LT3437EFE#PBF [Linear]

LT3437 - High Voltage 500mA, 200kHz Step-Down Switching Regulator with 100µA Quiescent Current; Package: TSSOP; Pins: 16; Temperature Range: -40°C to 85°C;
LT3437EFE#PBF
型号: LT3437EFE#PBF
厂家: Linear    Linear
描述:

LT3437 - High Voltage 500mA, 200kHz Step-Down Switching Regulator with 100µA Quiescent Current; Package: TSSOP; Pins: 16; Temperature Range: -40°C to 85°C

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LT3437  
High Voltage 500mA, 200kHz  
Step-Down Switching Regulator  
with 100µA Quiescent Current  
U
FEATURES  
DESCRIPTIO  
The LT®3437 is a 200kHz monolithic buck switching  
regulator that accepts input voltages up to 80V. A high  
efficiency500mA,0.8switchisincludedonthediealong  
with all the necessary oscillator, control and logic cir-  
cuitry. Current mode topology is used for fast transient  
response and good loop stability.  
Wide Input Range: 3.3V to 60V  
Load Dump (Input Transient) Protection to 80V  
500mA Peak Switch Current  
Burst Mode® Operation: 100µA Quiescent Current**  
Low Shutdown Current: IQ < 1µA  
Burst Mode Operation Defeat  
200kHz Switching Frequency  
Innovative design techniques along with a new high volt-  
age process achieve high efficiency over a wide input  
range. Efficiency is maintained over a wide output current  
rangebyemployingBurstModeoperationatlowcurrents,  
utilizing the output to bias the internal circuitry, and by  
using a supply boost capacitor to fully saturate the power  
switch. Burst Mode operation can be defeated by a logic  
high signal on the SYNC pin which results in lower light  
load ripple at the expense of light load efficiency. Patented  
circuitry maintains peak switch current over the full duty  
cycle range.* Shutdown reduces input supply current to  
less than 1µA. External synchronization can be imple-  
mented by driving the SYNC pin with logic-level inputs. A  
single capacitor from the CSS pin to the output provides a  
controlled output voltage ramp (soft-start).  
Saturating Switch Design: 0.8On-Resistance  
Peak Switch Current Maintained Over  
Full Duty Cycle Range*  
1.25V Feedback Reference Voltage  
Easily Synchronizable  
Soft-Start Capability  
Small 10-Pin Thermally Enhanced DFN Package  
U
APPLICATIO S  
High Voltage Power Conversion  
14V and 42V Automotive Systems  
Industrial Power Systems  
Distributed Power Systems  
Battery-Powered Systems  
The LT3437 is available in a low profile (0.75mm) 3mm ×  
3mm 10-pin DFN package or a 16-Pin TSSOP Package  
both with exposed pad leadframes for low thermal  
resistance.  
Powered Ethernet  
, LTC and LT are registered trademarks of Linear Technology Corporation. Burst Mode  
is a registered trademark of Linear Technology Corporation. All other trademarks are the  
property of their respective owners. *Protected by U.S. Patents including 6498466. **See  
Burst Mode Operation section for conditions.  
U
TYPICAL APPLICATIO  
Input Voltage  
Supply Current vs Input Voltage  
200  
Transient Response  
14V to 3.3V Step-Down Converter with  
100µA No Load Quiescent Current  
180  
V
OUT  
V
IN  
3.3V  
V
BOOST  
IN  
160  
140  
120  
100  
80  
4.5V TO 80V*  
V
IN  
2.2µF  
100V  
CER  
100µH  
400mA  
0.1µF  
BAS21  
20V/DIV  
SHDN  
SW  
LT3437  
0.1µF  
10MQ100N  
V
C
C
SS  
V
IN  
0V  
330pF  
1500pF  
25k  
V
BIAS  
FB  
V
165k  
100k  
OUT  
27pF  
100µF  
6.3V  
TANT  
20mV/DIV  
60  
SYNC  
GND  
AC COUPLED  
40  
3437 TA03  
I
250mA  
OUT  
50ms/DIV  
COLD CRANK  
20  
LOAD DUMP  
0
3437 TA01  
*FOR INPUT VOLTAGES ABOVE 60V RESTRICTIONS APPLY  
0
10 20 30 40 50 60 70 80  
INPUT VOLTAGE (V)  
3435 TA02  
3437f  
1
LT3437  
W W  
U W  
ABSOLUTE AXI U RATI GS  
(Note 1)  
Operating Junction Temperature Range  
VIN, SHDN, BIAS, SW Operating ............................. 60V  
VIN, SHDN 100ms Transient, <15% Duty Cycle ....... 80V  
BOOST Pin Above SW ............................................ 35V  
BOOST Pin Voltage Operating................................. 75V  
BOOST Pin 100ms Transient, <15% Duty Cycle ...... 85V  
SYNC, CSS, FB .......................................................... 6V  
LT3437EDD (Note 2) ....................... 40°C to 125°C  
LT3437IDD (Note 2) ........................ 40°C to 125°C  
LT3437EFE (Note 2) ........................ 40°C to 125°C  
LT3437IFE (Note 2) ......................... 40°C to 125°C  
Storage Temperature Range ................. 65°C to 125°C  
U
W
U
PACKAGE/ORDER I FOR ATIO  
TOP VIEW  
TOP VIEW  
NC  
SW  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
NC  
SHDN  
SYNC  
NC  
SW  
1
2
3
4
5
10 SHDN  
V
9
8
7
6
SYNC  
FB  
IN  
V
IN  
BST  
11  
17  
GND  
V
C
NC  
BOOST  
NC  
FB  
C
BIAS  
SS  
V
C
BIAS  
DD PACKAGE  
10-LEAD (3mm × 3mm) PLASTIC DFN  
GND  
C
SS  
θ
JA = 45°C/W, θJC(PAD) = 10°C/W  
FE PACKAGE  
16-LEAD PLASTIC TSSOP  
EXPOSED PAD IS GND (PIN 11)  
MUST BE SOLDERED TO GND (PIN 4)  
θ
JA = 45°C/W, θJC(PAD) = 10°C/W  
EXPOSED PAD IS GND (PIN 17)  
MUST BE SOLDERED TO GND (PIN 8)  
ORDER PART NUMBER  
FE PART MARKING  
ORDER PART NUMBER  
DD PART MARKING  
LT3437EDD  
LT3437IDD  
LBDJ  
LBDK  
LT3437EFE  
LT3437IFE  
3437EFE  
3437IFE  
Order Options Tape and Reel: Add #TR  
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF  
Lead Free Part Marking: http://www.linear.com/leadfree/  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 12V, SHDN = 12V, BIAS = 5V, FB = 1.25V,  
J
IN  
C
/SYNC = 0V unless otherwise noted.  
SS  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
1.3  
5
MAX  
1.45  
30  
UNITS  
V
V
SHDN Threshold  
1.15  
SHDN  
I
SHDN Input Current  
SHDN = 12V  
µA  
SHDN  
Minimum Input Voltage (Note 3)  
Supply Shutdown Current  
Supply Sleep Current (Note 4)  
2.5  
0.1  
3
V
I
SHDN = 0V, BOOST = 0V, FB/PGFB = 0V  
2
µA  
VINS  
VIN  
BIAS = 0V, FB = 1.35V  
FB = 1.35V  
300  
25  
500  
50  
µA  
µA  
I
Supply Quiescent Current  
BIAS = 0V, FB = 1.15V, V = 0.8V, SYNC = 2V  
BIAS = 5V, FB = 1.15V, V = 0.8V, SYNC = 2V  
1.35  
0.475  
2
1
mA  
mA  
C
C
Minimum BIAS Voltage (Note 5)  
2.7  
3.15  
V
3437f  
2
LT3437  
ELECTRICAL CHARACTERISTICS The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 12V, SHDN = 12V, BIAS = 5V, FB = 1.25V,  
J
IN  
C
SS  
/SYNC = 0V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
150  
0.75  
1.8  
MAX  
250  
1
UNITS  
µA  
I
I
BIAS Sleep Current (Note 4)  
BIAS Quiescent Current  
Minimum Boost Voltage (Note 6)  
Input Boost Current (Note 7)  
BIASS  
BIAS  
SYNC = 2V  
mA  
V
I
= 250mA  
2.5  
SW  
I
I
= 0.5A  
= 0.25A  
11  
8
16  
13  
mA  
mA  
SW  
SW  
V
Reference Voltage (V  
)
REF  
3.3V < V < 80V  
1.225  
1.25  
50  
1.275  
200  
V
nA  
REF  
VIN  
I
FB Input Bias Current  
FB  
EA Voltage Gain (Note 8)  
900  
650  
35  
V/V  
µMho  
µA  
EA Voltage g  
dI(V )= ±10µA  
C
m
EA Source Current  
EA Sink Current  
FB = 1.15V  
FB = 1.35V  
15  
15  
55  
55  
30  
µA  
V to SW g  
1
A/V  
mV  
V
C
m
V Switching Threshold  
C
V
= 2V  
SYNC  
500  
1.75  
650  
V High Clamp  
C
1.5  
2.1  
I
SW Current Limit  
500  
900  
mA  
PK  
SW V  
Switch Saturation Voltage  
(Note 9)  
I
I
= 250mA  
= 500mA  
200  
400  
400  
800  
mV  
mV  
CESAT  
SW  
SW  
Switching Frequency  
170  
200  
95  
240  
kHz  
%
Maximum Duty Cycle  
Minimum SYNC Amplitude  
SYNC Frequency Range  
SYNC Input Impedance  
1.5  
2
V
240  
4
700  
kHz  
k  
µA  
50  
10  
I
C
Current Threshold (Note 10)  
SS  
FB = 0V  
16  
CSS  
Note 1: Absolute Maximum Ratings are those values beyond which the life of  
defined as the quiescent current during the “sleep” portion of Burst Mode  
operation. See Applications Information for determining application supply  
currents.  
a device may be impaired.  
Note 2: The LT3437EDD/LT3437EFE are guaranteed to meet performance  
specifications from 0°C to 125°C junction temperature. Specifications over  
the –40°C to 125°C operating junction temperature range are assured by  
design, characterization and correlation with statistical process controls. The  
LT3437IDD/LT3437IFE are guaranteed and tested over the full –40°C to  
125°C operating junction temperature range.  
Note 3: Minimum input voltage is defined as the voltage where switching  
starts. Actual minimum input voltage to maintain a regulated output will  
depend upon output voltage and load current. See Applications Information.  
Note 5: Minimum BIAS voltage is the voltage on the BIAS pin when I  
is  
BIAS  
sourced into the pin.  
Note 6: This is the minimum voltage across the boost capacitor needed to  
guarantee full saturation of the internal power switch.  
Note 7: Boost current is the current flowing into the BOOST pin with the pin  
held 3.3V above input voltage. It flows only during switch on time.  
Note 8: Gain is measured with a V swing from 1.15V to 750mV.  
C
Note 9: Switch saturation voltage guaranteed by correlation to wafer level  
measurements for DD package parts.  
Note 4: Supply input current is the quiescent current drawn by the input  
pin. Its typical value depends on the voltage on the BIAS pin and operating  
state of the LT3437. With the BIAS pin at 0V, all of the quiescent current  
Note 10: The C threshold is defined as the value of current sourced into the  
SS  
C
pin which results in an increase in sink current from the V pin. See the  
Soft-Start section in Applications Information.  
SS  
C
required to operate the LT3437 will be provided by the V pin. With the  
IN  
BIAS voltage above its minimum input voltage, a portion of the total  
quiescent current will be supplied by the BIAS pin. Supply sleep current is  
3437f  
3
LT3437  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Efficiency and Power Loss  
vs Load Current  
Oscillator Frequency  
vs Temperature  
FB Voltage vs Temperature  
1.30  
1.28  
1.26  
1.24  
1.22  
1.20  
250  
240  
230  
220  
210  
200  
190  
180  
170  
160  
150  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
A
= 12V  
IN  
OUT  
= 25°C  
= 3.3V  
T
EFFICIENCY  
POWER LOSS  
0
50  
75 100 125  
–50  
0
25  
50  
75 100 125  
–50 –25  
0
25  
–25  
0.1  
1
10  
1000  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
LOAD CURRENT (mA)  
3437 G02  
3437 G03  
3437 G01  
Shutdown Supply Current  
vs Temperature  
SHDN Threshold  
SHDN Pin Current  
10  
9
1.50  
10  
8
1.45  
1.40  
8
7
1.35  
1.30  
6
6
V
= 80V  
VIN  
5
4
4
1.25  
1.20  
1.15  
1.10  
V
= 60V  
VIN  
3
2
1
0
2
V
= 12V  
VIN  
0
–50  
–25  
0
25  
50  
75 100 125  
–50  
0
25  
50  
75 100 125  
0
10  
20  
30  
40  
50  
60  
–25  
V
(V)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
SHDN  
3437 G04  
3437 G05  
3437 G06  
Switch Peak Current Limit  
vs Temperature  
Input Current vs Temperature  
Bias Current vs Temperature  
700  
600  
500  
900  
800  
700  
600  
500  
800  
700  
600  
500  
400  
300  
200  
100  
0
RUN MODE  
RUN MODE  
400  
300  
200  
100  
0
SLEEP MODE V  
= 0V  
BIAS  
400  
300  
200  
100  
0
SLEEP MODE  
SLEEP MODE V  
= 5V  
50  
BIAS  
25  
–50  
0
75 100 125  
–50  
0
25  
50  
75 100 125  
–25  
–25  
–50 –25 –0  
25  
50  
75 100 125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
3437 G07  
3437 G08  
3437 G09  
3437f  
4
LT3437  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Soft-Start Current Threshold  
vs FB Voltage  
Oscillator Frequency  
vs FB Voltage  
Switch On Voltage (V  
)
CESAT  
600  
500  
400  
300  
200  
100  
0
35  
30  
25  
20  
15  
10  
5
250  
200  
150  
100  
50  
SOFT-START DEFEATED  
T = 125°C  
J
T = 25°C  
J
T = –40°C  
J
0
0
0
0.2  
0.6  
0.8  
1.0  
1.2  
0
0.25  
0.75  
0.50  
FB VOLTAGE (V)  
1.00  
1.25  
400  
0.4  
100  
200  
300  
500  
FB VOLTAGE (V)  
LOAD CURRENT (mA)  
3437 G10  
3437 G11  
3437 G12  
Burst Mode Threshold  
vs Input Voltage  
Supply Current vs Input Voltage  
Minimum Input Voltage  
200  
180  
160  
140  
120  
100  
80  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
200  
180  
160  
140  
120  
100  
80  
V
= 3.3V  
V
= 3.3V  
OUT  
OUT  
5V TO START  
5V TO RUN  
ENTER  
EXIT  
3.3V TO START  
60  
60  
40  
40  
3.3V TO RUN  
20  
20  
0
0
3.0  
0
10 20 30 40 50 60 70 80  
0
40  
INPUT VOLTAGE (V)  
10  
20  
30  
50  
60  
0
100  
200  
300  
500  
400  
INPUT VOLTAGE (V)  
LOAD CURRENT (mA)  
3437 F13  
3437 G15  
3437 G14  
Minimum On-Time  
Boost Current vs Load Current  
Dropout Operation  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
12  
11  
10  
9
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
LOAD  
= 3.3V  
OUT  
I
= 250mA  
BOOST DIODE =  
DIODES INC B1100  
8
7
0
6
–50  
0
25  
50  
75 100 125  
–25  
100  
400  
LOAD CURRENT (mA)  
200  
300  
500  
2.0  
2.5  
3.0  
3.5  
4.5  
4.0  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
3437 G16  
3437 G17  
3437 G18  
3437f  
5
LT3437  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Maximum Duty Cycle  
vs Temperature  
V Switching Threshold  
C
vs Temperature  
Dropout Operation  
6
5
4
3
2
1
0
94.5  
94.0  
93.5  
93.0  
92.5  
92.0  
91.5  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
I
= 250mA  
V
LOAD  
= 5V  
LOAD  
OUT  
I
= 250mA  
BOOST DIODE = DIODES INC B1100  
–50  
0
25  
50  
75 100 125  
–50  
0
25  
50  
75 100 125  
–25  
–25  
2.0 2.5 3.0 3.5  
4.5  
5.5 6.0  
4.0  
5.0  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
3437 G20  
3437 G21  
3437 G19  
Maximum Sync Frequency  
vs Temperature  
Burst Mode Operation  
Burst Mode Defeated  
1600  
1500  
1400  
1300  
1200  
1100  
1000  
900  
V
V
I
= 12V  
IN  
OUT  
= 100mA  
VOUT  
20mV/DIV  
= 3.3V  
VOUT  
20mV/DIV  
OUT  
AC COUPLED  
AC COUPLED  
ISW  
100mA/DIV  
ISW  
100mA/DIV  
800  
700  
10µs/DIV  
3437 G24  
VIN = 12V  
VOUT = 3.3V  
IQ = 100µA  
10µs/DIV  
3437 G23  
VIN = 12V  
600  
VOUT = 3.3V  
500  
IQ = 1.7mA  
VSYNC = 3.3V  
400  
–50  
0
25  
50  
75 100 125  
–25  
TEMPERATURE (°C)  
3437 G22  
Step Response  
Step Response  
VOUT  
50mV/DIV  
VOUT  
50mV/DIV  
IOUT  
100mA/DIV  
IOUT  
100mA/DIV  
1ms/DIV  
LOAD STEP 0mA TO 200mA  
3437 G25  
1ms/DIV  
LOAD STEP 100mA TO 300mA  
3437 G26  
3437f  
6
LT3437  
U
U
U
(DD/FE)  
PI FU CTIO S  
SW (Pin 1/Pin 2): The SW pin is the emitter of the on-chip  
power NPN switch. This pin is driven up to the input pin  
voltage during switch on time. Inductor current drives the  
SW pin negative during switch off time. Negative voltage  
is clamped with the external catch diode. Maximum nega-  
tive switch voltage allowed is –0.8V.  
BIAS (Pin 6/Pin 10): The BIAS pin is used to improve  
efficiency when operating at higher input voltages and  
light load current. Connecting this pin to the regulated  
output voltage forces most of the internal circuitry to draw  
its operating current from the output voltage rather than  
the input supply. This architecture increases efficiency  
especially when the input voltage is much higher than the  
output. Minimum output voltage setting for this mode of  
operation is typically 3V.  
NC (Pins 1, 3, 5, 7, 13, 16)(FE Package ONLY): No  
Connection.  
VIN (Pin 2/Pin4):Thisisthecollectoroftheon-chippower  
NPNswitch.VIN powerstheinternalcontrolcircuitrywhen  
a voltage on the BIAS pin is not present. High di/dt edges  
occur on this pin during switch turn on and off. Keep the  
path short from the VIN pin through the input bypass  
capacitor, through the catch diode back to SW. All trace  
inductanceonthispathwillcreateavoltagespikeatswitch  
off, adding to the VCE voltage across the internal NPN.  
VC (Pin 7/Pin 11): The VC pin is the output of the error  
amplifier and the input of the peak switch current com-  
parator. It is normally used for frequency compensation,  
but can also serve as a current clamp or control loop  
override. VC sits at about 0.45V for light loads and 1.5V at  
maximum load. During the sleep portion of Burst Mode  
operation, the VC pin is held at a voltage slightly below the  
burst threshold for better transient response. Driving the  
VC pin to ground will disable switching and place the IC  
into sleep mode.  
BOOST (Pin 3/Pin 6): The BOOST pin is used to provide a  
drive voltage, higher than the input voltage, to the internal  
bipolarNPNpowerswitch. Withoutthisaddedvoltage, the  
typical switch voltage loss would be about 1.5V. The  
additional BOOST voltage allows the switch to saturate  
and its voltage loss approximates that of a 0.8FET  
structure.  
FB (Pin 8/Pin 12): The feedback pin is used to determine  
the output voltage using an external voltage divider from  
the output that generates 1.25V at the FB pin. When the FB  
pin drops below 0.9V, switching frequency is reduced, the  
SYNC function is disabled and output ramp rate control is  
enabled via the CSS pin. See the Feedback section in  
Applications Information for details.  
GND (Pins 4, 11/Pins 8, 17): The GND pin connection  
acts as the reference for the regulated output, so load  
regulation will suffer if the “ground” end of the load is not  
at the same voltage as the GND pin of the IC. This  
condition will occur when load current or other currents  
flow through metal paths between the GND pin and the  
load ground. Keep the path between the GND pin and the  
load ground short and use a ground plane when possible.  
The GND pin also acts as a heat sink and should be  
soldered (along with the exposed leadframe) to the cop-  
per ground plane to reduce thermal resistance (see Appli-  
cations Information).  
SYNC(Pin9/Pin14):TheSYNCpinisusedtosynchronize  
the internal oscillator to an external signal. It is directly  
logic compatible and can be driven with any signal be-  
tween 25% and 75% duty cycle. The synchronizing range  
is equal to maximum initial operating frequency up to  
700kHz. When the voltage on the FB pin is below 0.9V the  
SYNC function is disabled. When a synchronization signal  
or logic-level high is present at the SYNC pin, Burst Mode  
operation is disabled. See the synchronizing section in  
Applications Information for details.  
CSS (Pin 5/Pin 9): A capacitor from the CSS pin to the  
regulated output voltage determines the output voltage  
ramp rate during start-up. When the current through the  
CSS capacitor exceeds the CSS threshold (ICSS), the volt-  
age ramp of the output is limited. The CSS threshold is  
proportional to the FB voltage (see Typical Performance  
Characteristics)andisdefeatedforFBvoltagegreaterthan  
0.9V(typical).SeeSoft-StartsectioninApplicationsInfor-  
mation for details.  
SHDN(Pin10/Pin15):TheSHDNpinisusedtoturnoffthe  
regulator and to reduce input current to less than 1µA. The  
SHDN pin requires a voltage above 1.3V with a typical  
source current of 5µA to take the IC out of the shutdown  
state.  
Exposed Pad (Pin 11/Pin 17): Ground. Must be soldered  
to the PCB.  
3437f  
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LT3437  
W
BLOCK DIAGRA  
V
IN  
INTERNAL REF  
SLOPE  
COMP  
2.4V  
UNDERVOLTAGE  
LOCKOUT  
Σ
+
BIAS  
THERMAL  
SHUTDOWN  
200kHz  
CURRENT  
COMP  
OSCILLATOR  
SYNC  
SHDN  
BOOST  
SW  
ANTISLOPE  
COMP  
+
R
SHDN  
COMP  
SWITCH  
LATCH  
DRIVER  
CIRCUITRY  
Q
S
1.3V  
BURST MODE  
DETECT  
C
SS  
SOFT-START  
V
FOLDBACK  
DETECT  
C
CLAMP  
FB  
ERROR  
AMP  
+
GND  
1.25V  
V
C
PGND  
3437 BD  
Figure 1. LT3437 Block Diagram  
The LT3437 is a constant frequency, current mode buck  
converter.Thismeansthatthereisaninternalclockandtwo  
feedback loops that control the duty cycle of the power  
switch. In addition to the normal error amplifier, there is a  
current sense amplifier that monitors switch current on a  
cycle-by-cycle basis. A switch cycle starts with an oscilla-  
torpulsewhichsetstheRSlatchtoturntheswitchon.When  
switch current reaches a level set by the current compara-  
tor, the latch is reset and the switch turns off. Output volt-  
age control is obtained by using the output of the error  
amplifiertosettheswitchcurrenttrippoint.Thistechnique  
means that the error amplifier commands current to be  
delivered to the output rather than voltage. A voltage fed  
system will have low phase shift up to the resonant fre-  
quencyoftheinductorandoutputcapacitor,thenanabrupt  
180° shift will occur. The current fed system will have 90°  
phaseshiftatamuchlowerfrequency,butwillnothavethe  
additional 90° shift until well beyond the LC resonant fre-  
quency. This makes it much easier to frequency compen-  
sate the feedback loop and gives much quicker transient  
response and line rejection.  
Most of the circuitry of the LT3437 operates from an  
internal 2.4V bias line. The bias regulator normally draws  
power from the VIN pin, but if the BIAS pin is connected to  
an external voltage higher than 3V, bias power will be  
drawn from the external source (typically the regulated  
output voltage). This improves efficiency.  
High switch efficiency is attained by using the BOOST pin  
to provide a voltage to the switch driver which is higher  
than the input voltage, allowing the switch to be saturated.  
This boosted voltage is generated with an external capaci-  
tor and diode.  
To further optimize efficiency, the LT3437 automatically  
switchestoBurstModeoperationinlightloadsituations.In  
Burst Mode operation, all circuitry associated with control-  
ling the output switch is shut down, reducing the input  
supply current to 25µA and bias input current to 150µA.  
If lower output ripple is desired over light load efficiency,  
BurstModeoperationcanbedefeatedbysettingtheSYNC  
pin voltage greater than 2V. A logic-level low on the SHDN  
pindisablestheICandreducesinputsupplycurrenttoless  
than 1µA. External synchronization can be implemented  
by driving the SYNC pin with logic-level inputs.  
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FEEDBACK PIN FUNCTIONS  
Table 1  
OUTPUT  
VOLTAGE  
(V)  
R1  
NEAREST (1%)  
(k)  
OUTPUT  
ERROR  
(%)  
The feedback (FB) pin on the LT3437 is used to set output  
voltage and provide several overload protection features.  
The first part of this section deals with selecting resistors  
to set output voltage, and the remaining part talks about  
frequency foldback and soft-start features. Please read  
both parts before committing to a final design.  
R2  
(k, 1%)  
2.5  
3
100  
100  
100  
100  
100  
100  
100  
100  
100  
140  
165  
300  
383  
536  
698  
866  
0
0
3.3  
5
0.38  
0
Referring to Figure 2, the output voltage is determined by  
a voltage divider from VOUT to ground which generates  
1.25VattheFBpin.Sincetheoutputdividerisaloadonthe  
output, care must be taken when choosing the resistor  
divider values. For light load applications the resistor  
values should be as large as possible to achieve peak  
efficiencyinBurstModeoperation. Extremelylargevalues  
forresistorR1willcauseanoutputvoltageerrorduetothe  
50nA FB pin input current. The suggested value for the  
output divider resistor (see Figure 2) from FB to ground  
(R2) is 100k or less. A formula for R1 is shown below. A  
table of standard 1% values is shown in Table 1 for  
common output voltages.  
6
0.63  
0.63  
0.25  
0.63  
8
10  
12  
More Than Just Voltage Feedback  
The FB pin is used for more than just output voltage  
sensing. It also reduces switching frequency and con-  
trolsthesoft-startvoltagerampratewhenoutputvoltage  
is below the regulated level (see the Frequency Foldback  
and Soft-Start Current graphs in Typical Performance  
Characteristics).  
Frequencyfoldbackisdonetocontrolpowerdissipationin  
both the IC and in the external diode and inductor during  
short-circuit conditions. A shorted output requires the  
switching regulator to operate at very low duty cycles. As  
a result, the average current through the diode and induc-  
tor is equal to the short-circuit current limit of the switch  
(typically 500mA for the LT3437). Minimum switch on  
time limitations would prevent the switcher from attaining  
a sufficiently low duty cycle if switching frequency were  
maintained at 200kHz, so frequency is reduced by about  
10:1 when the FB pin voltage drops below 0.4V (see  
FrequencyFoldbackgraph). Asthefeedbackvoltagerises,  
the switching frequency increases to 200kHz with 0.95V  
on the FB pin. During frequency foldback, external syn-  
chronization is disabled to prevent interference with  
foldback operation. Frequency foldback does not affect  
operation during normal load conditions.  
VOUT – 1.25  
1.25 + R2 • 50nA  
R1= R2 •  
V
OUT  
LT3437  
SW  
1
5
C1  
C
SS  
SOFT-START  
200kHz  
OSCILLATOR  
FOLDBACK  
DETECT  
R1  
FB  
+
8
7
ERROR  
AMP  
R2  
1.25V  
V
C
3437 F02  
In addition to lowering switching frequency, the soft-start  
ramp rate is also affected by the feedback voltage. Large  
capacitive loads or high input voltages can cause a  
high input current surge during start-up. The soft-start  
Figure 2. Feedback Network  
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function reduces input current surge by regulating switch causetheinputvoltagetoswingabovetheDClevelofinput  
current via the VC pin to maintain a constant voltage ramp power source and it may exceed the maximum voltage  
rate(dV/dt)attheoutput. Acapacitor(C1inFigure2)from rating of the input capacitor and LT3437. All input voltage  
the CSS pin to the output determines the maximum output transient sequences should be observed at the VIN pin of  
dV/dt. Whenthefeedbackvoltageisbelow0.4V, theVC pin the LT3437 to ensure that absolute maximum voltage  
will rise, resulting in an increase in switch current and  
outputvoltage.IfthedV/dtoftheoutputcausesthecurrent  
through the CSS capacitor to exceed ICSS, the VC voltage is  
reduced resulting in a constant dV/dt at the output. As the  
feedback voltage increases, ICSS increases, resulting in an  
increased dV/dt until the soft-start function is defeated  
with 0.9V present at the FB pin. The soft-start function  
does not affect operation during normal load conditions.  
However, if a momentary short (brown out condition) is  
present at the output which causes the FB voltage to drop  
below 0.9V, the soft-start circuitry will become active.  
ratings are not violated.  
The easiest way to suppress input voltage transients is to  
addasmallaluminumelectrolyticcapacitorinparallelwith  
the low ESR input capacitor. The selected capacitor needs  
to have the right amount of ESR to critically damp the  
resonant circuit formed by the input lead inductance and  
theinputcapacitor. ThetypicalvaluesofESRwillfallinthe  
range of 0.5to 2and capacitance will fall in the range  
of 5µF to 50µF.  
If tantalum capacitors are used, values in the 22µF to  
470µF range are generally needed to minimize ESR and  
meet ripple current and surge ratings. Care should be  
taken to ensure the ripple and surge ratings are not  
exceeded. The AVX TPS and Kemet T495 series are surge  
rated. AVX recommends derating capacitor operating  
voltage by 2:1 for high surge applications.  
INPUT CAPACITOR  
Step-down regulators draw current from the input supply  
in pulses. The rise and fall times of these pulses are very  
fast. The input capacitor is required to reduce the voltage  
ripple this causes at the input of LT3437 and force the  
switching current into a tight local loop, thereby minimiz-  
ing EMI. The RMS ripple current can be calculated from:  
OUTPUT CAPACITOR  
The output capacitor is normally chosen by its effective  
series resistance (ESR) because this is what determines  
output ripple voltage. To get low ESR takes volume, so  
physically smaller capacitors have higher ESR. The ESR  
range for typical LT3437 applications is 0.05to 0.2. A  
typical output capacitor is an AVX type TPS, 100µF at 10V,  
with a guaranteed ESR less than 0.1. This is a “D” size  
surface mount solid tantalum capacitor. TPS capacitors  
are specially constructed and tested for low ESR, so they  
give the lowest ESR for a given volume. The value in  
microfarads is not particularly critical, and values from  
22µF to greater than 500µF work well, but you cannot  
cheat Mother Nature on ESR. If you find a tiny 22µF solid  
tantalum capacitor, it will have high ESR and output ripple  
voltage could be unacceptable. Table 2 shows some  
typical solid tantalum surface mount capacitors.  
IOUT  
V
IN  
IRIPPLE(RMS)  
=
VOUT V – VOUT  
(
IN  
)
Ceramiccapacitorsareidealforinputbypassing.At200kHz  
switching frequency input capacitor values in the range of  
2.2µF to 10µF are suitable for most applications. If opera-  
tionisrequiredclosetotheminimuminputrequiredbythe  
LT3437, a larger value may be required. This is to prevent  
excessive ripple causing dips below the minimum operat-  
ing voltage resulting in erratic operation.  
Input voltage transients caused by input voltage steps, or  
by hot plugging the LT3437 to a pre-powered source such  
as a wall adapter, can exceed maximum VIN ratings. The  
sudden application of input voltage will cause a large  
surge of current in the input leads that will store energy in  
the parasitic inductance of the leads. This energy will  
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Table 2. Surface Mount Solid Tantalum Capacitor ESR  
may still affect the proper operation of the regulator. A  
filter capacitor CF in parallel with the RC/CC network, along  
with a small feedforward capacitor CFB, is suggested to  
control possible ripple at the VC pin. The LT3437 can be  
stabilized using a 100µF ceramic output capacitor and VC  
component values of CC = 1500nF, RC = 25k, CF = 330pF  
and CFB =27pF.  
and Ripple Current  
E CASE SIZE  
AVX TPS  
ESR MAX ()  
RIPPLE CURRENT (A)  
0.1 to 0.3  
0.7 to 1.1  
D CASE SIZE  
AVX TPS  
0.1 to 0.3  
0.2  
0.7 to 1.1  
0.5  
C CASE SIZE  
AVX TPS  
OUTPUT RIPPLE VOLTAGE  
Many engineers have heard that solid tantalum capacitors  
are prone to failure if they undergo high surge currents.  
This is historically true, and type TPS capacitors are  
speciallytestedforsurgecapability,butsurgeruggedness  
is not a critical issue with the output capacitor. Solid  
tantalum capacitors fail during very high turn-on surges  
which do not occur at the output of regulators. High  
discharge surges, such as when the regulator output is  
dead shorted, do not harm the capacitors.  
Figure 3 shows a typical output ripple voltage waveform  
for the LT3437. Ripple voltage is determined by the  
impedance of the output capacitor and ripple current  
through the inductor. Peak-to-peak ripple current through  
the inductor into the output capacitor is:  
VOUT V – VOUT  
(
IN  
)
IP-P  
=
V
L f  
(
IN
)( )(
 
)  
Unlike the input capacitor RMS, ripple current in the  
output capacitor is normally low enough that ripple cur-  
rent rating is not an issue. The current waveform is  
triangular with a typical value of 30mARMS. The formula to  
calculate this is:  
For high frequency switchers the ripple current slew rate  
is also relevant and can be calculated from:  
di  
dt  
V
IN  
L
=
Output capacitor ripple current (RMS)  
0.29 VOUT V – VOUT  
Peak-to-peak output ripple voltage is the sum of a triwave  
created by peak-to-peak ripple current times ESR and a  
square wave created by parasitic inductance (ESL) and  
ripple current slew rate. Capacitive reactance is assumed  
to be small compared to ESR or ESL.  
(
)( IN  
)
IP-P  
12  
IRIPPLE(RMS)  
=
=
L f V  
( )( )( IN  
)
CERAMIC CAPACITORS  
di  
dt  
VRIPPLE = IP-P ESR + ESL  
(
)(  
) (  
)
Higher value, lower cost ceramic capacitors are now  
becoming available. They are generally chosen for their  
good high frequency operation, small size and very low  
ESR(effectiveseriesresistance).LowESRreducesoutput  
ripple voltage but also removes a useful zero in the loop  
frequency response, common to tantalum capacitors. To  
compensate for this, a resistor RC can be placed in series  
with the VC compensation capacitor CC (Figure 10). Care  
must be taken, however, since this resistor sets the high  
frequency gain of the error amplifier, including the gain at  
the switching frequency. If the gain of the error amplifier  
is high enough at the switching frequency, output ripple  
voltage (although smaller for a ceramic output capacitor)  
Example: with VIN = 12V, VOUT = 3.3V, L = 100µH, ESR =  
0.075, ESL = 10nH:  
3.3 12 – 3.3  
(
)(  
)
IP-P  
di  
=
= 0.120A  
12 100e 6 200e3  
( )(  
)(  
)
12  
=
= 0.12e6  
dt 100e – 6  
VRIPPLE = (0.120A)(0.075) + (10e – 9)(0.12e6)  
= 0.009 + 0.0012 = 10.2mVP-P  
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VOUT  
10mV/DIV  
100µF TANTALUM  
ESR 75mΩ  
Discontinuous operation occurs when:  
VOUT V – VOUT  
(
IN  
)
IOUT(DIS)  
VOUT  
10mV/DIV  
100µF CERAMIC  
2(L)(f)(V )  
IN  
For VOUT = 5V, VIN = 8V and L = 68µH:  
VSW  
10V/DIV  
5 8 – 5  
( )(  
)
V
IN = 12V  
1µs/DIV  
3437 F03  
IOUT(MAX) = 0.5 –  
VOUT = 3.3V  
ILOAD = 500mA  
L = 100µH  
2 68e – 6 200e3 8  
(
)(  
)( )  
= 0.5 – 0.069 = 0.431A  
Figure 3. LT3437 Ripple Voltage Waveform  
Note that there is less load current available at the higher  
inputvoltagebecauseinductorripplecurrentincreases.At  
VIN = 15V, duty cycle is 33% and for the same set of  
conditions:  
MAXIMUM OUTPUT LOAD CURRENT  
Maximum load current for a buck converter is limited by  
the maximum switch current rating (IPK). The current  
ratingfortheLT3437is500mA. Unlikemostcurrentmode  
converters, the LT3437 maximum switch current limit  
does not fall off at high duty cycles. Most current mode  
converters suffer a drop off of peak switch current for duty  
cycles above 50%. This is due to the effects of slope  
compensation required to prevent subharmonic oscilla-  
tions in current mode converters. (For detailed analysis,  
see Application Note 19.)  
5 15 – 5  
( )(  
)
IOUT(MAX) = 0.5 –  
2 68e – 6 200e3 15  
(
)(  
)(  
)
= 0.5 – 0.121= 0.379A  
To calculate actual peak switch current in continuous  
mode with a given set of conditions, use:  
The LT3437 is able to maintain peak switch current limit  
over the full duty cycle range by using patented circuitry to  
cancel the effects of slope compensation on peak switch  
current without affecting the frequency compensation it  
provides.  
VOUT V – VOUT  
(
IN  
)
ISW(PK) = IOUT  
+
2 L f V  
( )( )( IN  
)
Ifasmallinductorischosenwhichresultsindiscontinuous  
mode operation over the entire load range, the maximum  
load current is equal to:  
Maximum load current would be equal to maximum  
switch current for an infinitely large inductor, but with  
finite inductor size, maximum load current is reduced by  
one-half peak-to-peak inductor current. The following  
formula assumes continuous mode operation, implying  
IPK22 f L V  
( )( )( IN  
)
IOUT(MAX)  
=
2 VOUT V – VOUT  
(
)( IN  
)
that the term on the right (IP-P/2) is less than IOUT  
.
VOUT V – VOUT  
(
)( IN  
)
CHOOSING THE INDUCTOR  
IP-P  
2
IOUT(MAX) = IPK  
= IPK –  
2 L f V  
For most applications the output inductor will fall in the  
range of 68µH to 220µH. Lower values are chosen to  
reduce physical size of the inductor. Higher values allow  
( )( )( IN  
)
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more output current because they reduce peak current  
seen by the LT3437 switch, which has a 0.5A limit. Higher  
values also reduce output ripple voltage and reduce core  
loss.  
VIN = maximum input voltage  
f = switching frequency, 200kHz  
3. Decide if the design can tolerate an “open” core geom-  
etry like a rod or barrel, which has high magnetic field  
radiation, orwhetheritneedsaclosedcorelikeatoroid,  
to prevent EMI problems. This is a tough decision  
because the rods or barrels are temptingly cheap and  
small, and there are no helpful guidelines to calculate  
when the magnetic field radiation will be a problem.  
When choosing an inductor you might have to consider  
maximum load current, core and copper losses, allow-  
able component height, output voltage ripple, EMI, fault  
current in the inductor, saturation and of course cost.  
The following procedure is suggested as a way of han-  
dling these somewhat complicated and conflicting  
requirements.  
4. After making an initial choice, consider the secondary  
things like output voltage ripple, second sourcing, etc.  
Use the experts in Linear Technology’s applications  
department if you feel uncertain about the final choice.  
They have experience with a wide range of inductor  
types and can tell you about the latest developments in  
low profile, surface mounting, etc.  
1. Choose a value in microhenries such thatthe maximum  
load current plus half of the inductor ripple current is  
less than the minimum peak switch current (IPK).  
Choosing a small inductor with lighter loads may result  
in discontinuous mode of operation, but the LT3437 is  
designed to work well in either mode.  
Table 3. Inductor Selection Criteria  
Assume that the average inductor current is equal to  
load current and decide whether or not the inductor  
must withstand continuous fault conditions. If maxi-  
mum load current is 0.25A, for instance, a 0.25A  
inductor may not survive a continuous minimum peak  
switch current overload condition.  
VENDOR/  
PART NO.  
VALUE  
H)  
I
DCR  
(Ohms)  
HEIGHT  
(mm)  
DC(MAX)  
(mA)  
(
µ
Coiltronics  
UP1B-101  
100  
150  
220  
530  
460  
380  
1.11  
1.61  
1.96  
5.0  
5.0  
5.0  
UP1B-151  
UP2B-221  
For applications with a duty cycle above 50%, the  
inductor value should be chosen to obtain an inductor  
ripple current of less than 40% of the peak switch  
current.  
Coilcraft  
D01605T-473MX  
D01605T-104MX  
D03308P-154  
D03308P-224  
Sumida  
47  
450  
300  
600  
500  
1.1  
2.3  
1.8  
1.8  
3.0  
3.0  
100  
150  
220  
0.94  
1.6  
2. Calculate peak inductor current at full load current to  
ensure that the inductor will not saturate. Peak current  
canbesignificantlyhigherthanoutputcurrent,especially  
with smaller inductors and lighter loads, so do not omit  
thisstep.Powderedironcoresareforgivingbecausethey  
saturate softly, whereas ferrite cores saturate abruptly.  
Other core materials fall somewhere in between. The  
following formula assumes continuous mode of opera-  
tion, but it errs only slightly on the high side for discon-  
tinuous mode, so it can be used for all conditions.  
CDRH4D28-470  
CDRH4D28-101  
CDRH5D28-101  
47  
480  
290  
420  
0.387  
1.02  
3.0  
3.0  
3.0  
100  
100  
0.520  
Short-Circuit Considerations  
The LT3437 is a current mode controller. It uses the VC  
node voltage as an input to a current comparator which  
turns off the output switch on a cycle-by-cycle basis as  
this peak current is reached. The internal clamp on the VC  
node, nominally 1.5V, then acts as an output switch peak  
current limit. This action becomes the switch current limit  
specification. The maximum available output power is  
VOUT V – VOUT  
(
IN  
)
IPEAK = IOUT  
+
2 f L V  
( )( )( IN  
)
then determined by the switch current limit.  
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A potential controllability problem could occur under SOFT-START  
short-circuit conditions. If the power supply output is  
Forapplicationswhere[VIN/(VOUT +VF)]>10orlargeinput  
short circuited, the feedback amplifier responds to the low  
output voltage by raising the control voltage, VC, to its  
peak current limit value. Ideally, the output switch would  
be turned on, and then turned off as its current exceeded  
thevalueindicatedbyVC.However,thereisfiniteresponse  
time involved in both the current comparator and turn-off  
of the output switch. This results in a minimum on time  
surge currents cannot be tolerated, the LT3437 soft-start  
feature should be used to control the output capacitor  
charge rate during start-up, or during recovery from an  
output short circuit, thereby adding additional control  
over peak inductor current. The soft-start function limits  
the switch current via the VC pin to maintain a constant  
voltageramprate(dV/dt)attheoutputcapacitor.Acapaci-  
tor(C1inFigure2)fromtheCSS pintotheregulatedoutput  
voltage determines the output voltage ramp rate. When  
the current through the CSS capacitor exceeds the CSS  
threshold (ICSS), the voltage ramp of the output capacitor  
islimitedbyreducingtheVC pinvoltage.TheCSS threshold  
is proportional to the FB voltage (see Typical Performance  
Characteristics) and is defeated for FB voltages greater  
than0.9V(typical). TheoutputdV/dt canbeapproximated  
by:  
tON(MIN). When combined with the large ratio of VIN to  
(VF + I • R), the diode forward voltage plus inductor I • R  
voltage drop, the potential exists for a loss of control.  
Expressed mathematically the requirement to maintain  
control is:  
V
F
+ I•R  
V
IN  
f • tON  
where:  
f = switching frequency  
dV ICSS  
tON = switch on time  
=
dt CSS  
VF = diode forward voltage  
VIN = Input voltage  
but actual values will vary due to start-up load conditions,  
compensation values and output capacitor selection.  
I • R = inductor I • R voltage drop  
If this condition is not observed, the current will not be  
limited at IPK but will cycle-by-cycle ratchet up to some  
higher value. Using the nominal LT3437 clock frequency  
of 200kHz, a VIN of 40V and a (VF + I • R) of say 0.7V, the  
maximum tON to maintain control would be approximately  
90ns, an unacceptably short time.  
CSS = GND  
CSS = 0.1µF  
CSS = 0.01µF  
VOUT  
1V/DIV  
The solution to this dilemma is to slow down the oscillator  
to allow the current in the inductor to drop to a sufficiently  
low value such that the current does not continue to  
ratchet higher. When the FB pin voltage is abnormally low,  
thereby indicating some sort of short-circuit condition,  
the oscillator frequency will be reduced. Oscillator fre-  
quencyisreducedbyafactorof10whentheFBpinvoltage  
is below 0.4V and increases linearly to its typical value of  
200kHz at a FB voltage of 0.95V (see Typical Performance  
Characteristics). These oscillator frequency reductions  
during short-circuit conditions allow the LT3437 to main-  
tain current control  
VIN = 12V  
1ms/DIV  
3437 F04  
COUT = 100µF  
ILOAD = 200mA  
Figure 4. V  
dV/dt  
OUT  
Burst Mode OPERATION  
To enhance efficiency at light loads, the LT3437 automati-  
cally switches to Burst Mode operation which keeps the  
output capacitor charged to the proper voltage while  
minimizing the input quiescent current. During Burst  
Mode operation, the LT3437 delivers short bursts of  
3437f  
14  
LT3437  
W U U  
APPLICATIO S I FOR ATIO  
U
200  
current to the output capacitor followed by sleep periods  
where the output power is delivered to the load by the  
output capacitor. In addition, VIN and BIAS quiescent  
currents are reduced to typically 25µA and 150µA, respec-  
tively, duringthesleeptime. Astheloadcurrentdecreases  
towards a no load condition, the percentage of time that  
the LT3437 operates in sleep mode increases and the  
average input current is greatly reduced, resulting in  
higher efficiency.  
V
OUT  
= 3.3V  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
The minimum average input current depends on the VIN to  
VOUT ratio, VC frequency compensation, feedback divider  
network and Schottky diode leakage. It can be approxi-  
mated by the following equation:  
0
10 20 30 40 50 60 70 80  
INPUT VOLTAGE (V)  
3435 F05  
Figure 5. I vs V  
Q
IN  
If Burst Mode operation is undesirable, it can be defeated  
by placing 2V or greater on the SYNC pin. When Burst  
Modeoperationisdefeated, outputrippleatlightloadswill  
be reduced at the expense of light load efficiency.  
I
BIASS + IFB + IS  
(
)
VOUT  
I
IN(AVG) IVINS + ISHDN +  
V
η
( )  
IN  
where  
IVINS = input pin current in sleep mode  
VOUT = output voltage  
VIN = input voltage  
IBIASS = BIAS pin current in sleep mode  
IFB = feedback network current  
IS = catch diode reverse leakage at VOUT  
CATCH DIODE  
The catch diode carries load current during the SW off  
time. The average diode current is therefore dependent on  
the switch duty cycle. At high input to output voltage  
ratios, the diode conducts most of the time. As the ratio  
approachesunity, thediodeconductsonlyasmallfraction  
of the time. The most stressful condition for the diode is  
when the output is short circuited. Under this condition,  
thediodemustsafelyhandleIPEAK atmaximumdutycycle.  
η = low current efficiency (non Burst Mode operation)  
Example: For VOUT = 3.3V, VIN = 12V  
To maximize high and low load current efficiency, a fast  
switching diode with low forward drop and low reverse  
leakage should be used. Low reverse leakage is critical to  
maximize low current efficiency since its value over tem-  
perature can potentially exceed the magnitude of the  
LT3437 supply current. Low forward drop is critical for  
high current efficiency since the loss is proportional to  
forward drop.  
3.3  
12  
IIN(AVG) 25µA + 5µA +  
150µA + 12.5µA + 0.5µA  
(
)
0.75  
(
)
= 25µA + 5µA + 60µA = 90µA  
During the sleep portion of the Burst Mode cycle, the VC  
pin voltage is held just below the level needed for normal  
operation to improve transient response. See the Typical  
Performance Characteristics section for burst and tran-  
sient response waveforms.  
These requirements result in the use of a Schottky type  
diode. DC switching losses are minimized due to its low  
forward voltage drop, and AC behavior is benign due to its  
lackofasignificantreverserecoverytime.Schottkydiodes  
are generally available with reverse voltage ratings of 60V,  
andeven100V, andarepricecompetitivewithothertypes.  
3437f  
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LT3437  
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APPLICATIO S I FOR ATIO  
OPTIONAL  
The use of so-called “ultrafast” recovery diodes is gener-  
ally not recommended. When operating in continuous  
mode, the reverse recovery time exhibited by “ultrafast”  
diodes will result in a slingshot type effect. The power  
internalswitchwillrampupVIN currentintothediodeinan  
attempt to get it to recover. When the diode has finally  
turned off, some tens of nanoseconds later, the VSW node  
voltage ramps up at an extremely high dV/dt, perhaps 5V  
to even 10V/ns! With real world lead inductances, the VSW  
node can easily overshoot the VIN rail. This can result in  
poor RFI behavior, and if the overshoot is severe enough,  
damage the IC itself.  
V
V
BOOST  
SW  
V
OUT  
IN  
IN  
LT3437  
GND  
V
– V = V  
SW OUT  
= V + V  
IN OUT  
BOOST  
BOOST(MAX)  
V
(6a)  
V
V
BOOST  
SW  
IN  
IN  
LT3437  
V
GND  
OUT  
BOOST PIN  
For most applications, the boost components are a 0.1µF  
capacitor and a BAS21 diode. The anode is typically  
connected to the regulated output voltage, to generate a  
voltage approximately VOUT above VIN to drive the output  
stage (Figure 6a). However, the output stage discharges  
the boost capacitor during the on time of the switch. The  
output driver requires at least 2.5V of headroom through-  
out this period to keep the switch fully saturated. If the  
outputvoltageislessthan3.3V, itisrecommendedthatan  
alternate boost supply is used. The boost diode can be  
connected to the input (Figure 6b), but care must be taken  
to prevent the boost voltage (VBOOST = VIN • 2) from  
exceeding the BOOST pin absolute maximum rating. The  
additional voltage across the switch driver also increases  
power loss and reduces efficiency. If available, an inde-  
pendent supply can be used to generate the required  
BOOST voltage (Figure 6c). Tying BOOST to VIN or an  
independent supply may reduce efficiency, but it will  
reduce the minimum VIN required to start-up with light  
loads. If the generated BOOST voltage dissipates too  
much power at maximum load, the BOOST voltage the  
LT3437 sees can be reduced by placing a Zener diode in  
series with the BOOST diode (Figure 6a option).  
V
V
– V = V  
SW IN  
BOOST  
= 2V  
BOOST(MAX)  
IN  
(6b)  
V
V
BOOST  
V
V
IN  
IN  
DC  
LT3437  
GND  
SW  
OUT  
D
SS  
3437 F06  
V
– V = V  
SW DC  
= V + V  
DC IN  
BOOST  
V
BOOST(MAX)  
(6c)  
Figure 6. BOOST Pin Configurations  
ripple. The boost capacitor value could be reduced under  
less demanding conditions, but this will not improve  
circuitoperationorefficiency.Underlowinputvoltageand  
low load conditions, a higher value capacitor will reduce  
discharge ripple and improve start-up operation.  
SHUTDOWN FUNCTION AND UNDERVOLTAGE  
LOCKOUT  
The SHDN pin on the LT3437 controls the operation of the  
IC. When the voltage on the SHDN pin is below the 1.2V  
shutdown threshold, the LT3437 is placed in a “zero”  
supply current state. Driving the SHDN pin above the  
shutdown threshold enables normal operation. The SHDN  
pin has an internal sink current with a typical value of 5µA.  
A 0.1µF boost capacitor is recommended for most appli-  
cations. Almost any type of film or ceramic capacitor is  
suitable, but the ESR should be <1to ensure it can be  
fully recharged during the off time of the switch. The  
capacitor value is derived from worst-case conditions of  
4700ns on time, 11mA boost current and 0.7V discharge  
In addition to the shutdown feature, the LT3437 has an  
undervoltage lockout function. When the input voltage is  
3437f  
16  
LT3437  
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APPLICATIO S I FOR ATIO  
U
below 2.4V, switching will be disabled. The undervoltage  
lockout threshold doesn’t have any hysteresis and is  
mainly used to insure that all internal voltages are at the  
correct level before switching is enabled. If an undervolt-  
age lockout function with hysteresis is needed to limit  
inputcurrentatlowVIN toVOUT ratios, refertoFigure7and  
the following:  
See the Typical Performance Characteristics section for  
graphs of SHDN and VIN currents verses input voltage.  
SYNCHRONIZING  
Oscillatorsynchronizationtoanexternalinputisachieved  
by connecting a TTL logic-compatible square wave with a  
duty cycle between 25% and 75% to the LT3437 SYNC  
pin. The synchronizing range is equal to initial operating  
frequency up to 700kHz. This means that minimum  
practical sync frequency is equal to the worst-case high  
self-oscillating frequency (240kHz), not the typical oper-  
ating frequency of 200kHz. Caution should be used when  
synchronizing above 300kHz, because at higher sync  
frequencies the amplitude of the internal slope compen-  
sation used to prevent subharmonic switching is re-  
duced. Thistypeofsubharmonicswitchingonlyoccursat  
input voltages less than twice output voltage. Higher  
inductor values will tend to eliminate this problem. See  
Frequency Compensation section for a discussion of an  
entirely different cause of subharmonic switching before  
assuming that the cause is insufficient slope compensa-  
tion. Application Note 19 has more details on the theory  
of slope compensation.  
V
VSHDN  
R2  
SHDN  
R3  
VUVLO = R1  
+
+ ISHDN + V  
SHDN  
VOUT R1  
(
)
VHYST  
=
R3  
LT3437  
V
IN  
2
+
V
IN  
COMP  
2.4V  
1.3V  
ENABLE  
R1  
R3  
SHDN  
V
OUT  
10  
+
SHDN  
COMP  
5µA  
R2  
If the FB pin voltage is below 0.9V (power-up or output  
short-circuit conditions), the sync function is disabled.  
This allows the frequency foldback to operate to avoid  
hazardous conditions for the SW pin.  
3437 F07  
Figure 7. Undervoltage Lockout  
R1shouldbechosentominimizequiescentcurrentduring  
normal operation by the following equation:  
If a synchronization signal or logic-level above 2V is  
presentattheSYNCpin,BurstModeoperationisdisabled.  
Burst Mode operation can be enabled or disabled on the  
fly. If no synchronization or Burst Mode defeat is required,  
this pin should be connected to ground.  
V – 2V  
IN  
R1=  
1.5 I  
(
)
(
)
SHDN(TYP)  
Example:  
LAYOUT CONSIDERATIONS  
12 – 2  
R1=  
= 1.3MΩ  
As with all high frequency switchers, when considering  
layout, care must be taken in order to achieve optimal  
electrical, thermal and noise performance. For maximum  
efficiency, switch rise and fall times are typically in the  
nanosecond range. To prevent noise both radiated and  
conducted, the high speed switching current path,  
shown in Figure 8, must be kept as short as possible. This  
is implemented in the suggested layouts of Figure 9.  
Shortening this path will also reduce the parasitic trace  
1.5 5µA  
(
)
5 1.3MΩ  
(
)
R3 =  
= 6.5M(Nearest 1% 6.49M)  
1
1.3  
R2 =  
7 – 1.3  
1.3MΩ  
= 408k (Nearest 1% 412k)  
1.3  
1µA –  
6.49MΩ  
3437f  
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LT3437  
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APPLICATIO S I FOR ATIO  
inductance of approximately 25nH/inch. At switch off, this  
parasitic inductance produces a flyback spike across the  
LT3437 switch. When operating at higher currents and  
input voltages, with poor layout, this spike can generate  
voltages across the LT3437 that may exceed its absolute  
maximum rating. A ground plane should always be used  
under the switcher circuitry to prevent interplane coupling  
and overall noise.  
The VC and FB components should be kept as far away as  
possible from the switch and boost nodes. The LT3437  
pinout has been designed to aid in this. The ground for  
these components should be separated from the switch  
current path. Failure to do so will result in poor stability or  
subharmonic oscillation.  
Board layout also has a significant effect on thermal  
resistance. Pin 4/Pin 10 and the exposed die pad, Pin 11/  
Pin 17, are connected by a continuous copper plate that  
runs under the LT3437 die. This is the best thermal path  
for heat out of the package. Reducing the thermal resis-  
tance from Pin 4 and the exposed pad onto the board will  
reduce die temperature and increase the power capability  
of the LT3437. This is achieved by providing as much  
copper area as possible around the exposed pad. Adding  
multiple solder filled feedthroughs, under and around this  
pad, to an internal ground plane will also help. Similar  
treatment to the catch diode and coil terminations will  
reduce any additional heating effects.  
LT3437  
L1  
V
OUT  
V
IN  
SW  
V
IN  
+
HIGH  
C2  
FREQUENCY  
CIRCULATION  
PATH  
D1  
C1 LOAD  
3437 F08  
Figure 8. High Speed Switching Path  
L1  
THERMAL CALCULATIONS  
Power dissipation in the LT3437 chip comes from four  
sources: switch DC loss, switch AC loss, boost circuit  
current,andinputquiescentcurrent.Thefollowingformu-  
las show how to calculate each of these losses. These  
formulasassumecontinuousmodeoperation, andshould  
notbeusedforcalculatingefficiencyatlightloadcurrents.  
D1  
C1  
C2  
3437 F09a  
FE PACKAGE TOPSIDE METAL  
Switch loss:  
2
RSW IOUT VOUT  
(
) (  
)
PSW  
=
+ tEFF 1/2 IOUT  
V
f
(
)(  
)(
IN
)( )  
C1  
V
IN  
L1  
Boost current loss:  
D1  
2
V
(
OUT  
I
/30  
)
(
)
OUT  
P
=
BOOST  
V
IN  
C2  
Quiescent current loss:  
PQ = VIN (500µA) + VOUT (800µA)  
RSW = switch resistance (1 when hot )  
tEFF = effective switch current/voltage overlap time  
3437 F09b  
DD PACKAGE TOPSIDE METAL  
Figure 9. Suggested Layouts  
3437f  
18  
LT3437  
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APPLICATIO S I FOR ATIO  
U
(tr + tf + tIR + tIF)  
that AC switching loss is proportional to both operating  
frequency and output current. The majority of AC switch-  
ing loss is also proportional to the square of input voltage.  
tr = (VIN/0.6)ns  
tf = (VIN/2)ns  
For example, while the combination of VIN = 40V, VOUT  
=
tIR = tIF = (IOUT/0.05)ns  
f = switch frequency  
5V at 700mA and fOSC = 200kHz may be easily achievable,  
simultaneouslyraisingVIN to80VandfOSC to700kHzisnot  
possible. Nevertheless, input voltage transients up to 80V  
can usually be accommodated, assuming the resulting  
increase in internal dissipation is of insufficient time dura-  
tion to raise die temperature significantly.  
Example: with VIN = 40V, VOUT = 5V and IOUT = 250mA:  
1 0.25 2 5  
( )(  
) ( )  
+ 92 1/2 0.25 40 200e3  
P
SW  
=
( )( )  
(
)( )(  
)
40  
A second consideration is controllability. A potential limi-  
0.008 + 0.092 = 0.1W  
tation occurs with a high step-down ratio of VIN to VOUT  
,
5 2 0.25/30  
( )  
(
)
= 0.005W  
asthisrequiresacorrespondinglynarrowminimumswitch  
on time. An approximate expression for this (assuming  
continuous mode operation) is given as follows:  
P
=
BOOST  
40  
P = 40 0.0005 + 5 0.0008 = 0.024W  
(
)
(
)
Q
tON(MIN) = (VOUT + VF)/VIN(fOSC  
where:  
)
Total power dissipation is:  
PTOT = 0.1 + 0.065 + 0.024 = 0.13W  
VIN = input voltage  
Thermal resistance for the LT3437 package is influenced  
by the presence of internal or backside planes. With a full  
plane under the package, thermal resistance will be about  
45°C for the FE and DD packages. No plane will increase  
resistancetoabout150°C/W.Tocalculatedietemperature,  
use the proper thermal resistance number for the desired  
package and add in worst-case ambient temperature:  
VOUT = output voltage  
VF = Schottky diode forward drop  
fOSC = switching frequency  
A potential controllability problem arises if the LT3437 is  
called upon to produce an on time shorter than it is able to  
produce. Feedback loop action will lower, then reduce, the  
VC control voltage to the point where some sort of cycle-  
skipping or Burst Mode behavior is exhibited.  
TJ = TA + QJA (PTOT  
)
With the DD package (QJA = 45°C/W) at an ambient  
temperature of 70°C:  
In summary:  
TJ = 70 + 45(0.1) = 74.5°C  
1. Be aware that the simultaneous requirements of high  
VIN, high IOUT and high fOSC may not be achievable in  
practice due to internal dissipation. The Thermal Con-  
siderations section offers a basis to estimate internal  
power.Inquestionablecases,aprototypesupplyshould  
be built and exercised to verify acceptable operation.  
Input Voltage vs Operating Frequency Considerations  
TheabsolutemaximuminputsupplyvoltagefortheLT3437  
is specified at 80V. This is based solely on internal semi-  
conductor junction breakdown effects. Due to internal  
power dissipation, the actual maximum VIN achievable in  
a particular application may be less than this.  
2. The simultaneous requirements of high VIN, low VOUT  
and high fOSC can result in an unacceptably short mini-  
mumswitchontime. Cycleskippingand/orBurstMode  
behavior will result causing an increase in output volt-  
age ripple while maintaining the correct output voltage.  
A detailed theoretical basis for estimating internal power  
loss is given in the section Thermal Considerations. Note  
3437f  
19  
LT3437  
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APPLICATIO S I FOR ATIO  
FREQUENCY COMPENSATION  
Azerocanbeaddedintotheloopbyplacingaresistor(RC)  
attheVC pininserieswiththecompensationcapacitor,CC,  
or by placing a capacitor (CFB) between the output and the  
FB pin.  
Before starting on the theoretical analysis of frequency  
response,thefollowingshouldberemembered—theworse  
the board layout, the more difficult the circuit will be to  
stabilize. This is true of almost all high frequency analog  
circuits. Read the Layout Considerations section first.  
Common layout errors that appear as stability problems  
aredistantplacementofinputdecouplingcapacitorand/or  
catch diode, and connecting the VC compensation to a  
ground track carrying significant switch current. In addi-  
tion, the theoretical analysis considers only first order  
non-ideal component behavior. For these reasons, it is  
important that a final stability check is made with produc-  
tion layout and components.  
When using RC, the maximum value has two limitations.  
First, thecombinationofoutputcapacitorESRandRC may  
stopthelooprollingoffaltogether. Second, iftheloopgain  
is not rolled off sufficiently at the switching frequency,  
output ripple will perturb the VC pin enough to cause  
unstable duty cycle switching, similar to subharmonic  
oscillations. If needed, an additional capacitor (CF) can be  
addedacrosstheRC/CC networkfromtheVC pintoground  
to further suppress VC ripple voltage.  
With a tantalum output capacitor, the LT3437 already  
includes a resistor (RC) and filter capacitor (CF) at the VC  
pin (see Figures 10 and 11) to compensate the loop over  
the entire VIN range (to allow for stable pulse skipping for  
high VIN-to-VOUT ratios 10). A ceramic output capacitor  
canstillbeusedwithasimpleadjustmenttotheresistorRC  
for stable operation (see Ceramic Capacitors section for  
stabilizingLT3430). Ifadditionalphasemarginisrequired,  
a capacitor (CFB) can be inserted between the output and  
FB pin, but care must be taken for high output voltage  
applications. Sudden shorts to the output can create  
unacceptably large negative transients on the FB pin.  
The LT3437 uses current mode control. This alleviates  
many of the phase shift problems associated with the  
inductor. The basic regulator loop is shown in Figure 10.  
The LT3437 can be considered as two gm blocks, the error  
amplifier and the power stage.  
Figure 11 shows the overall loop response. At the VC pin,  
the frequency compensation components used are:  
RC = 25k, CC = 1500pF and CF = 330pF. The output  
capacitor used is a 100µF, 10V tantalum capacitor with  
typical ESR of 100m.  
TheESRofthetantalumoutputcapacitorprovidesauseful  
zerointheloopfrequencyresponseformaintainingstabil-  
ity. This ESR, however, contributes significantly to the  
ripple voltage at the output (see Output Ripple Voltage in  
the Applications Information section). It is possible to  
reduce capacitor size and output ripple voltage by replac-  
ing the tantalum output capacitor with a ceramic output  
capacitor because of its very low ESR. The zero provided  
by the tantalum output capacitor must now be reinserted  
back into the loop. Alternatively, there may be cases  
where, even with the tantalum output capacitor, an addi-  
tional zero is required in the loop to increase phase margin  
for improved transient response.  
For VIN-to-VOUT ratios < 10, higher loop bandwidths are  
possiblebyreadjustingthefrequencycompensationcom-  
ponents at the VC pin.  
When checking loop stability, the circuit should be oper-  
ated over the application’s full voltage, current and tem-  
peraturerange.Properloopcompensationmaybeobtained  
by empirical methods, as described in Application Notes  
19 and 76.  
3437f  
20  
LT3437  
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APPLICATIO S I FOR ATIO  
U
LT3437  
CURRENT MODE  
SW  
FB  
OUTPUT  
POWER STAGE  
g
= 1  
m
C
R1  
R2  
FB  
g
= 650µ  
m
+
V
C
ERROR  
AMP  
ESR  
R
1.6M  
C
1.25V  
C
OUT  
C
F
C
C
3437 F13  
Figure 10. Model for Loop Response  
100  
80  
0
V
C
C
= 3.3V  
OUT  
OUT  
F
= 100µF, 0.1  
–20  
= 330pF  
R
C
= 25k  
–40  
C
= 1500pF  
60  
C
–60  
I
= 250mA  
LOAD  
40  
–80  
–100  
–120  
–140  
–160  
–180  
20  
0
–20  
–40  
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
3437 F12  
Figure 11. Overall Loop Response  
3437f  
21  
LT3437  
U
PACKAGE DESCRIPTIO  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
0.675 ±0.05  
3.50 ±0.05  
2.15 ±0.05 (2 SIDES)  
1.65 ±0.05  
PACKAGE  
OUTLINE  
0.25 ± 0.05  
0.50  
BSC  
2.38 ±0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
R = 0.115  
TYP  
6
0.38 ± 0.10  
10  
3.00 ±0.10  
(4 SIDES)  
1.65 ± 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
(DD10) DFN 1103  
5
1
0.25 ± 0.05  
0.50 BSC  
0.75 ±0.05  
0.200 REF  
2.38 ±0.10  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
3437f  
22  
LT3437  
U
PACKAGE DESCRIPTIO  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663)  
Exposed Pad Variation BC  
4.90 – 5.10*  
(.193 – .201)  
3.58  
(.141)  
3.58  
(.141)  
16 1514 13 12 1110  
9
6.60 ±0.10  
4.50 ±0.10  
2.94  
(.116)  
6.40  
(.252)  
BSC  
SEE NOTE 4  
2.94  
(.116)  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT  
1.10  
(.0433)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0.25  
REF  
0° – 8°  
0.65  
(.0256)  
BSC  
0.09 – 0.20  
(.0035 – .0079)  
0.50 – 0.75  
(.020 – .030)  
0.05 – 0.15  
(.002 – .006)  
0.195 – 0.30  
FE16 (BC) TSSOP 0204  
(.0077 – .0118)  
TYP  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
3437f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
23  
LT3437  
U
TYPICAL APPLICATIO  
14V to 3.3V Step-Down Converter with  
100µA No Load Quiescent Current  
Supply Current vs  
Input Voltage  
Efficiency and Power Loss  
vs Load Current  
200  
180  
160  
140  
120  
100  
80  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
T
= 12V  
V
IN  
OUT  
= 25°C  
OUT  
= 3.3V  
3.3V  
V
BOOST  
SW  
IN  
V
IN  
2.2µF  
100V  
CER  
100µH  
400mA  
0.1µF  
A
BAS21  
4.5V TO  
80V*  
SHDN  
LT3437  
EFFICIENCY  
0.1µF  
10MQ100N  
V
C
C
SS  
V
BIAS  
330pF  
1500pF  
25k  
165k  
100k  
27pF  
100µF  
6.3V  
TANT  
SYNC  
GND  
FB  
60  
POWER LOSS  
40  
20  
3437 TA04  
*FOR INPUT VOLTAGES ABOVE 60V SOME RESTRICTIONS MAY APPLY  
0
1000  
0
0
10 20 30 40 50 60 70 80  
0.1  
1
10  
100  
INPUT VOLTAGE (V)  
LOAD CURRENT (mA)  
3435 TA05  
3437 G01  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LT1765  
25V, 3A (I ), 1.25MHz, High Efficiency Step-Down DC/DC  
Converter  
V : 3V to 25V, V  
SO-8, TSSOP16E  
= 1.20V, I = 1mA, I < 15µA,  
OUT(MIN) Q SD  
OUT  
IN  
LT1766  
LT1767  
LT1776  
LT1936  
LT1940  
LT1956  
LT1976  
LT1977  
LT3010  
LT3430  
LT3431  
60V, 1.2A (I ), 200kHz, High Efficiency Step-Down DC/DC  
Converter  
V : 5.5V to 60V, V  
= 1.20V, I = 2.5mA,  
OUT(MIN) Q  
OUT  
IN  
I
< 25µA, TSSOP16/E  
SD  
25V, 1.5A (I ), 1.25MHz, High Efficiency Step-Down DC/DC  
V : 3V to 25V, V  
= 1.20V, I = 1mA, I < 6µA,  
OUT  
IN  
OUT(MIN) Q SD  
Converter  
MS8/E  
40V, 550mA (I ), 200kHz, High Efficiency Step-Down DC/DC  
V : 7.4V to 40V, V  
= 1.24V, I = 3.2mA,  
Q
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
Converter  
I
< 30µA, N8, S8  
SD  
36V, 1.4A, 500kHz, High Efficiency Step-Down DC/DC Converter  
V : 3.6V to 36V, V  
= 1.2V, I = 1.8mA,  
Q
IN  
I
4mA MS8/E  
SD  
Dual 1.2A (I ), 1.1MHz, High Efficiency Step-Down DC/DC  
V : 3V to 25V, V  
= 1.2V, I = 3.8mA, TSSOP-16E  
OUT  
IN  
OUT(MIN) Q  
Converter  
60V, 1.2A (I ), 500kHz, High Efficiency Step-Down DC/DC  
V : 5.5V to 60V, V  
= 1.20V, I = 2.5mA,  
OUT(MIN) Q  
OUT  
IN  
Converter  
I
< 25µA, TSSOP16/E  
SD  
60V, 1.5A (I ), 200kHz, High Efficiency Step-Down DC/DC  
V : 3.3V to 60V, I = 100µA, I < 1µA, TSSOP-16E  
IN Q SD  
OUT  
Converter  
60V, 1.5A (I ), 500kHz, High Efficiency Step-Down DC/DC  
V : 3.3V to 60V, I = 100µA, I < 1µA, TSSOP-16E  
IN Q SD  
OUT  
Converter  
80V, 50mA, Low Noise Linear Regulator  
V : 1.5V to 80V, V  
= 1.28V, I = 30µA, I < 1µA,  
Q SD  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
MS8E  
60V, 2.5A (I ), 200kHz, High Efficiency Step-Down DC/DC  
V : 5.5V to 60V, V  
= 1.20V, I = 2.5mA,  
Q
OUT  
IN  
Converter  
I
< 30µA, TSSOP-16E  
SD  
60V, 2.5A (I ), 500kHz, High Efficiency Step-Down DC/DC  
V : 5.5V to 60V, V  
= 1.20V, I = 2.5mA,  
Q
OUT  
IN  
Converter  
I
< 30µA, TSSOP-16E  
SD  
LT3433  
60V, 400mA (I ), 200kHz/500kHz, Buck-Boost DC/DC Converter  
V : 5V to 60V, V : 3.3V to 20V, I = 100µA, TSSOP-16E  
IN OUT Q  
OUT  
LT3434/LT3435  
LT3470  
60V, 3A (I ), 200kHz, High Efficiency Step-Down DC/DC Converter  
V : 3.3V to 60V, I = 100µA, I < 1µA, TSSOP-16E  
OUT  
IN  
Q
SD  
40V, 300mA, MicroPower Buck Regulator with Integrated Boost and  
Catch Diodes  
V : 4V to 40V, V = 1.25V, I = 26µA, ThinSOT  
OUT(MIN) Q  
IN  
LTC3727/LTC3727-1 36V, 500kHz, High Efficiency Step-Down DC/DC Controllers  
V : 4V to 36V, V  
QFN-32, SSOP-28  
= 0.8V, I = 670µA, I < 20µA,  
OUT(MIN) Q SD  
IN  
3437f  
LT/TP 0605 500 PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
24  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
© LINEAR TECHNOLOGY CORPORATION 2005  

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