LTC1626CS [Linear]

Low Voltage, High Efficiency Step-Down DC/DC Converter; 低电压,高效率降压型DC / DC转换器
LTC1626CS
型号: LTC1626CS
厂家: Linear    Linear
描述:

Low Voltage, High Efficiency Step-Down DC/DC Converter
低电压,高效率降压型DC / DC转换器

转换器
文件: 总12页 (文件大小:284K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC1626  
Low Voltage, High Efficiency  
Step-Down DC/DC Converter  
U
FEATURES  
DESCRIPTION  
The LTC®1626 is a monolithic, low voltage, step-down  
current mode DC/DC converter featuring Burst ModeTM  
operation at low output current.  
Wide Input Supply Voltage Range: 2.5V to 6V  
High Efficiency: Up to 95%  
Low RDS(ON) Internal Switch: 0.32  
(VIN = 4.5V)  
Current Mode Operation for Excellent Line and Load  
Transient Response  
Short-Circuit Protected  
Low Dropout Operation: 100% Duty Cycle  
Built-In Low-Battery Detector  
Low Quiescent Current at Light Loads: IQ = 165µA  
Ultralow Shutdown Current: IQ = 0.5µA  
Peak Inductor Current Independent of Inductor Value  
Available in 14-Pin SO Package  
The input supply voltage range of 2.5V to 6V makes the  
LTC1626 ideal for single cell Li-Ion and 3- or 4-cell NiCd/  
NiMH applications. A built-in 0.32switch (VIN = 4.5V)  
allows up to 0.6A of output current.  
The LTC1626 incorporates automatic power saving Burst  
Mode operation to reduce gate charge losses when the  
load current drops below the level required for continuous  
operation. With no load, the converter draws only 165µA.  
In shutdown, it draws a mere 0.5µA—making it ideal for  
current sensitive applications.  
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APPLICATIONS  
Theinductorcurrentisuser-programmableviaanexternal  
current sense resistor. In dropout, the internal P-channel  
MOSFET switch is turned on continuously, maximizing  
battery life.  
Single Cell Li-Ion Step-Down Converters  
3- or 4-Cell NiMH Step-Down Converters  
Cellular Telephones  
5V to 3.3V Conversion  
3.3V to 2.5V Conversion  
Inverting Converters  
Portable Instruments  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Burst Mode is a trademark of Linear Technology Corporation.  
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TYPICAL APPLICATION  
V
IN  
2.7V TO 6V  
Efficiency  
100  
+
C
0.1µF  
PWR V  
IN  
L*  
47µF  
16V  
R **  
SENSE  
0.1Ω  
V
IN  
IN  
33µH  
V
95  
90  
85  
80  
75  
70  
OUT  
2.5V  
SHDN  
LTC1626  
SW  
D1  
0.25A  
MBRS130LT  
††  
+
PGND  
C
OUT  
3900pF  
100µF  
470Ω  
+
6.3V  
I
TH  
SENSE  
1000pF  
100pF  
10k  
SENSE  
C
T
V
= 3.5V  
IN  
L1 = 33µH  
= 2.5V  
C
T
V
FB  
SGND  
V
270pF  
OUT  
10k  
R
= 0.1Ω  
SENSE  
*
COILTRONICS CTX33-4  
C
= 270pF  
T
** IRC 1206-R100F  
1626 F01  
††  
AVX TPSD476KO16  
0.01  
0.1  
OUTPUT CURRENT (A)  
1
AVX TPSC107M006R0150  
1626 F01a  
Figure 1. High Efficiency 2.5V Step-Down Converter  
1
LTC1626  
W W U W  
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ABSOLUTE MAXIMUM RATINGS  
PACKAGE/ORDER INFORMATION  
(Voltages Referred to GND Pin)  
TOP VIEW  
ORDER PART  
Input Supply Voltage (Pins 1, 2, 13)............0.3V to 7V  
Shutdown Input Voltage (Pin 10) ................0.3V to 7V  
Sense, Sense+ (Pins 7, 8)........... 0.3V to (VIN + 0.3V)  
LBO, LBI (Pins 3, 4).................................... 0.3V to 7V  
CT, ITH, VFB (Pins 5, 6, 9)............. 0.3V to (VIN + 0.3V)  
DC Switch Current (Pin 14) .................................... 1.2A  
Peak Switch Current (Pin 14) ................................. 1.6A  
Switch Voltage (Pin 14) .......(VIN – 7.5V) to (VIN + 0.3V)  
Operating Temperature Range ..................... 0°C to 70°C  
Extended Commercial Operating  
NUMBER  
PWR V  
V
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
SW  
IN  
PWR V  
PGND  
SGND  
SHDN  
IN  
IN  
LBO  
LBI  
LTC1626CS  
C
T
I
TH  
V
FB  
+
SENSE  
8
SENSE  
S PACKAGE  
14-LEAD PLASTIC SO  
TJMAX = 125°C, θJA = 110°C/ W  
Temperature Range (Note 4) ............. 40°C to 85°C  
Junction Temperature (Note 1)............................. 125°C  
Storage Temperature Range ................. 65°C to 150°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
Consult factory for Industrial and Military grade parts.  
ELECTRICAL CHARACTERISTICS TA = 25°C, VIN = 4.5V, VOUT = 2.5V, VSHDN = 0V, unless otherwise specified.  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
0.1  
MAX  
UNITS  
I
Feedback Pin Current  
Feedback Voltage  
1
µA  
FB  
V
0°C to 70°C  
40°C to 85°C  
1.22  
1.2  
1.25  
1.28  
1.3  
V
V
FB  
V  
Output Voltage Line Regulation  
V
= 3.5V to 5.5V, I  
= 250mA  
40  
0
40  
50  
mV  
mV  
OUT  
IN  
LOAD  
Output Voltage Load Regulation  
Burst Mode Output Ripple  
10mA I  
250mA  
25  
50  
LOAD  
I
= 0  
mV  
LOAD  
P-P  
I
Input DC Supply Current (Note 2)  
Active Mode  
Q
1.9  
165  
0.5  
3.0  
300  
5
mA  
µA  
µA  
Sleep Mode  
Shutdown  
V
V
= V  
SHDN IN  
V
Low-Battery Trip Point  
1.15  
1.25  
1.35  
V
µA  
LBTRIP  
I
I
Low-Battery Input Bias Current  
Low-Battery Output Sink Current  
Current Sense Threshold Voltage  
±0.5  
LBI  
LBO  
= 0.4V  
0.4  
1.4  
mA  
LBO  
V
V
V
= 2.5V, V = V /2 + 25mV (Forced)  
= 2.5V, V = V /2 – 25mV (Forced)  
25  
155  
mV  
mV  
SENSE  
SENSE  
SENSE  
FB  
OUT  
+
V
– V  
130  
180  
0.45  
6
SENSE  
SENSE  
FB  
OUT  
R
ON Resistance of Switch  
Switch Off-Time (Note 3)  
SHDN Pin High  
0.32  
5
µs  
V
ON  
t
C = 390pF, I = 400mA  
LOAD  
4
OFF  
T
V
V
Minimum Voltage for Device to Be Shut Down  
Maximum Voltage for Device to Be Active  
V – 0.4  
IN  
IHSD  
ILSD  
INSD  
SHDN Pin Low  
0.4  
V
I
SHDN Pin Input Current  
0V V  
7V  
±1  
µA  
SHDN  
The  
denotes specifications that apply over the specified operating  
Note 3: In applications where R  
off-time increases by approximately 40%.  
is placed at ground potential, the  
SENSE  
temperature range.  
Note 1: T is calculated from the ambient temperature T and power  
dissipation according to the following formula:  
Note 4: C grade device specifications are guaranteed over the 0°C to 70°C  
temperature range. In addition, C grade device specifications are assured  
over the 40°C to 85°C temperature range by design or correlation, but  
are not production tested.  
J
A
T = T + (P • 110°C/W)  
J
A
D
Note 2: Dynamic supply current is higher due to the gate charge being  
delivered at the switching frequency.  
2
LTC1626  
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TYPICAL PERFORMANCE CHARACTERISTICS  
Efficiency vs Input Voltage  
(VOUT = 2.5V)  
Efficiency vs Output Current  
(VOUT = 3.3V)  
Efficiency vs Input Voltage  
(VOUT = 3.3V)  
100  
95  
90  
85  
80  
75  
70  
100  
98  
96  
94  
92  
90  
88  
86  
84  
82  
80  
100  
98  
96  
94  
92  
90  
88  
86  
84  
82  
80  
L1 = 33µH  
= 0.1Ω  
R
T
SENSE  
= 270pF  
C
I
= 100mA  
OUT  
I
= 100mA  
OUT  
I
= 250mA  
OUT  
I
= 250mA  
OUT  
L1 = 33µH  
V
V
= 5V  
IN  
OUT  
= 3.3V  
= 0.1Ω  
L1 = 33µH  
= 0.1Ω  
R
SENSE  
R
T
SENSE  
C
T
= 270pF  
C
= 270pF  
0.01  
0.1  
OUTPUT CURRENT (A)  
1
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
1626 G02  
1626 G01  
1626 G03  
Operating Frequency  
Switch Resistance  
Switch Leakage Current  
2.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 4.5V  
IN  
FIGURE 1 CIRCUIT  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
T = 70°C  
J
T = 25°C  
J
T = 0°C  
J
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0  
0
10 20 30 40 50 60 70 80 90 100  
JUNCTION TEMPERATURE (°C)  
1626 G06  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
1626 G04  
1626 G05  
DC Supply Current*  
Supply Current in Shutdown  
Low Voltage Behavior  
5.0  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
T = 25°C  
T = 25°C  
L1 = 33µH  
J
J
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
* DOES NOT INCLUDE  
SHUTDOWN = V  
IN  
R
C
= 0.1Ω  
SENSE  
T
GATE CHARGE CURRENT  
= 270pF  
T = 25°C  
V
V
= 3.3V  
= 2.5V  
J
OUT  
I
= 250mA  
LOAD  
OUT  
ACTIVE MODE  
SLEEP MODE  
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
1626 G07  
1626 G08  
1626 G09  
3
LTC1626  
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PIN FUNCTIONS  
SENSE(Pin 7): Connects to the (–) Input of the Current  
Comparator.  
PWR VIN (Pins 1, 13): Supply for the Power MOSFET and  
Its Driver. Decouple this pin properly to ground.  
SENSE+ (Pin 8): The (+) Input to the Current Comparator.  
VIN (Pin 2): Main Supply for All the Control Circuitry in  
A built-in offset between Pins 7 and 8 in conjunction with  
the LTC1626.  
RSENSE sets the current trip threshold.  
LBO (Pin 3): Open-Drain Output of the Low-Battery Com-  
parator. This pin will sink current when Pin 4 (LBI) goes  
below 1.25V. During shutdown, this pin is high imped-  
ance.  
VFB (Pin 9): This pin serves as the feedback pin from an  
external resistive divider used to set the output voltage.  
SHDN (Pin 10): Shutdown Pin. Pulling this pin to VIN  
keeps the internal switch off and puts the LTC1626 in  
micropower shutdown. If not used, connect to SGND.  
LBI (Pin 4): The (–) Input of the Low-Battery Comparator.  
The (+) input is connected to a reference voltage of 1.25V.  
If not used, connect to VIN.  
SGND (Pin 11): Small-Signal Ground. Must be routed  
separately from other grounds to the (–) terminal of COUT  
.
CT (Pin 5): External capacitor CT from Pin 5 to ground sets  
the switch off-time. The operating frequency is dependent  
on the input voltage and CT.  
PWR GND (Pin 12): Switch Driver Ground. Connects to  
the (–) terminal of CIN.  
ITH (Pin 6): Feedback Amplifier Decoupling Point. The  
current comparator threshold is proportional to Pin 6  
voltage.  
SW (Pin 14): Drain of the P-Channel MOSFET Switch.  
Cathode of the Schottky diode must be connected closely  
to this pin.  
W
BLOCK DIAGRAM  
+
SENSE  
7
PWR V  
SENSE  
8
IN  
1
13  
PWR GND  
12  
SW  
14  
9
V
FB  
+
V
SLEEP  
R
S
C
25mV TO 150mV  
Q
+
+
+
V
OS  
S
I
+
TH  
V
TH2  
13k  
G
6
V
TH1  
+
V
LBO  
3
IN  
T
2
+
REFERENCE  
10 SHDN  
A3  
OFF-TIME  
CONTROL  
SENSE  
V
LBI  
4
FB  
1626 BD  
5
C
T
11  
SGND  
4
LTC1626  
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OPERATIO  
The nominal off-time of the LTC1626 is set by an external  
timingcapacitorconnectedbetweentheCT pinandground.  
The operating frequency is then determined by the off-  
decreasesslightly.Thiscausestheoutputofthegainstage  
(Pin 6) to increase the current comparator threshold, thus  
tracking the load current.  
time and the difference between VIN and VOUT  
.
When the load is relatively light, the LTC1626 automati-  
cally switches to Burst Mode operation. The current loop  
is interrupted when the output voltage reaches the desired  
regulated value. The hysteretic voltage comparator V trips  
when VOUT is above the desired output voltage, turning off  
the switch and causing the timing capacitor to discharge.  
This capacitor discharges past VTH1 until its voltage drops  
below VTH2. Comparator S then trips and a sleep signal is  
generated. Thecircuitnowentersintosleepmodewiththe  
power MOSFET turned off. In sleep mode, the LTC1626 is  
in standby and the load current is supplied by the output  
capacitor. All unused circuitry is shut off, reducing quies-  
cent current from 1.9mA to 165µA. When the output  
capacitor discharges by the amount of the hysteresis of  
thecomparatorV,theP-channelswitchturnsonagainand  
the process repeats itself. During Burst Mode operation,  
The output voltage is set by an external divider returned to  
the VFB pin. A voltage comparator V and a gain block G  
compare the divided output voltage with a reference  
voltage of 1.25V.  
Tooptimizeefficiency,theLTC1626automaticallyswitches  
between continuous and Burst Mode operation. The volt-  
age comparator is the primary control element when the  
device is in Burst Mode operation, while the gain block  
controls the output voltage in continuous mode.  
When the load is heavy, the LTC1626 is in continuous  
operation. During the switch “ON” time, current compara-  
tor C monitors the voltage between the SENSE+ and  
SENSEpins connected across an external shunt in series  
with the inductor. When the voltage across the shunt  
reaches the comparator’s threshold value, its output sig-  
nal changes state, resetting the flip-flop and turning the  
internal P-channel MOSFET off. The timing capacitor  
connected to the CT pin is now allowed to discharge at a  
rate determined by the off-time controller.  
the peak inductor’s current is set at 25mV/RSENSE  
.
To avoid the operation of the current loop interfering with  
Burst Mode operation, a built-in offset VOS is incorporated  
in the gain stage. This prevents the current from increas-  
inguntiltheoutputvoltagehasdroppedbelowaminimum  
threshold.  
When the voltage on the timing capacitor has discharged  
pastVTH1,comparatorTtrips,setstheflip-flopandcauses  
the switch to turn on. Also, the timing capacitor is  
recharged. The inductor current will again ramp up until  
the current comparator C trips. The cycle then repeats.  
When the load current increases, the output voltage  
In dropout, the P-channel MOSFET is turned on continu-  
ously (100% duty cycle) providing low dropout operation  
with VOUT VIN.  
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APPLICATIONS INFORMATION  
determines the peak inductor current. Depending upon  
the load current condition, the threshold of the compara-  
tor lies between 25mV/RSENSE and 150mV/RSENSE. The  
maximum output current of the LTC1626 is:  
The basic LTC1626 application circuit is shown in Figure  
1. External component selection is driven by the load  
requirementandbeginswiththeselectionofRSENSE.Once  
RSENSE is known, CT and L can be chosen. Next, the  
Schottky diode D1 is selected followed by CIN and COUT  
.
IOUT(MAX) = 150mV/RSENSE – IRIPPLE/2 (A)  
RSENSE Selection for Output Current  
Where IRIPPLE is the peak-to-peak inductor ripple current.  
At a relatively light load, the LTC1626 is in Burst Mode  
operation. In this mode, the peak current is set at 25mV/  
RSENSE. To fully benefit from Burst Mode operation, the  
RSENSE is chosen based on the required output current.  
Withthecurrentcomparatormonitoringthevoltagedevel-  
oped across RSENSE, the threshold of the comparator  
5
LTC1626  
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APPLICATIONS INFORMATION  
inductor current should be continuous during burst peri-  
Operating Frequency Considerations  
ods. Hence, the peak-to-peak inductor ripple current must  
For most applications, the LTC1626 should be operated in  
the 100kHz to 300kHz range. This range can be extended,  
however, up to 600kHz, to accommodate smaller size/  
valued inductors, such as low profile types, with a slight  
decrease in efficiency due to gate charge losses. Some  
experimentation may be required to determine the opti-  
mum operating frequency for a particular set of external  
components and operating conditions.  
not exceed 25mV/RSENSE  
.
To account for light load conditions, the IOUT(MAX) is then  
given by:  
IOUT(MAX) = 150mV/RSENSE – 25mV/2RSENSE (A)  
= 137.5mV/RSENSE (A)  
Solving for RSENSE and allowing a margin of variations in  
the LTC1626 and external component values yields:  
CT and L Selection  
RSENSE = 100mV/IOUT(MAX) ()  
The value of CT is calculated from the desired continuous  
mode operating frequency:  
The LTC1626 switch is capable of supplying a maximum  
of 1.2A of output current. Therefore, the minimum value  
of RSENSE that can be used is 0.083. A graph for  
selecting RSENSE versus maximum output current is given  
in Figure 2.  
V V  
(
)
IN  
OUT  
C =  
F
( )  
T
V + V 3300 V V  
f
(
)(  
)(  
)( )  
IN  
IN  
D
BE  
O
whereVD isthedropacrosstheSchottkydiodeD1andVBE  
is a base-emitter voltage drop (0.6V).  
0.5  
0.4  
0.3  
0.2  
0.1  
0
The complete expression for operating frequency is given  
by:  
1
V V  
IN OUT  
V + V  
IN D  
f ≈  
Hz  
( )  
O
t
OFF  
where:  
t
= 3300 C V V  
sec  
) (  
(
)( )(  
)
OFF  
T
IN  
BE  
0
0.2  
0.4  
0.6  
0.8  
1.0  
MAXIMUM OUTPUT CURRENT (A)  
Figure 3 is a graph of operating frequency versus power  
supply voltage for the 2.5V regulator circuit shown in  
Figure 1 (CT = 270pF). Note that the frequency is relatively  
constant with supply voltage but drops as the supply  
voltage approaches the regulated output voltage.  
1626 F02  
Figure 2. Selecting RSENSE  
Duringashortcircuitoftheregulatoroutputtoground,the  
peak current is determined by:  
To maintain continuous inductor current at light load, the  
inductor must be chosen to provide no more than 25mV/  
ISC = 150mV/RSENSE (A)  
RSENSE of peak-to-peak ripple current. This results in the  
In this condition, the LTC1626 automatically extends the  
off-time period of the P-channel MOSFET switch to allow  
the inductor current to decay far enough to prevent any  
current buildup. The resulting ripple current causes the  
following expression for L:  
5
L 5.2 10  
R
(
C
V
REG  
H
(
)
)( )(  
) (
 
)  
SENSE  
T
average current to be approximately IOUT(MAX)  
.
Using an inductance smaller than the above value will  
result in inductor current being discontinuous. As a con-  
6
LTC1626  
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APPLICATIONS INFORMATION  
sequence, the LTC1626 will delay entering Burst Mode  
operation and efficiency will be degraded at low currents.  
the P-channel switch duty cycle. At high input voltages,  
the diode conducts most of the time. As VIN approaches  
VOUT, the diode conducts only a small fraction of the time.  
The most stressful condition for the diode is when the  
regulator output is shorted to ground.  
200  
FIGURE 1 CIRCUIT  
180  
160  
140  
120  
100  
80  
Under short-circuit conditions, the diode must safely  
handle ISC(PK) at close to 100% duty cycle. Most LTC1626  
circuits will be well served by either an MBRM5819 or an  
MBRS130LT3. An MBR0520LT1 is a good choice for  
60  
I
OUT(MAX) 500mA.  
40  
20  
Input Capacitor (CIN) Selection  
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5  
In continuous mode, the input current of the converter is  
a square wave of duty cycle VOUT/VIN. To prevent large  
voltage transients, a low effective series resistance (ESR)  
input capacitor must be used. In addition, the capacitor  
must handle a high RMS current. The CIN RMS current is  
given by:  
INPUT VOLTAGE (V)  
1626 F03  
Figure 3. Operating Frequency vs Supply Voltage  
for Circuit Shown in Figure 1  
Inductor Core Selection  
With the value of L selected, the type of inductor must be  
chosen. Basically, there are two kinds of losses in an  
inductor—core and copper losses.  
1/2  
]
I
V
V V  
(
)
OUT OUT IN  
OUT  
[
I
A
( )  
RMS  
V
IN  
Core losses are dependent on the peak-to-peak ripple  
current and core material. However, they are independent  
of the physical size of the core. By increasing inductance,  
the peak-to-peak inductor ripple current will decrease,  
therefore reducing core loss. Utilizing low core loss mate-  
rial,suchasmolypermalloyorKoolMµ® willallowtheuser  
to concentrate on reducing copper loss and preventing  
saturation.  
This formula has a maximum at VIN = 2VOUT, where  
IRMS = IOUT/2. This simple worst case is commonly used  
to design because even significant deviations do not offer  
much relief. Note that capacitor manufacturer’s ripple  
current ratings are often based on only 2000 hours life-  
time.Thismakeitadvisabletofurtherderatethecapacitor,  
or choose a capacitor rated at a higher temperature than  
required. Do not underspecify this component. An addi-  
tional0.1µFceramiccapacitorisalsorequiredonPWRVIN  
for high frequency decoupling.  
Althoughhigherinductancereducescoreloss,itincreases  
copper loss as it requires more windings. When space is  
not a premium, larger wire can be used to reduce the wire  
resistance. This also prevents excessive heat dissipation  
in the inductor.  
Output Capacitor (COUT) Selection  
The selection of COUT is driven by the ESR for proper  
operation of the LTC1626. The required ESR of COUT is:  
Catch Diode Selection  
ESRCOUT < 50mV/IRIPPLE  
Losses in the catch diode depend on forward drop and  
switching times. Therefore, Schottky diodes are a good  
choice for low drop and fast switching times.  
where IRIPPLE is the ripple current of the inductor. For the  
case where the IRIPPLE is 25mV/RSENSE, the required ESR  
of COUT is:  
The catch diode carries the load current during the off-  
time. The average diode current is therefore dependent on  
Kool Mµ is a registered trademark of Magnetics, Inc.  
7
LTC1626  
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APPLICATIONS INFORMATION  
ESRCOUT < 2RSENSE  
The LBO is an N-channel open drain that goes low when  
the battery voltage drops below the threshold voltage. In  
shutdown, the comparator is disabled and LBO is in the  
high impedance state. Figure 4 is a schematic diagram  
detailing the low-battery comparator connection and op-  
eration.  
To avoid overheating, the output capacitor must be sized  
to handle the ripple current generated by the inductor. The  
worst-case RMS ripple current in the output capacitor is  
given by:  
IRMS < 150mV/2RSENSE (ARMS)  
V
IN  
LTC1626  
Generally, once the ESR requirements for COUT have been  
met, the RMS current rating far exceeds the IRIPPLE  
requirement.  
R4  
1%  
LBO  
+
1.25V  
LBI  
C
R3  
1%  
FILTER  
1626 F04  
0.01µF  
In some surface mount applications, multiple capacitors  
may have to be paralleled to meet the capacitance, ESR or  
RMS current handling requirement of the application.  
Aluminum electrolyte and dry tantalum capacitors are  
bothavailableinsurfacemountconfigurations.Inthecase  
oftantalum,itiscriticalthatthecapacitorsaresurgetested  
for use in switching power supplies. An excellent choice is  
the AVX TPS series of surface mount tantalums, available  
in case heights ranging from 2mm to 4mm. Other capaci-  
tor types include Sanyo OS-CON, Nichicon PL series and  
Sprague 595D series. Consult the manufacturer for other  
specific recommendations.  
Figure 4. Low-Battery Comparator  
Setting the Output Voltage  
The LTC1626 develops a 1.25V reference voltage between  
the feedback pin VFB and the signal ground as shown in  
Figure 5. By selecting resistor R1, a constant current is  
caused to flow through R1 and R2 which sets the desired  
output voltage. The regulated output voltage is deter-  
mined by:  
When the capacitance of COUT is made too small, the  
outputrippleatlowfrequencieswillbelargeenoughtotrip  
the voltage comparator. This causes Burst Mode opera-  
tion to be activated when the LTC1626 would normally be  
in continuous mode operation. The effect will be most  
pronounced with low RSENSE values and can be improved  
at higher frequencies.  
R2  
R1  
V
= 1.25 1+  
OUT  
R1 should be 10k to ensure that sufficient current flows  
through the divider to maintain accuracy and to provide a  
minimum load for the regulator output at elevated  
temperatures. (See Switch Leakage Current curve in Typi-  
cal Performance Characteristics section.)  
Low-Battery Detection  
To prevent stray pickup, a 100pF capacitor is suggested  
across R1, located close to the LTC1626.  
The low-battery detector senses the input voltage through  
anexternalresistivedivider. Thisdividedvoltageconnects  
to the (–) input of a voltage comparator (LBI) and is  
compared to an internal 1.25V reference voltage. Neglect-  
ingLBIinputbiascurrent,thefollowingexpressionisused  
for setting the trip voltage threshold:  
V
OUT  
R2  
1%  
V
LTC1626  
SGND  
FB  
R1  
10k  
1%  
100pF  
1626 F05  
R4  
V
= 1.25 1+  
_
LB TRIP  
R3  
Figure 5. Setting the Output Voltage  
8
LTC1626  
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APPLICATIONS INFORMATION  
Thermal Considerations  
regulator when it is operating in a 25°C ambient tempera-  
ture is:  
In a majority of applications, the LTC1626 does not  
dissipate much heat due to its high efficiency. However, in  
applications where the switching regulator is running at  
high duty cycles or the part is in dropout with the switch  
turned on continuously (DC), some thermal analysis is  
required. The goal of the thermal analysis is to determine  
whetherthepowerdissipatedbytheregulatorexceedsthe  
maximum junction temperature. The temperature rise is  
given by:  
TJ = (0.113 • 110) + 25 = 38°C  
Remembering that the above junction temperature is  
obtained from an RDS(ON) at 25°C, we might recalculate  
the junction temperature based on a higher RDS(ON) since  
it increases with temperature. However, we can safely  
assume that the actual junction temperature will not  
exceed the absolute maximum junction temperature  
of 125°C.  
TRISE = PD θJA  
Board Layout Considerations  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC1626. These items are also illustrated graphically in  
the layout diagram of Figure 6. Check the following in your  
layout:  
The junction temperature is given by:  
TJ = TRISE + TAMBIENT  
1. Are the signal and power grounds separated? The  
LTC1626 signal ground (Pin 11) must return to the  
(–) plate of COUT. The power ground (Pin 12) returns  
to the anode of the Schottky diode and the (–) plate  
of CIN.  
As an example, consider the case when the LTC1626 is in  
dropout at an input voltage of 3V with a load current of  
0.5A. FromtheTypicalPerformanceCharacteristicsgraph  
of Switch Resistance, the ON resistance of the P-channel  
switch is 0.45. Therefore, power dissipated by the  
part is:  
2. Does the (+) plate of CIN connect to the power VIN (Pins  
1, 13) as close as possible? This capacitor provides the  
AC current to the internal P-channel MOSFET and its  
driver.  
PD = I2 • RDS(ON) = 113mW  
The SO package junction-to-ambient thermal resistance  
θJA is110°C/W.Therefore,thejunctiontemperatureofthe  
V
IN  
BOLD LINES INDICATE  
HIGH CURRENT PATHS  
1
2
PWR V  
IN  
14  
13  
SW  
PWR V  
IN  
V
IN  
D1  
+
LTC1626  
0.1µF  
C
IN  
L
3
4
5
6
7
12  
11  
10  
9
PGND  
SGND  
LBO  
LBI  
C
1k  
3900pF  
T
R1  
R2  
SHUTDOWN  
C
I
SHDN  
T
C
OUT  
V
FB  
+
TH  
R
SENSE  
8
+
SENSE  
SENSE  
V
OUT  
1000pF  
1626 F06  
Figure 6. LTC1626 Layout Diagram (See Board Layout Checklist)  
9
LTC1626  
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APPLICATIONS INFORMATION  
3. Is the input decoupling capacitor (0.1µF) connected  
closely between power VIN (Pins 1, 13) and power  
ground (Pin 12)? This capacitor carries the high fre-  
quency peak currents.  
divider R1-R2 must be connected between the (+) plate  
of COUT and the signal ground.  
6. AretheSENSEandSENSE+ leadsroutedtogetherwith  
minimum PC trace spacing? The 1000pF capacitor  
between Pin 7 and Pin 8 should be as close as possible  
to the LTC1626.  
4. Is the Schottky diode closely connected between the  
power ground (Pin 12) and switch output (Pin 14)?  
5. Does the LTC1626 SENSE(Pin 7) connect to a point  
close to RSENSE and the (+) plate of COUT? The resistor  
7. Is SHDN (Pin 10) actively pulled to ground during  
normal operation? The shutdown pin is high imped-  
ance and must not be allowed to float.  
U
TYPICAL APPLICATIONS  
Single Cell Li-Ion to 2.5V Converter  
(V = 2.7V TO 4.5V)  
IN  
SINGLE  
Li-ION  
CELL  
+
+
C
IN  
L1*  
0.1µF  
47µF  
16V  
R **  
SENSE  
0.1Ω  
PWR V  
V
IN  
IN  
22µH  
V
OUT  
LBI  
SW  
2.5V  
0.25A  
D1  
MBR0520LT1  
LBO  
SHDN  
SHUTDOWN  
PGND  
††  
LTC1626  
+
C
OUT  
+
I
TH  
SENSE  
SENSE  
V
100µF  
10V  
1000pF  
100pF  
1k  
3900pF  
C
T
10k  
10k  
270pF  
C
T
FB  
SGND  
1626 TA01  
*
SUMIDA CDRH62-220  
** IRC 1206-R100F  
AVX TPSD476K016  
AVX TPSD107K010  
††  
3- to 4-Cell NiCd/NiMH to 2.5V Converter  
(V = 2.7V TO 6V)  
IN  
+
+
C
IN  
3- OR 4-CELL  
NiCd OR NiMH  
L1*  
R4  
0.1µF  
47µF  
16V  
R **  
SENSE  
0.1Ω  
PWR V  
V
IN  
IN  
22µH  
V
OUT  
LBI  
SW  
2.5V  
0.25A  
D1  
MBR0520LT1  
LBO  
R3  
SHDN  
SHUTDOWN  
PGND  
††  
LTC1626  
+
C
OUT  
+
I
TH  
SENSE  
SENSE  
V
100µF  
10V  
1000pF  
100pF  
1k  
C
T
†††  
R1  
270pF  
3900pF  
10k  
C
T
FB  
†††  
R2  
10k  
SGND  
1626 TA02  
†††  
FOR 3.3V:  
*
SUMIDA CDRH62-220  
** IRC 1206-R100F  
R1 = 15k, 1%  
AVX TPSD476K016  
AVX TPSD107K010  
R2 = 9.09k, 1%  
††  
10  
LTC1626  
U
TYPICAL APPLICATIONS  
Low Profile (3mm Maximum Height) 2.8V Converter  
V
IN  
3V TO 6V  
C
IN  
†††  
+
4.7µF  
22µF  
16V  
TANT  
L1*  
15µH  
R
**  
SENSE  
0.1Ω  
CERAMIC  
PWR V  
V
IN  
IN  
V
OUT  
LBI  
SW  
2.8V  
0.25A  
D1  
MBR0520LT1  
LBO  
SHDN  
SHUTDOWN  
PGND  
††  
LTC1626  
+
C
OUT  
+
I
TH  
SENSE  
SENSE  
V
100µF  
6.3V  
1000pF  
100pF  
1k  
3900pF  
R1  
15k  
1%  
C
T
56pF  
C
T
FB  
R2  
SGND  
12.1k  
1%  
1626 TA03  
*
COILCRAFT DO3308-153  
** IRC 1206-R100F  
AVX TPSC226M016R0375  
††  
†††  
AVX TPSC107M006R0150  
MURATA GRM230Y5V475Z16  
U
PACKAGE DESCRIPTION  
Dimensions in inches (millimeters) unless otherwise noted.  
S Package  
14-Lead Plastic Small Outline (Narrow 0.150)  
(LTC DWG # 05-08-1610)  
0.337 – 0.344*  
(8.560 – 8.738)  
13  
12  
11 10  
8
14  
9
0.228 – 0.244  
(5.791 – 6.197)  
0.150 – 0.157**  
(3.810 – 3.988)  
1
2
3
4
5
6
7
0.010 – 0.020  
(0.254 – 0.508)  
× 45°  
0.053 – 0.069  
(1.346 – 1.752)  
0.004 – 0.010  
(0.101 – 0.254)  
0.008 – 0.010  
(0.203 – 0.254)  
0° – 8° TYP  
0.050  
(1.270)  
TYP  
0.014 – 0.019  
(0.355 – 0.483)  
0.016 – 0.050  
0.406 – 1.270  
S14 0695  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
11  
LTC1626  
TYPICAL APPLICATIONS  
U
Single Li-Ion to 3.3V Buck-Boost Converter  
(V = 2.5V TO 4.2V)  
IN  
L1B  
L1A  
SINGLE  
Li-ION  
CELL  
+
3
2
+
C
IN  
100µF  
L1A  
0.1µF  
100µF  
16V  
TOP VIEW  
16V  
PWR V  
V
IN  
IN  
33µH  
+
V
1
4
OUT  
LBI  
SW  
3.3V  
1
2
L1B  
L1A  
D1  
MBRS130LT1  
LBO  
SHDN  
SHUTDOWN  
1k  
PGND  
15k  
1%  
††  
MANUFACTURER  
PART NO.  
4
3
+
C
OUT  
LTC1626  
100µF  
COILTRONICS  
DALE  
CTX33-4  
LPT4545-330LA  
L1B  
I
TH  
10V  
33µH  
9.09k  
1%  
C
T
100pF  
V
75pF  
FB  
3900pF  
V
IN  
(V)  
I (mA)  
OUT  
1626 TA05  
SGND  
C
T
2.5  
200  
350  
500*  
500*  
500*  
+
SENSE  
3.0  
3.5  
4.0  
4.2  
SENSE  
R
SENSE  
*
1000pF  
0.1Ω  
*
IRC 1206-R100F  
††  
AVX TPSE107M016R0100  
AVX TPSD107M010R0065  
*DESIGN LIMIT  
5V to 3.3V Converter  
V
IN  
5V  
+
C
IN  
L1*  
47µH  
0.1µF  
100µF  
10V  
R
**  
SENSE  
0.1Ω  
PWR V  
V
IN  
IN  
V
3.3V  
0.5A  
OUT  
LBI  
SW  
D1  
MBRS130LT1  
LBO  
SHDN  
SHUTDOWN  
1k  
PGND  
††  
LTC1626  
+
C
OUT  
+
I
TH  
SENSE  
SENSE  
V
220µF  
10V  
1000pF  
100pF  
C
T
15k  
1%  
270pF  
3900pF  
C
T
FB  
SGND  
9.09k  
1%  
1626 TA04  
*
COILCRAFT DO3316-473  
** IRC 1206-R100F  
AVX TPSD107K010  
AVX TPSE227K010  
††  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC1174/LTC1174-3.3  
LTC1174-5  
High Efficiency Step-Down and Inverting DC/DC Converters  
Monolithic Switching Regulators, Burst Mode Operation  
LTC1265  
1.2A, High Efficiency Step-Down DC/DC Converter  
1.5A, 500kHz Step-Down Switching Regulators  
Constant Off-Time Monolithic, Burst Mode Operation  
High Frequency, Small Inductor, High Efficiency  
LT1375/LT1376  
LTC1435  
High Efficiency, Low Noise, Synchronous Step-Down Converter 16-Pin Narrow SO and SSOP  
LTC1436/LTC1436-PLL High Efficiency, Low Noise, Synchronous Step-Down Converters 24-Pin Narrow and 28-Pin SSOP  
LTC1438/LTC1439  
LTC1474/LTC1475  
Dual, Low Noise, Synchronous Step-Down Converters  
Low Quiescent Current Step-Down DC/DC Converters  
Multiple Output Capability  
Monolithic, I = 10µA, 8-Pin MSOP  
Q
1626f LT/TP 0398 4K • PRINTED IN USA  
12 Linear Technology Corporation  
1630McCarthyBlvd., Milpitas, CA95035-7417 (408)432-1900  
FAX: (408) 434-0507 TELEX: 499-3977 www.linear-tech.com  
LINEAR TECHNOLOGY CORPORATION 1997  

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