LT3012 [Linear]
250mA, 4V to 80V Low Dropout Micropower Linear Regulator; 250毫安， 4V至80V低压差微功耗线性稳压器
| 型号： | LT3012 |
| 厂家： | 
Linear |
| 描述： | 250mA, 4V to 80V Low Dropout Micropower Linear Regulator |
| 文件： | 总16页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LT3012
250mA, 4V to 80V
Low Dropout
Micropower Linear Regulator
DESCRIPTION
FEATURES
The LT®3012 is a high voltage, micropower low dropout
linearregulator.Thedeviceiscapableofsupplying250mAof
output current with a dropout voltage of 400mV. Designed
foruseinbattery-poweredorhighvoltagesystems,thelow
quiescent current (40μA operating and 1μA in shutdown)
makes the LT3012 an ideal choice. Quiescent current is
also well controlled in dropout.
n
Wide Input Voltage Range: 4V to 80V
n
Low Quiescent Current: 40μA
n
Low Dropout Voltage: 400mV
n
Output Current: 250mA
n
No Protection Diodes Needed
n
Adjustable Output from 1.24V to 60V
n
1μA Quiescent Current in Shutdown
n
Stable with 3.3μF Output Capacitor
Other features of the LT3012 include the ability to operate
with very small output capacitors. The regulator is stable
with only 3.3μF on the output while most older devices
require between 10μF and 100μF for stability. Small ce-
ramic capacitors can be used without any need for series
resistance (ESR) as is common with other regulators.
Internal protection circuitry includes reverse-battery
protection, current limiting, thermal limiting and reverse
current protection.
n
Stable with Aluminum, Tantalum or Ceramic
Capacitors
Reverse-Battery Protection
n
n
No Reverse Current Flow from Output to Input
n
Thermal Limiting
n
Thermally Enhanced 16-Lead TSSOP and
12-Pin (4mm × 3mm) DFN Packages
APPLICATIONS
The device is available with an adjustable output with a
1.24V reference voltage. The LT3012 regulator is available
in the 16-lead TSSOP and 12 pin low profile (0.75mm)
(4mm × 3mm) DFN packages with an exposed pad for
enhanced thermal handling capability.
n
Low Current High Voltage Regulators
n
Regulator for Battery-Powered Systems
n
Telecom Applications
n
Automotive Applications
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
5V Supply with Shutdown
Dropout Voltage
400
V
OUT
350
300
250
200
150
100
50
IN
OUT
ADJ
5V
250mA
V
IN
LT3012
750k
249k
5.4V TO
80V
3.3μF
1μF
SHDN
GND
3012 TA01
V
SHDN
OUTPUT
<0.3V
>2.0V
OFF
ON
0
50
100
150
250
0
200
OUTPUT CURRENT (mA)
3012 TA02
3012fd
1
LT3012
(Note 1)
ABSOLUTE MAXIMUM RATINGS
IN Pin Voltage ......................................................... 80V
OUT Pin Voltage...................................................... 60V
IN to OUT Differential Voltage ................................. 80V
ADJ Pin Voltage ........................................................ 7V
SHDN Pin Input Voltage.......................................... 80V
Output Short-Circuit Duration .......................... Indefinite
Storage Temperature Range
TSSOP Package.................................–65°C to 150°C
DFN Package......................................–65°C to 125°C
Operating Junction Temperature Range
(Notes 3, 10, 11)
LT3012E.............................................–40°C to 125°C
LT3012HFE.........................................–40°C to 140°C
Lead Temperature (FE16 Soldering, 10 sec) ......... 300°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
GND
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
NC
NC
OUT
OUT
ADJ
GND
NC
1
2
3
4
5
6
12 NC
11 IN
10 IN
OUT
OUT
ADJ
GND
NC
IN
IN
13
17
9
8
7
NC
NC
SHDN
NC
SHDN
NC
GND
GND
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
FE PACKAGE
16-LEAD PLASTIC TSSOP
= 140°C, θ = 40°C/W, θ = 16°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
T
= 125°C, θ = 40°C/W, θ = 16°C/W
JA JC
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
JMAX
T
JMAX
JA JC
ORDER INFORMATION
LEAD FREE FINISH
LT3012EDE#PBF
LT3012EFE#PBF
LT3012HFE#PBF
LEAD BASED FINISH
LT3012EDE
TAPE AND REEL
LT3012EDE#TRPBF
LT3012EFE#TRPBF
LT3012HFE#TRPBF
TAPE AND REEL
LT3012EDE#TR
PART MARKING
3012
PACKAGE DESCRIPTION
12-Lead (4mm × 3mm) Plastic DFN
TEMPERATURE RANGE
–40°C to 125°C
3012EFE
16-Lead Plastic TSSOP
–40°C to 125°C
–40°C to 140°C
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 140°C
3012HFE
PART MARKING
3012
16-Lead Plastic TSSOP
PACKAGE DESCRIPTION
12-Lead (4mm × 3mm) Plastic DFN
16-Lead Plastic TSSOP
LT3012EFE
LT3012EFE#TR
3012EFE
LT3012HFE
LT3012HFE#TR
3012HFE
16-Lead Plastic TSSOP
Consult LTC Marketing for parts specified with wider operating temperature ranges.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3012fd
2
LT3012
(LT3012E)
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the –40°C to 125°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
= 250mA
MIN
TYP
MAX
UNITS
l
Minimum Input Voltage
ADJ Pin Voltage (Notes 2, 3)
I
4
4.75
V
LOAD
V
= 4V, I
= 1mA
LOAD
1.225
1.2
1.24
1.24
1.255
1.28
V
V
IN
l
l
4.75V < V < 80V, 1mA < I
< 250mA
IN
LOAD
Line Regulation
ΔV = 4V to 80V, I
IN
= 1mA (Note 2)
0.1
7
5
mV
LOAD
Load Regulation (Note 2)
V
IN
V
IN
= 4.75V, ΔI
= 4.75V, ΔI
= 1mA to 250mA
= 1mA to 250mA
12
25
mV
mV
LOAD
LOAD
l
l
l
Dropout Voltage
I
I
= 10mA
= 10mA
160
250
400
230
300
mV
mV
LOAD
LOAD
V
= V
(Notes 4, 5)
OUT(NOMINAL)
IN
I
I
= 50mA
= 50mA
340
420
mV
mV
LOAD
LOAD
I
I
= 250mA
= 250mA
490
620
mV
mV
LOAD
LOAD
l
l
GND Pin Current
= 4.75V (Notes 4, 6)
I
I
I
= 0mA
= 100mA
= 250mA
40
3
10
100
μA
mA
mA
LOAD
LOAD
LOAD
V
IN
l
18
Output Voltage Noise
ADJ Pin Bias Current
Shutdown Threshold
C
= 10μF, I
= 250mA, BW = 10Hz to 100kHz
100
30
μV
RMS
OUT
LOAD
(Note 7)
100
2
nA
l
l
V
OUT
V
OUT
= Off to On
= On to Off
1.3
0.8
V
V
0.3
SHDN Pin Current (Note 8)
V
SHDN
V
SHDN
= 0V
= 6V
0.3
0.1
2
1
μA
μA
Quiescent Current in Shutdown
Ripple Rejection
V
= 6V, V
= 0V
SHDN
1
5
μA
dB
IN
IN
V
= 7V(Avg), V
= 0.5V
f
= 120Hz, I = 250mA
LOAD
65
75
RIPPLE
P-P, RIPPLE
Current Limit
V
IN
V
IN
= 7V, V
= 0V
OUT
400
mA
mA
l
= 4.75V, ΔV
= –0.1V (Note 2)
250
OUT
Reverse Output Current (Note 9)
V
OUT
= 1.24V, V < 1.24V (Note 2)
12
25
μA
IN
(LT3012H)
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the –40°C to 140°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
= 200mA
MIN
TYP
MAX
UNITS
l
Minimum Input Voltage
ADJ Pin Voltage (Notes 2, 3)
I
4
4.75
V
LOAD
V
= 4V, I
= 1mA
LOAD
1.225
1.2
1.24
1.24
1.255
1.28
V
V
IN
l
l
4.75V < V < 80V, 1mA < I
< 200mA
LOAD
IN
Line Regulation
ΔV = 4V to 80V, I
IN
= 1mA (Note 2)
0.1
6
5
mV
LOAD
Load Regulation (Note 2)
V
IN
V
IN
= 4.75V, ΔI
= 4.75V, ΔI
= 1mA to 200mA
= 1mA to 200mA
12
30
mV
mV
LOAD
LOAD
l
l
l
Dropout Voltage
I
I
= 10mA
= 10mA
160
250
360
230
320
mV
mV
LOAD
LOAD
V
= V
(Notes 4, 5)
OUT(NOMINAL)
IN
I
I
= 50mA
= 50mA
340
450
mV
mV
LOAD
LOAD
I
I
= 200mA
= 200mA
490
630
mV
mV
LOAD
LOAD
l
l
GND Pin Current
= 4.75V (Notes 4, 6)
I
I
I
= 0mA
= 100mA
= 200mA
40
3
7
110
μA
mA
mA
LOAD
LOAD
LOAD
V
IN
l
18
3012fd
3
LT3012
(LT3012H)
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the –40°C to 140°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
= 10μF, I
MIN
TYP
100
30
MAX
UNITS
Output Voltage Noise
ADJ Pin Bias Current
Shutdown Threshold
C
= 200mA, BW = 10Hz to 100kHz
μV
RMS
OUT
LOAD
(Note 7)
100
2
nA
l
l
V
OUT
V
OUT
= Off to On
= On to Off
1.3
0.8
V
V
0.3
SHDN Pin Current (Note 8)
V
SHDN
V
SHDN
= 0V
= 6V
0.3
0.1
2
1
μA
μA
Quiescent Current in Shutdown
Ripple Rejection
V
= 6V, V
= 0V
SHDN
1
5
μA
dB
IN
IN
V
= 7V(Avg), V
= 0.5V , f
= 120Hz, I = 200mA
LOAD
65
75
RIPPLE
P-P RIPPLE
Current Limit
V
IN
V
IN
= 7V, V
= 0V
OUT
400
mA
mA
l
= 4.75V, ΔV
= –0.1V (Note 2)
200
OUT
Reverse Output Current (Note 9)
V
OUT
= 1.24V, V < 1.24V (Note 2)
12
25
μA
IN
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 6: GND pin current is tested with V = 4.75V and a current source
IN
load. This means the device is tested while operating close to its dropout
region. This is the worst-case GND pin current. The GND pin current will
decrease slightly at higher input voltages.
Note 2: The LT3012 is tested and specified for these conditions with the
ADJ pin connected to the OUT pin.
Note 7: ADJ pin bias current flows into the ADJ pin.
Note 8: SHDN pin current flows out of the SHDN pin.
Note 3: Operating conditions are limited by maximum junction
temperature. The regulated output voltage specification will not apply
for all possible combinations of input voltage and output current. When
operating at maximum input voltage, the output current range must be
limited. When operating at maximum output current, the input voltage
range must be limited.
Note 4: To satisfy requirements for minimum input voltage, the LT3012
is tested and specified for these conditions with an external resistor
divider (249k bottom, 649k top) for an output voltage of 4.5V. The external
resistor divider will add a 5μA DC load on the output.
Note 9: Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the rated output voltage. This current flows into the OUT
pin and out the GND pin.
Note 10: The LT3012E is guaranteed to meet performance specifications
from 0°C to 125°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LT3012H is tested to the LT3012H Electrical Characteristics table at
140°C operating junction temperature. High junction temperatures degrade
operating lifetimes. Operating lifetime is derated at junction temperatures
greater than 125°C.
Note 5: Dropout voltage is the minimum input to output voltage differential
needed to maintain regulation at a specified output current. In dropout, the
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C (LT3012E) or 140°C (LT3012H) when
overtemperature protection is active. Continuous operation above the
specified maximum operating junction temperature may impair device
reliability.
output voltage will be equal to (V – V
).
IN
DROPOUT
3012fd
4
LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
Typical Dropout Voltage
Guaranteed Dropout Voltage
Dropout Voltage
600
500
400
300
200
100
0
600
500
600
500
400
300
200
100
0
= TEST POINTS
T
≤ 125°C
J
T
= 125°C
J
I
= 250mA
L
I
L
= 100mA
400
300
T
≤ 25°C
J
T
J
= 25°C
I
= 50mA
L
I
= 10mA
= 1mA
L
200
100
0
I
L
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
–25
0
50
100
150
200
250
0
50
100
150
200
250
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
3012 G03
3012 G02
3012 G01
Quiescent Current
ADJ Pin Voltage
Quiescent Current
100
90
80
70
60
50
40
30
20
10
0
1.260
80
70
60
50
40
30
20
10
0
V
= 6V
= ∞
IN
L
= 0
I = 1mA
L
T
= 25°C
= ∞
J
L
OUT
R
R
1.255
1.250
I
L
V
= 1.24V
1.245
1.240
1.235
1.230
1.225
V
= V
IN
SHDN
V
SHDN
= V
IN
V
SHDN
= GND
V
SHDN
= GND
6
1.220
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G04
–25
–50
0
25
50
TEMPERATURE (°C)
75 100
125 150
–25
0
1
2
3
4
5
7
8
9
10
INPUT VOLTAGE (V)
3012 G05
3012 G06
Quiescent Current
GND Pin Current
GND Pin Current
250
225
200
175
150
125
100
75
1.2
1.0
0.8
0.6
0.4
0.2
0
10
9
8
7
6
5
4
3
2
1
0
T
= 25°C
T
= 25°C, *FOR V
= 1.24V
R
J
L
T
= 25°C
J
OUT
J
R
=
∞
*FOR V
= 1.24V
OUT
V
= 1.24V
OUT
R
I
= 49.6Ω
= 25mA*
= 4.96Ω
L
L
L
I
= 250mA*
L
R
L
= 124Ω
= 10mA*
L
V
SHDN
= V
IN
I
R
L
= 12.4Ω
= 100mA*
L
I
V
SHDN
= GND
R
L
I
L
= 1.24k
= 1mA*
50
25
R
= 24.8Ω, I = 50mA*
L
L
0
0
10 20 30 40 50 60 70 80
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
3012 G07
3012 G08
3012 G09
3012fd
5
LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
GND Pin Current vs ILOAD
SHDN Pin Threshold
SHDN Pin Current
0.6
0.5
0.4
0.3
0.2
0.1
0
10
9
8
7
6
5
4
3
2
1
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
T
= 25°C
V
J
= 4.75V
J
IN
CURRENT FLOWS
T
= 25°C
OUT OF SHDN PIN
V
= 1.24V
OUT
OFF-TO-ON
ON-TO-OFF
0
0.5
1.0
1.5
2.0
2.5
3.0
0
50
100
150
200
250
–50
0
25 50 75
125 150
100
–25
SHDN PIN VOLTAGE (V)
LOAD CURRENT (mA)
TEMPERATURE (°C)
3012 G12
3012 G10
3012 G11
SHDN Pin Current
ADJ Pin Bias Current
Current Limit
120
100
80
0.6
0.5
0.4
0.3
0.2
0.1
0
1000
900
800
700
600
500
400
300
200
100
0
V
OUT
= 0V
V
V
= 6V
IN
SHDN
= 0V
CURRENT FLOWS
OUT OF SHDN PIN
T
= 25°C
J
T
= 125°C
J
60
40
20
0
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G14
–25
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G13
0
10 20 30 40 50 60 70 80
–25
INPUT VOLTAGE (V)
3012 G15
Current Limit
Reverse Output Current
Reverse Output Current
700
600
500
400
300
200
100
0
120
100
80
200
180
160
140
120
100
80
V
V
= 0V
= V
T
V
V
= 25°C
= 0V
IN
OUT
J
IN
= 1.24V
ADJ
= V
OUT
ADJ
60
ADJ
CURRENT FLOWS
INTO OUTPUT PIN
PIN CLAMP
(SEE APPLICATIONS
INFORMATION)
40
60
40
20
0
V
V
= 7V
IN
OUT
20
= 0V
0
–50
–25
0
25 50 75 100 125 150
TEMPERATURE (°C)
0
1
2
3
4
5
6
7
8
9
10
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
–25
OUTPUT VOLTAGE (V)
3012 G18
3012 G16
3012 G17
3012fd
6
LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
Input Ripple Rejection
Input Ripple Rejection
Minimum Input Voltage
100
90
92
88
84
80
76
72
68
64
60
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
LOAD
= 4.75V + 50mV
RIPPLE
RMS
I
= 250mA
IN
LOAD
I
= 250mA
80
70
60
50
C
OUT
= 10μF
40
30
20
10
0
V
I
= 4.75V + 0.5V RIPPLE AT f = 120Hz
P-P
IN
L
= 250mA
C
OUT
= 3.3μF
V
= 1.24V
OUT
10
100
1k
10k
100k
1M
–50
–25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G21
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
–25
FREQUENCY (Hz)
3012 G20
3012 G19
Load Regulation
Output Noise Spectral Density
10
1
0
C
I
= 3.3μF
= 250mA
ΔI = 1mA TO 250mA
L
OUT
–2
–4
LOAD
–6
–8
–10
–12
–14
–16
–18
–20
0.1
0.01
–50
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G22
–25
10
100
1k
FREQUENCY (Hz)
10k
100k
3012 G23
10Hz to 100kHz Output Noise
Transient Response
0.15
0.10
0.05
0
V
OUT
–0.05
–0.10
–0.15
300
200
100
0
100μV/DIV
V
V
C
C
= 6V
= 5V
= 3.3μF CERAMIC
IN
OUT
IN
= 3.3μF CERAMIC
LOAD
OUT
ΔI
= 100mA TO 200mA
3012 G24
C
I
= 10μF
1ms/DIV
OUT
L
OUT
= 250mA
V
= 1.24V
0
100
200
300
400
500
TIME (μs)
3012 G25
3012fd
7
LT3012
PIN FUNCTIONS (DFN Package/TSSOP Package)
NC (Pins 1, 6, 7, 9, 12)/(Pins 2, 7, 10, 12, 15): No Con-
nect. These pins have no internal connection; connecting
NC pins to a copper area for heat dissipation provides a
small improvement in thermal performance.
SHDN (Pin 8)/(Pin 11): Shutdown. The SHDN pin is used
to put the LT3012 into a low power shutdown state. The
output will be off when the SHDN pin is pulled low. The
SHDNpincanbedriveneitherby5Vlogicoropen-collector
logic with a pull-up resistor. The pull-up resistor is only
required to supply the pull-up current of the open-collec-
tor gate, normally several microamperes. If unused, the
OUT (Pins 2, 3)/(Pins 3, 4): Output.The output supplies
power to the load. A minimum output capacitor of 3.3μF
is required to prevent oscillations. Larger output capaci-
tors will be required for applications with large transient
loadstolimitpeakvoltagetransients. SeetheApplications
Information section for more information on output ca-
pacitance and reverse output characteristics.
SHDN pin must be tied to a logic high or to V .
IN
IN (Pins 10, 11)/(Pins 13,14): Input. Power is supplied
to the device through the IN pin. A bypass capacitor is
required on this pin if the device is more than six inches
away from the main input filter capacitor. In general, the
output impedance of a battery rises with frequency, so it is
advisabletoincludeabypasscapacitorinbattery-powered
circuits. A bypass capacitor in the range of 1μF to 10μF is
sufficient. The LT3012 is designed to withstand reverse
voltages on the IN pin with respect to ground and the OUT
pin. In the case of a reversed input, which can happen if
a battery is plugged in backwards, the LT3012 will act as
if there is a diode in series with its input. There will be no
reverse current flow into the LT3012 and no reverse volt-
age will appear at the load. The device will protect both
itself and the load.
ADJ (Pin 4)/(Pin 5): Adjust. This is the input to the error
amplifier. This pin is internally clamped to 7V. It has a
bias current of 30nA which flows into the pin (see curve
of ADJ Pin Bias Current vs Temperature in the Typical
Performance Characteristics). The ADJ pin voltage is
1.24V referenced to ground, and the output voltage range
is 1.24V to 60V.
GND (Pins 5, 13)/(Pins 1, 6, 8, 9, 16, 17): Ground. The
exposedbacksideofthepackageisanelectricalconnection
forGND.Assuch,toensureoptimumdeviceoperationand
thermalperformance,theexposedpadmustbeconnected
directly to pin 5/pin 6 on the PC board.
APPLICATIONS INFORMATION
The LT3012 is a 250mA high voltage low dropout regula-
tor with micropower quiescent current and shutdown.
The device is capable of supplying 250mA at a dropout
voltage of 400mV. The low operating quiescent current
(40μA) drops to 1μA in shutdown. In addition to the
low quiescent current, the LT3012 incorporates several
protection features which make it ideal for use in bat-
tery-powered systems. The device is protected against
both reverse input and reverse output voltages. In battery
backup applications where the output can be held up by
a backup battery when the input is pulled to ground, the
LT3012 acts like it has a diode in series with its output
and prevents reverse current flow.
Adjustable Operation
The LT3012 has an output voltage range of 1.24V to 60V.
The output voltage is set by the ratio of two external resis-
tors as shown in Figure 1. The device servos the output to
maintain the voltage at the adjust pin at 1.24V referenced
to ground. The current in R1 is then equal to 1.24V/R1
and the current in R2 is the current in R1 plus the ADJ
pin bias current. The ADJ pin bias current, 30nA at 25°C,
flows through R2 into the ADJ pin. The output voltage
can be calculated using the formula in Figure 1. The value
of R1 should be less than 250k to minimize errors in the
output voltage caused by the ADJ pin bias current. Note
that in shutdown the output is turned off and the divider
current will be zero.
3012fd
8
LT3012
APPLICATIONS INFORMATION
improved transient response for larger load current
changes. Bypass capacitors, used to decouple individual
components powered by the LT3012, will increase the
effective output capacitor value.
V
OUT
IN
OUT
+
LT3012
R2
V
IN
ADJ
3012 F01
R1
GND
Extra consideration must be given to the use of ceramic
capacitors. Ceramic capacitors are manufactured with a
variety of dielectrics, each with different behavior across
temperature and applied voltage. The most common
dielectrics used are specified with EIA temperature char-
acteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and
Y5V dielectrics are good for providing high capacitances
in a small package, but they tend to have strong voltage
and temperature coefficients as shown in Figures 2 and 3.
When used with a 5V regulator, a 16V 10μF Y5V capacitor
can exhibit an effective value as low as 1μF to 2μF for the
DC bias voltage applied and over the operating tempera-
ture range. The X5R and X7R dielectrics result in more
stable characteristics and are more suitable for use as the
output capacitor. The X7R type has better stability across
temperature, while the X5R is less expensive and is avail-
able in higher values. Care still must be exercised when
using X5R and X7R capacitors; the X5R and X7R codes
only specify operating temperature range and maximum
capacitancechangeovertemperature.Capacitancechange
due to DC bias with X5R and X7R capacitors is better than
Y5VandZ5Ucapacitors,butcanstillbesignificantenough
to drop capacitor values below appropriate levels. Capaci-
tor DC bias characteristics tend to improve as component
casesizeincreases, butexpectedcapacitanceatoperating
voltage should be verified.
R2
R1
V
= 1.24V 1 +
= 1.24V
+ (I )(R2)
ADJ
OUT
V
I
ADJ
ADJ
= 30nA AT 25°C
OUTPUT RANGE = 1.24V TO 60V
Figure 1. Adjustable Operation
The adjustable device is tested and specified with the
ADJ pin tied to the OUT pin and a 5μA DC load (unless
otherwise specified) for an output voltage of 1.24V. Speci-
fications for output voltages greater than 1.24V will be
proportional to the ratio of the desired output voltage to
1.24V; (V /1.24V). For example, load regulation for an
OUT
outputcurrentchangeof1mAto250mAis–7mVtypicalat
V
OUT
= 1.24V. At V
= 12V, load regulation is:
OUT
(12V/1.24V) • (–7mV) = –68mV
Output Capacitance and Transient Response
The LT3012 is designed to be stable with a wide range of
output capacitors. The ESR of the output capacitor affects
stability, most notably with small capacitors. A minimum
output capacitor of 3.3μF with an ESR of 3Ω or less is
recommended to prevent oscillations. The LT3012 is a
micropower device and output transient response will be
a function of output capacitance. Larger values of output
capacitance decrease the peak deviations and provide
40
20
20
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
0
X5R
0
–20
X5R
–20
–40
–40
Y5V
–60
–60
Y5V
–80
–80
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
–100
–100
0
8
12 14
2
4
6
10
16
–50
25
50
75
100 125
–25
0
DC BIAS VOLTAGE (V)
TEMPERATURE (°C)
3012 F02
3012 F03
Figure 2. Ceramic Capacitor DC Bias Characteristics
Figure 3. Ceramic Capacitor Temperature Characteristics
3012fd
9
LT3012
APPLICATIONS INFORMATION
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltageacrossitsterminalsduetomechanicalstress,simi-
lartothewayapiezoelectricaccelerometerormicrophone
works. For a ceramic capacitor the stress can be induced
by vibrations in the system or thermal transients.
normal conditions the maximum junction temperature
rating of 125°C (E-Grade) or 140°C (H-Grade)must not
be exceeded. It is important to give careful consideration
to all sources of thermal resistance from junction to ambi-
ent. Additional heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
Current Limit and Safe Operating Area Protection
Like many IC power regulators, the LT3012 has safe oper-
ating area protection. The safe operating area protection
decreases the current limit as the input voltage increases
and keeps the power transistor in a safe operating region.
Theprotectionisdesignedtoprovidesomeoutputcurrent
at all values of input voltage up to the device breakdown
(see curve of Current Limit vs Input Voltage in the Typical
Performance Characteristics).
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. DFN Measured Thermal Resistance
COPPER AREA
TOPSIDE
THERMAL RESISTANCE
TheLT3012islimitedforoperatingconditionsbymaximum
junction temperature. While operating at maximum input
voltage, the output current range must be limited; when
operating at maximum output current, the input voltage
range must be limited. Device specifications will not apply
for all possible combinations of input voltage and output
current. OperatingtheLT3012beyondthemaximumjunc-
tion temperature rating may impair the life of the device.
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
(JUNCTION-TO-AMBIENT)
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
40°C/W
45°C/W
50°C/W
62°C/W
Table 2. TSSOP Measured Thermal Resistance
COPPER AREA
TOPSIDE
THERMAL RESISTANCE
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
(JUNCTION-TO-AMBIENT)
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
40°C/W
Thermal Considerations
45°C/W
The power handling capability of the device will be limited
by the maximum rated junction temperature of (125°C for
LT3012E, or 140°C for LT3012HFE). The power dissipated
by the device will be made up of two components:
50°C/W
62°C/W
The thermal resistance junction-to-case (θ ), measured
JC
1. Output current multiplied by the input/output voltage
at the exposed pad on the back of the die, is 16°C/W.
differential: I
• (V – V ) and,
OUT
IN OUT
Continuous operation at large input/output voltage dif-
ferentials and maximum load current is not practical
due to thermal limitations. Transient operation at high
input/output differentials is possible. The approximate
thermal time constant for a 2500sq mm 3/32" FR-4 board
with maximum topside and backside area for one ounce
copper is 3 seconds. This time constant will increase as
more thermal mass is added (i.e., vias, larger board, and
other components).
2. GND pin current multiplied by the input voltage:
• V .
I
GND
IN
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Character-
istics. Power dissipation will be equal to the sum of the
two components listed above.
The LT3012 has internal thermal limiting designed to pro-
tectthedeviceduringoverloadconditions. Forcontinuous
3012fd
10
LT3012
APPLICATIONS INFORMATION
Foranapplicationwithtransienthighpowerpeaks,average
power dissipation can be used for junction temperature
calculationsaslongasthepulseperiodissignificantlyless
than the thermal time constant of the device and board.
P3(72V in, 5mA load) = 5mA • (72V – 5V)
+ (200μA • 72V) = 0.35W
P4(72V in, 50mA load) = 50mA • (72V – 5V)
+ (1mA • 72V) = 3.42W
Calculating Junction Temperature
Operation at the different power levels is as follows:
Example 1: Given an output voltage of 5V, an input volt-
age range of 24V to 30V, an output current range of 0mA
to 50mA, and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
76% operation at P1, 19% for P2, 4% for P3, and
1% for P4.
P
EFF
= 76%(0.23W) + 19%(2.20W) + 4%(0.35W)
+ 1%(3.42W) = 0.64W
The power dissipated by the device will be equal to:
With a thermal resistance in the range of 40°C/W to
62°C/W, this translates to a junction temperature rise
above ambient of 26°C to 38°C.
I
• (V
– V ) + (I
• V
)
OUT(MAX)
IN(MAX)
OUT
GND
IN(MAX)
where:
I
= 50mA
= 30V
High Temperature Operation
OUT(MAX)
V
CaremustbetakenwhendesigningLT3012applicationsto
operate at high ambient temperatures. The LT3012 works
at elevated temperatures but erratic operation can occur
duetounforeseenvariationsinexternalcomponents.Some
tantalum capacitors are available for high temperature
operation, but ESR is often several ohms; capacitor ESR
above 3Ω is unsuitable for use with the LT3012. Ceramic
capacitor manufacturers (Murata, AVX, TDK, and Vishay
Vitramonatthiswriting)nowofferceramiccapacitorsthat
areratedto150°CusinganX8Rdielectric.Deviceinstability
will occur if output capacitor value and ESR are outside
design limits at elevated temperature and operating DC
voltage bias (see information on capacitor characteristics
underOutputCapacitanceandTransientResponse).Check
each passive component for absolute value and voltage
ratings over the operating temperature range.
IN(MAX)
I
at (I
= 50mA, V = 30V) = 1mA
GND
OUT IN
So:
P = 50mA • (30V – 5V) + (1mA • 30V) = 1.28W
The thermal resistance will be in the range of 40°C/W to
62°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
1.31W • 50°C/W = 65.5°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
= 50°C + 65.5°C = 115.5°C
JMAX
Example 2: Given an output voltage of 5V, an input voltage
of 48V that rises to 72V for 5ms(max) out of every 100ms,
and a 5mA load that steps to 50mA for 50ms out of every
250ms, what is the junction temperature rise above ambi-
ent? Using a 500ms period (well under the time constant
of the board), power dissipation is as follows:
Leakages in capacitors or from solder flux left after
insuficient board cleaning adversely affects low
quiescent current operation. The output voltage resistor
divider should use a maximum bottom resistor value of
124k to compensate for high temperature leakage, setting
divider current to 10μA. Consider junction temperature
increase due to power dissipation in both the junction and
nearbycomponentstoensuremaximumspecificationsare
not violated for the device or external components.
P1(48V in, 5mA load) = 5mA • (48V – 5V)
+ (200μA • 48V) = 0.23W
P2(48V in, 50mA load) = 50mA • (48V – 5V)
+ (1mA • 48V) = 2.20W
3012fd
11
LT3012
APPLICATIONS INFORMATION
Protection Features
In situations where the ADJ pin is connected to a resistor
dividerthatwouldpulltheADJpinaboveits7Vclampvolt-
age if the output is pulled high, the ADJ pin input current
must be limited to less than 5mA. For example, a resistor
divider is used to provide a regulated 1.5V output from the
1.24V reference when the output is forced to 60V. The top
resistor of the resistor divider must be chosen to limit the
current into the ADJ pin to less than 5mA when the ADJ
pin is at 7V. The 53V difference between the OUT and ADJ
pins divided by the 5mA maximum current into the ADJ
pin yields a minimum top resistor value of 10.6k.
TheLT3012incorporatesseveralprotectionfeatureswhich
make it ideal for use in battery-powered circuits. In ad-
dition to the normal protection features associated with
monolithicregulators,suchascurrentlimitingandthermal
limiting, thedeviceisprotectedagainstreverse-inputvolt-
ages, and reverse voltages from output to input.
LikemanyICpowerregulators,theLT3012hassafeoperat-
ingareaprotection.Thesafeareaprotectiondecreasesthe
currentlimitasinputvoltageincreasesandkeepsthepower
transistor inside a safe operating region for all values of
input voltage. The protection is designed to provide some
outputcurrentatallvaluesofinputvoltageuptothedevice
breakdown. The SOA protection circuitry for the LT3012
uses a current generated when the input voltage exceeds
25V to decrease current limit. This current shows up as
additional quiescent current for input voltages above 25V.
This increase in quiescent current occurs both in normal
operationandinshutdown(seecurveofQuiescentCurrent
in the Typical Performance Characteristics).
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled
to ground, pulled to some intermediate voltage, or is left
open circuit. Current flow back into the output will follow
the curve shown in Figure 4. The rise in reverse output
current above 7V occurs from the breakdown of the 7V
clamp on the ADJ pin. With a resistor divider on the
regulator output, this current will be reduced depending
on the size of the resistor divider.
Current limit protection and thermal overload protection
areintendedtoprotectthedeviceagainstcurrentoverload
conditions at the output of the device. For normal opera-
tion, the junction temperature should not exceed 125°C
(LT3012E) or 140°C (LT3012HFE).
200
T
V
V
= 25°C
= 0V
J
IN
180
160
140
120
100
80
= V
OUT
ADJ
ADJ
PIN CLAMP
(SEE ABOVE)
The input of the device will withstand reverse voltages of
80V. No negative voltage will appear at the output. The
device will protect both itself and the load. This provides
protection against batteries which can be plugged in
backward.
CURRENT FLOWS
INTO OUTPUT PIN
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
The ADJ pin of the device can be pulled above or below
ground by as much as 7V without damaging the device.
If the input is left open circuit or grounded, the ADJ pin
will act like an open circuit when pulled below ground,
and like a large resistor (typically 100k) in series with a
diode when pulled above ground. If the input is powered
by a voltage source, pulling the ADJ pin below the refer-
ence voltage will cause the device to current limit. This
will cause the output to go to a unregulated high voltage.
Pulling the ADJ pin above the reference voltage will turn
off all output current.
OUTPUT VOLTAGE (V)
3012 F04
Figure 4. Reverse Output Current
When the IN pin of the LT3012 is forced below the OUT
pin or the OUT pin is pulled above the IN pin, input cur-
rent will typically drop to less than 2μA. This can happen
if the input of the LT3012 is connected to a discharged
(low voltage) battery and the output is held up by either
a backup battery or a second regulator circuit. The state
of the SHDN pin will have no effect on the reverse output
current when the output is pulled above the input.
3012fd
12
LT3012
TYPICAL APPLICATIONS
5V Buck Converter with Low Current Keep Alive Backup
D2
D1N914
6
C2
L1†
15μH
0.33μF
BOOST
V
V
IN
OUT
4
2
5.5V*
V
SW
5V
IN
C3
4.7μF
100V
D1
TO 60V
1A/250mA
10MQ060N
LT1766
CERAMIC
15
14
10
12
SHDN
BIAS
FB
R1
C1
+
15.4k
100μF 10V
SOLID
SYNC
GND
R2
4.99k
TANTALUM
V
C
1, 8, 9, 16 11
C
C
1nF
14
11
3
5
3012 TA03
IN
OUT
*FOR INPUT VOLTAGES BELOW 7.5V,
SOME RESTRICTIONS MAY APPLY
† INCREASE L1 TO 30μH FOR LOAD
CURRENTS ABOVE 0.6A AND TO
60μH ABOVE 1A
LT3012
750k
249k
OPERATING
CURRENT
SHDN
ADJ
HIGH
LOW
GND
1
Buck Converter
Efficiency vs Load Current
100
V
= 5V
OUT
L = 68μH
V
V
= 10V
= 42V
IN
IN
90
80
70
60
50
0
0.25
0.50
0.75
1.00
1.25
LOAD CURRENT (A)
3012 TA04
3012fd
13
LT3012
TYPICAL APPLICATIONS
LT3012 Automotive Application
IN
OUT
ADJ
NO PROTECTION
DIODE NEEDED!
+
V
IN
LT3012
GND
750k
249k
3.3μF
12V
1μF
LOAD: CLOCK,
SECURITY SYSTEM
ETC
(LATER 42V)
SHDN
OFF
ON
LT3012 Telecom Application
V
IN
IN
OUT
48V
(72V TRANSIENT)
+
–
LT3012
GND
750k
BACKUP
BATTERY
NO PROTECTION
DIODE NEEDED!
3.3μF
1μF
LOAD:
SYSTEM MONITOR
ETC
SHDN
ADJ
249k
3012 TA05
OFF
ON
Constant Brightness for Indicator LED over Wide Input Voltage Range
RETURN
IN
OUT
LT3012
1μF
3.3μF
OFF ON
–48V
SHDN ADJ
GND
R
SET
3012 TA06
I
= 1.24V/R
SET
LED
–48V CAN VARY FROM –4V TO –80V
3012fd
14
LT3012
PACKAGE DESCRIPTION
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.40 ± 0.10
4.00 ±0.10
(2 SIDES)
R = 0.115
TYP
7
12
R = 0.05
TYP
0.70 ±0.05
3.30 ±0.10
3.30 ±0.05
3.60 ±0.05
3.00 ±0.10
(2 SIDES)
2.20 ±0.05
1.70 ± 0.10
1.70 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
PACKAGE
OUTLINE
CHAMFER
(UE12/DE12) DFN 0806 REV D
6
1
0.25 ± 0.05
0.75 ±0.05
0.200 REF
0.25 ± 0.05
0.50 BSC
0.50 BSC
2.50 REF
2.50 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
3.58
(.141)
16 1514 13 12 1110
9
6.60 ±0.10
2.94
(.116)
4.50 ±0.10
6.40
(.252)
BSC
SEE NOTE 4
2.94
(.116)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.0433)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
0.65
(.0256)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
0.195 – 0.30
FE16 (BB) TSSOP 0204
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
3012fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LT3012
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1020
125mA, Micropower Regulator and Comparator V : 4.5V to 36V, V
= 2.5V, V = 0.4V, I = 40μA, I = 40μA, Comparator
DO Q SD
IN
OUT(MIN)
and Reference, Class B Outputs, S16, PDIP14 Packages
LT1120/LT1120A
125mA, Micropower Regulator and Comparator V : 4.5V to 36V, V
= 2.5V, V = 0.4V, I = 40μA, I = 10μA,
DO Q SD
IN
OUT(MIN)
Comparator and Reference, Logic Shutdown, Ref Sources and Sinks 2/4mA,
S8, N8 Packages
LT1121/LT1121HV 150mA, Micropower, LDO
V : 4.2V to 30/36V, V
= 3.75V, V = 0.42V, I = 30μA, I = 16μA,
IN
OUT(MIN) DO Q SD
Reverse Battery Protection, SOT-223, S8, Z Packages
LT1129
700mA, Micropower, LDO
V : 4.2V to 30V, V = 3.75V, V = 0.4V, I = 50μA, I = 16μA,
IN
OUT(MIN)
DO
Q
SD
DD, S0T-223, S8,TO220-5, TSSOP20 Packages
LT1676
60V, 440mA (I ), 100kHz, High Efficiency
V : 7.4V to 60V, V
= 1.24V, I = 3.2mA, I = 2.5μA, S8 Package
Q SD
OUT
IN
OUT(MIN)
Step-Down DC/DC Converter
LT1761
100mA, Low Noise Micropower, LDO
V : 1.8V to 20V, V
= 1.22V, V = 0.3V, I = 20μA, I = <1μA,
DO Q SD
IN
OUT(MIN)
Low Noise < 20μV
, Stable with 1μF Ceramic Capacitors, ThinSOT™ Package
RMS
LT1762
150mA, Low Noise Micropower, LDO
500mA, Low Noise Micropower, LDO
3A, Low Noise, Fast Transient Response, LDO
V : 1.8V to 20V, V
= 1.22V, V = 0.3V, I = 25μA, I = <1μA,
IN
OUT(MIN) DO Q SD
Low Noise < 20μV
, MS8 Package
RMS
LT1763
V : 1.8V to 20V, V
= 1.22V, V = 0.3V, I = 30μA, I = <1μA,
, S8 Package
IN
OUT(MIN) DO Q SD
Low Noise < 20μV
RMS
LT1764/LT1764A
V : 2.7V to 20V, V
= 1.21V, V = 0.34V, I = 1mA, I = <1μA,
, “A” Version Stable with Ceramic Capacitors,
IN
OUT(MIN) DO Q SD
Low Noise < 40μV
RMS
DD, TO220-5 Packages
LT1766
60V, 1.2A (I ), 200kHz, High Efficiency
V : 5.5V to 60V, V
= 1.2V, I = 2.5mA, I = 25μA, TSSOP16/E Package
Q SD
OUT
IN
OUT(MIN)
OUT(MIN)
Step-Down DC/DC Converter
LT1776
40V, 550mA (I ), 200kHz, High Efficiency
V : 7.4V to 40V, V
IN
= 1.24V, I = 3.2mA, I = 30μA, N8, S8 Packages
OUT
Q
SD
Step-Down DC/DC Converter
LT1934/LT1934-1
LT1956
300mA/60mA, (I ), Constant Off-Time, High 90% Efficiency, V : 3.2V to 34V, V
= 1.25V, I = 14μA, I = <1μA,
OUT
IN
OUT(MIN) Q SD
Efficiency Step-Down DC/DC Converter
ThinSOT Package
60V, 1.2A (I ), 500kHz, High Efficiency
V : 5.5V to 60V, V
= 1.2V, I = 2.5mA, I = 25μA, TSSOP16/E Package
Q SD
OUT
IN
OUT(MIN)
Step-Down DC/DC Converter
LT1962
300mA, Low Noise Micropower, LDO
V : 1.8V to 20V, V
= 1.22V, V = 0.27V, I = 30μA, I = <1μA,
DO Q SD
IN
OUT(MIN)
Low Noise < 20μV
, MS8 Package
RMS
LT1963/LT1963A
1.5A, Low Noise, Fast Transient Response, LDO V : 2.1V to 20V, V
= 1.21V, V = 0.34V, I = 1mA, I = <1μA,
IN
OUT(MIN) DO Q SD
Low Noise < 40μV
, “A” Version Stable with Ceramic Capacitors,
RMS
DD, TO220-5, S0T-223, S8 Packages
LT1964
200mA, Low Noise Micropower, Negative LDO
50mA, 3V to 80V, Low Noise Micropower LDO
V : –1.9V to –20V, V = –1.21V, V = 0.34V, I = 30μA, I = 3μA,
IN
OUT(MIN)
DO
Q
SD
Low Noise < 30μV
, Stable with Ceramic Capacitors, ThinSOT Package
RMS
LT3010/LT3010H
LT3013/LT3013H
V : 3V to 8V, V
= 1.275V, V = 0.3V, I = 30μA, I = 1μA,
IN
OUT(MIN) DO Q SD
Low Noise < 100μV
, MS8E Package, H Grade = +140°C T
.
RMS
JMAX
250mA, 4V to 80V, Low Dropout Micropower
Linear Regulator with PWRGD
V : 4V to 80V, V : 1.24V to 60V, V = 0.4V, I = 65μA, I = <1μA,
IN OUT DO Q SD
Power Good Feature; TSSOP-16E and 4mm × 3mm DFN-12 Packages,
H Grade = +140°C T
.
JMAX
LT3014/HV
20mA, 3V to 80V, Low Dropout Micropower
Linear Regulator
V : 3V to 80V (100V for 2ms, HV version), V : 1.22V to 60V, V = 0.35V,
IN OUT DO
I = 7μA, I = <1μA, ThinSOT and 3mm × 3mm DFN-8 Packages.
Q
SD
ThinSOT is a trademark of Linear Technology Corporation.
3012fd
LT 0508 REV D • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
16
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© LINEAR TECHNOLOGY CORPORATION 2005
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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