LTC1879EGN#PBF [Linear]

LTC1879 - 1.2A Synchronous Step-Down Regulator with 15µA Quiescent Current; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C;
LTC1879EGN#PBF
型号: LTC1879EGN#PBF
厂家: Linear    Linear
描述:

LTC1879 - 1.2A Synchronous Step-Down Regulator with 15µA Quiescent Current; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C

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LTC1879  
1.2A Synchronous  
Step-Down Regulator with  
15µA Quiescent Current  
U
FEATURES  
DESCRIPTIO  
High Efficiency: Up to 95%  
The LTC®1879 is a high efficiency monolithic synchro-  
nous buck regulator using a constant frequency, current  
mode architecture. Operating supply current is only 15µA  
with no load and drops to <1µA in shutdown. The input  
supply voltage range of 2.65V to 10V makes the LTC1879  
ideally suited for both single and dual Li-Ion battery-pow-  
ered applications. 100% duty cycle provides low dropout  
operation, extending battery life in portable systems.  
Low Quiescent Current: Only 15µA with No Load  
550kHz Constant Frequency Operation  
2.65V to 10V Input Voltage Range  
VOUT from 0.8V to VIN, IOUT to 1.2A  
True PLL Frequency Locking from 350kHz to 750kHz  
Power Good Output Voltage Monitor  
Low Dropout Operation: 100% Duty Cycle  
Burst Mode® or Pulse Skipping Operation  
The switching frequency is internally set to 550kHz, allow-  
ing the use of small surface mount inductors and capaci-  
tors. For noise sensitive applications, the LTC1879 can be  
externally synchronized from 350kHz to 750kHz. Burst  
Mode operation is inhibited during synchronization or  
when the SYNC/MODE pin is pulled low.  
Current Mode Operation for Excellent Line and Load  
Transient Response  
Shutdown Mode Draws <1µA Supply Current  
±2% Output Voltage Accuracy  
Overcurrent and Overtemperature Protected  
Available in 16-Lead SSOP Package  
The internal synchronous rectifier switch increases effi-  
ciency and eliminates the need for an external Schottky  
diode. Low output voltages are easily supported with a  
0.8Vfeedbackreferencevoltage. TheLTC1879isavailable  
in a 16-lead SSOP package.  
U
APPLICATIO S  
Cellular Telephones  
Portable Computers  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Wireless Modems  
Burst Mode is a registered trademark of Linear Technology Corporation.  
U
TYPICAL APPLICATIO  
High Efficiency Step-Down Converter  
Efficiency vs Output Load Current  
V
IN  
2.65V TO 10V  
100  
13  
V
IN  
= 3.6V  
C
IN  
10µF  
90  
80  
70  
60  
50  
40  
30  
SV  
IN  
2
15  
14  
4
8, 9  
5, 12  
6, 11  
7, 10  
3
RUN/SS  
PV  
IN  
V
= 7.2V  
IN  
L1  
SYNC/MODE  
LTC1879  
PGOOD  
SWP  
SWN  
6.2µH  
V
*
OUT  
V
IN  
= 10V  
3.1V  
C
OUT  
47µF  
150k  
I
TH  
PGND  
Burst Mode OPERATION  
= 3.1V  
47pF  
220pF  
V
V
OUT  
L = 6.2µH  
FB  
80.6k  
SGND  
1
28.0k  
0.1  
1
10 100  
OUPUT CURRENT (mA)  
1000  
1879 TA01a  
1879 TA01b  
C
C
: TAIYO YUDEN CERAMIC LMK325BJ106MN  
IN  
: TDK CERAMIC C4532X5ROJ476M  
OUT  
L1: TOKO A921CY6R2M  
*V  
CONNECTED TO V (MINUS SWITCH AND L1 VOLTAGE DROP) FOR 2.65V < V < 3.1V  
OUT  
I
N
I
N
1879f  
1
LTC1879  
W W  
U W  
U
W U  
ABSOLUTE MAXIMUM RATINGS  
PACKAGE/ORDER INFORMATION  
(Note 1)  
ORDER PART  
Input Supply Voltage ................................ 0.3V to 11V  
ITH, PLL_LPF Voltages............................. 0.3V to 2.7V  
RUN/SS, VFB Voltages ............................... 0.3V to VIN  
SYNC/MODE Voltage ................................. 0.3V to VIN  
(VPVIN – VSWP) Voltage............................. 0.3V to 11V  
VSWN Voltage ............................................ 0.3V to 11V  
P-Channel Switch Source Current (DC) .................... 2A  
N-Channel Switch Sink Current (DC) ........................ 2A  
Peak Switching Sink and Source Current ................. 3A  
Operating Ambient Temperature Range  
(Note 2) ............................................. 40°C to 85°C  
Junction Temperature (Notes 3, 6) ...................... 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
TOP VIEW  
NUMBER  
SGND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
PLL_LPF  
SYNC/MODE  
PGOOD  
RUN/SS  
LTC1879EGN  
V
FB  
I
SV  
IN  
TH  
SWP1  
SWN1  
SWP2  
SWN2  
PGND2  
GN PART  
MARKING  
PGND1  
PV  
IN1  
PV  
IN2  
1879  
GN PACKAGE  
16-LEAD PLASTIC SSOP  
TJMAX = 125°C, θJA = 140°C/ W, θJC = 40°C/ W  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C.  
VIN = 5V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
Feedback Current  
Regulated Output Voltage  
(Note 4)  
8
60  
nA  
VFB  
V
(Note 4) 0°C T 85°C  
(Note 4) 40°C T 85°C  
0.784  
0.740  
0.80  
0.80  
0.816  
0.840  
V
V
FB  
A
A
V  
V  
Overvoltage Trip Limit with Respect to V  
V  
V  
= V  
– V  
20  
20  
60  
60  
110  
110  
0.25  
mV  
mV  
OVL  
FB  
OVL  
UVL  
OVL  
FB  
Undervoltage Trip Limit with Respect to V  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
= V – V  
FB UVL  
UVL  
FB  
V /V  
V
IN  
= 2.65V to 10V (Note 4)  
0.05  
%/V  
FB FB  
V
Measured in Servo Loop, V  
Measured in Servo Loop, V  
= 0.9V to 1.2V  
= 1.6V to 1.2V  
0.1  
0.1  
0.6  
0.6  
%
%
LOADREG  
ITH  
ITH  
V
Input Voltage Range  
2.65  
10  
V
IN  
I
Input DC Bias Current  
Pulse Skipping Mode  
Burst Mode Operation  
Shutdown  
(Note 5)  
Q
2.65V < V < 10V, V  
= 0V, I = 0A  
OUT  
270  
15  
0
365  
22  
1
µA  
µA  
µA  
IN  
SYNC/MODE  
= 0A  
V
V
= V , I  
SYNC/MODE  
IN OUT  
= 0V, V = 10V  
RUN  
IN  
f
f
SYNC Capture Range  
Oscillator Frequency  
350  
495  
750  
605  
kHz  
SYNC  
OSC  
V
FB  
V
FB  
0.7V  
= 0V  
550  
80  
kHz  
kHz  
I
Phase Detector Output Current  
Sinking Capability  
Sourcing Capability  
PLLLPF  
f
f
< f  
OSC  
> f  
SOC  
3
–3  
10  
10  
20  
20  
µA  
µA  
PLLIN  
PPLIN  
R
R
R
R
of P-Channel FET  
of N-Channel FET  
I
I
= 100mA, V = 5V  
0.35  
0.37  
2.2  
0.45  
0.5  
A
PFET  
DS(ON)  
DS(ON)  
SW  
SW  
IN  
= 100mA, V = 5V  
NFET  
IN  
I
I
Peak Inductor Current  
SW Leakage  
V
V
= 0.7V, Duty Cycle < 35%, V = 5V  
1.8  
0.2  
2.7  
PK  
LSW  
FB  
IN  
= 0V, V = 0V or 10V, V = 10V  
±0.01  
1.0  
±2.5  
1.5  
µA  
V
RUN  
SW  
IN  
V
SYNC/MODE Threshold  
SYNC/MODE Leakage Current  
SYNC/MODE  
SYNC/MODE  
I
±0.01  
±1  
µA  
1879f  
2
LTC1879  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C.  
VIN = 5V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
0.7  
MAX  
1.5  
UNITS  
V
V
RUN Threshold  
RUN Input Current  
V
V
Ramping Up  
= 0V  
0.2  
RUN  
RUN  
RUN  
RUN  
I
±0.01  
±1  
µA  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 4: The LTC1879 is tested in a feedback loop which servos V to the  
FB  
balance point for the error amplifier (V = 1.2V)  
ITH  
Note 2: The LTC1879E is guaranteed to meet specified performance from  
0°C to 70°C. Specifications over the 40°C to 85°C operating ambient  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 5: Dynamic supply current is higher due to the gate charge being  
delivered at the switching frequency.  
Note 6: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 3: T is calculated from the ambient temperature T and power  
J
A
dissipation P according to the following formula:  
D
LTC1879: T = T + (P × 140°C/W)  
J
A
D
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Oscillator Frequency  
vs Supply Voltage  
Oscillator Frequency  
RDS(ON) vs Temperature  
vs Temperature  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
595  
575  
555  
535  
515  
495  
600  
590  
580  
570  
560  
550  
540  
530  
520  
510  
500  
V
= 5V  
SYNCHRONOUS SWITCH  
MAIN SWITCH  
IN  
V
= 5V  
IN  
V
= 10V  
IN  
V
= 5V  
IN  
V
= 10V  
25  
IN  
–50 –25  
0
50  
75 100 125  
–50 –25  
0
25  
50  
75 100 125  
2
4
6
8
10  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
1879 G01  
1879 G02  
1879 G03  
DC Supply Current  
vs Temperature  
DC Supply Current  
vs Input Voltage  
RDS(ON) vs Input Voltage  
300  
250  
200  
150  
100  
50  
300  
250  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
V
= 5V  
IN  
PULSE SKIPPING MODE  
SYNCHRONOUS  
SWITCH  
PULSE SKIPPING MODE  
200  
150  
MAIN  
SWITCH  
100  
50  
0
Burst Mode OPERATION  
Burst Mode OPERATON  
0
–50  
0
50  
100 125  
0
2
4
6
8
10  
7
8
2
3
4
5
6
9
10  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
1879 G04  
1879 G05  
1879 G06  
1879f  
3
LTC1879  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
Switch Leakage vs Temperature  
Switch Leakage vs Input Voltage  
Output Voltage vs Load Current  
2.51  
2.50  
2.49  
2.48  
2.47  
2.46  
2.45  
2.44  
2.43  
2.42  
2.41  
20  
18  
16  
14  
12  
10  
8
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
V
IN  
= 10V  
RUN = 0V  
T
= 25°C  
A
MAIN SWITCH  
MAIN SWITCH  
6
SYNCHRONOUS  
SWITCH  
4
PULSE SKIPPING MODE  
V
= 5V  
IN  
L = 6.2µH  
2
SYNCHRONOUS SWITCH  
0
0
50  
75 100 125  
0
200 400 600  
800  
1000 1600  
1200 1400  
–50  
0
25  
–25  
0
2
4
6
8
10  
LOAD CURRENT (mA)  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
1879 G09  
1879 G07  
1879 G08  
Reference Voltage  
vs Temperature  
Efficiency vs Output Current  
Efficiency vs Output Current  
804  
803  
802  
801  
800  
799  
798  
797  
796  
795  
794  
100  
90  
80  
70  
60  
50  
40  
30  
100  
90  
80  
70  
60  
50  
40  
30  
V
= 6V  
IN  
V
= 3.6V  
IN  
V
= 3.6V  
IN  
V
= 5V  
IN  
V
= 5V  
IN  
V
= 7.2V  
V
= 7.2V  
IN  
IN  
V
= 10V  
IN  
V
= 10V  
IN  
V
= 1.8V  
V
= 2.5V  
OUT  
L = 6.2µH  
Burst Mode OPERATION  
OUT  
L = 6.2µH  
Burst Mode OPERATION  
–50 –25  
0
25  
50  
75 100 125  
0.1  
1
10 100 1000  
0.1  
1
10  
100  
1000  
TEMPERATURE (°C)  
OUTPUT CURRENT (mA)  
OUTPUT CURRENT (mA)  
1879 G11  
1879 G12  
1879 G10  
Efficiency vs Output Current  
Efficiency vs Input Voltage  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
V
= 4.2V  
IN  
V
= 7.2V  
IN  
100mA  
10mA  
90  
80  
1mA  
V
= 4.2V  
IN  
70  
60  
50  
40  
30  
V
= 7.2V  
IN  
0.1mA  
V
= 3.1V  
OUT  
V
OUT  
= 2.5V  
L = 6.2µH  
L = 6.2µH  
Burst Mode OPERATION  
Burst Mode OPERATION  
PULSE SKIPPING MODE  
0.1  
1
10  
100  
1000  
4
6
10  
2
8
OUTPUT CURRENT (mA)  
INPUT VOLTAGE (V)  
1879 G13  
1879 G14  
1879f  
4
LTC1879  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Load Step  
(Pulse Skipping Mode)  
Load Step (Burst Mode Operation)  
Soft-Start with Shorted Output  
IL  
IL  
1A/DIV  
1A/DIV  
IVIN  
500mA/DIV  
RUN/SS  
1V/DIV  
VOUT  
100mV/DIV  
VOUT  
100mV/DIV  
50µs/DIV  
CIN = 20µF  
COUT = 47µF  
LOAD = 50mA to 1200mA  
1879 G15  
50µs/DIV  
CIN = 20µF  
COUT = 47µF  
1879 G16  
5ms/DIV  
CIN = 20µF  
COUT = 47µF  
LOAD = 0A  
1879 G19  
VIN = 5V  
VOUT = 2.5V  
L = 4.7µH  
VIN = 5V  
VOUT = 2.5V  
L = 4.7µH  
VIN = 5V  
VOUT = 0V  
L = 4.7µH  
I
I
LOAD = 50mA to 1200mA  
I
Burst Mode Operation  
Pulse Skipping Mode Operation  
IL  
IL  
200mA/DIV  
200mA/DIV  
VOUT  
50mV/DIV  
VOUT  
20mV/DIV  
SW  
5V/DIV  
SW  
5V/DIV  
25µs/DIV  
1879 G18  
2.5µs/DIV  
1879 G17  
VIN = 5V  
VOUT = 2.5V  
L = 4.7µH  
CIN = 20µF  
VIN = 5V  
OUT = 2.5V  
L = 4.7µH  
CIN = 20µF  
COUT = 47µF  
V
COUT = 47µF  
I
LOAD = 15mA  
ILOAD = 15mA  
1879f  
5
LTC1879  
U
U
U
PI FU CTIO S  
PVIN1, PVIN2 (Pins 8, 9): Power Supply Pins for the  
Internal Drivers and Switches. These pins should always  
be tied together.  
SGND (Pin 1): Signal Ground Pin.  
RUN/SS (Pin 2): Combination of Soft-Start and Run  
ControlInputs.Forcingthispinbelow0.7Vshutsdownthe  
device. In shutdown all functions are disabled and device  
draws zero supply current. For the proper operation of the  
part, force this pin above 2.5V. Do not leave this pin  
floating. Soft-start can be accomplished by raising the  
voltage on this pin gradually with an RC circuit.  
SVIN (Pin 13): Signal Power Supply Pin.  
PGOOD (Pin 14): Power Good Indicator Pin. Power good  
is an open-drain logic output. The PGOOD pin is pulled to  
ground when the voltage on the VFB pin is not within  
±7.5% of its nominally regulated potential. This pin re-  
quires a pull-up resistor for power good indication. Power  
good indication works in all modes of operation.  
V
FB (Pin 3): Feedback Pin. Receives the feedback voltage  
from an external resistor divider across the output.  
SYNC/MODE (Pin 15): External Clock Synchronization  
and Mode Select Input. To synchronize, apply an external  
clock with a frequency between 350kHz and 750kHz. To  
select Burst Mode operation, tie pin to SVIN. Grounding  
this pin selects pulse skipping mode. Do not leave this pin  
floating.  
ITH (Pin 4): Error Amplifier Compensation Point. The  
current output increases with this control voltage. Nomi-  
nal voltage range for this pin is 0.5V to 1.8V.  
SWP1, SWP2 (Pins 5, 12): Upper Switch Nodes. These  
pins connect to the drains of the internal main PMOS  
switches and should always be connected together  
externally.  
PLL_LPF (Pin 16): Output of the Phase Detector and  
Control Input of Oscillator. Connect a series RC lowpass  
networkfromthispintogroundifexternallysynchronized.  
If unused, this pin may be left open.  
SWN1, SWN2 (Pins 6, 11): Lower Switch Nodes. These  
pins connect to the drains of the internal synchronous  
NMOS switches and should always be connected together  
externally.  
PGND1,PGND2(Pins7,10):PowerGroundPins.Ground  
pins for the internal drivers and switches. These pins  
should always be tied together.  
1879f  
6
LTC1879  
W
BLOCK DIAGRA  
1879f  
7
LTC1879  
U
OPERATIO  
(Refer to Block Diagram)  
Main Control Loop  
the ITH voltage drops below approximately 0.45V, the  
BURSTcomparatortrips,turningoffbothpowerMOSFETs.  
The ITH pin is then disconnected from the output of the EA  
amplifier and held 0.65V above ground.  
The LTC1879 uses a constant frequency, current mode  
step-down architecture. Both the top MOSFET and syn-  
chronous bottom MOSFET switches are internal. During  
normal operation, the internal top power MOSFET is  
turned on each cycle when the oscillator sets the RS latch,  
andturnedoffwhenthecurrentcomparator, ICOMP, resets  
the RS latch. The peak inductor current at which ICOMP  
turns the top MOSFET off is controlled by the voltage on  
the ITH pin, which is the output of error amplifier EA. When  
the load current increases, it causes a slight decrease in  
the feedback voltage, VFB, relative to the 0.8V internal  
reference, which, in turn, causes the ITH voltage to in-  
crease until the average inductor current matches the new  
load current. While the top MOSFET is off, the bottom  
MOSFET is turned on until either the inductor current  
starts to reverse direction or the next clock cycle begins.  
In sleep mode, both power MOSFETs are held off and the  
internal circuitry is partially turned off, reducing the quies-  
cent current to 15µA. The load current is now being  
supplied from the output capacitor. When the output  
voltage drops, the ITH pin reconnects to the output of the  
EA amplifier and the top MOSFET is again turned on and  
this process repeats.  
Soft-Start/Run Function  
The RUN/SS pin provides a soft-start function and a  
means to shut down the LTC1879. Soft-start reduces the  
inputcurrentsurgebygraduallyincreasingtheregulator’s  
maximum output current. This pin can also be used for  
power supply sequencing.  
Comparator OVDET guards against transient overshoots  
>7.5% by turning the main switch off and keeping it off  
until the fault is removed.  
Pulling the RUN/SS pin below 0.7V shuts down the  
LTC1879, which then draws <1µA current from the sup-  
ply. This pin can be driven directly from logic circuits as  
showninFigure1.Itisrecommendedthatthispinisdriven  
to VIN during normal operation. Note that there is no  
current flowing out of this pin. Soft-start action is accom-  
plished by connecting an external RC network to the RUN/  
SS pin as shown in Figure 1. The LTC1879 actively pulls  
the RUN/SS pin to ground under low input supply voltage  
conditions.  
Burst Mode Operation  
The LTC1879 is capable of Burst Mode operation in which  
the internal power MOSFETs operate intermittently based  
on load demand. To enable Burst Mode operation, simply  
tie the SYNC/MODE pin to SVIN or connect it to a logic high  
(VSYNC/MODE > 1.5V). To disable Burst Mode operation  
andenablePWMpulseskippingmode, connecttheSYNC/  
MODE pin to SGND. In this mode, the efficiency is lower at  
lightloadsbutbecomescomparabletoBurstModeopera-  
tion when the output load exceeds 100mA. The advantage  
of pulse skipping mode is lower output ripple.  
V
IN  
3.3V OR 5V  
D1*  
0.32V  
R
SS  
When the converter is in Burst Mode operation, the peak  
current of the inductor is set to approximately 400mA,  
even though the voltage at the ITH pin indicates a lower  
value. The voltage at the ITH pin drops when the inductor’s  
average current is greater than the load requirement. As  
RUN/SS  
C
SS  
*ZETEX BAT54  
1879 F01  
Figure 1. RUN/SS Pin Interfacing  
1879f  
8
LTC1879  
U
OPERATIO  
Power Good Indicator  
(Refer to Block Diagram)  
Low Dropout Operation  
Thepowergoodfunctionmonitorstheoutputvoltageinall  
modes of operation. Its open-drain output is pulled low  
when the output voltage is not within ±7.5% of its nomi-  
nally regulated voltage. The feedback voltage is filtered  
before it is fed to a power good window comparator in  
order to prevent false tripping of the power good signal  
during fast transients. The window comparator monitors  
the output voltage even in Burst Mode operation. In  
shutdown mode, open drain is actively pulled low to  
indicate that the output voltage is invalid.  
When the input supply voltage decreases toward the  
output voltage in a buck regulator, the duty cycle in-  
creases toward the maximum on-time. Further reduction  
of the supply voltage forces the main switch to remain on  
for more than one cycle until it reaches 100% duty cycle.  
The output voltage will then be determined by the input  
voltage minus the voltage drop across the top MOSFET  
and the inductor.  
Low Supply Operation  
The LTC1879 is designed to operate down to an input  
supply voltage of 2.65V although the maximum allowable  
output current is reduced at this low voltage. Figure 2  
shows the reduction in the maximum output current as a  
function of input voltage.  
Short-Circuit Protection  
When the output is shorted to ground, the frequency of  
the oscillator is reduced to about 80kHz, 1/7 the nominal  
frequency. This frequency foldback ensures that the in-  
ductorcurrenthasmoretimetodecay, therebypreventing  
runaway. The oscillator’s frequency will progressively  
increase to 550kHz (or to the synchronized frequency)  
when VFB rises above 0.3V.  
Another important detail to remember is that at low input  
supply voltages, the RDS(ON) of the P-channel switch  
increases. Therefore, the user should calculate the power  
dissipation when the LTC1879 is used at 100% duty cycle  
with low supply voltage (see Thermal Considerations in  
the Applications Information section).  
Frequency Synchronization  
The LTC1879 can be synchronized to an external clock  
source connected to the SYNC/MODE pin. The turn-on of  
the top MOSFET is synchronized to the rising edge of the  
external clock.  
1800  
1600  
V
= 2.5V  
OUT  
When the LTC1879 is clocked by an external source, Burst  
Mode operation is disabled. In this synchronized mode,  
whentheoutputloadcurrentisverylow,currentcompara-  
tor, ICOMP, mayremaintrippedforseveralcyclesandforce  
the main switch to stay off for the same number of cycles.  
Increasing the output load slightly allows constant fre-  
quency PWM operation to resume.  
1400  
V
OUT  
= 1.8V  
1200  
1000  
800  
V
OUT  
= 3.1V  
600  
400  
3
4
5
6
7
10  
2
8
9
Frequency synchronization is inhibited when the feedback  
voltage VFB is below 0.6V. This prevents the external clock  
from interfering with the frequency foldback for short-  
circuit protection.  
INPUT VOLTAGE (V)  
1879 F02  
Figure 2. Maximum Output Current vs Input Voltage  
1879f  
9
LTC1879  
U
OPERATIO  
2400  
2200  
2000  
1800  
1600  
1400  
1200  
1000  
Slope Compensation and Inductor Peak Current  
V
= 5V  
IN  
Slope compensation is required in order to prevent sub-  
harmonic oscillation at high duty cycles. It is accom-  
plished by internally adding a compensating ramp to the  
inductor current signal at duty cycles in excess of 40%. As  
aresult,themaximuminductorpeakcurrentisreducedfor  
duty cycles >40%. This is shown in the decrease of the  
inductor peak current as a function of duty cycle graph in  
Figure 3.  
0
20  
40  
60  
80  
100  
DUTY CYCLE (%)  
1879 F03  
Figure 3. Maximum Inductor Peak Current vs Duty Cycle  
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A reasonable starting point for setting ripple current is  
ThebasicLTC1879applicationcircuitisshownonthefirst  
page of this data sheet. External component selection is  
driven by the load requirement and begins with the selec-  
IL = 0.3(IMAX).  
The inductor value also has an effect on Burst Mode  
operation. The transition to low current operation begins  
when the inductor current peaks fall to approximately  
500mA. Lower inductor values (higher IL) will cause this  
to occur at lower load currents, which can cause a dip in  
efficiency in the upper range of low current operation. In  
Burst Mode operation, lower inductance values will cause  
the burst frequency to increase.  
tion of L followed by CIN and COUT  
.
Inductor Value Calculation  
The inductor selection will depend on the operating fre-  
quency of the LTC1879. The internal nominal frequency is  
550kHz, but can be externally synchronized from 350kHz  
to 750kHz.  
The operating frequency and inductor selection are inter-  
related in that higher operating frequencies allow the use  
of smaller inductor and capacitor values. However, oper-  
ating at a higher frequency results in lower efficiency  
because of increased switching losses.  
Inductor Selection  
The inductor should have a saturation current rating  
greater than the peak inductor current set by the current  
comparator of LTC1879. Also, consideration should be  
given to the resistance of the inductor. Inductor conduc-  
tion losses are directly proportional to the DC resistance  
of the inductor. Manufacturers sometimes provide maxi-  
mum current ratings based on the allowable losses in the  
inductor.  
Theinductorvaluehasadirecteffectonripplecurrent.The  
ripple current IL decreases with higher inductance or  
frequency and increases with higher input voltages.  
1
VOUT  
V
IN  
IL =  
VOUT 1–  
(1)  
f L  
( )( )  
Suitable inductors are available from Coilcraft, Cooper,  
Dale, Sumida, Toko, Murata, Panasonic and other manu-  
facturers.  
Accepting larger values of IL allows the use of smaller  
inductors, but results in higher output voltage ripple.  
1879f  
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CIN and COUT Selection  
The selection of COUT is driven by the required effective  
series resistance (ESR). Typically, once the ESR require-  
ment is satisfied, the capacitance is adequate for filtering.  
The output ripple VOUT is determined by:  
Incontinuousmode,thesourcecurrentofthetopMOSFET  
is a trapezoidal waveform of duty cycle VOUT/VIN. To  
preventlargevoltagetransients, alowESRinputcapacitor  
sized for the maximum RMS current must be used. The  
maximum RMS input capacitor current is given by:  
1
VOUT IL ESR +  
8fCOUT  
1/2  
V
OUT(V – VOUT)  
[
]
IN  
where f = operating frequency, COUT = output capacitance  
and IL = ripple current in the inductor. The output ripple  
is highest at maximum input voltage since IL increases  
with input voltage. For the LTC1879, the general rule for  
proper operation is:  
IRMS(CIN) IOMAX  
V
IN  
This formula has a maximum at VIN = 2VOUT, where  
IRMS = IOUT/2. This simple worst-case condition is com-  
monly used for design because even significant devia-  
tions do not offer much relief. Note that the capacitor  
manufacturer’s ripple current ratings are often based on  
2000 hours of life. This makes it advisable to further  
derate the capacitor, or choose a capacitor rated at a  
highertemperaturethanrequired.Severalcapacitorsmay  
also be paralleled to meet size or height requirements in  
the design. Always consult the manufacturer if there are  
any questions.  
ESRCOUT < 0.125Ω  
The choice of using a smaller output capacitance in-  
creases the output ripple voltage due to the frequency  
dependent term but can be compensated for by using  
capacitor(s) of very low ESR to maintain low ripple volt-  
age. The ITH pin compensation components can be opti-  
mized to provide stable high performance transient  
response regardless of the output capacitor selected.  
Depending on how the LTC1879 circuit is powered up,  
you may need to check for input voltage transients. Input  
voltage transients may be caused by input voltage steps  
or by connecting the circuit to an already powered up  
source such as a wall adapter. The sudden application of  
input voltage will cause a large surge of current in the  
input leads that will store energy in the parasitic induc-  
tanceoftheleads. Thisenergywillcausetheinputvoltage  
to swing above the DC level of the input power source and  
it may exceed the maximum voltage rating of the input  
capacitor and LTC1879.  
Manufacturers such as Taiyo Yuden, AVX, Kemet and  
Sanyo should be considered for low ESR, high perfor-  
mance capacitors. The POSCAP solid electrolytic chip  
capacitor available from Sanyo is an excellent choice for  
output bulk capacitors due to its low ESR/size ratio. Once  
the ESR requirement for COUT has been met, the RMS  
current rating generally far exceeds the IRIPPLE(P-P)  
requirement.  
Output Voltage Programming  
The output voltage is set by a resistor divider according to  
the following formula:  
The easiest way to suppress input voltage transients is to  
add a small aluminum electrolytic capacitor in parallel  
with the low ESR input capacitor. The selected capacitor  
needstohavetherightamountofESRinordertocritically  
dampen the resonant circuit formed by the input lead  
inductance and the input capacitor. The typical values of  
ESR will fall in the range of 0.5to 2and capacitance  
will fall in the range of 5µF to 50µF.  
R1  
R2  
VOUT = 0.8V 1+  
(2)  
The external resistor divider is connected to the output,  
allowing remote voltage sensing as shown in Figure 4.  
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APPLICATIO S I FOR ATIO  
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R
0.8V V  
10V  
LP  
OUT  
2.4V  
C
LP  
R1  
V
FB  
PLL_LPF  
VCO  
R2  
SYNC/  
MODE  
LTC1879  
SGND  
DIGITAL  
PHASE/  
FREQUENCY  
DETECTOR  
1879 F04  
Figure 4. Setting the LTC1879 Output Voltage  
1879 F06  
Phase-Locked Loop and Frequency Synchronization  
The LTC1879 has an internal voltage-controlled oscillator  
and phase detector comprising a phase-locked loop. This  
allows the MOSFET turn-on to be locked to the rising edge  
of an external frequency source. The frequency range of  
the voltage-controlled oscillator is 350kHz to 750kHz. The  
phase detector used is an edge sensitive digital type that  
provides zero degrees phase shift between the external  
andinternaloscillators.Thistypeofphasedetectorwillnot  
lock up on input frequencies close to the harmonics of the  
VCO center frequency. The PLL hold-in range fH is equal  
to the capture range, fH = fC = ±200kHz.  
Figure 6. Phase-Locked Loop Block Diagram  
If the external frequency (VSYNC/MODE) is greater than  
550kHz, the center frequency, current is sourced continu-  
ously, pulling up the PLL_LPF pin. When the external  
frequency is less than 550kHz, current is sunk continu-  
ously, pulling down the PLL_LPF pin. If the external and  
internal frequencies are the same but exhibit a phase  
difference, the current sources turn on for an amount of  
time corresponding to the phase difference. Thus the  
voltage on the PLL_LPF pin is adjusted until the phase and  
frequency of the external and internal oscillators are  
identical. At this stable operating point the phase com-  
paratoroutputisopenandthefiltercapacitorCLP holdsthe  
voltage.  
The output of the phase detector is a pair of complemen-  
tary current sources charging or discharging the external  
filter network on the PLL_LPF pin. The relationship be-  
tween the voltage on the PLL_LPF pin and operating  
frequency is shown in Figure 5. A simplified block diagram  
is shown in Figure 6.  
The loop filter components CLP and RLP smooth out the  
current pulses from the phase detector and provide a  
stable input to the voltage controlled oscillator. The filter  
components CLP and RLP determine how fast the loop  
acquires lock. Typically RLP = 10k and CLP is 2200pF to  
0.01µF. When not synchronized to an external clock, the  
internal connection to the VCO is disconnected. This  
disallowssettingtheinternaloscillationfrequencybyaDC  
voltage on the VPLLLPF pin.  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
Efficiency Considerations  
The efficiency of a switching regulator is equal to the  
output power divided by the input power times 100%. It is  
oftenusefultoanalyzeindividuallossestodeterminewhat  
is limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
0
0.5  
1
1.5  
2
V
(V)  
PLLLPF  
1879 F05  
Figure 5. Relationship Between Oscillator Frequency  
and Voltage at PLL_LPF Pin  
Efficiency = 100% – (ρ1 + ρ2 + ρ3 + ...)  
1879f  
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LTC1879  
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2. I2R losses are calculated from the resistances of the  
internal switches RSW and external inductor RL. In  
continuous mode the average output current flowing  
through inductor L is “chopped” between the main  
switch and the synchronous switch. Thus, the series  
resistancelookingintoSWpinsisafunctionofbothtop  
andbottomMOSFETRDS(ON) andthedutycycle(DC)as  
follows:  
Where ρ1, ρ2, etc. are the individual losses as a percent-  
age of input power.  
Although all dissipative elements in the circuit produce  
losses, two main sources usually account for most of the  
losses in LTC1879 circuits: supply quiescent currents and  
I2R losses. The supply quiescent current loss dominates  
theefficiencylossatverylowloadcurrentwhereastheI2R  
loss dominates the efficiency loss at medium to high load  
currents. In a typical efficiency plot, the efficiency curve at  
very low load currents can be misleading since the actual  
power lost is of no consequence as illustrated in Figure 7.  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
The RDS(ON) for both the top and bottom MOSFETs can  
be obtained from the Typical Performance Characteris-  
tics curves. Thus, to obtain I2R losses, simply add RSW  
to RL and multiply by the square of the average output  
current.  
1. The supply quiescent current is due to two compo-  
nents: the DC bias current as given in the Electrical  
Characteristics and the internal main switch and syn-  
chronousswitchgatechargecurrents.Thegatecharge  
current results from switching the gate capacitance of  
the internal power MOSFET switches. Each time the  
gate is switched from high to low to high again, a  
packet of charge dQ moves from PVIN to ground. The  
resultingdQ/dtisthecurrentoutofPVINthatistypically  
larger than the DC bias current. In continuous mode,  
IGATECHG = f(QT + QB) where QT and QB are the gate  
charges of the internal top and bottom switches. Both  
the DC bias and gate charge losses are proportional to  
supply voltage and thus their effects will be more  
pronounced at higher supply voltages.  
Other losses including CIN and COUT ESR dissipative  
losses,MOSFETswitchinglossesandinductorcorelosses  
generally account for less than 2% total additional loss.  
Thermal Considerations  
In most applications, the LTC1879 does not dissipate  
much heat due to its high efficiency. But, in applications  
where the LTC1879 is running at high ambient tempera-  
ture with low supply voltage and high duty cycles, such as  
in dropout, the heat dissipated may exceed the maximum  
junction temperature of the part. If the junction tempera-  
ture reaches approximately 150°C, both power switches  
will be turned off and the SW nodes will become high  
impedance.  
1
V
V
= 6V  
IN  
OUT  
= 3.3V  
L = 6.8µH  
To avoid the LTC1879 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. Normally,  
some iterative calculation is required to determine a rea-  
sonably accurate value. The temperature rise is given by:  
Burst Mode OPERATION  
0.1  
0.01  
0.001  
TR = P • θJA  
0.0001  
0.1  
1
10  
100  
1000  
LOAD CURRENT (mA)  
where P is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
1879 F07  
Figure 7. Power Lost vs Load Current  
The junction temperature is given by:  
TJ = TA + TR  
1879f  
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LTC1879  
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APPLICATIO S I FOR ATIO  
where TA is the ambient temperature. Because the power  
transistor RDS(ON) is a function of temperature, it is  
usually necessary to iterate 2 to 3 times through the  
equations to achieve a reasonably accurate value for the  
junction temperature.  
Checking Transient Response  
The regulator loop response can be checked by looking at  
the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an amount  
equal to (ILOAD • ESR), where ESR is the effective series  
resistance of COUT. ILOAD also begins to charge or  
discharge COUT, generating a feedback error signal. The  
regulator loop then acts to return VOUT to its steady-state  
value. During this recovery time, VOUT can be monitored  
for overshoot or ringing that would indicate a stability  
problem. The ITH pin can be used for external compensa-  
tion as shown in Figure 9. (The capacitor, CC2, is typically  
needed for noise decoupling.)  
As an example, consider the LTC1879 in dropout at an  
input voltage of 5V, a load current of 0.8A and an ambient  
temperature of 70°C. From the typical performance graph  
of switch resistance, the RDS(ON) of the P-channel switch  
at 70°C is 0.38. Therefore, power dissipated by the IC is:  
P = I2 • RDS(ON) = 0.243W  
For the SSOP package, the θJA is 140°C/W. Thus the  
junction temperature of the regulator is:  
TJ = 70°C + (0.243)(140) = 104°C  
A second, more severe transient is caused by switching in  
loads with large (>1µF) supply bypass capacitors. The  
dischargedbypasscapacitorsareeffectivelyputinparallel  
with COUT, causing a rapid drop in VOUT. No regulator can  
deliver enough current to prevent this problem if the load  
switch resistance is low and it is driven quickly. The only  
solution is to limit the rise time of the switch drive so that  
the load rise time is limited to approximately (25 • CLOAD).  
Thus, a 10µF capacitor charging to 3.3V would require a  
250µs rise time, limiting the charging current to about  
130mA.  
However, at this temperature, the RDS(ON) is actually  
0.42.  
Therefore:  
TJ = 70°C + (0.269)(140) = 108°C  
which is below the maximum junction temperature of  
125°C.  
Note that at higher supply voltages, the junction tempera-  
ture is lower due to reduced switch resistance (RDS(ON)).  
1879f  
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PC Board Layout Checklist  
3. The high di/dt loop from the top terminal of the input  
capacitor, through the power MOSFETs and back to the  
input capacitor should be kept as tight as possible to  
reduce inductive ringing. Excess inductance can cause  
increased stress on the power MOSFET and increase  
noise on the input. If low ESR ceramic capacitors are  
usedtoreduceinputnoise,placethesecapacitorsclose  
to the DUT in order to keep the series inductance to a  
minimum.  
As with all high frequency switchers, when considering  
layout, care must be taken in order to achieve optimal  
electrical, thermal and noise performance. Figure 8 is a  
sample of PC board layout for the design example shown  
in Figure 9. A 4-layer PC board is used in this design.  
Several guidelines are followed in this layout:  
1. In order to minimize switching noise and improve  
output load regulation, the PGND pins of the LTC1879  
shouldbeconnecteddirectlyto1)thenegativeterminal  
of the output decoupling capacitors, 2) the negative  
terminal of the input capacitor and 3) vias to the ground  
plane immediately adjacent to Pins 1, 7 and 10. The  
ground trace on the top layer of the PC board should be  
as wide and short as possible to minimize series resis-  
tance and inductance.  
4. Place the small-signal components away from high  
frequency switching nodes. In the layout shown in  
Figure 8, all of the small-signal components have been  
placed on one side of the IC and all of the power  
components have been placed on the other.  
5. For optimum load regulation and true sensing, the top  
of the output resistor divider should connect indepen-  
dentlytothetopoftheoutputcapacitor(Kelvinconnec-  
tion), staying away from any high dV/dt traces. Place  
the divider resistors near the LTC1879 in order to keep  
the high impedance FB node short.  
2. BewareofgroundloopsinmultiplelayerPCboards. Try  
to maintain one central ground node on the board and  
use the input capacitor to avoid excess input ripple for  
high output current power supplies. If the ground is to  
be used for high DC currents, choose a path away from  
the small-signal components.  
VIAS TO GND PLANE  
R
R
SVIN  
C
C
C
R
PL  
C2  
PL  
C
C1  
VIA CONNECTION TO R  
FB1  
C
SS  
R
PG  
R
SS  
R
R
FB2  
FB1  
DUT  
L1  
C
IN1  
C
C
OUT  
IN2  
V
IN  
PGND  
V
OUT  
1879 F08  
VIAS TO GND PLANE  
Figure 8. Typical Application and Suggested Layout (Topside Only)  
1879f  
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Design Example  
An 15µH inductor works well for this application. For good  
efficiency choose a 1.5A inductor with less than 0.125Ω  
series resistance.  
As a design example, assume the LTC1879 is used in a  
dual lithium-ion battery-powered cellular phone applica-  
tion. The VIN will be operating from a maximum of 8.4V  
down to about 2.65V. The load current requirement is a  
maximumof0.7Abutmostofthetimeitwillbeonstandby  
mode, requiring only 2mA. Efficiency at both low and high  
load currents is important. Output voltage is 2.5V. With  
this information we can calculate L using equation (1),  
CIN will require an RMS current rating of at least 0.35A at  
temperature and COUT will require an ESR of less than  
0.125. In most applications, the requirements for these  
capacitors are fairly similar.  
For the feedback resistors, choose R2 = 412k. R1 can then  
be calculated from equation (2) to be:  
1
f I  
VOUT  
V
IN  
VOUT  
0.8  
L =  
VOUT 1–  
(3)  
R1=  
– 1 R2 = 875.5k,use 887k  
( )(  
)
L
Substituting VOUT = 2.5V, VIN = 8.4V, IL = 210mA and  
f = 550kHz in equation (3) gives:  
Figure 9 shows the complete circuit along with its effi-  
ciency curve.  
2.5V  
550kHz • 210mA  
2.5V  
8.4V  
L =  
1–  
= 15.2µH  
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R
SVIN  
10Ω  
C
SVIN  
13  
IN  
15  
0.1µF  
R
PG  
SV  
SYNC/MODE  
100k  
14  
2
8
9
V
IN  
PGOOD  
PV  
PV  
IN  
IN  
2.65V TO 8.4V  
C
IN2  
C
IN1  
R
SS  
10µF  
10µF  
1M  
GND  
7
PGND  
PGND  
RUN/SS  
10  
C
SS  
0.1µF  
C
OUT  
5
47µF  
LTC1879  
L1  
SWP  
SWP  
SWN  
SWN  
15µH  
12  
6
V
2.5V  
0.7A  
OUT  
16  
4
PLL_LPF  
11  
R1  
887k  
3
I
V
FB  
TH  
R2  
412k  
C
C1  
47pF  
1
C
1879 F09a  
C2  
SGND  
220pF  
R
150k  
C
BOLD LINES INDICATE HIGH CURRENT PATHS  
C
C
, C : TAIYO YUDEN CERAMIC JMK316BJ106ML  
OUT  
IN1 IN2  
: TDK CERAMIC C4532X5R0J476M  
L1: TOKO A921CY-150M  
: 0.7A IS THE MAXIMUM OUTPUT CURRENT  
V
OUT  
Figure 9a. Dual Lithium-Ion/8V Wall Adapter to 2.5V/0.7A Regulator from Design Example  
100  
V
V
= 3.6V  
IN  
OUT  
= 2.5V  
L = 15µH  
90  
80  
70  
60  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
1879 F09b  
Figure 9b. Efficiency vs Output Current for Design Example  
1879f  
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TYPICAL APPLICATIO  
Dual Li-Ion to 1.8V/1A Regulator Using All Ceramic Capacitors  
R
SVIN  
10Ω  
C
SVIN  
13  
IN  
15  
0.1µF  
R
PG  
SV  
SYNC/MODE  
100k  
14  
2
8
9
V
IN  
PGOOD  
PV  
PV  
IN  
IN  
3V TO 8.4V  
C
IN2  
C
IN1  
R
SS  
10µF  
10µF  
1M  
GND  
7
PGND  
PGND  
RUN/SS  
10  
C
SS  
0.1µF  
C
OUT  
47µF  
5
LTC1879  
L1  
SWP  
SWP  
SWN  
SWN  
8.2µH  
12  
6
V
1.8V  
1A  
OUT  
16  
4
PLL_LPF  
11  
R1  
523k  
3
I
V
FB  
TH  
R2  
412k  
C
C1  
1
47pF  
C
1879 TA02  
C2  
SGND  
220pF  
R
C
150k  
BOLD LINES INDICATE HIGH CURRENT PATHS  
C
C
, C : TAIYO YUDEN CERAMIC LMK325BJ106MN  
OUT  
IN1 IN2  
: TDK CERAMIC C4532X5R0J476M  
L1: TOKO A916CY-8R2M  
: 1A IS THE MAXIMUM OUTPUT CURRENT  
V
OUT  
Efficiency vs Output Current  
100  
V
= 3.6V  
IN  
90  
80  
V
= 5V  
IN  
70  
60  
V
= 7.2V  
IN  
50  
40  
V
= 1.8V  
OUT  
Burst Mode OPERATION  
0.1  
1
10 100 1000  
OUTPUT CURRENT (mA)  
1879 TA04  
1879f  
18  
LTC1879  
U
PACKAGE DESCRIPTION  
GN Package  
16-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
.189 – .196*  
(4.801 – 4.978)  
.045 ±.005  
.009  
(0.229)  
REF  
16 15 14 13 12 11 10 9  
.254 MIN  
.150 – .165  
.229 – .244  
.150 – .157**  
(5.817 – 6.198)  
(3.810 – 3.988)  
.0165 ±.0015  
.0250 TYP  
RECOMMENDED SOLDER PAD LAYOUT  
1
2
3
4
5
6
7
8
.015 ± .004  
(0.38 ± 0.10)  
× 45°  
.053 – .068  
(1.351 – 1.727)  
.004 – .0098  
(0.102 – 0.249)  
.007 – .0098  
(0.178 – 0.249)  
0° – 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.0250  
(0.635)  
BSC  
.008 – .012  
(0.203 – 0.305)  
NOTE:  
1. CONTROLLING DIMENSION: INCHES  
INCHES  
2. DIMENSIONS ARE IN  
(MILLIMETERS)  
GN16 (SSOP) 0502  
3. DRAWING NOT TO SCALE  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
1879f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnection ofits circuits as described herein willnotinfringe on existing patentrights.  
19  
LTC1879  
U
TYPICAL APPLICATIO  
5-Cell NiMH to 3.3V/0.25A ZETA Regulator Using All Ceramic Capacitors  
R
SVIN  
10  
C
SVIN  
13  
IN  
15  
0.1µF  
R
PG  
SV  
SYNC/MODE  
100k  
14  
2
8
9
V
IN  
PGOOD  
PV  
PV  
IN  
2.8V TO 7.5V  
C
IN2  
10µF  
C
IN1  
10µF  
R
SS  
IN  
1M  
GND  
7
PGND  
PGND  
RUN/SS  
10  
C
SS  
0.1µF  
L1  
C
OUT  
47µF  
5
LTC1879  
SWP  
SWP  
SWN  
SWN  
12  
6
L1  
4.7µH  
C
C
16  
4
10µF  
V
OUT  
PLL_LPF  
3.3V  
11  
0.25A  
R1  
1.3M  
3
I
TH  
V
FB  
SGND  
R2  
C
C1  
47pF  
412k  
1
C
1879 TA03  
C2  
220pF  
R
C
150k  
BOLD LINES INDICATE HIGH CURRENT PATHS  
C : TAIYO YUDEN CERAMIC LMK325BJ106MN  
C
C
, C : TAIYO YUDEN CERAMIC LMK325BJ106MN  
IN1 IN2  
OUT  
C
: TDK CERAMIC C4532X5R0J476M  
L1: COILTRONICS CTX5-4  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LT1616  
25V, 500mA (I ), 1.4MHz, High Efficiency  
V
V
V
V
V
V
V
V
V
V
V
V
V
= 3.6V to 25V, V  
= 1.25V, I = 1.9mA, I = <1µA, ThinSOTTM  
O SD  
OUT  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
OUT(MIN)  
OUT(MIN)  
Step-Down DC/DC Converter  
LT1676  
60V, 440mA (I ), 100kHz, High Efficiency  
= 7.4V to 60V, V  
= 1.24V, I = 3.2mA, I = 2.5µA, SO-8  
O SD  
OUT  
Step-Down DC/DC Converter  
LT1765  
25V, 2.75A (I ), 1.25MHz, High Efficiency  
= 3V to 25V, V  
= 1.20V, I = 1mA, I = 15µA, SO-8, TSSOP16E  
OUT(MIN) O SD  
OUT  
Step-Down DC/DC Converter  
LT1766/LT1956  
LT1767  
60V, 1.2A (I ), 200kHz/500kHz, High Efficiency  
= 5.5V to 60V, V  
= 1.20V, I = 2.5mA, I = 25µA, TSSOP16/E  
OUT  
OUT(MIN) O SD  
Step-Down DC/DC Converter  
25V, 1.2A (I ), 1.25kHz, High Efficiency  
= 3V to 25V, V  
= 1.20V, I = 1mA, I = 6µA, SO-8, MS8/E  
OUT  
OUT(MIN) O SD  
Step-Down DC/DC Converter  
LTC®1875  
LTC1877  
LT1940  
1.5A, (I ), 550kHz, Synchronous Step-Down  
= 2.7V to 6V, V  
= 0.8V, I = 15µA, I = <1µA, TSSOP-16  
OUT(MIN) O SD  
OUT  
DC/DC Converter  
600mA, (I ), 550kHz, Synchronous  
= 2.7V to 10V, V  
= 0.8V, I = 10µA, I = <1µA, MS8  
OUT(MIN) O SD  
OUT  
Step-Down DC/DC Converter  
Dual Output 1.4A (I ), Constant 1.1MHz,  
= 3V to 25V, V  
= 1.2V, I = 2.5µA, I = <1µA, TSSOP-16E  
OUT  
OUT(MIN) O SD  
High Efficiency Step-Down DC/DC Converter  
LTC3405/LTC3405A 300mA (I ), 1.5MHz, Synchronous  
= 2.7V to 6V, V  
= 0.8V, I = 20µA, I = <1µA, ThinSOT  
OUT(MIN) O SD  
OUT  
Step-Down DC/DC Converters  
LTC3406/LTC3406B 600mA (I ), 1.5MHz, Synchronous  
= 2.5V to 5.5V, V  
= 2.5V to 5.5V, V  
= 2.5V to 5.5V, V  
= 2.5V to 5.5V, V  
= 0.6V, I = 20µA, I = <1µA, ThinSOT  
O SD  
OUT  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
Step-Down DC/DC Converters  
LTC3411  
LTC3412  
LTC3430  
1.25A (I ), 4MHz, Synchronous  
= 0.8V, I = 60µA, I = <1µA, 10-Pin MS  
O SD  
OUT  
Step-Down DC/DC Converter  
2.5A (I ), 4MHz, Synchronous  
= 0.8V, I = 60µA, I = <1µA, TSSOP16E  
O SD  
OUT  
Step-Down DC/DC Converter  
2.5A (I ), 4MHz Synchronous  
= 0.8V, I = 60µA, I = <1µA, TSSOP16E  
O SD  
OUT  
Step-Down DC/DC Converter  
ThinSOT is a trademark of Linear Technology Corporation.  
1879f  
LT/TP 0303 2K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2001  

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