LTC2320HUKG-14#PBF [Linear]
LTC2320-14 - Octal, 14-Bit + Sign, 1.5Msps/Ch Simultaneous Sampling ADC; Package: QFN; Pins: 52; Temperature Range: -40°C to 125°C;型号: | LTC2320HUKG-14#PBF |
厂家: | Linear |
描述: | LTC2320-14 - Octal, 14-Bit + Sign, 1.5Msps/Ch Simultaneous Sampling ADC; Package: QFN; Pins: 52; Temperature Range: -40°C to 125°C 转换器 |
文件: | 总34页 (文件大小:2053K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC2320-14
Octal, 14-Bit + Sign,
1.5Msps/Ch Simultaneous
Sampling ADC
FEATURES
DESCRIPTION
The LTC®2320-14 is a low noise, high speed octal 14-bit
+ sign successive approximation register (SAR) ADC with
differential inputs and wide input common mode range.
Operating from a single 3.3V or 5V supply, the LTC2320-
n
1.5Msps/Ch Throughput Rate
n
Eight Simultaneously Sampling Channels
n
Guaranteed 14-Bit, No Missing Codes
n
8V Differential Inputs with Wide Input
P-P
Common Mode Range
14 has an 8V differential input range, making it ideal
P-P
n
n
n
n
n
81dB SNR (Typ) at f = 500kHz
for applications which require a wide dynamic range with
high common mode rejection. The LTC2320-14 achieves
1LSB INL typical, no missing codes at 14 bits and 81dB
SNR.
IN
IN
–90dB THD (Typ) at f = 500kHz
Guaranteed Operation to 125°C
Single 3.3V or 5V Supply
Low Drift (20ppm/°C Max) 2.048V or 4.096V
Internal Reference
The LTC2320-14 has an onboard low drift (20ppm/°C
max) 2.048V or 4.096V temperature-compensated
reference. The LTC2320-14 also has a high speed SPI-
compatible serial interface that supports CMOS or LVDS.
The fast 1.5Msps per channel throughput with no latency
makes the LTC2320-14 ideally suited for a wide variety
of high speed applications. The LTC2320-14 dissipates
only 20mW per channel and offers nap and sleep modes
to reduce the power consumption to 26μW for further
power savings during inactive periods.
n
n
n
n
1.8V to 2.5V I/O Voltages
CMOS or LVDS SPI-Compatible Serial I/O
Power Dissipation 20mW/Ch (Typ)
Small 52-Lead (7mm × 8mm) QFN Package
APPLICATIONS
n
High Speed Data Acquisition Systems
n
Communications
n
Optical Networking
Multiphase Motor Control
All registered trademarks and trademarks are the property of their respective owners.
n
TYPICAL APPLICATION
10ꢀꢁ
1ꢀꢁ
1ꢀꢁꢂ ꢃꢄ 2ꢀꢅꢂ
3ꢀ3ꢁ ꢂꢃ ꢄꢁ
32k Point FFT fSMPL = 1.5Msps,
fIN = 500kHz
TRUE DIFFERENTIAL INPUTS
NO CONFIGURATION REQUIRED
ꢀ
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CMOSꢀꢁꢂꢃꢄ
SDRꢀꢁꢁꢂ
ꢀꢁꢂꢃꢄꢂꢁꢅ
ꢀ
14ꢀꢁꢂꢃ
ꢄ ꢅꢂꢆꢇ
ꢅꢈꢉ ꢈꢊꢋ
+
–
ꢀꢁꢂ
IN , IN
0
ꢀ20
ꢃ
ꢃ
ꢀ
ꢀ
ꢀꢁꢂ ꢃ ꢄ1ꢅ1ꢆꢇ
ꢀꢁꢂ ꢃ ꢄꢅ0ꢆ2ꢇꢈ
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ꢅꢈꢉ ꢈꢊꢋ
ꢀ40
ꢀꢁꢂ
ꢃ
ꢃ
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ꢁꢂ4
ꢀꢁꢂ
0
0
0
0
ꢀꢁ0
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ꢄ
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14ꢀꢁꢂꢃ
ꢄ ꢅꢂꢆꢇ
ꢅꢈꢉ ꢈꢊꢋ
ꢀꢁ0
ꢀꢁꢂ
ꢄ
ꢄ
ꢀ
ꢀ
ꢁꢂꢃ
ꢁꢂꢃ
ꢀꢁꢂ
ꢀ100
ꢀ120
ꢀ140
CNV
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂꢀꢃ
ꢄ
ꢄ
ꢀ
ꢀ
ꢁꢂꢃ
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14ꢀꢁꢂꢃ
ꢄ ꢅꢂꢆꢇ
ꢅꢈꢉ ꢈꢊꢋ
ꢀꢁꢂ
ꢄ
ꢄ
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ꢁꢂꢃ
ꢁꢂꢃ
ꢀꢁꢂ
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
ꢀꢁꢂ
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232014 ꢀꢁ01a
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
232014 ꢀꢁ01ꢂ
ꢀꢁꢂꢃꢄ ꢅꢁꢆꢇꢈꢄꢉꢊꢀꢋꢇꢅ
ꢀꢁꢂꢃꢄꢅꢆꢇ ꢈꢉꢁꢆꢆꢊꢄꢀ
1ꢀꢁ
10ꢀꢁ
10ꢀꢁ
10ꢀꢁ
10ꢀꢁ
232014fa
1
For more information www.linear.com/LTC2320-14
LTC2320-14
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Notes 1, 2)
ꢅꢆꢇ ꢈꢉꢊꢋ
Supply Voltage (V )..................................................6V
DD
Supply Voltage (OV )................................................3V
DD
Analog Input Voltage
ꢁ2 ꢁ1 ꢁ0 4ꢄ 4ꢃ 4ꢂ 4ꢀ 4ꢁ 44 43 42 41
ꢛ
ꢛ
ꢜ
+
–
ꢑ
ꢑ
1
2
40 ꢘꢎꢆꢃꢞꢘꢎꢆꢎ
3ꢄ ꢘꢎꢆꢂꢞꢘꢎꢆꢎ
ꢉꢍꢀ
A
, A (Note 3) ................... –0.3V to (V + 0.3V)
IN
IN DD
ꢜ
ꢉꢍꢀ
REFOUT1,2,3,4........................ .–0.3V to (V + 0.3V)
DD
DD
ꢌꢍꢎ
ꢛ
ꢌꢍꢎ
ꢆꢈ
3
3ꢃ
3ꢂ
CNV........................................ –0.3V to (OV + 0.3V)
ꢑ
4
ꢉꢍꢁ
ꢎꢎ
ꢜ
ꢛ
ꢜ
ꢑ
ꢉꢍꢁ
ꢁ
3ꢀ ꢘꢎꢆꢀꢞꢘꢎꢆꢒ
ꢘꢎꢆꢁꢞꢘꢎꢆꢒ
3ꢁ
Digital Input Voltage
ꢝꢊꢚꢆꢏꢅ3
ꢌꢍꢎ
ꢀ
(Note 3).......................... (GND – 0.3V) to (OV + 0.3V)
ꢛ
DD
ꢂ
34 CꢀꢁOꢂꢃꢄNꢞꢒꢔꢐꢆꢏꢅ
ꢁ3
ꢌꢍꢎ
ꢜ
Digital Output Voltage
ꢝꢊꢚ
ꢃ
33 ꢒꢔꢐꢆꢏꢅꢞꢒꢔꢐꢆꢏꢅ
ꢝꢊꢚꢆꢏꢅ2
ꢛ
ꢄ
32 ꢌꢍꢎ
(Note 3).......................... (GND – 0.3V) to (OV + 0.3V)
DD
ꢑ
ꢑ
10
11
31 ꢆꢈ
ꢎꢎ
ꢉꢍ4
Operating Temperature Range
ꢜ
ꢛ
ꢜ
ꢛ
ꢜ
30 ꢘꢎꢆ4ꢞꢘꢎꢆꢟ
2ꢄ ꢘꢎꢆ3ꢞꢘꢎꢆꢟ
2ꢃ ꢘꢎꢆ2ꢞꢘꢎꢆꢑ
2ꢂ ꢘꢎꢆ1ꢞꢘꢎꢆꢑ
ꢉꢍ4
LTC2320C................................................ 0°C to 70°C
LTC2320I .............................................–40°C to 85°C
LTC2320H.......................................... –40°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
ꢌꢍꢎ 12
ꢛ
ꢑ
13
14
ꢉꢍ3
ꢜ
ꢑ
ꢉꢍ3
1ꢁ 1ꢀ 1ꢂ 1ꢃ 1ꢄ 20 21 22 23 24 2ꢁ 2ꢀ
ꢏꢐꢌ ꢇꢑꢒꢐꢑꢌꢊ
ꢁ2ꢓꢔꢊꢑꢎ ꢕꢂꢖꢖ × ꢃꢖꢖꢗ ꢇꢔꢑꢘꢅꢉꢒ ꢙꢚꢍ
T
= 150°C, θ = 31°C/W
JA
JMAX
EXPOSED PAD (PIN 53) IS GND, MUST BE SOLDERED TO PCB
http://www.linear.com/product/LTC2320-14#orderinfo
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
LTC2320UKG-14
LTC2320UKG-14
LTC2320UKG-14
PACKAGE DESCRIPTION
TEMPERATURE RANGE
0°C to 70°C
LTC2320CUKG-14#PBF
LTC2320IUKG-14#PBF
LTC2320HUKG-14#PBF
LTC2320CUKG-14#TRPBF
LTC2320IUKG-14#TRPBF
LTC2320HUKG-14#TRPBF
52-Lead (7mm × 8mm) Plastic QFN
52-Lead (7mm × 8mm) Plastic QFN
52-Lead (7mm × 8mm) Plastic QFN
–40°C to 85°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
232014fa
2
For more information www.linear.com/LTC2320-14
LTC2320-14
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
+
+
–
–
l
l
l
l
l
V
V
V
V
Absolute Input Range (A to A
)
)
(Note 5)
0
V
DD
V
DD
IN
IN
IN
IN
IN
IN
–
+
+
Absolute Input Range (A to A
(Note 5)
0
V
IN
–
+
–
– V
Input Differential Voltage Range
Common Mode Input Range
V
V
= V – V
–REFOUT1,2,3,4
REFOUT1,2,3,4
V
IN
IN
IN
IN
+
–
= (V – V )/2
0
V
DD
V
CM
CM
IN
IN
I
IN
Analog Input DC Leakage Current
Analog Input Capacitance
–1
1
μA
pF
dB
V
C
IN
10
CMRR
Input Common Mode Rejection Ratio
CNV High Level Input Voltage
CNV Low Level Input Voltage
CNV Input Current
f
IN
= 500kHz
102
l
l
l
V
V
1.5
IHCNV
ILCNV
INCNV
0.5
10
V
I
–10
μA
CONVERTER CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL PARAMETER
CONDITIONS
MIN
14
TYP
MAX
UNITS
Bits
l
l
Resolution
No Missing Codes
14
Bits
Transition Noise
0.8
1
LSB
RMS
l
l
l
INL
Integral Linearity Error
Differential Linearity Error
Bipolar Zero-Scale Error
Bipolar Zero-Scale Error Drift
Bipolar Full-Scale Error
Bipolar Full-Scale Error Drift
(Note 6)
(Note 7)
–3
–0.99
–3
3
0.99
3
LSB
DNL
BZE
0.4
0
LSB
LSB
0.005
0
LSB/°C
LSB
l
FSE
V
V
= 4.096V (REFBUFEN Grounded) (Note 7)
= 4.096V (REFBUFEN Grounded)
–8
8
REFOUT1,2,3,4
15
ppm/°C
REFOUT1,2,3,4
232014fa
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For more information www.linear.com/LTC2320-14
LTC2320-14
DYNAMIC ACCURACY The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C and AIN = –1dBFS (Notes 4, 8).
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
80
MAX
UNITS
dB
l
l
l
l
SINAD
Signal-to-(Noise + Distortion) Ratio f = 500kHz, V
= 4.096V, Internal Reference
= 5V, External Reference
= 4.096V, Internal Reference
= 5V, External Reference
= 4.096V, Internal Reference
= 5V, External Reference
= 4.096V, Internal Reference
= 5V, External Reference
75.5
IN
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
REFOUT1,2,3,4
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
= 500kHz, V
= 500kHz, V
= 500kHz, V
= 500kHz, V
= 500kHz, V
= 500kHz, V
= 500kHz, V
84
dB
SNR
Signal-to-Noise Ratio
76.5
77
81
dB
82.5
–90
–91
93
dB
THD
Total Harmonic Distortion
Spurious Free Dynamic Range
–77
dB
dB
SFDR
dB
93
dB
–3dB Input Bandwidth
Aperture Delay
55
MHz
ps
500
500
1
Aperture Delay Matching
Aperture Jitter
ps
ps
RMS
Transient Response
Full-Scale Step
3
ns
INTERNAL REFERENCE CHARACTERISTICS The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
l
V
Internal Reference Output Voltage
4.75V < V < 5.25V
4.078
2.034
4.096
2.048
4.115
2.064
V
V
REFOUT1,2,3,4
DD
3.13V < V < 3.47V
DD
l
V
Temperature Coefficient
(Note 14)
3
20
ppm/°C
Ω
REF
REFOUT1,2,3,4 Output Impedance
Line Regulation
0.25
0.3
V
4.75V < V < 5.25V
mV/V
REFOUT1,2,3,4
DD
I
External Reference Current
REFBUFEN = 0V
REFOUT1,2,3,4
REFOUT1,2,3,4 = 4.096V
REFOUT1,2,3,4 = 2.048V
(Notes 9, 10)
385
204
μA
μA
232014fa
4
For more information www.linear.com/LTC2320-14
LTC2320-14
DIGITAL INPUTS AND DIGITAL OUTPUTS The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL PARAMETER
CONDITIONS
CMOS/LVDS = GND
MIN
0.8 • OV
–10
TYP
MAX
UNITS
CMOS Digital Inputs and Outputs
l
l
l
l
V
V
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
V
V
IH
IL
DD
0.2 • OV
10
DD
I
V
IN
= 0V to OV
DD
μA
pF
IN
C
IN
Digital Input Capacitance
5
l
l
V
V
High Level Output Voltage
Low Level Output Voltage
I = –500μA
OV – 0.2
V
V
OH
OL
O
DD
I = 500μA
O
0.2
10
l
l
l
I
I
I
Hi-Z Output Leakage Current
Output Source Current
Output Sink Current
V
OUT
V
OUT
V
OUT
= 0V to OV
DD
–10
μA
mA
mA
OZ
= 0V
= OV
–10
10
SOURCE
SINK
DD
LVDS Digital Inputs and Outputs
CMOS/LVDS = OV
DD
l
l
l
l
l
l
V
V
V
V
V
V
LVDS Differential Input Voltage
LVDS Common Mode Input Voltage
LVDS Differential Output Voltage
LVDS Common Mode Output Voltage
100Ω Differential Termination
DD
240
1
600
1.45
600
1.4
mV
V
ID
OV = 2.5V
100Ω Differential Termination
OV = 2.5V
DD
IS
100Ω Differential Termination
OV = 2.5V
DD
220
0.85
100
0.85
350
1.2
200
1.2
mV
V
OD
100Ω Differential Termination
OV = 2.5V
DD
OS
Low Power LVDS Differential Output Voltage 100Ω Differential Termination
350
1.4
mV
V
OD_LP
OS_LP
OV = 2.5V
DD
Low Power LVDS Common Mode Output Voltage 100Ω Differential Termination
OV = 2.5V
DD
232014fa
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For more information www.linear.com/LTC2320-14
LTC2320-14
POWER REQUIREMENTS The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
l
V
Supply Voltage
5V Operation
3.3V Operation
4.75
3.13
5.25
3.47
V
V
DD
+
–
l
IV
DD
Supply Current
1.5Msps Sample Rate (IN = IN = 0V)
31
38
mA
CMOS I/O Mode
CMOS/LVDS = GND
Supply Voltage
l
l
l
l
OV
1.71
2.63
7.0
V
mA
mA
µA
DD
OVDD
NAP
I
I
I
Supply Current
1.5Msps Sample Rate (C = 5pF)
4.4
5.3
20
L
Nap Mode Current
Sleep Mode Current
Power Dissipation
Conversion Done (I
)
6.2
VDD
Sleep Mode (I
+ I )
OVDD
110
SLEEP
VDD
l
l
l
P
V
= 3.3V, 1.5Msps Sample Rate
DD
102
18
20
130
20.6
355
mW
mW
µW
D_3.3V
Nap Mode
Sleep Mode
l
l
l
P
D_5V
Power Dissipation
V
= 5V, 1.5Msps Sample Rate
162
27
30
208
31.2
525
mW
mW
µW
DD
Nap Mode
Sleep Mode
LVDS I/O Mode
CMOS/LVDS = OV , OV = 2.5V
DD DD
l
l
l
l
OV
Supply Voltage
Supply Current
2.37
2.63
34
V
mA
mA
µA
DD
OVDD
NAP
I
I
I
1.5Msps Sample Rate (C = 5pF, R = 100Ω)
26
5.3
20
L
L
Nap Mode Current
Sleep Mode Current
Power Dissipation
Conversion Done (I
)
6.2
VDD
Sleep Mode (I
+ I )
OVDD
110
SLEEP
VDD
l
l
l
P
V
= 3.3V, 1.5Msps Sample Rate
DD
151
52
80
195
58
355
mW
mW
µW
D_3.3V
Nap Mode
Sleep Mode
l
l
l
P
D_5V
Power Dissipation
V
= 5V, 1.5Msps Sample Rate
214
60
30
280
68.5
525
mW
mW
µW
DD
Nap Mode
Sleep Mode
ADC TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL
PARAMETER
CONDITIONS
MIN
0.667
30
TYP
MAX
1.5
UNITS
Msps
µs
l
l
l
l
f
t
t
t
t
t
Maximum Sampling Frequency
Time Between Conversions
Conversion Time
SMPL
(Note 11) t
= t
+ t
+ t
READOUT
1000
450
CYC
CYC
CNVH
CONV
ns
CONV
CNV High Time
ns
CNVH
Sampling Aperture
(Note 11) t
= t
– t
CONV
215
50
ns
ACQUISITION
WAKE
ACQUISITION
CYC
REFOUT1,2,3,4 Wake-Up Time
C
= 10µF
ms
REFOUT1,2,3,4
CMOS I/O Mode, SDR
CMOS/LVDS = GND, SDR/ DDR = GND
l
l
l
l
l
t
t
t
t
t
SCK Period
(Note 13)
9.1
4.1
4.1
0
ns
ns
ns
ns
ns
SCK
SCK High Time
SCK Low Time
SCKH
SCKL
SDO Data Remains Valid Delay from CLKOUT↓ C = 5pF (Note 12)
1.5
4.5
HSDO_SDR
DSCKCLKOUT
L
SCK to CLKOUT Delay
(Note 12)
2
232014fa
6
For more information www.linear.com/LTC2320-14
LTC2320-14
ADC TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 4).
SYMBOL
PARAMETER
CONDITIONS
(Note 11)
(Note 11)
(Note 11)
MIN
TYP
MAX
UNITS
ns
l
l
l
t
t
t
Bus Relinquish Time After CNV↑
SDO Valid Delay from CNV↓
SCK Delay Time to CNV↑
3
3
DCNVSDOZ
DCNVSDOV
DSCKHCNVH
ns
0
ns
CMOS I/O Mode, DDR
CMOS/LVDS = GND, SDR/ DDR = OV
DD
l
l
l
l
l
l
l
l
t
t
t
t
t
t
t
t
SCK Period
18.2
8.2
8.2
0
ns
ns
ns
ns
ns
ns
ns
ns
SCK
SCK High Time
SCK Low Time
SCKH
SCKL
SDO Data Remains Valid Delay from CLKOUT↓ C = 5pF (Note 12)
1.5
4.5
3
HSDO_DDR
DSCKCLKOUT
DCNVSDOZ
DCNVSDOV
DSCKHCNVH
L
SCK to CLKOUT Delay
(Note 12)
(Note 11)
(Note 11)
(Note 11)
2
Bus Relinquish Time After CNV↑
SDO Valid Delay from CNV↓
SCK Delay Time to CNV↑
3
0
LVDS I/O Mode, SDR
CMOS/LVDS = OV , SDR/DDR = GND
DD
l
l
l
l
l
l
t
t
t
t
t
t
SCK Period
3.3
1.5
1.5
0
ns
ns
ns
ns
ns
ns
SCK
SCK High Time
SCK Low Time
SCKH
SCKL
SDO Data Remains Valid Delay from CLKOUT↓ C = 5pF (Note 12)
1.5
4
HSDO_SDR
DSCKCLKOUT
DSCKHCNVH
L
SCK to CLKOUT Delay
(Note 12)
(Note 11)
2
SCK Delay Time to CNV↑
0
LVDS I/O Mode, DDR
CMOS/LVDS = OV , SDR/DDR = OV = 2.5V
DD DD
l
l
l
l
l
l
t
t
t
t
t
t
SCK Period
6.6
3
ns
ns
ns
ns
ns
ns
SCK
SCK High Time
SCK Low Time
SCKH
3
SCKL
SDO Data Remains Valid Delay from CLKOUT↓ C = 5pF
0
1.5
4
HSDO_DDR
DSCKCLKOUT
DSCKHCNVH
L
SCK to CLKOUT Delay
2
SCK Delay Time to CNV↑
(Note 11)
0
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
untrimmed deviation from ideal first and last code transitions and includes
the effect of offset error.
Note 8: All specifications in dB are referred to a full-scale 4.096V input
with REF = 4.096V.
Note 2: All voltage values are with respect to ground.
Note 9: When REFOUT1,2,3,4 is overdriven, the internal reference buffer
Note 3: When these pin voltages are taken below ground, or above V or
must be turned off by setting REFBUFEN = 0V.
DD
OV , they will be clamped by internal diodes. This product can handle input
DD
Note 10: f
= 1.5MHz, I
varies proportionally with sample rate.
SMPL
REFOUT1,2,3,4
currents up to 100mA below ground, or above V or OV , without latch-up.
DD
DD
Note 11: Guaranteed by design, not subject to test.
Note 12: Parameter tested and guaranteed at OV = 1.71V and OV = 2.5V.
Note 13: t
rising edge capture.
Note 14: Temperature coefficient is calculated by dividing the maximum
change in output voltage by the specified temperature range.
Note 15: CNV is driven from a low jitter digital source, typically at OV
logic levels.
Note 4: V = 5V, OV = 2.5V, REFOUT1,2,3,4 = 4.096V, f = 1.5MHz.
SMPL
DD
DD
DD
DD
Note 5: Recommended operating conditions.
of 9.1ns allows a shift clock frequency up to 105MHz for
SCK
Note 6: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 7: Bipolar zero error is the offset voltage measured from –0.5LSB
when the output code flickers between 000 0000 0000 0000 and 111
1111 1111 1111. Full-scale bipolar error is the worst-case of –FS or +FS
DD
232014fa
7
For more information www.linear.com/LTC2320-14
LTC2320-14
ADC TIMING CHARACTERISTICS
0ꢀꢁ ꢂ ꢃꢄ
ꢅꢅ
ꢉ
ꢎꢏꢅꢐꢑ
0ꢀ2 ꢂ ꢃꢄ
ꢅꢅ
ꢆ0ꢇ
ꢆ0ꢇ
ꢉ
ꢉ
ꢅꢊꢋꢌꢍ
ꢅꢊꢋꢌꢍ
232014 ꢈ01
0ꢀꢁ ꢂ ꢃꢄ
0ꢀꢁ ꢂ ꢃꢄ
0ꢀ2 ꢂ ꢃꢄ
ꢅꢅ
ꢅꢅ
ꢅꢅ
ꢅꢅ
0ꢀ2 ꢂ ꢃꢄ
Figure 1. Voltage Levels for Timing Specifications
232014fa
8
For more information www.linear.com/LTC2320-14
LTC2320-14
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VDD = 5V, OVDD = 2.5V, REFOUT1,2,3,4
= 4.096V, fSMPL = 1.5Msps, unless otherwise noted.
Integral Nonlinearity
vs Output Code
Differential Nonlinearity
vs Output Code
DC Histogram
30
2ꢀ0
1ꢀꢁ
1ꢀ0
0ꢀꢁ
σ ꢀ 0ꢁꢂ2
2ꢀ
24
21
1ꢀ
1ꢀ
12
ꢀ
1ꢀ0
0ꢀꢁ
0
0
ꢀ0ꢁꢂ
ꢀ1ꢁ0
ꢀ1ꢁꢂ
ꢀ2ꢁ0
ꢀ0ꢁꢂ
ꢀ
3
0
ꢀ1ꢁ0
ꢀ3
ꢀ2
ꢀ1
0
1
2
3
ꢀ1ꢁ3ꢂ4
ꢀꢁ1ꢂ2
0
ꢀ1ꢁ2
1ꢀ3ꢁ4
ꢀ1ꢁ3ꢂ4
ꢀꢁ1ꢂ2
0
ꢀ1ꢁ2
1ꢀ3ꢁ4
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢁꢂ ꢄꢀꢅꢆ
ꢀꢁꢂꢃꢁꢂ ꢄꢀꢅꢆ
232014 ꢀ03
232014 ꢀ01
232014 ꢀ02
THD, Harmonics vs Input
32k Point FFT, fSMPL = 1.5Msps,
fIN = 500kHz
SNR, SINAD vs Input Frequency
(1kHz to 750kHz)
Frequency (1kHz to 750kHz)
ꢀ2ꢁ0
ꢀ1ꢁꢀ
ꢀ1ꢁꢂ
ꢀ1ꢁ4
ꢀ1ꢁ2
ꢀ1ꢁ0
ꢀ0ꢁꢀ
ꢀ0ꢁꢂ
ꢀ0ꢁ4
ꢀ0ꢁ2
ꢀ0ꢁ0
ꢀꢁ0
ꢀꢁ4
0
ꢀ20
ꢀꢁꢂ ꢃ ꢄ1ꢅ1ꢆꢇ
ꢀꢁꢂ ꢃ ꢄꢅ0ꢆ2ꢇꢈ
ꢀꢁꢂꢃꢄ ꢅ ꢆ0ꢇꢆꢈꢉ
ꢀꢁꢂꢃ ꢄ ꢅ4ꢆꢇꢈꢉ
ꢀꢁꢁ
ꢀꢁꢂ
ꢀ40
ꢀꢁ2
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁ0
ꢀ100
ꢀ104
ꢀ10ꢁ
ꢀ112
ꢀ11ꢁ
ꢀ120
ꢀꢁꢂꢃꢄ
ꢀꢁ3
ꢀꢁ0
ꢀꢁ2
ꢀ100
ꢀ120
ꢀ140
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
232014 ꢀ0ꢁ
232014 ꢀ0ꢁ
232014 ꢀ04
THD, Harmonics vs Input Common
Mode
SNR, SINAD vs Reference Voltage,
fIN = 500kHz
32k Point FFT, IMD, fSMPL =1.5Msps,
AIN+ = 490kHz, AIN– = 510kHz
ꢀ3
ꢀ2
ꢀ1
ꢀ0
ꢀꢁ
ꢀꢁ
ꢀꢀ
ꢀꢁ
ꢀꢁ
ꢀ4
ꢀ3
ꢀ2
ꢀ1
ꢀ0
ꢀꢁ
0
ꢀ20
ꢀꢁ0
ꢀꢁ4
ꢀꢁꢂ ꢃ ꢄꢅꢆꢇ
f
ꢀ ꢁ00ꢂꢃꢄ
f
ꢀ ꢁ00ꢂꢃꢄ
ꢀꢁ
ꢀꢁ
ꢀ
ꢀ 20ꢁꢂꢃꢄ 4ꢅ
ꢀꢁ
ꢆꢇꢆ
ꢀꢁꢂ
ꢀꢁꢁ
ꢀꢁꢂꢃꢄ
ꢀꢁꢂ
ꢀ40
ꢀꢁ2
ꢀꢁꢂ
ꢀꢁ0
ꢀ100
ꢀ104
ꢀ10ꢁ
ꢀ112
ꢀ11ꢁ
ꢀ120
ꢀꢁ2
ꢀꢁ3
ꢀꢁ0
ꢀ100
ꢀ120
ꢀ140
0ꢀꢁ
1
1ꢀꢁ
2
2ꢀꢁ
3
3ꢀꢁ
4
4ꢀꢁ
ꢀ
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
1ꢀꢁ 1ꢀꢁ 1ꢀꢁ 2ꢀ1 2ꢀ3 2ꢀꢁ 2ꢀꢁ 2ꢀꢁ 3ꢀ1 3ꢀ3
ꢀ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
ꢀꢁꢂꢃꢄ ꢅꢆꢇꢇꢆꢁ ꢇꢆꢈꢉ ꢊꢋꢌ
232014 ꢀ0ꢁ
232014 ꢀ0ꢁ
232014 ꢀ0ꢁ
232014fa
9
For more information www.linear.com/LTC2320-14
LTC2320-14
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VDD = 5V, OVDD = 2.5V, REFOUT1,2,3,4
= 4.096V, fSMPL = 1.5Msps, unless otherwise noted.
Step Response
(Large Signal Settling)
1ꢀ3ꢁ4
CMRR vs Input Frequency
Crosstalk vs Input Frequency
120
11ꢀ
110
10ꢀ
100
ꢀꢁ
ꢀꢁ0
ꢀꢁ1
ꢀꢁ2
ꢀꢁ3
ꢀꢁ4
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢁ
ꢀ100
ꢀ
ꢀ 4ꢁ
ꢂꢃꢂ
ꢀꢁ
122ꢀꢀ
ꢀ1ꢁ2
4ꢀ0ꢁꢂꢃ ꢄꢅꢆꢇꢈ
40ꢀꢁ
0
ꢀꢁꢂ ꢃ 1ꢄꢅꢆꢇꢈ ꢉꢊꢋꢌꢍꢎ ꢏꢌꢐꢎ
ꢀꢁꢂ ꢃ 0ꢄ
ꢀ0
ꢀ40ꢁꢂ
0
ꢀ00
1000
1ꢀ00
ꢀ20 ꢀ10
0
10 20 30 40 ꢀ0 ꢀ0 ꢀ0 ꢀ0 ꢀ0
0
100 200 300 400 ꢀ00 ꢀ00 ꢀ00
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
ꢀꢁꢂꢂꢃꢄꢅꢆ ꢂꢄꢇꢁ ꢈꢉꢊꢋ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
232014 ꢀ10
232014 ꢀ12
232014 ꢀ11
Step Response
(Fine Settling)
External Reference Supply
Current vs Sample Frequency
REF Output vs Temperature
400
3ꢀ0
300
2ꢀ0
200
1ꢀ0
100
ꢀ0
1ꢀ0
0ꢀꢁ
12ꢀ
100
ꢀꢁ
ꢀꢁꢂꢃꢄꢂꢁꢅ ꢆ 0ꢇ
ꢀꢁꢂꢃ ꢄꢁꢅ ꢆꢇꢅ
ꢀ
ꢀ 3ꢁ3ꢂ
ꢀꢀ
ꢀꢁꢂꢃꢄꢃꢅꢁꢅꢆꢇ ꢃꢂꢈ ꢉꢊꢈꢋ
0
ꢀ0
ꢀ0ꢁꢂ
ꢀ1ꢁ0
ꢀ1ꢁꢂ
ꢀ2ꢁ0
ꢀ2ꢁꢂ
ꢀ3ꢁ0
2ꢀ
ꢀ
ꢀ 4ꢁ0ꢂꢃꢄ
ꢀꢁꢂꢃꢄꢅ1ꢆ2ꢆ3ꢆ4
0
ꢀ
ꢀ ꢁꢂ
ꢀꢀ
ꢀ2ꢁ
ꢀꢁ0
ꢀꢁꢂ
ꢀ100
ꢀ12ꢁ
4ꢀ0ꢁꢂꢃ ꢄꢅꢆꢇꢈ
ꢀꢁꢂ ꢃ 1ꢄꢅꢆꢇꢈ
ꢉꢊꢋꢌꢍꢎ ꢏꢌꢐꢎ
ꢀ
ꢀ 2ꢁ04ꢂꢃ
ꢀꢁꢂꢃꢄꢅ1ꢆ2ꢆ3ꢆ4
ꢀꢁꢂ ꢃ 0ꢄ
0
0
0ꢀ3
0ꢀꢁ
0ꢀꢁ
1ꢀ2
1ꢀꢁ
ꢀꢁꢁ ꢀ3ꢁ ꢀ1ꢁ
ꢀ
2ꢀ 4ꢀ ꢀꢁ ꢀꢁ 10ꢀ 12ꢀ
ꢀ20 ꢀ10
0
10 20 30 40 ꢀ0 ꢀ0 ꢀ0 ꢀ0 ꢀ0
ꢀꢁꢂꢃꢄꢅ ꢆꢇꢅꢈꢉꢅꢊꢋꢌ ꢍꢂꢎꢏꢎꢐ
ꢀꢁꢂꢃꢁꢄꢅꢀꢆꢄꢁ ꢇꢈꢉꢊ
ꢀꢁꢂꢂꢃꢄꢅꢆ ꢂꢄꢇꢁ ꢈꢉꢊꢋ
232014 ꢀ14
232014 ꢀ1ꢁ
232014 ꢀ13
Supply Current
vs Sample Frequency
OVDD Current vs SCK Frequency,
CLOAD = 10pF
Offset Error vs Temperature
33
31
2ꢀ
2ꢀ
2ꢀ
23
21
1ꢀ
1ꢀꢁ
1
ꢀ
ꢀ
ꢀ
ꢀ
4
3
2
1
0
32
ꢀꢁꢂꢂ ꢃꢄꢅꢂꢆ ꢃꢇꢈꢁꢃꢉꢇꢊꢅꢂ ꢇꢈꢋꢁꢌ
30
ꢀꢁꢂꢃ ꢄ4 ꢀꢅꢆꢇꢃꢈ 2ꢀ
2ꢀ
24
22
20
1ꢀ
1ꢀ
14
12
0ꢀꢁ
0
ꢀꢁꢂꢃ ꢄ2ꢅꢆ ꢈ ꢉ ꢊꢋꢌꢍꢃꢎ
ꢀꢁꢂꢃꢄ1ꢅꢆ ꢈ ꢆ ꢉꢊꢋꢌꢃꢍ
ꢀ
ꢀ ꢁꢂ
ꢀꢀ
ꢀ
ꢀ 3ꢁ3ꢂ
ꢀꢀ
ꢀ0ꢁꢂ
ꢀ1
ꢀꢁꢂ ꢃꢁꢂꢄꢅ ꢀꢆꢇꢈ ꢉ4 ꢀꢊꢋꢄꢈꢌ
ꢀ1ꢁꢂ
0
0ꢀ3
0ꢀꢁ
0ꢀꢁ
1ꢀ2
1ꢀꢁ
ꢀꢁꢁ ꢀ3ꢁ ꢀ1ꢁ
ꢀ
2ꢀ 4ꢀ ꢀꢁ ꢀꢁ 10ꢀ 12ꢀ
0
ꢀ0
100
1ꢀ0
200
2ꢀ0
300
ꢀꢁꢂꢃꢄꢅ ꢆꢇꢅꢈꢉꢅꢊꢋꢌ ꢍꢂꢎꢏꢎꢐ
ꢀꢁꢂꢃꢁꢄꢅꢀꢆꢄꢁ ꢇꢈꢉꢊ
ꢀꢁꢂ ꢃꢄꢅꢆꢇꢅꢈꢁꢉ ꢊꢋꢌꢍꢎ
232014 ꢀ1ꢁ
232014 ꢀ1ꢁ
232014 ꢀ1ꢁ
232014fa
10
For more information www.linear.com/LTC2320-14
LTC2320-14
PIN FUNCTIONS
Pins that are the same for all digital I/O modes.
V (Pins 15, 21, 44, 52): Power Supply. Bypass V to
DD DD
GND with a 10µF ceramic capacitor and a 0.1µF ceramic
capacitor close to the part. The VDD pins should be shorted
together and driven from the same supply.
+
–
A
, A
(Pins 2, 1): Analog Differential Input Pins.
IN6
IN6
Full-scale range (AIN6 – AIN6–) is REFOUT3 voltage.
These pins can be driven from V to GND.
+
DD
AIN2+, AIN2– (Pins 17, 16): Analog Differential Input Pins.
GND (Pins 3, 7, 12, 18, 26, 32, 38, 46, 49): Ground.
These pins and exposed pad (Pin 53) must be tied directly
to a solid ground plane.
+
Full-scale range (AIN2 – AIN2–) is REFOUT1 voltage.
These pins can be driven from V to GND.
DD
AIN1+, AIN1– (Pins 20, 19): Analog Differential Input Pins.
+
–
A
, A
(Pins 5, 4): Analog Differential Input Pins.
IN5
IN5
+
Full-scale range (AIN1 – AIN1–) is REFOUT1 voltage.
Full-scale range (AIN5 – AIN5–) is REFOUT3 voltage.
+
These pins can be driven from V to GND.
DD
These pins can be driven from V to GND.
DD
REFOUT1 (Pin 22): Reference Buffer 1 Output. An onboard
buffer nominally outputs 4.096V to this pin. This pin is
referred to GND and should be decoupled closely to the
pin with a 10µF (X5R, 0805 size) ceramic capacitor. The
internal buffer driving this pin may be disabled by ground-
ing the REFBUFEN pin. If the buffer is disabled, an external
reference may drive this pin in the range of 1.25V to 5V.
REFOUT3 (Pin 6): Reference Buffer 3 Output. An onboard
buffer nominally outputs 4.096V to this pin. This pin is
referred to GND and should be decoupled closely to the
pin with a 10µF (X5R, 0805 size) ceramic capacitor. The
internal buffer driving this pin may be disabled by ground-
ing the REFBUFEN pin. If the buffer is disabled, an external
reference may drive this pin in the range of 1.25V to 5V.
SDR/DDR (Pin 23): Double Data Rate Input. Controls the
frequency of SCK and CLKOUT. Tie to GND for the falling
edge of SCK to shift each serial data output (Single Data
Rate, SDR). Tie to OV to shift serial data output on each
edge of SCK (DoubleDDData Rate, DDR). CLKOUT will be a
delayed version of SCK for both pin states.
REF (Pin 8): Common 4.096V reference output. Decouple
to GND with a 1μF low ESR ceramic capacitor. May be
overdriven with a single external reference to establish a
common reference for ADC cores 1 through 4.
REFOUT2 (Pin 9): Reference Buffer 2 Output. An onboard
buffer nominally outputs 4.096V to this pin. This pin is
referred to GND and should be decoupled closely to the
pin with a 10µF (X5R, 0805 size) ceramic capacitor. The
internal buffer driving this pin may be disabled by ground-
ing the REFBUFEN pin. If the buffer is disabled, an external
reference may drive this pin in the range of 1.25V to 5V.
CNV (Pin 24): Convert Input. This pin, when high, defines
the acquisition phase. When this pin is driven low, the
conversion phase is initiated and output data is clocked
out. This input must be driven at OV levels with a low
DD
jitter pulse. This pin is unaffected by the CMOS/LVDS pin.
CMOS/LVDS (Pin 25): I/O Mode Select. Ground this pin
AIN4+, AIN4– (Pins 11, 10): Analog Differential Input Pins.
to enable CMOS mode, tie to OV to enable LVDS mode.
+
Full-scale range (AIN4 – AIN4–) is REFOUT2 voltage.
DD
Float this pin to enable low power LVDS mode.
These pins can be driven from V to GND.
DD
OVDD (Pins 31, 37): I/O Interface Digital Power. The range
AIN3+, AIN3– (Pins 14, 13): Analog Differential Input Pins.
of OV is 1.71V to 2.63V. This supply is nominally set
+
Full-scale range (AIN3 – AIN3–) is REFOUT2 voltage.
DD
to the same supply as the host interface (CMOS: 1.8V or
These pins can be driven from V to GND.
DD
2.5V, LVDS: 2.5V). Bypass OV to GND (Pins 32 and 38)
DD
with 0.1µF capacitors.
232014fa
11
For more information www.linear.com/LTC2320-14
LTC2320-14
PIN FUNCTIONS
REFBUFEN (Pin 43): Reference Buffer Output Enable. Tie
SDO3 (Pin 29): CMOS Serial Data Output for ADC Channel
3. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
to V when using the internal reference. Tie to ground
DD
to disable the internal REFOUT1–4 buffers for use with
external voltage references. This pin has a 500k internal
pull-up to V .
data to be read from A on SDO3 in SDR mode, 16 SCK
DD
IN3
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH4, CH5, CH6, CH7, CH8,
CH1, CH2).
REFOUT4 (Pin 45): Reference Buffer 4 Output. An
onboard buffer nominally outputs 4.096V to this pin. This
pin is referred to GND and should be decoupled closely to
the pin with a 10µF (X5R, 0805 size) ceramic capacitor.
The internal buffer driving this pin may be disabled by
grounding the REFBUFEN pin. If the buffer is disabled,
an external reference may drive this pin in the range of
1.25V to 5V.
SDO4 (Pin 30): CMOS Serial Data Output for ADC Channel
4. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
data to be read from A on SDO4 in SDR mode, 16 SCK
IN4
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH5, CH6, CH7, CH8, CH1,
CH2, CH3).
AIN8+, AIN8– (Pins 48, 47): Analog Differential Input Pins.
+
Full-scale range (AIN8 – AIN8–) is REFOUT4 voltage.
These pins can be driven from V to GND.
DD
CLKOUT (Pin 33): Serial Data Clock Output. CLKOUT pro-
AIN7+, AIN7– (Pins 51, 50): Analog Differential Input Pins.
vides a skew-matched clock to latch the SDO output at the
+
Full-scale range (AIN7 – AIN7–) is REFOUT4 voltage.
receiver (FPGA). The logic level is determined by OV .
DD
These pins can be driven from V to GND.
DD
This pin echoes the input at SCK with a small delay.
Exposed Pad (Pin 53): Ground. Solder this pad to ground.
CLKOUTEN (Pin 34): CLKOUT can be disabled by tying
Pin 34 to OV for a small power savings. If CLKOUT is
DD
CMOS DATA OUTPUT OPTION (CMOS/LVDS = LOW)
used, ground this pin.
SDO1 (Pin 27): CMOS Serial Data Output for ADC Channel
1. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
SDO5 (Pin 35): CMOS Serial Data Output for ADC Channel
5. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
data to be read from A on SDO1 in SDR mode, 16 SCK
IN1
data to be read from A on SDO5 in SDR mode, 16 SCK
IN5
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH2, CH3, CH4, CH5, CH6,
CH7, CH8).
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH6, CH7, CH8, CH1, CH2,
CH3, CH4).
SDO2 (Pin 28): CMOS Serial Data Output for ADC Channel
2. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
SDO6 (Pin 36): CMOS Serial Data Output for ADC Channel
6. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
data to be read from A on SDO2 in SDR mode, 16 SCK
IN2
data to be read from A on SDO6 in SDR mode, 16 SCK
IN6
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH3, CH4, CH5, CH6, CH7,
CH8, CH1).
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH7, CH8, CH1, CH2, CH3,
CH4, CH5).
232014fa
12
For more information www.linear.com/LTC2320-14
LTC2320-14
PIN FUNCTIONS
SDO7 (Pin 39): CMOS Serial Data Output for ADC Channel
7. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
mode and each SCK edge in DDR mode. 32 SCK edges
are required for 14-bit conversion data to be read from
A
and A on SDOB in SDR mode, 16 SCK edges in
IN3
IN4
DDR mode. Supplying more clocks will yield data from
subsequent channels (CH5, CH6, CH7, CH8, CH1, CH2).
Terminate with a 100Ω resistor at the receiver (FPGA).
CLKOUT+, CLKOUT– (Pins 33, 34): Serial Data Clock
Output. CLKOUT provides a skew-matched clock to latch
the SDO output at the receiver. These pins echo the input
at SCK with a small delay. These pins must be differ-
entially terminated by an external 100Ω resistor at the
receiver (FPGA).
data to be read from A on SDO7 in SDR mode, 16 SCK
IN7
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH8, CH1, CH2, CH3, CH4,
CH5, CH6).
SDO8 (Pin 40): CMOS Serial Data Output for ADC Channel
8. The conversion result is shifted MSB first on each fall-
ing edge of SCK in SDR mode and each SCK edge in DDR
mode. 16 SCK edges are required for 14-bit conversion
data to be read from A on SDO8 in SDR mode, 16 SCK
+
–
IN8
SDOC , SDOC (Pins 35, 36): LVDS Serial Data Output
for ADC channels 5 and 6. The conversion result is
shifted CH5 MSB first on each falling edge of SCK in SDR
mode and each SCK edge in DDR mode. 32 SCK edges
are required for 14-bit conversion data to be read from
edges in DDR mode. Supplying more clocks will yield data
from subsequent channels (CH1, CH2, CH3, CH4, CH5,
CH6, CH7).
SCK (Pin 41): Serial Data Clock Input. The falling edge
of this clock shifts the conversion result MSB first onto
the SDO pins in SDR mode (DDR = LOW). In DDR mode
(SDR/DDR = HIGH) each edge of this clock shifts the
conversion result MSB first onto the SDO pins. The logic
A
and A on SDOA in SDR mode, 16 SCK edges in
IN5
IN6
DDR mode. Supplying more clocks will yield data from
subsequent channels (CH7, CH8, CH1, CH2, CH3, CH4).
Terminate with a 100Ω resistor at the receiver (FPGA).
level is determined by OV .
+
–
DD
SDOD , SDOD (Pins 39, 40): LVDS Serial Data Output
for ADC Channels 7 and 8. The conversion result is
shifted CH7 MSB first on each falling edge of SCK in SDR
mode and each SCK edge in DDR mode. 32 SCK edges
are required for 14-bit conversion data to be read from
DNC (Pin 42): In CMOS mode do not connect this pin.
LVDS DATA OUTPUT OPTION (CMOS/LVDS = HIGH OR
FLOAT)
A
and A on SDOA in SDR mode, 16 SCK edges in
IN7
IN8
+
–
SDOA , SDOA (Pins 27, 28): LVDS Serial Data Output
for ADC Channels 1 and 2. The conversion result is
shifted CH1 MSB first on each falling edge of SCK in SDR
mode and each SCK edge in DDR mode. 32 SCK edges
are required for 14-bit conversion data to be read from
DDR mode. Supplying more clocks will yield data from
subsequent channels (CH1, CH2, CH3, CH4, CH5, CH6).
Terminate with a 100Ω resistor at the receiver (FPGA).
+
–
SCK , SCK (Pins 41, 42): Serial Data Clock Input. The
falling edge of this clock shifts the conversion result MSB
first onto the SDO pins in SDR mode (SDR/DDR = LOW).
In DDR mode (SDR/DDR = HIGH) each edge of this clock
shifts the conversion result MSB first onto the SDO pins.
These pins must be differentially terminated by an external
100Ω resistor at the receiver (ADC).
A
and A on SDOA in SDR mode, 16 SCK edges in
IN1
IN2
DDR mode. Supplying more clocks will yield data from
subsequent channels (CH3, CH4, CH5, CH6, CH7, CH8).
Terminate with a 100Ω resistor at the receiver (FPGA).
+
–
SDOB , SDOB (Pins 29, 30): LVDS Serial Data Output
for ADC Channels 3 and 4. The conversion result is
shifted CH3 MSB first on each falling edge of SCK in SDR
232014fa
13
For more information www.linear.com/LTC2320-14
LTC2320-14
FUNCTIONAL BLOCK DIAGRAM
CMOS IO Mode
V
GND
DD
24
CNV
(15, 21, 44, 52)
(3, 7, 12, 18, 26, 32, 38, 46, 49, 53)
+
–
A
A
IN1
+
–
20
19
S/H
IN1
SDO1
SDO2
27
28
CMOS
I/O
14-BIT+ SIGN
SAR ADC
+
–
MUX
A
A
IN2
+
17
16
S/H
IN2
–
REFOUT1
×1
REF
22
+
–
A
A
IN3
+
–
14
13
S/H
IN3
SDO3
SDO4
29
30
CMOS
I/O
14-BIT+ SIGN
SAR ADC
MUX
+
–
A
A
IN4
+
11
10
S/H
IN4
–
REFOUT2
×1
REF
9
CLKOUT
SCK
41
42
33
34
CMOS
RECEIVERS
OUTPUT
CLOCK DRIVER
DNC
CꢀꢁOꢂꢃꢄN
+
SDR/DDR
23
A
A
IN5
+
5
4
–
S/H
–
IN5
SDO6
SDO6
35
36
CMOS
I/O
14-BIT+ SIGN
SAR ADC
+
–
MUX
A
A
IN6
+
2
1
S/H
IN6
–
REFOUT3
×1
REF
6
+
–
A
A
IN7
+
51
50
S/H
–
IN7
SDO7
SDO8
39
40
CMOS
I/O
14-BIT+ SIGN
SAR ADC
MUX
+
–
A
A
IN8
+
48
47
S/H
IN8
–
REFOUT4
×1
REF
45
250μA
OV (31, 37)
DD
REF
×1.7
×3.4
8
1.2V INT REF
REFBUFEN
43
25
CMOS/LVDS
232014 BDa
232014fa
14
For more information www.linear.com/LTC2320-14
LTC2320-14
FUNCTIONAL BLOCK DIAGRAM
LVDS IO Mode
V
GND
DD
24
CNV
(15, 21, 44, 52)
(3, 7, 12, 18, 26, 32, 38, 46, 49, 53)
A
A
+
–
IN1
+
–
20
19
S/H
IN1
+
SDOA
27
LVDS
I/O
14-BIT+ SIGN
SAR ADC
–
MUX
SDOA
A
A
+
–
IN2
28
+
17
16
S/H
IN2
–
REFOUT1
22
×1
REF
A
A
+
–
IN3
+
–
14
13
S/H
IN3
+
SDOB
29
LVDS
I/O
14-BIT+ SIGN
SAR ADC
–
MUX
SDOB
A
A
+
–
IN4
30
+
11
10
S/H
IN4
–
REFOUT2
9
×1
REF
+
+
–
CLKOUT
SCK
SCK
41
42
33
LVDS
RECEIVERS
OUTPUT
CLOCK DRIVER
–
CLKOUT
34
SDR/DDR
23
A
A
+
–
IN5
+
5
4
S/H
–
IN5
+
SDOC
35
36
LVDS
I/O
14-BIT+ SIGN
SAR ADC
–
SDOC
MUX
A
A
+
–
IN6
+
2
1
S/H
IN6
–
REFOUT3
×1
REF
6
A
A
+
–
IN7
+
51
50
S/H
–
IN7
+
SDOD
39
40
LVDS
I/O
14-BIT+ SIGN
SAR ADC
–
MUX
SDOD
A
A
+
–
IN8
+
48
47
S/H
IN8
–
REFOUT4
×1
REF
45
250μA
OV (31, 37)
DD
REF
×1.7
×3.4
8
1.2V INT REF
REFBUFEN
43
25
CMOS/LVDS
232014 BDb
232014fa
15
For more information www.linear.com/LTC2320-14
LTC2320-14
TIMING DIAGRAM
ꢀꢁꢂꢃꢄꢅ ꢆ
SDR Mode, CMOS (Reading 1 Channel per SDO)
ꢀꢁꢂꢃꢄꢅ ꢆꢇ1
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅꢆ
ꢀꢁꢂꢃꢄꢅꢆ
1
2
3
4
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
10 11 12 13 14 1ꢀ 1ꢀ
ꢀꢁꢂ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂ1
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 2
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
232014 ꢀꢁ01
DDR Mode, CMOS (Reading 1 Channel per SDO)
ꢀꢁꢂꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅ ꢆꢇ1
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅꢆ
ꢀꢁꢂꢃꢄꢅꢆ
1
2
3
4
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
10 11 12 13 14 1ꢀ 1ꢀ
ꢀꢁꢂ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂ1
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 2
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
232014 ꢀꢁ02
232014fa
16
For more information www.linear.com/LTC2320-14
LTC2320-14
TIMING DIAGRAM
SDR Mode, LVDS (Reading 2 Channels per SDO Pair)
ꢀꢁꢂꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅ ꢆꢇ1
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅꢆ
ꢀꢁꢂꢃꢄꢅꢆ
1
2
3
4
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
10 11 12 13 14 1ꢀ 1ꢀ 1ꢀ 1ꢀ 1ꢀ 20 21 22 23 24 2ꢀ 2ꢀ 2ꢀ 2ꢀ 2ꢀ 30 31 32
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 2
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 3
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢁ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
232014 ꢀꢁ03
DDR Mode, LVDS (Reading 2 Channels per SDO Pair)
ꢀꢁꢂꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅ ꢆꢇ1
ꢀꢁꢂꢃꢄꢅꢆ
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅꢆ
1
2
3
4
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
10 11 12 13 14 1ꢀ 1ꢀ 1ꢀ 1ꢀ 1ꢀ 20 21 22 23 24 2ꢀ 2ꢀ 2ꢀ 2ꢀ 2ꢀ 30 31 32
ꢀꢁꢂ
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 2
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 3
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢁ
ꢀꢁꢂꢃ ꢄꢅꢆꢇ
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14 ꢀ13 ꢀ12 ꢀ11 ꢀ10 ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀꢁ ꢀ4 ꢀ3 ꢀ2 ꢀ1 ꢀ0
0
ꢀ14
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ ꢆ
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
ꢀꢁꢂꢃꢃꢄꢅ 1
ꢀꢁꢂꢃꢄꢅꢆꢇꢁꢂ ꢂ
232014 ꢀꢁ04
232014fa
17
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
OVERVIEW
inputs, the transfer function spans 215 codes. When
driven by pseudo differential inputs, the transfer func-
The LTC2320-14 is a low noise, high speed 14-bit succes-
sive approximation register (SAR) ADC with differential
inputs and a wide input common mode range. Operating
from a single 3.3V or 5V supply, the LTC2320-14 has a
4V or 8V differential input range, making it ideal for
14
tion spans 2 codes.
Table 1: Code Ranges for the Analog Input Operational Modes
+
–
MODE
Span (V – V ) Min Code
Max Code
IN
IN
Fully Differential
–REFOUT to
+REFOUT
100 0000 0000 011 1111 1111
P-P
P-P
0000
1111
applications which require a wide dynamic range. The
LTC2320-14 achieves 1LSB INL typical, no missing
codes at 14 bits and 81dB SNR.
Pseudo-Differential –REFOUT/2 to
Bipolar +REFOUT/2
110 0000 0000 001 1111 1111
0000 1111
Pseudo-Differential 0 to REFOUT
Unipolar
000 0000 0000 011 1111 1111
0000
1111
The LTC2320-14 has an onboard reference buffer and
low drift (20ppm/°C max) 4.096V temperature-compen-
sated reference. The LTC2320-14 also has a high speed
SPI-compatible serial interface that supports CMOS or
LVDS. The fast 1.5Msps per channel throughput with no
latency makes the LTC2320-14 ideally suited for a wide
variety of high speed applications. The LTC2320-14 dis-
sipates only 20mW per channel. Nap and sleep modes
are also provided to reduce the power consumption
of the LTC2320-14 during inactive periods for further
power savings.
011 1111 1111 1111
011 1111 1111 1110
000 0000 0000 0001
000 0000 0000 0000
111 1111 1111 1111
1ꢇꢑꢒ ꢘ 2 ꢙ ꢎꢊꢏꢆꢃꢄ
32ꢚꢛꢜ
100 0000 0000 0001
100 0000 0000 0000
CONVERTER OPERATION
ꢍꢎꢊꢏꢆꢃꢄꢐ2
ꢍ1
ꢇꢑꢒ
0
1
ꢇꢑꢒ
ꢎꢊꢏꢆꢃꢄꢐ2
ꢍ1ꢇꢑꢒ
The LTC2320-14 operates in two phases. During the
acquisition phase, the sample capacitor is connected to
ꢀꢁꢂꢃꢄ ꢅꢆꢇꢄꢈꢉꢊ ꢋꢅꢌ
232014 ꢏ02
Figure 2. LTC2320-14 Transfer Function
+
–
the analog input pins A and A to sample the differ-
IN
IN
Analog Input
ential analog input voltage, as shown in Figure 3. A falling
edge on the CNV pin initiates a conversion. During the
conversion phase, the 14-bit CDAC is sequenced through
a successive approximation algorithm effectively com-
paring the sampled input with binary-weighted fractions
of the reference voltage (e.g., VREFOUT/2, VREFOUT/4 …
The differential inputs of the LTC2320-14 provide great
flexibility to convert a wide variety of analog signals with
no configuration required. The LTC2320-14 digitizes the
+
–
difference voltage between the A and A pins while
IN
IN
supporting a wide common mode input range. The analog
V
/32768) using a differential comparator. At the
REFOUT
input signals can have an arbitrary relationship to each
end of conversion, a CDAC output approximates the sam-
pled analog input. The ADC control logic then prepares
the 14-bit digital output code for serial transfer.
other, provided that they remain between V and GND.
DD
The LTC2320-14 can also digitize more limited classes
of analog input signals such as pseudo-differential uni-
polar/bipolar and fully differential with no configuration
required.
TRANSFER FUNCTION
The LTC2320-14 digitizes the full-scale voltage of 2 •
The analog inputs of the LTC2320-14 can be modeled
by the equivalent circuit shown in Figure 3. The back-to-
back diodes at the inputs form clamps that provide ESD
15
REFOUT into 2 levels, resulting in a 15-bit resolution
size of 250µV with REFBUF = 4.096V. The ideal trans-
fer function is shown in Figure 2. The output data is in
2’s complement format. When driven by fully differential
protection. In the acquisition phase, 10pF (C ) from
IN
the sampling capacitor in series with approximately
232014fa
18
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
wide common mode input range relaxes the accuracy
requirements of any signal conditioning circuits prior
to the analog inputs.
V
DD
C
IN
R
15Ω
ON
10pF
+
A
IN
Pseudo-Differential Bipolar Input Range
BIAS
VOLTAGE
V
The pseudo-differential bipolar configuration represents
driving one of the analog inputs at a fixed voltage, typi-
DD
C
IN
R
15Ω
ON
10pF
cally V /2, and applying a signal to the other A pin. In
REF
IN
232014 F03
–
IN
A
this case the analog input swings symmetrically around
the fixed input yielding bipolar two’s complement output
codes with an ADC span of half of full-scale. This con-
figuration is illustrated in Figure 4, and the corresponding
transfer function in Figure 5. The fixed analog input pin
Figure 3. The Equivalent Circuit for the Differential
Analog Input of the LTC2320-14
need not be set at V /2, but at some point within the
REF
15Ω (RON) from the on-resistance of the sampling
switch is connected to the input. Any unwanted signal
that is common to both inputs will be reduced by the
common mode rejection of the ADC sampler. The inputs
of the ADC core draw a small current spike while charg-
V
rails allowing the alternate input to swing symmetri-
cally around this voltage. If the input signal (A – A
DD
+
–
)
IN
IN
swings beyond REFOUT1,2,3,4/2, valid codes will be
generated by the ADC and must be clamped by the user,
if necessary.
ing the C capacitors during acquisition.
IN
Pseudo-Differential Unipolar Input Range
Single-Ended Signals
The pseudo-differential unipolar configuration represents
driving one of the analog inputs at ground and applying a
Single-ended signals can be directly digitized by the
LTC2320-14. These signals should be sensed pseudo-
differentially for improved common mode rejection. By
connecting the reference signal (e.g., ground sense) of
signal to the other A pin. In this case, the analog input
IN
swings between ground and V yielding unipolar two’s
REF
complement output codes with an ADC span of half of full-
scale. This configuration is illustrated in Figure 6, and the
corresponding transfer function in Figure 7. If the input
the main analog signal to the other A pin, any noise or
IN
disturbance common to the two signals will be rejected
by the high CMRR of the ADC. The LTC2320-14 flex-
ibility handles both pseudo-differential unipolar and
bipolar signals, with no configuration required. The
+
–
signal (A – A ) swings negative, valid codes will be
IN
IN
generated by the ADC and must be clamped by the user,
if necessary.
V
V
REF
REF
LT1819
LTC2320-14
+
25Ω
+
–
0V
0V
A
REFOUT1
IN1
IN1
10µF
1µF
V
REF
REF
220pF
10k
V
/2
REF
25Ω
+
–
V
/2
REF
–
TO CONTROL
LOGIC
(FPGA, CPLD,
DSP, ETC.)
A
SDO1
CLKOUT
SCK
10k
1µF
ONLY CHANNEL 1 SHOWN FOR CLARITY
232014 F04
Figure 4. Pseudo-Differential Bipolar Application Circuit
232014fa
19
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
ꢐꢉꢖ ꢖꢊꢉꢅ
ꢓ2ꢗꢘ ꢖꢊꢙꢚꢑꢅꢙꢅꢎꢋꢕ
1ꢈ3ꢆ3
ꢆ1ꢇ1
ꢐ
ꢍꢎ
ꢔ
ꢂ
ꢓꢐ ꢂ ꢐ
ꢕ
ꢍꢎ
ꢍꢎ
ꢂꢃ
ꢂꢃ ꢛ2
ꢄꢅꢀ
0
ꢃ
ꢄꢅꢀ
ꢛ2
ꢃ
ꢄꢅꢀ
ꢄꢅꢀ
ꢉꢊꢋꢋꢅꢉ ꢄꢅꢌꢍꢊꢎꢏ ꢐꢃꢐꢍꢑꢐꢒꢑꢅ
ꢂꢆ1ꢇ2
ꢂ1ꢈ3ꢆ4
232014 ꢀ0ꢁ
Figure 5. Pseudo-Differential Bipolar Transfer Function
V
REF
LT1818
LTC2320-14
+
V
REF
25Ω
25Ω
+
–
0V
A
REFOUT1
IN1
0V
10µF
1µF
REF
220pF
TO CONTROL
LOGIC
–
A
SDO1
CLKOUT
SCK
IN1
(FPGA, CPLD,
DSP, ETC.)
232014 F06
Figure 6. Pseudo-Differential Unipolar Application Circuit
ꢍꢆꢓ ꢓꢇꢆꢅ
ꢐ2ꢔꢕ ꢓꢇꢖꢗꢎꢅꢖꢅꢋꢈꢒ
1ꢛ3ꢙ3
ꢙ1ꢚ1
ꢍ
ꢊꢋ
ꢑ
ꢂ
ꢐꢍ ꢂ ꢍ
ꢒ
ꢊꢋ
ꢊꢋ
ꢂꢃ
ꢂꢃ ꢘ2
ꢄꢅꢀ
0
ꢃ
ꢄꢅꢀ
ꢘ2
ꢃ
ꢄꢅꢀ
ꢄꢅꢀ
ꢆꢇꢈꢈꢅꢆ ꢄꢅꢉꢊꢇꢋꢌ ꢍꢃꢍꢊꢎꢍꢏꢎꢅ
ꢂꢙ1ꢚ2
ꢂ1ꢛ3ꢙ4
232014 ꢀ0ꢁ
Figure 7. Pseudo-Differential Unipolar Transfer Function
232014fa
20
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Single-Ended-to-Differential Conversion
REFOUT1,2,3,4. The common mode input voltage can
span the entire supply range up to VDD, limited by the
input signal swing. The fully-differential configuration is
illustrated in Figure 10, with the corresponding transfer
function illustrated in Figure 11.
While single-ended signals can be directly digitized as
previously discussed, single-ended to differential conver-
sion circuits may also be used when higher dynamic range
is desired. By producing a differential signal at the inputs
of the LTC2320-14, the signal swing presented to the ADC
is maximized, thus increasing the achievable SNR.
INPUT DRIVE CIRCUITS
The LT®1819 high speed dual operational amplifier is
recommended for performing single-ended-to-differen-
tial conversions, as shown in Figure 8. In this case, the
first amplifier is configured as a unity-gain buffer and the
single-ended input signal directly drives the high imped-
ance input of this amplifier.
A low impedance source can directly drive the high imped-
ance inputs of the LTC2320-14 without gain error. A high
impedance source should be buffered to minimize set-
tling time during acquisition and to optimize the distor-
tion performance of the ADC. Minimizing settling time is
important even for DC inputs, because the ADC inputs
draw a current spike during acquisition.
Fully-Differential Inputs
For best performance, a buffer amplifier should be used to
drive the analog inputs of the LTC2320-14. The amplifier
provides low output impedance to minimize gain error
and allows for fast settling of the analog signal during
the acquisition phase. It also provides isolation between
the signal source and the ADC inputs, which draw a small
current spike during acquisition.
To achieve the best distortion performance of the
LTC2320-14, we recommend driving a fully-differential
signal through LT1819 amplifiers configured as two unity-
gain buffers, as shown in Figure 9. This circuit achieves
the full data sheet THD specification of –90dB at input
frequencies up to 500kHz. A fully-differential input sig-
nal can span the maximum full-scale of the ADC, up to
ꢀ
ꢁꢂꢃ
0ꢀ
ꢆꢇ1ꢈ1ꢉ
V
REF
LT1819
ꢀ
ꢁꢂꢃ
ꢄ
ꢅ
V
REF
+
–
0V
0ꢀ
0V
ꢀ
ꢁꢂꢃ
0ꢀ
ꢀ
ꢁꢂꢃ
ꢄ
ꢅ
V
REF
V
REF
/2
+
–
200Ω
0ꢀ
0V
232014 ꢃ0ꢉ
200Ω
232014 F08
Figure 8. Single-Ended to Differential Driver
Figure 9. LT1819 Buffering a Fully-Differential Signal Source
232014fa
21
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
V
V
REF
REF
0V
LT1819
LTC2320-14
+
25Ω
25Ω
+
–
0V
A
A
REFOUT1
IN1
10µF
1µF
REF
220pF
V
V
REF
0V
REF
+
–
0V
–
TO CONTROL
LOGIC
(FPGA, CPLD,
DSP, ETC.)
SDO1
CLKOUT
SCK
IN1
ONLY CHANNEL 1 SHOWN FOR CLARITY
232014 F10
Figure 10. Fully-Differential Application Circuit
ꢅꢋꢌ ꢌꢍꢋꢄ
ꢈ2ꢎꢏ ꢌꢍꢐꢑꢒꢄꢐꢄꢇꢓꢊ
1ꢗ3ꢕ3
ꢕ1ꢖ2
ꢅ
ꢆꢇ
ꢉ
ꢁ
ꢈꢅ
ꢁ ꢅ
ꢊ
ꢆꢇn
ꢆꢇn
ꢁꢂ
ꢁꢂ ꢔ2
ꢃꢄꢀ
0
ꢂ
ꢃꢄꢀ
ꢔ2
ꢂ
ꢃꢄꢀ
ꢃꢄꢀ
ꢁꢕ1ꢖ2
ꢁ1ꢗ3ꢕ4
232014 ꢀ11
Figure 11. Fully-Differential Transfer Function
232014fa
22
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Input Filtering
ADC REFERENCE
The noise and distortion of the buffer amplifier and signal
source must be considered since they add to the ADC
noise and distortion. Noisy input signals should be filtered
prior to the buffer amplifier input with a low bandwidth
filter to minimize noise. The simple 1-pole RC lowpass fil-
ter shown in Figure 12 is sufficient for many applications.
Internal Reference
The LTC2320-14 has an on-chip, low noise, low
drift (20ppm/°C max), temperature compensated band-
gap reference. It is internally buffered and is available
at REF (Pin 8). The reference buffer gains the internal
reference voltage to 4.096V for supply voltages V = 5V
and to 2.048V for V = 3.3V. The REF pin also drives
the four internal reference buffers with a current limited
output (250μA) so it may be easily overdriven with an
external reference in the range of 1.25V to 5V. Bypass
REF to GND with a 1μF (X5R, 0805 size) ceramic capacitor
to compensate the reference buffer and minimize noise.
The 1μF capacitor should be as close as possible to the
LTC2320-14 package to minimize wiring inductance. The
voltage on the REF pin must be externally buffered if used
for external circuitry.
DD
The sampling switch on-resistance (R ) and the sample
capacitor (C ) form a second lowpaOsNs filter that limits
DD
IN
the input bandwidth to the ADC core to 110MHz. A buffer
amplifier with a low noise density must be selected to
minimize the degradation of the SNR over this bandwidth.
High quality capacitors and resistors should be used in
the RC filters since these components can add distor-
tion. NPO and silver mica type dielectric capacitors have
excellent linearity. Carbon surface mount resistors can
generate distortion from self heating and from damage
that may occur during soldering. Metal film surface mount
resistors are much less susceptible to both problems.
SINGLE-ENDED
INPUT SIGNAL
50Ω
+
IN
LTC2320
–
IN
3.3nF
SINGLE-ENDED
TO DIFFERENTIAL
232014 F12
DRIVER
BW = 1MHz
Figure 12. Input Signal Chain
Table 2. Reference Configurations and Ranges
REFOUT1,2,3,4
PIN
DIFFERENTIAL INPUT
RANGE PIN
REFERENCE CONFIGURATION
V
REFBUFEN
5V
REF PIN
4.096V
DD
Internal Reference with Internal Buffers
5V
3.3V
5V
4.096V
4.096V
3.3V
5V
2.048V
2.048V
2.048V
Common External Reference with Internal Buffer (REF Pin
Externally Overdriven)
1.25V to 5V
1.25V to 5V
4.096V
1.25V to 3.3V
1.25V to 3.3V
1.25V to 5V
1.25V to 3.3V
1.25V to 5V
1.25V to 3.3V
1.25V to 5V
1.25V to 3.3V
3.3V
5V
3.3V
0V
External Reference with REF Buffers Disabled
3.3V
0V
2.048V
232014fa
23
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
External Reference
recommended when overdriving REFOUT. The LTC6655-5
offers the same small size, accuracy, drift and extended
temperature range as the LTC6655-4.096. By using a 5V
reference, a higher SNR can be achieved. We recommend
bypassing the LTC6655-5 with a 10μF ceramic capacitor
(X5R, 0805 size) close to each of the REFOUT1,2,3,4 pins.
If the REF pin voltage is used as a REFOUT reference when
REFBUFEN is connected to GND, it should be buffered
externally.
The internal REFOUT1,2,3,4 buffers can also be over-
driven from 1.25V to 5V with an external reference at
REFOUT1,2,3,4 as shown in Figure 13 (c). To do so,
REFBUFEN must be grounded to disable the REF buffers.
A 55k internal resistance loads the REFOUT1,2,3,4 pins
when the REF buffers are disabled. To maximize the input
signal swing and corresponding SNR, the LTC6655-5 is
ꢀ
ꢈ
3ꢉ3ꢀ ꢃꢊ ꢋꢀ
ꢁꢁ
ꢐꢄꢈ
ꢌꢌ
ꢄꢈ ꢁꢉ
13ꢆ2ꢈ
ꢌꢍꢈꢏꢎꢈꢍꢇ
ꢌꢍꢈ
ꢑꢒꢋꢔꢓꢋꢒꢎ
ꢑꢒꢋ
ꢀꢁꢂꢃꢃꢄꢄꢅ4ꢆ0ꢇꢃ
ꢈ
ꢈ
ꢉꢓꢁꢘꢋ
ꢈ
ꢕꢎ
1ꢐꢈ
ꢖꢗꢌꢎ
ꢂꢃꢄ2320ꢅ14
ꢉꢓꢁꢘꢖ
ꢀꢁꢂ2320ꢅ14
10ꢊꢋ
10ꢊꢋ
0ꢆ1ꢊꢋ
ꢌꢍꢈꢊꢎꢃ1
ꢑꢒꢋꢉꢓꢁ1
ꢑꢒꢋꢉꢓꢁ2
ꢑꢒꢋꢉꢓꢁ3
ꢑꢒꢋꢉꢓꢁ4
10ꢐꢈ
ꢌꢍꢈꢊꢎꢃ2
10ꢐꢈ
10ꢊꢋ
ꢌꢍꢈꢊꢎꢃ3
10ꢐꢈ
10ꢊꢋ
ꢌꢍꢈꢊꢎꢃ4
10ꢐꢈ
10ꢊꢋ
ꢆꢇꢁ
ꢍꢎꢌ
232014 ꢈ13a
232014 ꢋ13ꢏ
(13a) LTC2320-14 Internal Reference Circuit
(13b) LTC2320-14 with a Shared External Reference Circuit
ꢁ
ꢎꢀꢁ
ꢇꢇ
ꢏꢐꢆꢒꢑꢆꢐꢌ
ꢏꢐꢆ
1ꢅꢆ
ꢀꢁ ꢂꢃ 13ꢄ2ꢁ
ꢀꢁ ꢂꢃ 13ꢄ2ꢁ
ꢀꢁ ꢂꢃ 13ꢄ2ꢁ
ꢀꢁ ꢂꢃ 13ꢄ2ꢁ
ꢈꢂꢉꢓꢓꢀꢀꢊ4ꢄ0ꢔꢓ
ꢁ
ꢁ
ꢕꢌ
ꢃꢑꢂꢘꢆ
ꢁ
ꢃꢑꢂꢘꢖ
ꢏꢐꢆꢃꢑꢂ1
ꢖꢗꢇꢌ
10ꢅꢆ
10ꢅꢆ
10ꢅꢆ
10ꢅꢆ
0ꢄ1ꢅꢆ
0ꢄ1ꢅꢆ
0ꢄ1ꢅꢆ
0ꢄ1ꢅꢆ
ꢈꢂꢉ2320ꢊ14
ꢈꢂꢉꢓꢓꢀꢀꢊ2ꢄ04ꢙ
ꢁ
ꢁ
ꢏꢐꢆꢃꢑꢂ2
ꢏꢐꢆꢃꢑꢂ3
ꢕꢌ
ꢃꢑꢂꢘꢆ
ꢁ
ꢃꢑꢂꢘꢖ
ꢖꢗꢇꢌ
ꢈꢂꢉꢓꢓꢀꢀꢊ2ꢄꢀ
ꢁ
ꢁ
ꢕꢌ
ꢃꢑꢂꢘꢆ
ꢖꢗꢇꢌ
ꢁ
ꢃꢑꢂꢘꢖ
ꢈꢂꢉꢓꢓꢀꢀꢊ3
ꢁ
ꢁ
ꢕꢌ
ꢃꢑꢂꢘꢆ
ꢁ
ꢃꢑꢂꢘꢖ
ꢏꢐꢆꢃꢑꢂ4
ꢖꢗꢇꢌ
ꢋꢌꢇ
232014 ꢆ13ꢍ
(13c) LTC2320-14 with Different External Reference Voltages
Figure 13. Reference Connections
232014fa
24
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Internal Reference Buffer Transient Response
The REFOUT1,2,3,4 pins of the LTC2320-14 draw charge
DYNAMIC PERFORMANCE
Fast Fourier transform (FFT) techniques are used to test
the ADC’s frequency response, distortion and noise at the
rated throughput. By applying a low distortion sine wave
and analyzing the digital output using an FFT algorithm,
the ADC’s spectral content can be examined for frequen-
cies outside the fundamental. The LTC2320-14 provides
guaranteed tested limits for both AC distortion and noise
measurements.
(Q
) from the external bypass capacitors during each
CONV
conversion cycle. If the internal reference buffer is over-
driven, the external reference must provide all of this charge
with a DC current equivalent to IREF = QCONV/tCYC
.
Thus, the DC current draw of IREFOUT1,2,3,4 depends
on the sampling rate and output code. In applications
where a burst of samples is taken after idling for long
periods, as shown in Figure 14 , IREFBUF quickly goes from
approximately ~75µA to a maximum of 500µA for REFOUT
= 5V at 1.5Msps. This step in DC current draw triggers a
transient response in the external reference that must be
considered since any deviation in the voltage at REFOUT
will affect the accuracy of the output code. If an external
reference is used to overdrive REFOUT1,2,3,4, the fast
settling LTC6655 reference is recommended.
Signal-to-Noise and Distortion Ratio (SINAD)
The signal-to-noise and distortion ratio (SINAD) is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the A/D output. The output is bandlimited
to frequencies from above DC and below half the sampling
frequency. Figure 16 shows that the LTC2320-14 achieves
a typical SINAD of 80dB at a 1.5MHz sampling rate with
a 500kHz input.
CNV
Signal-to-Noise Ratio (SNR)
ꢁꢂꢃꢄ
ꢅꢄꢆꢁꢇꢂ
232014 ꢀ14
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC. Figure 16 shows
that the LTC2320-14 achieves a typical SNR of 81dB at a
1.5MHz sampling rate with a 500kHz input.
Figure 14. CNV Waveform Showing Burst Sampling
1ꢀ3ꢁ4
122ꢀꢀ
0
ꢀꢁꢂ ꢃ ꢄ1ꢅ1ꢆꢇ
ꢀꢁꢂ ꢃ ꢄꢅ0ꢆ2ꢇꢈ
ꢀ20
ꢀ40
ꢀꢁꢂꢃꢄ ꢅ ꢆ0ꢇꢆꢈꢉ
ꢀꢁꢂꢃ ꢄ ꢅ4ꢆꢇꢈꢉ
ꢀ1ꢁ2
4ꢀ0ꢁꢂꢃ ꢄꢅꢆꢇꢈ
40ꢀꢁ
ꢀꢁ0
ꢀꢁ0
0
ꢂ
ꢀꢁ ꢃ 1ꢄꢅꢆꢇꢈ ꢉꢊꢋꢌꢍꢎ ꢏꢌꢐꢎ
ꢀ100
ꢀ120
ꢀ140
ꢂ
ꢀꢁ ꢃ 0ꢄ
ꢀ40ꢁꢂ
ꢀ20 ꢀ10
0
10 20 30 40 ꢀ0 ꢀ0 ꢀ0 ꢀ0 ꢀ0
ꢀꢁꢂꢂꢃꢄꢅꢆ ꢂꢄꢇꢁ ꢈꢉꢊꢋ
232014 ꢀ1ꢁ
0
0ꢀ1 0ꢀ2 0ꢀ3 0ꢀ4 0ꢀꢁ 0ꢀꢁ 0ꢀꢁ
ꢀꢁꢂꢃꢄꢂꢅꢆꢇ ꢈꢉꢊꢋꢌ
Figure 15. Transient Response of the LTC2320-14
232014 ꢀ1ꢁ
Figure 16. 32k Point FFT of the LTC2320-14
232014fa
25
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Total Harmonic Distortion (THD)
supply voltage drops below 2V. Once the supply voltage
re-enters the nominal supply voltage range, the POR will
reinitialize the ADC. No conversions should be initiated
until 10ms after a POR event to ensure the reinitialization
period has ended. Any conversions initiated before this
time will produce invalid results.
Total harmonic distortion (THD) is the ratio of the
RMS sum of all harmonics of the input signal to the
fundamental itself. The out-of-band harmonics alias into
the frequency band between DC and half the sampling
frequency (f
/2). THD is expressed as:
SMPL
2
2
2
2
V2 + V3 + V4 + …+V
N
TIMING AND CONTROL
THD= 20log
V1
CNV Timing
where V1 is the RMS amplitude of the fundamental
The LTC2320-14 sampling and conversion is controlled
by CNV. A rising edge on CNV will start sampling and the
falling edge starts the conversion and readout process.
The conversion process is timed by the SCK input clock.
For optimum performance, CNV should be driven by a
clean low jitter signal. The Typical Application at the back
of the data sheet illustrates a recommended implemen-
tation to reduce the relatively large jitter from an FPGA
CNV pulse source. Note the low jitter input clock times
the falling edge of the CNV signal. The rising edge jitter
of CNV is much less critical to performance. The typical
pulse width of the CNV signal is 30ns with < 1.5ns rise
and fall times at a 1.5Msps conversion rate.
frequency and V2 through V are the amplitudes of the
N
second through Nth harmonics.
POWER CONSIDERATIONS
The LTC2320-14 requires two power supplies: the 3.3V
to 5V power supply (VDD), and the digital input/output
interface power supply (OV ). The flexible OV supply
DD
DD
allows the LTC2320-14 to communicate with any digital
logic operating between 1.8V and 2.5V. When using LVDS
I/O, the OV supply must be set to 2.5V.
DD
Power Supply Sequencing
The LTC2320-14 does not have any specific power sup-
ply sequencing requirements. Care should be taken to
adhere to the maximum voltage relationships described in
the Absolute Maximum Ratings section. The LTC2320-14
has a power-on-reset (POR) circuit that will reset the
LTC2320-14 at initial power-up or whenever the power
SCK Serial Data Clock Input
In SDR mode (SDR/DDR Pin 23 = GND), the falling edge
of this clock shifts the conversion result MSB first onto
the SDO pins. A 100MHz external clock must be applied at
the SCK pin to achieve 1.5Msps throughput using all eight
SDO outputs. In DDR mode (SDR/DDR Pin 23 = OV ),
DD
33
31
2ꢀ
each input edge of SCK shifts the conversion result MSB
first onto the SDO pins. A 50MHz external clock must be
applied at the SCK pin to achieve 1.5Msps throughput
using all eight SDO1 through SDO8 outputs.
ꢀ
ꢀ ꢁꢂ
ꢀꢀ
2ꢀ
2ꢀ
23
21
1ꢀ
CLKOUT Serial Data Clock Output
ꢀ
ꢀ 3ꢁ3ꢂ
ꢀꢀ
The CLKOUT output provides a skew-matched clock to
latch the SDO output at the receiver. The timing skew
of the CLKOUT and SDO outputs are matched. For high
throughput applications, using CLKOUT instead of SCK to
capture the SDO output eases timing requirements at the
receiver. For low throughput speed applications, CLKOUT
0
0ꢀ3
0ꢀꢁ
0ꢀꢁ
1ꢀ2
1ꢀꢁ
ꢀꢁꢂꢃꢄꢅ ꢆꢇꢅꢈꢉꢅꢊꢋꢌ ꢍꢂꢎꢏꢎꢐ
232014 ꢀ1ꢁ
can be disabled by tying Pin 34 to OV .
Figure 17. Power Supply Current of the LTC2320-14
Versus Sampling Rate
DD
232014fa
26
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Nap/Sleep Modes
conversion result MSB first on the SDO pins. CLKOUT
provides a skew-matched clock to latch the SDO output
at the receiver. The timing skew of the CLKOUT and SDO
outputs are matched. For high throughput applications,
using CLKOUT instead of SCK to capture the SDO output
eases timing requirements at the receiver. In CMOS mode,
use the SDO1 – SDO8, and CLKOUT pins as outputs. Use
Nap mode is a method to save power without sacrificing
power-up delays for subsequent conversions. Sleep mode
has substantial power savings, but a power-up delay is
incurred to allow the reference and power systems to
become valid. To enter nap mode on the LTC2320-14,
the SCK signal must be held high or low and a series
of two CNV pulses must be applied. This is the case for
both CMOS and LVDS modes. The second rising edge of
CNV initiates the nap state. The nap state will persist until
either a single rising edge of SCK is applied, or further
CNV pulses are applied. The SCK rising edge will put the
LTC2320-14 back into the operational (full-power) state.
When in nap mode, two additional pulses will put the
LTC2320-14 in sleep mode. When configured for CMOS
I/O operation, a single rising edge of SCK can return the
LTC2320-14 into operational mode. A 10ms delay is nec-
essary after exiting sleep mode to allow the reference buf-
fer to recharge the external filter capacitor. In LVDS mode,
exit sleep mode by supplying a fifth CNV pulse. The fifth
pulse will return the LTC2320-14 to operational mode,
and further SCK pulses will keep the part from re-entering
nap and sleep modes. The fifth SCK pulse also works in
CMOS mode as a method to exit sleep. In the absence of
SCK pulses, repetitive CNV pulses will cycle the LTC2320-
14 between operational, nap and sleep modes indefinitely.
+
the SCK pin as an input. In LVDS mode, use the SDOA /
–
+
–
+
–
SDOA through SDOD /SDOD and CLKOUT /CLKOUT
pins as differential outputs. Each LVDS lane yields two
channels worth of data: SDOA yields CH1 and CH2 data,
SDOB yields CH3 and CH4 data, SDOC yields CH5 and
CH6 data and SDOD yields CH7 and CH8 data. These pins
must be differentially terminated by an external 100Ω
+
–
resistor at the receiver (FPGA). The SCK /SCK pins are
differential inputs and must be terminated differentially by
an external 100Ω resistor at the receiver(ADC).
SDR/DDR Modes
The LTC2320-14 has an SDR (single data rate) and DDR
(double data rate) mode for reading conversion data from
the SDO pins. In both modes, CLKOUT is a delayed ver-
sion of SCK. In SDR mode, each negative edge of SCK
shifts the conversion data out the SDO pins. In DDR
mode, each edge of the SCK input shifts the conversion
data out. In DDR mode, the required SCK frequency is half
of what is required in SDR mode. Tie SDR/DDR to ground
RefertothetimingdiagramsinFigure18,Figure19,Figure20
and Figure 21 for more detailed timing information about
sleep and nap modes.
to configure for SDR mode and to OV for DDR mode.
DD
The CLKOUT signal is a delayed version of the SCK input
and is phase aligned with the SDO data. In SDR mode, the
SDO transitions on the falling edge of CLKOUT as illus-
trated in Figure 21. We recommend using the rising edge
of CLKOUT to latch the SDO data into the FPGA register
in SDR mode. In DDR mode, The SDO transitions on each
input edge of SCK. We recommend using the CLKOUT ris-
ing and falling edges to latch the SDO data into the FPGA
registers in DDR mode. Since CLKOUT and SDO data is
phase aligned, the SDO signals will need to be digitally
delayed in the FPGA to provide adequate setup and hold
timing margins in DDR mode.
DIGITAL INTERFACE
The LTC2320-14 features a serial digital interface that
is simple and straightforward to use. The flexible OV
DD
supply allows the LTC2320-14 to communicate with any
digital logic operating between 1.8V and 2.5V. In addi-
tion to a standard CMOS SPI interface, the LTC2320-14
provides an optional LVDS SPI interface to support low
noise digital design. The CMOS /LVDS pin is used to select
the digital interface mode. The SCK input clock shifts the
232014fa
27
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
CNV
1
2
ꢒꢏꢃ ꢈꢄꢉꢆ
ꢀꢁꢂꢂ ꢃꢄꢅꢆꢇ ꢈꢄꢉꢆ
ꢊꢋꢌ
ꢍꢄꢂꢉ ꢊꢎꢏꢎꢐꢋ ꢍꢐꢑꢍ ꢄꢇ ꢂꢄꢅ
ꢕ
ꢅꢏꢌꢆ ꢄꢒ 1ꢊꢎ ꢊꢋꢌ ꢆꢉꢑꢆ
ꢊꢉꢄ1 ꢓ ꢔ
ꢕ
232014 ꢀ1ꢔ
Figure 18. CMOS and LVDS Mode NAP and WAKE Using SCK
ꢇꢆꢀꢄꢁꢎ
ꢇꢆꢏꢄꢍꢆꢇꢐ
ꢇꢆꢀꢄꢁꢎ1 ꢑ 4
4ꢊ0ꢋꢌꢍ
4ꢊ0ꢋꢌꢍ
ꢛ
ꢅꢕꢓꢆ
CNV
1
2
3
4
ꢘꢕꢃ ꢈꢄꢉꢆ
ꢒꢂꢆꢆꢃ ꢈꢄꢉꢆ
ꢀꢁꢂꢂ ꢃꢄꢅꢆꢇ ꢈꢄꢉꢆ
ꢒꢏꢓ
ꢔꢄꢂꢉ ꢒꢎꢕꢎꢖꢏ ꢔꢖꢗꢔ ꢄꢇ ꢂꢄꢅ
ꢅꢕꢓꢆ ꢄꢘ 1ꢒꢎ ꢒꢏꢓ ꢆꢉꢗꢆ
ꢒꢉꢄ1 ꢑ ꢙ
ꢚ
ꢚ
ꢚ
ꢚ
232014 ꢀ1ꢋ
Figure 19. CMOS Mode SLEEP and WAKE Using SCK
ꢅꢆꢇꢈꢉꢊ
ꢅꢆꢋꢈꢄꢆꢅꢌ
ꢅꢆꢇꢈꢉꢊ1 ꢛ 4
4ꢁ0ꢂꢃꢄ
4ꢁ0ꢂꢃꢄ
ꢚ
ꢕꢒꢎꢆ
ꢕꢒꢎꢆ ꢈꢖ ꢀꢊꢏ
CNV ꢆꢑꢔꢆ
CNV
1
2
3
4
ꢀ
ꢖꢒꢗ ꢘꢈꢑꢆ
ꢍꢐꢆꢆꢗ ꢘꢈꢑꢆ
ꢇꢉꢐꢐ ꢗꢈꢕꢆꢅ ꢘꢈꢑꢆ
ꢍꢋꢎ
ꢏꢈꢐꢑ ꢍꢊꢒꢊꢓꢋ ꢏꢓꢔꢏ ꢈꢅ ꢐꢈꢕ
ꢍꢑꢈ1 ꢛ ꢜ
ꢙ
ꢙ
ꢙ
ꢙ
ꢙ
232014 ꢇ20
Figure 20. LVDS and CMOS Mode SLEEP and WAKE Using CNV
232014fa
28
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
SDR MODE TIMING
DDR MODE TIMING
ꢀ
ꢀ
ꢀꢁꢀ
ꢀꢁꢀ
ꢀ
ꢀ
ꢀ
ꢀꢁꢂꢃꢄꢅꢆ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀ
ꢀ
ꢀ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢄꢅꢆ
ꢀ
ꢀꢁꢂꢃꢂꢄꢅꢆ
ꢀ
ꢀꢁꢂꢃꢂꢄꢅꢆ
CNV
CNV
ꢀ
ꢀ
ꢀꢁꢂꢃ
ꢀ
ꢀꢁꢂ
ꢀꢁꢂꢃ
ꢀ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
1
2
3
14
1ꢀ
1ꢀ
1
2
3
14
1ꢀ
1ꢀ
ꢀ
ꢀꢁꢂꢃ
ꢀ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢄꢅ
ꢀꢁꢂꢃꢄꢅ
1
2
3
14
1ꢀ
1ꢀ
1
2
3
14
1ꢀ
1ꢀ
ꢀ
ꢀꢁꢂꢃꢂꢄꢃꢅꢆꢇ
ꢀ
ꢀꢁꢂꢃꢂꢄꢃꢅꢆꢇ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀꢁꢂꢃꢄꢀꢅꢃ
ꢀꢁꢂꢃꢄꢀꢅꢆ
ꢀꢁꢂꢃꢄꢀꢅꢆ
ꢀ
ꢀ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃꢄꢀꢅꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂꢃ
ꢀꢁꢂ
ꢀ1ꢁ
ꢀ14
ꢀ13
ꢀ2
ꢀ1
ꢀ0 ꢀ1ꢁ
ꢀꢁꢂ
ꢀ1ꢁ
ꢀ14
ꢀ13
ꢀ2
ꢀ1
ꢀ0 ꢀ1ꢁ
232014 21
Figure 21. LTC2320-14 Timing Diagram
232014fa
29
For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
Multiple Data Lanes
a sequential circular manner. For example, the first conver-
sion result on SDO1 corresponds to analog input channel 1,
followed by the conversion results for channels 2 through
8. The data output on SDO1 then wraps back to channel
1 and this pattern repeats indefinitely. Other SDO lanes
follow a similar circular pattern except the first conversion
result presented on each lane corresponds to its associated
analog input channel.
The LTC2320-14 has up to eight SDO data lanes in CMOS
mode and four SDO lanes in LVDS mode. In CMOS mode,
the number of possible data lanes range from eight
(SDO1 – SDO8), four (SDO1, SDO3, SDO5 and SDO7), two
(SDO1 and SDO5) and one (SDO1). Generally, the more
data lanes used, the lower the required SCK frequency.
When using less than eight lanes in CMOS mode, there is a
limit on the maximum possible conversion frequency (see
Table 3). Each SDO pin will hold the MSB of the conversion
data. In DDR mode you can use a SCK frequency half of
SDR mode. See Table 3 for examples of various possibili-
ties and the resulting SCK frequency required.
Applications that cannot accommodate the full eight lanes
of serial data may employ fewer lanes without reconfigur-
ing the LTC2320-14. For example, capturing the first two
conversion results (32 SCK cycles total in SDR mode and
32 SCK edges in DDR mode) from SDO1, SDO3, SDO5, and
SDO7 provides data for analog input channels 1 and 2, 3
and 4, 5 and 6, and 7 and 8, respectively, using four output
lanes. Similarly, capturing the first four conversion results
(64 SCK cycles total in SDR mode and 64 SCK edges in
DDR mode) from SDO1 and SDO5 provides data for ana-
log input channels 1 to 4 and 5 to 8, respectively, using
two output lanes. If only one lane can be accommodated,
capturing the first eight conversion results (128 SCK cycles
total in SDR mode and 128 SCK edges in DDR mode)
from SDO1 provides data for all analog input channels.
Generally, the more data lanes used, the lower the required
SCK frequency. When using less than eight lanes in CMOS
mode, there is a limit on the maximum possible conversion
Multiple Data Lanes
The LTC2320-14 has up to eight serial data output data
lanes in CMOS mode and four serial data output lane pairs
in LVDS mode. The data on each lane consists of 14-bit
conversion results presented MSB first.
CMOS
In CMOS mode, the number of possible data lanes range
from eight (SDO1 – SDO8), four (SDO1, SDO3, SDO5 and
SDO7), two (SDO1 and SDO5) and one (SDO1). As sug-
gested in the CMOS Timing Diagrams, each SDO lane out-
puts the conversion results for all analog input channels in
2.5V
2.5V
LTC2320-14
FPGA OR DSP
LTC2320-14
FPGA OR DSP
OV
DD
OV
DD
+
–
+
–
+
–
+
–
SCK
SCK
SCK
SCK
100Ω
100Ω
100Ω
+
–
+
–
+
–
SDOD
SDOD
SDOD
SDOD
+
–
+
–
+
–
SDOC
SDOC
SDOC
SDOC
100Ω
100Ω
100Ω
100Ω
2.5V
2.5V
CMOS/LVDS
CMOS/LVDS
+
–
+
–
+
–
+
–
CLKOUT
CLKOUT
CLKOUT
CLKOUT
100Ω
100Ω
+
–
+
–
+
–
SDOB
SDOB
SDOB
SDOB
+
–
+
–
+
–
+
–
SDOA
SDOA
SDOA
SDOA
RETIMING
FLIP-FLOP
RETIMING
FLIP-FLOP
CNV
CNV
232014 F22
232014 F23
Figure 22. LTC2320-14 Using the LVDS Interface
Figure 23. LTC2320-14 Using the LVDS Interface with One Lane
232014fa
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For more information www.linear.com/LTC2320-14
LTC2320-14
APPLICATIONS INFORMATION
frequency. See Table 3 for examples of various possibilities
and the resulting SCK frequency required.
and 128 SCK edges in DDR mode) from SDOA provides
data for all analog input channels. Generally, the more
data lanes used, the lower the required SCK frequency.
When using less than four lanes in LVDS mode, there is
a limit on the maximum possible conversion frequency.
See Table 3 for examples of various possibilities and the
resulting SCK frequency required.
LVDS
In LVDS mode, the number of possible data lane pairs
range from four (SDOA – SDOD), two (SDOA and SDOC)
and one (SDOA). As suggested in the LVDS Timing
Diagrams, each SDO lane pair outputs the conversion
results for all analog input channels in a sequential cir-
cular manner. For example, the first conversion result on
SDOA corresponds to analog input channel pair 1 and 2,
followed by the conversion results for channels 3 through
8. The data output on SDOA then wraps back to channel
1 and this pattern repeats indefinitely. Other SDO lanes
follow a similar circular pattern except the first conversion
result presented on each lane corresponds to its associ-
ated analog input channel pairs (SDOA: analog inputs 1
and 2, SDOB: analog inputs 3 and 4, SDOC: analog inputs
5 and 6 and SDOD: analog inputs 7 and 8).
BOARD LAYOUT
To obtain the best performance from the LTC2320-14,
a printed circuit board is recommended. Layout for the
printed circuit board (PCB) should ensure the digital and
analog signal lines are separated as much as possible.
In particular, care should be taken not to run any digital
clocks or signals adjacent to analog signals or underneath
the ADC.
Supply bypass capacitors should be placed as close as
possible to the supply pins. Low impedance common
returns for these bypass capacitors are essential to the
low noise operation of the ADC. A single solid ground
plane is recommended for this purpose. When possible,
screen the analog input traces using ground.
Applications that cannot accommodate the full four lanes
of serial data may employ fewer lanes without reconfigur-
ing the LTC2320-14. For example, capturing the first four
conversion results (64 SCK cycles total in SDR mode
and 64 SCK edges in DDR mode) from SDOA and SDOC
provides data for analog input channels 1 through 4, and
5 through 8, respectively, using two output lanes. If only
one lane can be accommodated, capturing the first eight
conversion results (128 SCK cycles total in SDR mode
Recommended Layout
For a detailed look at the reference design for this con-
verter, including schematics and PCB layout, please refer
to DC2395A, the evaluation kit for the LTC2320-14.
Table 3. Conversion Frequency for Various I/O Modes
CONVERSION
FREQUENCY
(Msps/CH)
CMOS/
I/O MODE LVDS PIN
SDR/
DDR PIN
SDO1 – 8
LANES
SDOA – D
LANES
SCK FREQ
(MHz)
CLKOUT FREQ
(MHz)
SCK
CYCLES
OV
DD
GND (SDR) SDO1 – SDO8
OV (DDR) SDO1 – SDO8
DD
100
50
100
50
16
8
1.5
1.5
GND
CMOS
1.8V to 2.5V
2.5V
SDO1, SDO3,
SDO5, SDO7
SDO1
(CMOS)
OV (DDR)
50
50
16
1.25
DD
GND (SDR)
GND (SDR)
100
200
100
150
300
100
200
100
150
300
128
32
16
32
128
0.5
1.5
1.5
1.4
1.0
SDOA – SDOD
SDOA – SDOD
SDOA, SDOC
SDOA
OV (DDR)
OV
DD
DD
LVDS
(LVDS)
OV (DDR)
DD
GND (SDR)
Notes: Conversion Period (SDR) = t
Conversion Period (DDR) = t
+ t
+ t
+ (128/(Lanes • f ))
+ (64/(Lanes • f ))
SCK
CNV_MIN
CONV_MAX SCK
CNV_MIN
CONV_MAX
Conversion Frequency = 1/Conversion Period
SCK Cycles (SDR) = 128/Lanes
SCK Cycles (DDR) = 64/Lanes
232014fa
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LTC2320-14
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC2320-14#packaging for the most recent package drawings.
UKG Package
52-Lead Plastic QFN (7mm × 8mm)
(Reference LTC DWG # 05-08-1729 Rev Ø)
ꢀꢁꢞ0 ±0ꢁ0ꢞ
ꢟꢁ10 ±0ꢁ0ꢞ
ꢞꢁꢞ0 ꢌꢆꢗ
ꢂ2 ꢃꢄꢅꢆꢃꢇ
0ꢁꢀ0 ±0ꢁ0ꢞ
ꢟꢁ4ꢞ ±0ꢁ0ꢞ
ꢟꢁꢞ0 ꢌꢆꢗ
ꢂ2 ꢃꢄꢅꢆꢃꢇ
ꢀꢁ10 ±0ꢁ0ꢞ ꢣꢁꢞ0 ±0ꢁ0ꢞ
ꢞꢁ41 ±0ꢁ0ꢞ
ꢒꢍꢑꢓꢍꢏꢆ ꢉꢔꢊꢕꢄꢈꢆ
0ꢁ2ꢞ ±0ꢁ0ꢞ
0ꢁꢞ0 ꢙꢃꢑ
ꢌꢆꢑꢉꢖꢖꢆꢈꢅꢆꢅ ꢃꢉꢕꢅꢆꢌ ꢒꢍꢅ ꢒꢄꢊꢑꢚ ꢍꢈꢅ ꢅꢄꢖꢆꢈꢃꢄꢉꢈꢃ
ꢍꢒꢒꢕꢝ ꢃꢉꢕꢅꢆꢌ ꢖꢍꢃꢓ ꢊꢉ ꢍꢌꢆꢍꢃ ꢊꢚꢍꢊ ꢍꢌꢆ ꢈꢉꢊ ꢃꢉꢕꢅꢆꢌꢆꢅ
ꢞꢁꢞ0 ꢌꢆꢗ
ꢂ2 ꢃꢄꢅꢆꢃꢇ
0ꢁꢀꢞ ±0ꢁ0ꢞ
ꢀꢁ00 ±0ꢁ10
ꢂ2 ꢃꢄꢅꢆꢃꢇ
ꢌ ꢠ 0ꢁ11ꢞ
ꢊꢝꢒ
0ꢁ00 ꢤ 0ꢁ0ꢞ
ꢞ1
ꢞ2
0ꢁ40 ±0ꢁ10
ꢒꢄꢈ 1 ꢊꢉꢒ ꢖꢍꢌꢓ
ꢂꢃꢆꢆ ꢈꢉꢊꢆ ꢟꢇ
1
2
ꢒꢄꢈ 1 ꢈꢉꢊꢑꢚ
ꢌ ꢠ 0ꢁ30 ꢊꢝꢒ ꢉꢌ
0ꢁ3ꢞ × 4ꢞ°ꢑ
ꢑꢚꢍꢖꢗꢆꢌ
ꢟꢁ4ꢞ ±0ꢁ10
ꢣꢁ00 ±0ꢁ10
ꢂ2 ꢃꢄꢅꢆꢃꢇ
ꢟꢁꢞ0 ꢌꢆꢗ
ꢂ2 ꢃꢄꢅꢆꢃꢇ
ꢞꢁ41 ±0ꢁ10
ꢂꢔꢓꢏꢞ2ꢇ ꢥꢗꢈ ꢌꢆꢡ
ꢦ 030ꢟ
ꢌ ꢠ 0ꢁ10
ꢊꢝꢒ
0ꢁ2ꢞ ±0ꢁ0ꢞ
0ꢁꢞ0 ꢙꢃꢑ
ꢊꢉꢒ ꢡꢄꢆꢎ
0ꢁ200 ꢌꢆꢗ
0ꢁ00 ꢤ 0ꢁ0ꢞ
ꢙꢉꢊꢊꢉꢖ ꢡꢄꢆꢎꢢꢆꢘꢒꢉꢃꢆꢅ ꢒꢍꢅ
0ꢁꢀꢞ ±0ꢁ0ꢞ
232014fa
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LTC2320-14
REVISION HISTORY
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DATE
DESCRIPTION
PAGE NUMBER
A
01/18 Corrected no latency operation.
18, 25
232014fa
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
33
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
LTC2320-14
TYPICAL APPLICATION
Low Jitter Clock Timing with RF Sine Generator Using Clock Squaring/Level-Shifting Circuit and Retiming Flip-Flop
V
CC
NC7SVUO4P5X
0.1µF
1k
MASTER_CLOCK
V
CC
50Ω
1k
D
ꢁRꢂ
NC7SV74K8X
CONV
ꢃ
CONTROL
LOGIC
(FPGA, CPLD,
DSP, ETC.)
CꢀR
CONV ENABLE
CNV
LTC2320-14
SCK
10Ω
10Ω
CLKOUT
GND
GND
CMOS/LVDS
SDR/DDR
SDO1 – 8
232014 TA02
NC7SVU04P5X (× 9)
RELATED PARTS
PART NUMBER
ADCs
DESCRIPTION
COMMENTS
LTC2320-16/LTC2320-12 16-/12-Bit, Octal 1.5Msps/CH, Simultaneous
Sampling ADCs
3.3V/5V Supply, 20mW/Ch, 20ppm°C Max Internal Reference, Flexible
Inputs, 7mm × 8mm QFN Package
LTC2310-16/LTC2310-14/ 16-/14-/12-Bit, Differential Input ADC with Wide
3.3V/5V Supply, Single-Channel, 35mW, 20ppm/°C Max Internal
Reference, Flexible Inputs, 16-Lead MSO Package
LTC2310-12
Input Common Mode
LTC2321-16/LTC2321-14/ Dual 16-/14-/12-Bit, 2Msps, Simultaneous
LTC2321-12 Sampling ADCs
3.3V/5V Supply, 33mW/Ch, 20ppm°C Max Internal Reference,
Flexible Inputs, 4mm × 5mm QFN-28 Package
LTC2324-16/LTC2324-14/ Quad 16-/14-/12-Bit, 2Msps/Channel, Simultaneous 3.3V/5V Supply, Single-Channel, 40mW, 20ppm/°C Max Internal
LTC2324-12
Sampling ADCs
Reference, Flexible Inputs, 52-Lead QFN Package
LTC2380-16/LTC2378-16/ 16-Bit, 2Msps/1Msps/500ksps/250ksps Serial,
LTC2377-16/LTC2376-16 Low Power ADC
2.5V Supply, Differential Input, 96.2dB SNR, 5V Input Range, DGC,
Pin-Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
DACs
LTC2632
Dual 12-/10-/8-Bit, SPI V
Reference
DACs with Internal
DACs with External
2.7V to 5.5V Supply Range, 10ppm/°C Reference, External REF Mode,
Rail-to-Rail Output, 8-Pin ThinSOT™ Package
OUT
LTC2602/LTC2612/
LTC2622
Dual 16-/14-/12-Bit SPI V
Reference
300μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, 8-Lead
MSOP Package
OUT
References
LTC6655
Precision Low Drift, Low Noise Buffered Reference 5V/4.096V/3.3V/3V/2.5V/2.048V/1.25V, 2ppm/°C, 0.25ppm
Peak-to-Peak Noise, MSOP-8 Package
LTC6652
Precision Low Drift, Low Noise Buffered Reference 5V/4.096V/3.3V/3V/2.5V/2.048V/1.25V, 5ppm/°C, 2.1ppm
Peak-to-Peak Noise, MSOP-8 Package
Amplifiers
LT1818/LT1819
400MHz, 2500V/µs, 9mA Single/Dual Operational
Amplifiers
–85dBc Distortion at 5MHz, 6nV/√Hz Input Noise Voltage, 9mA Supply
Current, Unity-Gain Stable
LT1806
LT6200
325MHz, Single, Rail-to-Rail Input and Output, Low –80dBc Distortion at 5MHz, 3.5nV/√Hz Input Noise Voltage,
Distortion, Low Noise Precision Op Amps 9mA Supply Current, Unity-Gain Stable
165MHz, Rail-to-Rail Input and Output, 0.95nV/√Hz Low Noise, Low Distortion, Unity-Gain Stable
Low Noise, Op Amp Family
232014fa
LT 0118 REV A • PRINTED IN USA
www.linear.com/LTC2320-14
34
ANALOG DEVICES, INC. 2018
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