions  
n
Tolerates Reverse Output Voltage  
n
Available in 8-pin PDIP and SO Packages, 3-lead  
SOT-223, 5-Pin Surface Mount DD and Through-Hole  
TO-220 Packages  
Several new features make the LT1175 very user-friendly.  
The SHDN pin can interface directly to either positive or  
negative logic levels. Current limit is user-selectable at  
200mA, 400mA, 600mA and 800mA. The output can be  
forced to reverse voltage without damage or latchup. Un-  
likesomeearlierdesigns,theincreaseinquiescentcurrent  
during a dropout condition is actively limited.  
applicaTions  
n
Analog Systems  
n
Modems  
n
Instrumentation  
n
A/D and D/A Converters  
The LT1175 has complete blowout protection with current  
limiting, power limiting and thermal shutdown. Special  
attention was given to the problem of high temperature  
operation with micropower operating currents, preventing  
output voltage rise under no-load conditions. The LT1175  
is available in 8-pin PDIP and SO packages, 3-lead SOT-  
223 as well as 5-pin surface mount DD and through-hole  
TO-220 packages. The 8-pin SO package is specially  
constructed for low thermal resistance.  
n
Interface Drivers  
n
Battery-Powered Systems  
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear  
Technology Corporation. All other trademarks are the property of their respective owners.  
Typical applicaTion  
Minimum Input-to-Output Voltage  
1.0  
T
= 25°C  
Typical LT1175 Connection  
J
I
, I  
TIED TO V  
LIM2 LIM4 IN  
0.8  
0.6  
0.4  
0.2  
0
+
+
C
OUT  
C
*
IN  
≥ 0.1µF  
SHDN  
GND  
SENSE  
–5V  
UP TO 500mA  
V
–V  
IN  
IN  
I
LT1175-5  
OUTPUT  
LIM2  
I
LIM4  
*C IS NEEDED ONLY IF REGULATOR IS MORE THAN 6" FROM  
IN  
INPUT SUPPLY CAPACITOR. SEE APPLICATIONS INFORMATION  
0
0.2 0.3 0.4  
0.5 0.6 0.7  
0.1  
1175 TA01  
SECTION FOR DETAILS  
OUTPUT CURRENT (A)  
1175 TA02  
1175fe  
LT1175  
absoluTe MaxiMuM raTings  
(Note 1)  
Input Voltage (Transient 1 sec, Note 11) ...................25V  
Input Voltage (Continuous) .......................................20V  
Input-to-Output Differential Voltage (Note 12)..........20V  
5V SENSE Pin (with Respect to GND Pin).........2V, –10V  
ADJ SENSE Pin  
(with Respect to OUTPUT Pin)...................20V, –0.5V  
5V SENSE Pin  
(with Respect to OUTPUT Pin)......................20V, –7V  
Output Reverse Voltage ..............................................2V  
SHDN Pin to GND Pin Voltage (Note 2)........13.5V, –20V  
SHDN Pin to V Pin Voltage.............................30V, –5V  
IN  
Operating Junction Temperature Range  
LT1175C................................................. 0°C to 125°C  
LT1175I.............................................. –40°C to 125°C  
Ambient Operating Temperature Range  
LT1175C................................................... 0°C to 70°C  
LT1175I................................................–40°C to 85°C  
Storage Temperature Range .................. –65°C to 150°C  
Lead Temperature (Soldering, 10 sec)...................300°C  
pin conFiguraTion  
FRONT VIEW  
TOP VIEW  
FRONT VIEW  
3
2
1
GND  
V
1
2
3
4
V
I
8
7
6
5
5
4
3
2
1
SHDN  
GND  
IN  
IN  
TAB  
IS  
IN  
TAB IS  
I
LIM2  
LIM4  
V
IN  
V
V
IN  
IN  
V
SENSE  
OUTPUT  
OUTPUT  
SENSE  
SHDN  
OUTPUT  
GND  
Q PACKAGE  
ST PACKAGE  
3-LEAD PLASTIC SOT-223  
= 50°C/W  
WITH BACKPLANE AND 10cm  
TOPSIDE LAND SOLDERED TO TAB  
N8 PACKAGE  
8-LEAD PDIP  
= 80°C/W TO 120°C/W  
5-LEAD PLASTIC DD  
θ
= 27°C/W TO 60°C/W  
DEPENDING ON PC MOUNTING.  
SEE DATA SHEET FOR DETAILS  
JA  
θ
JA  
θ
JA  
2
DEPENDING ON PC BOARD LAYOUT  
TOP VIEW  
V
1
2
3
4
8
7
6
5
V
I
IN  
IN  
FRONT VIEW  
I
LIM2  
LIM4  
5
4
3
2
1
SHDN  
GND  
OUTPUT  
SENSE  
SHDN  
GND  
V
IN  
SENSE  
OUTPUT  
S8 PACKAGE  
8-LEAD PLASTIC SO  
TAB IS  
IN  
θ
= 60°C/W TO 100°C/W  
JA  
V
DEPENDING ON PC BOARD LAYOUT  
T PACKAGE  
5-LEAD PLASTIC TO-220  
PINS 1, 8 ARE INTERNALLY CONNECTED TO DIE ATTACH PADDLE FOR HEAT SINKING.  
ELECTRICAL CONTACT CAN BE MADE TO EITHER PIN. FOR BEST THERMAL RESISTANCE,  
PINS 1, 8 SHOULD BE CONNECTED TO AN EXPANDED LAND THAT IS OVER AN INTERNAL  
OR BACKSIDE PLANE.  
θ
= 50°C/W, θ = 5°C/W  
JC  
JA  
SEE APPLICATIONS INFORMATION  
1175fe  
LT1175  
orDer inForMaTion  
LEAD FREE FINISH  
LT1175CN8#PBF  
LT1175CN8-5#PBF  
LT1175CS8#PBF  
LT1175CS8-5#PBF  
LT1175CST-5#PBF  
LT1175CQ#PBF  
LT1175CQ-5#PBF  
LT1175CT#PBF  
LT1175CT-5#PBF  
LT1175IN8#PBF  
LT1175IN8-5#PBF  
LT1175IS8#PBF  
LT1175IS8-5#PBF  
LT1175IST-5#PBF  
LT1175IQ#PBF  
LT1175IQ-5#PBF  
LT1175IT#PBF  
LT1175IT-5#PBF  
LEAD BASED FINISH  
LT1175CN8  
TAPE AND REEL  
LT1175CN8#TRPBF  
LT1175CN8-5#TRPBF  
LT1175CS8#TRPBF  
LT1175CS8-5#TRPBF  
LT1175CST-5#TRPBF  
LT1175CQ#TRPBF  
LT1175CQ-5#TRPBF  
LT1175CT#TRPBF  
LT1175CT-5#TRPBF  
LT1175IN8#TRPBF  
LT1175IN8-5#TRPBF  
LT1175IS8#TRPBF  
LT1175IS8-5#TRPBF  
LT1175IST-5#TRPBF  
LT1175IQ#TRPBF  
LT1175IQ-5#TRPBF  
LT1175IT#TRPBF  
LT1175IT-5#TRPBF  
TAPE AND REEL  
LT1175CN8#TR  
PART MARKING*  
LT1175CN8  
LT1175CN8-5  
1175  
PACKAGE DESCRIPTION  
8-Lead Plastic Dip  
TEMPERATURE RANGE  
0°C to 125°C  
8-Lead Plastic Dip  
0°C to 125°C  
8-Lead Plastic SO  
0°C to 125°C  
11755  
8-Lead Plastic SO  
0°C to 125°C  
11755  
3-Lead Plastic SOT-223  
5-Lead Plastic DD-Pak  
5-Lead Plastic DD-Pak  
5-Lead Plastic TO-220  
5-Lead Plastic TO-220  
8-Lead Plastic Dip  
0°C to 125°C  
LT1175CQ  
LT1175CQ-5  
LT1175CT  
LT1175CT-5  
LT1175IN8  
LT1175IN8-5  
1175I  
0°C to 125°C  
0°C to 125°C  
0°C to 125°C  
0°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
TEMPERATURE RANGE  
0°C to 125°C  
8-Lead Plastic Dip  
8-Lead Plastic SO  
1175I5  
8-Lead Plastic SO  
1175I5  
3-Lead Plastic SOT-223  
5-Lead Plastic DD-Pak  
5-Lead Plastic DD-Pak  
5-Lead Plastic TO-220  
5-Lead Plastic TO-220  
PACKAGE DESCRIPTION  
8-Lead Plastic Dip  
LT1175IQ  
LT1175IQ-5  
LT1175IT  
LT1175IT-5  
PART MARKING*  
LT1175CN8  
LT1175CN8-5  
1175  
LT1175CN8-5  
LT1175CS8  
LT1175CN8-5#TR  
LT1175CS8#TR  
8-Lead Plastic Dip  
0°C to 125°C  
8-Lead Plastic SO  
0°C to 125°C  
LT1175CS8-5  
LT1175CST-5  
LT1175CQ  
LT1175CS8-5#TR  
LT1175CST-5#TR  
LT1175CQ#TR  
11755  
8-Lead Plastic SO  
0°C to 125°C  
11755  
3-Lead Plastic SOT-223  
5-Lead Plastic DD-Pak  
5-Lead Plastic DD-Pak  
5-Lead Plastic TO-220  
5-Lead Plastic TO-220  
8-Lead Plastic Dip  
0°C to 125°C  
LT1175CQ  
LT1175CQ-5  
LT1175CT  
LT1175CT-5  
LT1175IN8  
LT1175IN8-5  
1175I  
0°C to 125°C  
LT1175CQ-5  
LT1175CQ-5#TR  
LT1175CT#TR  
0°C to 125°C  
LT1175CT  
0°C to 125°C  
LT1175CT-5  
LT1175CT-5#TR  
0°C to 125°C  
LT1175IN8  
LT1175IN8#TR  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
LT1175IN8-5  
LT1175IN8-5#TR  
LT1175IS8#TR  
8-Lead Plastic Dip  
LT1175IS8  
8-Lead Plastic SO  
LT1175IS8-5  
LT1175IS8-5#TR  
LT1175IST-5#TR  
LT1175IQ#TR  
1175I5  
8-Lead Plastic SO  
LT1175IST-5  
1175I5  
3-Lead Plastic SOT-223  
5-Lead Plastic DD-Pak  
5-Lead Plastic DD-Pak  
5-Lead Plastic TO-220  
5-Lead Plastic TO-220  
LT1175IQ  
LT1175IQ  
LT1175IQ-5  
LT1175IT  
LT1175IT-5  
LT1175IQ-5  
LT1175IQ-5#TR  
LT1175IT  
LT1175IT#TR  
LT1175IT-5  
LT1175IT-5#TR  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
1175fe  
LT1175  
elecTrical characTerisTics The l denotes specifications which apply over the operating temperature  
range, otherwise specifications are at TA = 25°C. VOUT = 5V, VIN = 7V, IOUT = 0, VSHDN = 3V, ILIM2 and ILIM4 tied to VIN, TJ = 25°C, unless  
otherwise noted. To avoid confusion with “min” and “max” as applied to negative voltages, all voltages are shown as absolute values  
except where polarity is not obvious.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Feedback Sense Voltage  
Adjustable Part  
Fixed 5V Part  
3.743  
4.93  
3.8  
5.0  
3.857  
5.075  
V
V
Output Voltage Initial Accuracy  
Adjustable, Measured at 3.8V Sense  
Fixed 5V  
0.5  
0.5  
1.5  
1.5  
%
%
l
Output Voltage Accuracy (All Conditions)  
Quiescent Input Supply Current  
V
– V  
= 1V to V = 20V, I = 0A to 500mA  
OUT  
1.5  
2.5  
%
IN  
OUT  
IN  
P = 0 to P  
, T = T  
to T  
(Note 3)  
MAX  
J
MIN  
MAX  
V
IN  
– V  
≤ 12V  
OUT  
45  
65  
80  
µA  
µA  
l
l
GND Pin Current Increase with Load (Note 4)  
Input Supply Current in Shutdown  
10  
10  
20  
µA/mA  
V
SHDN  
= 0V  
20  
25  
µA  
µA  
l
l
l
Shutdown Thresholds (Note 9)  
Either Polarity On SHDN Pin  
0.8  
2.5  
V
SHDN Pin Current (Note 2)  
V
SHDN  
V
SHDN  
= 0V to 10V (Flows Into Pin)  
= –15V to 0V (Flows Into Pin)  
4
1
8
4
µA  
µA  
Output Bleed Current in Shutdown (Note 6)  
SENSE Pin Input Current  
V
= 0V, V = 15V  
0.1  
1
1
5
µA  
µA  
OUT  
IN  
l
l
l
(Adjustable Part Only, Current Flows Out of Pin)  
(Fixed Voltage Only, Current Flows Out of Pin)  
75  
12  
150  
20  
nA  
µA  
l
l
l
l
l
l
Dropout Voltage (Note 7)  
I
I
I
I
I
I
= 25mA  
0.1  
0.18  
0.5  
0.2  
0.26  
0.7  
V
V
V
V
V
V
OUT  
OUT  
OUT  
LIM2  
LIM4  
= 100mA  
= 500mA  
Open, I  
Open, I  
= 300mA  
= 200mA  
OUT  
0.33  
0.3  
0.5  
OUT  
OUT  
0.45  
0.45  
, I  
Open, I  
= 100mA  
0.26  
LIM2 LIM4  
l
l
l
l
Current Limit (Note 11)  
V
– V  
= 1V to 12V  
520  
390  
260  
130  
800  
600  
400  
200  
1300  
975  
650  
325  
mA  
mA  
mA  
mA  
IN  
OUT  
Open  
Open  
I
I
I
LIM2  
LIM4  
LIM2 LIM4  
, I  
Open  
l
l
Line Regulation (Note 10)  
Load Regulation (Note 5, 10)  
Thermal Regulation  
V
– V  
= 1V to V = 20V  
0.003  
0.1  
0.015  
0.35  
%/V  
%
IN  
OUT  
IN  
I
= 0mA to 500mA  
OUT  
P = 0 to P  
(Notes 3, 8)  
5-Pin Packages  
8-Pin Packages  
0.04  
0.1  
0.1  
0.2  
%/W  
%/W  
MAX  
Output Voltage Temperature Drift  
T = 25°C to T  
, or 25°C to T  
JMIN JMAX  
0.25  
1.25  
%
J
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
is in saturation, GND pin current will be slightly higher. See Typical  
Performance Characteristics.  
Note 5: With I  
= 0, at T > 125°C, power transistor leakage could  
LOAD  
J
increase higher than the 10µA to 25µA drawn by the output divider or fixed  
voltage SENSE pin, causing the output to rise above the regulated value.  
To prevent this condition, an internal active pull-up will automatically turn  
on, but supply current will increase.  
Note 2: SHDN pin maximum positive voltage is 30V with respect to  
–V and 13.5V with respect to GND. Maximum negative voltage is –20V  
IN  
with respect to GND and –5V with respect to –V .  
IN  
Note 3: P  
= 1.5W for 8-pin packages, and 6W for 5-pin packages.  
Note 6: This is the current required to pull the output voltage to within 1V  
of ground during shutdown.  
Note 7: Dropout voltage is measured by setting the input voltage equal to  
the normal regulated output voltage and measuring the difference between  
MAX  
This power level holds only for input-to-output voltages up to 12V, beyond  
which internal power limiting may reduce power. See Guaranteed Current  
Limit curve in Typical Performance Characteristics section. Note that all  
conditions must be met.  
V
and V . For currents between 100mA and 500mA, with both I  
IN  
OUT LIM  
Note 4: GND pin current increases because of power transistor base  
drive. At low input-to-output voltages (<1V) where the power transistor  
pins tied to V , maximum dropout can be calculated from  
IN  
V = 0.15 + 1.1Ω (I ).  
DO OUT  
1175fe  
LT1175  
elecTrical characTerisTics  
Note 8: Thermal regulation is a change in the output voltage caused by  
die temperature gradients, so it is proportional to chip power dissipation.  
Temperature gradients reach final value in less than 100ms. Output voltage  
changes after 100ms are due to absolute die temperature changes and  
reference voltage temperature coefficient.  
regulation will be affected by thermal regulation (Note 8) and chip  
temperature changes. Load regulation specification also holds for currents  
up to the specified current limit when I or I are left open.  
Note 11: Current limit is reduced for input-to-output voltage above 12V.  
See the graph in Typical Performance Characteristics for guaranteed limits  
above 12V.  
Note 12: Operating at very large input-to-output differential voltages  
(>15V) with load currents less than 5mA requires an output capacitor with  
an ESR greater than 1Ω to prevent low level output oscillations.  
LIM2  
LIM4  
Note 9: The lower limit of 0.8V is guaranteed to keep the regulator in  
shutdown. The upper limit of 2.5V is guaranteed to keep the regulator  
active. Either polarity may be used, referenced to GND pin.  
Note 10: Load and line regulation are measured on a pulse basis with  
pulse width of 20ms or less to keep chip temperature constant. DC  
Typical perForMance characTerisTics  
Typical Current Limit  
Characteristics  
Guaranteed Current Limit  
Output Voltage Temperature Drift  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
5.05  
5.00  
4.95  
3.84  
3.80  
3.76  
CURRENT LIMIT CHANGES ONLY SLIGHTLY  
WITH TEMPERATURE SO CURVES ARE  
REPRESENTATIVE OF ALL TEMPERATURES  
CURVES REPRE-  
SENT MINIMUM  
GUARANTEED  
I
, I  
TIED TO V  
OUTPUT  
LIM2 LIM4 IN  
FIXED 5V PART  
LIMITS AT ALL  
TEMPERATURES  
I
, I  
TIED TO V  
LIM2 LIM4 IN  
I
TIED TO V  
LIM4  
IN  
I
TIED TO V  
LIM4  
IN  
I
TIED TO V  
LIM2  
IN  
I
TIED TO V  
LIM2  
IN  
FEEDBACK VOLTAGE  
ADJUSTABLE PART  
I
, I  
OPEN  
LIM2 LIM4  
I
, I  
OPEN  
LIM2 LIM4  
0
5
10  
15  
20  
25  
0
5
10  
15  
20  
25  
50  
JUNCTION TEMPERATURE (°C)  
125  
–50  
0
25  
75 100  
–25  
INPUT-TO-OUTPUT DIFFERENTIAL VOLTAGE (V)  
INPUT-TO-OUTPUT DIFFERENTIAL VOLTAGE (V)  
1175 G03  
1175 G01  
1175 G02  
SENSE Bias Current  
(Adjustable Part)  
Minimum Input-to-Output Voltage  
Minimum Input-to-Output Voltage  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
100  
80  
60  
40  
20  
0
T = 25°C  
V
REDUCED UNTIL OUTPUT  
IN  
J
IN  
V
REDUCED  
VOLTAGE DROPS 1%.  
I , I TIED TO V  
LIM2 LIM4  
UNTIL OUTPUT  
VOLTAGE  
IN  
I
TIED  
IN  
LIM2  
DROPS 1%  
TO V  
I
, I  
LIM2 LIM4  
T = 125°C  
J
OPEN  
I
TIED  
IN  
LIM4  
TO V  
T = 25°C  
J
T = –55°C  
J
I
, I  
LIM2 LIM4  
TIED TO V  
IN  
0
0.2 0.3 0.4  
0.5 0.6 0.7  
0
0.2 0.3 0.4  
0.5 0.6 0.7  
–50  
0
25  
50  
75 100 125  
0.1  
0.1  
–25  
OUTPUT CURRENT (A)  
OUTPUT CURRENT (A)  
TEMPERATURE (°C)  
1175 G04  
1175 G05  
1175 G06  
1175fe  
LT1175  
Typical perForMance characTerisTics  
Shutdown Input Current  
Shutdown Thresholds  
SHDN Pin Characteristics  
25  
20  
15  
10  
5
2.5  
2.0  
1.5  
1.0  
0.5  
0
15  
10  
5
V
IN  
= 25V  
CHARACTERISTICS DO NOT  
CHANGE SIGNIFICANTLY WITH  
TEMPERATURE, SO A SINGLE  
CURVE IS SHOWN. POSITIVE  
CURRENT FLOWS INTO  
SHDN PIN  
POSITIVE THRESHOLD  
NEGATIVE THRESHOLD  
T = 25°C  
J
T = 125°C  
J
0
T = –55°C  
J
IF SHDN PIN IS NEGATIVE WITH  
RESPECT TO INPUT VOLTAGE AND  
INPUT VOLTAGE IS LESS THAN 15V,  
NEGATIVE BREAKOVER POINT WILL  
–5  
DEVICE IS OFF  
BELOW THRESHOLD  
BE ABOUT 8V BELOW –V  
IN  
0
–10  
0
5
10  
15  
20  
25  
–25 –20 –15 –10 –5  
0
5
10 15 20 25  
–50  
0
25  
50  
75 100 125  
–25  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
SHUTDOWN TO GROUND VOLTAGE (V)  
1175 G07  
1175 G08  
1175 G09  
GND Pin Current  
Ripple Rejection  
20  
16  
12  
8
100  
V
= 12V  
OUT  
(ADJUSTABLE)  
WITH 0.1µF ACROSS  
DIVIDER RESISTOR  
80  
60  
40  
20  
0
V
= 5V  
OUT  
V
– V  
J
= 2V  
OUT  
(FIXED)  
IN  
POWER  
TRANSISTOR  
IN DROPOUT  
T = 25°C  
V
= 12V  
OUT  
(ADJUSTABLE)  
T = –55°C  
J
T = 25°C  
J
4
I
V
C
= 100mA  
OUT  
IN  
– V  
= 2V  
OUT  
V
J
– V  
≥ 3V  
IN  
OUT  
= 1µF TANT  
OUT  
T = 25°C  
0
10  
100  
1k  
10k  
100k  
1M  
0
0.2 0.3 0.4  
0.5 0.6 0.7  
0.1  
FREQUENCY (Hz)  
OUTPUT CURRENT (A)  
1175 G10  
RIPPLE REJECTION IS RELATIVELY INDEPENDENT OF  
INPUT VOLTAGE AND LOAD FOR CURRENTS BETWEEN  
25mA AND 500mA. LARGER OUTPUT CAPACITORS DO  
NOT IMPROVE REJECTION FOR FREQUENCIES BELOW  
50kHz. AT VERY LIGHT LOADS, REJECTION WILL  
1175 G11  
IMPROVE WITH LARGER OUTPUT CAPACITORS  
1175fe  
LT1175  
pin FuncTions (N8/Q/ST/S8/T)  
V (Pins 1, 8/Pin 3, Tab/Pin 2, Tab/Pins 1, 8/Pin 3, Tab):  
The fixed 5V version utilizes the SENSE pin to give true  
Kelvin connections to the load or to drive an external pass  
transistor for higher output currents. Bias current out  
of the 5V SENSE pin is approximately 12µA. Separating  
the SENSE and OUTPUT pins also allows for a new loop  
compensation technique described in the Applications  
Information section.  
IN  
Power is supplied to the device through this pin. A bypass  
capacitor is required on this pin if the device is more than  
six inches away from the main filter capacitor. In general,  
the impedance of a battery rises with frequency, so it is  
advisabletoincludeabypasscapacitorinbattery-powered  
circuits. A 1µF or larger tantalum capacitor is suggested  
for all applications, but if low ESR capacitors such as  
ceramic or film are used for the output and input capaci-  
tors, the input capacitor should be three times the value  
of the output capacitor.  
GND (Pin 5/Pin 4/Pin 3/Pin 5/Pin 4): The GND pin has a  
quiescent current of 45µA at zero load current, increas-  
ing by approximately 10µA per mA of output current. At  
500mA output current, GND pin current is about 5mA.  
Current flows into the GND pin.  
I
, I  
(Pins 2, 7/NA/NA/Pins 2, 7/NA): The two  
LIM2 LIM4  
currentlimitpinsareemittersectionsofthepowertransis-  
tor. When left open, they float several hundred millivolts  
above the negative input voltage. When shorted to the  
input voltage, they increase current limit by a minimum  
SHDN (Pin 6/Pin 5/NA/Pin 6/Pin 5): The SHDN pin is  
specially configured to allow it to be driven from either  
positive voltage logic or with negative only logic. Forc-  
ing the SHDN pin 2V either above or below the GND  
pin will turn the regulator on. This makes it simple to  
connect directly to positive logic signals for active low  
shutdown. If no positive voltages are available, the  
SHDN pin can be driven below the GND pin to turn the  
regulator on. When left open, the SHDN pin will default  
low to a regulator “on” condition. For all voltages below  
absolute maximum ratings, the SHDN pin draws only a  
few microamperes of current (see Typical Performance  
Characteristics).MaximumvoltageontheSHDNpinis15V,  
20V with respect to the GND pin and 35V, 5V with  
respect to the negative input pin.  
of 200mA for I  
and 400mA for I  
. These pins must  
LIM2  
LIM4  
be connected only to the input voltage, either directly or  
through a resistor.  
OUTPUT (Pin 3/Pin 1/Pin 1/Pin 3/Pin 1): The OUTPUT pin  
isthecollectoroftheNPNpowertransistor.Itcanbeforced  
to the input voltage, to ground or up to 2V positive with  
respect to ground without damage or latchup (see Output  
VoltageReversalinApplicationsInformationsection).The  
LT1175 has foldback current limit, so maximum current at  
the OUTPUT pin is a function of input-to-output voltage.  
See Typical Performance Characteristics.  
SENSE (Pin 4/Pin 2/NA/Pin 4/Pin 2): The SENSE pin is  
used in the adjustable version to allow custom selection  
of output voltage, with an external divider set to generate  
3.8V at the SENSE pin. Input bias current is typically 75nA  
flowing out of the pin. Maximum forced voltage on the  
SENSE pin is 2V and –10V with respect to GND pin.  
1175fe  
LT1175  
applicaTions inForMaTion  
The LT1175-5 is a fixed 5V design with the SENSE pin  
acting as a Kelvin connection to the output. Normally the  
SENSE pin and the OUTPUT pin are connected directly  
together, either close to the regulator or at the remote  
load point.  
Note to Reader: To avoid confusion when working with  
negative voltages (is –6V more or less than –5V?), I have  
decidedtotreattheLT1175asifitwereapositiveregulator  
andexpressallvoltagesaspositivevalues,bothintextand  
informulas. Ifyoudothesameandsimplyaddanegative  
signtotheeventualanswer,confusionshouldbeavoided.  
Please don’t give me a hard time about “preciseness” or  
“correctness.” I have to field phone calls from around  
the world and this is my way of dealing with a multitude  
of conventions. Thanks for your patience.  
SHUTDOWN  
LOGIC  
> 2V OR < –2V TO  
TURN REGULATOR ON  
+
+
R1  
C
IN  
383k  
1%  
SHDN  
GND  
SENSE  
C
OUT  
V
IN  
≥ 0.1µF  
R2  
825k  
1%  
LT1175  
Setting Output Voltage  
I
LIM2  
V
OUT  
I
OUTPUT  
The LT1175 adjustable version has a feedback sense  
voltage of 3.8V with a bias current of approximately 75nA  
flowing out of the SENSE pin. To avoid output voltage  
errors caused by this current, the output divider string  
(see Figure 1) should draw about 25µA. Table 1 shows  
suggested resistor values for a range of output voltages.  
The second part of the table shows resistor values which  
draw only 10µA of current. Output voltage error caused  
by bias current with the lower valued resistors is about  
0.4% maximum and with the higher values, about 1%  
maximum. A formula is also shown for calculating the  
resistors for any output voltage.  
LIM4  
–12V  
1175 F01  
Figure 1. Typical LT1175 Adjustable Connection  
Setting Current Limit  
The LT1175 uses two I pins to set current limit (typical)  
LIM  
at 200mA, 400mA, 600mA or 800mA. The corresponding  
minimumguaranteedcurrentsare130mA,260mA,390mA  
and 520mA. This allows the user to select a current limit  
tailored to his specific application and prevents the situa-  
tion where short-circuit current is many times higher than  
full-load current. Problems with input supply overload or  
excessivepowerdissipationinafaultedloadareprevented.  
Power limiting in the form of foldback current limit is built  
inandreducescurrentlimitasafunctionofinput-to-output  
voltage differential for differentials exceeding 14V. See the  
graph in Typical Performance Characteristics. The LT1175  
is guaranteed to be blowout-proof regardless of current  
limit setting. The power limiting combined with thermal  
shutdown protects the device from destructive junction  
temperatures under all load conditions.  
Table 1. Suggested Divider Resistors  
OUTPUT  
VOLTAGE  
R1  
R2  
R1  
R2  
I
= 25µA NEAREST 1%  
I
DIV  
= 10µA NEAREST 1%  
DIV  
5V  
6V  
150k  
47.5k  
86.6k  
165k  
243k  
324k  
442k  
383k  
121k  
221k  
422k  
619k  
825k  
1.13M  
150k  
150k  
150k  
150k  
150k  
383k  
383k  
383k  
383k  
383k  
8V  
10V  
12V  
15V  
Shutdown  
3.8V  
IDIV  
R1=  
In shutdown, the LT1175 draws only about 10µA. Special  
circuitry is used to minimize increases in shutdown cur-  
rent at high temperatures, but a slight increase is seen  
above 125°C. One option not taken was to actively pull  
down on the output during shutdown. This means that the  
output will fall slowly after shutdown is initiated, at a rate  
determined by load current plus the 12µA internal load,  
and the size of the output capacitor. Active pull-down is  
1175fe  
R1 V 3.8V  
(
)
OUT  
R2 =  
R2 =  
Simple formula  
(
)
3.8V  
R1 V 3.8V  
(
)
OUT  
Taking SENSE pin bias  
current into account  
3.8V +R1 I  
( FB)  
IDIV = Desired divider current  
LT1175  
applicaTions inForMaTion  
normally a good thing when the regulator is used by itself,  
but it prevents the user from shutting down the regulator  
when a second power source is connected to the LT1175  
output. If active output pull-down is needed in shutdown,  
it can be added externally with a depletion mode PFET as  
shown in Figure 2. Note that the maximum pinch-off volt-  
age of the PFET must be less than the positive logic high  
level to ensure that the device is completely off when the  
regulator is active. The Motorola J177 device has 300Ω  
on resistance for zero gate source voltage.  
yet allows the power transistor to approach its theoretical  
saturation limit.  
Output Capacitor  
Severalnewregulatordesigntechniquesareusedtomake  
theLT1175extremelytolerantofoutputcapacitorselection.  
Like most low dropout designs which use a collector or  
drain of the power transistor to drive the output node, the  
LT1175 uses the output capacitor as part of the overall  
loop compensation. Older regulators generally required  
the output capacitor to have a minimum value of 1µF to  
100µF, a maximum ESR (Effective Series Resistance) of  
0.1Ω to 1Ω and a minimum ESR in the range of 0.03Ω to  
0.3Ω. These restrictions usually could be met only with  
good quality solid tantalum capacitors. Aluminum capaci-  
tors have problems with high ESR unless much higher  
values of capacitance are used (physically large). The ESR  
of ceramic or film capacitors was too low, which made  
the capacitance/ESR zero frequency too high to maintain  
phase margin in the regulator. Even with optimum capaci-  
tors, loop phase margin was very low in previous designs  
whenoutputcurrentwaslow. Theseproblemsledtoanew  
designtechniquefortheLT1175erroramplifierandinternal  
frequency compensation as shown in Figure 3.  
3V TO 5V  
s
Q1*  
d
+
SHDN  
GND  
SENSE  
C
OUT  
≥ 0.1µF  
V
–V  
IN  
IN  
LT1175-5  
I
LIM2  
I
OUTPUT  
LIM4  
* MOTOROLA J177  
PINCH-OFF VOLTAGE MUST BE LESS THAN  
POSITIVE LOGIC HIGH VOLTAGE  
1175 F02  
Figure 2. Active Output Pull-Down During Shutdown  
A conventional regulator loop consists of error amplifier  
A1, driver transistor Q2 and power transistor Q1. Added  
to this basic loop are secondary loops generated by Q3  
Minimum Dropout Voltage  
Dropoutvoltageistheminimumvoltagerequiredbetween  
input and output to maintain proper output regulation.  
For older 3-terminal regulator designs, dropout voltage  
was typically 1.5V to 3V. The LT1175 uses a saturating  
power transistor design which gives much lower dropout  
voltage, typically 100mV at light loads and 450mV at full  
load. Special precautions were taken to ensure that this  
technique does not cause quiescent supply current to be  
high under light load conditions. When the regulator input  
voltage is too low to maintain a regulated output, the pass  
transistor is driven hard by the error amplifier as it tries  
to maintain regulation. The current drawn by the driver  
transistor could be tens of milliamperes even with little or  
no load on the output. This indeed was the case for older  
IC designs that did not actively limit driver current when  
the power transistor saturated. The LT1175 uses a new  
antisaturation technique that prevents high driver current,  
and C . A DC negative feedback current fed into the error  
F
amplifier through Q3 and R causes overall loop current  
N
gain to be very low at light load currents. This is not a  
problem because very little gain is needed at light loads.  
In addition to low gain, the parasitic pole frequency at Q2  
base is extended by the DC feedback. The combination of  
thesetwoeffectsdramaticallyimprovesloopphasemargin  
at light loads and makes the loop tolerant of large ESR in  
theoutputcapacitor.Withheavyloads,loopphaseandgain  
are not nearly as troublesome and large negative feedback  
could degrade regulation. The logarithmic behavior of the  
base emitter voltage of Q1 reduces Q3 negative feedback  
at heavy loads to prevent poor regulation.  
Inaconventionaldesign,evenwiththenonlinearfeedback,  
poor loop phase margin would occur at medium to heavy  
loads if the ESR of the output capacitor fell below 0.3Ω.  
1175fe  
LT1175  
applicaTions inForMaTion  
GND  
LT1175  
+
3.8V  
R1  
R2  
+
C
OUT  
A1  
LOAD  
ESR  
SENSE  
Q2  
AC  
FEEDFORWARD  
PATH  
OUTPUT  
C
F
20pF  
OUTPUT  
R
C
0.5Ω  
NEGATIVE DC  
FEEDBACK  
AT LIGHT  
LOADS  
PARASITIC  
COLLECTOR  
RESISTANCE  
Q3  
Q1  
POWER  
TRANSISTOR  
R
N
R
LIM  
CURRENT LIMIT  
SENSE RESISTOR  
1175 F03  
V
IN  
Figure 3  
This condition can occur with ceramic or film capacitors  
which often have an ESR under 0.1Ω. With previous de-  
signs, the user was forced to add a real resistor in series  
with the capacitor to guarantee loop stability. The LT1175  
uses a unique AC feedforward technique to eliminate  
The end result of all this attention to loop stability is that  
the output capacitor used with the LT1175 can range in  
value from 0.1µF to hundreds of microfarads, with an ESR  
from 0Ω to 10Ω. This range allows the use of ceramic,  
solid tantalum, aluminum and film capacitors over a wide  
range of values.  
this problem. C is a conventional feedforward capacitor  
F
often used in regulators to cancel the pole formed by the  
output capacitor. It would normally be connected from the  
regulated output node to the feedback node at the R1/R2  
junction or to an internal node on the amplifier as shown.  
In this case, however, the capacitor is connected to the  
The optimum output capacitor type for the LT1175 is  
still solid tantalum, but there is considerable leeway in  
selecting the exact unit. If large load current transients  
are expected, larger capacitors with lower ESR may be  
needed to control worst-case output variation during  
transients. If transients are not an issue, the capacitor  
can be chosen for small physical size, low price, etc.  
Concerns about surge currents in tantalum capacitors are  
not an issue for the output capacitor because the LT1175  
limits inrush current to well below the level which can  
cause capacitor damage. Surges caused by shorting the  
regulator output are also not a problem because tantalum  
internalstructureofthepowertransistor.R istheunavoid-  
C
able parasitic collector resistance of the power transistor.  
Access to the node at the bottom of R is available only  
C
in monolithic structures where Kelvin connections can  
be made to the NPN buried collector layer. The loop now  
responds as if R were in series with the output capacitor  
C
and good loop stability is achieved even with extremely  
low ESR in the output capacitor.  
1175fe  
ꢀ0  
LT1175  
applicaTions inForMaTion  
capacitors do not fail during a “shorting out” surge, only  
voltage when the regulator output is being pulled high. If  
a 4.8V output is pulled to 5V, for instance, the load on the  
primary regulator would be (5V – 4.8V)/2kΩ = 100µA.  
This also means that if the internal pass transistor leaks  
50µA, the output voltage will be (50µA)(2kΩ) = 100mV  
high. Thisconditionwillnotoccurundernormaloperating  
conditions, but could occur immediately after an output  
short circuit had overheated the chip.  
during a “charge up” surge.  
The output capacitor should be located within several  
inchesoftheregulator.Ifremotesensingisused,theoutput  
capacitor can be located at the remote sense node, but the  
GND pin of the regulator should also be connected to the  
remote site. The basic rule is to keep SENSE and GND pins  
close to the output capacitor, regardless of where it is.  
Operating at very large input-to-output differential volt-  
ages (>15V) with load currents less than 5mA requires an  
output capacitor with an ESR greater than 1Ω to prevent  
low level output oscillations.  
Thermal Considerations  
The LT1175 is available in a special 8-pin surface mount  
packagewhichhasPins1and8connectedtothedieattach  
paddle.ThisreducesthermalresistancewhenPins1and8  
are connected to expanded copper lands on the PC board.  
Table2showsthermalresistanceforvariouscombinations  
of copper lands and backside or internal planes. Table 2  
also shows thermal resistance for the 5-pin DD surface  
mount package and the 8-pin DIP and package.  
Input Capacitor  
The LT1175 requires a separate input bypass capacitor  
only if the regulator is located more than six inches from  
the raw supply output capacitor. A 1µF or larger tantalum  
capacitor is suggested for all applications, but if low ESR  
capacitors such as ceramic or film are used for the out-  
put and input capacitors, the input capacitor should be  
at least three times the value of the output capacitor. If a  
solid tantalum or aluminum electrolytic output capacitor  
is used, the input capacitor is very noncritical.  
Table 2. Package Thermal Resistance (°C/W)  
LAND AREA  
DIP  
140  
110  
ST  
90  
70  
SO  
100  
80  
Q
Minimum  
60  
50  
Minimum with  
Backplane  
2
1cm Top Plane with  
100  
80  
64  
50  
75  
60  
35  
27  
Backplane  
High Temperature Operation  
2
10cm Top Plane  
with Backplane  
The LT1175 is a micropower design with only 45µA qui-  
escent current. This could make it perform poorly at high  
temperatures (>125°C), where power transistor leakage  
might exceed the output node loading current (5µA to  
15µA). To avoid a condition where the output voltage  
driftsuncontrolledhighduringahightemperatureno-load  
condition, the LT1175 has an active load which turns on  
when the output is pulled above the nominal regulated  
voltage. This load absorbs power transistor leakage and  
maintains good regulation. There is one downside to this  
feature,however.Iftheoutputispulledhighdeliberately,as  
itmightbewhentheLT1175isusedasabackuptoaslightly  
higher output from a primary regulator, the LT1175 will act  
as an unwanted load on the primary regulator. Because of  
this, the active pull-down is deliberately “weak.” It can be  
modeled as a 2k resistor in series with an internal clamp  
Tocalculatedietemperature, maximumpowerdissipation  
or maximum input voltage, use the following formulas  
with correct thermal resistance numbers from Table 2.  
For through-hole TO-220 applications use θ = 50°C/W  
JA  
without a heat sink and θ = 5°C/W + heat sink thermal  
JA  
resistance when using a heat sink.  
Die Temp = TA + θJA V V  
I
(
OUT )( LOAD  
)
IN  
TMAX TA  
θJA  
TMAX TA  
Maximum Power Dissipation =  
Maximum Input Voltage  
for Thermal Considerations  
=
+ VOUT  
θJA  
I
(
)
LOAD  
1175fe  
ꢀꢀ  
LT1175  
applicaTions inForMaTion  
T
= Maximum ambient temperature  
between the input and output of the regulator. Reverse  
voltages between input and output above 1V will damage  
the regulator if large currents are allowed to flow. Simply  
disconnecting the input source with the output held up  
will not cause damage even though the input-to-output  
voltage will become slightly reversed.  
A
T
= Maximum LT1175 die temperature (125°C for  
commercial and industrial grades)  
MAX  
θ
= LT1175 thermal resistance, junction to ambient  
JA  
V
= Maximum continuous input voltage at maximum  
load current  
IN  
High Frequency Ripple Rejection  
I
= Maximum load current  
LOAD  
The LT1175 will sometimes be powered from switching  
regulatorsthatgeneratetheunregulatedorquasi-regulated  
inputvoltage.Thisvoltagewillcontainhighfrequencyripple  
that must be rejected by the linear regulator. Special care  
was taken with the LT1175 to maximize high frequency  
ripple rejection, but as with any micropower design,  
rejection is strongly affected by ripple frequency. The  
graph in the Typical Performance Characteristics section  
shows 60dB rejection at 1kHz, but only 15dB rejection at  
100kHz for the 5V part. Photographs in Figures 4a and 4b  
show actual output ripple waveforms with square wave  
and triwave input ripple.  
Example: LT1175S8 with I  
= 200mA, V  
= 5V,  
LOAD  
OUT  
V
= 7V, T = 60°C. Maximum die temperature for the  
IN  
A
LT1175S8 is 125°C. Thermal resistance from Table 2 is  
found to be 80°C/W.  
Die Temperature = 60 + 80 (0.2A)(8 – 5) = 108°C  
125 – 60  
Maximum Power Dissipation =  
= 0.81W  
+ 5 = 9V  
80  
Maximum Continuous  
Input Voltage  
(for Thermal Considerations)  
125 – 60  
=
80 0.2  
(
)
Output Voltage Reversal  
C
C
= 4.7µF TANT  
= 1µF TANT  
The LT1175 is designed to tolerate an output voltage  
reversal of up to 2V. Reversal might occur, for instance,  
if the output was shorted to a positive 5V supply. This  
would almost surely destroy IC devices connected to the  
negative output. Reversal could also occur during start-  
up if the positive supply came up first and loads were  
connected between the positive and negative supplies.  
For these reasons, it is always good design practice to  
add a reverse biased diode from each regulator output to  
ground to limit output voltage reversal. The diode should  
be rated to handle full negative load current for start-up  
situations,ortheshort-circuitcurrentofthepositivesupply  
if supply-to-supply shorts must be tolerated.  
OUT  
OUT  
OUTPUT  
20mV/DIV  
INPUT  
RIPPLE  
100mV/DIV  
f = 50kHz  
1175 F04a  
5µs/DIV  
Figure 4a.  
C
C
= 4.7µF TANT  
= 1µF TANT  
OUT  
OUTPUT  
100mV/DIV  
Input Voltage Lower Than Output  
OUT  
Linear Technology’s positive low dropout regulators  
LT1121 and LT1129, will not draw large currents if the  
input voltage is less than the output. These devices use a  
lateralPNPpowertransistorstructurethathas40Vemitter  
base breakdown voltage. The LT1175, however, uses an  
NPN power transistor structure that has a parasitic diode  
INPUT  
RIPPLE  
100mV/DIV  
f = 100kHz  
1175 F04b  
2µs/DIV  
Figure 4b.  
1175fe  
ꢀꢁ  
LT1175  
applicaTions inForMaTion  
To estimate regulator output ripple under different  
conditions, the following general comments should be  
helpful:  
loads, larger resistors and smaller capacitors can be used  
to save space. At heavier loads an inductor may have to  
be used in place of the resistor. The value of the inductor  
can be calculated from:  
1. Output ripple at high frequency is only weakly affected  
by load current or output capacitor size for medium  
to heavy loads. At very light loads (<10mA), higher  
frequency ripple may be reduced by using larger output  
capacitors.  
ESR  
L
=
FIL  
rr / 20  
10  
2π f  
( )  
(
)
ESR = Effective series resistance of filter capacitor. This  
assumesthatthecapacitivereactanceissmallcom-  
pared to ESR, a reasonable assumption for solid  
tantalum capacitors above 2.2µF and 50kHz.  
2. Afeedforwardcapacitoracrosstheresistordividerused  
with the adjustable part is effective in reducing ripple  
only for output voltages greater than 5V and only for  
frequencies less than 100kHz.  
f
= Ripple frequency  
3. Input-to-output voltage differential has little effect on  
ripple rejection until the regulator actually enters a  
dropout condition of 0.2V to 0.6V.  
rr = Ripple rejection ratio of filter in dB  
Example: ESR = 1.2Ω, f = 100kHz, rr = 25dB.  
1.2  
If ripple rejection needs to be improved, an input filter can  
be added. This filter can be a simple RC filter using a 1Ω  
to 10Ω resistor. A 3.3Ω resistor for instance, combined  
with a 0.3Ω ESR solid tantalum capacitor, will give an ad-  
ditional 20dB ripple rejection. The size of the resistor will  
be dictated by maximum load current. If the maximum  
L
=
= 34µH  
FIL  
5
25/ 20  
6.3 10  
  
10  
  
Solid tantalum capacitors are suggested for the filter to  
keep filter Q fairly low. This prevents unwanted ringing at  
theresonantfrequencyofthelterandoscillationproblems  
with the filter/regulator combination.  
voltage drop allowable across the resistor is “V ,” and  
R
maximum load current is I  
, R = V /I  
. At light  
LOAD  
R LOAD  
1175fe  
ꢀꢂ  
LT1175  
package DescripTion  
N8 Package  
8-Lead PDIP (Narrow .300 Inch)  
(Reference LTC DWG # 05-08-1510)  
.400*  
(10.160)  
MAX  
8
7
6
5
4
.255 ± .015*  
(6.477 ± 0.381)  
1
2
3
.130 ± .005  
.300 – .325  
.045 – .065  
(3.302 ± 0.127)  
(1.143 – 1.651)  
(7.620 – 8.255)  
.065  
(1.651)  
TYP  
.008 – .015  
(0.203 – 0.381)  
.120  
.020  
(0.508)  
MIN  
(3.048)  
MIN  
+.035  
.325  
–.015  
.018 ± .003  
(0.457 ± 0.076)  
.100  
(2.54)  
BSC  
+0.889  
8.255  
(
)
N8 1002  
–0.381  
NOTE:  
INCHES  
1. DIMENSIONS ARE  
MILLIMETERS  
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.  
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)  
1175fe  
ꢀꢃ  
LT1175  
package DescripTion  
Q Package  
5-Lead Plastic DD Pak  
(Reference LTC DWG # 05-08-1461)  
.060  
(1.524)  
TYP  
.390 – .415  
(9.906 – 10.541)  
.060  
(1.524)  
.165 – .180  
(4.191 – 4.572)  
.256  
(6.502)  
.045 – .055  
(1.143 – 1.397)  
15° TYP  
+.008  
.004  
–.004  
.060  
(1.524)  
.059  
(1.499)  
TYP  
.183  
(4.648)  
.330 – .370  
(8.382 – 9.398)  
+0.203  
–0.102  
0.102  
(
)
.095 – .115  
(2.413 – 2.921)  
.075  
(1.905)  
.067  
(1.702)  
BSC  
.050 ± .012  
(1.270 ± 0.305)  
.300  
(7.620)  
.013 – .023  
(0.330 – 0.584)  
+.012  
.143  
–.020  
.028 – .038  
+0.305  
BOTTOM VIEW OF DD PAK  
HATCHED AREA IS SOLDER PLATED  
COPPER HEAT SINK  
3.632  
Q(DD5) 0502  
(0.711 – 0.965)  
(
)
–0.508  
TYP  
.420  
.276  
.080  
.420  
.350  
.325  
.205  
.565  
.565  
.320  
.090  
.042  
.090  
.042  
.067  
.067  
RECOMMENDED SOLDER PAD LAYOUT  
NOTE:  
RECOMMENDED SOLDER PAD LAYOUT  
FOR THICKER SOLDER PASTE APPLICATIONS  
1. DIMENSIONS IN INCH/(MILLIMETER)  
2. DRAWING NOT TO SCALE  
1175fe  
ꢀꢄ  
LT1175  
package DescripTion  
S8 Package  
8-Lead Plastic Small Outline (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1610)  
.189 – .197  
(4.801 – 5.004)  
NOTE 3  
.045 ±.005  
.050 BSC  
7
5
8
6
.245  
MIN  
.160 ±.005  
.150 – .157  
(3.810 – 3.988)  
NOTE 3  
.228 – .244  
(5.791 – 6.197)  
.030 ±.005  
TYP  
1
2
3
4
RECOMMENDED SOLDER PAD LAYOUT  
.010 – .020  
(0.254 – 0.508)  
× 45°  
.053 – .069  
(1.346 – 1.752)  
.004 – .010  
(0.101 – 0.254)  
.008 – .010  
(0.203 – 0.254)  
0°– 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.050  
(1.270)  
BSC  
.014 – .019  
(0.355 – 0.483)  
TYP  
NOTE:  
INCHES  
1. DIMENSIONS IN  
(MILLIMETERS)  
2. DRAWING NOT TO SCALE  
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.  
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)  
SO8 0303  
ST Package  
3-Lead Plastic SOT-223  
(Reference LTC DWG # 05-08-1630)  
.248 – .264  
(6.30 – 6.71)  
.129 MAX  
.114 – .124  
(2.90 – 3.15)  
.059 MAX  
.264 – .287  
(6.70 – 7.30)  
.248 BSC  
.130 – .146  
(3.30 – 3.71)  
.039 MAX  
.059 MAX  
.090  
BSC  
.181 MAX  
RECOMMENDED SOLDER PAD LAYOUT  
.033 – .041  
(0.84 – 1.04)  
.0905  
(2.30)  
BSC  
10° – 16°  
.010 – .014  
10°  
MAX  
.071  
(1.80)  
MAX  
(0.25 – 0.36)  
10° – 16°  
.0008 – .0040  
(0.0203 – 0.1016)  
.024 – .033  
(0.60 – 0.84)  
.012  
(0.31)  
MIN  
.181  
(4.60)  
BSC  
ST3 (SOT-233) 0502  
1175fe  
ꢀꢅ  
LT1175  
package DescripTion  
T Package  
5-Lead Plastic TO-220 (Standard)  
(Reference LTC DWG # 05-08-1421)  
.165 – .180  
(4.191 – 4.572)  
.147 – .155  
(3.734 – 3.937)  
DIA  
.390 – .415  
(9.906 – 10.541)  
.045 – .055  
(1.143 – 1.397)  
.230 – .270  
(5.842 – 6.858)  
.570 – .620  
(14.478 – 15.748)  
.620  
(15.75)  
TYP  
.460 – .500  
(11.684 – 12.700)  
.330 – .370  
(8.382 – 9.398)  
.700 – .728  
(17.78 – 18.491)  
.095 – .115  
(2.413 – 2.921)  
SEATING PLANE  
.152 – .202  
(3.861 – 5.131)  
.155 – .195*  
(3.937 – 4.953)  
.260 – .320  
(6.60 – 8.13)  
.013 – .023  
(0.330 – 0.584)  
.067  
BSC  
.135 – .165  
(3.429 – 4.191)  
.028 – .038  
(0.711 – 0.965)  
(1.70)  
* MEASURED AT THE SEATING PLANE  
T5 (TO-220) 0801  
revision hisTory (Revision history begins at Rev E)  
REV  
DATE  
11/09 Revise Typical Application  
Revise Pin Configuration Drawings and Layout  
Update Order Information  
Added and Pin Numbers Added to Pin Funcitons  
DESCRIPTION  
PAGE NUMBER  
E
1
2
3
V
IN  
7
Title Added to Table 1  
8
8, 9, 10, 12  
11  
Revised Figures 1, 2, 3, 4a and 4b  
Value Correction in Final Paragraph of Output Capacitor Section  
1175fe  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
ꢀꢆ  
LT1175  
relaTeD parTs  
PART NUMBER  
LT1121  
DESCRIPTION  
COMMENTS  
150mA Positive Micropower Low Dropout Regulator with Shutdown  
700mA Positive Micropower Low Dropout Regulator with Shutdown  
3A Negative Low Dropout Regulator  
LT1129  
LT1185  
LT1521  
300mA Positive Micropower Low Dropout Regulator with Shutdown  
3A Positive Micropower Low Dropout Regulator with Shutdown  
LT1529  
1175fe  
LT 1109 REV E • PRINTED IN USA  
Linear Technology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
ꢀꢇ  
LINEAR TECHNOLOGY CORPORATION 1995  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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