LT3431IFE#TR [Linear]

LT3431 - High Voltage, 3A, 500kHz Step-Down Switching Regulator; Package: TSSOP; Pins: 16; Temperature Range: -40°C to 85°C;
LT3431IFE#TR
型号: LT3431IFE#TR
厂家: Linear    Linear
描述:

LT3431 - High Voltage, 3A, 500kHz Step-Down Switching Regulator; Package: TSSOP; Pins: 16; Temperature Range: -40°C to 85°C

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LT3431  
High Voltage, 3A,  
500kHz Step-Down  
Switching Regulator  
U
FEATURES  
DESCRIPTIO  
Wide Input Range: 5.5V to 60V  
TheLT®3431isa500kHzmonolithicbuckswitchingregu-  
latorthatacceptsinputvoltagesupto60V.Ahighefficiency  
3A,0.1switchisincludedonthediealongwithallthenec-  
essaryoscillator,controlandlogiccircuitry.Acurrentmode  
architectureprovidesfasttransientresponseandgoodloop  
stability.  
3A Peak Switch Current  
Small Thermally Enhanced 16-Pin TSSOP Package  
Constant 500kHz Switching Frequency  
Saturating Switch Design: 0.1Ω  
Peak Switch Current Maintained Over  
Full Duty Cycle Range  
Special design techniques and a new high voltage process  
achieve high efficiency over a wide input range. Efficiency  
ismaintainedoverawideoutputcurrentrangebyusingthe  
output to bias the circuitry and by utilizing a supply boost  
capacitor to saturate the power switch. Patented circuitry  
maintainspeakswitchcurrentoverthefulldutycyclerange.  
Ashutdownpinreducessupplycurrentto30µAandthede-  
vicecanbeexternallysynchronizedfrom580kHzto700kHz  
with logic level inputs.  
Effective Supply Current: 2.5mA  
Shutdown Current: 30µA  
1.2V Feedback Reference Voltage  
Easily Synchronizable  
Cycle-by-Cycle Current Limiting  
U
APPLICATIO S  
Industrial and Automotive Power Supplies  
The LT3431 is available in a thermally enhanced 16-pin  
TSSOP package.  
Portable Computers  
Battery Chargers  
Distributed Power Systems  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
U
TYPICAL APPLICATIO  
5V, 2A Buck Converter  
MMSD914TI  
6
0.22µF  
Efficiency vs Load Current  
BOOST  
10µH**  
V
V
IN  
OUT  
3, 4  
2, 5  
12V  
(TRANSIENTS  
TO 60V)  
V
SW  
5V  
IN  
100  
2.2µF†  
100V  
CERAMIC  
2A  
V
= 12V  
IN  
30BQ060  
LT3431  
L = 15µH  
V
= 5V  
OUT  
47µF  
CERAMIC  
90  
80  
70  
60  
50  
15  
14  
10  
12  
SHDN  
BIAS  
FB  
V
= 3.3V  
OUT  
15.4k  
SYNC  
GND  
V
C
4.99k  
1, 8, 9, 16  
11  
220pF  
1.5k  
15nF  
0
0.5  
1.0  
1.5  
2.0  
2.5  
LOAD CURRENT (A)  
**  
INCREASE INDUCTOR VALUE FOR LOAD CURRENTS ABOVE 2A  
(SEE APPLICATIONS INFORMATION—MAXIMUM OUTPUT LOAD CURRENT)  
UNITED CHEMI-CON THCS50EZA225ZT  
3431 TA02  
3431 TA01  
sn3431 3431fs  
1
LT3431  
W W  
U W  
U W  
U
ABSOLUTE AXI U RATI GS  
PACKAGE/ORDER I FOR ATIO  
(Note 1)  
Input Voltage (VIN) ................................................. 60V  
BOOST Pin Above SW ............................................ 35V  
BOOST Pin Voltage ................................................. 68V  
SYNC Voltage ........................................................... 7V  
SHDN Voltage ........................................................... 6V  
BIAS Pin Voltage .................................................... 30V  
FB Pin Voltage/Current .................................. 3.5V/2mA  
Operating Junction Temperature Range  
LT3431EFE (Notes 8, 10) ................. 40°C to 125°C  
LT3431IFE (Notes 8, 10) ................. 40°C to 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
ORDER PART  
TOP VIEW  
NUMBER  
GND  
SW  
1
2
3
4
5
6
7
8
16 GND  
15 SHDN  
14 SYNC  
13 NC  
LT3431EFE  
LT3431IFE  
V
IN  
V
IN  
SW  
BOOST  
NC  
12 FB  
11  
10 BIAS  
GND  
V
C
GND  
9
FE PART MARKING  
FE PACKAGE  
16-LEAD PLASTIC TSSOP  
3431EFE  
3431IFE  
TJMAX = 125°C, θJA = 45°C/ W, θJC (PAD) = 10°C/W  
EXPOSED PAD MUST BE SOLDERED  
TO GROUND PLANE  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.  
PARAMETER  
CONDITIONS  
5.5V V 60V  
MIN  
TYP  
MAX  
UNITS  
Reference Voltage (V  
)
1.204 1.219 1.234  
V
V
REF  
IN  
V
+ 0.2 V V – 0.2  
1.195  
200  
1.243  
–1.5  
OL  
C
OH  
FB Input Bias Current  
–0.2  
475  
µA  
Error Amp Voltage Gain  
(Note 2)  
dl (V ) = ±10µA  
V/V  
Error Amp g  
1650  
1000  
2200  
3300  
4200  
µMho  
µMho  
m
C
V to Switch g  
3.4  
275  
275  
0.8  
A/V  
µA  
µA  
V
C
m
EA Source Current  
EA Sink Current  
FB = 1V or V  
= 4.1V  
125  
100  
450  
500  
SENSE  
FB = 1.4V or V  
Duty Cycle = 0  
SHDN = 1V  
= 5.7V  
SENSE  
V Switching Threshold  
C
V High Clamp  
C
2.1  
V
Switch Current Limit  
V Open, BOOST = V + 5V, FB = 1V or V  
= 4.1V –40°C Tj 25°C  
Tj = 125°C  
3.0  
2.5  
5
4
6.5  
5.5  
A
A
C
IN  
SENSE  
(Note 9)  
Switch On Resistance  
I
= 2.5A, BOOST = V + 5V (Note 7)  
0.1  
0.14  
0.18  
SW  
IN  
Maximum Switch Duty Cycle  
Switch Frequency  
FB = 1V or V  
= 4.1V  
88  
80  
92  
%
%
SENSE  
V Set to Give DC = 50%  
460  
430  
500  
500  
540  
570  
kHz  
kHz  
C
f
f
Line Regulation  
5.5V V 60V  
0.05  
0.8  
0.15  
%/V  
V
SW  
SW  
IN  
Shifting Threshold  
Df = 10kHz  
sn3431 3431fs  
2
LT3431  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
4.6  
1.8  
MAX  
5.5  
3
UNITS  
Minimum Input Voltage  
Minimum Boost Voltage  
Boost Current (Note 5)  
(Note 3)  
V
V
(Note 4) I 2.5A  
SW  
BOOST = V + 5V, I = 0.75A  
25  
75  
50  
120  
mA  
mA  
IN  
SW  
SW  
BOOST = V + 5V, I = 2.5A  
IN  
Input Supply Current (I  
)
)
(Note 6) V  
(Note 6) V  
= 5V  
= 5V  
1.5  
3.1  
30  
2.2  
4.2  
mA  
mA  
VIN  
BIAS  
BIAS  
Bias Supply Current (I  
BIAS  
Shutdown Supply Current  
SHDN = 0V, V 60V, SW = 0V, V Open  
100  
200  
µA  
µA  
IN  
C
Lockout Threshold  
V Open,  
C
2.30  
2.42  
2.53  
V
Shutdown Thresholds  
V Open, Shutting Down  
C
0.15  
0.25  
0.37  
0.42  
0.58  
0.6  
V
V
C
V Open, Starting Up  
Minimum SYNC Amplitude  
SYNC Frequency Range  
SYNC Input Resistance  
1.5  
2.2  
V
kHz  
kΩ  
580  
700  
20  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
Note 7: Switch on resistance is calculated by dividing V to SW voltage by  
the forced current (3A). See Typical Performance Characteristics for the  
graph of switch voltage at other currents.  
Note 8: The LT3431EFE is guaranteed to meet performance specifications  
from 0°C to 125°C junction temperature. Specifications over the –40°C to  
125°C operating junction temperature range are assured by design,  
characterization and correlation with statistical process controls. The  
LT3431IFE is guaranteed over the full –40°C to 125°C operating junction  
temperature range.  
IN  
of a device may be impaired.  
Note 2: Gain is measured with a V swing equal to 200mV above the low  
C
clamp level to 200mV below the upper clamp level.  
Note 3: Minimum input voltage is not measured directly, but is guaranteed  
by other tests. It is defined as the voltage where internal bias lines are still  
regulated so that the reference voltage and oscillator remain constant.  
Actual minimum input voltage to maintain a regulated output will depend  
upon output voltage and load current. See Applications Information.  
Note 4: This is the minimum voltage across the boost capacitor needed to  
guarantee full saturation of the internal power switch.  
Note 9: See Typical Performance Graph of Peak Switch Current Limit vs  
Junction Temperature.  
Note 10. This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 5: Boost current is the current flowing into the BOOST pin with the  
pin held 5V above input voltage. It flows only during switch on time.  
Note 6: Input supply current is the quiescent current drawn by the input  
pin when the BIAS pin is held at 5V with switching disabled. Bias supply  
current is the current drawn by the BIAS pin when the BIAS pin is held at  
5V. Total input referred supply current is calculated by summing input  
supply current (I ) with a fraction of bias supply current (I  
):  
BIAS  
VIN  
I
= I + (I  
)(V /V )  
BIAS OUT IN  
TOTAL  
VIN  
With V = 15V, V  
= 5V, I = 1.5mA, I  
= 3.1mA, I  
= 2.5mA.  
IN  
OUT  
VIN  
BIAS  
TOTAL  
sn3431 3431fs  
3
LT3431  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
Switch Peak Current Limit  
FB Pin Voltage and Current  
SHDN Pin Bias Current  
6
5
4
1.234  
1.229  
1.224  
1.219  
2.0  
1.5  
250  
200  
150  
100  
12  
T = 25°C  
j
CURRENT REQUIRED TO FORCE SHUTDOWN  
(FLOWS OUT OF PIN). AFTER SHUTDOWN,  
CURRENT DROPS TO A FEW µA  
TYPICAL  
VOLTAGE  
CURRENT  
1.0  
0.5  
0
1.214  
1.209  
1.204  
GUARANTEED MINIMUM  
AT 2.38V STANDBY THRESHOLD  
(CURRENT FLOWS OUT OF PIN)  
3
2
6
0
0
20  
40  
60  
80  
100  
50  
100 125  
50  
100 125  
–50 –25  
0
25  
75  
–50 –25  
0
25  
75  
DUTY CYCLE (%)  
JUNCTION TEMPERATURE (°C)  
JUNCTION TEMPERATURE (°C)  
3431 G01  
3431 G02  
3431 G03  
Lockout and Shutdown  
Thresholds  
Shutdown Supply Current  
Shutdown Supply Current  
300  
250  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
40  
35  
30  
25  
20  
15  
10  
5
V
= 0V  
SHDN  
LOCKOUT  
V
IN  
= 60V  
200  
150  
V
IN  
= 15V  
100  
50  
0
START-UP  
SHUTDOWN  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
–25  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
–50  
SHUTDOWN VOLTAGE (V)  
JUNCTION TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
3431 G06  
3431 G04  
3431 G05  
Frequency Foldback  
Error Amplifier Transconductance  
Error Amplifier Transconductance  
3000  
2500  
2000  
1500  
1000  
500  
200  
150  
100  
50  
625  
500  
375  
250  
125  
0
2500  
2000  
1500  
1000  
500  
SWITCHING  
FREQUENCY  
PHASE  
GAIN  
V
C
C
R
OUT  
12pF  
OUT  
200k  
–3  
V
2 • 10  
(
)
FB  
ERROR AMPLIFIER EQUIVALENT CIRCUIT  
= 50Ω  
0
FB PIN  
CURRENT  
R
LOAD  
–50  
0
100  
1k  
10k  
100k  
1M  
10M  
–50  
–25  
0
25  
50  
75  
100  
125  
0
0.2  
0.4  
0.6  
(V)  
0.8  
1.0  
1.2  
FREQUENCY (Hz)  
JUNCTION TEMPERATURE (°C)  
V
FB  
3431 G08  
3431 G07  
3431 G09  
sn3431 3431fs  
4
LT3431  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Minimum Input Voltage  
with 5V Output  
Switching Frequency  
BOOST Pin Current  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
575  
550  
525  
500  
475  
450  
425  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
MINIMUM INPUT  
VOLTAGE TO START  
MINIMUM INPUT  
VOLTAGE TO RUN  
0
1
2
3
–50  
–25  
0
25  
50  
75  
100  
125  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
LOAD CURRENT (A)  
SWITCH CURRENT (A)  
JUNCTION TEMPERATURE (°C)  
3431 G12  
3431 G10  
3431 G11  
Switch Minimum ON Time  
vs Temperature  
VC Pin Shutdown Threshold  
Switch Voltage Drop  
2.1  
1.9  
600  
500  
400  
300  
450  
400  
350  
300  
250  
200  
150  
100  
50  
T = 125°C  
J
1.7  
1.5  
1.3  
1.1  
0.9  
T = 25°C  
J
200  
100  
0
T = –40°C  
J
0.7  
0
50  
100 125  
50  
100 125  
–50 –25  
0
25  
75  
0
1
2
3
–50 –25  
0
25  
75  
JUNCTION TEMPERATURE (°C)  
SWITCH CURRENT (A)  
JUNCTION TEMPERATURE (°C)  
3431 G13  
3431 G14  
3431 G15  
Switch Peak Current Limit  
6.00  
5.50  
5.00  
4.50  
4.00  
3.50  
3.00  
2.50  
–25  
0
25  
50  
75  
100  
125  
–50  
JUNCTION TEMPERATURE (°C)  
3431 G16  
sn3431 3431fs  
5
LT3431  
U
U
U
PI FU CTIO S  
GND (Pins 1, 8, 9, 16): The GND pin connections act as  
the reference for the regulated output, so load regulation  
will suffer if the “ground” end of the load is not at the same  
voltage as the GND pins of the IC. This condition will occur  
when load current or other currents flow through metal  
pathsbetweentheGNDpinsandtheloadground.Keepthe  
paths between the GND pins and the load ground short  
anduseagroundplanewhenpossible.TheFEpackagehas  
an exposed pad that is fused to the GND pins. The pad  
should be soldered to the copper ground plane under the  
device to reduce thermal resistance. (See Applications  
Information—Layout Considerations.)  
supply. This architecture increases efficiency especially  
when the input voltage is much higher than the output.  
Minimumoutputvoltagesettingforthismodeofoperation  
is 3V.  
VC (Pin 11) The VC pin is the output of the error amplifier  
and the input of the peak switch current comparator. It is  
normally used for frequency compensation, but can also  
serve as a current clamp or control loop override. VC sits  
at about 0.9V for light loads and 2.1V at maximum load. It  
can be driven to ground to shut off the regulator, but if  
driven high, current must be limited to 4mA.  
FB (Pin 12): The feedback pin is used to set the output  
voltage using an external voltage divider that generates  
1.22V at the pin for the desired output voltage. Three  
additionalfunctionsareperformedbytheFBpin.Whenthe  
pin voltage drops below 0.6V, switch current limit is  
reducedandtheexternalSYNCfunctionisdisabled.Below  
0.8V, switching frequency is also reduced. See Feedback  
Pin Functions in Applications Information for details.  
SW(Pins2, 5):Theswitchpinistheemitteroftheon-chip  
power NPN switch. This pin is driven up to the input pin  
voltage during switch on time. Inductor current drives the  
switch pin voltage negative during switch off time. Nega-  
tive voltage is clamped with the external catch diode.  
Maximum negative switch voltage allowed is 0.8V.  
VIN (Pins 3, 4): This is the collector of the on-chip power  
NPNswitch.VIN powerstheinternalcontrolcircuitrywhen  
a voltage on the BIAS pin is not present. High dI/dt edges  
occur on this pin during switch turn on and off. Keep the  
path short from the VIN pin through the input bypass  
capacitor, through the catch diode back to SW. All trace  
inductanceinthispathcreatesvoltagespikesatswitchoff,  
adding to the VCE voltage across the internal NPN.  
SYNC (Pin 14): The SYNC pin is used to synchronize the  
internal oscillator to an external signal. It is directly logic  
compatible and can be driven with any signal between  
10% and 90% duty cycle. The synchronizing range is  
equal to initial operating frequency up to 700kHz. See  
Synchronizing in Applications Information for details.  
SHDN (Pin 15): The SHDN pin is used to turn off the  
regulator and to reduce input drain current to a few  
microamperes. This pin has two thresholds: one at 2.38V  
to disable switching and a second at 0.4V to force com-  
plete micropower shutdown. The 2.38V threshold func-  
tions as an accurate undervoltage lockout (UVLO); some-  
times used to prevent the regulator from delivering power  
until the input voltage has reached a predetermined level.  
BOOST (Pin 6): The BOOST pin is used to provide a drive  
voltage, higher than the input voltage, to the internal bipo-  
lar NPN power switch. Without this added voltage, the  
typical switch voltage loss would be about 1.5V. The ad-  
ditional BOOST voltage allows the switch to saturate and  
voltage loss approximates that of a 0.1FET structure.  
NC (Pins 7, 13): No Connection.  
B
IAS (Pin 10): The BIAS pin is used to improve efficiency  
If the SHDN pin functions are not required, the pin can  
either be left open (to allow an internal bias current to lift  
the pin to a default high state) or be forced high to a level  
not to exceed 6V.  
when operating at higher input voltages and light load  
current. Connecting this pin to the regulated output volt-  
age forces most of the internal circuitry to draw its oper-  
ating current from the output voltage rather than the input  
sn3431 3431fs  
6
LT3431  
W
BLOCK DIAGRA  
The LT3431 is a constant frequency, current mode buck  
converter. This means that there is an internal clock and  
twofeedbackloopsthatcontrolthedutycycleofthepower  
switch. In addition to the normal error amplifier, there is a  
current sense amplifier that monitors switch current on a  
cycle-by-cycle basis. A switch cycle starts with an oscilla-  
tor pulse which sets the RS flip-flop to turn the switch on.  
When switch current reaches a level set by the inverting  
input of the comparator, the flip-flop is reset and the  
switch turns off. Output voltage control is obtained by  
using the output of the error amplifier to set the switch  
current trip point. This technique means that the error  
amplifier commands current to be delivered to the output  
rather than voltage. A voltage fed system will have low  
phase shift up to the resonant frequency of the inductor  
and output capacitor, then an abrupt 180° shift will occur.  
The current fed system will have 90° phase shift at a much  
lower frequency, but will not have the additional 90° shift  
until well beyond the LC resonant frequency. This makes  
itmucheasiertofrequencycompensatethefeedbackloop  
and also gives much quicker transient response.  
Most of the circuitry of the LT3431 operates from an  
internal 2.9V bias line. The bias regulator normally draws  
power from the regulator input pin, but if the BIAS pin is  
connected to an external voltage equal to or higher than  
3V, bias power will be drawn from the external source  
(typically the regulated output voltage). This will improve  
efficiency if the BIAS pin voltage is lower than regulator  
input voltage.  
High switch efficiency is attained by using the BOOST pin  
to provide a voltage to the switch driver which is higher  
than the input voltage, allowing switch to be saturated.  
This boosted voltage is generated with an external  
capacitor and diode. Two comparators are connected to  
the shutdown pin. One has a 2.38V threshold for under-  
voltage lockout and the second has a 0.4V threshold for  
complete shutdown.  
V
IN  
3, 4  
10  
R
R
SENSE  
LIMIT  
+
2.9V BIAS  
REGULATOR  
INTERNAL  
CC  
BIAS  
V
CURRENT  
COMPARATOR  
SLOPE COMP  
Σ
SYNC 14  
BOOST  
6
ANTISLOPE COMP  
SHUTDOWN  
COMPARATOR  
500kHz  
OSCILLATOR  
+
S
Q1  
POWER  
SWITCH  
R
DRIVER  
CIRCUITRY  
S
FLIP-FLOP  
R
0.4V  
5.5µA  
SW  
SHDN 15  
+
2, 5  
FREQUENCY  
FOLDBACK  
LOCKOUT  
COMPARATOR  
×1  
Q2  
FOLDBACK  
CURRENT  
LIMIT  
V
C(MAX)  
CLAMP  
Q3  
ERROR  
AMPLIFIER  
= 2000µMho  
CLAMP  
+
12  
FB  
g
m
11  
1.22V  
2.38V  
V
C
GND  
1, 8, 9, 16  
3431 F01  
Figure 1. LT3431 Block Diagram  
sn3431 3431fs  
7
LT3431  
W U U  
U
APPLICATIO S I FOR ATIO  
FEEDBACK PIN FUNCTIONS  
short-circuitcurrentlimitoftheswitch(typically4Aforthe  
LT3431, foldingbacktolessthan2A). Minimumswitchon  
time limitations would prevent the switcher from attaining  
a sufficiently low duty cycle if switching frequency were  
maintained at 500kHz, so frequency is reduced by about  
5:1 when the feedback pin voltage drops below 0.8V (see  
FrequencyFoldbackgraph). Thisdoesnotaffectoperation  
with normal load conditions; one simply sees a gear shift  
in switching frequency during start-up as the output  
voltage rises.  
The feedback (FB) pin on the LT3431 is used to set output  
voltage and provide several overload protection features.  
The first part of this section deals with selecting resistors  
to set output voltage and the second part talks about  
foldback frequency and current limiting created by the FB  
pin. Please read both parts before committing to a final  
design.  
The suggested value for the output divider resistor (see  
Figure 2) from FB to ground (R2) is 5k or less, and a  
formula for R1 is shown below. The output voltage error  
caused by ignoring the input bias current on the FB pin is  
less than 0.25% with R2 = 5k. A table of standard 1%  
values is shown in Table 1 for common output voltages.  
Please read the following if divider resistors are increased  
above the suggested values.  
In addition to lower switching frequency, the LT3431 also  
operates at lower switch current limit when the feedback  
pin voltage drops below 0.6V. Q2 in Figure 2 performs this  
function by clamping the VC pin to a voltage less than its  
normal 2.1V upper clamp level. This foldback current limit  
greatly reduces power dissipation in the IC, diode and in-  
ductor during short-circuit conditions. External synchro-  
nization is also disabled to prevent interference with fold-  
back operation. Again, it is nearly transparent to the user  
under normal load conditions. The only loads that may be  
affected are current source loads which maintain full load  
current with output voltage less than 50% of final value. In  
theseraresituationsthefeedbackpincanbeclampedabove  
0.6Vwithanexternaldiodetodefeatfoldbackcurrentlimit.  
Caution: clamping the feedback pin means that frequency  
shifting will also be defeated, so a combination of high in-  
putvoltageanddeadshortedoutputmaycausetheLT3431  
to lose control of current limit.  
R2 VOUT 1.22  
(
)
R1=  
1.22  
Table 1  
OUTPUT  
VOLTAGE  
(V)  
R1  
% ERROR AT OUTPUT  
R2  
(NEAREST 1%) DUE TO DISCREET 1%  
(kΩ  
)
(k  
)
RESISTOR STEPS  
+0.32  
3
3.3  
5
4.99  
4.99  
4.99  
4.75  
4.47  
4.32  
4.12  
4.12  
7.32  
8.45  
15.4  
18.7  
24.9  
30.9  
36.5  
46.4  
0.43  
0.30  
6
+0.40  
8
+0.20  
The internal circuitry which forces reduced switching  
frequency also causes current to flow out of the feedback  
pin when output voltage is low. The equivalent circuitry is  
shown in Figure 2. Q1 is completely off during normal  
operation. If the FB pin falls below 0.8V, Q1 begins to  
conduct current and reduces frequency at the rate of  
approximately 3.5kHz/µA. To ensure adequate frequency  
foldback (under worst-case short-circuit conditions), the  
external divider Thevinin resistance must be low enough  
to pull 115µA out of the FB pin with 0.44V on the pin (RDIV  
3.8k). The net result is that reductions in frequency and  
current limit are affected by output voltage divider imped-  
ance. Although divider impedance is not critical, caution  
should be used if resistors are increased beyond the  
suggested values and short-circuit conditions can possi-  
10  
12  
15  
0.54  
+0.24  
0.27  
More Than Just Voltage Feedback  
The feedback pin is used for more than just output voltage  
sensing. It also reduces switching frequency and current  
limit when output voltage is very low (see the Frequency  
Foldback graph in Typical Performance Characteristics).  
ThisisdonetocontrolpowerdissipationinboththeICand  
in the external diode and inductor during short-circuit  
conditions. A shorted output requires the switching regu-  
lator to operate at very low duty cycles, and the average  
current through the diode and inductor is equal to the  
bly occur with high input voltage. High frequency pickup  
sn3431 3431fs  
8
LT3431  
W U U  
APPLICATIO S I FOR ATIO  
U
V
SW  
LT3431  
L1  
TO FREQUENCY  
SHIFTING  
OUTPUT  
5V  
1.4V  
Q1  
ERROR  
AMPLIFIER  
R1  
1.2V  
+
R4  
2k  
R3  
1k  
FB  
+
C1  
BUFFER  
Q2  
R2  
TO SYNC CIRCUIT  
V
GND  
C
3431 F02  
Figure 2. Frequency and Current Limit Foldback  
will increase and the protection accorded by frequency  
and current foldback will decrease.  
V
OUT USING  
47µF CERAMIC  
OUTPUT  
CAPACITOR  
CHOOSING THE INDUCTOR  
10mV/DIV  
VOUT USING  
100µF, 0.08Ω  
TANTALUM  
OUTPUT  
For most applications, the output inductor will fall into the  
range of 5µH to 33µH. Lower values are chosen to reduce  
physical size of the inductor. Higher values allow more  
output current because they reduce peak current seen by  
the LT3431 switch, which has a 3A limit. Higher values  
also reduce output ripple voltage.  
CAPACITOR  
1µs/DIV  
VIN = 12V  
VOUT = 5V  
L = 10µH  
3431 F03  
When choosing an inductor you will need to consider  
output ripple voltage, maximum load current, peak induc-  
tor current and fault current in the inductor. In addition,  
other factors such as core and copper losses, allowable  
component height, EMI, saturation and cost should also  
be considered. The following procedure is suggested as a  
way of handling these somewhat complicated and con-  
flicting requirements.  
Figure 3. LT3431 Output Ripple Voltage Waveforms.  
Ceramic vs Tantalum Output Capacitors  
Output ripple voltage is determined by ripple current  
(ILP-P) through the inductor and the high frequency  
impedance of the output capacitor. At high frequencies,  
the impedance of the tantalum capacitor is dominated by  
its effective series resistance (ESR).  
Output Ripple Voltage  
Tantalum Output Capacitor  
Figure 3 shows a comparison of output ripple voltage for  
the LT3431 using either a tantalum or ceramic output  
capacitor. It can be seen from Figure 3 that output ripple  
voltagecanbesignificantlyreducedbyusingtheceramic  
outputcapacitor;thesignificantdecreaseinoutputripple  
voltage is due to the very low ESR of ceramic capacitors.  
The typical method for reducing output ripple voltage  
when using a tantalum output capacitor is to increase the  
inductor value (to reduce the ripple current in the induc-  
tor). The following equations will help in choosing the  
required inductor value to achieve a desirable output  
ripple voltage level. If output ripple voltage is of less  
sn3431 3431fs  
9
LT3431  
W U U  
U
APPLICATIO S I FOR ATIO  
importance, the subsequent suggestions in Peak Induc-  
tor and Fault Current and EMI will additionally help in the  
selection of the inductor value.  
physically larger inductor with the possibility of increased  
component height and cost.  
Ceramic Output Capacitor  
Peak-to-peak output ripple voltage is the sum of a triwave  
(created by peak-to-peak ripple current (ILP-P) times ESR)  
and a square wave (created by parasitic inductance (ESL)  
and ripple current slew rate). Capacitive reactance is  
assumed to be small compared to ESR or ESL.  
An alternative way to further reduce output ripple voltage  
is to reduce the ESR of the output capacitor by using a  
ceramic capacitor. Although this reduction of ESR re-  
moves a useful zero in the overall loop response, this zero  
can be replaced by inserting a resistor (RC) in series with  
the VC pin and the compensation capacitor CC. (See  
Ceramic Capacitors in Applications Information.)  
dI  
dt  
V
RIPPLE = ILP-P ESR + ESL Σ  
(
)(  
) (  
)
Peak Inductor Current and Fault Current  
where:  
To ensure that the inductor will not saturate, the peak  
inductor current should be calculated knowing the maxi-  
mum load current. An appropriate inductor should then  
bechosen.Inaddition,adecisionshouldbemadewhether  
or not the inductor must withstand continuous fault  
conditions.  
ESR = equivalent series resistance of the output  
capacitor  
ESL = equivalent series inductance of the output  
capacitor  
dI/dt = slew rate of inductor ripple current = VIN/L  
If maximum load current is 1A, for instance, a 1A inductor  
maynotsurviveacontinuous4Aoverloadcondition. Dead  
shortswillactuallybemoregentleontheinductorbecause  
the LT3431 has frequency and current limit foldback.  
Peak-to-peak ripple current (ILP-P) through the inductor  
and into the output capacitor is typically chosen to be  
between 20% and 40% of the maximum load current. It is  
approximated by:  
Peak inductor and switch current can be significantly  
higher than output current, especially with smaller induc-  
tors and lighter loads, so don’t omit this step. Powdered  
iron cores are forgiving because they saturate softly,  
whereas ferrite cores saturate abruptly. Other core mate-  
rials fall somewhere in between. The following formula  
assumes continuous mode of operation, but errs only  
slightly on the high side for discontinuous mode, so it can  
be used for all conditions.  
VOUT V – VOUT  
(
)( IN  
)
ILP-P  
=
V
f L  
(
IN)( )( )  
Example: with VIN = 12V, VOUT = 5V, L = 10µH, ESR =  
0.080and ESL = 10nH, output ripple voltage can be  
approximated as follows:  
5 12 5  
( )(  
)
IP-P  
=
= 0.58A  
12 10106 500103  
VOUT V – VOUT  
(
)( IN  
)
(ILP-P  
2
)
( )  
(
)(  
)
IPEAK = IOUT  
+
= IOUT +  
2 V f L  
( )(
IN
)( )( )  
dI  
dt  
12  
Σ
=
= 106 •1.2  
10106  
EMI  
V
RIPPLE = 0.58A 0.08 + 10109 106 1.2  
(
)(  
)
(
)
)
(
)(  
Decide if the design can tolerate an “open” core geometry  
like a rod or barrel, which have high magnetic field  
radiation, or whether it needs a closed core like a toroid to  
prevent EMI problems. This is a tough decision because  
the rods or barrels are temptingly cheap and small and  
sn3431 3431fs  
= 0.046 + 0.012 = 58mVP-P  
To reduce output ripple voltage further requires an in-  
crease in the inductor value with the trade-off being a  
10  
LT3431  
W U U  
APPLICATIO S I FOR ATIO  
U
fall off at high duty cycles. Most current mode converters  
suffer a drop off of peak switch current for duty cycles  
above 50%. This is due to the effects of slope compensa-  
tion required to prevent subharmonic oscillations in cur-  
rent mode converters. (For detailed analysis, see Applica-  
tion Note 19.)  
there are no helpful guidelines to calculate when the  
magnetic field radiation will be a problem.  
Table 2  
VENDOR/  
PART NUMBER  
VALUE  
H)  
I
DCR  
(Ohms)  
HEIGHT  
(mm)MAX  
DC  
(
µ
(Amps)  
Sumida  
The LT3431 is able to maintain peak switch current limit  
over the full duty cycle range by using patented circuitry to  
cancel the effects of slope compensation on peak switch  
current without affecting the frequency compensation it  
provides.  
CDRH8D28-4R7  
CDRH8D28-7R3  
CDRH8D43-100  
CDRH8D43-150  
CEI122-100  
4.7  
7.3  
10  
15  
10  
15  
15  
22  
33  
3.4  
2.8  
4
0.019  
0.030  
0.029  
0.042  
0.029  
0.071  
0.037  
0.054  
0.066  
3
3
4.5  
4.5  
3
2.9  
3.4  
3.6  
3.6  
2.9  
2.9  
Maximum load current would be equal to maximum  
switch current for an infinitely large inductor, but with  
finite inductor size, maximum load current is reduced by  
one-halfpeak-to-peakinductorcurrent(ILP-P).Thefollow-  
ing formula assumes continuous mode operation, imply-  
ing that the term on the right is less than one-half of IP.  
CEI122(H)-150  
CDRH104R-150  
CDRH104R-220  
CDRH124-330  
Coiltronics  
3
4
4
4.5  
UP2B-6R8  
6.8  
10  
22  
33  
3.6  
3.3  
3.7  
3.0  
0.020  
0.027  
0.049  
0.069  
6
UP2B-100  
6
IOUT(MAX)  
=
UP3B-220  
6.8  
6.8  
Continuous Mode  
UP3B-330  
VOUT + VF V VOUT VF  
Coilcraft  
(
)( IN  
)
ILP-P  
2
IP –  
=IP −  
DO1813P-472  
DS3316P-472  
DS3316P-682  
DO3316P-103  
DO3316P-153  
4.7  
4.7  
6.8  
10  
2.6  
3.2  
2.8  
3.8  
3.0  
0.054  
0.054  
0.075  
0.038  
0.046  
5
2 L f V  
( )( )(
IN  
)
5.08  
5.08  
5.21  
5.21  
For VOUT = 5V, VIN = 12V, VF(D1) = 0.52V, f = 500kHz  
and L = 10µH:  
15  
5 + 0.52 12 5 – 0.52  
(
)(  
)
IOUT MAX) = 3 −  
(
2 15106 500•103 12  
Additional Considerations  
( )  
(
)(  
)
After making an initial choice, consider additional factors  
such as core losses and second sourcing, etc. Use the  
experts in Linear Technology’s Applications department if  
you feel uncertain about the final choice. They have  
experience with a wide range of inductor types and can tell  
you about the latest developments in low profile, surface  
mounting, etc.  
=3 0.3 = 2.7A  
Note that there is less load current available at the higher  
inputvoltagebecauseinductorripplecurrentincreases.At  
VIN = 24V, duty cycle is 23% and for the same set of  
conditions:  
5 + 0.52 24 5 – 0.52  
(
)(  
)
IOUT(MAX) = 3 −  
Maximum Output Load Current  
2 15106 500•103 24  
( )  
(
)(  
)
Maximum load current for a buck converter is limited by  
themaximumswitchcurrentrating(IP).Thecurrentrating  
for the LT3431 is 3A. Unlike most current mode convert-  
ers, the LT3431 maximum switch current limit does not  
= 3 0.43 = 2.57A  
sn3431 3431fs  
11  
LT3431  
W U U  
U
APPLICATIO S I FOR ATIO  
Example: For VIN = 12V, VOUT = 5V, VF = 0.52V, f = 500kHz  
and L = 2.2µH.  
To calculate actual peak switch current with a given set of  
conditions, use:  
IOUT(MAX)  
32 (500103)(4.7•106)(12)  
=
ILP-P  
2
Discontinuous  
ISW PEAK = IOUT  
+
+
2(5 + 0.52)(12 – 5 – 0.52)  
(
)
Mode  
(VOUT + VF) V VOUT VF  
IOUT(MAX)  
= 1.66A  
(
IN  
)
= IOUT  
Discontinuous Mode  
2 L f V  
( )( )( IN  
)
What has been shown here is that if high inductor ripple  
current and discontinuous mode operation can be toler-  
ated, small inductor values can be used. If a higher output  
load current is required, the inductor value must be  
increased. If IOUT(MAX) no longer meets the discontinuous  
mode criteria, use the IOUT(MAX) equation for continuous  
mode; the LT3431 is designed to operate well in both  
modes of operation, allowing a large range of inductor  
values to be used.  
Reduced Inductor Value and Discontinuous Mode  
If the smallest inductor value is of most importance to a  
converter design, in order to reduce inductor size/cost,  
discontinuous mode may yield the smallest inductor solu-  
tion. The maximum output load current in discontinuous  
mode, however, must be calculated and is defined later in  
this section.  
Discontinuous mode is entered when the output load  
current is less than one-half of the inductor ripple  
current (ILP-P). In this mode, inductor current falls to  
zero before the next switch turn on (see Figure 8). Buck  
converters will be in discontinuous mode for output  
load current given by:  
Short-Circuit Considerations  
For a ground short-circuit fault on the regulated output,  
the maximum input voltage for the LT3431 is typically  
limited to 21V. If a greater input voltage is required,  
increasing the resistance in series with the inductor may  
suffice (see short-circuit calculations at the end of this  
section). Alternatively, the LT3430 can be used since it is  
identical to the LT3431 but runs at a lower frequency of  
200kHz,allowinghighersustainedinputvoltagecapability  
during output short-circuit.  
(VOUT + V )(V VOUT – V )  
F
IN  
F
IOUT  
<
(2)(V )(f)(L)  
Discontinuous Mode  
IN  
The inductor value in a buck converter is usually chosen  
large enough to keep inductor ripple current (ILP-P) low;  
this is done to minimize output ripple voltage and maxi-  
mize output load current. In the case of large inductor  
values, as seen in the equation above, discontinuous  
mode will be associated with “light loads.”  
The LT3431 is a current mode controller. It uses the VC  
node voltage as an input to a current comparator which  
turns off the output switch on a cycle-by-cycle basis as  
peak current is reached. The internal clamp on the VC  
node, nominally 2V, then acts as an output switch peak  
current limit. This action becomes the switch current limit  
specification. The maximum available output power is  
then determined by the switch current limit.  
When choosing small inductor values, however, discon-  
tinuous mode will occur at much higher output load  
currents. The limit to the smallest inductor value that can  
be chosen is set by the LT3431 peak switch current (IP)  
and the maximum output load current required, given by:  
2
A potential controllability problem could occur under  
short-circuit conditions. If the power supply output is  
short circuited, the feedback amplifier responds to the low  
output voltage by raising the control voltage, VC, to its  
peak current limit value. Ideally, the output switch would  
be turned on, and then turned off as its current exceeded  
thevalueindicatedbyVC.However,thereisfiniteresponse  
sn3431 3431fs  
IOUT(MAX)  
Discontinuous Mode  
IP  
=
(2)(ILP-P  
)
2
IP f L•V  
(
IN  
)
=
2(VOUT + VF)(V – VOUT VF)  
IN  
12  
LT3431  
W U U  
APPLICATIO S I FOR ATIO  
U
time involved in both the current comparator and turnoff  
maximum allowable input voltage during an output short  
to ground is typically:  
of the output switch. These result in a minimum on time  
t
ON(MIN). When combined with the large ratio of VIN to  
VIN = (0.52V + 0.068V)/(100kHz • 275ns)  
VIN(MAX) = 21V  
(VF + I • R), the diode forward voltage plus inductor I • R  
voltage drop, the potential exists for a loss of control.  
Expressed mathematically the requirement to maintain  
control is:  
Increasing the DCR of the inductor will increase the  
maximum VIN allowed during an output short to ground  
but will also drop overall efficiency during normal opera-  
tion.  
VF +I•R  
f • tON  
V
IN  
It is recommended that for [VIN/(VOUT + VF)] ratios > 4, a  
soft-start circuit should be used to control the output  
capacitor charge rate during start-up or during recovery  
from an output short circuit, thereby adding additional  
control over peak inductor current. See Buck Converter  
with Adjustable Soft-Start later in this data sheet.  
where:  
f = switching frequency  
ON = switch minimum on time  
VF = diode forward voltage  
VIN = Input voltage  
I • R = inductor I • R voltage drop  
t
If this condition is not observed, the current will not be  
limited at IPK, but will cycle-by-cycle ratchet up to some  
higher value. Using the nominal LT3431 clock frequency  
of 500KHz, a VIN of 12V and a (VF + I • R) of say 0.6V, the  
maximum tON to maintain control would be approximately  
100ns, an unacceptably short time.  
OUTPUT CAPACITOR  
The LT3431 will operate with either ceramic or tantalum  
output capacitors. The output capacitor is normally cho-  
sen by its effective series resistance (ESR), because this  
is what determines output ripple voltage. The ESR range  
for typical LT3431 applications using a tantalum output  
capacitoris0.05to0.2. Atypicaloutputcapacitorisan  
AVX type TPS, 100µF at 10V, with a guaranteed ESR less  
than 0.1. This is a “D” size surface mount solid tantalum  
capacitor. TPS capacitors are specially constructed and  
tested for low ESR, so they give the lowest ESR for a given  
volume. The value in microfarads is not particularly criti-  
cal, and values from 22µF to greater than 500µF work well,  
but you cannot cheat mother nature on ESR. If you find a  
tiny 22µF solid tantalum capacitor, it will have high ESR,  
and output ripple voltage will be terrible. Table 3 shows  
some typical solid tantalum surface mount capacitors.  
The solution to this dilemma is to slow down the oscilla-  
tor when the FB pin voltage is abnormally low thereby  
indicatingsomesortofshort-circuitcondition. Oscillator  
frequencyisunaffecteduntilFBvoltagedropstoabout2/3  
of its normal value. Below this point the oscillator fre-  
quency decreases roughly linearly down to a limit of about  
100kHz. This lower oscillator frequency during short-  
circuit conditions can then maintain control with the  
effective minimum on time. Even with frequency foldback,  
however, the LT3431 will not survive a permanent output  
shortattheabsolutemaximumvoltageratingofVIN =60V;  
this is defined solely by internal semiconductor junction  
breakdown effects.  
Table 3. Surface Mount Solid Tantalum Capacitor ESR  
and Ripple Current  
ESR (Max.,  
)
Ripple Current (A)  
For the maximum input voltage allowed during an output  
short to ground, the previous equation defining minimum  
on-time can be used. Assuming VF (D1 catch diode) =  
0.52V at 2.5A (short-circuit current is folded back to  
typicalswitchcurrentlimit0.5), I(inductor)DCR=2.5A  
• 0.027 = 0.068V (L = UP2B-100), typical f = 100kHz  
(folded back) and typical minimum on-time = 275ns, the  
E Case Size  
AVX TPS, Sprague 593D  
D Case Size  
0.1 to 0.3  
0.1 to 0.3  
0.2 (typ)  
0.7 to 1.1  
AVX TPS, Sprague 593D  
C Case Size  
0.7 to 1.1  
AVX TPS  
0.5 (typ)  
sn3431 3431fs  
13  
LT3431  
W U U  
U
APPLICATIO S I FOR ATIO  
Many engineers have heard that solid tantalum capacitors  
are prone to failure if they undergo high surge currents.  
This is historically true, and type TPS capacitors are  
speciallytestedforsurgecapability,butsurgeruggedness  
is not a critical issue with the output capacitor. Solid  
tantalum capacitors fail during very high turn-on surges,  
which do not occur at the output of regulators. High  
discharge surges, such as when the regulator output is  
dead shorted, do not harm the capacitors.  
sheet for component references) C3 = 2.2µF, RC = 1.5k,  
CC = 15nF, CF = 220pF and C1 = 47µF. See Application  
Note 19 for further detail on techniques for proper loop  
compensation.  
INPUT CAPACITOR  
Step-down regulators draw current from the input supply  
in pulses. The rise and fall times of these pulses are very  
fast. The input capacitor is required to reduce the voltage  
ripple this causes at the input of LT3431 and force the  
switching current into a tight local loop, thereby minimiz-  
ing EMI. The RMS ripple current can be calculated from:  
Unlike the input capacitor, RMS ripple current in the  
output capacitor is normally low enough that ripple cur-  
rent rating is not an issue. The current waveform is  
triangular with a typical value of 250mARMS. The formula  
to calculate this is:  
2
IN  
IRIPPLE RMS = IOUT VOUT V – VOUT /V  
(
IN  
)
(
)
Output capacitor ripple current (RMS):  
Ceramiccapacitorsareidealforinputbypassing.At500kHz  
switching frequency, the energy storage requirement of  
the input capacitor suggests that values in the range of  
2.2µF to 10µF are suitable for most applications. If opera-  
tionisrequiredclosetotheminimuminputrequiredbythe  
output of the LT3431, a larger value may be required. This  
is to prevent excessive ripple causing dips below the  
minimum operating voltage resulting in erratic operation.  
0.29 VOUT V VOUT  
(
)( IN  
)
IRIPPLE RMS  
=
(
)
L f V  
( )( )( IN  
)
Ceramic Capacitors  
Ceramic capacitors are generally chosen for their good  
high frequency operation, small size and very low ESR  
(effective series resistance). Their low ESR reduces out-  
put ripple voltage but also removes a useful zero in the  
loop frequency response, common to tantalum capaci-  
tors. To compensate for this, a resistor RC can be placed  
in series with the VC compensation capacitor CC. Care  
must be taken however, since this resistor sets the high  
frequency gain of the error amplifier, including the gain at  
the switching frequency. If the gain of the error amplifier  
is high enough at the switching frequency, output ripple  
voltage (although smaller for a ceramic output capacitor)  
may still affect the proper operation of the regulator. A  
filter capacitor CF in parallel with the RC/CC network is  
suggested to control possible ripple at the VC pin. An “All  
Ceramic” solution is possible for the LT3431 by choosing  
the correct compensation components for the given  
application.  
Depending on how the LT3431 circuit is powered up you  
may need to check for input voltage transients.  
The input voltage transients may be caused by input  
voltage steps or by connecting the LT3431 converter to an  
already powered up source such as a wall adapter. The  
sudden application of input voltage will cause a large  
surge of current in the input leads that will store energy in  
the parasitic inductance of the leads. This energy will  
causetheinputvoltagetoswingabovetheDClevelofinput  
power source and it may exceed the maximum voltage  
rating of input capacitor and LT3431.  
The easiest way to suppress input voltage transients is to  
addasmallaluminumelectrolyticcapacitorinparallelwith  
the low ESR input capacitor. The selected capacitor needs  
to have the right amount of ESR in order to critically  
dampen the resonant circuit formed by the input lead  
inductance and the input capacitor. The typical values of  
ESRwillfallintherangeof0.5to2andcapacitancewill  
fall in the range of 5µF to 50µF.  
Example:ForVIN =8Vto20V, VOUT =5Vat2A, theLT3431  
can be stabilized, provide good transient response and  
maintain very low output ripple voltage using the follow-  
ing component values: (refer to the first page of this data  
sn3431 3431fs  
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If tantalum capacitors are used, values in the 22µF to  
470µF range are generally needed to minimize ESR and  
meet ripple current and surge ratings. Care should be  
taken to ensure the ripple and surge ratings are not  
exceeded. The AVX TPS and Kemet T495 series are surge  
rated. AVX recommends derating capacitor operating  
voltage by 2:1 for high surge applications.  
BOOST PIN  
Formostapplications, theboostcomponentsarea0.22µF  
capacitor and a MMSD914TI diode. The anode is typically  
connected to the regulated output voltage to generate a  
voltage approximately VOUT above VIN to drive the output  
stage. However, the output stage discharges the boost  
capacitor during the on time of the switch. The output  
driver requires at least 3V of headroom throughout this  
period to keep the switch fully saturated. If the output  
voltage is less than 3.3V, it is recommended that an  
alternate boost supply is used. The boost diode can be  
connected to the input, although, care must be taken to  
prevent the 2× VIN boost voltage from exceeding the  
BOOST pin absolute maximum rating. The additional  
voltage across the switch driver also increases power  
loss, reducing efficiency. If available, an independent  
supply can be used with a local bypass capacitor.  
CATCH DIODE  
HighestefficiencyoperationrequirestheuseofaSchottky  
type diode. DC switching losses are minimized due to its  
low forward voltage drop, and AC behavior is benign due  
to its lack of a significant reverse recovery time. Schottky  
diodes are generally available with reverse voltage ratings  
ofupto60Vandeven100V, andarepricecompetitivewith  
other types.  
The use of so-called “ultrafast” recovery diodes is gener-  
ally not recommended. When operating in continuous  
mode, the reverse recovery time exhibited by “ultrafast”  
diodes will result in a slingshot type effect. The power  
internalswitchwillrampupVIN currentintothediodeinan  
attempt to get it to recover. Then, when the diode has  
finallyturnedoff,sometensofnanosecondslater,theVSW  
node voltage ramps up at an extremely high dV/dt, per-  
haps 5 to even 10V/ns! With real world lead inductances,  
the VSW node can easily overshoot the VIN rail. This can  
result in poor RFI behavior and if the overshoot is severe  
enough, damage the IC itself.  
A 0.22µF boost capacitor is recommended for most appli-  
cations. Almost any type of film or ceramic capacitor is  
suitable, but the ESR should be <1to ensure it can be  
fully recharged during the off time of the switch. The  
capacitor value is derived from worst-case conditions of  
1840ns on time, 75mA boost current and 0.7V discharge  
ripple. The boost capacitor value could be reduced under  
less demanding conditions, but this will not improve  
circuitoperationorefficiency.Underlowinputvoltageand  
low load conditions, a higher value capacitor will reduce  
discharge ripple and improve start-up operation.  
The suggested catch diode (D1) is an International Recti-  
fier 30BQ060 Schottky. It is rated at 3A average forward  
current and 60V reverse voltage. Typical forward voltage  
is 0.52V at 3A. The diode conducts current only during  
switch off time. Peak reverse voltage is equal to regulator  
input voltage. Average forward current in normal opera-  
tion can be calculated from:  
SHUTDOWN FUNCTION AND UNDERVOLTAGE  
LOCKOUT  
Figure 4 shows how to add undervoltage lockout (UVLO)  
to the LT3431. Typically, UVLO is used in situations where  
the input supply is current limited, or has a relatively high  
source resistance. A switching regulator draws constant  
power from the source, so source current increases as  
source voltage drops. This looks like a negative resistance  
loadtothesourceandcancausethesourcetocurrentlimit  
or latch low under low source voltage conditions. UVLO  
prevents the regulator from operating at source voltages  
where these problems might occur.  
IOUT V – VOUT  
(
IN  
)
ID(AVG)  
=
V
IN  
This formula will not yield values higher than 3A with  
maximum load current of 3A.  
sn3431 3431fs  
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LT3431  
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R
FB  
L1  
LT3431  
OUTPUT  
V
SW  
2.38V  
+
IN  
INPUT  
STANDBY  
R
HI  
5.5µA  
+
SHDN  
C1  
+
TOTAL  
SHUTDOWN  
R
C2  
LO  
0.4V  
GND  
3431 F04  
Figure 4. Undervoltage Lockout  
Threshold voltage for lockout is about 2.38V. A 5.5µA bias  
currentflows outofthepinatthisthreshold. Theinternally  
generated current is used to force a default high state on  
the shutdown pin if the pin is left open. When low shut-  
down current is not an issue, the error due to this current  
can be minimized by making RLO 10k or less. If shutdown  
currentisanissue, RLO canberaisedto100k, buttheerror  
due to initial bias current and changes with temperature  
should be considered.  
25k suggested for RLO  
VIN = Input voltage at which switching stops as input  
voltage descends to trip level  
V = Hysteresis in input voltage level  
Example: output voltage is 5V, switching is to stop if input  
voltage drops below 12V and should not restart unless  
input rises back to 13.5V. V is therefore 1.5V and  
VIN = 12V. Let RLO = 25k.  
25k 12 2.38 1.5/5 +1 + 1.5  
R
LO = 10k to 100k 25k suggested  
(
)
[
]
(
)
RHI =  
2.38 – 25k 5.5µA  
RLO V 2.38V  
(
)
(
IN  
)
RHI =  
25k 10.41  
2.38V RLO 5.5µA  
(
)
(
)
=
= 116k  
2.24  
VIN = Minimum input voltage  
RFB = 116k 5/1.5 = 387k  
(
)
Keep the connections from the resistors to the shutdown  
pin short and make sure that interplane or surface capaci-  
tance to the switching nodes are minimized. If high  
resistor values are used, the shutdown pin should be  
bypassed with a 1000pF capacitor to prevent coupling  
problems from the switch node. If hysteresis is desired in  
the undervoltage lockout point, a resistor RFB can be  
added to the output node. Resistor values can be calcu-  
lated from:  
SYNCHRONIZING  
The SYNC input must pass from a logic level low, through  
the maximum synchronization threshold with a duty cycle  
between 10% and 90%. The input can be driven directly  
from a logic level output. The synchronizing range is equal  
to initial operating frequency up to 700kHz. This means  
that minimum practical sync frequency is equal to the  
worst-case high self-oscillating frequency (570kHz), not  
the typical operating frequency of 500kHz. Caution should  
be used when synchronizing above 662kHz because at  
highersyncfrequenciestheamplitudeoftheinternalslope  
compensation used to prevent subharmonic switching is  
RLO V 2.38 V/VOUT +1 + ∆V  
IN  
(
)
[
]
RHI =  
2.38 RLO 5.5µA  
(
)
RFB = RHI VOUT  
/
V  
(
)(  
)
sn3431 3431fs  
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reduced. This type of subharmonic switching only occurs  
at input voltages less than twice output voltage. Higher  
inductor values will tend to eliminate this problem. See  
Frequency Compensation section for a discussion of an  
entirely different cause of subharmonic switching before  
assuming that the cause is insufficient slope compensa-  
tion. Application Note 19 has more details on the theory  
of slope compensation.  
nanosecond range. To prevent noise both radiated and  
conducted, the high speed switching current path, shown  
inFigure5,mustbekeptasshortaspossible.Thisisimple-  
mented in the suggested layout of Figure 6. Shortening  
this path will also reduce the parasitic trace inductance of  
approximately 25nH/inch. At switch off, this parasitic in-  
ductance produces a flyback spike across the LT3431  
switch. When operating at higher currents and input volt-  
ages, with poor layout, this spike can generate voltages  
acrosstheLT3431thatmayexceeditsabsolutemaximum  
rating. A ground plane should always be used under the  
switcher circuitry to prevent interplane coupling and over-  
all noise.  
At power-up, when VC is being clamped by the FB pin (see  
Figure2,Q2),thesyncfunctionisdisabled.Thisallowsthe  
frequency foldback to operate in the shorted output con-  
dition. During normal operation, switching frequency is  
controlledbytheinternaloscillatoruntiltheFBpinreaches  
0.6V, after which the SYNC pin becomes operational. If no  
synchronization is required, this pin should be connected  
to ground.  
LT3431  
L1  
5V  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
V
IN  
C3  
D1 C1  
LOAD  
LAYOUT CONSIDERATIONS  
As with all high frequency switchers, when considering  
layout,caremustbetakeninordertoachieveoptimalelec-  
trical, thermal and noise performance. For maximum  
efficiency, switch rise and fall times are typically in the  
3431 F05  
Figure 5. High Speed Switching Path  
1
2
3
4
5
6
GND  
SW  
CONNECT TO  
V
IN  
GROUND PLANE  
V
IN  
GND  
LT3431  
SW  
L1  
BOOST  
SOLDER THE EXPOSED PAD  
TO THE ENTIRE COPPER  
C1  
V
PINS 3 AND 4  
IN  
GROUND PLANE UNDERNEATH  
THE DEVICE. NOTE: THE BOOST  
AND BIAS COPPER TRACES ARE  
ON A SEPARATE LAYER FROM  
THE GROUND PLANE  
MINIMIZE LT3430  
C3-D1 LOOP  
ARE SHORTED TOGETHER.  
D2  
SW PINS 2 AND 5 ARE ALSO  
SHORTED TOGETHER (USING  
AVAILABLE SPACE UNDERNEATH  
THE DEVICE BETWEEN PINS AND  
GND PLANE)  
V
OUT  
D1  
C3  
C2  
GND  
1
GND  
SW  
GND 16  
15  
KELVIN SENSE  
SHDN  
V
OUT  
2
3
4
5
6
7
8
V
IN  
14  
SYNC  
R2  
V
IN  
13  
CFB  
R1  
LT3431  
SW  
FB 12  
11  
KEEP FB AND V COMPONENTS  
C
AWAY FROM HIGH FREQUENCY,  
HIGH CURRENT COMPONENTS  
BOOST  
V
C
BIAS 10  
GND  
C
R
C
F
GND  
9
V
IN  
C
C
PLACE FEEDTHROUGH AROUND  
GROUND PINS (4 CORNERS) FOR  
GOOD THERMAL CONDUCTIVITY  
3431 F06  
Figure 6. Suggested Layout  
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The VC and FB components should be kept as far away as  
possible from the switch and boost nodes. The LT3431  
pinout has been designed to aid in this. The ground for  
these components should be separated from the switch  
current path. Failure to do so will result in poor stability or  
subharmonic like oscillation.  
absolute max switch voltage. The path around switch,  
catch diode and input capacitor must be kept as short as  
possibletoensurereliableoperation.Whenlookingatthis,  
a >100MHz oscilloscope must be used, and waveforms  
should be observed on the leads of the package. This  
switch off spike will also cause the SW node to go below  
ground. The LT3431 has special circuitry inside which  
mitigates this problem, but negative voltages over 0.8V  
lasting longer than 10ns should be avoided. Note that  
100MHz oscilloscopes are barely fast enough to see the  
details of the falling edge overshoot in Figure 7.  
Board layout also has a significant effect on thermal  
resistance. Pins 1, 8, 9 and 16, GND, are a continuous  
copper plate that runs under the LT3431 die. This is an  
exposedpadandisthebestthermalpathforheatoutofthe  
package. Soldering the exposed pad to the copper ground  
plane under the device will reduce die temperature and  
increase the power capability of the LT3431. Adding  
multiple solder filled feedthroughs under and around the  
four corner pins to the ground plane will also help. Similar  
treatment to the catch diode and coil terminations will  
reduce any additional heating effects.  
A second, much lower frequency ringing is seen during  
switch off time if load current is low enough to allow the  
inductor current to fall to zero during part of the switch off  
time (see Figure 8). Switch and diode capacitance reso-  
nate with the inductor to form damped ringing at 1MHz to  
10MHz. This ringing is not harmful to the regulator and it  
hasnotbeenshowntocontributesignificantlytoEMI. Any  
attempt to damp it with a resistive snubber will degrade  
efficiency.  
PARASITIC RESONANCE  
Resonance or “ringing” may sometimes be seen on the  
switch node (see Figure 7). Very high frequency ringing  
followingswitchrisetimeiscausedbyswitch/diode/input  
capacitor lead inductance and diode capacitance. Schot-  
tky diodes have very high “Q” junction capacitance that  
can ring for many cycles when excited at high frequency.  
If total lead length for the input capacitor, diode and  
switchpathis1inch,theinductancewillbeapproximately  
25nH. At switch off, this will produce a spike across the  
NPN output device in addition to the input voltage. At  
highercurrentsthisspikecanbeintheorderof10Vto20V  
or higher with a poor layout, potentially exceeding the  
INDUCTOR  
0.2A/DIV  
5V/DIV  
CURRENT AT  
I
OUT = 0.1A  
SWITCH NODE  
VOLTAGE  
VIN = 12V  
VOUT = 5V  
L = 10µH  
500ns/DIV  
3431 F08  
Figure 8. Discontinuous Mode Ringing  
SW RISE  
SW FALL  
THERMAL CALCULATIONS  
Power dissipation in the LT3431 chip comes from four  
sources: switch DC loss, switch AC loss, boost circuit  
current,andinputquiescentcurrent.Thefollowingformu-  
las show how to calculate each of these losses. These  
formulas assume continuous mode operation, so they  
should not be used for calculating efficiency at light load  
currents.  
2V/DIV  
50ns/DIV  
3431 F07  
Figure 7. Switch Node Resonance  
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Switch loss:  
When estimating ambient, remember the nearby catch  
diode and inductor will also be dissipating power:  
2
RSW IOUT VOUT  
(
) (  
)
P
SW  
=
+ tEFF(1/2) IOUT  
V
f
(
)( IN)( )  
(VF)(V – VOUT )(ILOAD  
)
IN  
V
PDIODE =  
IN  
V
IN  
Boost current loss:  
VF = Forward voltage of diode (assume 0.52V at 2A)  
2
VOUT  
I
OUT/36  
(
)
(0.52)(12 – 5)(2)  
PBOOST  
=
PDIODE  
=
= 0.61W  
V
IN  
12  
Quiescent current loss:  
Notice that the catch diode’s forward voltage contributes  
a significant loss in the overall system efficiency. A larger,  
lower VF diode can improve efficiency by several percent.  
PQ =V 0.0015 + VOUT 0.003  
IN  
(
)
(
)
RSW = Switch resistance (0.15) hot  
PINDUCTOR = (ILOAD)2(RIND  
)
tEFF = Effective switch current/voltage overlap time  
= (tr + tf + tIr + tIf)  
RIND = Inductor DC resistance (assume 0.1)  
PINDUCTOR (2)2(0.1) = 0.4W  
tr = (VIN/1.2)ns  
tf = (VIN/1.1)ns  
tIr = tIf = (IOUT/0.05)ns  
f = Switch frequency  
Typical thermal resistance of the board is 5°C/W. Taking  
the catch diode and inductor power dissipation into ac-  
count and using the example calculations for LT3431  
dissipation, the LT3431 die temperature will be estimated  
as:  
Example: with VIN = 12V, VOUT = 5V and IOUT = 2A  
(0.15)(2)2(5)  
P
SW  
=
+ (101•109)(1/2)(2)(12)(500•103)  
TJ = TA + (θJA • PTOT) + [5 • (PDIODE + PINDUCTOR)]  
12  
With the TSSOP package (θJA = 45°C/W), at an ambient  
temperature of 50°C:  
= 0.25 + 0.61= 0.86W  
(5)2(2 /36)  
PBOOST  
=
= 0.12W  
TJ = 50 + (45 • 1.01) + (5 • 1.01) = 101°C  
12  
Die temperature can peak for certain combinations of VIN,  
VOUT and load current. While higher VIN gives greater  
switch AC losses, quiescent and catch diode losses, a  
lower VIN may generate greater losses due to switch DC  
losses. In general, the maximum and minimum VIN levels  
should be checked with maximum typical load current for  
calculation of the LT3431 die temperature. If a more  
accurate die temperature is required, a measurement of  
the SYNC pin resistance (to GND) can be used. The SYNC  
pin resistance can be measured by forcing a voltage no  
greaterthan0.5Vatthepinandmonitoringthepincurrent  
over temperature in an oven. This should be done with  
minimal device power (low VIN and no switching  
(VC = 0V)) in order to calibrate SYNC pin resistance with  
ambient (oven) temperature.  
PQ = 12(0.0015)+ 5(0.003) = 0.033W  
Total power dissipation in the IC is given by:  
PTOT = PSW + PBOOST + PQ  
= 0.86W + 0.12W + 0.03W = 1.01W  
Thermal resistance for the LT3431 package is influenced  
by the presence of internal or backside planes.  
TSSOP(ExposedPad)Package:Withafullplaneunderthe  
TSSOP package, thermal resistance JA) will be about  
45°C/W.  
To calculate die temperature, use the proper thermal  
resistance number for the desired package and add in  
worst-case ambient temperature:  
TJ = TA + (θJA • PTOT  
)
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Note: Some of the internal power dissipation in the IC, due  
to BOOST pin voltage, can be transferred outside of the IC  
to reduce junction temperature, by increasing the voltage  
drop in the path of the boost diode D2. (see Figure 9). This  
reduction of junction temperature inside the IC will allow  
higher ambient temperature operation for a given set of  
conditions. BOOST pin circuitry dissipates power given  
by:  
Example:TheBOOSTpinpowerdissipationfora20Vinput  
to 12V output conversion at 2A is given by :  
12 • (2 / 36) •12  
PBOOST  
=
= 0.4W  
20  
If a 7V zener D4 is placed in series with D2, then power  
dissipation becomes :  
12 • (2 / 36) 5  
PBOOST  
=
= 0.167W  
V
OUT • (ISW / 36) • VC2  
20  
PDISS(BOOST)  
=
V
IN  
For an FE package with thermal resistance of 45°C/W,  
ambient temperature savings would be, T(AMBIENT) sav-  
ings = 0.233W • 45°C/W = 11°C. The 7V zener should be  
sizedforexcessof0.233Woperaton. Thetolerancesofthe  
zener should be considered to ensure minimum VC2 ex-  
Typically VC2 (the boost voltage across the capacitor C2)  
equals VOUT. This is because diodes D1 and D2 can be  
considered almost equal, where:  
ceeds 3.3V + VDROOP  
.
VC2 = VOUT – VFD2 – (–VFD1) = VOUT  
.
Hencetheequationusedforboostcircuitrypowerdissipa-  
tion given in the previous Thermal Calculations section is  
stated as:  
D2 D4  
D2  
VOUT • (ISW / 36) • VOUT  
C2  
PDISS(BOOST)  
=
BOOST  
L1  
V
IN  
V
V
IN  
LT3431 SW  
IN  
C3  
BIAS  
Here it can be seen that Boost power dissipation increases  
as the square of Vout. It is possible, however, to reduce  
VC2 below Vout to save power dissipation by increasing  
the voltage drop in the path of D2. Care should be taken  
that VC2 does not fall below the minimum 3.3V Boost  
voltage required for full saturation of the internal power  
switch.Foroutputvoltagesof5V,VC2 isapproximately5V.  
During switch turn on, VC2 will fall as the boost capacitor  
C2 is dicharged by the boost pin. In a previous BOOST Pin  
section, the value of C2 was designed for a 0.7V droop in  
VC2 = VDROOP. Hence, an output voltage as low as 4V  
would still allow the minimum 3.3V for the boost function  
usingtheC2capacitorcalculated.Ifatargetoutputvoltage  
of 12V is required, however, an excess of 8V is placed  
across the boost capacitor which is not required for the  
boost function, but still dissipates additional power. What  
is required is a voltage drop in the path of D2 to achieve  
minimal power dissipation while still maintaining mini-  
mum boost voltage across C2. A zener, D4, placed in  
series with D2 (see Figure 9), drops voltage to C2.  
R1  
R2  
SHDN  
SYNC  
FB  
+
GND  
V
C
C1  
D1  
R
C
C
F
C
C
3431 F09  
Figure 9. BOOST Pin, Diode Selection  
Input Voltage vs Operating Frequency Considerations  
TheabsolutemaximuminputsupplyvoltagefortheLT3431  
is specified at 60V. This is based on internal semiconduc-  
tor junction breakdown effects. The practical maximum  
input supply voltage for the LT3431 may be less than 60V  
due to internal power dissipation or switch minimum on  
time considerations.  
For the extreme case of an output short-circuit fault to  
ground, see the section Short-Circuit Considerations.  
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A detailed theoretical basis for estimating internal power  
dissipation is given in the Thermal Calculations section.  
Thiswillallowafirstpasscheckofwhetheranapplication’s  
maximum input voltage requirement is suitable for the  
LT3431. Be aware that these calculations are for DC input  
voltages and that input voltage transients as high as 60V  
are possible if the resulting increase in internal power  
dissipation is of insufficient time duration to raise die  
temperature significantly. For the FE package, this means  
high voltage transients on the order of hundreds of milli-  
seconds are possible. If LT3431 thermal calculations  
show power dissipation is not suitable for the given  
application, the LT3430 is a recommended alternative  
since it is identical to the LT3431 but runs cooler at  
200kHz.  
tion, the theoretical analysis considers only first order  
non-ideal component behavior. For these reasons, it is  
important that a final stability check is made with produc-  
tion layout and components.  
The LT3431 uses current mode control. This alleviates  
many of the phase shift problems associated with the  
inductor. The basic regulator loop is shown in Figure 10.  
The LT3431 can be considered as two gm blocks, the error  
amplifier and the power stage.  
LT3431  
CURRENT MODE  
POWER STAGE  
SW  
OUTPUT  
ERROR  
AMPLIFIER  
g
= 2mho  
m
C
R1  
FB  
FB  
CERAMIC  
g
=
m
2000µmho  
Switch minimum on time is the other factor that may limit  
the maximum operational input voltage for the LT3431 if  
pulse-skipping behavior is not allowed. For the LT3431,  
pulse-skipping may occur for VIN/(VOUT + VF) ratios > 4.  
(VF = Schottky diode D1 forward voltage drop, Figure 5.)  
If the LT3430 is used, the ratio increases to 10. Pulse-  
skippingistheregulator’swayofmissingswitchpulsesto  
maintain output voltage regulation. Although an increase  
in output ripple voltage can occur during pulse-skipping,  
a ceramic output capacitor can be used to keep ripple  
voltage to a minimum (see output ripple voltage compari-  
son for tantalum vs ceramic output capacitors, Figure 3).  
ESR  
ESL  
C1  
+
R
1.22V  
O
R
LOAD  
200k  
+
C1  
GND  
V
C
TANTALUM  
R2  
R
C
C
F
C
C
3431 F10  
Figure 10. Model for Loop Response  
Figure 11 shows the overall loop response. At the VC pin,  
the frequency compensation components used are:  
RC = 3.3k, CC = 0.022µF and CF = 220pF. The output  
capacitor used is a 100µF, 10V tantalum capacitor with  
typical ESR of 100m.  
FREQUENCY COMPENSATION  
Before starting on the theoretical analysis of frequency  
response,thefollowingshouldberemembered—theworse  
the board layout, the more difficult the circuit will be to  
stabilize. This is true of almost all high frequency analog  
circuits, read the Layout Considerations section first.  
Common layout errors that appear as stability problems  
are distant placement of input decoupling capacitor and/  
or catch diode, and connecting the VC compensation to a  
ground track carrying significant switch current. In addi-  
The ESR of the tantalum output capacitor provides a  
useful zero in the loop frequency response for maintain-  
ing stability.  
This ESR, however, contributes significantly to the ripple  
voltage at the output (see Output Ripple Voltage in the  
Applications Information section). It is possible to reduce  
capacitor size and output ripple voltage by replacing the  
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tantalum output capacitor with a ceramic output capacitor  
because of its very low ESR. The zero provided by the  
tantalum output capacitor must now be reinserted back  
intotheloop. Alternativelytheremaybecaseswhere, even  
with the tantalum output capacitor, an additional zero is  
requiredinthelooptoincreasephasemarginforimproved  
transient response.  
a capacitor, CFB, can be inserted between the output and  
FB pin but care must be taken for high output voltage  
applications. Sudden shorts to the output can create  
unacceptably large negative transients on the FB pin.  
For VIN-to-VOUT ratios <4, higher loop bandwidths are  
possiblebyreadjustingthefrequencycompensationcom-  
ponents at the VC pin.  
A zero can be added into the loop by placing a resistor, RC,  
at the VC pin in series with the compensation capacitor, CC  
or by placing a capacitor, CFB, between the output and the  
FB pin.  
When checking loop stability, the circuit should be oper-  
ated over the application’s full voltage, current and  
temperature range. Proper loop compensation may be  
obtained by empirical methods as described in detail in  
Application Notes 19 and 76.  
80  
180  
150  
120  
90  
60  
GAIN  
40  
CONVERTER WITH BACKUP OUTPUT REGULATOR  
20  
In systems with a primary and backup supply, for ex-  
ample, a battery powered device with a wall adapter input,  
the output of the LT3431 can be held up by the backup  
supply with the LT3431 input disconnected. In this condi-  
tion, the SW pin will source current into the VIN pin. If the  
SHDN pin is held at ground, only the shut down current of  
30µAwillbepulledviatheSWpinfromthesecondsupply.  
With the SHDN pin floating, the LT3431 will consume its  
quiescentoperatingcurrentof1.5mA. TheVIN pinwillalso  
source current to any other components connected to the  
input line. If this load is greater than 10mA or the input  
could be shorted to ground, a series Schottky diode must  
be added, as shown in Figure 12. With these safeguards,  
the output can be held at voltages up to the VIN absolute  
maximum rating.  
PHASE  
0
60  
–20  
–40  
30  
0
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
R
3431 F11  
V
= 12V  
= 3.3k  
= 22nF  
= 220pF  
IN  
C
C
F
V
= 5V  
C
C
OUT  
LOAD  
I
= 1A  
C
= 100µF, 10V, 0.1Ω  
OUT  
Figure 11. Overall Loop Response  
When using RC, the maximum value has two limitations.  
First, thecombinationofoutputcapacitorESRandRC may  
stopthelooprollingoffaltogether. Second, iftheloopgain  
is not rolled sufficiently at the switching frequency, output  
ripple will perturb the VC pin enough to cause unstable  
duty cycle switching similar to subharmonic oscillation. If  
needed, an additional capacitor (CF) can be added across  
the RC/CC network from VC pin to ground to further  
suppress VC ripple voltage.  
D2  
MMSD914TI  
C2  
D3  
30BQ060  
0.22µF  
BOOST  
10µH  
REMOVABLE  
INPUT  
V
LT3431 SW  
IN  
5V, 2A  
ALTERNATE  
SUPPLY  
54k  
BIAS  
R1  
15.4k  
SHDN  
SYNC  
With a tantalum output capacitor, the LT3431 already  
includesaresistor, RC andfiltercapacitor, CF, attheVC pin  
(see Figures 10 and 11) to compensate the loop over the  
entire VIN range (to allow for stable pulse skipping for high  
VIN-to-VOUT ratios4).Aceramicoutputcapacitorcanstill  
be used with a simple adjustment to the resistor RC for  
stable operation. (See Ceramic Capacitors section for  
stabilizingLT3431).Ifadditionalphasemarginisrequired,  
FB  
R2  
GND  
V
C
D1  
30BQ060  
4.99k  
25k  
+
C1  
100µF  
10V  
R
C
C
F
C3  
4.7µF  
3.3k  
C
220pF  
C
0.022µF  
3431 F12  
Figure 12. Dual Source Supply with 25µA Reverse Leakage  
sn3431 3431fs  
22  
LT3431  
W U U  
APPLICATIO S I FOR ATIO  
U
BUCK CONVERTER WITH ADJUSTABLE SOFT-START  
Dual Polarity Output Converter  
Large capacitive loads or high input voltages can cause  
high input currents at start-up. Figure 13 shows a circuit  
that limits the dv/dt of the output at start-up, controlling  
the capacitor charge rate. The buck converter is a typical  
configuration with the addition of R3, R4, CSS and Q1.  
As the output starts to rise, Q1 turns on, regulating switch  
current via the VC pin to maintain a constant dv/dt at the  
output. Output rise time is controlled by the current  
through CSS defined by R4 and Q1’s VBE. Once the output  
is in regulation, Q1 turns off and the circuit operates  
normally. R3 is transient protection for the base of Q1.  
The circuit in Figure 14a generates both positive and  
negative 5V outputs with all components under 3mm  
height. The topology for the 5V output is a standard buck  
converter. The –5V output uses a second inductor L2,  
diode D3, and output capacitor C6. The capacitor C4  
couples energy to L2 and ensures equal voltages across  
L2 and L1 during steady state. Instead of using a trans-  
former for L1 and L2, uncoupled inductors were used  
becausetheyrequirelessheightthanasingletransformer,  
can be placed separately in the circuit layout for optimized  
space savings and reduce overall cost. This is true even  
whentheuncoupledinductorsaresized(twicethevalueof  
inductance of the transformer) in order to keep ripple  
current comparable to the transformer solution. If a single  
transformer becomes available to provide a better height  
/cost solution, refer to the Dual Output SEPIC circuit  
description in Design Note 100 for correct transformer  
connection.  
R4 CSS VOUT  
( )(  
)(  
)
Rise Time =  
VBE  
Using the values shown in Figure 10,  
47 •103 1510–9  
5
( )  
(
)(  
)
Rise Time =  
= 5ms  
0.7  
During switch on-time, in steady state, the voltage across  
both L1 and L2 is positive and equal ; with energy (and  
current) ramping up in each inductor. The current in L2 is  
provided by the coupling capacitor C4. During switch off-  
time, current ramps downward in each inductor. The  
currentinL2andC4flowsviathecatchdiodeD3, charging  
the negative output capacitor C6. If the negative output is  
notloadedenoughitcangoseverelyunregulated(become  
more negative). Figure 14b shows the maximum allow-  
able –5V output load current (vs load current on the 5V  
output) that will maintain the –5V output within 3%  
tolerance. Figure 14c shows the –5V output voltage regu-  
lation versus its own load current when plotted for three  
separate load currents on the 5V output. The efficiency of  
the dual polarity output converter circuit shown in Figure  
14a is given in Figure 14d.  
The ramp is linear and rise times in the order of 100ms are  
possible. Since the circuit is voltage controlled, the ramp  
rate is unaffected by load characteristics and maximum  
outputcurrentisunchanged. Variantsofthiscircuitcanbe  
used for sequencing multiple regulator outputs.  
D2  
MMSD914TI  
C2  
0.22µF  
L1  
15µH  
BOOST  
BIAS  
SW  
OUTPUT  
5V  
2A  
INPUT  
12V  
V
IN  
C3  
D1  
C1  
100µF  
10V  
+
R1  
4.7µF  
25V  
CER  
30BQ060  
LT3431  
15.4k  
OR B250A  
SHDN  
SYNC GND  
FB  
C
R2  
4.99k  
V
C
SS  
15nF  
C
F
R3  
2k  
Q1  
220pF  
R
C
3.3k  
3431 F13  
C
C
R4  
47k  
0.022µF  
L1: CDRH104R-220M  
Figure 13. Buck Converter with Adjustable Soft-Start  
sn3431 3431fs  
23  
LT3431  
APPLICATIO S I FOR ATIO  
W U U  
U
V
IN  
9V TO 16V  
36V TRANSIENT  
D2  
MMSD914T1  
C3  
2.2µF  
50V  
L1  
C2  
CDRH6D28-100  
0.22µF  
V
BOOST  
SW  
IN  
10µH  
V
OUT1  
CER  
5V AT  
1.5A*  
SHDN  
LT3431EFE  
V
OUT1  
SYNC  
BIAS  
C4  
R2  
10µF  
6.3V  
0805  
X5R  
CER  
C5  
15.4k  
22µF  
F
B
6.3V  
R3  
4.99k  
X5R CER  
GND  
V
C
D1  
B140A  
R
C
C
F
220pF  
1.5k  
C
10nF  
C
C6  
22µF  
6.3V  
L2  
CDRH6D28-100  
X5R CER  
10µH  
FOR LOAD CURRENT LESS THAN 25mA,  
A PRELOAD OF 200SHOULD BE USED  
TO IMPROVE LOAD REGULATION.  
OUT1 OUT2  
LOAD CURRENT RELATIONSHIP  
V
OUT2  
–5V AT 0.9A*  
*SEE FIGURE 14c FOR V  
, V  
D3  
B140A  
3431 F14a  
Figure 14a. Dual Polarity Output Converter with all Components Under 3mm Height  
100  
95  
90  
85  
80  
75  
70  
65  
60  
5.30  
5.25  
5.20  
5.15  
5.10  
5.05  
5.00  
4.95  
4.90  
4.85  
4.80  
4/75  
4.70  
1200  
1000  
800  
600  
400  
200  
0
V
= 12V  
V
= 12V  
IN  
IN  
V
= 16V  
IN  
V
= 12V  
IN  
V
AT 1A  
V
OUT1  
V
= 9V  
IN  
V
OUT1  
AT 500mA  
V
AT 1.5A  
AT 1.5A  
OUT1  
OUT1  
V
AT 500mA  
OUT1  
V
OUT1  
AT 1A  
400  
LOAD CURRENT (mA)  
0
200  
V
600  
800  
1000  
0
1000  
1500  
500  
2000  
0
200  
V
400  
600  
800  
1000  
V
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
OUT1  
OUT2  
OUT2  
3431 F14d  
3431F14b  
3431 F14c  
Figure 14b. VOUT2 (–5V) Maximum  
Allowable Load Current vs VOUT1  
(5V) Load Current  
Figure 14c. VOUT2 (–5V)  
Output Voltage vs Load Current  
Figure 14d. Dual Polarity  
Output Converter Efficiency  
sn3431 3431fs  
24  
LT3431  
W U U  
APPLICATIO S I FOR ATIO  
U
POSITIVE-TO-NEGATIVE CONVERTER  
Inductor Value  
The circuit in Figure 15 is a positive-to-negative topology  
using a grounded inductor. It differs from the standard  
approach in the way the IC chip derives its feedback signal  
because the LT3431 accepts only positive feedback sig-  
nals. Thegroundpinmustbetiedtotheregulatednegative  
output. A resistor divider to the FB pin then provides the  
proper feedback voltage for the chip.  
The criteria for choosing the inductor is typically based on  
ensuring that peak switch current rating is not exceeded.  
This gives the lowest value of inductance that can be used,  
but in some cases (lower output load currents) it may give  
a value that creates unnecessarily high output ripple  
voltage.  
The difficulty in calculating the minimum inductor size  
needed is that you must first decide whether the switcher  
will be in continuous or discontinuous mode at the critical  
point where switch current reaches 3A. The first step is to  
use the following formula to calculate the load current  
above which the switcher must use continuous mode. If  
your load current is less than this, use the discontinuous  
mode formula to calculate minimum inductor needed. If  
load current is higher, use the continuous mode formula.  
Thefollowingequationcanbeusedtocalculatemaximum  
load current for the positive-to-negative converter:  
(V )(VOUT  
)
IN  
IP –  
(VOUT )(V – 0.15)  
IN  
2(VOUT + V )(f)(L)  
IN  
IMAX  
=
(VOUT + V – 0.15)(VOUT + VF)  
IN  
IP = Maximum rated switch current  
VIN = Minimum input voltage  
VOUT = Output voltage  
VF = Catch diode forward voltage  
0.15 = Switch voltage drop at 3A  
Output current where continuous mode is needed:  
(V )2(IP)2  
IN  
ICONT  
>
4(V + VOUT )(V + VOUT + VF)  
IN  
IN  
Example: with VIN(MIN) = 5.5V, VOUT = 12V, L = 3.9µH,  
VF = 0.52V, IP = 3A: IMAX = 0.6A.  
Minimum inductor discontinuous mode:  
2(VOUT )(IOUT  
(f)(IP)2  
)
LMIN  
=
D2  
MMSD914TI  
C2  
0.22µF  
L1*  
Minimum inductor continuous mode:  
(V )(VOUT  
3.9µH  
INPUT  
12V  
BOOST  
LT3431  
SW  
FB  
V
IN  
)
R1  
36.5k  
IN  
LMIN  
=
(VOUT + VF)  
GND  
V
C
C3  
2(f)(V + VOUT ) IP – IOUT 1+  
+
C1  
100µF  
16V TANT  
IN  
D1  
2.2µF  
25V  
CER  
V
IN  
30BQ060  
C
C
R2  
C
4.12k  
R
F
C
OUTPUT**  
–12V, 0.5A  
3431 F15  
For a 12V to –12V converter using the LT3431 with peak  
switch current of 3A and a catch diode of 0.52V:  
* INCREASE L1 FOR HIGHER CURRENT APPLICATIONS.  
SEE APPLICATIONS INFORMATION  
** MAXIMUM LOAD CURRENT DEPENDS ON MINIMUM INPUT VOLTAGE  
AND INDUCTOR SIZE. SEE APPLICATIONS INFORMATION  
(12)2(3)2  
4(12 +12)(12 +12 + 0.52)  
ICONT  
=
= 0.742A  
Figure 15. Positive-to-Negative Converter  
sn3431 3431fs  
25  
LT3431  
W U U  
U
APPLICATIO S I FOR ATIO  
For a load current of 0.5A, this says that discontinuous  
mode can be used and the minimum inductor needed is  
found from:  
reduces the size required for the output capacitor (versus  
placing the input capacitor between VIN and ground).  
The peak-to-peak ripple current in both the inductor and  
output capacitor (assuming continuous mode) is:  
2(12)(0.5)  
(500103)(3)2  
LMIN  
=
= 2.7µH  
DC V  
IN  
IP-P  
=
In practice, the inductor should be increased by about  
30% over the calculated minimum to handle losses and  
variations in value. This suggests a minimum inductor of  
3.5µH for this application.  
f L  
VOUT + VF  
VOUT + V + VF  
DC = Duty Cycle =  
IN  
IP-P  
ICOUT (RMS) =  
Ripple Current in the Input and Output Capacitors  
12  
Positive-to-negativeconvertershavehighripplecurrentin  
the input capacitor. For long capacitor lifetime, the RMS  
value of this current must be less than the high frequency  
ripple current rating of the capacitor. The following for-  
mula will give an approximate value for RMS ripple cur-  
rent. This formula assumes continuous mode and large  
inductor value. Small inductors will give somewhat higher  
ripple current, especially in discontinuous mode. The  
exactformulasareverycomplexandappearinApplication  
Note 44, pages 29 and 30. For our purposes here I have  
simply added a fudge factor (ff). The value for ff is about  
1.2 for higher load currents and L 15µH. It increases to  
about 2.0 for smaller inductors at lower load currents.  
Theoutputripplevoltageforthisconfigurationisaslowas  
the typical buck regulator based predominantly on the  
inductor’s triangular peak-to-peak ripple current and the  
ESR of the chosen capacitor (see Output Ripple Voltage in  
Applications Information).  
Diode Current  
Average diodecurrentisequaltoloadcurrent. Peak diode  
current will be considerably higher.  
Peak diode current:  
Continuous Mode =  
VOUT  
V
IN  
(V + VOUT  
)
(V )(VOUT )  
IN  
IN  
Capacitor IRMS = (ff)(IOUT  
)
IOUT  
+
V
IN  
2(L)(f)(V + VOUT )  
IN  
ff = 1.2 to 2.0  
2(IOUT )(VOUT  
(L)(f)  
)
Discontinuous Mode =  
The output capacitor ripple current for the positive-to-  
negative converter is similar to that for a typical buck  
regulator—it is a triangular waveform with peak-to-peak  
valueequaltothepeak-to-peaktriangularwaveformofthe  
inductor. The low output ripple design in Figure 15 places  
theinputcapacitorbetweenVIN andtheregulatednegative  
output. This placement of the input capacitor significantly  
Keep in mind that during start-up and output overloads,  
average diode current may be much higher than with  
normalloads.Careshouldbeusedifdiodesratedlessthan  
1A are used, especially if continuous overload conditions  
must be tolerated.  
sn3431 3431fs  
26  
LT3431  
U
PACKAGE DESCRIPTIO  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663,  
Exposed Pad Variation BB)  
4.90 – 5.10*  
(.193 – .201)  
3.58  
(.141)  
3.58  
(.141)  
16 1514 13 12 1110  
9
6.60 ±0.10  
4.50 ±0.10  
2.94  
(.116)  
SEE NOTE 4  
2.94  
(.116)  
6.40  
BSC  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT  
1.10  
(.0433)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0° – 8°  
0.65  
(.0256)  
BSC  
0.45 – 0.75  
0.09 – 0.20  
0.05 – 0.15  
(.018 – .030)  
(.0036 – .0079)  
(.002 – .006)  
0.195 – 0.30  
(.0077 – .0118)  
FE16 (BB) TSSOP 0203  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
sn3431 3431fs  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
27  
LT3431  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
= 7.3V to 45/64V, V  
LT1074/LT1074HV  
4.4A (I ), 100kHz, High Efficiency  
V
= 2.21V, I = 8.5mA, I = 10µA,  
OUT Q SD  
DD-5/7, TO220-5/7 Packages  
OUT  
IN  
Step-Down DC/DC Converter  
LT1076/LT1076HV  
LT1616  
1.6A (I ), 100kHz, High Efficiency  
Step-Down DC/DC Converter  
V
IN  
= 7.3V to 45/64V, V = 2.21V, I = 8.5mA, I = 10µA,  
OUT  
OUT  
Q
SD  
DD-5/7, TO220-5/7 Packages  
25V, 500mA (I ), 1.4MHz, High Efficiency  
V
IN  
= 3.6V to 25V, V  
= 1.25V, I = 1.9mA, I = <1µA,  
Q SD  
OUT  
OUT  
Step-Down DC/DC Converter  
ThinSOT Package  
LT1676  
60V, 440mA (I ), 100kHz, High Efficiency  
Step-Down DC/DC Converter  
V
= 7.4V to 60V, V  
= 1.24V, I = 3.2mA, I = 2.5µA,  
Q SD  
OUT  
IN  
OUT  
S8 Package  
LTC1701/LTC1701B  
LT1765  
700mA (I ), 1MHz, High Efficiency  
Step-Down DC/DC Converter  
V
= 2.5V to 5V, V  
= 1.25V, I = 135µA, I = <1µA,  
Q SD  
OUT  
IN  
OUT  
OUT  
ThinSOT Package  
25V, 2.75A (I ), 1.25MHz, High Efficiency  
V
= 3V to 25V, V  
= 1.2V, I = 1mA, I = 15µA,  
Q SD  
OUT  
IN  
Step-Down DC/DC Converter  
S8, TSSOP16E Packages  
LT1766  
60V, 1.2A (I ), 200kHz, High Efficiency  
Step-Down DC/DC Converter  
V
IN  
= 5.5V to 60V, V = 1.2V, I = 2.5mA, I = 25µA,  
OUT  
OUT  
Q
SD  
TSSOP16/E Package  
= 3V to 25V; V = 1.2V, I = 1mA, I = 6µA,  
OUT Q SD  
LT1767  
25V, 1.2A (I ), 1.25MHz, High Efficiency  
V
IN  
OUT  
Step-Down DC/DC Converter  
MS8/E Packages  
LT1776  
40V, 550mA (I ), 200kHz, High Efficiency  
Step-Down DC/DC Converter  
V
= 7.4V to 40V; V  
= 1.24V, I = 3.2mA, I = 30µA,  
OUT Q SD  
OUT  
IN  
N8, S8 Packages  
LTC1875  
1.5A (I ), 550kHz, Synchronous  
Step-Down DC/DC Converter  
V
= 2.7V to 6V; V  
= 0.8V, I = 15µA, I = <1µA,  
OUT Q SD  
OUT  
IN  
TSSOP16 Package  
LTC1877  
600mA (I ), 550kHz, Synchronous  
Step-Down DC/DC Converter  
V
= 2.7V to 10V; V  
= 0.8V, I = 10µA, I = <1µA,  
OUT Q SD  
OUT  
IN  
MS8 Package  
LTC1879  
1.2A (I ), 550kHz, Synchronous  
Step-Down DC/DC Converter  
V
= 2.7V to 10V; V  
= 0.8V, I = 15µA, I = <1µA,  
Q SD  
OUT  
IN  
OUT  
OUT  
TSSOP16 Package  
LT1956  
60V, 1.2A (I ), 500kHz, High Efficiency  
V
IN  
= 5.5V to 60V, V  
= 1.2V, I = 2.5mA, I = 25µA,  
Q SD  
OUT  
Step-Down DC/DC Converter  
TSSOP16/E Package  
LTC3404  
600mA (I ), 1.4MHz, Synchronous  
Step-Down DC/DC Converter  
V
= 2.7V to 6V, V  
= 0.8V, I = 10µA, I = <1µA,  
Q SD  
OUT  
IN  
OUT  
MS8 Package  
LTC3405/LTC3405A  
LTC3406/LTC3406B  
LTC3411  
300mA (I ), 1.5MHz, Synchronous  
Step-Down DC/DC Converter  
V
= 2.7V to 6V, V  
= 0.8V, I = 20µA, I = <1µA,  
Q SD  
OUT  
IN  
OUT  
ThinSOT Package  
600mA (I ), 1.5MHz, Synchronous  
V
IN  
= 2.5V to 5.5V, V  
= 0.6V, I = 20µA, I = <1µA,  
OUT Q SD  
OUT  
Step-Down DC/DC Converter  
ThinSOT Package  
1.25A (I ), 4MHz, Synchronous  
V
IN  
= 2.5V to 5.5V, V  
= 0.8V, I = 60µA, I = <1µA,  
Q SD  
OUT  
OUT  
OUT  
OUT  
Step-Down DC/DC Converter  
MS Package  
LTC3412  
2.5A (I ), 4MHz, Synchronous  
V
IN  
= 2.5V to 5.5V, V  
= 0.8V, I = 60µA, I = <1µA,  
Q SD  
OUT  
Step-Down DC/DC Converter  
TSSOP16E Package  
LT3430  
60V, 2.75A (I ), 200kHz, High Efficiency  
V
IN  
= 5.5V to 60V, V  
= 1.2V, I = 2.5mA, I = 30µA,  
Q SD  
OUT  
Step-Down DC/DC Converter  
TSSOP16E Package  
ThinSOT is a trademark of Linear Technology Corporation.  
sn3431 3431fs  
LT/TP 0303 2K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2003  

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