LTC1702IGN#PBF [Linear]
LTC1702 - Dual 550kHz Synchronous 2-Phase Switching Regulator Controller; Package: SSOP; Pins: 24; Temperature Range: -40°C to 85°C;型号: | LTC1702IGN#PBF |
厂家: | Linear |
描述: | LTC1702 - Dual 550kHz Synchronous 2-Phase Switching Regulator Controller; Package: SSOP; Pins: 24; Temperature Range: -40°C to 85°C 信息通信管理 开关 光电二极管 |
文件: | 总36页 (文件大小:395K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC1702
Dual 550kHz Synchronous
2-Phase Switching Regulator Controller
U
FEATURES
DESCRIPTIO
The LTC®1702 is a dual switching regulator controller opti-
■
Two Independent Controllers in One Package
Two Sides Run Out-of-Phase to Minimize CIN
All N-Channel External MOSFET Architecture
No External Current Sense Resistors
Excellent Output Regulation: 1% Total Output
Accuracy
■
■
■
■
mized for high efficiency with low input voltages. It includes
two complete, on-chip, independent switching regulator
controllerseachdesignedtodriveapairofexternalN-channel
MOSFET devices in a voltage mode feedback, synchronous
buckconfiguration.TheLTC1702usesaconstant-frequency,
true PWM design switching at 550kHz, minimizing external
component size and cost and maximizing load transient
performance. The synchronous buck architecture automati-
cally shifts to discontinuous and then to Burst ModeTM
operation as the output load decreases, ensuring maximum
efficiency over a wide range of load currents.
■
550kHz Switching Frequency Minimizes External
Component Size
■
■
■
■
1A to 25A Output Current per Channel
High Efficiency over Wide Load Current Range
Quiescent Current Drops Below 100µA in Shutdown
Small 24-Pin Narrow SSOP Package
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The LTC1702 features an onboard reference trimmed to
0.5% and can provide better than 1% regulation at the
converteroutputs.Open-drainlogicoutputsindicatewhether
eitheroutputhasrisentowithin5%ofthefinaloutputvoltage
and an optional latching FAULT mode protects the load if the
output rises 15% above the intended voltage. Each channel
can be enabled independently; with both channels disabled,
the LTC1702 shuts down and supply current drops below
100µA.
APPLICATIO S
■
Microprocessor Core and I/O Supplies
■
Multiple Logic Supply Generator
■
Distributed Power Applications
■
High Efficiency Power Conversion
, LTC and LT are registered trademarks of Linear Technology Corporation. Burst Mode
is a registered trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S. Patents including 5481178,
5847554, 6304066, 6307356, 6580258.
U
TYPICAL APPLICATIO
Dual Output High Power 3.3V/2.5V Logic Supply
V
IN
= 5V ±10%
C
IN
, C
: PANASONIC EEFUE0G181R
: KEMET TS10X337M010AS
OUT1 OUT2
+
D1
C
IN
C
10Ω 10µF
330µF
×3
D2
D1, D2: MOTOROLA MBR0520LT1
D3, D4: MOTOROLA MBRS320T3
L1, L2: SUMIDA CEP125-1R0
1µF
27k
10µF
1
2
24
23
22
21
20
19
18
17
16
15
14
13
Q1 TO Q8: FAIRCHILD FDS6670A
PV
I
MAX2
1µF
CC
1µF
1µF
BOOST1
BG1
BOOST2
BG2
3
Q1
Q3
Q2
Q4
Q5
Q7
Q6
Q8
L1
1µH
L2
4
TG1
TG2
1µH
V
OUT1
2.5V
AT 15A
5
V
OUT2
SW1
SW2
3.3V/15A
27k
6
D3
D4
I
PGND
PGOOD2
FAULT
RUN/SS2
COMP2
FB2
+
C
MAX1
OUT1
1µF
LTC1702
180µF
×4
7
1.2k
1.6k
PGOOD1
FCB
8
+
C
OUT2
15.8k
1%
10k
1%
820pF
1µF
180µF
×4
680pF
9
RUN/SS
COMP1
SGND
FB1
1µF
10
11
12
1µF
4.99k
1%
4.75k
1%
47k
680pF
68k
3300pF
V
IN
10k
V
IN
27pF
27pF
V
CC
10k
PWRGD2
FAULT
PWRGD1
1702 TA01
1702fa
1
LTC1702
W W
U W
U
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ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
(Note 1)
TOP VIEW
Supply Voltage
1
2
I
MAX2
24
23
22
21
20
19
18
17
16
15
14
13
PV
CC
V
CC ........................................................................ 7V
BOOST2
BG2
BOOST1
BG1
3
BOOSTn............................................................... 15V
BOOSTn – SWn .................................................... 7V
Input Voltage
SWn .......................................................... –1V to 8V
All Other Inputs ......................... –0.3V to VCC + 0.3V
Peak Output Current < 10µs
TGn, BGn ............................................................... 5A
Operating Temperature Range
LTC1702C ............................................... 0°C to 70°C
LTC1702I........................................... –40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
4
TG2
TG1
5
SW2
SW1
6
PGND
PGOOD2
FAULT
RUN/SS2
COMP2
FB2
I
MAX1
7
PGOOD1
FCB
8
9
RUN/SS1
COMP1
SGND
10
11
12
V
FB1
CC
GN PACKAGE
24-LEAD NARROW PLASTIC SSOP
TJMAX = 125°C, θJA = 100°C/ W
ORDER PART NUMBER
LTC1702CGN
LTC1702IGN
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The
●
denotes specifications which apply over the full operating
temperature range, otherwise specifications are T = 25°C. V = 5V unless otherwise specified. (Note 3)
CC
A
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Main Control Loop
V
V
Supply Voltage
CC
●
●
●
3
3
7
7
7
V
V
V
CC
PV
BV
PV Supply Voltage
(Note 2)
CC
CC
BOOST Pin Voltage
V
– V (Note 2)
2.7
CC
BOOST
SW
I
V
Supply Current
Test Circuit 1, C = 0pF
●
●
2.2
30
8
100
mA
µA
CC
CC
L
RUN/SS1 = RUN/SS2 = 0V (Note 5)
IPV
PV Supply Current
CC
Test Circuit 1, C = 0pF (Note 4)
●
●
2.2
6
6
100
mA
µA
CC
L
RUN/SS1 = RUN/SS2 = 0V (Note 5)
I
BOOST Pin Current
Feedback Voltage
Test Circuit 1, C = 0pF (Note 4)
●
●
1.3
0.1
3
mA
BOOST
L
RUN/SS1 = RUN/SS2 = 0V
10
µA
V
Test Circuit 1, C = 0pF, LTC1702C
●
●
0.792
0.790
0.800
0.800
0.808
0.810
V
V
FB
L
Test Circuit 1, C = 0pF, LTC1702I
L
∆V
Feedback Voltage Line Regulation
Feedback Current
V
= 3V to 7V
CC
●
●
●
●
± 0.005
± 0.001
0.1
± 0.05
±1
±0.2
0.85
%/V
µA
%
FB
I
FB
∆V
OUT
Output Voltage Load Regulation
FCB Threshold
(Note 6)
V
0.75
0.8
V
FCB
∆V
FCB Feedback Hysteresis
FCB Pin Current
20
mV
µA
FCB
I
●
●
± 0.001
0.55
±1
0.65
–6
FCB
V
RUN/SS Pin RUN Threshold
Soft-Start Source Current
0.45
–2
V
RUN
I
RUN/SSn = 0V
–3.5
µA
SS
1702fa
2
LTC1702
ELECTRICAL CHARACTERISTICS The
●
denotes specifications which apply over the full operating
temperature range, otherwise specifications are T = 25°C. V = 5V unless otherwise specified. (Note 3)
CC
A
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Switching Characteristics
f
Oscillator Frequency
Converter 2 Oscillator Phase
Minimum Duty Cycle
Minimum Duty Cycle
Maximum Duty Cycle
Driver Nonoverlap
Test Circuit 1, C = 0pF
●
475
550
180
10
750
kHz
DEG
%
OSC
L
Φ
Relative to Converter 1 (Note 6)
OSC2
DC
V
V
< V
> V
●
●
●
●
●
7
0
MIN1
FB
FB
MAX
MAX
DC
DC
%
MIN2
87
90
40
12
93
100
80
%
MAX
t
Test Circuit 1, C = 2000pF (Note 7)
ns
NOV
L
t , t
Driver Rise/Fall Time
Test Circuit 1, C = 2000pF (Note 7)
ns
r
f
L
Feedback Amplifier
A
FB DC Gain
●
74
±3
85
25
dB
MHz
mA
VFB
GBW
FB Gain Bandwidth
I
FB Sink/Source Current
MIN Comparator Threshold
MAX Comparator Threshold
●
●
●
± 10
760
840
ERR
V
V
785
mV
MIN
815
mV
MAX
Current Limit Loop
A
I
I
Gain
40
dB
VILIM
IMAX
LIM
I
Source Current
I
I
= 0V, LTC1702C
= 0V, LTC1702I
●
●
–7
–7
–10
–10
–13
–14
µA
µA
MAX
MAX
MAX
Status Outputs
V
V
PGOOD Trip Point
V
Relative to Regulated V
●
●
●
–10
–5
0.03
±0.1
100
+15
0.03
–10
25
–2
0.1
±1
%
V
PGOOD
OLPG
FB
OUT
PGOOD Output Low Voltage
PGOOD Output Leakage
PGOOD Delay Time
PGOOD = 1mA
I
t
µA
µs
%
V
PGOOD
PGOOD
V
V
< V
to PGOOD (Note 7)
PGOOD
FB
V
V
FAULT Trip Point
Relative to Regulated V
●
●
+10
+20
0.1
FAULT
OLF
FB
OUT
FAULT Output Low Voltage
FAULT Output Current
FAULT Delay Time
I
= 1mA
= 0V
FAULT
I
t
V
V
µA
µs
FAULT
FAULT
FAULT
> V
to FAULT
FAULT
(Note 7)
FB
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 4: Supply current in normal operation is dominated by the current
needed to charge and discharge the external MOSFET gates. This current
will vary with supply voltage and the external MOSFETs used.
Note 5: Supply current in shutdown is dominated by external MOSFET
leakage and may be significantly higher than the quiescent current drawn
by the LTC1702, especially at elevated temperature.
Note 2: PV and BV (V
– V ) must be greater than V
of
CC
CC BOOST
SW
GS(ON)
the external MOSFETs used to ensure proper operation.
Note 3: All currents into device pins are positive; all currents out of device
pins are negative. All voltages are referenced to ground unless otherwise
specified.
Note 6: This parameter is guaranteed by correlation and is not tested
directly.
Note 7: Rise and fall times are measured using 10% and 90% levels. Delay
and nonoverlap times are measured using 50% levels.
1702fa
3
LTC1702
TYPICAL PERFOR A CE CHARACTERISTICS
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MOSFET Driver Supply Current
vs Gate Capacitance
Efficiency vs Load Current
Transient Response
100
90
35
30
V
IN
= 5V
TEST CIRCUIT 1
ONE DRIVER LOADED
MULTIPLY BY # OF ACTIVE
DRIVERS TO OBTAIN TOTAL
DRIVER SUPPLY CURRENT
VIN = 5V
V
OUT
= 3.3V
V
OUT = 1.8V
ILOAD = 0A-10A-0A
±2.2% MAX DEVIATION
V
V
= 2.5V
= 1.6V
OUT
OUT
25
20
15
10
5
20mV/
DIV
80
70
0
1702 G02
0
5
10
15
10µs/DIV
2000
4000
10000
0
6000
8000
LOAD CURRENT (A)
GATE CAPACITANCE (pF)
1702 G01
1702 G03
Normalized Frequency
vs Temperature
Supply Current vs Temperature
Driver R vs Temperature
ON
2.5
2.0
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
2.6
V
CC
= 5V
V
V
= 5V
BOOST
PVCC
TEST CIRCUIT 1
L
– V = 5V
SW
C
= 0pF
2.4
2.2
PV
CC
1.5
1.0
V
CC
2.0
1.8
1.6
1.4
1.2
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
BOOST1, BOOST2
1.0
–25
0
50
75 100 125
–50
0
25
50
75
125
–50
0
25
50
75
125
–50
25
100
100
–25
–25
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
1702 G04
1702 G05
1702 G06
RUN/SS Source Current
vs Temperature
Nonoverlap Time vs Temperature
Driver Rise/Fall vs Temperature
15
14
13
12
11
12
5.0
4.5
4.0
3.5
70
60
TEST CIRCUIT 1
V
CC
= 5V
TEST CIRCUIT 1
C
= 2000pF
C
= 2000pF
L
L
TG FALLING EDGE
BG RISING EDGE
50
40
30
20
10
BG FALLING EDGE
TG RISING EDGE
3.0
2.5
2.0
0
–50 –25
0
25
50
75 100 125
50
TEMPERATURE (°C)
100 125
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
–50 –25
0
25
75
TEMPERATURE (°C)
1702 G09
1702 G07
1702 G08
1702fa
4
LTC1702
U
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PIN FUNCTIONS
PVCC (Pin 1): Driver Power Supply Input. PVCC provides
power to the two BGn output drivers. PVCC must be
connected to a voltage high enough to fully turn on the
external MOSFETs QB1 and QB2. PVCC should generally
be connected directly to VIN. PVCC requires at least a 1µF
bypass capacitor directly to PGND.
FB1falls5%belowitsprogrammedvalue.WhenRUN/SS1
is low (side 1 shut down), PGOOD1 will go high.
FCB (Pin 8): Force Continuous Bar. The FCB pin forces
both converters to maintain continuous synchronous
operation regardless of load when the voltage at FCB
drops below 0.8V. FCB is normally tied to VCC. To force
continuous operation, tie FCB to SGND. FCB can also be
connected to a feedback resistor divider from a secondary
winding on one converter’s inductor to generate a third
regulated output voltage. Do not leave FCB floating.
BOOST1 (Pin 2): Controller 1 Top Gate Driver Supply. The
BOOST1 pin supplies power to the floating TG1 driver.
BOOST1 should be bypassed to SW1 with a 1µF capacitor.
An additional Schottky diode from VIN to BOOST1 pin will
create a complete floating charge-pumped supply at
BOOST1. No other external supplies are required.
RUN/SS1 (Pin 9): Controller 1 Run/Soft-start. Pulling
RUN/SS1 to SGND will disable controller 1 and turn off
both of its external MOSFET switches. Pulling both
RUN/SS pins down will shut down the entire LTC1702,
dropping the quiescent supply current below 100µA. A
capacitor from RUN/SS1 to SGND will control the turn-on
time and rate of rise of the controller 1 output voltage at
power-up. An internal 3.5µA current source pull-up at
RUN/SS1 pin sets the turn-on time at approximately
500ms/µF.
BG1 (Pin 3): Controller 1 Bottom Gate Drive. The BG1 pin
drives the gate of the bottom N-channel synchronous
switch MOSFET, QB1. BG1 is designed to drive up to
10,000pF of gate capacitance directly. If RUN/SS1 goes
low, BG1 will go low, turning off QB1. If FAULT mode is
tripped, BG1 will go high and stay high, keeping QB1 on
until the power is cycled.
TG1 (Pin 4): Controller 1 Top Gate Drive. The TG1 pin
drives the gate of the top N-channel MOSFET, QT1. The
TG1driverdraws powerfromtheBOOST1pinandreturns
to the SW1 pin, providing true floating drive to QT1. TG1
is designed to drive up to 10,000pF of gate capacitance
directly. In shutdown or fault modes, TG1 will go low.
COMP1 (Pin 10): Controller 1 Loop Compensation. The
COMP1 pin is connected directly to the output of the first
controller’s error amplifier and the input to the PWM
comparator. An RC network is used at the COMP1 pin to
compensate the feedback loop for optimum transient
response.
SW1 (Pin 5): Controller 1 Switching Node. SW1 should be
connected to the switching node of converter 1. The TG1
driver ground returns to SW1, providing floating gate
drive to the top N-channel MOSFET switch, QT1. The
voltage at SW1 is compared to IMAX1 by the current limit
comparator while the bottom MOSFET, QB1, is on.
SGND (Pin 11): Signal Ground. All internal low power
circuitry returns to the SGND pin. Connect to a low
impedance ground, separated from the PGND node. All
feedback,compensationandsoft-startconnectionsshould
return to SGND. SGND and PGND should connect only at
a single point, near the PGND pin and the negative plate of
the CIN bypass capacitor.
IMAX1 (Pin 6): Controller 1 Current Limit Set. The IMAX1
pin sets the current limit comparator threshold for
controller1.IfthevoltagedropacrossthebottomMOSFET,
FB1 (Pin 12): Controller 1 Feedback Input. FB1 should be
connected through a resistor network to VOUT1 to set the
output voltage. The loop compensation network for con-
troller 1 also connects to FB1.
QB1, exceeds the magnitude of the voltage at IMAX1
,
controller 1 will go into current limit. The IMAX1 pin has an
internal 10µA current source pull-up, allowing the current
threshold to be set with a single external resistor to PGND.
See the Current Limit Programming section for more
VCC (Pin 13): Power Supply Input. All internal circuits
except the output drivers are powered from this pin. VCC
should be connected to a low noise power supply voltage
between 3V and 7V and should be bypassed to SGND with
at least a 1µF capacitor in close proximity to the LTC1702.
1702fa
information on choosing RIMAX
.
PGOOD1 (Pin 7): Controller 1 Power Good. PGOOD1 is an
open-drain logic output. PGOOD1 will pull low whenever
5
LTC1702
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PIN FUNCTIONS
FB2 (Pin 14): Controller 2 Feedback Input. See FB1.
disable latched FAULT mode and will allow the LTC1702 to
resume normal operation when the overvoltage fault is
removed.
COMP2 (Pin 15): Controller 2 Loop Compensation. See
COMP1.
PGOOD2(Pin18):Controller2PowerGood.SeePGOOD1.
RUN/SS2 (Pin 16): Controller 2 Run/Soft-start. See RUN/
SS1.
PGND (Pin 19): Power Ground. The BGn drivers return to
this pin. Connect PGND to a high current ground node in
close proximity to the sources of external MOSFETs, QB1
and QB2, and the VIN and VOUT bypass capacitors.
FAULT (Pin 17): Output Overvoltage Fault (Latched). The
FAULT pin is an open-drain output with an internal 10µA
pull-up. If either regulated output voltage rises more than
15% above its programmed value for more than 25µs, the
FAULT output will go high and the entire LTC1702 will be
disabled. When FAULT is high, both BG pins will go high,
turning on the bottom MOSFET switches and pulling down
the high output voltage. The LTC1702 will remain latched
in this state until the power is cycled. When FAULT mode
is active, the FAULT pin will be pulled up with an internal
10µA current source. Tying FAULT directly to PGND will
SW2 (Pin 20): Controller 2 Switching Node. See SW1.
TG2 (Pin 21): Controller 2 Top Gate Drive. See TG1.
BG2 (Pin 22): Controller 2 Bottom Gate Drive. See BG1.
BOOST2 (Pin 23): Controller 2 Top Gate Driver Supply.
See BOOST1.
I
MAX2 (Pin 24): Controller 2 Current Limit Set. See IMAX1
.
W
BLOCK DIAGRAM
PV
CC
FCB
V
CC
BOOST1,2
TG1,2
BURST
LOGIC
DRIVE
LOGIC
SW1,2
BG1,2
PGND
90% DUTY CYCLE
OSC
SGND
1V
P-P
550kHz
DIS
3.5µA
SOFT
START
100µs
PGOOD1,2
FAULT
RUN/SS1,2
COMP1,2
DELAY
25µs
DELAY
I
LIM
10µA
FB
MIN
MAX
FLT
+
–
FROM
I
MAX1,2
OTHER
800mV
760mV
840mV
920mV
CONTROLLER
FB1,2
SHUTDOWN TO
THIS CONTROLLER
1702 BD
SHUTDOWN TO
ENTIRE CHIP
550mV
FROM
OTHER
CONTROLLER
1702fa
6
LTC1702
TEST CIRCUIT
Test Circuit 1
5V
+
I
I
I
I
BOOST2
BOOST1
CC
PVCC
0.1µF
100µF
V
PV
CC
CC
BOOST1
BOOST2
f
OSC
MEASURED
TG1
TG2
5V
BG1
BG2
SW1
SW2
5V
C
C
C
C
L
L
L
L
10k
I
I
MAX2
MAX1
LTC1702
10k
FCB
V
V
PGOOD1
PGOOD2
FAULT
V
PGOOD1
PGOOD2
FAULT
RUN/SS1
COMP1
RUN/SS2
COMP2
FB2
2k
2k
V
FB1
V
FB2
FB1
GND
PGND
1702 TC
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APPLICATIONS INFORMATION
OVERVIEW
controllersallow,improvingstabilityandmaximizingtran-
sient response. The 800mV internal reference allows
regulated output voltages as low as 800mV without exter-
nal level shifting amplifiers.
The LTC1702 is a dual, step-down (buck), voltage mode
feedback switching regulator controller. It is designed to
be used in a synchronous switching architecture with two
external N-channel MOSFETs per channel. It is intended to
operate from a low voltage input supply (7V maximum)
and provide a high power, high efficiency, precisely regu-
lated output voltage. Several features make it particularly
suitedformicroprocessorsupplyregulation.Outputregu-
lation is extremely tight, with DC line and load regulation
and initial accuracy better than 1%, and total regulation
including transient response inside of 3% with a properly
designed circuit. The 550kHz switching frequency allows
theuseofphysicallysmall,lowvalueexternalcomponents
without compromising performance.
The LTC1702’s synchronous switching logic transitions
automatically into Burst Mode operation, maximizing effi-
ciency with light loads. Onboard power-good and over-
voltage (OV) fault flags indicate when the output is in
regulation or an OV fault has occurred. The OV flag can be
set to latch the device off when an OV fault has occurred,
or to automatically resume operation when the fault is
removed.
The LTC1702 takes a low input voltage and generates two
lower output voltages at very high currents. Its strengths
are small size, unmatched regulation and transient
response and high efficiency. This combination makes it
ideal for providing multiple low voltage logic supplies to
microprocessors or high density ASICs in systems using
a “2-step” regulation architecture, used in portable and
advanced desktop computers.
The LTC1702’s internal feedback amplifier is a 25MHz
gain-bandwidth op amp, allowing the use of complex
multipole/zero compensation networks. This allows the
feedback loop to maintain acceptable phase margin at
higher frequencies than traditional switching regulator
1702fa
7
LTC1702
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APPLICATIONS INFORMATION
2-Step Conversion
regulation system happens in the 5V supply, which is
usuallylocatedawayfromtheCPU. Thepowerlosttoheat
in the LTC1702 section of the system is relatively low,
minimizing the added heat near the CPU.
“2-step” architectures use a primary regulator to convert
the input power source (batteries or AC line voltage) to an
intermediate supply voltage, often 5V. This intermediate
voltage is then converted to the low voltage, high current
supplies required by the system using a secondary regu-
lator—the LTC1702. 2-step conversion eliminates the
need for a single converter that converts a high input
voltage to a very low output voltage, often an awkward
design challenge. It also fits naturally into systems that
continue to use the 5V supply to power portions of their
circuitry, or have excess 5V capacity available as newer
circuit designs shift the current load to lower voltage
supplies.
See the Optimizing Performance section for a detailed
explanation of how to calculate system efficiency.
2-Phase Operation
The LTC1702 dual switching regulator controller also
features the considerable benefits of 2-phase operation.
Notebook computers, hand-held terminals and automo-
tive electronics all benefit from the lower input filtering
requirement, reduced electromagnetic interference (EMI)
and increased efficiency associated with 2-phase
operation.
Each regulator in a typical 2-step system maintains a
relativelylowstep-downratio(5:1orless), runningathigh
efficiency while maintaining a reasonable duty cycle. In
contrast, a regulator taking a single step from a high input
voltage to a 1.xV or 2.xV output must run at a very narrow
duty cycle, mandating trade-offs in external component
values and compromising efficiency and transient
response. The efficiency loss can exceed that of using a
2-step solution (see the 2-Step Efficiency Calculation
section and Figure 10). Further complicating the calcula-
tion is the fact that many systems draw a significant
fraction of their total power off the intermediate 5V supply,
bypassing the low voltage supply. 2-step solutions using
the LTC1702 usually match or exceed the total system
efficiency of single-step solutions, and provide the addi-
tional benefits of improved transient response, reduced
PCB area and simplified power trace routing.
Whytheneedfor2-phaseoperation?UpuntiltheLTC1702,
constant-frequency dual switching regulators operated
both channels in phase (i.e., single-phase operation). This
means that both topside MOSFETs turned on at the same
time, causing current pulses of up to twice the amplitude
of those for one regulator to be drawn from the input
capacitor. These large amplitude current pulses increased
the total RMS current flowing from the input capacitor,
requiring the use of more expensive input capacitors and
increasing both EMI and losses in the input capacitor and
input power supply.
With 2-phase operation, the two channels of the LTC1702
are operated 180 degrees out of phase. This effectively
interleaves the current pulses coming from the switches,
greatlyreducingtheoverlaptimewheretheyaddtogether.
The result is a significant reduction in total RMS input
current, which in turn allows less expensive input capaci-
tors to be used, reduces shielding requirements for EMI
and improves real world operating efficiency.
2-stepregulationcanbuyadvantagesinthermalmanage-
mentaswell. PowerdissipationintheLTC1702portionof
a 2-step circuit is lower than it would be in a typical 1-step
converter, even in cases where the 1-step converter has
higher total efficiency than the 2-step system. In a typical
microprocessor core supply regulator, for example, the
regulator is usually located right next to the CPU. In a
1-step design, all of the power dissipated by the core
regulator is right there next to the hot CPU, aggravating
thermal management. In a 2-step LTC1702 design, a
significant percentage of the power lost in the core
Figure 7 shows example waveforms for a single switching
regulator channel versus a 2-phase LTC1702 system with
both sides switching. A single-phase dual regulator with
both sides operating would exhibit double the single side
numbers. In this example, 2-phase operation reduced the
RMS input current from 9.3ARMS (2 × 4.66ARMS) to
4.8ARMS. While this is an impressive reduction in itself,
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2
rememberthatthepowerlossesareproportionaltoIRMS
,
High Efficiency
meaning that the actual power wasted is reduced by a
factorof3.75.Thereducedinputripplevoltagealsomeans
less power is lost in the input power path, which could
include batteries, switches, trace/connector resistances
andprotectioncircuitry. Improvementsinbothconducted
and radiated EMI also directly accrue as a result of the
reduced RMS input current and voltage.
The LTC1702 uses a synchronous step-down (buck)
architecture, with two external N-channel MOSFETs per
output. A floating topside driver and a simple external
charge pump provide full gate drive to the upper MOSFET.
The voltage mode feedback loop and MOSFET VDS current
limit sensing remove the need for an external current
sense resistor, eliminating an external component and a
source of power loss in the high current path. Properly
designed circuits using low gate charge MOSFETs are
capable of efficiencies exceeding 90% over a wide range
of output voltages.
Small Footprint
The LTC1702 operates at a 550kHz switching frequency,
allowing it to use low value inductors without generating
excessive ripple currents. Because the inductor stores
less energy per cycle, the physical size of the inductor can
be reduced without risking core saturation, saving PCB
board space. The high operating frequency also means
less energy is stored in the output capacitors between
cycles, minimizing their required value and size. The
remaining components, including the 150mil SSOP-24
LTC1702,aretiny,allowinganentiredual-outputLTC1702
circuit to be constructed in 1.5in2 of PCB space. Further,
this space is generally located right next to the micropro-
cessor or in some similarly congested area, where PCB
real estate is at a premium. The fact that the LTC1702 runs
off the 5V supply, often available from a power plane, is an
added benefit in portable systems —it does not require a
dedicated supply line running from the battery.
ARCHITECTURE DETAILS
The LTC1702 dual switching regulator controller includes
two identical, independent regulator channels. The two
sides of the chip and their corresponding external compo-
nents act independently of each other with the exception
of the common input bypass capacitor and the FCB and
FAULT pins, which affect both channels. In the following
discussions, when a pin is referred to without mentioning
which side is involved, that discussion applies equally to
both sides.
Switching Architecture
Each half of the LTC1702 is designed to operate as a
synchronous buck converter (Figure 1). Each channel
includes two high power MOSFET gate drivers to control
external N-channel MOSFETs QT and QB. These drivers
have 0.5Ω output impedances and can carry well over an
Fast Transient Response
The LTC1702 uses a fast 25MHz GBW op amp as an error
amplifier. This allows the compensation network to be
designed with several poles and zeros in a more flexible
configuration than with a typical gm feedback amplifier.
The high bandwidth of the amplifier, coupled with the high
switching frequency and the low values of the external
inductor and output capacitor, allow very high loop cross-
over frequencies. The low inductor value is the other half
of the equation—with a typical value on the order of 1µH,
the inductor allows very fast di/dt slew rates. The result is
superior transient response compared with conventional
solutions.
V
IN
+
C
C
IN
L
QT
QB
TG
EXT
LTC1702 SW
V
OUT
+
BG
PGND
OUT
1702 F01
Figure 1. Synchronous Buck Architecture
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tion with a simple external charge pump (Figure 2), this
allows the LTC1702 to completely enhance the gate of QT
without requiring an additional, higher supply voltage.
amp of continuous current with peak currents up to 5A to
slew large MOSFET gates quickly. The external MOSFETs
are connected with the drain of QT attached to the input
supply and the source of QT at the switching node SW. QB
is the synchronous rectifier with its drain at SW and its
source at PGND. SW is connected to one end of the
inductor,withtheotherendconnectedtoVOUT.Theoutput
capacitor is connected from VOUT to PGND.
The two channels of the LTC1702 run from a common
clock, with the phasing chosen to be 180° from side 1 to
side 2. This has the effect of doubling the frequency of the
switching pulses seen by the input bypass capacitor, sig-
nificantly lowering the RMS current seen by the capacitor
andreducingthevaluerequired(seethe2-Phasesection).
When a switching cycle begins, QB is turned off and QT is
turned on. SW rises almost immediately to VIN and the
inductor current begins to increase. When the PWM pulse
finishes, QTturnsoffandonenonoverlapintervallater, QB
turnson. NowSWdropstoPGNDandtheinductorcurrent
decreases. The cycle repeats with the next tick of the
master clock. The percentage of time spent in each mode
is controlled by the duty cycle of the PWM signal, which in
turn is controlled by the feedback amplifier. The master
clock generates a 1VP-P, 550kHz sawtooth waveform and
turns QT once every 1.8µs. In a typical application with a
5Vinputanda1.6Voutput, thedutycyclewillbesetat1.6/
5 × 100% or 32% by the feedback loop. This will give
roughly a 575ns on-time for QT and a 1.22µs on-time for
QB.
V
IN
+
+
D
C
CP
IN
PV
BOOST
TG
CC
C
1µF
CP
QT
L
EXT
SW
V
OUT
BG
QB
C
OUT
LTC1702
PGND
1702 F02
Figure 2. Floating TG Driver Supply
This constant frequency operation brings with it a couple
of benefits. Inductor and capacitor values can be chosen
with a precise operating frequency in mind and the feed-
back loop components can be similarly tightly specified.
Noise generated by the circuit will always be in a known
frequency band with the 550kHz frequency designed to
leavethe455kHzIFbandfreeofinterference.Subharmonic
oscillation and slope compensation, common headaches
with constant frequency current mode switchers, are
absent in voltage mode designs like the LTC1702.
Feedback Amplifier
Each side of the LTC1702 senses the output voltage at
VOUT with an internal feedback op amp (see Block Dia-
gram). This is a real op amp with a low impedance output,
85dBopen-loopgainand25MHzgain-bandwidthproduct.
The positive input is connected internally to an 800mV
reference, while the negative input is connected to the FB
pin. The output is connected to COMP, which is in turn
connected to the soft-start circuitry and from there to the
PWM generator.
During the time that QT is on, its source (the SW pin) is at
VIN. VIN is also the power supply for the LTC1702. How-
ever, QT requires VIN + VGS(ON) at its gate to achieve
minimumRON.ThispresentsaproblemfortheLTC1702—
it needs to generate a gate drive signal at TG higher than
itshighestsupplyvoltage.Togetaroundthis,theTGdriver
runs from floating supplies, with its negative supply at-
tached to SW and its power supply at BOOST. This allows
it to slew up and down with the source of QT. In combina-
Unlike many regulators that use a resistor divider con-
nected to a high impedance feedback input, the LTC1702
is designed to use an inverting summing amplifier topol-
ogy with the FB pin configured as a virtual ground. This
allows flexibility in choosing pole and zero locations not
available with simple gm configurations. In particular, it
allows the use of “type 3” compensation, which provides
a phase boost at the LC pole frequency and significantly
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improves loop phase margin (see Figure 3). The Feedback
Loop/Compensation section contains a detailed explana-
tion of type 3 feedback loops.
Notice that the FB pin is the virtual ground node of the
feedback amplifier. A typical compensation network does
not include local DC feedback around the amplifier, so that
the DC level at FB will be an accurate replica of the output
voltage, divided down by R1 and RB (Figure 3). However,
the compensation capacitors will tend to attenuate AC
signals at FB, especially with low bandwidth type 1 feed-
back loops. This creates a situation where the MIN and
MAX comparators do not respond immediately to shifts in
the output voltage, since they monitor the output at FB.
Maximizing feedback loop bandwidth will minimize these
delays and allow MIN and MAX to operate properly. See
the Feedback Loop/Compensation section.
C3
0.8V
+
R3
COMP
FB
R1
FB
V
–
OUT
R
B
C2
C1
R2
1702 F03
Figure 3. “Type 3” Feedback Loop
PGOOD Flags
The MIN comparator performs another function; it drives
the external “power good” pin (PGOOD) through a 100µs
delay stage. PGOOD is an open-drain output, allowing it to
be wire-OR’ed with other open-drain/open-collector sig-
nals. An external pull-up resistor is required for PGOOD to
swing high. Any time the FB pin is more than 5% below the
programmed value for more than 100µs, PGOOD will pull
low, indicating that the output is out of regulation. PGOOD
remains active during soft-start and current limit, even
thoughtheMINcomparatorhasnoeffectonthedutycycle
during these times. The 100µs delay ensures that short
output transient glitches that are successfully “caught” by
the MIN comparator don’t cause momentary glitches at
the PGOOD pin. Note that the PGOOD pin only watches
MIN, not MAX—it does not indicate if the output is 5%
above the programmed value.
MIN/MAX
Two additional feedback loops keep an eye on the primary
feedback amplifier and step in if the feedback node moves
± 5%fromitsnominal800mVvalue. TheMAXcomparator
(see Block Diagram) activates whenever FB rises more
than 5% above 800mV. It immediately turns the top
MOSFET (QT) off and the bottom MOSFET (QB) on and
keeps them that way until FB falls back within 5%. This
pulls the output down as fast as possible, preventing
damage to the (often expensive) load. If FB rises because
the output is shorted to a higher supply, QB will stay on
until the short goes away, the higher supply current limits
or QB dies trying to save the load. This behavior provides
maximum protection against overvoltage faults at the
output, while allowing the circuit to resume normal opera-
tionwhenthefaultisremoved. Theovervoltageprotection
circuit can optionally be set to latch the output off perma-
nently (see the Overvoltage Fault section).
When either side of the LTC1702 is in shutdown, its
associated PGOOD pin will go high. This behavior allows
a valid PGOOD reading when the two PGOOD pins are tied
together, even if one side is shut down. It also reduces
quiescent current by eliminating the excess current drawn
by the pull-up at the PGOOD pin. As soon as the RUN/SS
pin rises above the shutdown threshold and the side
comes out of shutdown, the PGOOD pin will pull low until
the output voltage is valid. If both sides are shut down at
the same time, both PGOOD pins will go high. To avoid
confusion, if either side of the LTC1702 is shut down, the
host system should ignore the associated PGOOD pin.
The MIN comparator (see Block Diagram) trips whenever
FB is more than 5% below 800mV and immediately forces
the switch duty cycle to 90% to bring the output voltage
back into range. It releases when FB is within the 5%
window. MIN is disabled when the soft-start or current
limit circuits are active—the only two times that the
output should legitimately be below its regulated value.
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SHUTDOWN/SOFT-START
10%. The maximum duty cycle limit increases linearly
between1Vand2.5V, reachingitsfinalvalueof90%when
RUN/SS is above 2.5V. Somewhere before this point, the
feedback amplifier will assume control of the loop and the
output will come into regulation. When RUN/SS rises to
0.5V below VCC, the MIN feedback comparator is enabled,
and the LTC1702 is in full operation (see Figure 4).
Each half of the LTC1702 has a RUN/SS pin. The RUN/SS
pins perform two functions: when pulled to ground, each
shuts down its half of the LTC1702, and each acts as a
conventional soft-start pin, enforcing a maximum duty
cycle limit proportional to the voltage at RUN/SS. An
internal 3.5µA current source pull-up is connected to each
RUN/SS pin, allowing a soft-start ramp to be generated
with a single external capacitor to ground. The 3.5µA
current sources are active even when the LTC1702 is shut
down, ensuring the device will start when any external
pull-down at RUN/SS is released. Either side can be shut
down without affecting the operation of the other side. If
both sides are shut down at the same time, the LTC1702
goes into a micropower sleep mode, and quiescent cur-
rent drops below 100µA. Entering sleep mode also resets
the FAULT latch, if it was set.
CURRENT LIMIT
TheLTC1702includesanonboardcurrentlimitcircuitthat
limitsthemaximumoutputcurrenttoauser-programmed
level. It works by sensing the voltage drop across QB
during the time that QB is on and comparing that voltage
toauser-programmedvoltageatIMAX. SinceQBlookslike
a low value resistor during its on-time, the voltage drop
across it is proportional to the current flowing in it. In a
buck converter, the average current in the inductor is
equaltotheoutputcurrent.Thiscurrentalsoflowsthrough
QB during its on-time. Thus, by watching the voltage
across QB, the LTC1702 can monitor the output current.
EachRUN/SSpinshutsdownitshalfoftheLTC1702when
it falls below about 0.5V. Between 0.5V and about 1V, that
half is active, but the maximum duty cycle is limited to
V
OUT
0V
5V
4.5V
V
2.5V
2.5V
RUN/SS
1.0V
0.55V
0V
LTC1702 ENABLED
RUN/SS CONTROLS
DUTY CYCLE
RUN/SS CONTROLS
DUTY CYCLE
COMP CONTROLS DUTY CYCLE
MIN COMPARATOR ENABLED
START-UP
NORMAL OPERATION
CURRENT LIMIT
1702 F04
Figure 4. Soft-Start Operation in Start-Up and Current Limit
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Any time QB is on and the current flowing to the output is
reasonably large, the SW node at the drain of QB will be
somewhat negative with respect to PGND. The LTC1702
senses this voltage and inverts it to allow it to compare the
sensed voltage with a positive voltage at the IMAX pin. The
IMAX pin includes a trimmed 10µA pull-up, enabling the
DISCONTINUOUS/Burst Mode OPERATION
Theory of operation
The LTC1702 switching logic has three modes of opera-
tion. Under heavy loads, it operates as a fully synchro-
nous, continuous conduction switching regulator. In this
modeofoperation(“continuous”mode), thecurrentinthe
inductorflowsinthepositivedirection(towardtheoutput)
during the entire switching cycle, constantly supplying
current to the load. In this mode, the synchronous switch
(QB) is on whenever QT is off, so the current always flows
through a low impedance switch, minimizing voltage drop
and power loss. This is the most efficient mode of opera-
tion at heavy loads, where the resistive losses in the power
devices are the dominant loss term.
usertosetthevoltageatIMAX withasingleresistor, RIMAX
,
to ground. The LTC1702 compares the two inputs and
begins limiting the output current when the magnitude of
the negative voltage at the SW pin is greater than the
voltage at IMAX
.
The current limit detector is connected to an internal gm
amplifier that pulls a current from the RUN/SS pin propor-
tional to the difference in voltage magnitudes between the
SW and IMAX pins. This current begins to discharge the
soft-start capacitor at RUN/SS, reducing the duty cycle
and controlling the output voltage until the current drops
below the limit. The soft-start capacitor needs to move a
fair amount before it has any effect on the duty cycle,
addingadelayuntilthecurrentlimittakeseffect(Figure4).
This allows the LTC1702 to experience brief overload
conditionswithoutaffectingtheoutputvoltageregulation.
The delay also acts as a pole in the current limit loop to
enhance loop stability. Larger overloads cause the soft-
start capacitor to pull down quickly, protecting the output
components from damage. The current limit gm amplifier
includes a clamp to prevent it from pulling RUN/SS below
0.5V and shutting off the device.
Continuous mode works efficiently when the load current
is greater than half of the ripple current in the inductor. In
a buck converter like the LTC1702, the average current in
the inductor (averaged over one switching cycle) is equal
to the load current. The ripple current is the difference
between the maximum and the minimum current during a
switching cycle (see Figure 5a). The ripple current
depends on inductor value, clock frequency and output
voltage, but is constant regardless of load as long as the
LTC1702 remains in continuous mode. See the Inductor
Selection section for a detailed description of ripple
current.
As the output load current decreases in continuous mode,
theaveragecurrentintheinductorwillreachapointwhere
it drops below half the ripple current. At this point, the
inductor current will reverse during a portion of the
switching cycle, or begin to flow from the output back to
the input. This does not adversely affect regulation, but
does cause additional losses as a portion of the inductor
current flows back and forth through the resistive power
switches, giving away a little more power each time and
lowering the efficiency. There are some benefits to allow-
ing this reverse current flow: the circuit will maintain
regulation even if the load current drops below zero (the
load supplies current to the LTC1702) and the output
Power MOSFET RDS(ON) varies from MOSFET to MOSFET,
limitingtheaccuracyobtainablefromtheLTC1702current
limit loop. Additionally, ringing on the SW node due to
parasitics can add to the apparent current, causing the
loop to engage early. The LTC1702 current limit is
designed primarily as a disaster prevention, “no blow up”
circuit, and is not useful as a precision current regulator.
It should typically be set around 50% above the maximum
expected normal output current to prevent component
tolerancesfromencroachingonthenormalcurrentrange.
See the Current Limit Programming section for advice on
choosing a valve for RIMAX
.
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ripple voltage and frequency remain constant at all loads,
easing filtering requirements. Circuits that take advantage
of this behavior can force the LTC1702 to operate in
continuous mode at all loads by tying the FCB (Force
Continuous Bar) pin to ground.
on. SinceQBactslikearesistor, SWshouldideallyberight
at0Vwhentheinductorcurrentreacheszero.Inreality,the
SW node will ring to some degree immediately after it is
switched to ground by QB, causing some uncertainty as to
the actual moment the average current in QB goes to zero.
The LTC1702 minimizes this effect by ignoring the SW
node for a fixed 50ns after QB turns on when the ringing
is most severe, and by including a few millivolts offset in
the comparator that monitors the SW node. Despite these
precautions, some combinations of inductor and layout
parasitics can cause the LTC1702 to enter discontinuous
mode erratically. In many cases, the time that QB turns off
will correspond to a peak in the ringing waveform at the
SW pin (Figure 6). This erratic operation isn’t pretty, but
retains much of the efficiency benefit of discontinuous
mode and maintains regulation at all times.
Discontinuous Mode
To minimize the efficiency loss due to reverse current flow
at light loads, the LTC1702 switches to a second mode of
operation:discontinuousmode(Figure5b).Indiscontinu-
ousmode, theLTC1702detectswhentheinductorcurrent
approaches zero and turns off QB for the remainder of the
switch cycle. During this time, the voltage at the SW pin
will float about VOUT, the voltage across the inductor will
be zero, and the inductor current remains zero until the
next switching cycle begins andQT turns on again. This
prevents current from flowing backwards in QB, eliminat-
ing that power loss term. It also reduces the ripple current
in the inductor as the output current approaches zero.
Burst Mode Operation
Discontinuous mode removes the resistive loss drop term
in QB, but the LTC1702 is still switching QT and QB on and
off once a cycle. Each time an external MOSFET is turned
on, the internal driver must charge its gate to VCC. Each
time it is turned off, that charge is lost to ground. At the
high switching frequencies that the LTC1702 operates at,
thechargelosttothegatescanadduptotensofmilliamps
from VCC. As the load current continues to drop, this
quickly become the dominant power loss term, reducing
efficiency once again.
TheLTC1702detectsthattheinductorcurrenthasreached
zero by monitoring the voltage at the SW pin while QB is
I
RIPPLE
I
AVERAGE
TIME
1702 F05a
DISCONTINUOUS
COMPARATOR
TURNS OFF BG
V
Figure 5a. Continuous Mode
SW
0V
TIME
50ns
BLANK
TIME
5V
I
RIPPLE
V
BG
0V
1702 F06
TIME
I
AVERAGE
TIME
1702 F05b
Figure 6. Ringing at SW Causes Discontinuous
Comparator to Trip Early
Figure 5b. Discontinuous Mode
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Once again, the LTC1702 switches to a new mode to
minimize efficiency loss: Burst Mode operation. As the
circuit goes deeper and deeper into discontinuous mode,
thetotaltimeQTandQBareonreduces.However,theratio
of the time that QT is on to the time that QB is on must
remain constant for the output to stay in regulation. An
internal timer circuit forces QT to stay on for at least 10%
of a normal switching cycle. When the load drops to the
pointthattheoutputrequireslessthan10%on-timeatQT,
the output voltage will begin to rise. The LTC1702 senses
this rise and shuts both QT and QB off completely, skip-
ping several switching cycles until the output falls back
into range. It then resumes switching in discontinuous
mode with QT at 10% duty cycle and the burst sequence
repeats. The total deviation from the regulated output is
within the 1% regulation tolerance of the LTC1702.
Paralleling Outputs
Synchronous regulators (like the LTC1702) are known for
their bullheadedness when their outputs are paralleled
with other regulators. In particular, a synchronous regu-
lator paralleled with another regulator whose output is
slightlyhigher(perhapsjustbymillivolts)willhappilysink
amps of current attempting to pull its own output back
down to what it thinks is the right value.
The LTC1702 discontinuous mode allows it to be paral-
leled with another regulator without fighting. A typical
system might use the LTC1702 as a primary regulator and
a small LDO as a backup regulator to keep SRAM alive
when the main power is off. When the LTC1702 is shut
down(bypullingRUN/SStoground), bothQTandQBturn
off and the output goes into a high impedance state,
allowing the smaller regulator to support the output volt-
age. However, if the LTC1702 is powered back up in
continuous mode, it will begin a soft-start cycle with a low
duty cycle, pulling the output down and corrupting the
data stored in SRAM. The solution is to tie FCB high,
allowing the device to start in discontinuous mode. Any
reversecurrentflowinQBwilltripthediscontinuousmode
circuitry, preventing the LTC1702 from pulling down the
output. The Typical Applications section shows an
example of such a circuit.
InBurstModeoperation, bothresistivelossandswitching
loss are minimized while keeping the output in regulation.
The ripple current will be set by the 10% QT on-time and
the input supply voltage and is the lowest of all three
operating modes. As the load current falls to zero in Burst
Mode operation, the most significant loss term becomes
the 3mA quiescent current drawn by each side of the
LTC1702—usually much less than the minimum load
current in a typical low voltage logic system. Burst Mode
operation maximizes efficiency at low load currents, but
can cause low frequency ripple in the output voltage as the
cycle-skipping circuitry switches on and off.
OVERVOLTAGE FAULT
The LTC1702 includes a single overvoltage fault flag for
both channels: FAULT. FAULT is an open-drain output
with an internal 10µA pull-up. If either FB pin rises more
than 15% above the nominal 800mV value for more than
25µs, the overvoltage comparator will trip, setting an
internal latch. This latch releases the pull-down at FAULT,
allowing the 10µA pull-up to take it high. When FAULT
goeshigh, theLTC1702stopsallswitching, turnsbothQB
(bottom synchronous) MOSFETs on continuously and
remainsinthisstateuntil bothRUN/SSpinsarepulledlow
simultaneously, the power supply is recycled, or the
FAULT pin is pulled low externally. This behavior is in-
tended to protect a potentially expensive load from over-
voltage damage at all costs. Under some conditions, this
behavior can cause the output voltage to undershoot
FCB Pin
Insomecircumstances, itisdesirabletocontrolordisable
discontinuousandBurstModeoperations.TheFCB(Force
Continuous Bar) pin allows the user to do this. When the
FCB pin is high, the LTC1702 is allowed to enter discon-
tinuous and Burst Mode operations at either side as
required. If FCB is taken low, discontinuous and Burst
Mode operations are disabled and both sides of the
LTC1702 run in continuous mode regardless of load. This
does not affect output regulation but does reduce effi-
ciency at low output currents. The FCB pin threshold is
specified at 0.8V ±50mV, and includes 20mV of hyster-
esis, allowing it to be used as a precision small-signal
comparator.
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below ground. If latched FAULT mode is used, a Schottky
diode should be added with its cathode at the output and
its anode at ground to clamp the negative voltage to a safe
level and prevent possible damage to the load and the
output capacitors.
low RDS(ON) at 5V VGS (3.3V VGS if the PVCC input supply
is 3.3V) to minimize resistive power loss while they are
conducting current. They must also have low gate charge
to minimize transition losses during switching. On the
other hand, voltage breakdown requirements in a typical
LTC1702 circuit are pretty tame: the 7V maximum input
voltage limits the VDS and VGS the MOSFETs can see to
safe levels for most devices.
Note that in overvoltage conditions, the MAX comparator
will kick in at just +5%, turning QB on continuously long
before the output reaches +15%. Under most fault condi-
tions, this is adequate to bring the output back down
without firing the fault latch. Additionally, if MAX success-
fully keeps the output below +15%, the LTC1702 will
resume normal regulation as soon as the output overvolt-
age fault is resolved.
Low RDS(ON)
RDS(ON) calculations are pretty straightforward. RDS(ON) is
the resistance from the drain to the source of the MOSFET
when the gate is fully on. Many MOSFETs have RDS(ON)
specified at 4.5V gate drive—this is the right number to
use in LTC1702 circuits running from a 5V supply. As
current flows through this resistance while the MOSFET is
on, it generates I2R watts of heat, where I is the current
flowing (usually equal to the output current) and R is the
MOSFET RDS(ON). This heat is only generated when the
MOSFET is on. When it is off, the current is zero and the
power lost is also zero (and the other MOSFET is busy
losing power).
In some circuits, the OV latch can be a liability. Consider
a circuit where the output voltage at one channel may be
changed on the fly by switching in different feedback
resistors. A downward adjustment of greater than 15%
willfirethefaultlatch, disablingbothsidesoftheLTC1702
untilthepowerisrecycled.Incircuitssuchasthis,thefault
latch can be disabled by grounding the FAULT pin. The
internal latch will still be set the first time the output
exceeds +15%, but the 10µA current source pull-up will
notbeabletopullFAULThigh,andtheLTC1702willignore
the latch and continue normal operation. The MAX com-
parator will act as usual, turning on QB until output is
within range and then allowing the loop to resume normal
operation. FAULT can also be pulled down with external
open-collector logic to restart a fault-latched LTC1702 as
analternativetorecyclingthepower. Notethatthiswillnot
reset the internal latch; if the external pull-down is
released, the LTC1702 will reenter FAULT mode. To reset
the latch, pull both RUN/SS pins low simultaneously or
cycle the input power.
This lost power does two things: it subtracts from the
power available at the output, costing efficiency, and it
makes the MOSFET hotter—both bad things. The effect is
worst at maximum load when the current in the MOSFETs
and thus the power lost are at a maximum. Lowering
RDS(ON) improves heavy load efficiency at the expense of
additional gate charge (usually) and more cost (usually).
Proper choice of MOSFET RDS(ON) becomes a trade-off
between tolerable efficiency loss, power dissipation and
cost. Note that while the lost power has a significant effect
on system efficiency, it only adds up to a watt or two in a
typical LTC1702 circuit, allowing the use of small, surface
mount MOSFETs without heat sinks.
EXTERNAL COMPONENT SELECTION
POWER MOSFETs
Gate Charge
Gate charge is amount of charge (essentially, the number
of electrons) that the LTC1702 needs to put into the gate
of an external MOSFET to turn it on. The easiest way to
visualize gate charge is to think of it as a capacitance from
the gate pin of the MOSFET to SW (for QT) or to PGND (for
GettingpeakefficiencyoutoftheLTC1702dependsstrongly
on the external MOSFETs used. The LTC1702 requires at
least two external MOSFETs per side—more if one or
more of the MOSFETs are paralleled to lower on-resis-
tance. To work efficiently, these MOSFETs must exhibit
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QB). This capacitance is composed of MOSFET channel
charge, actual parasitic drain-source capacitance and
Miller-multiplied gate-drain capacitance, but can be ap-
proximated as a single capacitance from gate to source.
Regardless of where the charge is going, the fact remains
that it all has to come out of VCC to turn the MOSFET gate
on, and when the MOSFET is turned back off, that charge
all ends up at ground. In the meanwhile, it travels through
the LTC1702’s gate drivers, heating them up. More power
lost!
times that of the total input capacitance of the topside
MOSFET(s). For very large external MOSFETs (or multiple
MOSFETs in parallel), CCP may need to be increased over
the 1µF value.
INPUT SUPPLY
The BiCMOS process that allows the LTC1702 to include
large MOSFET drivers on-chip also limits the maximum
input voltage to 7V. This limits the practical maximum
input supply to a loosely regulated 5V or 6V rail. The
LTC1702willoperateproperlywithinputsuppliesdownto
about 3V, so a typical 3.3V supply can also be used if the
externalMOSFETsarechosenappropriately(seethePower
MOSFETs section).
Inthiscase,thepowerislostinlittlebite-sizedchunks,one
chunk per switch per cycle, with the size of the chunk set
bythegatechargeoftheMOSFET. EverytimetheMOSFET
switches, another chunk is lost. Clearly, the faster the
clock runs, the more important gate charge becomes as a
lossterm.Old-fashionedswitchersthatranat20kHzcould
pretty much ignore gate charge as a loss term; in the
550kHz LTC1702, gate charge loss can be a significant
efficiency penalty. Gate charge loss can be the dominant
loss term at medium load currents, especially with large
MOSFETs. Gate charge loss is also the primary cause of
power dissipation in the LTC1702 itself.
At the same time, the input supply needs to supply several
amps of current without excessive voltage drop. The input
supply must have regulation adequate to prevent sudden
load changes from causing the LTC1702 input voltage to
dip. In most typical applications where the LTC1702 is
generating a secondary low voltage logic supply, all of
these input conditions are met by the main system logic
supply when fortified with an input bypass capacitor.
TG Charge Pump
Input Bypass
There’sanothernuanceofMOSFETdrivethattheLTC1702
needs to get around. The LTC1702 is designed to use
N-channel MOSFETs for both QT and QB, primarily
becauseN-channelMOSFETsgenerallycostlessandhave
lower RDS(ON) than similar P-channel MOSFETs. Turning
QB on is no big deal since the source of QB is attached to
PGND; the LTC1702 just switches the BG pin between
PGND and VCC. Driving QT is another matter. The source
of QT is connected to SW which rises to VCC when QT is
on. To keep QT on, the LTC1702 must get TG one MOSFET
VGS(ON) above VCC. It does this by utilizing a floating driver
with the negative lead of the driver attached to SW (the
source of QT) and the VCC lead of the driver coming out
separately at BOOST. An external 1µF capacitor CCP con-
nected between SW and BOOST (Figure 2) supplies power
to BOOST when SW is high, and recharges itself through
DCP when SW is low. This simple charge pump keeps the
TG driver alive even as it swings well above VCC. The value
of the bootstrap capacitor CCP needs to be at least 100
A typical LTC1702 circuit running from a 5V logic supply
might provide 1.6V at 10A at one of its outputs. 5V to 1.6V
implies a duty cycle of 32%, which means QT is on 32%
of each switching cycle. During QT’s on-time, the current
drawn from the input equals the load current and during
the rest of the cycle, the current drawn from the input is
near zero. This 0A to 10A, 32% duty cycle pulse train adds
up to 4.7ARMS at the input. At 550kHz, switching cycles
last about 1.8µs—most system logic supplies have no
hope of regulating output current with that kind of speed.
A local input bypass capacitor is required to make up the
difference and prevent the input supply from dropping
drastically when QT kicks on. This capacitor is usually
chosen for RMS ripple current capability and ESR as well
as value.
The input bypass capacitor in an LTC1702 circuit is
common to both channels. Consider our 10A example
casewiththeothersideoftheLTC1702disabled.Theinput
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bypass capacitor gets exercised in three ways: its ESR
must be low enough to keep the initial drop as QT turns on
within reason (100mV or so); its RMS current capability
must be adequate to withstand the 4.6ARMS ripple current
at the input and the capacitance must be large enough to
maintain the input voltage until the input supply can make
up the difference. Generally, a capacitor that meets the
first two parameters will have far more capacitance than is
required to keep capacitance-based droop under control.
Inourexample, weneed0.01ΩESRtokeeptheinputdrop
under 100mV with a 10A current step and 4.6ARMS ripple
current capacity to avoid overheating the capacitor. These
requirements can be met with multiple low ESR tantalum
or electrolytic capacitors in parallel, or with a large mono-
lithic ceramic capacitor.
Calculating RMS Current in CIN
A buck regulator like the LTC1702 draws pulses of
current from the input capacitor during normal opera-
tion. The input capacitor sees this as AC current, and
dissipates power proportional to the RMS value of the
input current waveform. To properly specify the capaci-
tor, we need to know the RMS value of the input current.
Calculating the approximate RMS value of a pulse train
withafixeddutycycleis straightforward,buttheLTC1702
complicatesmattersbyrunningtwosidessimultaneously
and out of phase, creating a complex waveform at the
input.
To calculate the approximate RMS value of the input
current, we first need to calculate the average DC value
with both sides of the LTC1702 operating at maximum
load. Over a single period, the system will spend some
time with one top switch on and the other off, perhaps
some time with both switches on, and perhaps some
time with both switches off. During the time each top
switch is on, the current will equal that side’s full load
output current. When both switches are on, the total
current will be the sum of the two full load currents, and
when both are off, the current is effectively zero. Multiply
each current value by the percentage of the period that
the current condition lasts, and sum the results—this is
the average DC current value.
The two sides of the LTC1702 run off a single master clock
and are wired 180° out of phase with each other to
significantly reduce the total capacitance/ESR needed at
the input. Assuming 100mV of ripple and 10A output
current, we needed an ESR of 0.01Ω and 4.7A ripple
current capability for one side. Now, assume both sides
are running simultaneously with identical loading. If the
two sides switched in phase, all the loading conditions
would double and we’d need enough capacitance for
9.4ARMS and 0.005Ω ESR. With the two sides out of
phase, the input current is 4.8ARMS—barely larger than
32%
10A
As an example, consider a circuit that takes a 5V input
and generates 3.3V at 3A at side 1 and 1.6V at 10A at
side 2. When a cycle starts, TG1 turns on and 3A flows
Q1 CURRENT, SIDE 1 ONLY
(FOR 1-PHASE, 2 SIDES:
MULTIPLY CURRENT BY 2)
68%
68%
0
32%
6.8A
50%
16% 16% 18%
CURRENT IN C , SIDE 1 ONLY
IN
13
10
I
= 4.66A
, (1-PHASE,
RMS
CIN
2 SIDES: I = 9.3A
)
RMS
0
CIN
–3.2A
32% 18% 32% 18%
32% 18% 32% 18%
10A
0
Q11 CURRENT
Q21 CURRENT
BOTH SIDES EQUAL LOAD
2-PHASE OPERATION
5.2
3
I
AVE
3.6A
0
CURRENT IN C
,
IN
0
BOTH SIDES EQUAL LOAD
= 4.8A
0
A
B
TIME
C
D
I
CIN
RMS
1702 F07
–6.4A
1702 SB1
Figure 7. RMS Input Current
Figure SB1. Average Current Calculation
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from CIN (time point A). 50% of the way through, TG2
turns on and the total current is 13A (time point B).
Shortly thereafter, TG1 turns off and the current drops to
10A (time point C). Finally, TG2 turns off and the current
spends a short time at 0 before TG1 turns on again (time
point D).
–2.182 • 0.5 + 7.822 • 0.16 +
(
(
) (
)
IRMS
=
4.822 • 0.16 + –5.182 • 0.18
) (
)
= 4.55ARMS
Ifthecircuitislikelytospendtimewithonesideoperating
and the other side shut down, the RMS current will need
to be calculated for each possible case (side 1 on, side 2
off; side 1 off, side 2 on; both sides on). The capacitor
must be sized to withstand the largest RMS current of the
three—sometimes this occurs with one side shut down!
IAVG = 3A • 0.5 + 13A • 0.16 +
(
) (
)
10A • 0.16 + 0A • 0.18 = 5.18A
(
) (
)
Now we can calculate the RMS current. Using the same
waveform we used to calculate the average DC current,
subtract the average current from each of the DC values.
Square each current term and multiply the squares by the
same period percentages we used to calculate the aver-
age DC current. Sum the results and take the square root.
The result is the approximate RMS current as seen by the
inputcapacitorwithbothsidesoftheLTC1702atfullload.
Actual RMS current will differ due to inductor ripple cur-
rent and resistive losses, but this approximate value is
adequate for input capacitor calculation purposes.
Side1only:
IAVE1 = 3A • 0.67 + 0A • 0.33 = 2.01A
(
) (
)
2
IRMS1
=
1 • 0.67 + –22 • 0.33 = 1.42ARMS
(
) (
)
Side 2 only:
IAVE2 = 10A • 0.32 + 0A • 0.68 = 3.2A
(
) (
)
IRMS2
=
6.82 • 0.32 + –3.22 • 0.68
(
) (
)
50%
16% 16% 18%
7.8
4.8
= 4.66ARMS > 4.55ARMS
Consider the case where both sides are operating at the
same load, with a 50% duty cycle at each side. The RMS
current with both sides running is near zero, while the
RMS current with one side active is 1/2 the total load
current of that side. The 2-phase, 5V to 2.5V circuit in the
applications section takes advantage of this phenom-
enon, allowingittosupply40Aofoutputcurrentwithonly
120µF of input capacitance (and only 40µF of output
capacitance!).
0
–2.2
–5.2
0
A
B
TIME
C
D
1702 SB2
Figure SB2. AC Current Calculation
the single case (Figure 7)! The peak current deltas are still
only10A, requiringthesame0.01ΩESRrating. Aslongas
the capacitor we chose for the single side application can
support the slightly higher 4.8ARMS current, we can add
the second channel without changing the input capacitor
at all. As a general rule, an input bypass capacitor capable
of supporting the larger output current channel can sup-
port both channels running simultaneously (see the
2-Phase Operation section for more details).
Tantalum capacitors are a popular choice as input capaci-
tors for LTC1702 applications, but they deserve a special
caution here. Generic tantalum capacitors have a destruc-
tive failure mechanism when they are subjected to large
RMS currents (like those seen at the input of a LTC1702).
At some random time after they are turned on, they can
blow up for no apparent reason. The capacitor manufac-
turers are aware of this and sell special “surge tested”
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tantalum capacitors specifically designed for use with
switching regulators. When choosing a tantalum input
capacitor, make sure that it is rated to carry the RMS
current that the LTC1702 will draw. If the data sheet
doesn’t give an RMS current rating, chances are the
capacitor isn’t surge tested. Don’t use it!
tON(Q2)
V
1.2µs 1.6V
(
)
(
)(
)
= 0.5µH
OUT
L =
=
IRIPPLE
4A
1.6V
5V
⎛
⎞
⎟
⎠
with tON(Q2) = 1−
/550kHz = 1.2µs
⎜
⎝
The inductor must not saturate at the expected peak
current. In this case, if the current limit was set to 15A, the
inductor should be rated to withstand 15A + 1/2 IRIPPLE
or 17A without saturating.
OUTPUT BYPASS CAPACITOR
,
The output bypass capacitor has quite different require-
ments from the input capacitor. The ripple current at the
output of a buck regulator like the LTC1702 is much lower
than at the input, due to the fact that the inductor current
is constantly flowing at the output whenever the LTC1702
is operating in continuous mode. The primary concern at
the output is capacitor ESR. Fast load current transitions
at the output will appear as voltage across the ESR of the
output bypass capacitor until the feedback loop in the
LTC1702 can change the inductor current to match the
newloadcurrentvalue. ThisESRstepattheoutputisoften
the single largest budget item in the load regulation
calculation. As an example, our hypothetical 1.6V, 10A
switcher with a 0.01Ω ESR output capacitor would expe-
rience a 100mV step at the output with a 0 to 10A load
step—a 6.3% output change!
FEEDBACK LOOP/COMPENSATION1
Feedback Loop Types
In a typical LTC1702 circuit, the feedback loop consists of
the modulator, the external inductor and output capacitor,
and the feedback amplifier and its compensation network.
All of these components affect loop behavior and need to
beaccountedforintheloopcompensation.Themodulator
consistsoftheinternalPWMgenerator,theoutputMOSFET
drivers and the external MOSFETs themselves. From a
feedback loop point of view, it looks like a linear voltage
transferfunctionfromCOMPtoSWandhasagainroughly
equal to the input voltage. It has fairly benign AC behavior
at typical loop compensation frequencies with significant
phase shift appearing at half the switching frequency.
Usually the solution is to parallel several capacitors at the
output. For example, to keep the transient response inside
of 3% with the previous design, we’d need an output ESR
better than 0.0048Ω. This can be met with three 0.014Ω,
470µF low ESR tantalum capacitors in parallel.
Theexternalinductor/outputcapacitorcombinationmakes
a more significant contribution to loop behavior. These
components cause a second order LC roll-off at the
output, with the attendant 180° phase shift. This roll-off is
what filters the PWM waveform, resulting in the desired
DC output voltage, but the phase shift complicates the
loop compensation if the gain is still higher than unity at
the pole frequency. Eventually (usually well above the LC
pole frequency), the reactance of the output capacitor will
approach its ESR, and the roll-off due to the capacitor will
stop, leaving 6dB/octave and 90° of phase shift (Figure 8).
INDUCTOR
The inductor in a typical LTC1702 circuit is chosen prima-
rily for value and saturation current. The inductor value
sets the ripple current, which is commonly chosen at
around 40% of the anticipated full load current. Ripple
current is set by:
So far, the AC response of the loop is pretty well out of the
user’scontrol.Themodulatorisafundamentalpieceofthe
LTC1702 design, and the external L and C are usually
chosen based on the regulation and load current require-
ments without considering the AC loop response. The
tON(Q2)
V
OUT
(
)
IRIPPLE
=
L
In our hypothetical 1.6V, 10A example, we'd set the ripple
current to 40% of 10A or 4A, and the inductor value would
be:
1The information in this section is based on the paper “The K Factor: A New Mathematical Tool for
Stability Analysis and Synthesis” by H. Dean Venable, Venable Industries, Inc. For complete paper,
see “Reference Reading #4” at www.linear-tech.com.
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feedback amplifier, on the other hand, gives us a handle
with which to adjust the AC response. The goal is to have
180° phase shift at DC (so the loop regulates) and some-
thing less than 360° phase shift at the point that the loop
gain falls to 0dB. The simplest strategy is to set up the
feedback amplifier as an inverting integrator, with the 0dB
frequency lower than the LC pole (Figure 9). This “type 1”
configuration is stable but transient response will be less
than exceptional if the LC pole is at a low frequency.
Figure 10 shows an improved “type 2” circuit that uses an
additional pole-zero pair to temporarily remove 90° of
phase shift. This allows the loop to remain stable with 90°
more phase shift in the LC section, provided the loop
reaches 0dB gain near the center of the phase “bump.”
Type 2 loops work well in systems where the ESR zero in
the LC roll-off happens close to the LC pole, limiting the
total phase shift due to the LC. The additional phase
compensation in the feedback amplifier allows the 0dB
point to be at or above the LC pole frequency, improving
loop bandwidth substantially over a simple type 1 loop. It
has limited ability to compensate for LC combinations
where low capacitor ESR keeps the phase shift near 180°
for an extended frequency range. LTC1702 circuits using
conventional switching grade electrolytic output capaci-
tors can often get acceptable phase margin with type 2
compensation.
GAIN
(dB)
PHASE
(DEG)
GAIN
A
V
–12dB/OCT
0
0
–90
PHASE
–180
–6dB/OCT
1702 F08
C2
Figure 8. Transfer Function of Buck Modulator
C1
R2
C1
R1
–
+
IN
R1
OUT
–
+
IN
R
B
OUT
R
B
1702 F10a
V
REF
1702 F09a
V
REF
Figure 9a. Type 1 Amplifier Schematic Diagram
Figure 10a. Type 2 Amplifier Schematic Diagram
GAIN
(dB)
PHASE
(DEG)
GAIN
(dB)
PHASE
(DEG)
–6dB/OCT
GAIN
GAIN
0
0
0
0
–6dB/OCT
–6dB/OCT
–90
–180
–90
–180
PHASE
PHASE
–270
–270
1702 F10b
1702 F09b
Figure 9b. Type 1 Amplifier Transfer Function
Figure 10b. Type 2 Amplifier Transfer Function
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Applicationsthatrequireoptimizedtransientresponsewill
need to recalculate the compensation values specifically
forthecircuitinquestion.Theunderlyingmathematicsare
complex, but the component values can be calculated in a
straightforward manner if we know the gain and phase of
the modulator at the crossover frequency.
“Type 3” loops (Figure 11) use two poles and two zeros to
obtain a 180° phase boost in the middle of the frequency
band. A properly designed type 3 circuit can maintain
acceptable loop stability even when low output capacitor
ESR causes the LC section to approach 180° phase shift
wellabovetheinitialLCroll-off. Aswithatype2circuit, the
loop should cross through 0dB in the middle of the phase
bump to maximize phase margin. Many LTC1702 circuits
using low ESR tantalum or OS-CON output capacitors
need type 3 compensation to obtain acceptable phase
margin with a high bandwidth feedback loop.
Modulator gain and phase can be measured directly from
a breadboard, or can be simulated if the appropriate
parasitic values are known. Measurement will give more
accurateresults,butsimulationcanoftengetcloseenough
to give a working system. To measure the modulator gain
and phase directly, wire up a breadboard with an LTC1702
and the actual MOSFETs, inductor, and input and output
capacitors that the final design will use. This breadboard
should use appropriate construction techniques for high
speed analog circuitry: bypass capacitors located close to
the LTC1702, no long wires connecting components,
appropriately sized ground returns, etc. Wire the feedback
amplifier as a simple type 1 loop, with a 10k resistor from
C2
C3
R3
C1
R2
R1
–
+
IN
OUT
R
B
1702 F11a
V
REF
V
OUT to FB and a 0.1µF feedback capacitor from COMP to
Figure 11a. Type 3 Amplifier Schematic Diagram
FB. Choose the bias resistor (RB) as required to set the
desired output voltage. Disconnect RB from ground and
connect it to a signal generator or to the source output of
a network analyzer (Figure 12) to inject a test signal into
the loop. Measure the gain and phase from the COMP pin
to the output node at the positive terminal of the output
capacitor. Make sure the analyzer’s input is AC coupled so
that the DC voltages present at both the COMP and VOUT
GAIN
(dB)
PHASE
(DEG)
–6dB/OCT
+6dB/OCT
–6dB/OCT
GAIN
0
0
–90
–180
5V
PHASE
+
10Ω MBR0530T
C
IN
–270
+
10µF
V
CC
PV
CC
1702 F11b
BOOST2
1µF
QT
QB
TG
Figure 11B. Type 3 Amplifier Transfer Function
L
EXT
1/2 LTC1702
COMP
V
V
COMP
TO
OUT
TO
SW
0.1µF
ANALYZER
ANALYZER
+
FB
BG
C
OUT
Feedback Component Selection
NC
RUN/SS
FCB
R
10k
B
Selecting the R and C values for a typical type 2 or type 3
loopisanontrivialtask.Theapplicationsshowninthisdata
sheet show typical values, optimized for the power com-
ponentsshown.Theyshouldgiveacceptableperformance
with similar power components, but can be way off if even
one major power component is changed significantly.
FAULT
PGND
AC
SOURCE
FROM
SGND
ANALYZER
1702 F12
Figure 12. Modulator Gain/Phase Measurement Set-Up
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nodes don’t corrupt the measurements or damage the
analyzer.
Finally, choose a convenient resistor value for R1 (10k is
usuallyagoodvalue). Nowcalculatetheremainingvalues:
If breadboard measurement is not practical, a SPICE
simulation can be used to generate approximate gain/
phase curves. Plug the expected capacitor, inductor and
MOSFET values into the following SPICE deck and gener-
ate an AC plot of V(VOUT)/V(COMP) in dB and phase of
V(OUT) in degrees. Refer to your SPICE manual for details
of how to generate this plot.
(K is a constant used in the calculations)
ƒ = chosen crossover frequency
G = 10(GAIN/20) (this converts GAIN in dB to G in absolute
gain)
Type 2 Loop:
*1702 modulator gain/phase
* 1999 Linear Technology
*this file written to run with PSpice 8.0
*may require modifications for other SPICE
simulators
⎛
⎞
©
BOOST
2
1
K = Tan
+ 45°
⎜
⎟
⎝
⎠
C2 =
2πƒGKR1
*MOSFETs
rfet mod sw 0.02
;MOSFET rdson
C1= C2 K2 – 1
(
)
*inductor
K
lext sw out1 1u
rl out1 out 0.005
;inductor value
;inductor series R
R2 =
RB =
2πƒC1
VREF R1
( )
*output cap
cout out out2 1000u
resr out2 0 0.01
;capacitor value
;capacitor ESR
VOUT – VREF
*1702 internals
emod mod 0 comp 0 5
vstim comp 0 0 ac 1
.ac dec 100 1k 1meg
.probe
;3.3 for 3.3V supply
;ac stimulus
Type 3 Loop:
⎛
⎞
.end
BOOST
4
K = Tan2
+ 45°
⎜
⎟
With the gain/phase plot in hand, a loop crossover fre-
quency can be chosen. Usually the curves look something
like Figure 8. Choose the crossover frequency in the rising
or flat parts of the phase curve, beyond the external LC
poles. Frequencies between 10kHz and 50kHz usually
work well. Note the gain (GAIN, in dB) and phase (PHASE,
in degrees) at this point. The desired feedback amplifier
gain will be –GAIN to make the loop gain 0dB at this
frequency. Nowcalculatetheneededphaseboost, assum-
ing 60° as a target phase margin:
⎝
⎠
1
C2 =
2πƒGR1
C1= C2 K – 1
(
)
K
R2 =
R3 =
2πƒC1
R1
K – 1
(
)
BOOST = –(PHASE + 30°)
1
C3 =
RB =
If the required BOOST is less than 60°, a type 2 loop can
be used successfully, saving two external components.
BOOST values greater than 60° usually require type 3
loops for satisfactory performance.
2πƒ K R3
VREF R1
( )
VOUT – VREF
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Accuracy Trade-Offs
CURRENT LIMIT PROGRAMMING
The VDS sensing scheme used in the LTC1702 is not
particularly accurate, primarily due to uncertainty in the
RDS(ON) from MOSFET to MOSFET. A second error term
arises from the ringing present at the SW pin, which
causes the VDS to look larger than (ILOAD)(RDS(ON)) at the
beginning of QB’s on-time. These inaccuracies do not
prevent the LTC1702 current limit circuit from protecting
itself and the load from damaging overcurrent conditions,
but they do prevent the user from setting the current limit
to a tight tolerance if more than one copy of the circuit is
being built. The 50% factor in the current setting equation
above reflects the margin necessary to ensure that the
circuitwillstayoutofcurrentlimitatthemaximumnormal
load, even with a hot MOSFET that is running quite a bit
higher than its RDS(ON) spec.
ProgrammingthecurrentlimitontheLTC1702isstraight-
forward. The IMAX pin sets the current limit by setting the
maximum allowable voltage drop across QB (the bottom
MOSFET) before the current limit circuit engages. The
voltage across QB is set by its on-resistance and the
current flowing in the inductor, which is the same as the
output current. The LTC1702 current limit circuit inverts
the voltage at IMAX before comparing it with the negative
voltage across QB, allowing the current limit to be set with
a positive voltage.
Tosetthecurrentlimit,calculatetheexpectedvoltagedrop
across QB at the maximum desired current:
VPROG = I
R
+ CF
(
)
(
)
ILIM
DS(ON)
ILIM should be chosen to be quite a bit higher than the
expected operating current, to allow for MOSFET RDS(ON)
changes with temperature. Setting ILIM to 150% of the
maximumnormaloperatingcurrentisusuallysafeandwill
adequately protect the power components if they are
chosenproperly. TheCFtermisanapproximatefactorthat
corrects for errors caused by ringing on the switch node
(illustrated in Figure 6). This correction factor will change
depending on the layout and the components used, but
100mV is usually a good starting point. To provide ad-
equate margin and to accommodate for offsets and exter-
nal variations, it is recommended that VPROG be calculated
with CF = 100 ± 50mV.
FCB OPERATION/SECONDARY WINDINGS
The FCB pin can be used in conjunction with a secondary
winding on one side of the LTC1702 to generate a third
regulated voltage output. This output can be directly
regulated at the FCB pin. In theory, a fourth output could
be added, either unregulated or with additional external
circuitry at the FCB pin.
The extra auxiliary output is taken from a second winding
on the core of the inductor on one channel, converting it
intoatransformer(Figure13).Theauxiliaryoutputvoltage
is set by the main output voltage and the turns ratio of the
extra winding to the primary winding. Load regulation at
the auxiliary output will be relatively good as long as the
mainoutputisrunningincontinuousmode. Astheloadon
the main channel drops and the LTC1702 switches to
discontinuous or Burst Mode operation, the auxiliary
output will not be able to maintain regulation, especially if
the load at the auxiliary output remains heavy.
VPROG is then programmed at the IMAX pin using the
internal 10µA pull-up and an external resistor:
RILIM = VPROG/10µA
The resulting value of RILIM should be checked in an actual
circuit to ensure that the ILIM circuit kicks in as expected.
MOSFET RDS(ON) specs are like horsepower ratings in
automobiles, and should be taken with a grain of salt.
Circuits that use very low values for RIMAX (<20k) should
be checked carefully, since small changes in RIMAX can
cause large ILIM changes when the 100mV correction
factor makes up a large percentage of the total VPROG
value. If VPROG is set too low, the LTC1702 may fail to
start up.
To avoid this, the auxiliary output voltage can be divided
downwithaconventionalfeedbackresistorstringwiththe
divided auxiliary output voltage fed back to the FCB pin
(Figure 13). The FCB pin threshold is trimmed to 800mV
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V
IN
The FAULT pin is an additional open-drain output that
indicates if one or both of the outputs has exceeded 15%
of its programmed output voltage. FAULT includes an
internal 10µA pull-up to VCC and does not require an
external pull-up to interface to standard logic. FAULT pulls
low in normal operation, and releases when a overvoltage
fault is detected.
V
OUT(AUX)
+
C
IN
+
+
C
C
QT
TG
LTC1702
BG
OUT(AUX)
V
OUT
QB
FCB
OUT
R
R
FCB1
When an overvoltage fault occurs, an internal latch sets
and FAULT goes high, disabling the LTC1702 until the
latch is cleared by recycling the power or pulling both
RUN/SS pins low simultaneously. Alternately, the FAULT
pin can be pulled back low externally with an open-
collector/open-drain device or an NFET or NPN, which will
allow the LTC1702 to resume normal operation, but will
not reset the latch. If the pull-down is later removed, the
LTC1702 will latch off again unless the latch is reset by
cycling the power or RUN/SS pins.
FCB2
1702 F08
Figure 13. Regulating an Auxiliary Output with the FCB Pin
with 10mV of hysteresis, allowing fairly precise control of
the auxiliary voltage. If the LTC1702 is in discontinuous or
Burst Mode operation and the auxiliary output voltage
drops, the FCB pin will trip and the LTC1702 will resume
continuous operation regardless of the load on the main
output. The FCB pin removes the requirement that power
must be drawn from the inductor primary in order to
extractpowerfromtheauxiliarywindings. Withtheloopin
continuous mode, the auxiliary outputs may be loaded
withoutregardtotheprimaryload.NotethatiftheLTC1702
is already running in continuous mode and the auxiliary
output drops due to excessive loading, no additional
action can be taken by the LTC1702 to regulate the
auxiliary output.
NotethatboththePGOODpinsandtheFAULTpinmonitor
the output voltages by watching the FB pins. During
normaloperation, eachFBpinisheldatavirtualgroundby
the feedback amplifier, and changes at the output will not
appear at FB. This is not an issue with a properly designed
circuit, since the virtual ground at FB implies that the
output voltage is under control. If the feedback amplifier
loses control of the output, the virtual ground disappears
and the PGOOD circuit can see any output changes. This
occurs whenever the soft-start or current limit circuits are
active, whenever the MIN or MAX comparators are active,
or any time the feedback amplifier output (the COMP pin)
hits a rail or is in slew limit. Since the MAX comparator will
engage well before the output reaches the +15% fault
level, the FAULT output is largely unaffected by the virtual
ground at FB.
POWER GOOD/FAULT FLAGS
The PGOOD pins report the status of the output voltage at
their respective outputs. Each is an open-drain output that
pulls low until the FB pin rises to (VREF – 5%), indicating
that the output voltage has risen to within 5% of the
programmed output voltage. Each PGOOD pin can inter-
face directly to standard logic inputs if an appropriate pull-
up resistor is added, or the two pins can be tied together
with a single pull-up to give a “both good” signal. Each
PGOOD pin includes an internal 100µs delay to prevent
glitches at the output from indicating false PGOOD
signals.
OPTIMIZING PERFORMANCE
2-Step Conversion
The LTC1702 is ideally suited for use in 2-step conversion
systems. 2-step systems use a primary regulator to con-
vert the input power source (batteries or AC line voltage)
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to an intermediate supply voltage, often 5V. The LTC1702
then converts the intermediate voltage to the low voltage,
high current supplies required by the system. Compared
to a 1-step converter that converts a high input voltage
directly to a very low output voltage, the 2-step converter
exhibits superior transient response, smaller component
size and equivalent efficiency. Thermal management and
layout complexity are also improved with a 2-step
approach.
Clearly, the 5V and 3.3V sections of the two schemes are
equivalent. The 2-step system draws additional power
from the 5V and 3.3V outputs, but the regulation tech-
niques and trade-offs at these outputs are similar. The
difference lies in the way the 1.8V and 1.5V supplies are
generated. For example, the 2-step system converts 3.3V
to 1.5V with a 45% duty cycle. During the QT on-time, the
voltage across the inductor is 1.8V and during the QB
on-time, the voltage is 1.5V, giving roughly symmetrical
transientresponsetopositiveandnegativeloadsteps.The
1.8V maximum voltage across the inductor allows the use
of a small 0.47µH inductor while keeping ripple current
under 4A (40% of the 10A maximum load). By contrast,
the 1-step converter is converting 15V to 1.5V, requiring
just a 10% duty cycle. Inductor voltages are now 13.5V
when QT is on and 1.5V when QB is on, giving vastly
different di/dt values and correspondingly skewed tran-
sient response with positive and negative current steps.
The narrow 10% duty cycle usually requires a lower
switching frequency, which in turn requires a higher value
inductor and larger output capacitor. Parasitic losses due
to the large voltage swing at the source of QT cost
efficiency, eliminating any advantage the 1-step conver-
sion might have had.
A typical notebook computer supply might use a 4-cell
Li-Ion battery pack as an input supply with a 15V nominal
terminalvoltage.Thelogiccircuitsrequire5V/3Aand3.3V/
5A to power system board logic, and 2.5V/0.5A, 1.8V/2A
and 1.5V/10A to power the CPU. A typical 2-step conver-
sion system would use a step-down switcher (perhaps an
LTC1628 or two LTC1625s) to convert 15V to 5V and
another to convert 15V to 3.3V (Figure 14). One channel of
the LTC1702 would generate the 1.5V supply using the
3.3V supply as the input and the other channel would gen-
erate 1.8V using the 5V supply as the input. The corre-
sponding1-stepsystemwouldusefoursimilarstep-down
switchers, each using 15V as the input supply and gener-
ating one of the four output voltages. Since the 2.5V sup-
ply represents a small fraction of the total output power,
either system can generate it from the 3.3V output using
an LDO linear regulator, without the 75% linear efficiency
making much of an impact on total system efficiency.
Note that power dissipation in the LTC1702 portion of a
2-step circuit is lower than it would be in a typical 1-step
converter, even in cases where the 1-step converter has
higher total efficiency than the 2-step system. In a typical
microprocessor core supply regulator, for example, the
regulator is usually located right next to the CPU. In a
1-step design, all of the power dissipated by the core
regulator is right there next to the hot CPU, aggravating
thermal management. In a 2-step LTC1702 design, a
significant percentage of the power lost in the core regu-
lation system happens in the 5V or 3.3V supply, which is
usually away from the CPU. The power lost to heat in the
LTC1702 section of the system is relatively low, minimiz-
ing the heat near the CPU.
V
BAT
15V
5V/3A
1.8V/2A
1.5V/10A
LTC1628*
LTC1702
LDO
3.3V/5A
2.5V/0.5A
*OR TWO LTC1625s
1702 F14
Figure 14. 2-Step Conversion Block Diagram
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2-Step Efficiency Calculation
Maximizing High Load Current Efficiency
Calculating the efficiency of a 2-step converter system
involves some subtleties. Simply multiplying the effi-
ciency of the primary 5V or 3.3V supply by the efficiency
of the 1.8V or 1.5V supply underestimates the actual
efficiency, since a significant fraction of the total power is
drawn from the 3.3V and 5V rails in a typical system. The
correct way to calculate system efficiency is to calculate
the power lost in each stage of the converter, and divide
the total output power from all outputs by the sum of the
output power plus the power lost:
Efficiency at high load currents (when the LTC1702 is
operating in continuous mode) is primarily controlled by
the resistance of the components in the power path
(QT, QB, LEXT) and power lost in the gate drive circuits due
to MOSFET gate charge. Maximizing efficiency in this
region of operation is as simple as minimizing these
terms.
The behavior of the load over time affects the efficiency
strategy. Parasitic resistances in the MOSFETs and the
inductor set the maximum output current the circuit can
supply without burning up. A typical efficiency curve
(Figure 15) shows that peak efficiency occurs near 30% of
this maximum current. If the load current will vary around
theefficiencypeakandwillspendrelativelylittletimeatthe
maximumload, choosingcomponentssothattheaverage
load is at the efficiency peak is a good idea. This puts the
maximum load well beyond the efficiency peak, but usu-
ally gives the greatest system efficiency over time, which
translates to the longest run time in a battery-powered
system. If the load is expected to be relatively constant at
the maximum level, the components should be chosen so
that this load lands at the peak efficiency point, well below
the maximum possible output of the converter.
Efficiency =
TotalOutputPower
TotalOutputPower+ TotalPowerLost
100%
(
)
In our example 2-step system, the total output power is:
Total output power =
15W + 16.5W + 1.25W + 3.6W + 15W = 51.35W
corresponding to 5V, 3.3V, 2.5V, 1.8V and 1.5V output
voltages.
Assuming the LTC1702 provides 90% efficiency at each
output, the additional load on the 5V and 3.3V supplies is:
1.5V: 15W/90% = 16.6W/3.3V = 5A from 3.3V
1.8V: 3.6W/90% = 4W/5V = 0.8A from 5V
2.5V: 1.25W/75% = 1.66W/3.3V = 0.5A from 3.3V
100
V
IN
= 5V
V
= 3.3V
OUT
If the 5V and 3.3V supplies are each 94% efficient, the
power lost in each supply is:
V
V
= 2.5V
= 1.6V
OUT
OUT
90
80
70
1.5V: 16.6W – 15W = 1.6W
1.8V: 4W – 3.6W = 0.4W
2.5V: 1.66W – 1.25W = 0.4W
3.3V: 17.55W – 16.5W = 1W
5V: 16W – 15W = 1W
0
5
10
15
Total loss = 4.4W
LOAD CURRENT (A)
1702 G01
Total system efficiency =
51.35W/(51.35W + 4.4W) = 92.1%
Figure 15. Typical LTC1702 Efficiency Curves
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Maximizing Low Load Current Efficiency
offset. This accounts for 1% error at the output with a 5V
input supply. The feedback voltage line regulation spec
addsanadditional0.05%/Vtermthataccountsforchange
in reference output with change in input supply voltage.
With a 5V supply, the errors contributed by the LTC1702
itself add up to no more than 1% DC error at the output.
Low load current efficiency depends strongly on proper
operation in discontinuous and Burst Mode operations. In
anideallyoptimizedsystem, discontinuousmodereduces
conduction losses but not switching losses, since each
power MOSFET still switches on and off once per cycle. In
a typical system, there is additional loss in discontinuous
mode due to a small amount of residual current left in the
inductor when QB turns off. This current gets dissipated
across the body diode of either QT or QB. Some LTC1702
systems lose as much to body diode conduction as they
save in MOSFET conduction. The real efficiency benefit of
discontinuousmodehappenswhenBurstModeoperation
is invoked. At typical power levels, when Burst Mode
operation is activated, gate drive is the dominant loss
term. Burst Mode operation turns off all output switching
for several clock cycles in a row, significantly cutting gate
drive losses. As the load current in Burst Mode operation
falls toward zero, the current drawn by the circuit falls to
the LTC1702’s background quiescent level—about 3mA
per channel.
The output voltage setting resistors (R1 and RB in
Figure 3) are the other major contributor to DC error. At a
typical1.xVoutputvoltage, theresistorsareofroughlythe
same value, which tends to halve their error terms, im-
proving accuracy. Still, using 1% resistors for R1 and RB
will add 1% to the total output error budget, equal to that
of all errors due to the LTC1702 combined. Using 0.1%
resistors in just those two positions can nearly halve the
DC output error for very little additional cost.
Load Regulation
Load regulation is affected by feedback voltage, feedback
amplifier gain and external ground drops in the feedback
path. Feedback voltage is covered above and is within 1%
over temperature. A full-range load step might require a
10% duty cycle change to keep the output constant,
requiring the COMP pin to move about 100mV. With
amplifier gain at 85dB, this adds up to only a 10µV shift at
FB, negligible compared to the reference accuracy terms.
To maximize low load efficiency, make sure the LTC1702
is allowed to enter discontinuous and Burst Mode opera-
tion as cleanly as possible. FCB must be above its 0.8V
threshold. Minimize ringing at the SW node so that the
discontinuous comparator leaves as little residual current
in the inductor as possible when QB turns off. It helps to
connect the SW pin of the LTC1702 as close to the drain
of QB as possible. An RC snubber network can also be
added from SW to PGND.
External ground drops aren’t so negligible. The LTC1702
can sense the positive end of the output voltage by
attaching the feedback resistor directly at the load, but it
cannot do the same with the ground lead. Just 0.001Ω of
resistanceinthegroundleadat10Aloadwillcausea10mV
error in the output voltage—as much as all the other DC
errors put together. Proper layout becomes essential to
achieving optimum load regulation from the LTC1702.
See the Layout/Troubleshooting section for more infor-
mation. A properly laid out LTC1702 circuit should move
less than a millivolt at the output from zero to full load.
REGULATION OVER COMPONENT TOLERANCE/
TEMPERATURE
DC Regulation Accuracy
The LTC1702 initial DC output accuracy depends mainly
on internal reference accuracy, op amp offset and external
resistor accuracy. Two LTC1702 specs come into play:
feedbackvoltageandfeedbackvoltagelineregulation. The
feedback voltage spec is 800mV ± 8mV over the full
temperature range, and is specified at the FB pin, which
encompasses both reference accuracy and any op amp
TRANSIENT RESPONSE
Transient response is the other half of the regulation
equation. The LTC1702 can keep the DC output voltage
constant to within 1% when averaged over hundreds of
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cycles. Over just a few cycles, however, the external
components conspire to limit the speed that the output
can move. Consider our typical 5V to 1.6V circuit, sub-
jected to a 1A to 5A load transient. Initially, the loop is in
regulation and the DC current in the output capacitor is
zero. Suddenly, an extra 4A start flowing out of the output
capacitor while the inductor is still supplying only 1A. This
sudden change will generate a (4A)(CESR)voltage step at
the output; with a typical 0.015Ω output capacitor ESR,
thisisa60mVstepattheoutput,or3.8%(fora1.6Voutput
voltage).
Note that the output voltage will stop dropping before the
inductor current reaches this new output current level.
Recall that any practical output capacitor looks like a pure
capacitance in series with some amount of ESR. When a
load transient hits, virtually all of the initial voltage drop at
the output is due to IR drop across the ESR. The output
capacitance begins to discharge at the same time and
continuesuntiltheinductorcurrentrisestomatchthenew
output current level.
The output voltage, however, will turn around and start
heading the right way before this happens. The next time
the top MOSFET turns on, the inductor current will begin
increasing linearly. This increasing current flows almost
entirely into the capacitor, going through the ESR as it
does so (Figure 16). Positive di/dt in the inductor causes
positive dv/dt in the ESR, regardless of what the “pure”
capacitance is doing. The output voltage will turn around
when the positive dv/dt across the ESR exceeds the
negativedv/dtacrossthepurecapacitance.Iftheexpected
load step (∆I) is known, an optimum inductor value can be
chosen:
Very quickly, the feedback loop will realize that something
has changed and will move at the bandwidth allowed by
the external compensation network towards a new duty
cycle. If the bandwidth is set to 50kHz, the COMP pin will
get to 60% of the way to 90% duty cycle in 3µs. Now the
inductor is seeing 3.5V across itself for a large portion of
the cycle, and its current will increase from 1A at a rate set
by di/dt = V/L. If the inductor value is 0.5µH, the di/dt will
be 3.5V/0.5µH or 7A/µs. Sometime in the next few micro-
secondsaftertheswitchcyclebegins,theinductorcurrent
will have risen to the 5A level of the load current and the
output capacitor will stop losing charge.
ESR
∆I
L ≤ V – VOUT •C •
IN
I
L
I
OUT
I
L
I
OUT
V
ESR
V
ESR
V
CAP
V
V
CAP
I
L
OUT
V
V
OUT
V
OUT
SW
L
V
OUT(NOMINAL)
+
V
ESR
–
C
I
OUT
OUT
+
V
CAP
1702 F16b
–
TRANSIENT
HITS
I
L
> I
OUT
TIME
1702 F16a
V
OUT
TURNS
AROUND
Figure 16a. Capacitor Parasitics
Affecting Transient Recovery
Figure 16b. Transient Recovery Curves
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MakingLsmallerthanthisoptimumvalueyieldslittleorno
improvement in transient response. As the output voltage
recovers, the inductor current will briefly rise above the
leveloftheoutputcurrenttoreplenishthechargelostfrom
the output capacitor. With a properly compensated loop,
the entire recovery time will be inside of 10µs.
Optimizing Loop Compensation
Loop compensation has a fundamental impact on tran-
sient recovery time, the time it takes the LTC1702 to
recoveraftertheoutputvoltagehasdroppedduetooutput
capacitor ESR. Optimizing loop compensation entails
maintaining the highest possible loop bandwidth while
ensuring loop stability. The Feedback Component Selec-
tionsectiondescribesindetailhowtodesignanoptimized
feedback loop, appropriate for most LTC1702 systems.
Most loads care only about the maximum deviation from
ideal, which occurs somewhere in the first two cycles after
the load step hits. During this time, the output capacitor
does all the work until the inductor and control loop regain
control. The initial drop (or rise if the load steps down) is
entirelycontrolledbytheESRofthecapacitorandamounts
to most of the total voltage drop. To minimize this drop,
reduce the ESR as much as possible by choosing low ESR
capacitors and/or paralleling multiple capacitors at the
output. The capacitance value accounts for the rest of the
voltage drop until the inductor current rises. With most
output capacitors, several devices paralleled to get the
ESR down will have so much capacitance that this drop
term is negligible. Ceramic capacitors are an exception; a
small ceramic capacitor can have suitably low ESR with
relatively small values of capacitance, making this second
drop term significant.
Voltage Positioning
If the load transients consist primarily of load steps from
near zero load to full load and back, the transient response
can be traded off against DC regulation performance by
using a technique known as “voltage positioning.” The
goal is to intentionally compromise the DC regulation loop
such that the output rides near the maximum allowable
value (often +5%) with no load and near the minimum
allowable value at maximum load. With the load at zero,
any transient that comes along will be a current increase
whichwillcausetheoutputvoltagetofall. Sincetheoutput
voltage is initially at a high value, it can fall further before
V
IN
MAXIMUM
+5%
NOM
–5%
ALLOWABLE
V
OUT
TRANSIENT
LTC1702
FB
V
OUT
MAX
0
LOAD
CURRENT
1702 F17a
1702 F17b
Figure 17a. Standard Regulator
Figure 17b. Standard Regulator—Transient Response
V
IN
+5%
NOM
–5%
MAXIMUM
ALLOWABLE
TRANSIENT
V
OUT
≈2× FIGURE 17b
LTC1702
FB
V
OUT
MAX
0
LOAD
CURRENT
1702 F17c
1702 F17d
Figure 17c. Voltage Positioning Regulator
Figure 17d. Positioning Regulator—Transient Response
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itgoesoutofspec.Similarly,atfullload,theoutputcurrent
can only decrease, causing a positive shift in the output
voltage; the initial low value allows it to rise further before
the spec is exceeded. The primary benefit of voltage
positioning is it increases the allowable ESR of the output
capacitors, saving cost. An additional bonus is that at
maximum load, the output voltage is near the minimum
allowable, decreasing the power dissipated in the load.
oscilloscopeturnedontolimithighfrequencynoise. Note
thatmicroprocessormanufacturerstypicallyspecifyripple
≤20MHz, as energy above 20MHz is generally radiated
and not conducted and will not affect the load even if it
appears at the output capacitor.
Now that we know how to measure the signal, we need to
have something to measure. The ideal situation is to use
the actual load for the test, and switch it on and off while
watching the output. If this isn’t convenient, a current step
generator is needed. This generator needs to be able to
turn on and off in nanoseconds to simulate a typical
switching logic load, so stray inductance and long clip
leads between the LTC1702 and the transient generator
must be minimized.
Implementing voltage positioning is as simple as creating
an intentional resistance in the output path to generate the
required voltage drop. This resistance can be a low value
resistor, a length of PCB trace, or even the parasitic
resistance of the inductor if an appropriate filter is used. If
theLTC1702sensestheoutputvoltageupstreamfromthe
resistance (Figure 17), the output voltage will move with
load as I • R, where I is the load current and R is the value
of the resistance. If the feedback network is then reset to
regulateneartheupperedgeofthespecifiedtolerance, the
outputvoltagewillridehighwhenILOAD islowandwillride
low when ILOAD is high. Compared to a traditional regula-
tor, a voltage positioning regulator can theoretically stand
asmuchastwicetheESRdropacrosstheoutputcapacitor
while maintaining output voltage regulation. This means
smaller, cheaper output capacitors can be used while
keeping the output voltage within acceptable limits.
Figure 18 shows an example of a simple transient genera-
tor. Be sure to use a noninductive resistor as the load
element—many power resistors use an inductive spiral
pattern and are not suitable for use here. A simple solution
is to take ten 1/4W film resistors and wire them in parallel
togetthedesiredvalue.Thisgivesanoninductiveresistive
load which can dissipate 2.5W continuously or 50W if
pulsed with a 5% duty cycle, enough for most LTC1702
circuits. SoldertheMOSFETandtheresistor(s)ascloseto
the output of the LTC1702 circuit as possible and set up
thesignalgeneratortopulseata100Hzratewitha5%duty
cycle. This pulses the LTC1702 with 500µs transients
10ms apart, adequate for viewing the entire transient
recovery time for both positive and negative transitions
while keeping the load resistor cool.
Measurement Techniques
Measuring transient response presents a challenge in
two respects: obtaining an accurate measurement and
generating a suitable transient to use to test the circuit.
Output measurements should be taken with a scope
probedirectly across the output capacitor. Proper high
frequencyprobingtechniquesshouldbeused. Inparticu-
lar, don’t use the 6" ground lead that comes with the
probe! Use an adapter that fits on the tip of the probe and
has a short ground clip to ensure that inductance in the
ground path doesn’t cause a bigger spike than the tran-
sient signal being measured. Conveniently, the typical
probe tip ground clip is spaced just right to span the leads
of a typical output capacitor. In general, it is best to take
this measurement with the 20MHz bandwidth limit on the
LTC1702
V
OUT
R
LOAD
LOCATE CLOSE
TO THE OUTPUT
IRFZ44 OR
EQUIVALENT
PULSE
GENERATOR
50Ω
1702 F18
0V TO 10V
100Hz, 5%
DUTY CYCLE
Figure 18. Transient Load Generator
1702fa
31
LTC1702
U
W U U
APPLICATIONS INFORMATION
FAULT BEHAVIOR
never programmed to step down by more than 15% in any
single step. The safest strategy is to step the output down
by 10% or less at a time and wait for the output to settle
to the new value before taking subsequent steps.
Changing the Output Voltage on the Fly
Someapplicationsuseaswitchingschemeattachedtothe
feedback resistors to allow the system to adjust the
LTC1702 output voltage. The voltage can be changed on
the fly if desired, but care must be taken to avoid tripping
theovervoltagefaultcircuit. Steppingthevoltageupwards
abruptly is safe, but stepping down quickly by more than
15% can leave the system in a state where the output
voltageisstillattheoldhigherlevel, butthefeedbacknode
is set to expect a new, substantially lower voltage. If this
condition persists for more than 10µs, the overvoltage
fault circuitry will fire and latch off the LTC1702.
VID Applications
Certain microprocessors specify a set of codes that corre-
spond to power supply voltages required from the regula-
torsystem. Ifthesecodesarechangedonthefly, thesame
caveats as above apply. In addition, the switching matrix
that programs the output voltage may vary its resistance
significantly over the entire span of output voltages,
potentiallychangingtheloopcompensationifthecircuitis
not designed properly. With a typical type 3 feedback loop
(Figure 8), make sure that the RBIAS resistor is modified to
set the output voltage. The R1 resistor must stay constant
to ensure that the loop compensation is not affected.
The simplest solution is to disable the fault circuit by
grounding the FAULT pin. Systems that must keep the
fault circuit active should ensure that the output voltage is
U
TYPICAL APPLICATIONS
3.3V , 2.5V/1.8V Output Power Supply
IN
V
IN
3.3V
D1, D2: MOTOROLA MBR0520LT1
D3: MOTOROLA MBRS320T3
+
C1
470µF
×2
± 5%
R1
10Ω
D2
C4
D1
C1: KEMET T510X477M006AS
10µF
C12, C20: PANASONIC EEFUE0G181R
L1: SUMIDA CEP1254712-T007
L2: SUMIDA CDRH744734-JPS023
Q1A, Q1B, Q2A, Q2B: SILICONIX Si9804
Q3, Q4: 1/2 SILICONIX Si4966
C2
1µF
C5
R8
36k
1µF
C6
1µF
C8
1µF
PV
CC
I
MAX2
BOOST1 BOOST2
C3
1µF
BG1
TG1
SW1
BG2
TG2
Q2A
Q1A
L1
L2
Q2B
Q1B
Q3
0.68µH
1µH
V
V
2.5V
5A
OUT2
OUT1
1.8V
SW2
LTC1702
R2 39k
12A
D3
Q4
+
I
PGND
+
C12
MAX1
R10
2.4k
C20
180µF
R3
4.3k
180µF
PGOOD1 PGOOD2
FCB FAULT
RUN/SS RUN/SS2
×3
C21
1µF
R12
R4
C11
820pF
C19
1000pF
C15
10k
10.7k
1%
C16 1µF
C7 1µF
1µF
1%
GND
GND
V
IN
10k
V
R13
4.99k
1%
IN
R5
COMP2
FB2
COMP1
SGND
FB1
8.06k
10k
1%
PGOOD2
FAULT
PGOOD1
V
CC
R9 27k
R7 68k
C17
100pF
C18
1000pF
C9
20pF
C10
100pF
1702 TA02
1702fa
32
LTC1702
U
TYPICAL APPLICATIONS
1702fa
33
LTC1702
U
TYPICAL APPLICATIONS
1702fa
34
LTC1702
U
PACKAGE DESCRIPTION
GN Package
24-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.337 – .344*
(8.560 – 8.738)
.033
(0.838)
REF
24 23 22 21 20 19 18 17 16 15 14 13
.045 ±.005
.229 – .244
.150 – .157**
(5.817 – 6.198)
(3.810 – 3.988)
.254 MIN
.150 – .165
1
2
3
4
5
6
7
8
9 10 11 12
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.015 ± .004
(0.38 ± 0.10)
.0532 – .0688
(1.35 – 1.75)
× 45°
.004 – .0098
(0.102 – 0.249)
.0075 – .0098
(0.19 – 0.25)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
.008 – .012
.0250
(0.635)
BSC
GN24 (SSOP) 0204
(0.203 – 0.305)
TYP
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1702fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
35
LTC1702
TYPICAL APPLICATION
U
Low Cost Dual Supply with 2.5V Keepalive
V
IN
IN OUT
LT1761
5V
+
±10%
1µF
10Ω
C
IN
16.2k
0.1%
GND ADJ
MBR0530T
+
4.75k
0.1%
10µF
10k
V
CC
PV
CC
0.1%
16.9k
0.1%
FB2
BOOST2
TG2
330pF
56pF
68k
L2
1µF
QT2
V
OUT2
COMP2
2.5V/7A
SW2
2.45V/100mA
STANDBY
+
RUN/SS2
RUN/SS1
QB2
BG2
1k
1k
C
47k
OUT2
QSS1
I
MAX2
0.1µF
QSS2
STBY/ON
FAULT
MBR0530T
1µF
LTC1702
BOOST1
QT1B
QB1B
FB1
220pF
L1
TG1
SW1
BG1
QT1A
QB1A
20k
1%
39pF
56k
V
OUT1
COMP1
FCB
1.8V
20A
+
C
OUT1
16k
1%
33k
I
MAX1
PGND
SGND
1702 TA04
QSS1, QSS2: MOTOROLA MMBT3904LT1
QT1A, QT1B, QB1A, QB1B: FAIRCHILD FDS6670A
QT2, QB2: 1/2 SILICONIX Si4966
C
C
C
= SANYO 10MV1200GX (6 IN PARALLEL)
IN
= SANYO 6MV1500GX (8 IN PARALLEL)
= SANYO 6MV1500GX (3 IN PARALLEL)
OUT1
OUT2
L1: 1µH SUMIDA CEP125-1R0MC-H
L2: 2.2µH COILTRONICS UP2B-2R2
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
LTC1530
LTC1625
High Power Synchronous Step-Down Controller
No R
TM Current Mode Synchronous Step-Down Controller
SO-8 with Current Limit. No R
Required
SENSE
Above 95% Efficiency, Needs No R
Fits SO-8 Footprint
, 16-Lead SSOP Package
SENSE
SENSE
LTC1628
LTC1703
Dual High Efficiency 2-Phase Synchronous Step-Down Controller Constant Frequency, Standby 5V and 3.3V LDOs, 3.5V ≤ V ≤ 36V
IN
Dual 550kHz Synchronous 2-Phase Switching Regulator Controller LTC1702 with 5-Bit Mobile VID for Mobile Pentium® Processor
with Mobile VID
Systems
LTC1706-81
VID Voltage Programmer
Adds 5-Bit Mobile VID to 0.8V Referenced Switching
Regulators
LTC1709
LTC1736
LTC1753
2-Phase, 5-Bit Desktop VID Synchronous Step-Down Controller
Current Mode, V to 36V, I
Up to 42A
OUT
IN
Synchronous Step-Down Controller with 5-Bit Mobile VID Control Fault Protection, PowerGood, 3.5V to 36V Input, Current Mode
5-Bit Desktop VID Programmable Synchronous
Switching Regulator
1.3V to 3.5V Programmable Output Using Internal 5-Bit DAC
LTC1873
LTC1929
Dual Synchronous Switching Regulator with 5-Bit Desktop VID
2-Phase, Synchronous High Efficiency Converter
1.3V to 3.5V Programmable Core Output Plus I/O Output
Current Mode Ensures Accurate Current Sensing,
V
IN
Up to 36V, I
Up to 40A
OUT
No R
is a trademark of Linear Technology Corporation. Pentium is a registered trademark of Intel Corporation.
SENSE
1702fa
LT 0306 REV A • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
36
© LINEAR TECHNOLOGY CORPORATION 1999
●
●
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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