LT1765 [Linear]

Monolithic 3A, 1.25MHz Step-Down Switching Regulator; 单片式3A , 1.25MHz的降压型开关稳压器
LT1765
型号: LT1765
厂家: Linear    Linear
描述:

Monolithic 3A, 1.25MHz Step-Down Switching Regulator
单片式3A , 1.25MHz的降压型开关稳压器

稳压器 开关
文件: 总20页 (文件大小:248K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
Monolithic 3A, 1.25MHz  
Step-Down Switching Regulator  
U
FEATURES  
DESCRIPTIO  
The LT®1765 is a 1.25MHz monolithic buck switching  
regulator. A high efficiency 3A, 0.09switch is included  
on the die together with all the control circuitry required  
to construct a high frequency, current mode switching  
regulator. Current mode control provides fast transient  
response and excellent loop stability.  
3A Switch in a Thermally Enhanced 16-Lead  
TSSOP or 8-Lead SO Package  
Constant 1.25MHz Switching Frequency  
Wide Operating Voltage Range: 3V to 25V  
High Efficiency 0.09Switch  
1.2V Feedback Reference Voltage  
Uses Low Profile Surface Mount Components  
New design techniques achieve high efficiency at high  
switchingfrequenciesoverawideoperatingvoltagerange.  
A low dropout internal regulator maintains consistent  
performance over a wide range of inputs from 24V  
systems to Li-Ion batteries. An operating supply current  
of 1mA improves efficiency, especially at lower output  
currents. Shutdown reduces quiescent current to 15µA.  
Maximum switch current remains constant at all duty  
cycles. Synchronization allows an external logic level  
signal to increase the internal oscillator into the range of  
1.6MHz to 2MHz.  
Low Shutdown Current: 15µA  
Synchronizable to 2MHz  
Current Mode Loop Control  
Constant Maximum Switch Current Rating at  
All Duty Cycles*  
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APPLICATIO S  
DSL Modems  
Portable Computers  
Regulated Wall Adapters  
Full cycle-by-cycle current control and thermal shutdown  
are provided. High frequency operation allows the reduc-  
tion of input and output filtering components and permits  
the use of chip inductors.  
Battery-Powered Systems  
Distributed Power  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
* Patent Pending  
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TYPICAL APPLICATIO  
5V to 3.3V Step-Down Converter  
Efficiency vs Load Current  
90  
CMDSH-3  
V
V
= 10V  
OUT  
IN  
= 5V  
0.18µF  
85  
80  
75  
70  
1.5µH  
OUTPUT  
3.3V  
BOOST  
INPUT  
5V  
V
IN  
V
SW  
FB  
2.5A  
2.2µF  
CERAMIC  
LT1765-3.3  
OFF ON  
SHDN  
SYNC GND  
V
C
4.7µF  
CERAMIC  
2.2nF  
UPS120  
1765 TA01  
1.0  
1.5  
0
2.0  
0.5  
SWITCH CURRENT (A)  
1765 • TAO1a  
sn1765 1765fas  
1
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
W W U W  
ABSOLUTE AXI U RATI GS  
(Note 1)  
Input Voltage .......................................................... 25V  
BOOST Pin Above SW ............................................ 20V  
Max BOOST Pin Voltage .......................................... 35V  
SHDN Pin ............................................................... 25V  
FB Pin Current ....................................................... 1mA  
SYNC Pin Current .................................................. 1mA  
Operating Junction Temperature Range  
(Note 2) ........................................... 40°C to 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
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W
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PACKAGE/ORDER I FOR ATIO  
ORDER PART  
NUMBER  
ORDER PART  
NUMBER  
TOP VIEW  
GND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
NC  
TOP VIEW  
LT1765ES8  
LT1765EFE  
BOOST  
LT1765EFE-1.8  
LT1765EFE-2.5  
LT1765EFE-3.3  
LT1765EFE-5  
BOOST  
1
2
3
4
8
7
6
5
SYNC  
V
IN  
SYNC  
V
IN  
V
C
V
IN  
V
C
SW  
FB  
SW  
SW  
FB  
GND  
SHDN  
SHDN  
NC  
S8 PART  
MARKING  
NC  
S8 PACKAGE  
8-LEAD PLASTIC SO  
FE PART MARKING  
GND  
GND  
TJMAX = 125°C, θJA = 90°C/W,  
θJC(PIN 4) = 30°C/W  
1765EFE  
1765  
FE PACKAGE  
16-LEAD PLASTIC TSSOP  
GROUND PIN CONNECTED TO  
LARGE COPPER AREA  
1765EFE18  
1765EFE25  
1765EFE33  
1765EFE-5  
θJA = 45°C/W, θJC(PAD) = 10°C/W  
EXPOSED PAD SOLDERED TO LARGE  
COPPER PLANE  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.  
VIN = 15V, VC = 0.8V, Boost = VIN + 5V, SHDN, SYNC and switch open unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
3
TYP  
4
MAX  
6
UNITS  
A
Maximum Switch Current Limit  
Oscillator Frequency  
Switch On Voltage Drop  
3.3V < V < 25V  
1.1  
1.25  
270  
2.6  
1
1.6  
430  
2.73  
1.3  
MHz  
mV  
V
IN  
I = 3A  
V
IN  
V
IN  
Undervoltage Lockout  
Supply Current  
(Note 3)  
2.47  
mA  
Shutdown Supply Current  
V
SHDN  
= 0V, V = 25V, V = 0V  
15  
35  
55  
µA  
µA  
IN  
SW  
Feedback Voltage  
3V < V < 25V, 0.4V < V < 0.9V  
(Note 3)  
LT1765 (Adj)  
1.182  
1.176  
1.2  
1.218  
1.224  
V
V
IN  
C
LT1765-1.8  
LT1765-2.5  
LT1765-3.3  
LT1765-5  
1.764  
2.45  
3.234  
4.9  
1.8  
2.5  
3.3  
5
1.836  
2.55  
3.366  
5.1  
V
V
V
V
sn1765 1765fas  
2
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
ELECTRICAL CHARACTERISTICS  
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.  
VIN = 15V, VC = 0.8V, Boost = VIN + 5V, SHDN, SYNC and switch open unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
FB Input Current  
FB Input Resistance  
LT1765 (Adj)  
0.25  
0.5  
µA  
LT1765  
10.5  
14.7  
19  
15  
21  
27.5  
42  
21  
30  
39  
60  
kΩ  
kΩ  
kΩ  
kΩ  
LT1765-1.8  
LT1765-3.3  
LT1765-5  
29  
FB Error Amp Voltage Gain  
0.4V < V < 0.9V  
150  
500  
80  
350  
850  
120  
110  
5
C
FB Error Amp Transconductance  
I = ±10µA  
VC  
1300  
160  
µMho  
µA  
µA  
A/V  
V
V Pin Source Current  
C
V
V
= V  
= V  
– 17%  
+ 17%  
FB  
FB  
NOM  
NOM  
V Pin Sink Current  
C
70  
180  
V Pin to Switch Current Transconductance  
C
V Pin Minimum Switching Threshold  
Duty Cycle = 0%  
0.4  
0.9  
90  
C
V Pin 3A I Threshold  
V
C
SW  
Maximum Switch Duty Cycle  
V = 1.2V, I = 800mA, V = 6V  
85  
80  
%
%
C
SW  
IN  
Minimum Boost Voltage Above Switch  
Boost Current  
I
= 3A  
1.8  
2.7  
V
SW  
I
I
= 1A (Note 4)  
= 3A (Note 4)  
20  
70  
30  
140  
mA  
mA  
SW  
SW  
SHDN Threshold Voltage  
1.27  
4
1.33  
7
1.40  
10  
V
µA  
SHDN Threshold Current Hysteresis  
SHDN Input Current (Shutting Down)  
SYNC Threshold Voltage  
SHDN = 60mV Above Threshold  
– 7  
– 10  
1.5  
– 13  
2.2  
2
µA  
V
SYNC Input Frequency  
1.6  
MHz  
kΩ  
SYNC Pin Resistance  
I
= 1mA  
20  
SYNC  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 2: The LT1765E is guaranteed to meet performance specifications  
from 0°C to 125°C. Specifications over the 40°C to 125°C operating  
junction temperature range are assured by design, characterization and  
correlation with statistical process controls.  
Note 3: Minimum input voltage is defined as the voltage where the internal  
regulator enters lockout. Actual minimum input voltage to maintain a  
regulated output will depend on output voltage and load current. See  
Applications Information.  
Note 4: Current flows into the BOOST pin only during the on period of the  
switch cycle.  
sn1765 1765fas  
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LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
FB vs Temperature (Adj)  
Switch On Voltage Drop  
Oscillator Frequency  
1.220  
1.215  
1.210  
1.205  
1.200  
1.195  
1.190  
1.185  
1.180  
350  
300  
250  
200  
150  
100  
50  
1.50  
1.45  
1.40  
1.35  
1.30  
1.25  
1.20  
1.15  
1.10  
T
= 125°C  
A
T
= –40°C  
A
T
= 25°C  
A
0
–25  
0
25  
50  
75  
125  
–50  
100  
2
3
0
1
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
SWITCH CURRENT (A)  
1765 G01  
1765 G02  
1765 G03  
SHDN Threshold vs Temperature  
SHDN Supply Current vs VIN  
7
1.40  
1.38  
1.36  
1.34  
1.32  
1.30  
SHDN = 0V  
6
5
4
3
2
1
0
–50 –25  
0
25  
50  
75 100 125  
0
5
10  
15  
(V)  
20  
25  
30  
TEMPERATURE (°C)  
V
IN  
1765 G04  
1765 G05  
SHDN IP Current vs Temperature  
–12  
–10  
–8  
–6  
–4  
–2  
0
SHUTTING DOWN  
STARTING UP  
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
1765 G06  
sn1765 1765fas  
4
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Minimum Input Voltage for  
2.5V Out  
SHDN Supply Current  
Input Supply Current  
1200  
1000  
800  
600  
400  
200  
0
3.5  
3.3  
3.1  
2.9  
2.7  
2.5  
300  
250  
200  
150  
100  
50  
V
= 15V  
IN  
UNDERVOLTAGE  
LOCKOUT  
0
0.001  
0.01  
0.1  
1
0
0.2 0.4 0.6 0.8  
1
1.2 1.4  
0
5
10  
15  
20  
25  
30  
LOAD CURRENT (A)  
SHUTDOWN VOLTAGE (V)  
INPUT VOLTAGE (V)  
1765 G07  
1765 G08  
1765 G09  
Maximum Load Current,  
VOUT = 5V  
Current Limit Foldback  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
4
40  
30  
20  
10  
0
L = 4.7µH  
3
2
1
0
SWITCH CURRENT  
L = 2.2µH  
FB CURRENT  
L = 1.5µH  
0
5
10  
15  
20  
25  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
INPUT VOLTAGE (V)  
FEEDBACK VOLTAGE (V)  
1765 G11  
1765 G10  
Maximum Load Current,  
VOUT = 2.5V  
3.0  
2.8  
2.6  
2.4  
2.2  
L = 4.7µH  
L = 2.2µH  
L = 1.5µH  
0
5
10  
15  
20  
25  
INPUT VOLTAGE (V)  
1765 G12  
sn1765 1765fas  
5
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
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PI FU CTIO S  
VSW: The switch pin is the emitter of the on-chip power  
NPN switch. This pin is driven up to the input pin voltage  
during switch on time. Inductor current drives the switch  
pin negative during switch off time. Negative voltage must  
be clamped with an external catch diode with a VBR <0.8V.  
Both VSW pins of the TSSOP package must be shorted  
together on the PC board.  
FB: The feedback pin is used to set output voltage using  
an external voltage divider (adjustable version) that gen-  
erates 1.2V at the pin when connected to the desired  
output voltage. The fixed voltage 1.8V, 2.5V, 3.3V and 5V  
versions have the divider network included internally and  
the FB pin is connected directly to the output. If required,  
the current limit can be reduced during start up or short-  
circuitwhentheFBpinisbelow0.5V(seetheCurrentLimit  
Foldback graph in the Typical Performance Characteris-  
tics section). An impedance of less than 5kon the  
adjustable version at the FB pin is needed for this feature  
to operate.  
SYNC: The sync pin is used to synchronize the internal  
oscillator to an external signal. It is directly logic compat-  
ible and can be driven with any signal between 20% and  
80% duty cycle. The synchronizing range is from 1.6MHz  
to 2MHz. See Synchronization section in Applications  
Informationfordetails. Whennotinuse, thispinshouldbe  
grounded.  
BOOST: The BOOST pin is used to provide a drive voltage,  
higher than the input voltage, to the internal bipolar NPN  
power switch.  
SHDN: The shutdown pin is used to turn off the regulator  
and to reduce input drain current to a few microamperes.  
The 1.33V threshold can function as an accurate under-  
voltage lockout (UVLO), preventing the regulator from  
operating until the input voltage has reached a predeter-  
mined level. Float or pull high to put the regulator in the  
operating mode.  
VIN:This is the collector of the on-chip power NPN switch.  
This pin powers the internal circuitry and internal regula-  
tor. At NPN switch on and off, high di/dt edges occur on  
this pin. Keep the external bypass capacitor and catch  
diodeclosetothispin.Alltraceinductanceonthispathwill  
create a voltage spike at switch off, adding to the VCE  
voltage across the internal NPN. Both VIN pins of the  
TSSOP package must be shorted together on the PC  
board.  
VC: The VC pin is the output of the error amplifier and the  
input of the peak switch current comparator. It is normally  
used for frequency compensation, but can do double duty  
as a current clamp or control loop override. This pin sits  
at about 0.4V for very light loads and 0.9V at maximum  
load. It can be driven to ground to shut off the output.  
GND: The GND pin acts as the reference for the regulated  
output, soloadregulationwillsufferifthegroundendof  
the load is not at the same voltage as the GND pin of the  
IC. This condition will occur when load current or other  
currents flow through metal paths between the GND pin  
and the load ground point. Keep the ground path short  
between the GND pin and the load and use a ground plane  
when possible. Keep the path between the input bypass  
and the GND pin short. The exposed GND pad and/or GND  
pinsofthepackagearedirectlyattachedtotheinternaltab.  
These pins/pad should be attached to a large copper area  
to reduce thermal resistance.  
sn1765 1765fas  
6
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
W
BLOCK DIAGRA  
The LT1765 is a constant frequency, current mode buck  
converter. This means that there is an internal clock and  
twofeedbackloopsthatcontrolthedutycycleofthepower  
switch. In addition to the normal error amplifier, there is a  
current sense amplifier that monitors switch current on a  
cycle-by-cycle basis. A switch cycle starts with an oscilla-  
tor pulse which sets the RS flip-flop to turn the switch on.  
When switch current reaches a level set by the inverting  
input of the comparator, the flip-flop is reset and the  
switch turns off. Output voltage control is obtained by  
using the output of the error amplifier to set the switch  
current trip point. This technique means that the error  
amplifier commands current to be delivered to the output  
rather than voltage. A voltage fed system will have low  
phase shift up to the resonant frequency of the inductor  
and output capacitor, then an abrupt 180° shift will occur.  
The current fed system will have 90° phase shift at a much  
lower frequency, but will not have the additional 90° shift  
until well beyond the LC resonant frequency. This makes  
itmucheasiertofrequencycompensatethefeedbackloop  
and also gives much quicker transient response.  
High switch efficiency is attained by using the BOOST pin  
to provide a voltage to the switch driver which is higher  
than the input voltage, allowing the switch to be saturated.  
This boosted voltage is generated with an external capaci-  
tor and diode. A comparator connected to the shutdown  
pin disables the internal regulator, reducing supply  
current.  
0.005Ω  
INPUT  
+
CURRENT  
SENSE  
INTERNAL  
CC  
2.5V BIAS  
REGULATOR  
AMPLIFIER  
V
VOLTAGE GAIN = 40  
SLOPE COMP  
BOOST  
Σ
0.4V  
1.25MHz  
S
R
SYNC  
Q1  
POWER  
SWITCH  
OSCILLATOR  
R
DRIVER  
CURRENT  
COMPARATOR  
S
FLIP-FLOP  
CIRCUITRY  
+
SHUTDOWN  
COMPARATOR  
V
SW  
PARASITIC DIODES  
DO NOT FORWARD BIAS  
7µA  
+
FB  
1.33V  
+
ERROR  
V
C
AMPLIFIER  
1.2V  
INTERNAL  
CC  
g
m
= 850µMho  
SHDN  
V
GND  
3µA  
1765 F01  
Figure 1. Block Diagram  
sn1765 1765fas  
7
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
W U U  
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APPLICATIO S I FOR ATIO  
FB RESISTOR NETWORK  
rating and turn-on surge problems. Y5V or similar type  
ceramics can be used since the absolute value of capaci-  
tance is less important and has no significant effect on  
loop stability. If operation is required close to the mini-  
mum input required by the output or the LT1765, a larger  
value may be required. This is to prevent excessive ripple  
causingdipsbelowtheminimumoperatingvoltageresult-  
ing in erratic operation.  
If an output voltage of 1.8V, 2.5V, 3.3V or 5V is required,  
the respective fixed option part, -1.8, -2.5, -3.3 or -5,  
shouldbeused. TheFBpinistieddirectlytotheoutput;the  
necessary resistive divider is already included on the part.  
For other voltage outputs, the adjustable part should be  
used and an external resistor divider added. The sug-  
gested resistor (R2) from FB to ground is 10k. This  
reduces the contribution of FB input bias current to output  
voltage to less than 0.25%. The formula for the resistor  
(R1) from VOUT to FB is:  
Iftantalumcapacitorsareused,valuesinthe22µFto470µF  
range are generally needed to minimize ESR and meet  
ripple current and surge ratings. Care should be taken to  
ensure the ripple and surge ratings are not exceeded. The  
AVX TPS and Kemet T495 series tantalum capacitors are  
surge rated. AVX recommends derating capacitor operat-  
ing voltage by 2:1 for high surge applications.  
R2(VOUT – 1.2)  
1.2 – R2(0.25µA)  
R1=  
LT1765 (ADJ)  
V
SW  
OUTPUT  
OUTPUT CAPACITOR  
ERROR  
AMPLIFIER  
Unlike the input capacitor, RMS ripple current in the  
output capacitor is normally low enough that ripple cur-  
rent rating is not an issue. The current waveform is  
triangular, with an RMS value given by:  
1.2V  
+
R1  
+
FB  
R2  
10k  
1765 F02  
0.29 V  
OUT )(  
=
V V  
IN OUT  
(
)
IRIPPLE RMS  
V
C
GND  
(
)
L f V  
( )( )(  
)
IN  
Figure 2. Feedback Network  
The LT1765 will operate with both ceramic and tantalum  
output capacitors. Ceramic capacitors are generally cho-  
sen for their small size, very low ESR (effective series  
resistance), and good high frequency operation. Ceramic  
output capacitors in the 1µF to 10µF range, X7R or X5R  
type are recommended.  
INPUT CAPACITOR  
Step-down regulators draw current from the input supply  
in pulses. The rise and fall times of these pulses are very  
fast. The input capacitor is required to reduce the voltage  
ripple at the input of LT1765 and to force the switching  
currentintoatightlocalloop,therebyminimizingEMI.The  
RMS ripple current can be calculated from:  
Tantalum capacitors are usually chosen for their bulk  
capacitance properties, useful in high transient load appli-  
cations. ESR rather than absolute value defines output  
ripple at 1.25MHz. Typical LT1765 applications require a  
tantalum capacitor with less than 0.3ESR at 22µF to  
500µF, see Table 2. This ESR provides a useful zero in the  
frequency response. Ceramic output capacitors with low  
ESR usually require a larger VC capacitor or an additional  
series R to compensate for this.  
2
IN  
IRIPPLE RMS =IOUT VOUT V VOUT / V  
(
IN  
)
(
)
Ceramiccapacitorsareidealforinputbypassing.Athigher  
switching frequency, the energy storage requirement of  
theinputcapacitorisreducedsovaluesintherangeof1µF  
to 4.7µF are suitable for most applications. Their high  
frequency capacitive nature removes most ripple current  
sn1765 1765fas  
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LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
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APPLICATIO S I FOR ATIO  
U
Table 2. Surface Mount Solid Tantalum Capacitor ESR  
IOUT MAX  
=
(VOUT )(VIN VOUT  
2(L)(f)(VIN)  
)
(
)
and Ripple Current  
IP –  
E Case Size  
ESR (Max, )  
0.1 to 0.3  
Ripple Current (A)  
0.7 to 1.1  
0.4  
Continuous Mode  
AVX TPS, Sprague 593D  
AVX TAJ  
For VIN = 8V, VOUT = 5V and L = 3.3µH,  
0.7 to 0.9  
D Case Size  
5 8 5  
( )(  
)
AVX TPS, Sprague 593D  
C Case Size  
0.1 to 0.3  
0.2 (typ)  
0.7 to 1.1  
0.5 (typ)  
IOUT(MAX) = 3 −  
2 3.3 •106 1.25106 8  
( )  
(
)(  
)
AVX TPS  
= 3 0.23 = 2.77A  
Figure3showsacomparisonofoutputrippleforaceramic  
and tantalum capacitor at 200mA ripple current.  
Note that the worst case (minimum output current avail-  
able) condition is at the maximum input voltage. For the  
same circuit at 15V, maximum output current would be  
only 2.6A.  
VOUT USING 47µF, 0.1Ω  
TANTALUM CAPACITOR  
(10mV/DIV)  
Inductor Selection  
The output inductor should have a saturation current  
rating greater than the peak inductor current set by the  
current comparator of the LT1765. The peak inductor  
currentwilldependontheoutputcurrent,inputandoutput  
voltages and the inductor value:  
V
OUT USING 2.2µF  
CERAMIC CAPACITOR  
(10mV/DIV)  
VSW  
(5V/DIV)  
VOUT V V  
(
)
IN  
OUT  
IPEAK = IOUT +  
2 L f V  
( )( )(  
)
IN  
0.2µs/DIV  
1765 F03  
VIN = Maximum input voltage  
f = Switching frequency, 1.25MHz  
Figure 3. Output Ripple Voltage Waveform  
If an inductor with a peak current lower than the maximum  
switch current of the LT1765 is chosen a soft-start circuit  
in Figure 10 should be used. Also, short-circuit conditions  
should not be allowed because the inductor may saturate  
resulting in excessive power dissipation.  
INDUCTOR CHOICE AND MAXIMUM OUTPUT  
CURRENT  
Maximum output current for an LT1765 buck converter is  
equal to the maximum switch rating (IP) minus one half  
peaktopeakinductorripplecurrent.TheLT1765maintains  
a constant switch current rating at all duty cycles. (Patent  
Pending)  
Also, consideration should be given to the resistance of  
the inductor. Inductor conduction loses are directly pro-  
portional to the DC resistance of inductor. Sometime, the  
manufacturers will also provide maximum current rating  
based on the allowable losses in the inductor. Care should  
be taken, however. At high input voltages and low DCR,  
excessiveswitchcurrentcouldflowduringshortedoutput  
condition.  
For most applications, the output inductor will be in the  
1µHto10µHrange. Lowervaluesarechosentoreducethe  
physical size of the inductor, higher values allow higher  
outputcurrentsduetoreducedpeaktopeakripplecurrent.  
The following formula gives maximum output current for  
continuous mode operation, implying that the peak to  
peak ripple (2x the term on the right) is less than the  
maximum switch current.  
SuitableinductorsareavailablefromCoilcraft,Coiltronics,  
Dale, Sumida, Toko, Murata, Panasonic and other  
manufacturers.  
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Table 3  
supply is used. The boost diode can be connected to the  
input, although, care must be taken to prevent the 2x VIN  
boost voltage from exceeding the BOOST pin absolute  
maximum rating. The additional voltage across the switch  
driver also increases power loss, reducing efficiency. If  
available, an independent supply can be used with a local  
bypass capacitor.  
VALUE  
I
DCR  
HEIGHT  
(mm)  
RMS  
PART NUMBER  
Coiltcraft  
(µH)  
(Amps)  
()  
DO1608C-222  
Sumida  
2.2  
2.4  
0.07  
2.9  
CDRH3D16-1R5  
CDRH4D18-1R0  
CDC5D23-2R2  
CR43-1R4  
1.5  
1.0  
2.2  
1.4  
2.6  
1.6  
1.7  
2.2  
2.5  
2.6  
0.043  
0.035  
0.03  
1.8  
2.0  
2.5  
3.5  
3.0  
A 0.18µF boost capacitor is recommended for most appli-  
cations. Almost any type of film or ceramic capacitor is  
suitable, but the ESR should be <1to ensure it can be  
fully recharged during the off time of the switch. The  
capacitor value is derived from worst-case conditions of  
700ns on-time, 90mA boost current, and 0.7V discharge  
ripple.Thisvalueisthenguardbandedby2xforsecondary  
factors such as capacitor tolerance, ESR and temperature  
effects. The boost capacitor value could be reduced under  
less demanding conditions, but this will not improve  
circuitoperationorefficiency.Underlowinputvoltageand  
low load conditions, a higher value capacitor will reduce  
discharge ripple and improve start up operation.  
0.056  
0.013  
CDRH5D28-2R6  
Toko  
(D62F)847FY-2R4M  
(D73LF)817FY-2R2M  
2.4  
2.2  
2.5  
2.7  
0.037  
0.03  
2.7  
3.0  
CATCH DIODE  
ThediodeD1conductscurrentonlyduringswitchofftime.  
Peak reverse voltage is equal to regulator input voltage.  
Averageforwardcurrentinnormaloperationcanbecalcu-  
lated from:  
IOUT V VOUT  
(
IN  
)
SHUTDOWN AND UNDERVOLTAGE LOCKOUT  
ID(AVG  
=
)
V
IN  
Figure 4 shows how to add undervoltage lockout (UVLO)  
to the LT1765. Typically, UVLO is used in situations where  
the input supply is current limited, or has a relatively high  
source resistance. A switching regulator draws constant  
power from the source, so source current increases as  
source voltage drops. This looks like a negative resistance  
loadtothesourceandcancausethesourcetocurrentlimit  
or latch low under low source voltage conditions. UVLO  
prevents the regulator from operating at source voltages  
where these problems might occur.  
The only reason to consider a larger than 3A diode is the  
worst-case condition of a high input voltage and shorted  
output. With a shorted condition, diode current will in-  
crease to a typical value of 4A, determined by peak switch  
current limit of the LT1765. A higher forward voltage will  
also limit switch current. This is safe for short periods of  
time, but it would be prudent to check with the diode  
manufacturer if continuous operation under these condi-  
tions must be tolerated.  
BOOST PIN  
LT1765  
Formostapplications, theboostcomponentsarea0.18µF  
capacitor and a CMDSH-3 diode. The anode is typically  
connected to the regulated output voltage to generate a  
voltage approximately VOUT above VIN to drive the output  
stage. The output driver requires at least 2.7V of head-  
room throughout the on period to keep the switch fully  
saturated.However,theoutputstagedischargestheboost  
capacitor during this on time. If the output voltage is less  
than 3.3V, it is recommended that an alternate boost  
V
SW  
7µA  
IN  
INPUT  
1.33V  
R1  
R2  
3µA  
V
CC  
OUTPUT  
SHDN  
+
C1  
GND  
1765 F04  
Figure 4. Undervoltage Lockout  
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An internal comparator will force the part into shutdown  
below the minimum VIN of 2.6V. This feature can be used  
to prevent excessive discharge of battery-operated sys-  
tems. If an adjustable UVLO threshold is required, the  
shutdown pin can be used. The threshold voltage of the  
shutdown pin comparator is 1.33V. A 3µA internal current  
sourcedefaultstheopenpinconditiontobeoperating(see  
TypicalPerformanceGraphs). Currenthysteresisisadded  
above the SHDN threshold. This can be used to set voltage  
hysteresis of the UVLO using the following:  
input can be driven directly from a logic level output. The  
synchronizing range is equal to initial operating frequency  
up to 2MHz. This means that minimum practical sync  
frequency is equal to the worst-case high self-oscillating  
frequency (1.6MHz), not the typical operating frequency  
of 1.25MHz. Caution should be used when synchronizing  
above 1.8MHz because at higher sync frequencies the  
amplitude of the internal slope compensation used to  
prevent subharmonic switching is reduced. This type of  
subharmonic switching only occurs at input voltages less  
than twice output voltage. Higher inductor values will tend  
to eliminate this problem. See Frequency Compensation  
section for a discussion of an entirely different cause of  
subharmonic switching before assuming that the cause is  
insufficient slope compensation. Application Note 19 has  
more details on the theory of slope compensation.  
VH VL  
R1=  
7µA  
1.33V  
R2 =  
V 1.33V  
(
)
H
+ 3µA  
R1  
VH – Turn-on threshold  
VL – Turn-off threshold  
LAYOUT CONSIDERATIONS  
As with all high frequency switchers, when considering  
layout, care must be taken in order to achieve optimal  
electrical, thermalandnoiseperformance. Formaximum  
efficiency, switch rise and fall times are typically in the  
nanosecond range. To prevent noise both radiated and  
conducted,thehighspeedswitchingcurrentpath,shown  
inFigure5, mustbekeptasshortaspossible. Shortening  
thispathwillalsoreducetheparasitictraceinductanceof  
approximately 25nH/inch. At switch off, this parasitic  
inductance produces a flyback spike across the LT1765  
switch. When operating at higher currents and input  
voltages, with poor layout, this spike can generate  
voltages across the LT1765 that may exceed its absolute  
Example: switching should not start until the input is  
above 4.75V and is to stop if the input falls below 3.75V.  
VH = 4.75V  
VL = 3.75V  
4.75V 3.75V  
R1=  
R2 =  
= 143k  
7µA  
1.33V  
= 49.4k  
4.75V 1.33V  
(
)
+ 3µA  
143k  
Keep the connections from the resistors to the SHDN pin  
short and make sure that the interplane or surface capaci-  
tance to the switching nodes are minimized. If high resis-  
torvaluesareused,theSHDNpinshouldbebypassedwith  
a 1nF capacitor to prevent coupling problems from the  
switch node.  
LT1765  
L1  
V
IN  
SW  
5V  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
C3  
D1 C1  
V
IN  
LOAD  
SYNCHRONIZATION  
1765 F05  
TheSYNCpinisusedtosynchronizetheinternaloscillator  
to an external signal. The SYNC input must pass from a  
logic level low, through the maximum synchronization  
threshold with a duty cycle between 20% and 80%. The  
Figure 5. High Speed Switching Path  
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MINIMIZE D1, C3  
LT1765 LOOP  
V
IN  
GND  
D2  
CMDSH-3  
C3  
KEEP FB AND V  
C
INPUT  
COMPONENTS AND  
TRACES AWAY FROM  
HIGH FREQUENCY,  
HIGH INPUT  
C
D2  
C2  
C
15V  
C2  
C3  
0.18µF  
4.7µF  
CERAMIC  
L1  
2.7µH  
OUTPUT  
3.3V  
BOOST  
COMPONENTS  
V
IN  
V
SW  
FB  
C
2.5A  
LT1765-33  
D1  
OFF ON  
SHDN  
SYNC GND  
L1  
V
C
C1  
4.7µF  
CERAMIC  
D1  
B220A  
C
2.2nF  
PLACE FEEDTHROUGHS  
UNDER AND AROUND  
GROUND PAD FOR  
GOOD THERMAL  
V
OUT  
GND  
C1  
1765 F06  
CONDUCTIVITY  
KELVIN  
SENSE  
1765 F6a  
V
OUT  
Figure 6. Typical Application and Layout (Topside Only Shown)  
maximum rating. A ground plane should always be used  
under the switcher circuitry to prevent interplane coupling  
and overall noise.  
THERMAL CALCULATIONS  
Power dissipation in the LT1765 chip comes from four  
sources: switch DC loss, switch AC loss, boost circuit  
current, and input quiescent current. The following  
formulas show how to calculate each of these losses.  
These formulas assume continuous mode operation, so  
they should not be used for calculating efficiency at light  
load currents.  
The VC and FB components should be kept as far away as  
possible from the switch and boost nodes. The LT1765  
pinout has been designed to aid in this. The ground for  
these components should be separated from the switch  
current path. Failure to do so will result in poor stability or  
subharmonic like oscillation.  
Switch loss:  
Board layout also has a significant effect on thermal  
resistance. The exposed pad or GND pin is a continuous  
copper plate that runs under the LT1765 die. This is the  
best thermal path for heat out of the package as can be  
seenbythelowθJC oftheexposedpadpackage. Reducing  
the thermal resistance from Pin 4 or exposed pad onto the  
board will reduce die temperature and increase the power  
capability of the LT1765. This is achieved by providing as  
much copper area as possible around this pin/pad. Also,  
having multiple solder filled feedthroughs to a continuous  
copper plane under LT1765 will help in reducing thermal  
resistance. Ground plane is usually suitable for this pur-  
pose. In multilayer PCB designs, placing a ground plane  
next to the layer with the LT1765 will reduce thermal  
resistance to a minimum.  
2
RSW OUT  
I
V
OUT  
(
) (  
)
P
SW  
=
+ 17ns I  
V
f
(
OUT)( IN)( )  
V
IN  
Boost current loss for VBOOST = VOUT  
:
2
VOUT  
I
/50  
(
)
OUT  
PBOOST  
=
V
IN  
Quiescent current loss:  
PQ =V 0.001  
IN  
(
)
RSW = Switch resistance (0.13at hot)  
17ns = Equivalent switch current/voltage overlap time  
f = Switch frequency  
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DIE TEMPERATURE MEASUREMENT  
Example: with VIN = 10V, VOUT = 5V and IOUT = 2A:  
If a true die temperature is required, a measurement of the  
SYNC to GND pin resistance can be used. The SYNC pin  
resistance across temperature must first be calibrated,  
with no significant output load, in an oven. An initial value  
of 40k with a temperature coefficient of 0.16%/°C is  
typical. The same measurement can then be used in  
operation to indicate the die temperature.  
0.13 2 2 5  
(
)( ) ( )  
P
=
+ 17 •109 2 10 1.25 •106  
( )( )  
SW  
(
)
(
)
10  
=0.26 + 0.43 = 0.69W  
5 2 2 /50  
( ) (  
)
PBOOST  
=
= 0.1W  
10  
P =10 0.001 = 0.01W  
(
)
Q
FREQUENCY COMPENSATION  
Total power dissipation, PTOT, is 0.69 + 0.1 + 0.01 = 0.8W.  
Before starting on the theoretical analysis of frequency  
response,thefollowingshouldberemembered—theworse  
the board layout, the more difficult the circuit will be to  
stabilize. This is true of almost all high frequency analog  
circuits, read the ‘LAYOUT CONSIDERATIONS’ section  
first. Common layout errors that appear as stability prob-  
lems are distant placement of input decoupling capacitor  
and/or catch diode, and connecting the VC compensation  
to a ground track carrying significant switch current. In  
addition,thetheoretical analysisconsidersonlyfirstorder  
ideal component behavior. For these reasons, it is impor-  
tant that a final stability check is made with production  
layout and components.  
Thermal resistance for the LT1765 16-lead TSSOP ex-  
posed pad package is influenced by the presence of  
internal or backside planes. With a full plane under the  
package, thermal resistance will be about 45°C/W. With  
no plane under the package, thermal resistance will in-  
crease to about 110°C/W. For the exposed pad package  
θJC(PAD) = 10°C/W. Thermal resistance is dominated by  
board performance. To calculate die temperature, use the  
appropriate thermal resistance number and add in worst-  
case ambient temperature:  
TJ = TA + θJA (PTOT  
)
When estimating ambient, remember the nearby catch  
diode will also be dissipating power.  
The LT1765 uses current mode control. This alleviates  
many of the phase shift problems associated with the  
inductor. The basic regulator loop is shown in Figure 7,  
with both tantalum and ceramic capacitor equivalent cir-  
cuits. TheLT1765canbeconsideredastwogm blocks, the  
error amplifier and the power stage.  
V V V  
( )( OUT )( LOAD  
=
I
)
F
IN  
PDIODE  
V
IN  
VF = Forward voltage of diode (assume 0.5V at 2A)  
0.5 10 5 2  
(
)(  
)( )  
LT1765  
PDIODE  
=
= 0.5W  
10  
CURRENT MODE  
POWER STAGE  
g = 5mho  
m
V
SW  
FB  
OUTPUT  
ERROR  
AMPLIFIER  
Notice that the catch diode’s forward voltage contributes  
a significant loss in the overall system efficiency. A larger,  
lower VF diode can improve efficiency by several percent.  
R1  
R2  
TANTALUM CERAMIC  
g
=
m
850µmho  
ESR  
C1  
ESL  
C1  
+
500k  
1.2V  
TypicalthermalresistanceoftheboardθB is35°C/W.Atan  
ambient temperature of 25°C,  
+
GND  
V
C
TJ = TA + θJA(PTOT) + θB(PDIODE  
)
R
C
C
F
TJ = 25 + 45 (0.8) + 35 (0.5) = 79°C  
C
C
1765 F07  
Figure 7. Model for Loop Response  
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Figure 8 shows the overall loop response with a 330pF VC  
capacitor and a typical 100µF tantalum output capacitor.  
The response is set by the following terms:  
ciently at the switching frequency, output ripple will  
perturb the VC pin enough to cause unstable duty cycle  
switching similar to subharmonic oscillation. This may  
not be apparent at the output. Small signal analysis will  
notshowthissinceacontinuoustimesystemisassumed.  
If needed, an additional capacitor (CF) can be added to the  
VC pin to form a pole at typically one fifth the switching  
frequency (If RC = ~ 5k, CF = ~ 100pF)  
Error amplifier:  
DC gain set by gm and RL = 850µ • 500k = 425.  
Pole set by CF and RL = (2π • 500k • 330p)–1 = 965Hz.  
Unity-gain set by CF and gm = (2π • 330p • 850µ–1)–1  
410kHz.  
=
When checking loop stability, the circuit should be oper-  
ated over the application’s full voltage, current and tem-  
perature range. Any transient loads should be applied and  
the output voltage monitored for a well-damped behavior.  
Power stage:  
DC gain set by gm and RL (assume 5) = 5 • 5 = 25.  
Pole set by COUT and RL = (2π • 100µ • 10)–1 = 159Hz.  
Unity-gainsetbyCOUT andgm =(2π 100µ5–1)–1 =8kHz.  
Tantalum output capacitor:  
CONVERTER WITH BACKUP OUTPUT REGULATOR  
Zero set by COUT and CESR = (2π • 100µ• 0.1)–1 = 15.9kHz.  
In systems with a primary and backup supply, for ex-  
ample, a battery powered device with a wall adapter input,  
the output of the LT1765 can be held up by the backup  
supply with its input disconnected. In this condition, the  
SW pin will source current into the VIN pin. If the SHDN pin  
is held at ground, only the shutdown current of 6µA will be  
pulled via the SW pin from the second supply. With the  
SHDN pin floating, the LT1765 will consume its quiescent  
operating current of 1mA. The VIN pin will also source  
current to any other components connected to the input  
line. If this load is greater than 10mA or the input could be  
shortedtoground, aseriesSchottkydiodemustbeadded,  
as shown in Figure 9. With these safeguards, the output  
can be held at voltages up to the VIN absolute maximum  
rating.  
The zero produced by the ESR of the tantalum output  
capacitor is very useful in maintaining stability. Ceramic  
output capacitors do not have a zero due to very low ESR,  
but are dominated by their ESL. They form a notch in the  
1MHzto10MHzrange. Withoutthiszero, theVC polemust  
be made dominant. A typical value of 2.2nF will achieve  
this.  
If better transient response is required, a zero can be  
added to the loop using a resistor (RC) in series with the  
compensation capacitor. As the value of RC is increased,  
transient response will generally improve, but two effects  
limit its value. First, the combination of output capacitor  
ESR and a large RC may stop loop gain rolling off  
altogether. Second, if the loop gain is not rolled suffi-  
80  
60  
180  
150  
120  
90  
V
C
C
= 5V  
BUCK CONVERTER WITH ADJUSTABLE SOFT-START  
OUT  
OUT  
C
= 100µF, 0.1Ω  
= 330pF  
Large capacitive loads or high input voltages can cause  
high input currents at start-up. Figure 10 shows a circuit  
that limits the dv/dt of the output at start-up, controlling  
the capacitor charge rate. The buck converter is a typical  
configuration with the addition of R3, R4, CSS and Q1. As  
the output starts to rise, Q1 turns on, regulating switch  
current via the VC pin to maintain a constant dv/dt at the  
output. Output rise time is controlled by the current  
through CSS defined by R4 and Q1’s VBE. Once the output  
is in regulation, Q1 turns off and the circuit operates  
normally. R3 is transient protection for the base of Q1.  
R /C = 0  
C
F
I
= 1A  
LOAD  
40  
PHASE  
GAIN  
20  
0
60  
–20  
–40  
30  
0
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
1765 F08  
Figure 8. Overall Loop Response  
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CMDSH-3  
0.18µF  
MBRS330T3*  
83k  
5µH  
BOOST  
REMOVABLE  
INPUT  
V
V
SW  
IN  
3.3V, 2A  
ALTERNATE  
SUPPLY  
LT1765-3.3  
SHDN  
SYNC GND  
FB  
V
C
28.5k  
2.2µF  
2.2nF  
4.7µF  
UPS120  
1765 F09  
* ONLY REQUIRED IF ADDITIONAL LOADS ON THE INPUT CAN SINK >10mA  
Figure 9. Dual Source Supply with 6µA Reverse Leakage  
D2  
CMDSH-3  
Dual Output Converter  
The circuit in Figure 11 generates both positive and  
negative 5V outputs with a single piece of magnetics. The  
two inductors shown are actually just two windings on a  
standard B H Electronics inductor. The topology for the 5V  
output is a standard buck converter. The 5V topology  
would be a simple flyback winding coupled to the buck  
converter if C4 were not present. C4 creates a SEPIC  
(single-ended primary inductance converter) topology  
which improves regulation and reduces ripple current in  
L1. Without C4, the voltage swing on L1B compared to  
L1A would vary due to relative loading and coupling  
losses. C4 provides a low impedance path to maintain an  
equal voltage swing in L1B, improving regulation. In a  
flybackconverter,duringswitchontime,alltheconverter’s  
energyisstoredinL1Aonly, sincenocurrentflowsinL1B.  
At switch off, energy is transferred by magnetic coupling  
into L1B, powering the 5V rail. C4 pulls L1B positive  
duringswitchontime, causingcurrenttoflow, andenergy  
to build in L1B and C4. At switch off, the energy stored in  
both L1B and C4 supply the –5V rail. This reduces the  
current in L1A and changes L1B current waveform from  
square to triangular. For details on this circuit, including  
maximum output currents, see Design Note 100.  
C2  
0.18µF  
L1  
5µH  
OUTPUT  
5V  
BOOST  
INPUT  
12V  
C3  
2.2µF  
V
IN  
V
SW  
1A  
+
C1  
LT1765-5  
SHDN  
SYNC GND  
D1  
100µF  
FB  
C
V
C
SS  
R3  
2k  
15nF  
Q1  
C
C
330pF  
1765 F10  
R4  
47k  
D1: UPS120  
Q1: 2N3904  
Figure 10. Buck Converter with Adjustable Soft Start  
(R4)(CSS)(VOUT  
(VBE)  
)
RiseTime =  
Using the values shown in Figure 10,  
(47 103)(15109)(5)  
RiseTime =  
= 5ms  
0.7  
The ramp is linear and rise times in the order of 100ms are  
possible. Since the circuit is voltage controlled, the ramp  
rate is unaffected by load characteristics and maximum  
outputcurrentisunchanged. Variantsofthiscircuitcanbe  
used for sequencing multiple regulator outputs.  
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D2  
CMDSH-3  
C2  
0.18µF  
L1A*  
BOOST  
OUTPUT  
INPUT  
12V  
V
V
IN  
SW  
FB  
5V AT 1.5A  
LT1765-5  
SHDN  
SYNC GND  
4.7µF  
6.3V  
CERAMIC  
V
C
C3  
2.2µF  
25V  
R
3.3k  
C
D1  
C
C
CERAMIC  
4700pF  
GND  
C4  
4.7µF  
4.7µF  
16V  
CERAMIC  
6.3V  
L1B*  
CERAMIC  
OUTPUT  
–5V AT 1.1A  
* L1 IS A SINGLE CORE WITH TWO WINDINGS  
COILTRONICS CTX5-1A  
D3  
1765 F11a  
IF LOAD CAN GO TO ZERO, AN OPTIONAL  
PRELOAD OF 1k TO 5k MAY BE USED TO  
IMPROVE LOAD REGULATION  
D1, D3: B220A  
Figure 11a. Dual Output Converter  
Max Negative Load vs  
Positive Load  
1200  
1000  
800  
600  
400  
200  
0
10  
100  
1000  
10000  
5V LOAD CURRENT (mA)  
1765 F11b  
Figure 11b. Dual Output Converter (Output Currents)  
sn1765 1765fas  
16  
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
W U U  
U
APPLICATIO S I FOR ATIO  
D2  
CMDSH-3  
C2  
0.22µF  
L1  
3µH  
BOOST  
INPUT  
V
V
IN  
SW  
FB  
5V  
U1  
LT1765-5  
SYNC  
SHDN  
C1  
D1  
B220A  
GND  
V
C
10µF  
6.3V X5R  
CERAMIC  
C3  
C
2.2µF  
C
1800pF  
16V X5R  
C
F
CERAMIC  
R
100pF  
C
2.4k  
OUTPUT  
–5V AT 1A  
L1: CDRH6D28-3R0  
1765 F12  
Figure 12. Positive-to-Negative Low Output Ripple Converter  
D2  
CMDSH-3  
INPUT  
–5V  
C2  
0.22µF  
L1  
2.5µH  
BOOST  
V
V
IN  
SW  
FB  
U1  
LT1765FE  
SYNC  
SHDN  
D1  
UPS120  
C1  
2.2µF  
GND  
V
C
6.3V X5R  
C3  
R2  
10k  
R1  
64.9k  
C
22µF  
C
4700pF  
16V X5R  
CERAMIC  
C
F
R
100pF  
C
6.8k  
OUTPUT  
–9V AT 1A  
L1: CDRH5D28-2R5  
BOLD LINES INDICATE HIGH CURRENT PATHS  
1765 F13  
Figure 13. Negative Boost Converter  
sn1765 1765fas  
17  
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
U
PACKAGE DESCRIPTIO  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663,  
Exposed Pad Variation BB)  
4.95 – 5.05*  
(.196 – .204)  
3.8  
(.149)  
16 1514 13 12 1110  
9
6.60 ±0.10  
EXPOSED  
PAD HEAT SINK  
ON BOTTOM OF  
PACKAGE  
4.50 ±0.10  
3.0  
(.118)  
6.25 – 6.50  
(.246 – .256)  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD  
1.15  
(.0453)  
MAX  
4.30 – 4.48*  
(.169 – .176)  
0° – 8°  
0.65  
(.0256)  
BSC  
0.50 – 0.70  
(.020 – .028)  
0.105 – 0.180  
(.0041 – .0071)  
0.05 – 0.15  
(.002 – .006)  
FE16 TSSOP 1101  
0.195 – 0.30  
(.0077 – .0118)  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS  
MILLIMETERS  
2. DIMENSIONS ARE IN  
(INCHES)  
3. DRAWING NOT TO SCALE  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
sn1765 1765fas  
18  
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
U
PACKAGE DESCRIPTIO  
S8 Package  
8-Lead Plastic Small Outline (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1610)  
0.189 – 0.197*  
(4.801 – 5.004)  
7
5
8
6
0.150 – 0.157**  
(3.810 – 3.988)  
0.228 – 0.244  
(5.791 – 6.197)  
1
3
4
2
0.010 – 0.020  
(0.254 – 0.508)  
× 45°  
0.053 – 0.069  
(1.346 – 1.752)  
0.004 – 0.010  
(0.101 – 0.254)  
0.008 – 0.010  
(0.203 – 0.254)  
0°– 8° TYP  
0.016 – 0.050  
(0.406 – 1.270)  
0.050  
(1.270)  
BSC  
0.014 – 0.019  
(0.355 – 0.483)  
TYP  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
SO8 1298  
sn1765 1765fas  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
19  
LT1765/LT1765-1.8/LT1765-2.5/  
LT1765-3.3/LT1765-5  
RELATED PARTS  
PART NUMBER  
LT1370  
DESCRIPTION  
COMMENTS  
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LT1371  
35V, 3A, 500kHz Switch  
LT1372/LT1377 500kHz and 1MHz High Efficiency 1.5A Switching Regulators  
LT1374 High Efficiency Step-Down Switching Regulator  
LT1375/LT1376 1.5A Step-Down Switching Regulators  
Boost Topology  
25V, 4.5A, 500kHz Switch  
500kHz, Synchronizable in SO-8 Package  
500kHz, 4V to 16V Input, SO-8 Package  
200kHz, Reduced EMI Generation  
200kHz, Reduced EMI Generation  
1.4MHz, 4V to 25V Input, ThinSOTTM Package  
60V Input, 700mA Internal Switches, N8, S8  
Burst Mode® Operation, 16-Pin Narrow SSOP  
LT1507  
LT1576  
LT1578  
LT1616  
1.5A Step-Down Switching Regulator  
1.5A Step-Down Switching Regulator  
1.5A Step-Down Switching Regulator  
600mA Step-Down Switching Regulator  
LT1676/LT1776 Wide Input Range Step-Down Switching Regulators  
LTC1735 High Efficiency Synchronous Step-Down, N-Ch Drive  
LT1766/LT1766-5 Wide Input Range, 1.5A, Step-Down Regulator  
200kHz, V = 5.5V to 60V, SSOP-16, TSSOP-16E  
IN  
LT1767  
1.5A Step-Down Switching Regulator  
1.25MHz, 1.5A, 25V Input, MS8 Package  
LTC1877  
LTC1878  
High Efficiency Monolithic Step-Down Regulator  
High Efficiency Monolithic Step-Down Regulator  
550kHz, MS8, V Up to 10V, I =10µA, I  
to 600mA at V = 5V  
IN  
IN  
Q
OUT  
OUT  
550kHz, MS8, V Up to 6V, I = 10µA, I  
to 600mA at V = 3.3V  
IN  
IN  
Q
LT1956/LT1956-5 Wide Input Range, 1.5A, Step-Down Regulator  
500kHz, V = 5.5V to 60V, Adjustable Fixed 5V,  
SSOP-16, TSSOP-16E  
IN  
LTC3401  
LTC3402  
LTC3404  
Single Cell, High Current (1A), Micropower, Synchronous 3MHz  
Step-Up DC/DC Converter  
V = 0.5V to 5V, Up to 97% Efficiency Synchronizable  
IN  
Oscillator from 100kHz to 3MHz, MS10  
Single Cell, High Current (2A), Micropower, Synchronous 3MHz  
Step-Up DC/DC Converter  
V
IN  
= 0.7V to 5V, Up to 95% Efficiency Synchronizable  
Oscillator from 100kHz to 3MHz, MS10  
1.4MHz High Efficiency, Monolithic Synchronous Step-Down  
Regulator  
Up to 95% Efficiency, 100% Duty Cycle, I = 10µA,  
Q
V
= 2.65V to 6V, MS8  
IN  
Burst Mode is a registered trademark of Linear Technology Corporation.  
ThinSOT is a trademark of Linear Technology Corporation.  
sn1765 1765fas  
LT/TP 0802 1.5K REV A • PRINTED IN USA  
20 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2001  

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