LT4356 [Linear]

Overvoltage/Overcurrent Protection Controller; 过压/过流保护控制器
LT4356
型号: LT4356
厂家: Linear    Linear
描述:

Overvoltage/Overcurrent Protection Controller
过压/过流保护控制器

控制器
文件: 总16页 (文件大小:407K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC4361-1/LTC4361-2  
Overvoltage/Overcurrent  
Protection Controller  
FeaTures  
DescripTion  
n
2.5V to 5.5V Operation  
TheLTC®4361overvoltage/overcurrentprotectioncontrol-  
ler safeguards 2.5V to 5.5V systems from input supply  
overvoltage. It is designed for portable devices with  
multiple power supply options including wall adaptors,  
car battery adaptors and USB ports.  
n
Overvoltage Protection Up to 80V  
n
No Input Capacitor or TVS Required for Most  
Applications  
n
2% Accurate 5.8V Overvoltage Threshold  
n
10% Accurate 50mV Overcurrent Circuit Breaker  
The LTC4361 controls an external N-channel MOSFET in  
series with the input power supply. During overvoltage  
transients, the LTC4361 turns off the MOSFET within  
1µs, isolating downstream components from the input  
supply. Inductive cable transients are absorbed by the  
MOSFET and load capacitance. In most applications, the  
LTC4361 provides protection from transients up to 80V  
without requiring transient voltage suppressors or other  
external components.  
n
<1µs Overvoltage Turn-Off, Gentle Shutdown  
n
Controls N-Channel MOSFET  
n
Adjustable Power-Up dV/dt Limits Inrush Current  
n
Reverse Voltage Protection  
n
Power Good Output  
n
Low Current Shutdown  
n
Latchoff (LTC4361-1) or Auto-Retry (LTC4361-2)  
After Overcurrent  
n
Available in 8-Lead ThinSOT™ and 8-Lead  
The LTC4361 has a delayed start-up and adjustable dV/dt  
(2mm × 2mm) DFN Packages  
ramp-upforinrushcurrentlimiting.APWRGDpinprovides  
powergoodmonitoringforV .TheLTC4361featuresasoft  
IN  
applicaTions  
shutdown controlled by the ON pin and drives an optional  
externalP-channelMOSFETfornegativevoltageprotection.  
Followinganovervoltagecondition,theLTC4361automati-  
cally restarts with a start-up delay. After an overcurrent  
fault, the LTC4361-1 remains off while the LTC4361-2  
automatically restarts after a 130ms start-up delay.  
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and  
n
USB Protection  
n
Handheld Computers  
n
Cell/Smart Phones  
n
MP3/MP4 Players  
n
Digital Cameras  
ThinSOT, Hot Swap, No R  
and PowerPath are trademarks of Linear Technology  
SENSE  
Corporation. All other trademarks are the property of their respective owners.  
Typical applicaTion  
Protection from Overvoltage and Overcurrent  
Output Protected from Overvoltage at Input  
0.025Ω  
V
Si1470DH  
OUT  
V
IN  
V
IN  
5V  
5V  
1.5A  
C
OUT  
GATE  
SENSE OUT  
V
OUT  
IN  
V
, V  
IN OUT  
5V/DIV  
LTC4361  
ON PWRGD  
V
GATE  
10V/DIV  
GND  
436112 TA01a  
436112 TA01b  
0.5µs/DIV  
Si1470DH  
= 10µF  
C
OUT  
436112fb  
1
LTC4361-1/LTC4361-2  
absoluTe maximum raTings  
(Notes 1, 2)  
Bias Supply Voltage (IN)............................ –0.3V to 85V  
Input Voltages  
SENSE ................................................... –0.3V to 85V  
OUT, ON................................................... –0.3V to 9V  
Output Voltages  
Operating Temperature Range  
LTC4361C ................................................ 0°C to 70°C  
LTC4361I .............................................–40°C to 85°C  
LTC4361H.......................................... –40°C to 125°C  
Storage Temperature Range .................. –65°C to 150°C  
Lead Temperature (Soldering, 10 sec)  
PWRGD.................................................... –0.3V to 9V  
GATE (Note 3)........................................ –0.3V to 15V  
GATEP.................................................... –0.3V to 85V  
IN to GATEP ........................................... –0.3V to 10V  
TSOT.................................................................300°C  
pin conFiguraTion  
TOP VIEW  
TOP VIEW  
1
2
3
4
8
7
6
5
IN  
GND  
GATEP  
OUT  
ON 1  
OUT 2  
GATEP 3  
GND 4  
8 PWRGD  
7 GATE  
6 SENSE  
5 IN  
SENSE  
GATE  
PWRGD  
9
ON  
TS8 PACKAGE  
8-LEAD PLASTIC TSOT-23  
DC PACKAGE  
8-LEAD (2mm × 2mm) PLASTIC DFN  
T
= 125°C, θ = 195°C/W  
JA  
JMAX  
T
= 125°C, θ = 102°C/W  
JA  
EXPOSED PAD (PIN 9) IS GND, CONNECTION OPTIONAL  
JMAX  
orDer inFormaTion  
Lead Free Finish  
TAPE AND REEL (MINI)  
LTC4361CTS8-1#TRMPBF  
LTC4361CTS8-2#TRMPBF  
LTC4361ITS8-1#TRMPBF  
LTC4361ITS8-2#TRMPBF  
LTC4361HTS8-1#TRMPBF  
LTC4361HTS8-2#TRMPBF  
LTC4361CDC-1#TRMPBF  
LTC4361CDC-2#TRMPBF  
LTC4361IDC-1#TRMPBF  
LTC4361IDC-2#TRMPBF  
LTC4361HDC-1#TRMPBF  
LTC4361HDC-2#TRMPBF  
TAPE AND REEL  
PART MARKING*  
LTDWN  
LTFMN  
LTDWN  
LTFMN  
LTDWN  
LTFMN  
LDWP  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
LTC4361CTS8-1#TRPBF  
LTC4361CTS8-2#TRPBF  
LTC4361ITS8-1#TRPBF  
LTC4361ITS8-2#TRPBF  
LTC4361HTS8-1#TRPBF  
LTC4361HTS8-2#TRPBF  
LTC4361CDC-1#TRPBF  
LTC4361CDC-2#TRPBF  
LTC4361IDC-1#TRPBF  
LTC4361IDC-2#TRPBF  
LTC4361HDC-1#TRPBF  
LTC4361HDC-2#TRPBF  
8-Lead Plastic TSOT-23  
0°C to 70°C  
8-Lead Plastic TSOT-23  
0°C to 70°C  
8-Lead Plastic TSOT-23  
–40°C to 85°C  
–40°C to 85°C  
–40°C to 125°C  
–40°C to 125°C  
0°C to 70°C  
8-Lead Plastic TSOT-23  
8-Lead Plastic TSOT-23  
8-Lead Plastic TSOT-23  
8-Lead (2mm × 2mm) Plastic DFN  
8-Lead (2mm × 2mm) Plastic DFN  
8-Lead (2mm × 2mm) Plastic DFN  
8-Lead (2mm × 2mm) Plastic DFN  
8-Lead (2mm × 2mm) Plastic DFN  
8-Lead (2mm × 2mm) Plastic DFN  
LFMP  
0°C to 70°C  
LDWP  
–40°C to 85°C  
–40°C to 85°C  
–40°C to 125°C  
–40°C to 125°C  
LFMP  
LDWP  
LFMP  
TRM = 500 pieces. *Temperature grades are identified by a label on the shipping container.  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
Consult LTC Marketing for information on lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
436112fb  
2
LTC4361-1/LTC4361-2  
elecTrical characTerisTics The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 5V, VON = 0V, unless otherwise noted.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
l
l
l
l
V
V
Input Voltage Range  
2.5  
1.8  
80  
2.47  
400  
10  
V
V
IN  
Input Undervoltage Lockout  
Input Supply Current  
V
V
V
Rising  
= 0V  
2.1  
220  
1.5  
IN(UVL)  
IN  
I
IN  
µA  
µA  
ON  
ON  
= 2.5V  
Thresholds  
l
l
l
l
V
V
IN Pin Overvoltage Threshold  
IN Pin Overvoltage Recovery Threshold  
Overvoltage Hysteresis  
V
V
Rising  
Falling  
5.684  
5.51  
25  
5.8  
5.7  
100  
50  
5.916  
5.85  
260  
55  
V
V
IN(OV)  
IN  
IN  
IN(OVL)  
mV  
mV  
V  
V  
OV  
OC  
Overcurrent Threshold  
V
– V  
45  
IN  
SENSE  
External Gate Drive  
l
l
External N-Channel MOSFET Gate Drive 2.5V ≤ V < 3V, I  
= –1µA  
= –1µA  
3.5  
4.5  
4.5  
6
6
7.9  
V
V
V  
GATE  
IN  
GATE  
GATE  
(V  
– V  
)
3V ≤ V < 5.5V, I  
GATE  
OUT  
IN  
l
l
V
GATE High Threshold for PWRGD Status  
V
IN  
V
IN  
= 3.3V  
= 5V  
5.7  
6.7  
6.3  
7.2  
6.8  
7.8  
V
V
GATE(TH)  
l
l
I
GATE Pull-Up Current  
GATE Ramp-Up  
V
V
= 1V  
–4.5  
1.3  
–10  
3
–15  
4.5  
µA  
GATE(UP)  
GATE  
GATE  
V
= 1V to 7V  
V/ms  
GATE(UP)  
GATE(FST)  
l
l
I
I
GATE Pull-Down Current  
Fast Turn-Off, V = 6V, V  
= 9V (C-, I-Grade)  
(H-Grade)  
15  
12  
30  
30  
60  
60  
mA  
mA  
IN  
GATE  
l
GATE Pull-Down Current  
V
= 2.5V, V = 9V  
GATE  
5
40  
80  
µA  
GATE(DN)  
ON  
Input Pins  
I
I
SENSE Input Current  
OUT Input Current  
V
= 5V  
SENSE  
10  
nA  
SENSE(IN)  
OUT(IN)  
l
l
V
V
= 5V, V = 0V  
5
10  
0
20  
3
µA  
µA  
OUT  
OUT  
ON  
ON  
= 5V, V = 2.5V  
l
l
V
ON Input Threshold  
0.4  
2
1.5  
10  
V
ON(TH)  
I
ON Pull-Down Current  
V
= 2.5V  
5
µA  
ON  
ON  
Output Pins  
l
l
V
IN to GATEP Clamp Voltage  
GATEP Resistive Pull-Down  
PWRGD Output Low Voltage  
V
V
V
= 8V to 80V  
5
5.8  
2
7.9  
3.2  
V
GATEP(CLP)  
IN  
R
= 3V  
0.6  
MΩ  
GATEP  
GATEP  
l
l
V
= 5V, I = 3mA  
PWRGD  
(C-, I-Grade)  
(H-Grade)  
0.23  
0.23  
0.4  
0.5  
V
V
PWRGD(OL)  
IN  
l
R
PWRGD Pull-Up Resistance to OUT  
V
= 6.5V, V  
= 1V  
PWRGD  
220  
500  
800  
kΩ  
PWRGD  
IN  
Delay  
l
t
t
GATE On Delay  
V
High to I = –5µA  
GATE  
50  
5
130  
219  
ms  
ON  
IN  
l
l
GATE Off Propagation Delay  
V
V
= Step 5V to 6.5V to PWRGD High  
0.25  
10  
1
20  
µs  
µs  
OFF  
IN  
IN  
– V  
= Step 0mV to 100mV  
SENSE  
l
l
t
t
PWRGD Delay  
V
V
= Step 5V to 6.5V  
GATE  
0.25  
65  
1
µs  
PWRGD  
IN  
> V  
to PWRGD Low  
GATE(TH)  
25  
105  
ms  
l
ON High to GATE Off  
V
= Step 0V to 2.5V  
ON  
2
5
µs  
ON(OFF)  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 2: All currents into device pins are positive; all currents out of device  
pins are negative. All voltages are referenced to GND unless otherwise  
specified.  
Note 3: An internal clamp limits V  
to a minimum of 4.5V above V  
.
GATE  
OUT  
Driving this pin to voltages beyond this clamp may damage the device.  
436112fb  
3
LTC4361-1/LTC4361-2  
Typical perFormance characTerisTics  
TA = 25°C, VIN = 5V, VON = 0V, unless otherwise noted.  
Input Supply Current  
vs Input Voltage  
GATE Fast Pull-Down Current  
vs Temperature  
GATE Drive vs GATE Current  
40  
35  
30  
25  
10000  
1000  
8
7
6
5
4
3
2
1
0
V
V
= 6V  
IN  
GATE  
= 9V  
V
= 0V  
ON  
V
= 5V  
IN  
100  
V
= 3V  
IN  
V
V
= 2.5V  
ON  
10  
1
= 2.5V  
IN  
20  
0.1  
–50 –25  
0
25  
50  
75 100 125  
1
10  
(V)  
100  
0
2
4
6
8
10  
12  
TEMPERATURE (°C)  
V
IN  
I
(µA)  
GATE  
436112 G03  
436112 G01  
436112 G02  
GATE Voltage and GATE High  
PWRGD Voltage  
vs PWRGD Current  
GATE Off Propagation Delay  
vs Overdrive  
Threshold (for PWRGD Status)  
vs Input Voltage  
500  
400  
300  
200  
100  
0
8
12  
11  
10  
9
V
= STEP 5V TO (V  
+ V  
)
V
= V  
IN  
IN(OV)  
OVDRV  
IN OUT  
7
6
5
4
3
2
1
0
V
GATE  
8
V
GATE(TH)  
7
6
5
4
2.5  
0
1
2
3
(mA)  
4
5
0
1
1.5  
(V)  
2
2.5  
4
V
IN  
4.5  
(V)  
5
5.5  
6
0.5  
3.5  
3
I
V
PWRGD  
OVDRV  
436112 G04  
436112 G05  
436112 G06  
Normal Start-Up Sequence  
GATE Slow Ramp-Up  
Entering Sleep Mode  
V
ON  
5V/DIV  
V
V
IN  
IN  
5V/DIV  
5V/DIV  
V
V
V
OUT  
OUT  
OUT  
5V/DIV  
5V/DIV  
5V/DIV  
V
V
V
GATE  
GATE  
GATE  
10V/DIV  
10V/DIV  
10V/DIV  
I
I
I
CABLE  
CABLE  
CABLE  
0.5A/DIV  
0.5A/DIV  
0.5A/DIV  
436112 G07  
436112 G08  
436112 G09  
20ms/DIV  
1ms/DIV  
50µs/DIV  
FIGURE 5 CIRCUIT  
FIGURE 5 CIRCUIT  
FIGURE 5 CIRCUIT  
R
R
= 150mΩ, L = 0.7µH  
IN  
SENSE  
LOAD = 10Ω, C  
IN  
R
R
= 150mΩ, L = 0.7µH  
R
R
= 150mΩ, L = 0.7µH  
IN  
SENSE  
IN  
IN  
SENSE  
IN  
= 25mΩ  
= 25mΩ  
= 25mΩ  
= 10µF  
OUT  
LOAD = 10Ω, C  
= 10µF  
LOAD = 10Ω, C  
= 10µF  
OUT  
OUT  
436112fb  
4
LTC4361-1/LTC4361-2  
pin FuncTions  
ExposedPad(DFN):Ground.ConnectiontoPCBisoptional.  
V
V to release the overvoltage lockout. Dur-  
OV  
IN(OV)  
ing lockout, GATE is held low and the PWRGD pull-down  
GATE: Gate Drive for External N-Channel MOSFET. An  
internal charge pump provides a 10µA pull-up current to  
charge the gate of the external N-channel MOSFET. An  
additional ramp circuit limits the GATE ramp rate when  
turning on to 3V/ms. For slower ramp rates, connect an  
external capacitor from GATE to GND. An internal clamp  
limits GATE to 6V above the OUT pin voltage. An internal  
GATE high comparator controls the PWRGD pin.  
releases.  
ON:OnControlInput.AlogiclowatONenablestheLTC4361.  
A logic high at ON activates a low current pull-down at the  
GATE pin and causes the LTC4361 to enter a low current  
sleep mode. An internal 5µA current pulls ON down to  
ground. Connect to ground or leave open if unused.  
OUT:OutputVoltageSenseInputforGATEClamp.Connect  
to the source of the external N-channel MOSFET to sense  
the output voltage for GATE to OUT clamp.  
GATEP: Gate Drive for External P-Channel MOSFET. GATEP  
connectstothegateofanoptionalexternalP-channelMOS-  
FET to protect against negative voltages at IN. This pin is  
internally clamped to 5.8V below V . An internal 2M resis-  
tor connects this pin to ground. Connect to IN if not used.  
PWRGD: Power Good Status. Open-drain output with  
IN  
internal 500k resistive pull-up to OUT. Pulls low 65ms  
after GATE ramps above V  
.
GATE(TH)  
GND: Device Ground.  
SENSE: Current Sense Input. Connect a sense resistor  
between IN and SENSE. An overcurrent protection circuit  
turns off the N-channel MOSFET when the voltage across  
the sense resistor exceeds 50mV for more than 10µs.  
IN: Supply Voltage Input. Connect this pin to the input  
power supply. This pin has an overvoltage threshold of  
5.8V. After an overvoltage event, this pin must fall below  
436112fb  
5
LTC4361-1/LTC4361-2  
block Diagram  
GATEP  
200k  
IN  
SENSE  
5.8V  
CHARGE  
PUMP  
1.8M  
10µA  
GATE  
5.8V  
GATE HIGH  
ON  
+
COMPARATOR  
1V  
+
OUT  
V
GATE(TH)  
5µA  
OVERCURRENT  
COMPARATOR  
+
50mV  
+
CONTROL  
OVERVOLTAGE  
COMPARATOR  
500k  
+
5.8V  
5.7V  
PWRGD  
GND  
436112 BD  
operaTion  
Mobile devices like cell phones and MP3/MP4 players have  
highly integrated subsystems fabricated from deep submi-  
cronCMOSprocesses.Thesmallformfactorisaccompanied  
by low absolute maximum voltage ratings. The sensitive  
electronics are susceptible to damage from transient or DC  
overvoltage conditions from the power supply.  
If the voltage at the IN pin exceeds 5.8V (V  
GATE is pulled low quickly to protect the load. The  
incoming power supply must remain below 5.7V  
),  
IN(OV)  
(V  
V ) for the duration of the start-up delay to  
IN(OV)  
OV  
restart the GATE ramp-up.  
AsenseresistorplacedbetweenINandSENSEimplements  
an overcurrent protection with a 50mV trip threshold and  
a 10µs glitch filter. After an overcurrent, the LTC4361-  
1 latches off while the LTC4361-2 restarts following a  
130ms delay.  
Failures or faults in the power adaptor can cause an overvolt-  
age event. So can hot-plugging an AC adaptor into the power  
input of the mobile device (see LTC Application Note 88).  
Today’smobiledevicesderivetheirpowersupplyorrecharge  
theirinternalbatteriesfrommultiplealternativeinputslikeAC  
wall adaptors, car battery adaptors and USB ports. A user  
may unknowingly plug in the wrong adaptor, damaging the  
device with a high or even a negative power supply voltage.  
The LTC4361 has a CMOS compatible ON input. When  
driven low, the part is enabled. When driven high, the  
external N-channel MOSFET is turned off and the supply  
current of the LTC4361 drops to 1.5µA. The PWRGD pull-  
down releases during this low current sleep mode, UVLO,  
overvoltage or overcurrent and the subsequent 130ms  
start-up delay. After the start-up delay, GATE starts its  
The LTC4361 protects low voltage electronics from these  
overvoltage conditions by controlling a low cost external  
N-channel MOSFET configured as a pass transistor. At  
power-up (V > 2.1V), a start-up delay cycle begins. Any  
slow ramp-up and ramps higher than V  
to trigger  
IN  
GATE(TH)  
overvoltage condition causes the delay cycle to continue  
until a safe voltage is present. When the delay cycle com-  
pletes, an internal high side switch driver slowly ramps up  
the MOSFET gate, powering up the output at a controlled  
rateandlimitingtheinrushcurrenttotheoutputcapacitor.  
a 65ms delay cycle. When that completes, PWRGD pulls  
low.The LTC4361 has a GATEP pin that drives an optional  
external P-channel MOSFET to provide protection against  
negative voltages at IN.  
436112fb  
6
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
The typical LTC4361 application protects 2.5V to 5.5V  
systems in portable devices from power supply overvolt-  
age. The basic application circuit is shown in Figure 1.  
Device operation and external component selection is  
discussed in detail in the following sections.  
The GATE ramp rate is limited to 3V/ms. V  
follows at  
OUT  
a similar rate which results in an inrush current into the  
load capacitor C  
of:  
OUT  
dVGATE  
dt  
IINRUSH =COUT  
=COUT 3 mA/µF  
[
]
The servo loop is compensated by the parasitic capaci-  
tance of the external MOSFET. No further compensation  
components are normally required. In the case where  
the parasitic capacitance is less than 100pF, a 100pF  
compensation capacitor between GATE and ground may  
be required.  
R
M1  
Si1470DH  
SENSE  
0.025Ω  
V
OUT  
V
IN  
5V  
5V  
1.5A  
C
OUT  
10µF  
GATE  
SENSE OUT  
LTC4361  
IN  
An even slower GATE ramp and lower inrush current can  
be achieved by connecting an external capacitor, C , from  
ON PWRGD  
G
GND  
GATE to ground. The voltage at GATE then ramps up with a  
436112 F01  
slopeequalto10µA/C [V/s].ChooseC usingtheformula:  
G
G
10µA  
IINRUSH  
Figure 1. Protection from Input Overvoltage and Overcurrent  
CG =  
COUT  
Start-Up  
Overvoltage  
When power is first applied, V must remain below 5.7V  
When V is less than the undervoltage lockout level of  
IN  
IN  
2.1V,theGATEdriverisheldlowandthePWRGDpull-down  
(V  
V ) for more than 130ms before GATE is  
IN(OV)  
OV  
is high impedance. When V rises above 2.1V and ON is  
IN  
ramped up to turn on the MOSFET. If V then rises above  
IN  
held low, a 130ms delay cycle starts. Any undervoltage or  
5.8V (V  
), the overvoltage comparator activates the  
IN(OV)  
overvoltage event at IN (V < 2.1V or V > 5.7V) restarts  
IN  
IN  
30mA fast pull-down on GATE within 1µs. After an over-  
the delay cycle. This delay allows the N-channel MOSFET  
to isolate the output from any input transients that occur  
at start-up. When the delay cycle completes, GATE starts  
its slow ramp-up.  
voltage condition, the MOSFET is held off until V once  
IN  
again remains below 5.7V for 130ms.  
Overcurrent  
GATE Control  
The overcurrent comparator protects the MOSFET from  
excessive current. It trips when the SENSE pin falls more  
than 50mV below IN for 10µs. When the overcurrent  
comparator trips, GATE is pulled low quickly and the  
PWRGDpull-downreleases.TheLTC4361-2automatically  
tries to apply power again after a 130ms start-up delay.  
An internal charge pump provides a gate overdrive greater  
than 3.5V when 2.5V ≤ V < 3V. If V ≥ 3V, the gate drive  
is guaranteed to be greater than 4.5V. This allows the use  
of logic-level N-channel MOSFETs. An internal 6V clamp  
between GATE and OUT protects the MOSFET gate.  
IN  
IN  
436112fb  
7
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
The LTC4361-1 has an internal latch that maintains this  
off state until it is reset. To reset this latch, cycle IN be-  
PWRGD Output  
PWRGD is an active low output with a MOSFET pull-down  
togroundanda500kresistivepull-uptoOUT.ThePWRGD  
pin pull-down releases during the low current sleep mode  
(invoked by ON high), UVLO, overvoltage or overcurrent  
and the subsequent 130ms start-up delay. After the start-  
up delay, GATE starts its slow ramp-up and control of the  
PWRGDpull-downpassesontotheGATEhighcomparator.  
low 2.1V (V  
) or ON above 1.5V (V  
) for more  
IN(UVL)  
ON(TH)  
than 500µs. After reset, the LTC4361-1 goes through the  
start-up cycle.  
Inapplicationsnotrequiringtheovercurrentprotection,tie  
the SENSE pin to the IN pin. To implement an overcurrent  
threshold I  
, choose R  
using the formula:  
TRIP  
SENSE  
V
>V  
formorethan65ms assertsthePWRGD  
GATE  
pull-down and V  
GATE(TH)  
VOC  
ITRIP  
RSENSE  
=
< V  
releases the pull-down.  
GATE  
GATE(TH)  
The PWRGD pull-down is capable of sinking up to 3mA of  
current allowing it to drive an optional LED. To interface  
PWRGDtoanotherI/Orail,connectaresistorfromPWRGD  
to the I/O rail with a resistance low enough to override  
the internal 500k pull-up to OUT. Figure 2 details PWRGD  
behaviorforaLTC4361-2with1kpull-upto5VatPWRGD.  
After choosing the R , keep in mind that:  
SENSE  
VOC(MAX)  
ITRIP(MAX)  
=
RSENSE(MIN)  
VOC(MIN)  
ITRIP(MIN)  
=
RSENSE(MAX)  
OC  
START-UP  
FROM UVLO  
RESTART  
FROM OV  
RESTART  
FROM ON  
RESTART  
FROM OC  
OV  
ON  
OC  
THRESHOLD  
I
CABLE  
V
IN(OV)  
V
V  
IN(OV)  
OV  
V
IN(UVL)  
IN  
OUT  
V
V
V
V
V
GATE(TH)  
GATE(TH)  
GATE(TH)  
GATE(TH)  
GATE(TH)  
GATE  
ON  
PWRGD  
130ms  
65ms  
130ms 65ms  
130ms  
65ms  
130ms 65ms  
10µs (NOT TO SCALE)  
436112 F02  
Figure 2. PWRGD Behavior  
436112fb  
8
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
ON Input  
Fornearzeroreverse-leakagecurrentprotectionwhenGATE  
is pulled to ground, back-to-back N-channel MOSFETs  
can be used. Adding an additional P-channel MOSFET  
controlled by GATEP provides negative input voltage  
ON is a CMOS compatible, active low enable input. It has  
a default 5µA pull-down to ground. Connect this pin to  
ground or leave open to enable normal device operation.  
If it is driven high while the external MOSFET is turned on,  
GATE is pulled low with a weak pull-down current (40µA)  
to turn off the external MOSFET gradually, minimizing  
inputvoltagetransients.TheLTC4361thengoesintoalow  
current sleep mode, drawing only 1.5µA at IN. When ON  
goes back low, the part restarts with a 130ms delay cycle.  
protection down to the BV  
of the P-channel MOSFET.  
DSS  
Another configuration consists of a P-channel MOSFET  
controlled by GATEP and a N-channel MOSFET controlled  
byGATE.Thisprovidesprotectionagainstovervoltageand  
negative voltage but not reverse current.  
OVERVOLTAGE  
PROTECTION  
R
R
SENSE  
M1  
SUPPLY  
SUPPLY  
GATEP Control  
OUT  
OUT  
IN  
IN  
SENSE  
GATEP has a 2M resistive pull-down to ground and a 5.8V  
Zener clamp in series with a 200k resistor to IN. It con-  
trols the gate of an optional external P-channel MOSFET  
to provide negative voltage protection. The 2M resistive  
GATE  
OVERVOLTAGE, REVERSE-  
CURRENT PROTECTION  
SENSE  
M1  
M3  
pull-down turns on the MOSFET once V – V  
is  
IN  
GATEP  
more than the MOSFET gate threshold voltage. The IN to  
SENSE  
GATEP Zener protects the MOSFET from gate overvoltage  
GATE  
by clamping its V to 5.8V when V goes high.  
GS  
IN  
NEGATIVE  
VOLTAGE  
OVERVOLTAGE, REVERSE-  
CURRENT PROTECTION  
PROTECTION  
R
MOSFET Configurations and Selection  
SENSE  
M2  
M1  
M3  
SUPPLY  
SUPPLY  
The LTC4361 can be used with various external MOSFET  
configurations (see Figure 3). The simplest configuration  
is a single N-channel MOSFET. It has the lowest R  
and voltage drop and is thus the most power efficient  
solution. When GATE is pulled to ground, the N-channel  
MOSFET can isolate OUT from a positive voltage at IN up  
OUT  
IN  
SENSE  
GATEP  
GATE  
DS(ON)  
NEGATIVE  
VOLTAGE  
PROTECTION  
M2  
OVERVOLTAGE  
PROTECTION  
M1  
R
SENSE  
to the BV  
of the N-channel MOSFET. However, reverse  
OUT  
IN  
SENSE  
DSS  
GATEP  
GATE  
436112 F03  
current can still flow from OUT to IN via the parasitic body  
diode of the N-channel MOSFET.  
Figure 3. MOSFET Configurations  
436112fb  
9
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
MOBILE  
DEVICE  
WALL ADAPTOR  
AC/DC  
R
L
IN  
IN  
IN  
I
CABLE  
V
IN  
C
OUT  
10V/DIV  
+
CABLE  
LOAD  
I
CABLE  
20A/DIV  
436112 F04b  
436112 F04a  
5µs/DIV  
= 10µF  
R
= 150mΩ,  
= 0.7µH  
IN  
IN  
L
LOAD = 10Ω, C  
OUT  
Figure 4. 20V Hot-Plug into a 10µF Capacitor  
MOBILE  
DEVICE  
WALL ADAPTOR  
AC/DC  
M1  
Si1470DH  
L
IN  
R
R
IN  
SENSE  
IN  
OUT  
V
IN  
10V/DIV  
I
CABLE  
C
OUT  
GATE  
+
SENSE OUT  
LTC4361  
CABLE  
LOAD  
V
OUT  
1V/DIV  
IN  
GND  
I
CABLE  
20A/DIV  
436112 F05b  
436112 F05a  
5µs/DIV  
R
= 150mΩ,  
= 0.7µH, R  
IN  
IN  
L
= 25mΩ  
SENSE  
= 10µF  
LOAD = 10Ω, C  
OUT  
Figure 5. 20V Hot-Plug into the LTC4361  
Input Transients  
L and R form an LC tank circuit with any capacitance  
IN IN  
at IN. If the wall adaptor is powered up first, plugging the  
wall adaptor output to IN does the equivalent of applying  
a voltage step to this LC circuit. The resultant voltage  
overshoot at IN can rise to twice the DC output voltage  
of the wall adaptor as shown in Figure 4. Figure 5 shows  
the 20V adaptor output applied to the LTC4361. Due to  
the low capacitance at the IN pin, the plug-in transient has  
been brought down to a manageable level.  
Figure 4 shows a typical setup when an AC wall adaptor  
charges a mobile device. The inductor L represents the  
IN  
lumpedequivalentinductanceofthecableandtheEMIfilter  
found in some wall adaptors. R is the lumped equivalent  
IN  
resistance of the cable, adaptor output capacitor ESR and  
the connector contact resistance.  
436112fb  
10  
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
As the IN pin can withstand up to 80V, a high voltage  
N-channel MOSFET can be used to protect the system  
against rugged abuse from high transient or DC voltages  
85V absolute maximum voltage rating of the LTC4361.  
The single, nonrepetitive, pulse of energy (E ) absorbed  
AS  
by the MOSFET during this avalanche breakdown with a  
up to the BV  
of the MOSFET. Figure 6 shows a 50V  
peak current I is approximated by the formula:  
DSS  
AS  
input plugged into the LTC4361 controlling a 60V rated  
2
E
AS  
= 0.5 • L I  
IN AS  
MOSFET.  
ForL =0.7μHandI =4A,thenE =5.6μJ.Thisiswithin  
IN  
AS  
AS  
Input transients also occur when the current through the  
cableinductancechangesabruptly. Thiscanhappenwhen  
theLTC4361turnsofftheN-channelMOSFETrapidlyinan  
overvoltage or overcurrent event. Figure 7 shows an input  
the I and E capabilities of most MOSFET’s including  
AS  
AS  
the Si1470DH. So in most instances, the LTC4361 can  
ride through such transients without a bypass capacitor,  
transientvoltagesuppressororotherexternalcomponents  
transientafteranovercurrent. ThecurrentinL willcause  
IN  
at IN. Note that if an IN bypass capacitor is used, the V  
IN  
V to overshoot and avalanche the N-channel MOSFET to  
IN  
transients will overshoot less but last longer. If V dips  
IN  
C
OUT  
. Typically, IN will be clamped to a voltage of V  
+
OUT  
below V  
for more than 10µs, the internal latch-off  
IN(UVL)  
1.3 • (BV  
of Si1470DH) = 45V. This is well below the  
DSS  
latch in the LTC4361-1 could be inadvertently reset.  
V
IN  
20V/DIV  
V
IN  
20V/DIV  
V
OUT  
5V/DIV  
V
GATE  
V
10V/DIV  
OUT  
1V/DIV  
I
I
CABLE  
CABLE  
5A/DIV  
5A/DIV  
436112 F07  
436112 F06  
2µs/DIV  
5µs/DIV  
FIGURE 5 CIRCUIT  
FDC5612  
R
R
= 150mΩ, L = 0.7µH  
R
R
= 150mΩ, L = 0.7µH  
IN  
SENSE  
IN  
IN  
SENSE  
IN  
= 25mΩ, LOAD = 10Ω, C  
= 10µF  
OUT  
= 25mΩ, LOAD = 10Ω, C  
= 10µF  
OUT  
Figure 6. 50V Hot-Plug into the LTC4361  
Figure 7. Overcurrent Turn-Off and Resulting Input Transient  
436112fb  
11  
LTC4361-1/LTC4361-2  
applicaTions inFormaTion  
Figure 8 shows a particularly severe situation which can  
occur in a mobile device with dual power inputs. A 20V  
wall adaptor is mistakenly hot-plugged into the 5V device  
with the USB input already live. As shown in Figure 9, a  
the MOSFET before V  
overshoots to a dangerous volt-  
OUT  
age. A larger C  
also helps to lower the V  
due to  
OUT  
OUT  
the discharge of the energy in L if the MOSFET BV  
is used as an input clamp.  
IN  
DSS  
large current can build up in L to charge up C . When  
IN  
OUT  
Layout Considerations  
the N-channel MOSFET shuts off, the energy stored in L  
IN  
is dumped into C , causing a large 40V input transient.  
OUT  
Figure 10 shows an example PCB layout for the LTC4361  
(TS8 package) with a single N-channel MOSFET (SC70  
package) and a 0603 size sense resistor. Keep the traces  
to the N-channel MOSFET wide and short. The PCB traces  
associated with the power path through the N-channel  
MOSFET should have low resistance. Use Kelvin connec-  
The LTC4361 limits this to a 1V rise in the output voltage.  
If the V  
OUT  
due to the discharge of the energy in L into  
IN  
OUT  
C
is not acceptable or the avalanche capability of the  
MOSFET is exceeded, an additional external clamp such  
as the SMAJ24A can be placed between IN and GND. C  
OUT  
tions to R  
for an accurate overcurrent threshold.  
is the decoupling capacitor of the protected circuits and  
SENSE  
its value will largely be determined by their requirements.  
Using a larger C  
will work with L to slow down the  
IN  
OUT  
dV/dt at OUT, allowing time for the LTC4361 to shut off  
V
IN  
20V/DIV  
R
L
IN  
IN  
+
V
OUT  
20V  
WALL  
ADAPTER  
I
CABLE  
M1  
Si1470DH  
5V/DIV  
R
SENSE  
IN  
OUT  
V
GATE  
10V/DIV  
D1  
B160  
GATE  
LTC4361  
SENSE  
C
OUT  
I
CABLE  
10A/DIV  
LOAD  
+
436112 F09  
IN  
OUT  
GND  
1µs/DIV  
5V  
USB  
R1  
100k  
FIGURE 8 CIRCUIT  
R
= 150mΩ  
IN  
IN  
L
C
= 2µH, R  
= 25mΩ, LOAD = 10Ω  
SENSE  
436112 F08  
= 10µF (16V, SIZE 1210)  
OUT  
Figure 8. Setup for Testing 20V Plugged into 5V System  
Figure 9. Overvoltage Protection Waveforms  
When 20V Plugged into 5V System  
LTC4361  
GND  
OUT  
IN  
R
SUPPLY  
Si1470DH  
SENSE  
436112 F10  
Figure 10. Layout for N-Channel MOSFET Configuration  
436112fb  
12  
LTC4361-1/LTC4361-2  
package DescripTion  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
DC8 Package  
8-Lead Plastic DFN (2mm × 2mm)  
(Reference LTC DWG # 05-08-1719 Rev A)  
0.70 ±0.05  
2.55 ±0.05  
0.64 ±0.05  
1.15 ±0.05  
(2 SIDES)  
PACKAGE  
OUTLINE  
0.25 ±0.05  
0.45 BSC  
1.37 ±0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
R = 0.115  
TYP  
5
8
R = 0.05  
TYP  
0.40 ±0.10  
PIN 1 NOTCH  
2.00 ±0.10 0.64 ±0.10  
(4 SIDES)  
(2 SIDES)  
R = 0.20 OR  
0.25 × 45°  
CHAMFER  
PIN 1 BAR  
TOP MARK  
(SEE NOTE 6)  
(DC8) DFN 0409 REVA  
4
1
0.23 ±0.05  
0.45 BSC  
0.75 ±0.05  
0.200 REF  
1.37 ±0.10  
(2 SIDES)  
BOTTOM VIEW—EXPOSED PAD  
0.00 – 0.05  
NOTE:  
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
436112fb  
13  
LTC4361-1/LTC4361-2  
package DescripTion  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
TS8 Package  
8-Lead Plastic TSOT-23  
(Reference LTC DWG # 05-08-1637 Rev A)  
2.90 BSC  
(NOTE 4)  
0.40  
MAX  
0.65  
REF  
1.22 REF  
1.4 MIN  
1.50 – 1.75  
(NOTE 4)  
2.80 BSC  
3.85 MAX 2.62 REF  
PIN ONE ID  
RECOMMENDED SOLDER PAD LAYOUT  
PER IPC CALCULATOR  
0.22 – 0.36  
8 PLCS (NOTE 3)  
0.65 BSC  
0.80 – 0.90  
0.20 BSC  
DATUM ‘A’  
0.01 – 0.10  
1.00 MAX  
0.30 – 0.50 REF  
1.95 BSC  
TS8 TSOT-23 0710 REV A  
0.09 – 0.20  
(NOTE 3)  
NOTE:  
1. DIMENSIONS ARE IN MILLIMETERS  
2. DRAWING NOT TO SCALE  
3. DIMENSIONS ARE INCLUSIVE OF PLATING  
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR  
5. MOLD FLASH SHALL NOT EXCEED 0.254mm  
6. JEDEC PACKAGE REFERENCE IS MO-193  
436112fb  
14  
LTC4361-1/LTC4361-2  
revision hisTory  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
A
01/11 Revised conditions for V  
and t in Electrical Characteristics section  
3
GATE(CLP)  
OFF  
Revised GATE Control in Applications Information section  
05/12 Added H-grade order information  
7
B
2
Change to Electrical Characteristics Input Undervoltage Lockout  
3
Added V  
specifications  
3
IN(OVL)  
Change to Electrical Characteristics Overvoltage Hysteresis  
Change to Electrical Characteristics GATE Pull-Up and Pull-Down Current  
Change to Electrical Characteristics GATE Ramp-Up  
3
3
3
Added I  
specifications  
3
SENSE(IN)  
Change to Electrical Characteristics ON Pull-Down Current  
Change to Electrical Characteristics IN to GATEP Clamp Voltage  
Change to Electrical Characteristics GATEP Resistive Pull-Down  
Change to Electrical Characteristics PWRGD Pull-Up Resistance to OUT  
Change to Electrical Characteristics GATE On Delay  
Change to Electrical Characteristics PWRGD Delay  
Replaced GATE Fast Pull-Down Current vs Temperature Curve  
Added PCB trace to short pin 3 to pin 5 in Figure 10  
Added packaging link  
3
3
3
3
3
3
4
12  
13, 14  
436112fb  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  
LTC4361-1/LTC4361-2  
Typical applicaTion  
5V System Protected from 24V Power Supplies and Overcurrent  
5V System Protected from 24V Power Supplies,  
Overcurrent and Reverse Current  
FDC6561AN  
M1  
R
M2  
Si1471DH  
SENSE  
Si3590DV  
M1  
R
V
0.05Ω  
SENSE  
OUT  
M3  
V
IN  
V
0.05Ω  
5V  
OUT  
M2  
V
5V  
IN  
5V  
0.5A  
5V  
C
OUT  
0.5A  
C
10µF  
OUT  
10µF  
GATE  
GATE  
SENSE  
OUT  
SENSE  
OUT  
V
IO  
V
IO  
LTC4361  
LTC4361  
5V  
5V  
IN  
IN  
R1  
1k  
R1  
1k  
GATEP  
GATEP  
D1  
LN1351CTR  
D1  
LN1351CTR  
ON  
PWRGD  
ON  
PWRGD  
GND  
GND  
436112 TA02  
436112 TA03  
relaTeD parTs  
PART NUMBER DESCRIPTION  
COMMENTS  
LTC2935  
LT3008  
LT3009  
Ultralow Power Supervisor with Eight Pin-Selectable  
Thresholds  
500nA Quiescent Current, 2mm × 2mm 8-Lead DFN and TSOT-23 Packages  
20mA, 45V, 3µA I Micropower LDO  
280mV Dropout Voltage, Low I : 3µA, V = 2.0V to 45V, V  
= 0.6V to 39.5V;  
= 0.6V to 19.5V;  
Q
Q
IN  
OUT  
ThinSOT and 2mm × 2mm DFN-6 Packages  
20mA, 3µA I Micropower LDO  
280mV Dropout Voltage, Low I : 3µA, V = 1.6V to 20V, V  
Q
Q
IN  
OUT  
ThinSOT and SC-70 Packages  
LTC3576/  
LTC3576-1  
Switching USB Power Manager with USB OTG + Triple Complete Multifunction PMIC: Bi-Directional Switching Power Manager + 3  
Step-Down DC/DCs  
Bucks + LDO  
LTC4090/  
LTC4090-5  
High Voltage USB Power Manager with Ideal Diode  
High Efficiency 1.2A Charger from 6V to 38V (60V Max) Input Charges Single  
Controller and High Efficiency Li-Ion Battery Charger Cell Li-Ion Batteries Directly from a USB Port  
LTC4098  
USB-Compatible Switchmode Power Manager  
with OVP  
High V : 38V operating, 60V transient; 66V OVP. 1.5A Max Charge Current  
IN  
from Wall, 600mA Charge Current from USB  
LTC4210  
LTC4213  
Single Channel, Low Voltage Hot Swap™ Controller  
Operates from 2.7V to 16.5V, Active Current Limiting, SOT23-6  
No R ™ Electronic Circuit Breaker  
SENSE  
Controls Load Voltages from 0V to 6V. 3 Selectable Circuit Breaker Thresholds.  
Dual Level Overcurrent Fault Protection  
LT4356  
Surge Stopper- Overvoltage/Overcurrent Protection  
Regulator  
Wide Operation Range: 4V to 80V. Reverse Input Protection to –60V.  
Adjustable Output Clamp Voltage  
LTC4411  
LTC4412  
SOT-23 Ideal Diode  
2.6A Forward Current, 28mV Regulated Forward Voltage  
2.5V to 28V, Low Loss PowerPath™ Controller in  
ThinSOT  
More Efficient than Diode-ORing, Automatic Switching Between DC Sources,  
Simplified Load Sharing  
LTC4413-1/  
LTC4413-2  
Dual 2.6A, 2.5V to 5.5V Fast Ideal Diodes in  
3mm × 3mm DFN  
130mΩ On Resistance, Low Reverse Leakage Current, 18mV Regulated  
Forward Voltage (LTC4413-2 with Overvoltage Protection Sensor)  
436112fb  
LT 0512 REV B • PRINTED IN USA  
16 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
LINEAR TECHNOLOGY CORPORATION 2010  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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