LTC2462 [Linear]

Ultra-Tiny, 16-Bit ΔΣ ADCs with 10ppm/°C Max Precision Reference; 超纤巧, 16位ΔΣ ADC,具有10ppm的/ ° C(最大值)精密基准
LTC2462
型号: LTC2462
厂家: Linear    Linear
描述:

Ultra-Tiny, 16-Bit ΔΣ ADCs with 10ppm/°C Max Precision Reference
超纤巧, 16位ΔΣ ADC,具有10ppm的/ ° C(最大值)精密基准

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中文:  中文翻译
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LTC2460/LTC2462  
Ultra-Tiny, 16-Bit ΔΣ ADCs  
with 10ppm/°C Max  
Precision Reference  
DESCRIPTION  
FEATURES  
The LTC®2460/LTC2462 are ultra tiny, 16-Bit analog-to-  
digital converters with an integrated precision reference.  
They use a single 2.7V to 5.5V supply and communicate  
through an SPI Interface. The LTC2460 is single-ended  
with a 0V to VREF input range and the LTC2462 is dif-  
ferential with a VREF input range. Both ADC’s include  
a 1.25V integrated reference with 2ppm/°C drift per-  
formance and 0.1% initial accuracy. The converters are  
available in a 12-pin DFN 3mm × 3mm package or an  
MSOP-12 package. They include an integrated oscillator  
and perform conversions with no latency for multiplexed  
applications. TheLTC2460/LTC2462includeaproprietary  
input sampling scheme that reduces the average input  
current several orders of magnitude when compared to  
conventional delta sigma converters.  
n
16-Bit Resolution, No Missing Codes  
n
Internal Reference, High Accuracy 10ppm/°C (Max)  
n
Single-Ended (LTC2460) or Differential (LTC2462)  
n
2LSB Offset Error  
0.01% Gain Error  
60 Conversions Per Second  
n
n
n
Single Conversion Settling Time for Multiplexed  
Applications  
n
Single-Cycle Operation with Auto Shutdown  
n
1.5mA Supply Current  
2μA (Max) Sleep Current  
n
n
Internal Oscillator—No External Components  
Required  
SPI Interface  
Ultra-Tiny 12-Lead 3mm × 3mm DFN and MSOP  
Packages  
n
n
Following a single conversion, the LTC2460/LTC2462  
automatically power down the converter and can also be  
configured to power down the reference. When both the  
ADC and reference are powered down, the supply current  
is reduced to 200nA.  
APPLICATIONS  
n
System Monitoring  
n
Environmental Monitoring  
n
Direct Temperature Measurements  
The LTC2460/LTC2462 can sample at 60 conversions per  
second, and due to the very large oversampling ratio,  
have extremely relaxed antialiasing requirements. Both  
includecontinuousinternaloffsetandfullscalecalibration  
algorithmswhicharetransparenttotheuser, ensuringac-  
curacy over time and the operating temperature range.  
n
Instrumentation  
n
Industrial Process Control  
n
Data Acquisition  
n
Embedded ADC Upgrades  
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.  
All other trademarks are the property of their respective owners.  
Protected by U.S. Patents, including 6208279, 6411242, 7088280, 7164378.  
TYPICAL APPLICATION  
VREF vs Temperature  
1.2520  
2.7V TO 5.5V  
1.2515  
1.2510  
1.2505  
1.2500  
1.2495  
1.2490  
1.2485  
1.2480  
0.1μF  
0.1μF  
COMP  
0.1μF  
10μF  
0.1μF  
10k  
REFOUT  
V
CC  
+
IN  
SCK  
10k  
10k  
SPI  
INTERFACE  
LTC2462  
SDO  
IN  
CS  
0.1μF  
REF  
GND  
R
24602 TA01a  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
24602 TA01b  
24602f  
1
LTC2460/LTC2462  
ABSOLUTE MAXIMUM RATINGS  
(Notes 1, 2)  
Supply Voltage (V ) ................................... –0.3V to 6V  
Storage Temperature Range................... –65°C to 150°C  
Operating Temperature Range  
CC  
Analog Input Voltage  
+
(IN , IN , IN, REF ,  
LTC2460C/LTC2462C ............................... 0°C to 70°C  
LTC2460I/LTC2462I.............................. –40°C to 85°C  
COMP, REFOUT)............................ –0.3V to (V + 0.3V)  
CC  
Digital Voltage  
(V , V , V , V )................. –0.3V to (V + 0.3V)  
SDI SDO SCK CS  
CC  
PIN CONFIGURATION  
LTC2462  
LTC2462  
TOP VIEW  
TOP VIEW  
1
2
3
4
5
6
V
12  
CC  
REFOUT  
COMP  
CS  
1
2
3
4
5
6
REFOUT  
COMP  
CS  
12 V  
CC  
11 GND  
11 GND  
IN  
IN  
10  
9
10 IN  
+
+
SDI  
SDI  
SCK  
SDO  
9
8
7
IN  
REF  
8
REF  
GND  
SCK  
7
GND  
SDO  
MS PACKAGE  
DD PACKAGE  
12-LEAD (3mm s 3mm) PLASTIC DFN  
= 125°C, θ = 43°C/W  
12-LEAD PLASTIC MSOP  
T
= 125°C, θ = 120°C/W  
T
JMAX  
JA  
JMAX  
JA  
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL  
LTC2460  
LTC2460  
TOP VIEW  
TOP VIEW  
1
2
3
4
5
6
12  
V
CC  
REFOUT  
COMP  
CS  
1
2
3
4
5
6
REFOUT  
COMP  
CS  
12 V  
CC  
11 GND  
10 GND  
11 GND  
GND  
IN  
10  
9
SDI  
SDI  
SCK  
SDO  
9
8
7
IN  
REF  
GND  
REF  
8
SCK  
7
GND  
SDO  
MS PACKAGE  
DD PACKAGE  
12-LEAD (3mm s 3mm) PLASTIC DFN  
= 125°C, θ = 43°C/W  
12-LEAD PLASTIC MSOP  
T
= 125°C, θ = 120°C/W  
T
JMAX  
JA  
JMAX  
JA  
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC2460CDD#PBF  
LTC2460IDD#PBF  
LTC2460CMS#PBF  
LTC2460IMS#PBF  
LTC2462CDD#PBF  
LTC2462IDD#PBF  
LTC2462CMS#PBF  
LTC2462IMS#PBF  
TAPE AND REEL  
PART MARKING*  
LFDQ  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
0°C to 70°C  
LTC2460CDD#TRPBF  
LTC2460IDD#TRPBF  
LTC2460CMS#TRPBF  
LTC2460IMS#TRPBF  
LTC2462CDD#TRPBF  
LTC2462IDD#TRPBF  
LTC2462CMS#TRPBF  
LTC2462IMS#TRPBF  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic MSOP-12  
LFDQ  
–40°C to 85°C  
0°C to 70°C  
2460  
2460  
12-Lead Plastic MSOP-12  
–40°C to 85°C  
0°C to 70°C  
LDXM  
LDXM  
2462  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic (3mm × 3mm) DFN  
12-Lead Plastic MSOP-12  
–40°C to 85°C  
0°C to 70°C  
2462  
12-Lead Plastic MSOP-12  
–40°C to 85°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
24602f  
2
LTC2460/LTC2462  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. (Note 2)  
PARAMETER  
CONDITIONS  
(Note 3)  
MIN  
TYP  
MAX  
UNITS  
Bits  
l
l
l
Resolution (No Missing Codes)  
Integral Nonlinearity  
Offset Error  
16  
(Note 4)  
1
10  
10  
LSB  
2
LSB  
Offset Error Drift  
Gain Error  
0.02  
0.01  
LSB/°C  
l
Includes Contributions of ADC and Internal Reference  
0.25 % of FS  
Gain Error Drift  
Includes Contributions of ADC and Internal Reference  
C-Grade  
I-Grade  
l
l
2
5
10  
ppm/°C  
ppm/°C  
Transition Noise  
2.2  
80  
μV  
RMS  
Power Supply Rejection DC  
dB  
The l denotes the specifications which apply over the full operating temperature range, otherwise  
ANALOG INPUTS  
specifications are at TA = 25°C.  
SYMBOL  
PARAMETER  
CONDITIONS  
LTC2462  
MIN  
0
TYP  
MAX  
UNITS  
V
+
l
l
l
V
V
V
V
V
C
Positive Input Voltage Range  
Negative Input Voltage Range  
Input Voltage Range  
V
REF  
V
REF  
V
REF  
IN  
IN  
IN  
LTC2462  
0
V
LTC2460  
0
V
+
+
+
, V  
UR  
, V  
UR  
Overrange/Underrange Voltage, IN  
V
IN  
V
IN  
= 0.625V (See Figure 3)  
= 0.625V (See Figure 3)  
8
8
LSB  
LSB  
pF  
OR  
OR  
IN  
+
Overrange/Underrange Voltage, IN–  
+
IN , IN , IN Sampling Capacitance  
0.35  
+
l
l
+
I
I
I
IN , IN DC Leakage Current (LTC2462)  
IN DC Leakage Current (LTC2460)  
V
V
= GND (Note 8)  
–10  
–10  
1
1
10  
10  
nA  
nA  
DC_LEAK(IN , IN , IN)  
IN  
IN  
= V (Note 8)  
CC  
l
l
IN DC Leakage Current  
V
V
= GND (Note 8)  
–10  
–10  
1
1
10  
10  
nA  
nA  
DC_LEAK(IN )  
IN  
IN  
= V (Note 8)  
CC  
Input Sampling Current (Note 5)  
Reference Output Voltage  
50  
nA  
V
CONV  
l
l
V
1.247  
1.25  
1.253  
10  
REF  
Reference Voltage Coefficient  
(Note 11)  
C-Grade  
I-Grade  
2
5
ppm/°C  
ppm/°C  
Reference Line Regulation  
2.7V ≤ V ≤ 5.5V  
–90  
dB  
mA  
CC  
l
l
Reference Short Circuit Current  
COMP Pin Short Circuit Current  
Reference Load Regulation  
Reference Output Noise Density  
V
CC  
V
CC  
= 5.5, Forcing Output to GND  
= 5.5, Forcing Output to GND  
35  
200  
μA  
2.7V ≤ V ≤ 5.5V, I  
= 100ꢀA Sourcing  
= 0.1ꢀF, At f = 1kHz  
3.5  
30  
mV/mA  
nV/√Hz  
CC  
OUT  
C = 0.1ꢀF, C  
COMP REFOUT  
The l denotes the specifications which apply over the full operating temperature  
POWER REQUIREMENTS  
range, otherwise specifications are at TA = 25°C.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
l
V
Supply Voltage  
2.7  
5.5  
V
CC  
I
Supply Current  
Conversion  
Nap  
CC  
l
l
l
1.5  
800  
0.2  
2.5  
1500  
2
mA  
μA  
μA  
Sleep  
24602f  
3
LTC2460/LTC2462  
The l denotes the specifications which apply over the full  
DIGITAL INPUTS AND DIGITAL OUTPUTS  
operating temperature range,otherwise specifications are at TA = 25°C. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
– 0.3  
TYP  
MAX  
UNITS  
V
l
l
l
V
V
High Level Input Voltage  
Low Level Input Voltage  
Digital Input Current  
V
V
IH  
IL  
CC  
0.3  
10  
V
I
IN  
–10  
μA  
pF  
V
C
V
V
Digital Input Capacitance  
High Level Output Voltage  
Low Level Output Voltage  
Hi-Z Output Leakage Current  
10  
IN  
l
l
l
I = –800μA  
O
– 0.5  
CC  
OH  
OL  
I = 1.6mA  
O
0.4  
10  
V
I
OZ  
–10  
μA  
TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature  
range,otherwise specifications are at TA = 25°C.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
23  
UNITS  
ms  
MHz  
ns  
l
l
l
l
l
l
l
l
l
l
t
f
t
t
t
t
t
t
t
t
Conversion Time  
13  
16.6  
CONV  
SCK  
lSCK  
hSCK  
1
SCK Frequency Range  
SCK Low Period  
2
250  
250  
0
SCK High Period  
ns  
CS Falling Edge to SDO Low Z  
CS Rising Edge to SDO High Z  
CS Falling Edge to SCK Falling Edge  
SCK Falling Edge to SDO Valid  
SDI Setup Before SCK↑  
SDI Hold After SCK↑  
(Notes 7, 8)  
(Notes 7, 8)  
100  
100  
ns  
0
ns  
2
100  
0
ns  
3
(Note 7)  
(Note 3)  
(Note 3)  
100  
ns  
KQ  
4
100  
100  
ns  
ns  
5
Guaranteed by design and test correlation.  
Note 5: CS = V . A positive current is flowing into the DUT pin.  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
CC  
Note 6: SCK = V or GND. SDO is high impedance.  
CC  
Note 7: See Figure 4.  
Note 8: See Figure 5.  
Note 9: Input sampling current is the average input current drawn from the  
input sampling network while the LTC2460/LTC2462 is actively sampling  
the input.  
Note 10: A positive current is flowing into the DUT pin.  
Note 11: Temperature coefficient is calculated by dividing the maximum  
Note 2. All voltage values are with respect to GND. V = 2.7V to 5.5V  
CC  
unless otherwise specified.  
V
V
= V /2, FS = V  
REF REF  
REFCM  
+
+
= V – V , –V ≤ V ≤ V ; V  
= (V + V )/2.  
IN IN  
IN  
IN  
IN  
REF  
IN  
REF INCM  
Note 3. Guaranteed by design, not subject to test.  
Note 4. Integral nonlinearity is defined as the deviation of a code from a  
straight line passing through the actual endpoints of the transfer curve.  
change in output voltage by the specified temperature range.  
24602f  
4
LTC2460/LTC2462  
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, unless otherwise noted)  
Integral Nonlinearity  
Integral Nonlinearity  
Maximum INL vs Temperature  
3
2
3
2
3
2
V
= 5.5V, 4.1V, 2.7V  
V
= 5.5V  
V
= 2.7V  
CC  
CC  
CC  
T
A
= –45°C, 25°C, 90°C  
T = –45°C, 25°C, 90°C  
A
1
1
1
0
0
0
–1  
–2  
–3  
–1  
–2  
–3  
–1  
–2  
–3  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–55 –35 –15  
5
25 45 65 85 105 125  
DIFFERENTIAL INPUT VOLTAGE (V)  
DIFFERENTIAL INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
24602 G03  
24602 G01  
24602 G02  
Offset Error vs Temperature  
ADC Gain Error vs Temperature  
Transition Noise vs Temperature  
25  
20  
15  
10  
5
10  
9
8
7
6
5
4
3
2
1
0
5
4
V
= 5.5V  
CC  
V
= 5.5V  
CC  
3
2
V
= 4.1V  
CC  
1
V
= 2.7V  
0
CC  
–1  
–2  
–3  
–4  
–5  
V
= 4.1V  
= 2.7V  
CC  
V
= 2.7V  
= 5.5V  
30  
CC  
V
V
CC  
CC  
0
–50  
–25  
0
25  
50  
75  
100  
–50 –30 –10 10  
50  
70  
90  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
24602 G05  
24602 G06  
24602 G04  
Conversion Mode Power Supply  
Current vs Temperature  
Sleep Mode Power Supply  
Current vs Temperature  
V
REF vs Temperature  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
350  
300  
250  
200  
150  
100  
50  
1.2508  
1.2507  
1.2506  
1.2505  
1.2504  
1.2503  
1.2502  
V
= 5.5V  
CC  
V
= 5.5V  
CC  
V
= 4.1V  
CC  
V
= 2.7V  
V
= 4.1V  
CC  
CC  
V
= 2.7V  
30  
CC  
0
–50 –30 –10 10  
30  
50  
70  
90  
–50 –30 –10 10  
50  
70  
90  
–50 –30 –10 10  
30  
50  
70  
90  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
24602 G07  
24602 G08  
24602 G09  
24602f  
5
LTC2460/LTC2462  
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, unless otherwise noted)  
Power Supply Rejection  
vs Frequency at VCC  
Conversion Time vs Temperature  
VREF vs VCC  
0
–20  
21  
20  
19  
18  
17  
16  
15  
14  
1.24892  
1.24891  
1.24890  
1.24889  
1.24888  
1.24887  
1.24886  
1.24885  
1.24884  
T
= 25°C  
A
–40  
V
= 5V, 4.1V, 3V  
CC  
–60  
–80  
–100  
–120  
1
10 100 1k 10k 100k 1M 10M  
–50  
–25  
0
25  
50  
75  
100  
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
(V)  
FREQUENCY AT V (Hz)  
CC  
TEMPERATURE (°C)  
V
CC  
24602 G10  
24602 G11  
24602 G12  
PIN FUNCTIONS  
REFOUT (Pin 1): Reference Output Pin. Nominally 1.25V,  
this voltage sets the fullscale input range of the ADC. For  
noise and reference stability connect to a 0.1μF capacitor  
tied to GND. This capacitor value must be less than or  
equal to the capacitor tied to the reference compensation  
pin (COMP). REFOUT cannot be overdriven by an external  
reference. For applications that require an input range  
greater than 0V to 1.25V, please refer to the LTC2450/  
LTC2452.  
SDO (Pin 6): Three-State Serial Data Output. SDO is used  
forserialdataoutputduringtheDATAINPUT/OUTPUTstate  
and can be used to monitor the conversion status.  
GND (Pins 7, 11): Ground. Connect directly to the ground  
plane through a low impedance connection.  
REF (Pin 8): Negative Reference Input to the ADC. The  
voltage on this pin sets the zero input to the ADC. This  
pin should tie directly to ground or the ground sense of  
the input sensor.  
COMP (Pin 2): Internal Reference Compensation Pin. For  
low noise and reference stability, tie a 0.1ꢀF capacitor to  
GND.  
+
IN (LTC2462), IN (LTC2460) (Pin 9): Positive input volt-  
age for the LTC2462 differential device. ADC input for the  
LTC2460 single-ended device.  
CS (Pin 3): Chip Select (Active LOW) Digital Input. A LOW  
on this pin enables the SDO output. A HIGH on this pin  
places the SDO output pin in a high impedance state and  
any inputs on SDI and SCK will be ignored.  
IN (LTC2462), GND (LTC2460) (Pin 10): Negative input  
voltage for the LTC2462 differential device. GND for the  
LTC2460 single-ended device.  
V
(Pin 12): Positive Supply Voltage. Bypass to GND  
SDI (Pin 4): Serial Data Input Pin. This pin is used to  
program the sleep mode and 30Hz/60Hz output rate  
(LTC2460).  
CC  
with a 10ꢀF capacitor in parallel with a low-series-induc-  
tance 0.1ꢀF capacitor located as close to the device as  
possible.  
SCK (Pin 5): Serial Clock Input. SCK synchronizes the  
serial data input/output. Once the conversion is complete,  
a new data bit is produced at the SDO pin following each  
SCK falling edge. Data is shifted into the SDI pin on each  
rising edge of SCK.  
Exposed Pad (Pin 13 – DFN Package): Ground. Connect  
directly to the ground plane through a low impedance  
connection.  
24602f  
6
LTC2460/LTC2462  
BLOCK DIAGRAM  
1
2
12  
REFOUT  
COMP  
V
CC  
3
CS  
INTERNAL  
REFERENCE  
5
$3 A/D  
CONVERTER  
SPI  
INTERFACE  
SCK  
9
+
IN  
6
4
SDO  
SDI  
(IN)  
DECIMATING  
SINC FILTER  
$3 A/D  
CONVERTER  
10  
IN  
INTERNAL  
OSCILLATOR  
(GND)  
REF  
GND  
7,11,13 (DD PACKAGE)  
8
24602 BD  
( ) PARENTHESIS INDICATE LTC2460  
Figure 1. Functional Block Diagram  
APPLICATIONS INFORMATION  
CONVERTER OPERATION  
POWER-ON RESET  
CONVERT  
Converter Operation Cycle  
The LTC2460/LTC2462 are low power, delta sigma, ana-  
log to digital converters with a simple SPI interface (see  
Figure 1). The LTC2462 has a fully differential input while  
the LTC2460 is single-ended. Both are pin and software  
compatible. Their operation is composed of three distinct  
states: CONVERT, SLEEP/NAP, and DATA INPUT/OUTPUT.  
The operation begins with the CONVERT state (see Fig-  
ure 2).Oncetheconversionisnished,theconverterauto-  
matically powers down (NAP) or under user control, both  
the converter and reference are powered down (SLEEP).  
The conversion result is held in a static register while the  
device is in this state. The cycle concludes with the DATA  
INPUT/OUTPUTstate. Onceall16-bitsarereadoranabort  
is initiated the device begins a new conversion.  
SLEEP/NAP  
NO  
CS = LOW?  
YES  
DATA INPUT/OUTPUT  
16TH FALLING  
EDGE OF SCK  
OR  
NO  
YES  
24602 F02  
CS = HIGH?  
TheCONVERTstatedurationisdeterminedbytheLTC2460/  
LTC2462 conversion time (nominally 16.6 milliseconds).  
Oncestarted, thisoperationcannotbeabortedexceptbya  
Figure 2. LTC2460/LTC2462 State Transition Diagram  
low power supply condition (V < 2.1V) which generates  
CC  
While in the SLEEP/NAP state, when chip select input is  
HIGH (CS = HIGH), the LTC2460/LTC2462’s converters  
are powered down. This reduces the supply current by  
approximately 50%. While in the Nap state the reference  
remainspoweredup.Inordertopowerdownthereference  
in addition to the converter, the user can select the SLEEP  
an internal power-on reset signal.  
Afterthecompletionofaconversion,theLTC2460/LTC2462  
enters the SLEEP/NAP state and remains there until the  
chip select is LOW (CS = LOW). Following this condition,  
the ADC transitions into the DATA INPUT/OUTPUT state.  
24602f  
7
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
mode during the DATA INPUT/OUTPUT state. Once the  
next conversion is complete, the SLEEP state is entered  
and power is reduced to less than 2ꢀA. The reference is  
powered up once CS is brought low. The reference startup  
timeis12ms(ifthereferenceandcompensationcapacitor  
values are both 0.1ꢀF).  
cycle. If SLP = 1, the reference powers down following  
the next conversion cycle. The remaining 12 SDI input  
bits are ignored (don’t care).  
SDI may also be tied directly to GND or V in order to  
DD  
simplify the user interface. In the case of the LTC2460,  
the 60Hz output rate is selected if SDI is tied low and  
Upon entering the DATA INPUT/OUTPUT state, SDO  
outputs the sign (D15) of the conversion result. During  
this state, the ADC shifts the conversion result serially  
through the SDO output pin under the control of the SCK  
input pin. There is no latency in generating this data and  
the result corresponds to the last completed conversion.  
A new bit of data appears at the SDO pin following each  
falling edge detected at the SCK input pin and appears  
from MSB to LSB. The user can reliably latch this data  
on every rising edge of the external serial clock signal  
driving the SCK pin.  
the 30Hz output rate is selected if SDI is tied to V . The  
DD  
LTC2462 output rate is always 60Hz independent of SDI  
or SPD. The reference sleep mode is disabled for both  
the LTC2460 and LTC2462 if SDI is tied to GND or V .  
DD  
The DATA INPUT/OUTPUT state concludes in one of two  
differentways.First,theDATAINPUT/OUTPUTstateopera-  
tion is completed once all 16 data bits have been shifted  
out and the clock then goes low. This corresponds to the  
th  
16 falling edge of SCK. Second, the DATA INPUT/OUT-  
PUT state can be aborted at any time by a LOW-to-HIGH  
transition on the CS input. Following either one of these  
twoactions,theLTC2460/LTC2462willentertheCONVERT  
state and initiate a new conversion cycle.  
During the DATA INPUT/OUTPUT state, the LTC2460/  
LTC2462 can be programmed to SLEEP or NAP (default)  
followingthenextconversioncycle.Dataisshiftedintothe  
device through the SDI pin on the rising edge of SCK. The  
input word is 4 bits. If the first bit EN1 = 1 and the second  
bit EN2 = 0 the device is enabled for programming. The  
following two bits (SPD and SLP) will be written into the  
device. SPD(onlyusedfortheLTC2460)toselectthe60Hz  
output rate, no offset calibration mode (SPD = 0, default).  
Set SPD = 1 for 30Hz mode with offset calibration. SPD  
is ignored for the LTC2462. The next bit (SLP) enables  
the sleep or nap mode. If SLP = 0 (default) the reference  
remains powered up at the end of the next conversion  
Power-Up Sequence  
When the power supply voltage (V ) applied to the con-  
CC  
verter is below approximately 2.1V, the ADC performs a  
power-on reset. This feature guarantees the integrity of  
the conversion result.  
WhenV risesabovethiscriticalthreshold, theconverter  
CC  
generates an internal power-on reset (POR) signal for  
approximately 0.5ms. The POR signal clears all internal  
registers.FollowingthePORsignal,theLTC2460/LTC2462  
startaconversioncycleandfollowthesuccessionofstates  
shown in Figure 2. The reference startup time following a  
20  
16  
12  
8
POR is 12ms (C  
= C  
= 0.1ꢀF). The first conver-  
COMP  
REFOUT  
sion following powerup will be invalid since the reference  
voltage has not completely settled. The first conversion  
following power up can be discarded using the data abort  
command or simply read and ignored. The following con-  
versions are accurate to the device specifications.  
4
0
–4  
SIGNALS  
–8  
BELOW  
GND  
–12  
–16  
–20  
Ease of Use  
The LTC2460/LTC2462 data output has no latency, filter  
settling delay or redundant results associated with the  
conversion cycle. There is a one-to-one correspondence  
–0.001 –0.005  
0
V
0.005 0.001 0.0015  
+
+
/V  
IN REF  
24602 F03  
Figure 3. Output Code vs VIN+ with VIN= 0 (LTC2462)  
between the conversion and the output data. Therefore,  
24602f  
8
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
multiplexing multiple analog input voltages requires no  
special actions.  
Input Voltage Range (LTC2462)  
AsmentionedintheOutputDataFormatsection,theoutput  
+
The LTC2460/LTC2462 perform offset calibrations every  
conversion. This calibration is transparent to the user  
and has no effect upon the cyclic operation described  
previously. The advantage of continuous calibration is  
stability of the ADC performance with respect to time and  
temperature.  
code is given as 32768 • (V – V )/V + 32768. For  
IN  
IN  
REF  
+
(V – V ) ≥ V , the output code is clamped at 65535  
(all ones). For (V – V ) ≤ –V , the output code is  
IN  
IN  
REF  
IN  
+
IN  
REF  
clamped at 0 (all zeroes).  
The LTC2462 includes a proprietary architecture that  
can, typically, digitize each input up to 8 LSBs above V  
REF  
TheLTC2460/LTC2462includeaproprietaryinputsampling  
scheme that reduces the average input current by several  
orders of magnitude when compared to traditional delta-  
sigma architectures. This allows external filter networks  
to interface directly to the LTC2460/LTC2462. Since the  
average input sampling current is 50nA, an external RC  
lowpass filter using 1kΩ and 0.1μF results in <1LSB  
additional error. Additionally, there is negligible leakage  
and below GND, if the differential input is within V  
.
REF  
As an example (Figure 3), if the user desires to measure  
a signal slightly below ground, the user could set V  
IN  
+
= GND, and V = 1.25V. If V = GND, the output code  
would be approximately 32768. If V = GND – 8LSB =  
REF  
IN  
+
IN  
–0.305mV,theoutputcodewouldbeapproximately32760.  
For applications that require an input range greater than  
1.25V, please refer to the LTC2452.  
+
current between IN and IN .  
Output Data Format  
Input Voltage Range (LTC2460)  
The LTC2460/LTC2462 generates a 16-bit direct binary  
encoded result. It is provided as a 16-bit serial stream  
through the SDO output pin under the control of the SCK  
input pin (see Figure 4).  
Ignoring offset and full-scale errors, the LTC2460 will  
theoretically output an “all zero” digital result when the  
input is at ground (a zero scale input) and an “all one”  
digital result when the input is at V (V  
= 1.25V).  
The LTC2462 (differential input) output code is given by  
REF REFOUT  
+
In an under-range condition, for all input voltages below  
zeroscale,theconverterwillgeneratetheoutputcode0.In  
an over-range condition, for all input voltages greater than  
32768 • (V – V )/V  
+ 32768. The first bit output  
IN  
IN  
REF  
+
by the LTC2462, D15, is the MSB, which is 1 for V  
IN  
+
V
and 0 for V < V . This bit is followed by succes-  
IN  
IN IN  
V
, the converter will generate the output code 65535.  
sively less significant bits (D14, D13, …) until the LSB is  
REF  
For applications that require an input range greater than  
output by the LTC2462, see Table 1.  
0V to 1.25V, please refer to the LTC2450.  
t
3
t
2
t
1
CS  
D
D
D
D
D
D
D
D
D
7
D
6
D
D
D
3
D
D
1
D
0
15  
14  
13  
12  
11  
10  
9
8
5
4
2
MSB  
LSB  
SDO  
SCK  
t
t
t
hSCK  
KQ  
lSCK  
EN1  
EN2  
SPD* SLP  
DONT CARE  
SDI  
24602 F04  
t
5
t
6
*SPD IS A DONT CARE BIT FOR THE LTC2462  
Figure 4. Data Input/Output Timing  
24602f  
9
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
Table 1. LTC2460/LTC2462 Output Data Format  
SINGLE ENDED INPUT V  
(LTC2460)  
DIFFERENTIAL INPUT VOLTAGE  
D15  
(MSB)  
D14  
D13  
D12...D2  
D1  
D0  
(LSB)  
CORRESPONDING  
DECIMAL VALUE  
IN  
+
V
– V (LTC2462)  
IN  
IN  
≥V  
≥V  
1
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
65535  
65534  
49152  
49151  
32768  
32767  
16384  
16383  
0
REF  
REF  
V
– 1LSB  
V
– 1LSB  
REF  
REF  
0.75 • V  
0.5 • V  
REF  
REF  
0.75 • V – 1LSB  
0.5 • V – 1LSB  
REF  
REF  
0.5 • V  
0
REF  
0.5 • V – 1LSB  
–1LSB  
REF  
0.25 • V  
–0.5 • V  
REF  
REF  
0.25 • V – 1LSB  
–0.5 • V – 1LSB  
REF  
REF  
0
≤ –V  
REF  
The LTC2460 (single-ended input) output code is a direct  
binary encoded result, see Table 1.  
the next conversion is complete. It will remain powered  
down until CS is pulled low. The reference startup time is  
approximately 12ms. In order to ensure a stable reference  
for the following conversions, either the data input/output  
time should be delayed 12ms after CS goes low or the  
first conversion following a reference start up should be  
discarded. If SDI is tied HIGH (LTC2460 operating in 30Hz  
mode) the SLP mode is disabled.  
During the data output operation the CS input pin must  
be pulled low (CS = LOW). The data output process starts  
with the most significant bit of the result being present at  
the SDO output pin (SDO = D15) once CS goes low. A new  
data bit appears at the SDO output pin after each falling  
edge detected at the SCK input pin. The output data can  
be reliably latched on the rising edge of SCK.  
Conversion Status Monitor  
Data Input Format  
For certain applications, the user may wish to monitor the  
LTC2460/LTC2462conversionstatus.Thiscanbeachieved  
by holding SCK HIGH during the conversion cycle. In  
this condition, whenever the CS input pin is pulled low  
(CS = LOW), the SDO output pin will provide an indication  
of the conversion status. SDO = HIGH is an indication of  
a conversion cycle in progress while SDO = LOW is an  
indication of a completed conversion cycle. An example  
of such a sequence is shown in Figure 5.  
The data input word is 4 bits long and consists of two  
enable bits (EN1 and EN2) and two programming bits  
(SPD and SLP). EN1 is applied to the first rising edge of  
SCK after the conversion is complete. Programming is  
enabled by setting EN1 = 1 and EN2 = 0.  
The speed bit (SPD) is only used by the LTC2460. In the  
default mode, SPD = 0, the output rate is 60Hz and con-  
tinuousbackgroundoffsetcalibrationisnotperformed. By  
changing the SPD bit to 1, background offset calibration is  
performed and the output rate is reduced to 30Hz. Alterna-  
Conversion status monitoring, while possible, is not re-  
quired for the LTC2460/LTC2462 as its conversion time is  
fixed and typically 16.6ms (23ms maximum). Therefore,  
externaltimingcanbeusedtodeterminethecompletionofa  
conversion cycle.  
tively, SDI can be tied directly to ground (SPD = 0) or V  
CC  
(SPD = 1), eliminating the need to program the device. The  
LTC2462 data output rate is always 60Hz and background  
offset calibration is performed (SPD = don’t care).  
SERIAL INTERFACE  
The sleep bit (SLP) is used to power down the on chip  
reference. In the default mode, the reference remains  
powered up even when the ADC is powered down. If the  
SLP bit is set HIGH, the reference will power down after  
The LTC2460/LTC2462 transmit the conversion result  
and receive the start of conversion command through  
a synchronous 2-, 3- or 4-wire interface. This interface  
24602f  
10  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
t
1
t
2
CS  
SDO  
SDI = LOW  
SCK = HIGH  
CONVERT  
NAP  
24602 F05  
Figure 5. Conversion Status Monitoring Mode  
can be used during the CONVERT and SLEEP states to  
assess the conversion status and during the DATA OUT-  
PUT state to read the conversion result, and to trigger a  
new conversion.  
4) When SCK = HIGH, it is possible to monitor the conver-  
sion status by pulling CS low and watching for SDO to  
go low. This feature is available only in the idle-high  
(CPOL = 1) mode.  
Serial Interface Operation Modes  
Serial Clock Idle-High (CPOL = 1) Examples  
The modes of operation can be summarized as follows:  
In Figure 6, following a conversion cycle the LTC2460/  
LTC2462 automatically enter the NAP mode with the ADC  
powereddown.TheADC’sreferencewillpowerdownifthe  
SLPbitwassethighpriortothejustcompletedconversion  
and CS is HIGH. Once CS goes low, the device powers up.  
The user can monitor the conversion status at convenient  
intervals using CS and SDO.  
1) The LTC2460/LTC2462 function with SCK idle high  
(commonly known as CPOL = 1) or idle low (commonly  
known as CPOL = 0).  
2) After the 16th bit is read, a new conversion is started  
if CS is pulled high or SCK is pulled low.  
3) At any time during the Data Output state, pulling CS  
high causes the part to leave the I/O state, abort the  
output and begin a new conversion.  
Pulling CS LOW while SCK is HIGH tests whether  
or not the chip is in the CONVERT state. While in  
the CONVERT state, SDO is HIGH while CS is LOW.  
Once the conversion is complete, SDO is LOW  
CS  
D
15  
D
14  
D
13  
D
12  
D
2
D
1
D
0
SD0  
SCK  
clk  
1
clk  
2
clk  
3
clk  
4
clk  
15  
clk  
16  
EN1  
EN2  
SPD  
SLP  
DATA OUTPUT  
SDI  
CONVERT  
NAP  
CONVERT  
24602 F06  
Figure 6. Idle-High (CPOL = 1) Serial Clock Operation Example.  
The Rising Edge of CS Starts a New Conversion  
24602f  
11  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
while CS is LOW. These tests are not required op-  
erational steps but may be useful for some applications.  
ThetimingdiagraminFigure9isidenticaltothatofFigure 8,  
except in this case a new conversion is triggered by SCK.  
The 16th SCK falling edge triggers a new conversion cycle  
and the CS signal is subsequently pulled high.  
Whenthedataisavailable, theuserapplies16clockcycles  
to transfer the result. The CS rising edge is then used to  
initiate a new conversion.  
Examples of Aborting Cycle using CS  
The operation example of Figure 7 is identical to that of  
Figure 6, except the new conversion cycle is triggered by  
the falling edge of the serial clock (SCK).  
For some applications, the user may wish to abort the I/O  
cycleandbeginanewconversion.IftheLTC2460/LTC2462  
are in the data output state, a CS rising edge clears the  
remainingdatabitsfromtheoutputregister,abortstheout-  
put cycle and triggers a new conversion. Figure 10 shows  
an example of aborting an I/O with idle-high (CPOL = 1)  
and Figure 11 shows an example of aborting an I/O with  
idle-low (CPOL = 0).  
Serial Clock Idle-Low (CPOL = 0) Examples  
In Figure 8, following a conversion cycle the LTC2460/  
LTC2462 automatically enters the NAP state. The device  
reference will power down if the SLP bit was set high  
prior to the just completed conversion and CS is HIGH.  
Once CS goes low, the reference powers up. The user  
determines data availability (and the end of conversion)  
based upon external timing. The user then pulls CS low  
(CS = ) and uses 16 clock cycles to transfer the result.  
Followingthe16thrisingedgeoftheclock,CSispulledhigh  
(CS = ), which triggers a new conversion.  
A new conversion cycle can be triggered using the CS  
signal without having to generate any serial clock pulses  
as shown in Figure 12. If SCK is maintained at a low logic  
level, after the end of a conversion cycle, a new conver-  
sion operation can be triggered by pulling CS low and  
then high. When CS is pulled low (CS = LOW), SDO will  
CS  
D
D
14  
D
D
12  
D
2
D
1
D
0
15  
13  
SD0  
SCK  
clk  
clk  
clk  
3
clk  
clk  
clk  
clk  
17  
1
2
4
15  
16  
EN1  
EN2  
SPD  
SLP  
DATA OUTPUT  
SDI  
CONVERT  
NAP  
CONVERT  
24602 F07  
Figure 7. Idle-High (CPOL = 1) Clock Operation Example.  
A 17th Clock Pulse is Used to Trigger a New Conversion Cycle  
CS  
D
D
D
13  
D
12  
D
D
1
D
0
15  
14  
2
SD0  
SCK  
clk  
1
clk  
clk  
clk clk  
clk  
clk  
16  
2
3
4
14  
15  
EN1  
EN2  
SPD  
SLP  
DATA OUTPUT  
SDI  
CONVERT  
NAP  
CONVERT  
24602 F08  
Figure 8. Idle-Low (CPOL = 0) Clock. CS Triggers a New Conversion  
24602f  
12  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
CS  
D
D
D
D
D
D
1
D
0
15  
14  
13  
12  
2
SD0  
SCK  
clk  
clk  
2
clk  
3
clk  
clk  
clk  
clk  
16  
1
4
14  
15  
EN1  
EN2  
SPD  
SLP  
DATA OUTPUT  
SDI  
CONVERT  
NAP  
CONVERT  
24602 F09  
Figure 9. Idle-Low (CPOL = 0) Clock. The 16th SCK Falling Edge Triggers a New Conversion  
CS  
D
D
D
13  
15  
14  
SD0  
SCK  
clk  
clk  
clk  
clk  
4
1
2
3
EN1  
EN2  
SPD  
SLP  
SDI  
CONVERT  
NAP  
DATA OUTPUT  
CONVERT  
24602 F10  
Figure 10. Idle-High (CPOL = 1) Clock and Aborted I/O Example  
CS  
D
D
D
13  
15  
14  
SD0  
SCK  
clk  
1
clk  
clk  
3
2
EN1  
EN2  
SPD  
SLP  
SDI  
CONVERT  
NAP  
DATA OUTPUT  
CONVERT  
24602 F11  
Figure 11. Idle-Low (CPOL = 0) Clock and Aborted I/O Example  
CS  
D
15  
SD0  
SDI = DONT CARE  
SCK = LOW  
CONVERT  
NAP  
DATA OUTPUT  
CONVERT  
24602 F12  
Figure 12. Idle-Low (CPOL = 0) Clock and Minimum Data Output Length Example  
24602f  
13  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
output the sign (D15) of the result of the just completed  
conversion. While a low logic level is maintained at SCK  
pin and CS is subsequently pulled high (CS = HIGH) the  
remaining 15 bits of the result (D14:D0) are discarded  
and a new conversion cycle starts.  
Figure 13 shows a 2-wire operation sequence which uses  
anidle-high(CPOL=1)serialclocksignal. Theconversion  
status can be monitored at the SDO output. Following a  
conversion cycle, the ADC enters the data output state  
and the SDO output transitions from HIGH to LOW. Sub-  
sequently 16 clock pulses are applied to the SCK input in  
order to serially shift the 16 bit result. Finally, the 17th  
clock pulse is applied to the SCK input in order to trigger  
a new conversion cycle.  
Following the aborted I/O, additional clock pulses in the  
CONVERT state are acceptable, but excessive signal tran-  
sitions on SCK can potentially create noise on the ADC  
during the conversion, and thus may negatively influence  
the conversion accuracy.  
Figure 14 shows a 2-wire operation sequence which uses  
an idle-low (CPOL = 0) serial clock signal. The conversion  
status cannot be monitored at the SDO output. Following  
aconversioncycle,theLTC2460/LTC2462enterstheDATA  
OUTPUT state. At this moment the SDO pin outputs the  
sign (D15) of the conversion result. The user must use  
externaltiminginordertodeterminetheendofconversion  
and result availability. Subsequently 16 clock pulses are  
applied to SCK in order to serially shift the 16-bit result.  
The 16th clock falling edge triggers a new conversion  
cycle. For the LTC2460 tie SDI LOW for 60Hz output rate  
and HIGH for 30Hz output rate.  
2-Wire Operation  
The 2-wire operation modes, while reducing the number  
of required control signals, should be used only if the  
LTC2460/LTC2462 low power sleep capability is not re-  
quired. In addition the option to abort serial data transfers  
is no longer available. Hardwire CS to GND for 2-wire  
operation. For the LTC2460, tie SDI LOW for 60Hz output  
rate and HIGH for 30Hz output rate, for the LTC2462 tie  
SDI low.  
CS = LOW  
D
D
D
D
4
D
D
D
0
15  
14  
13  
12  
2
1
SD0  
SCK  
clk  
clk  
clk  
clk  
clk  
clk  
clk  
17  
1
2
3
15  
16  
CONVERT  
DATA OUTPUT  
CONVERT  
SDI = 0 OR 1  
24602 F13  
Figure 13. 2-Wire, Idle-High (CPOL = 1) Serial Clock, Operation Example  
CS = LOW  
SD0  
D
D
14  
D
D
D
2
D
D
0
15  
13  
12  
1
SCK  
clk  
clk  
2
clk  
clk clk  
clk  
15  
clk  
16  
1
3
4
14  
CONVERT  
DATA OUTPUT  
CONVERT  
SDI = 0 OR 1  
24602 F14  
Figure 14. 2-Wire, Idle-Low (CPOL = 0) Serial Clock Operation Example  
24602f  
14  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
PRESERVING THE CONVERTER ACCURACY  
passing through these two decoupling capacitors, and  
returningtotheconverterGNDpin.Theareaencompassed  
by this circuit path, as well as the path length, should be  
minimized.  
TheLTC2460/LTC2462aredesignedtominimizetheconver-  
sion result’s sensitivity to device decoupling, PCB layout,  
antialiasingcircuits,lineandfrequencyperturbations.Nev-  
ertheless, inordertopreservethehighaccuracycapability  
of this part, some simple precautions are desirable.  
As shown in Figure 15, REF is used as the negative refer-  
ence voltage input to the ADC. This pin can be tied directly  
to ground or kelvined to sensor ground. In the case where  
Digital Signal Levels  
REF is used as a sense input, it should be bypassed to  
ground with a 0.1ꢀF ceramic capacitor in parallel with a  
10ꢀF low ESR ceramic capacitor.  
DuetothenatureofCMOSlogic,itisadvisabletokeepinput  
digital signals near GND or V . Voltages in the range of  
CC  
0.5V to V – 0.5V may result in additional current leakage  
CC  
Very low impedance ground and power planes, and star  
from the part. Undershoot and overshoot should also be  
minimized, particularly while the chip is converting. It is  
thus beneficial to keep edge rates of about 10ns and limit  
overshoot and undershoot to less than 0.3V.  
connections at both V and GND pins, are preferable.  
CC  
The V pin should have two distinct connections: the  
CC  
first to the decoupling capacitors described above, and  
the second to the ground return for the power supply  
voltage source.  
Noisy external circuitry can potentially impact the output  
under 2-wire operation. In particular, it is possible to get  
the LTC2460/LTC2462 into an unknown state if an SCK  
pulse is missed or noise triggers an extra SCK pulse.  
In this situation, it is impossible to distinguish SDO = 1  
(indicating conversion in progress) from valid “1” data  
bits. As such, CPOL = 1 is recommended for the 2-wire  
mode. The user should look for SDO = 0 before reading  
data, and look for SDO = 1 after reading data. If SDO does  
not return a “0” within the maximum conversion time (or  
return a “1” after a full data read), generate 16 SCK pulses  
to force a new conversion.  
REFOUT and COMP  
The on chip 1.25V reference is internally tied to the  
converter’s reference input and is output to the REFOUT  
INTERNAL  
V
V
V
V
CC  
CC  
CC  
CC  
REFERENCE  
R
SW  
15k  
I
I
LEAK  
LEAK  
(TYP)  
REFOUT  
R
SW  
15k  
Driving V and GND  
I
I
LEAK  
CC  
(TYP)  
+
IN  
InrelationtotheV andGNDpins, the LTC2460/LTC2462  
CC  
LEAK  
combinesinternalhighfrequencydecouplingwithdamping  
elements, which reduce the ADC performance sensitivity  
to PCB layout and external components. Nevertheless,  
the very high accuracy of this converter is best pre-  
served by careful low and high frequency power supply  
decoupling.  
C
EQ  
R
SW  
0.35pF  
(TYP)  
15k  
I
I
LEAK  
(TYP)  
IN  
LEAK  
A 0.1μF, high quality, ceramic capacitor in parallel with  
a 10μF low ESR ceramic capacitor should be connected  
R
SW  
15k  
I
I
LEAK  
(TYP)  
24602 F15  
REF  
between the V and GND pins, as close as possible to the  
CC  
LEAK  
package. The 0.1μF capacitor should be placed closest  
to the ADC package. It is also desirable to avoid any via  
in the circuit path, starting from the converter V pin,  
Figure 15. LTC2460/LTC2462 Analog Input/Reference  
Equivalent Circuit  
CC  
24602f  
15  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
pin. A 0.1ꢀF capacitor should be placed on the REFOUT  
pin.Itispossibletoreducethiscapacitor,butthetransition  
noise increases. A 0.1ꢀF capacitor should also be placed  
on the COMP pin. This pin is tied to an internal point in the  
referenceandisusedforstability.Inorderforthereference  
to remain stable the capacitor placed on the COMP pin  
must be greater than or equal to the capacitor tied to the  
REFOUT pin. The REFOUT pin cannot be overridden by an  
external voltage. If a reference voltage greater than 1.25V  
is required, the LTC2450/LTC2452 should be used.  
input parasitic capacitance C . Depending on the PCB  
PAR  
layout, C  
has typical values between 2pF and 15pF. In  
PAR  
addition, the equivalent circuit of Figure 16 includes the  
converter equivalent internal resistor R and sampling  
SW  
capacitor C .  
EQ  
V
CC  
IN  
R
SW  
(LTC2460)  
15k  
I
LEAK  
R
S
(TYP)  
+
IN  
(LTC2462)  
I
I
LEAK  
+
+
C
C
IN  
EQ  
SIG  
I
I
CONV  
0.35pF  
(TYP)  
C
PAR  
DependingonthesizeofthecapacitorstiedtotheREFOUT  
and COMP pins, the internal reference has a correspond-  
ing start up time. This start up time is typically 12ms  
when 0.1ꢀF capacitors are used. At initial power up, the  
first conversion result can be aborted or ignored. At the  
completion of this first conversion, the reference has  
settled and all subsequent conversions are valid.  
V
CC  
R
SW  
15k  
I
LEAK  
R
S
(TYP)  
IN  
(LTC2462)  
LEAK  
+
C
IN  
C
SIG  
EQ  
CONV  
0.35pF  
(TYP)  
C
PAR  
24602 F16  
Figure 16. LTC2460/LTC2462 Input Drive Equivalent Circuit  
If the reference is put to sleep (program SLP = 1 and  
CS = 1) the reference is powered down after the next  
conversion. This conversion result is valid. On CS falling  
edge, the reference is powered up. In order to ensure the  
reference output has settled before the next conversion,  
the power up time can be extended by delaying the data  
read 12ms after the falling edge of CS. Once all 16 bits  
are read from the device or CS is brought HIGH, the next  
conversion automatically begins. In the default operation,  
the reference remains powered up at the conclusion of the  
conversion cycle.  
Therearesomeimmediatetrade-offsinR andC without  
S
IN  
needing a full circuit analysis. Increasing R and C can  
S
IN  
give the following benefits:  
1) DuetotheLTC2460/LTC2462’sinputsamplingalgorithm,  
+
the input current drawn by either V or V over a  
IN  
IN  
conversion cycle is typically 50nA. A high R • C at-  
S
IN  
tenuates the high frequency components of the input  
current, and R values up to 1k result in <1LSB error.  
S
2) The bandwidth from V is reduced at the input pins  
SIG  
+
(IN , IN or IN). This bandwidth reduction isolates the  
ADCfromhighfrequencysignals, andassuchprovides  
simple antialiasing and input noise reduction.  
+
Driving V and V  
IN  
IN  
The input drive requirements can best be analyzed using  
the equivalent circuit of Figure 16. The input signal V is  
SIG  
3) Switching transients generated by the ADC are attenu-  
ated before they go back to the signal source.  
+
connected to the ADC input pins (IN and IN ) through an  
equivalentsourceresistanceR .Thisresistorincludesboth  
S
4) A large C gives a better AC ground at the input pins,  
the actual generator source resistance and any additional  
IN  
helping reduce reflections back to the signal source.  
optional resistors connected to the input pins. Optional  
input capacitors C are also connected to the ADC input  
IN  
5) Increasing R protects the ADC by limiting the current  
S
pins. This capacitor is placed in parallel with the ADC  
during an outside-the-rails fault condition.  
24602f  
16  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
There is a limit to how large R • C should be for a given  
through low value sense resistors, temperature measure-  
ments, low impedance voltage source monitoring, and so  
S
IN  
application. Increasing R beyond a given point increases  
S
the voltage drop across R due to the input current,  
on. The resultant INL vs V is shown in Figure 18. The  
S
IN  
to the point that significant measurement errors exist.  
measurements of Figure 18 include a capacitor C  
cor-  
PAR  
Additionally, forsomeapplications, increasingtheR •C  
respondingtoaminimumsizedlayoutpadandaminimum  
width input trace of about 1 inch length.  
S
IN  
product too much may unacceptably attenuate the signal  
at frequencies of interest.  
Signal Bandwidth, Transition Noise and Noise  
Equivalent Input Bandwidth  
For most applications, it is desirable to implement C as  
IN  
a high-quality 0.1μF ceramic capacitor and R ≤ 1k. This  
S
1
The LTC2460/LTC2462 include a sinc type digital filter  
capacitor should be located as close as possible to the  
with the first notch located at f = 60Hz. As such, the  
actualV packagepin.Furthermore,theareaencompassed  
0
IN  
3dB input signal bandwidth is 26.54Hz. The calculated  
LTC2460/LTC2462 input signal attenuation vs frequency  
over a wide frequency range is shown in Figure 19. The  
calculated LTC2460/LTC2462 input signal attenuation vs  
frequency at low frequencies is shown in Figure 20. The  
by this circuit path, as well as the path length, should be  
minimized.  
In the case of a 2-wire sensor that is not remotely  
grounded, it is desirable to split R and place series  
S
resistors in the ADC input line as well as in the sensor  
ground return line, which should be tied to the ADC GND  
pin using a star connection topology.  
converter noise level is about 2.2μV  
and can be mod-  
RMS  
eled by a white noise source connected at the input of a  
noise-free converter.  
Figure 17 shows the measured LTC2462 INL vs Input  
On a related note, the LTC2462 uses two separate A/D  
converters to digitize the positive and negative inputs.  
Voltage as a function of R value with an input capacitor  
S
C = 0.1μF.  
IN  
Each of these A/D converters has 2.2μV  
transition  
RMS  
Insomecases,R canbeincreasedabovetheseguidelines.  
noise. If one of the input voltages is within this small  
transition noise band, then the output will fluctuate one  
bit, regardless of the value of the other input voltage. If  
both of the input voltages are within their transition noise  
bands, the output can fluctuate 2 bits.  
S
The input current is zero when the ADC is either in sleep  
or I/O modes. Thus, if the time constant of the input RC  
circuit τ = R • C , is of the same order of magnitude or  
S
IN  
longer than the time periods between actual conversions,  
then one can consider the input current to be reduced  
correspondingly.  
Forasimplesystemnoiseanalysis,theV drivecircuitcan  
IN  
be modeled as a single-pole equivalent circuit character-  
These considerations need to be balanced out by the input  
ized by a pole location f and a noise spectral density n .  
i
i
signal bandwidth. The 3dB bandwidth ≈ 1/(2πR C ).  
If the converter has an unlimited bandwidth, or at least a  
S IN  
bandwidth substantially larger than f , then the total noise  
i
Finally, if the recommended choice for C is unacceptable  
IN  
contribution of the external drive circuit would be:  
fortheuser’sspecificapplication,analternatestrategyisto  
eliminateC andminimizeC andR .Inpracticalterms,  
IN  
PAR  
S
Vn = ni π /2• fi  
thisconfigurationcorrespondstoalowimpedancesensor  
directly connected to the ADC through minimum length  
traces. Actual applications include current measurements  
Then, the total system noise level can be estimated as  
2
the square root of the sum of (V ) and the square of the  
n
2
LTC2460/LTC2462 noise floor (~2.2μV ).  
24602f  
17  
LTC2460/LTC2462  
APPLICATIONS INFORMATION  
3
3
2
C
V
T
= 0.1μF  
= 5V  
C
V
T
= 0  
IN  
CC  
= 25°C  
IN  
CC  
A
= 5V  
= 25°C  
2
1
A
R
= 10k  
R = 10k  
S
S
1
R
= 1k  
S
R
S
= 0k  
0
0
R
= 0k  
R
= 1k  
S
S
–1  
–2  
–3  
–1  
–2  
–3  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
–1.25  
–0.75  
–0.25  
0.25  
0.75  
1.25  
DIFFERENTIAL INPUT VOLTAGE (V)  
DIFFERENTIAL INPUT VOLTAGE (V)  
24602 F17  
24602 F18  
Figure 17. Measured INL vs Input Voltage  
Figure 18. Measured INL vs Input Voltage  
0
–20  
0
–5  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
–50  
–40  
–60  
–80  
–100  
0
5.0  
7.5  
1.00 1.25 1.50  
2.5  
0
60 120 180 240 300 360 420 480 540 600  
INPUT SIGNAL FREQUENCY (Hz)  
INPUT SIGNAL FREQUENCY (MHz)  
24602 F19  
24602 F20  
Figure 19. LTC2462 Input Signal Attentuation vs Frequency  
Figure 20. LTC2462 Input Signal Attenuation  
vs Frequency (Low Frequencies)  
24602f  
18  
LTC2460/LTC2462  
PACKAGE DESCRIPTION  
DD Package  
12-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1725 Rev A)  
R = 0.115  
0.40 0.10  
TYP  
7
12  
0.70 0.05  
2.38 0.10  
1.65 0.10  
2.38 0.05  
1.65 0.05  
3.50 0.05  
2.10 0.05  
3.00 0.10  
(4 SIDES)  
PACKAGE  
OUTLINE  
PIN 1 NOTCH  
R = 0.20 OR  
0.25 s 45°  
CHAMFER  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
6
1
0.23 0.05  
0.45 BSC  
0.75 0.05  
0.200 REF  
0.25 0.05  
0.45 BSC  
2.25 REF  
(DD12) DFN 0106 REV A  
2.25 REF  
0.00 – 0.05  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
MS Package  
12-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1668 Rev Ø)  
4.039 p 0.102  
(.159 p .004)  
(NOTE 3)  
0.889 p 0.127  
(.035 p .005)  
0.406 p 0.076  
(.016 p .003)  
REF  
12 11 10 9 8 7  
DETAIL “A”  
0o – 6o TYP  
3.00 p 0.102  
(.118 p .004)  
(NOTE 4)  
5.23  
4.90 p 0.152  
(.193 p .006)  
0.254  
(.010)  
3.20 – 3.45  
(.206)  
(.126 – .136)  
MIN  
GAUGE PLANE  
0.53 p 0.152  
(.021 p .006)  
1
2 3 4 5 6  
0.65  
(.0256)  
BSC  
0.42 p 0.038  
(.0165 p .0015)  
TYP  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
RECOMMENDED SOLDER PAD LAYOUT  
0.22 – 0.38  
(.009 – .015)  
TYP  
0.1016 p 0.0508  
(.004 p .002)  
MSOP (MS12) 1107 REV Ø  
0.650  
(.0256)  
BSC  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
24602f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
19  
LTC2460/LTC2462  
TYPICAL APPLICATION  
10μF  
+
V
V
CC  
V
CC  
0.1μF  
0.1μF  
1μF  
1
2
10V  
5V  
SCK SDO  
CS  
μC  
1
12  
U1*  
6
4
7
5
CS  
3
5
REFOUT  
V
1k  
CC  
CS  
10  
9
+
+
SCK/SCL  
MOSI/SDA  
MISO/SDO  
IN  
IN  
SCK  
LTC2462  
0.1μF  
1k  
6
4
SDO  
SDI  
IN  
IN  
GND GND GND  
COMP REF GND  
0.1μF  
0.1μF  
3
8
13  
2
8
7, 11  
0.1μF  
24602 TA02  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC1860/LTC1861  
12-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP  
850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP Packages  
450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP Packages  
850μA at 250ksps, 2μA at 1ksps, SO-8 and MSOP Packages  
450μA at 150ksps, 10μA at 1ksps, SO-8 and MSOP Packages  
3V Supply, 1.5mW at 100ksps, TSOT 6-pin/8-pin Packages  
LTC1860L/LTC1861L 12-Bit, 3V, 1-/2-Channel 150ksps SAR ADC  
LTC1864/LTC1865 16-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP  
LTC1864L/LTC1865L 16-bit, 3V, 1-/2-Channel 150ksps SAR ADC  
LTC2360  
LTC2440  
LTC2480  
12-Bit, 100ksps SAR ADC  
200nV  
Noise, 4kHz Output Rate, 15ppm INL  
24-Bit No Latency ΔΣADC  
RMS  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
Noise,  
Noise,  
Noise,  
Noise,  
Noise,  
Noise,  
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,  
Temp. Sensor, SPI  
RMS  
RMS  
RMS  
RMS  
RMS  
RMS  
LTC2481  
LTC2482  
LTC2483  
LTC2484  
LTC2485  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,  
2
Temp. Sensor, I C  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, SPI  
2
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
16-Bit, Differential Input, No Latency ΔΣ ADC, I C  
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
24-Bit, Differential Input, No Latency ΔΣ ADC, SPI with  
Temp. Sensor  
2
Easy-Drive Input Current Cancellation, 600nV  
Tiny 10-Lead DFN Package  
24-Bit, Differential Input, No Latency ΔΣ ADC, I C with  
Temp. Sensor  
LTC6241  
LTC2450  
Dual, 18MHz, Low Noise, Rail-to-Rail Op Amp  
550nV Noise, 125μV Offset Max  
P-P  
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V Input  
Range  
2 LSB INL, 50nA Sleep current, Tiny 2mm × 2mm DFN-6 Package,  
30Hz Output Rate  
LTC2450-1  
LTC2451  
LTC2452  
LTC2453  
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V Input  
Range  
2 LSB INL, 50nA Sleep Current, Tiny 2mm × 2mm DFN-6 Package,  
60Hz Output Rate  
2
Easy-to-Use, Ultra-Tiny 16-Bit ADC, I C, 0V to 5.5V Input  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package, Programmable 30Hz/60Hz Output Rates  
Range  
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, SPI, 5.5V  
Input Range  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package  
2
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, I C, 5.5V  
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT  
Package  
Input Range  
No Latency ΔΣ is a trademark of Linear Technology Corporation.  
24602f  
LT 0409 • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
© LINEAR TECHNOLOGY CORPORATION 2009  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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