LTC2617CDE#TRPBF [Linear]
LTC2617 - 14-Bit Dual Rail-to-Rail DAC with I<sup>2</sup>C Interface; Package: DFN; Pins: 12; Temperature Range: 0°C to 70°C;型号: | LTC2617CDE#TRPBF |
厂家: | Linear |
描述: | LTC2617 - 14-Bit Dual Rail-to-Rail DAC with I<sup>2</sup>C Interface; Package: DFN; Pins: 12; Temperature Range: 0°C to 70°C 光电二极管 转换器 |
文件: | 总20页 (文件大小:287K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC2607/LTC2617/LTC2627
16-/14-/12-Bit Dual Rail-to-Rail
2
DACs with I C Interface
Features
Description
The LTC®2607/LTC2617/LTC2627 are dual 16-, 14- and
12-bit, 2.7V to 5.5V rail-to-rail voltage output DACs in a
12-leadDFNpackage.Theyhavebuilt-inhighperformance
output buffers and are guaranteed monotonic.
n
Smallest Pin-Compatible Dual DACs:
LTC2607: 16 Bits
LTC2617: 14 Bits
LTC2627: 12 Bits
n
Guaranteed Monotonic Over Temperature
These parts establish new board-density benchmarks for
16- and 14-bit DACs and advance performance standards
for output drive and load regulation in single-supply,
voltage-output DACs.
n
27 Selectable Addresses
2
n
400kHz I C Interface
n
Wide 2.7V to 5.5V Supply Range
n
Low Power Operation: 260µA per DAC at 3V
2
n
Thepartsusea2-wire, I Ccompatibleserialinterface. The
Power Down to 1µA, Max
n
LTC2607/LTC2617/LTC2627 operate in both the standard
mode (clock rate of 100kHz) and the fast mode (clock rate
of 400kHz). An asynchronous DAC update pin (LDAC) is
also included.
High Rail-to-Rail Output Drive ( 15mA, Min)
n
Ultralow Crosstalk (30µV)
n
Double-Buffered Data Latches
n
Asynchronous DAC Update Pin
n
LTC2607/LTC2617/LTC2627: Power-On Reset to
The LTC2607/LTC2617/LTC2627 incorporate a power-on
resetcircuit.Duringpower-up,thevoltageoutputsriseless
than 10mV above zero scale;and afterpower-up, they stay
at zero scale until a valid write and update take place. The
power-on reset circuit resets the LTC2607-1/LTC2617-1/
LTC2627-1 to mid-scale. The voltage outputs stay at mid-
scale until a valid write and update takes place.
Zero Scale
n
LTC2607-1/LTC2617-1/LTC2627-1: Power-On Reset
to Mid-Scale
Tiny (3mm × 4mm) 12-Lead DFN Package
n
applications
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 5396245 and 6891433. Patent Pending.
n
Mobile Communications
n
Process Control and Industrial Automation
n
Instrumentation
Automatic Test Equipment
n
Block Diagram
9
11
10
8
REFLO
GND
REF
V
CC
Differential Nonlinearity
(LTC2607)
12
V
12-/14-/16-BIT DAC
12-/14-/16-BIT DAC
7
1.0
0.8
V
OUTB
V
= 5V
= 4.096V
CC
OUTA
V
REF
0.6
DAC REGISTER
DAC REGISTER
0.4
0.2
0
INPUT REGISTER
INPUT REGISTER
–0.2
–0.4
–0.6
–0.8
–1.0
32-BIT SHIFT REGISTER
0
16384
32768
CODE
49152
65535
2-WIRE INTERFACE
SDA
2607 BD01b
CA0
CA1
LDAC
SCL
CA2
1
2
3
4
5
6
2607 BD01a
26071727fa
ꢀ
LTC2607/LTC2617/LTC2627
aBsolute maximum ratings
pin conFiguration
(Note 1)
TOP VIEW
Any Pin to GND............................................ –0.3V to 6V
Any Pin to V ............................................. –6V to 0.3V
CA0
CA1
1
2
3
4
5
6
12
V
OUTA
CC
11 REFLO
10 GND
Maximum Junction Temperature .......................... 125°C
Storage Temperature Range .................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec)...................300°C
Operating Temperature Range:
LDAC
SCL
13
9
8
7
REF
SDA
CA2
V
V
CC
OUTB
LTC2607C/LTC2617C/LTC2627C
DE12 PACKAGE
12-LEAD (4mm s 3mm) PLASTIC DFN
LTC2607C-1/LTC2617C-1/LTC2627C-1 .... 0°C to 70°C
LTC2607I/LTC2617I/LTC2627I
T
= 125°C, θ = 43°C/W
JA
JMAX
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
LTC2607I-1/LTC2617I-1/LTC2627I-1....–40°C to 85°C
orDer inFormation
LEAD FREE FINISH
LTC2607CDE#PBF
LTC2607IDE#PBF
LTC2607CDE-1#PBF
LTC2607IDE-1#PBF
LTC2617CDE#PBF
LTC2617IDE#PBF
LTC2617CDE-1#PBF
LTC2617IDE-1#PBF
LTC2627CDE#PBF
LTC2627IDE#PBF
LTC2627CDE-1#PBF
LTC2627IDE-1#PBF
TAPE AND REEL
PART MARKING*
2607
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2607CDE#TRPBF
LTC2607IDE#TRPBF
LTC2607CDE-1#TRPBF
LTC2607IDE-1#TRPBF
LTC2617CDE#TRPBF
LTC2617IDE#TRPBF
LTC2617CDE-1#TRPBF
LTC2617IDE-1#TRPBF
LTC2627CDE#TRPBF
LTC2627IDE#TRPBF
LTC2627CDE-1#TRPBF
LTC2627IDE-1#TRPBF
0°C to 70°C
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
12-Lead (4mm × 3mm) Plastic DFN
2607
–40°C to 85°C
0°C to 70°C
26071
26071
2617
–40°C to 85°C
0°C to 70°C
2617
–40°C to 85°C
0°C to 70°C
26171
26171
2627
–40°C to 85°C
0°C to 70°C
2627
–40°C to 85°C
0°C to 70°C
26271
26271
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
26071727fa
ꢁ
LTC2607/LTC2617/LTC2627
electrical characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), REFLO = 0V,
VOUT unloaded, unless otherwise noted.
LTC2627/LTC2627-1 LTC2617/LTC2617-1 LTC2607/LTC2607-1
SYMBOL PARAMETER
DC Performance
Resolution
CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
l
l
l
l
12
12
14
14
16
16
Bits
Bits
LSB
LSB
Monotonicity
(Note 2)
(Note 2)
DNL
INL
Differential Nonlinearity (Note 2)
0.5
4
1
1
Integral Nonlinearity
Load Regulation
1.5
5
16
19
64
V
= V = 5V, Mid-Scale
CC
OUT
OUT
REF
I
I
l
l
= 0mA to 15mA Sourcing
= 0mA to 15mA Sinking
0.02 0.125
0.03 0.125
0.1
0.1
0.5
0.5
0.35
0.42
2
2
LSB/mA
LSB/mA
V
= V = 2.7V, Mid-Scale
OUT
OUT
REF
I
I
CC
l
l
= 0mA to 7.5mA Sourcing
= 0mA to 7.5mA Sinking
0.04 0.25
0.05 0.25
0.2
0.2
1
1
0.7
0.8
4
4
LSB/mA
LSB/mA
l
l
ZSE
Zero-Scale Error
Offset Error
Code = 0
(Note 6)
1
9
1
1
7
9
9
1
1
7
9
9
mV
mV
V
OS
1
9
V
OS
Temperature
7
µV/°C
Coefficient
l
GE
Gain Error
0.15
4
0.7
0.15
4
0.7
0.15
4
0.7
%FSR
Gain Temperature
Coefficient
ppm/°C
The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.
REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), REFLO = 0V, VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
PSR Power Supply Rejection
CONDITIONS
MIN
TYP
MAX
UNITS
V
10%
–80
dB
CC
R
DC Output Impedance
V
= V = 5V, Mid-Scale;
REF CC
OUT
l
l
–15mA ≤ I
≤ 15mA
0.032
0.035
0.15
0.15
Ω
Ω
OUT
V
= V = 2.7V, Mid-Scale;
CC
REF
–7.5mA ≤ I
≤ 7.5mA
OUT
DC Crosstalk (Note 4)
Due to Full Scale Output Change (Note 5)
Due to Load Current Change
Due to Powering Down (Per Channel)
4
3
30
µV
µV/mA
µV
I
Short-Circuit Output Current
V
= 5.5V, V = 5.5V
SC
CC
REF
l
l
Code: Zero Scale; Forcing Output to V
15
15
36
37
60
60
mA
mA
CC
Code: Full Scale; Forcing Output to GND
V
CC
= 2.7V, V = 2.7V
REF
l
l
Code: Zero Scale; Forcing Output to V
7.5
7.5
22
30
50
50
mA
mA
CC
Code: Full Scale; Forcing Output to GND
Reference Input
Input Voltage Range
l
l
0
V
V
kΩ
pF
CC
Resistance
Normal Mode
44
64
30
80
Capacitance
l
I
Reference Current, Power Down Mode
DAC Powered Down
0.001
1
µA
REF
26071727fa
ꢂ
LTC2607/LTC2617/LTC2627
electrical characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), REFLO = 0V,
VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
Power Supply
CONDITIONS
MIN
TYP
MAX
UNITS
l
V
Positive Supply Voltage
Supply Current
For Specified Performance
2.7
5.5
V
CC
l
l
l
l
I
V
V
= 5V (Note 3)
= 3V (Note 3)
0.66
0.52
0.4
1.3
1
1
1
mA
mA
µA
CC
CC
CC
DAC Powered Down (Note 3) V = 5V
CC
CC
DAC Powered Down (Note 3) V = 3V
0.10
µA
Digital I/O (Note 11)
l
l
V
V
V
Low Level Input Voltage (SDA and SCL)
High Level Input Voltage (SDA and SCL)
Low Level Input Voltage (LDAC)
0.3V
V
V
IL
CC
0.7V
IH
CC
l
l
V
V
= 4.5V to 5.5V
= 2.7V to 5.5V
0.8
0.6
V
V
IL(LDAC)
CC
CC
l
l
V
V
V
High Level Input Voltage (LDAC)
V
V
= 2.7V to 5.5V
= 2.7V to 3.6V
2.4
2.0
V
V
IH(LDAC)
IL(CAn)
IH(CAn)
CC
CC
l
Low Level Input Voltage on CAn
(n = 0, 1, 2)
See Test Circuit 1
0.15V
V
CC
l
l
High Level Input Voltage on CAn (n = 0, 1, 2)
Resistance from CAn (n = 0, 1, 2)
See Test Circuit 1
See Test Circuit 2
0.85V
V
CC
R
R
R
10
10
kΩ
INH
INL
INF
OL
to V to Set CAn = V
CC
CC
l
l
Resistance from CAn (n = 0, 1, 2)
to GND to Set CAn = GND
See Test Circuit 2
See Test Circuit 2
Sink Current = 3mA
kΩ
Resistance from CAn (n = 0, 1, 2)
2
0
MΩ
to V or GND to Set CAn = Float
CC
l
l
V
Low Level Output Voltage
Output Fall Time
0.4
V
t
V = V
to V = V
,
20 + 0.1C
250
ns
OF
O
B
IH(MIN)
O
IL(MAX)
B
C = 10pF to 400pF (Note 9)
l
l
l
l
l
t
I
Pulse Width of Spikes Suppressed by Input Filter
Input Leakage
0
50
1
ns
µA
pF
pF
pF
SP
IN
0.1V ≤ V ≤ 0.9V
CC
IN
CC
C
C
C
I/O Pin Capacitance
Note 12
10
400
10
IN
Capacitive Load for Each Bus Line
B
External Capacitive Load on Address
Pins CAn (n = 0, 1, 2)
CAX
26071727fa
ꢃ
LTC2607/LTC2617/LTC2627
electrical characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), REFLO = 0V,
VOUT unloaded, unless otherwise noted.
LTC2627/LTC2627-1 LTC2617/LTC2617-1 LTC2607/LTC2607-1
SYMBOL PARAMETER
AC Performance
CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
t
Settling Time (Note 7)
0.024% ( 1LSB at 12 Bits)
0.006% ( 1LSB at 14 Bits)
0.0015% ( 1LSB at 16 Bits)
7
7
9
7
9
10
µs
µs
µs
S
Settling Time for 1LSB Step
(Note 8)
0.024% ( 1LSB at 12 Bits)
0.006% ( 1LSB at 14 Bits)
0.0015% ( 1LSB at 16 Bits)
2.7
2.7
4.8
2.7
4.8
5.2
µs
µs
µs
Voltage Output Slew Rate
Capacitive Load Driving
Glitch Impulse
0.8
1000
12
0.8
1000
12
0.8
1000
12
V/µs
pF
At Mid-Scale Transition
nV • s
kHz
Multiplying Bandwidth
180
180
180
e
Output Voltage Noise Density At f = 1kHz
At f = 10kHz
120
100
120
100
120
100
nV/√Hz
nV/√Hz
n
Output Voltage Noise
0.1Hz to 10Hz
15
15
15
µV
P-P
timing characteristics The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (See Figure 1) (Notes 10, 11)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
CC
= 2.7V to 5.5V
l
l
l
l
l
l
l
l
l
l
l
l
f
t
t
t
t
t
t
t
t
t
t
t
SCL Clock Frequency
0
0.6
400
kHz
µs
µs
µs
µs
µs
ns
ns
ns
µs
µs
ns
SCL
Hold Time (Repeated) Start Condition
Low Period of the SCL Clock Pin
High Period of the SCL Clock Pin
Set-Up Time for a Repeated Start Condition
Data Hold Time
HD(STA)
LOW
HIGH
SU(STA)
HD(DAT)
SU(DAT)
r
1.3
0.6
0.6
0
0.9
Data Set-Up Time
100
Rise Time of Both SDA and SCL Signals
Fall Time of Both SDA and SCL Signals
Set-Up Time for Stop Condition
Bus Free Time Between a Stop and Start Condition
(Note 9)
(Note 9)
20 + 0.1C
20 + 0.1C
0.6
300
300
B
f
B
SU(STO)
BUF
1.3
Falling Edge of 9th Clock of the 3rd Input Byte to
LDAC High or Low Transition
400
1
l
t
LDAC Low Pulse Width
20
ns
2
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 5: R = 2kΩ to GND or V .
L CC
Note 6: Inferred from measurement at code k (Note 2) and at full scale.
L
Note 7: V = 5V, V
= 4.096V. DAC is stepped 1/4 scale to 3/4 scale
CC
REF
and 3/4 scale to 1/4 scale. Load is 2k in parallel with 200pF to GND.
Note 2: Linearity and monotonicity are defined from code k to code
L
Note 8: V = 5V, V = 4.096V. DAC is stepped 1LSB between half
CC
REF
N
2N – 1, where N is the resolution and k is given by k = 0.016(2 /V ),
L
L
REF
scale and half scale – 1. Load is 2k in parallel with 200pF to GND.
rounded to the nearest whole code. For V
= 4.096V and N = 16, k =
REF
L
Note 9: C = capacitance of one bus line in pF.
B
256 and linearity is defined from code 256 to code 65,535.
Note 10: All values refer to V
and V
levels.
IL(MAX)
IH(MIN)
Note 3: SDA, SCL and LDAC at 0V or V , CA0, CA1 and CA2 Floating.
CC
Note 11: These specifications apply to LTC2607/LTC2607-1,
LTC2617/LTC2617-1, LTC2627/LTC2627-1.
Note 12: Guaranteed by design and not production tested.
Note 4: DC crosstalk is measured with V = 5V and V
= 4.096V, with
REF
CC
the measured DAC at mid-scale, unless otherwise noted.
26071727fa
ꢄ
LTC2607/LTC2617/LTC2627
typical perFormance characteristics
LTC2607
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
INL vs Temperature
32
24
1.0
0.8
32
24
V
V
= 5V
REF
V
V
= 5V
REF
V
= 5V
CC
= 4.096V
REF
CC
CC
= 4.096V
= 4.096V
V
0.6
16
16
0.4
INL (POS)
INL (NEG)
8
8
0.2
0
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–8
–8
–16
–24
–32
–16
–24
–32
0
16384
32768
CODE
49152
65535
0
16384
32768
CODE
49152
65535
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
2607 G01
2607 G02
2607 G03
DNL vs Temperature
INL vs VREF
DNL vs VREF
1.0
0.8
32
24
1.5
1.0
V
V
= 5V
REF
V
= 5.5V
V
= 5.5V
CC
CC
CC
= 4.096V
0.6
16
0.4
0.5
INL (POS)
INL (NEG)
DNL (POS)
DNL (NEG)
8
DNL (POS)
DNL (NEG)
0.2
0
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–8
–0.5
–1.0
–1.5
–16
–24
–32
–50 –30 –10 10
30
50
70
90
0
1
2
3
4
5
0
1
2
3
4
5
TEMPERATURE (°C)
V
REF
(V)
V
(V)
REF
2607 G04
2607 G05
2607 G06
Settling to 1LSB
Settling of Full-Scale Step
V
OUT
V
OUT
100µV/DIV
±00µV/DIV
±2.3µs
9.7µs
9TH CLOCK
OF 3RD DATA
BYTE
SCL
2V/DIV
SCL
2V/DIV
9TH CLOCK OF
3RD DATA ꢀYTE
2607 G07
2607 G08
2µs/DIV
5µs/DIV
V
= 5V, V
= 4.096V
REF
CC
SETTLING TO ±±LSꢀ
1/4-SCALE TO 3/4-SCALE STEP
= 2k, C = 200pF
V
= 5V, V
= 4.096V
CC
REF
R
L
L
CODE 5±2 TO 65535 STEP
AVERAGE OF 2048 EVENTS
AVERAGE OF 2048 EVENTS
26071727fa
ꢅ
LTC2607/LTC2617/LTC2627
typical perFormance characteristics
LTC2617
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Settling to 1LSB
8
6
1.0
0.8
V
V
= 5V
REF
V
V
= 5V
REF
CC
CC
= 4.096V
= 4.096V
0.6
4
0.4
V
OUT
2
0.2
100µV/DIV
0
0
9TH CLOCK
OF 3RD DATA
BYTE
SCL
2V/DIV
–0.2
–0.4
–0.6
–0.8
–1.0
–2
–4
–6
–8
8.9µs
2607 G11
2µs/DIV
V
= 5V, V
= 4.096V
REF
CC
1/4-SCALE TO 3/4-SCALE STEP
R
= 2k, C = 200pF
L
L
0
4096
8192
CODE
12288
16383
0
4096
8192
CODE
12288
16383
AVERAGE OF 2048 EVENTS
2607 G09
2607 G10
LTC2627
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Settling to 1LSB
2.0
1.5
1.0
0.8
V
V
= 5V
REF
V
V
= 5V
REF
CC
CC
= 4.096V
= 4.096V
0.6
1.0
6.8µs
0.4
V
OUT
0.5
0.2
1mV/DIV
0
0
9TH CLOCK
OF 3RD DATA
BYTE
SCL
2V/DIV
–0.2
–0.4
–0.6
–0.8
–1.0
–0.5
–1.0
–1.5
–2.0
2607 G14
2µs/DIV
= 4.096V
V
= 5V, V
REF
CC
1/4-SCALE TO 3/4-SCALE STEP
= 2k, C = 200pF
R
0
1024
2048
CODE
3072
4095
0
1024
2048
CODE
3072
4095
L
L
AVERAGE OF 2048 EVENTS
2607 G12
2607 G13
26071727fa
ꢆ
LTC2607/LTC2617/LTC2627
typical perFormance characteristics
LTC2607/LTC2617/LTC2627
Current Limiting
Load Regulation
Offset Error vs Temperature
0.10
0.08
0.06
0.04
0.02
0
1.0
0.8
3
2
CODE = MID-SCALE
CODE = MID-SCALE
V
V
= V = 5V
CC
REF
REF
0.6
= V = 3V
CC
0.4
1
0.2
0
0
V
= V = 5V
CC
REF
–0.02
–0.04
–0.06
–0.08
–0.10
–0.2
–0.4
–0.6
–0.8
–1.0
V
= V = 3V
CC
REF
REF
–1
–2
–3
V
= V = 5V
CC
V
= V = 3V
REF CC
–40 –30 –20 –10
0
10 20 30 40
–35 –25 –15 –5
5
15
25
35
–50 –30 –10 10
30
50
70
90
I
(mA)
I
(mA)
TEMPERATURE (°C)
OUT
OUT
2607 G15
2607 G16
2607 G17
Zero-Scale Error vs Temperature
Gain Error vs Temperature
Offset Error vs VCC
3
2.5
2.0
1.5
1.0
0.5
0
0.4
0.3
3
2
0.2
1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–1
–2
–3
–50 –30 –10 10
30
50
70
90
–50 –30 –10 10
30
50
70
90
2.5
3
3.5
4
4.5
5
5.5
TEMPERATURE (°C)
TEMPERATURE (°C)
V
(V)
CC
2607 G18
2607 G19
2607 G20
Gain Error vs VCC
ICC Shutdown vs VCC
0.4
0.3
450
400
350
300
250
200
150
100
50
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
V
(V)
V
(V)
CC
CC
2607 G21
2607 G22
26071727fa
ꢇ
LTC2607/LTC2617/LTC2627
typical perFormance characteristics
LTC2607/LTC2617/LTC2627
Large-Signal Response
Mid-Scale Glitch Impulse
Power-On Reset to Zeroscale
TRANSITION FROM
MS-1 TO MS
V
OUT
V
CC
10mV/DIV
1V/DIV
V
OUT
0.5V/DIV
TRANSITION FROM
MS TO MS-1
9TH CLOCK
OF 3RD DATA
BYTE
4mV PEAK
SCL
2V/DIV
V
= V = 5V
CC
REF
V
OUT
1/4-SCALE TO 3/4-SCALE
10mV/DIV
2607 G24
2607 G25
2.5µs/DIV
2.5µs/DIV
2607 G23
250µs/DIV
Headroom at Rails
vs Output Current
Power-On Reset to Midscale
Supply Current vs Logic Voltage
950
900
850
800
750
700
650
600
550
500
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
= V
CC
REF
5V SOURCING
V
CC
= 5V
SWEEP LDAC
OV TO V
CC
3V SOURCING
1V/DIV
5V SINKING
V
CC
3V SINKING
V
OUT
2607 G27
500µs/DIV
0
1
2
3
4
I
5
(mA)
6
7
8
9
10
0
0.5
1
1.5
2
2.5
5
3
3.5
4
4.5
LOGIC VOLTAGE (V)
OUT
2607 G26
2607 G28
Output Voltage Noise,
0.1Hz to 10Hz
Multiplying Bandwidth
Supply Current vs Logic Voltage
0
–3
1300
1200
1100
1000
V
= 5V
CC
SWEEP SCL AND
SDA OV TO V
AND V TO OV
CC
–6
CC
–9
–12
–15
–18
–21
–24
–27
–30
–33
–36
V
OUT
HYSTERSIS
370mV
10µV/DIV
900
800
700
600
500
V
V
V
= 5V
CC
(DC) = 2V
REF
REF
0
1
2
3
4
5
6
7
8
9
10
(AC) = 0.2V
P-P
CODE = FULL SCALE
SECONDS
2607 G31
1k
10k
100k
1M
1
2
4
0
5
3
FREQUENCY (Hz)
LOGIC VOLTAGE (V)
2607 G30
2607 G029
26071727fa
ꢈ
LTC2607/LTC2617/LTC2627
typical perFormance characteristics
LTC2607/LTC2617/LTC2627
Short-Circuit Output Current vs
VOUT (Sinking)
Short-Circuit Output Current vs
VOUT (Sourcing)
50
0
–10
–20
–30
V
V
= 5.5V
REF
CODE = 0
V
V
= 5.5V
REF
CC
CC
= 5.6V
= 5.6V
CODE = FULL SCALE
40
30
20
V
SWEPT 0V TO V
V
SWEPT V TO 0V
OUT
CC
OUT CC
10
0
–40
–50
0
2
3
4
5
6
0
2
3
4
5
6
1
1
1V/DIV
1V/DIV
2607 G32
2607 G33
pin Functions
CA0 (Pin 1): Chip Address Bit 0. Tie this pin to V , GND
CA2 (Pin 6): Chip Address Bit 2. Tie this pin to V , GND
CC
CC
2
2
or leave it floating to select an I C slave address for the
or leave it floating to select an I C slave address for the
part (Table 1).
part (Table 1).
CA1 (Pin 2): Chip Address Bit 1. Tie this pin to V , GND
V
(Pin 7): DAC Analog Voltage Output. The output
OUTB
CC
2
or leave it floating to select an I C slave address for the
range is V
to V
.
REFLO
REF
part (Table 1).
V
(Pin 8): Supply Voltage Input. 2.7V ≤ V ≤ 5.5V.
CC
CC
LDAC (Pin 3): Asynchronous DAC Update. A falling edge
of this input after four bytes have been written into the part
immediately updates the DAC register with the contents of
the input register. A low on this input without a complete
32-bit (four bytes including the slave address) data write
transfer to the part wakes up sleeping DACs without up-
dating the DAC output. Software power-down is disabled
when LDAC is low. LDAC is disabled when tied high.
REF (Pin 9): Reference Voltage Input. The input range
is V ≤ V ≤ V .
REFLO
REF
CC
GND (Pin 10): Analog Ground.
REFLO (Pin 11): Reference Low. The voltage at this pin
sets the zero scale (ZS)voltage ofallDACs. The V
pin
REFLO
can be used at voltages up to 1V for V = 5V, or 100mV
CC
for V = 3V.
CC
SCL (Pin 4): Serial Clock Input Pin. Data is shifted into
the SDA pin at the rising edges of the clock. This high
impedance pin requires a pull-up resistor or current
V
(Pin 12): DAC Analog Voltage Output. The output
OUTA
range is V
to V
.
REFLO
REF
Exposed Pad (Pin 13): Ground. Must be soldered to
PCB ground.
source to V .
CC
SDA (Pin 5): Serial Data Bidirectional Pin. Data is shifted
into the SDA pin and acknowledged by the SDA pin. This
pin is high impedance while data is shifted in and an open-
drainN-channeloutputduringacknowledgment.Requires
a pull-up resistor or current source to V
CC.
26071727fa
ꢀ0
LTC2607/LTC2617/LTC2627
Block Diagram
9
11
10
8
REFLO
GND
REF
V
CC
12-/14-/16-BIT DAC
12-/14-/16-BIT DAC
12
V
7
V
OUTB
OUTA
DAC REGISTER
DAC REGISTER
INPUT REGISTER
INPUT REGISTER
32-BIT SHIFT REGISTER
2-WIRE INTERFACE
SDA
CA0
CA1
LDAC
SCL
CA2
5
6
1
2
3
4
2607 BD
test circuits
Test Circuit 1
Test Circuit 2
V
DD
R
/R /R
INH INL INF
100Ω
/V
CAn
CAn
V
IH(CAn) IL(CAn)
GND
2607 TC
26071727fa
ꢀꢀ
LTC2607/LTC2617/LTC2627
timing Diagrams
26071727fa
ꢀꢁ
LTC2607/LTC2617/LTC2627
operation
Power-On Reset
2
specifications. For an I C bus operating in the fast mode,
anactivepull-upwillbenecessaryifthebuscapacitanceis
The LTC2607/LTC2617/LTC2627 clear the outputs to
zero scale when power is first applied, making system
initialization consistent and repeatable. The LTC2607-1/
LTC2617-1/LTC2627-1setthevoltageoutputstomidscale
when power is first applied.
greaterthan200pF. TheV powershouldnotberemoved
CC
2
from the LTC2607/LTC2617/LTC2627 when the I C bus
2
is active to avoid loading the I C bus lines through the
internal ESD protection diodes.
The LTC2607/LTC2617/LTC2627 are receive-only (slave)
devices. The master can write to the LTC2607/LTC2617/
LTC2627.TheLTC2607/LTC2617/LTC2627donotrespond
to a read from the master.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero
outputs from the DAC during this time. The LTC2607/
LTC2617/LTC2627 contain circuitry to reduce the power-
on glitch; furthermore, the glitch amplitude can be made
arbitrarily small by reducing the ramp rate of the power
supply. For example, if the power supply is ramped to 5V
in 1ms, the analog outputs rise less than 10mV above
ground (typ) during power-on. See Power-On Reset Glitch
in the Typical Performance Characteristics section.
The START (S) and STOP (P) Conditions
When the bus is not in use, both SCL and SDA must be
high. A bus master signals the beginning of a communica-
tion to a slave device by transmitting a START condition. A
START condition is generated by transitioning SDA from
high to low while SCL is high.
Power Supply Sequencing
When the master has finished communicating with the
slave, it issues a STOP condition. A STOP condition is
generated by transitioning SDA from low to high while
SCL is high. The bus is then free for communication with
The voltage at REF (Pin 9) should be kept within the range
–0.3V ≤ V ≤ V + 0.3V (see Absolute Maximum Rat-
REF
CC
ings). Particular care should be taken to observe these
2
limitsduringpowersupplyturn-onandturn-offsequences,
another I C device.
when the voltage at V (Pin 8) is in transition.
CC
Acknowledge
Transfer Function
The Acknowledge signal is used for handshaking between
the master and the slave. An Acknowledge (active LOW)
generated by the slave lets the master know that the lat-
est byte of information was received. The Acknowledge
related clock pulse is generated by the master. The master
releasestheSDAline(HIGH)duringtheAcknowledgeclock
pulse. The slave-receiver must pull down the SDA bus line
during the Acknowledge clock pulse so that it remains a
stable LOW during the HIGH period of this clock pulse.
The LTC2607/LTC2617/LTC2627 respond to a write by a
master in this manner. The LTC2607/LTC2617/LTC2627
do not acknowledge a read (retains SDA HIGH during the
period of the Acknowledge clock pulse).
The digital-to-analog transfer function is:
k
VOUT(IDEAL)
=
VREF − VREFLO + V
REFLO
(
)
N
2
where k is the decimal equivalent of the binary DAC
input code, N is the resolution and V
REF (Pin 6).
is the voltage at
REF
Serial Digital Interface
The LTC2607/LTC2617/LTC2627 communicate with a
2
host using the standard 2-wire I C interface. The Timing
Diagrams (Figures 1 and 2) show the timing relationship
of the signals on the bus. The two bus lines, SDA and
SCL, must be high when the bus is not in use. External
pull-up resistors or current sources are required on these
lines. The value of these pull-up resistors is dependent
Chip Address
The state of CA0, CA1 and CA2 decides the slave address
of the part. The pins CA0, CA1 and CA2 can be each set
to any one of three states: V , GND or float. This results
CC
2
on the power supply and can be obtained from the I C
26071727fa
ꢀꢂ
LTC2607/LTC2617/LTC2627
operation
in 27 selectable addresses for the part. The slave address
assignments are shown in Table 1.
The addresses corresponding to the states of CA0, CA1
and CA2 and the global address are shown in Table 1. The
maximum capacitive load allowed on the address pins
(CA0,CA1andCA2)is10pF,asthesepinsaredrivenduring
address detection to determine if they are floating.
Table 1. Slave Address Map
CA2
GND
CA1
GND
CA0
GND
SA6 SA5 SA4 SA3 SA2 SA1 SA0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
GND
GND
FLOAT
Write Word Protocol
GND
GND
V
CC
The master initiates communication with the LTC2607/
LTC2617/LTC2627withaSTARTconditionanda7-bitslave
address followed by the Write bit (W) = 0. The LTC2607/
LTC2617/LTC2627 acknowledges by pulling the SDA pin
low at the 9th clock if the 7-bit slave address matches the
address of the parts (set by CA0, CA1 and CA2) or the
global address. The master then transmits three bytes of
data.TheLTC2607/LTC2617/LTC2627acknowledgeseach
byte of data by pulling the SDA line low at the 9th clock of
eachdatabytetransmission.Afterreceivingthreecomplete
bytesofdata,theLTC2607/LTC2617/LTC2627executesthe
command specified in the 24-bit input word.
GND
FLOAT
GND
GND
FLOAT FLOAT
FLOAT
GND
V
CC
GND
V
CC
V
CC
V
CC
GND
GND
FLOAT
GND
V
CC
FLOAT
FLOAT
FLOAT
GND
GND
GND
GND
FLOAT
V
CC
FLOAT FLOAT
FLOAT FLOAT FLOAT
FLOAT FLOAT
GND
V
CC
If more than three data bytes are transmitted after a valid
7-bitslaveaddress,theLTC2607/LTC2617/LTC2627donot
acknowledge the extra bytes of data (SDA is high during
the 9th clock).
FLOAT
FLOAT
FLOAT
V
V
V
GND
CC
CC
CC
FLOAT
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
The format of the three data bytes is shown in Figure 3.
The first byte of the input word consists of the 4-bit com-
mandwordC3-C0, and4-bitDACaddressA3-A0. Thenext
two bytes consist of the 16-bit data word. The 16-bit data
word consists of the 16-, 14- or 12-bit input code, MSB
to LSB, followed by 0, 2 or 4 don’t care bits (LTC2607,
LTC2617 and LTC2627 respectively). A typical LTC2607
write transaction is shown in Figure 4.
FLOAT
GND
V
CC
FLOAT
GND
FLOAT FLOAT
FLOAT
V
CC
V
V
V
GND
CC
CC
CC
FLOAT
V
CC
GLOBAL ADDRESS
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 2. The first four commands in the table
consist of write and update operations. A write operation
loads a 16-bit data word from the 32-bit shift register
into the input register of the selected DAC, n. An update
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DAC if it had been in power-down mode. The data path
and registers are shown in the Block Diagram.
In addition to the address selected by the address pins,
the parts also respond to a global address. This address
allows a common write to all LTC2607, LTC2617 and
LTC2627 parts to be accomplished with one 3-byte write
transaction on the I C bus. The global address is a 7-bit
on-chip hardwired address and is not selectable by CA0,
CA1 and CA2.
2
26071727fa
ꢀꢃ
LTC2607/LTC2617/LTC2627
operation
Write Word Protocol for LTC2607/LTC2617/LTC1627
W
A
1STDATABYTE
A
2NDDATABYTE
A
3RDDATABYTE
A
P
S
SLAVEADDRESS
INPUT WORD
Input Word (LTC2607)
C3
C1
A3 A2 A1
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
C2
C0
A0
A0
A0
1ST DATA BYTE
2ND DATA BYTE
3RD DATA BYTE
Input Word (LTC2617)
C3
C1
A3 A2 A1
D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
2ND DATA BYTE 3RD DATA BYTE
X
X
X
C2
C0
1ST DATA BYTE
Input Word (LTC2627)
C3
C1
A3 A2 A1
D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X
X
X
C2
C0
2607 F03
1ST DATA BYTE
2ND DATA BYTE
3RD DATA BYTE
Figure 3
appropriateDACaddress. The16-bitdatawordisignored.
Thesupplyandreferencecurrentsarereducedbyapproxi-
mately 50% for each DAC powered down; the effective
resistance at REF (Pin 9) rises accordingly, becoming a
high-impedance input (typically > 1GΩ) when both DACs
are powered down.
Table 2
COMMAND*
C3 C2 C1 C0
0
0
0
0
1
0
0
0
1
1
0
0
1
0
1
0
1
1
0
1
Write to Input Register
Update (Power Up) DAC Register
Write to and Update (Power Up)
Power Down
Normal operation can be resumed by executing any
command which includes a DAC update, as shown in
Table 2 or performing an asychronous update (LDAC) as
describedinthenextsection.TheselectedDACispowered
upasitsvoltageoutputisupdated.WhenaDACinpowered-
down state is powered up and updated, normal settling
is delayed. If one of the two DACs is in a powered- down
state prior to the update command, the power up delay is
5µs. If on the other hand, both DACs are powered down,
the main bias generation circuit has been automatically
shut down in addition to the DAC amplifiers and reference
input and so the power up delay time is
No Operation
ADDRESS*
A3 A2 A1 A0
0
0
1
0
0
1
0
0
1
0
1
1
DAC A
DAC B
All DACs
*Command and address codes not shown are reserved and should not be used.
Power-Down Mode
Forpower-constrainedapplications,thepower-downmode
can be used to reduce the supply current whenever one or
both of the DAC outputs are not needed. When in power-
down,thebufferamplifiers,biascircuitsandreferenceinput
are disabled and draw essentially zero current. The DAC
outputsareputintoahighimpedancestate,andtheoutput
12µs (for V = 5V) or 30µs (for V = 3V)
CC
CC
Asynchronous DAC Update Using LDAC
In addition to the update commands shown in Table 2, the
LDAC pin asynchronously updates the DAC registers with
the contents of the input registers. Asynchronous update
is disabled when the input word is being clocked into
the part.
pins are passively pulled to V
through 90k resistors.
REFLO
Input-registerandDAC-registercontentsarenotdisturbed
during power-down.
Either or both DAC channels can be put into power-down
mode by using command 0100b in combination with the
26071727fa
ꢀꢄ
LTC2607/LTC2617/LTC2627
operation
If a complete input word has been written to the part, a low
on the LDAC pin causes the DAC registers to be updated
with the contents of the input registers.
Board Layout
The excellent load regulation performance is achieved in
partbyseparatingthesignalandpowergroundsasREFLO
and GND pins, respectively.
If the input word is being written to the part, a low going
pulseontheLDACpinbeforethecompletionofthreebytes
ofdatapowersuptheDACsbutdoesnotcausetheoutputs
to be updated. If LDAC remains low after a complete input
wordhasbeenwrittentothepart,thenLDACisrecognized,
the command specified in the 24-bit word just transferred
is executed and the DAC outputs updated.
The PC Board should have separate areas for the analog
and digital sections of the circuit. This keeps the digital
signals away from the sensitive analog signals and facili-
tates the use of separate digital and analog ground planes
that have minimal interaction with each other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground. Ideally, the
analog ground plane should be located on the component
side of the board, and should be allowed to run under the
part to shield it from noise. Analog ground should be a
continuous and uninterrupted plane, except for necessary
lead pads and vias, with signal traces on another layer.
The DACs are powered up when LDAC is taken low, inde-
2
pendent of any activity on the I C bus.
If LDAC is low at the falling edge of the 9th clock of the
3rd byte of data, it inhibits any software power-down
command that was specified in the input word. LDAC is
disabled when tied high.
The GND pin functions as a return path for power supply
currents in the device and should be connected to analog
ground. Resistance from the GND pin to the analog power
supply return should be as low as possible. Resistance
herewilladddirectlytothechannelresistanceoftheoutput
device when sinking load current. When a zero scale DAC
output voltage of zero is required, the REFLO pin should
be connected to system star ground. Any shared trace
resistance between REFLO and GND pins is undesirable
since it adds to the effective DC output impedance (typi-
Voltage Output
Both of the two rail-to-rail amplifiers have guaranteed
load regulation when sourcing or sinking up to 15mA at
5V (7.5mA at 3V).
Load regulation is a measure of the amplifiers’ ability to
maintain the rated voltage accuracy over a wide range
of load conditions. The measured change in output volt-
age per milliampere of forced load current change is
expressed in LSB/mA.
Ω) of the part.
cally 0.035
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifiers’ DC output
impedance is 0.035Ω when driving a load well away from
the rails.
Rail-to-Rail Output Considerations
Inanyrail-to-railvoltageoutputdevice,theoutputislimited
to voltages within the supply range.
Since the analog output of the device cannot go below
ground,itmaylimitforthelowestcodesasshowninFigure
5b. Similarly, limiting can occur near full scale when the
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited
by the 30Ω typical channel resistance of the output
devices; e.g., when sinking 1mA, the minimum output
voltage = 30Ω • 1mA = 30mV. See the graph Headroom
at Rails vs Output Current in the Typical Performance
Characteristics section.
REF pin is tied to V . If V = V and the DAC full-scale
CC
REF
CC
error (FSE) is positive, the output for the highest codes
limits at V as shown in Figure 5c. No full-scale limiting
CC
will occur if V is less than V – FSE.
REF
CC
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting
can occur.
The amplifiers are stable driving capacitive loads of up
to 1000pF.
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ꢀꢅ
LTC2607/LTC2617/LTC2627
operation
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ꢀꢆ
LTC2607/LTC2617/LTC2627
package Description
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
0.70 p0.05
3.30 p0.05
1.70 p 0.05
3.60 p0.05
2.20 p0.05
PACKAGE OUTLINE
0.25 p 0.05
2.50 REF
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.40 p 0.10
4.00 p0.10
(2 SIDES)
R = 0.115
TYP
7
12
R = 0.05
TYP
3.30 p0.10
3.00 p0.10
(2 SIDES)
1.70 p 0.10
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45o
CHAMFER
(UE12/DE12) DFN 0806 REV D
6
1
0.25 p 0.05
0.75 p0.05
0.200 REF
0.50 BSC
2.50 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
26071727fa
ꢀꢇ
LTC2607/LTC2617/LTC2627
revision history
REV
DATE
DESCRIPTION
PAGE NUMBER
A
1/10
Revised Features
1
2
Added Pin Configuration and Updated Order Information
Added Text to Serial Digital Interface Section
13
26071727fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
ꢀꢈ
LTC2607/LTC2617/LTC2627
typical application
Demo Circuit Schematic. Onboard 20-Bit ADC Measures Key Performance Parameters
5V
5V
V
REF
1V TO 5V
0.1µF
8
6
REF
2
1
V
CC
3
1
2
6
V
FS
CC
LDAC
CA0
CA1
CA2
SET
100Ω
7.5k
7
3
4
V
CH 1
CH 0
OUTB
9
8
7
SCK
SDO
CS
DAC
OUTPUT B
LTC2607
SPI BUS
LTC2422
4
5
100Ω
7.5k
12
2
SCL
SDA
V
I C BUS
OUTA
10
F
O
ZS
GND
6
DAC
OUTPUT A
SET
5
GND
10, 13
REFLO
2607 TA01
relateD parts
PART NUMBER
DESCRIPTION
COMMENTS
LTC1458: V = 4.5V to 5.5V, V
LTC1458/LTC1458L
Quad 12-Bit Rail-to-Rail Output DACs with Added Functionality
= 0V to 4.096V
OUT
OUT
CC
LTC1458L: V = 2.7V to 5.5V, V
= 0V to 2.5V
CC
LTC1654
Dual 14-Bit Rail-to-Rail V DAC
Programmable Speed/Power, 3.5µs/750µA, 8µs/450µA
= 5V(3V), Low Power, Deglitched
OUT
LTC1655/LTC1655L
LTC1657/LTC1657L
LTC1660/LTC1665
LTC1664
Single 16-Bit V
DACs with Serial Interface in SO-8
V
CC
OUT
Parallel 5V/3V 16-Bit V
DACs
Low Power, Deglitched, Rail-to-Rail V
OUT
OUT
Octal 10/8-Bit V
DACs in 16-Pin Narrow SSOP
V
CC
V
CC
= 2.7V to 5.5V, Micropower, Rail-to-Rail Output
OUT
Quad 10-Bit V
DAC in 16-Pin Narrow SSOP
= 2.7V to 5.5V, Micropower, Rail-to-Rail Output
OUT
LTC1821
Parallel 16-Bit Voltage Output DAC
Octal 16-/14-/12-Bit V DACs in 16-Lead SSOP
Precision 16-Bit Settling in 2µs for 10V Step
LTC2600/LTC2610/
LTC2620
250µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail
Output, SPI Serial Interface
OUT
LTC2601/LTC2611/
LTC2621
Single 16-/14-/12-Bit V
DACs in 10-Lead DFN
300µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail
Output, SPI Serial Interface
OUT
LTC2602/LTC2612/
LTC2622
Dual 16-/14-/12-Bit V
DACs in 8-Lead MSOP
DACs in 16-Lead SSOP
300µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail
Output, SPI Serial Interface
OUT
LTC2604/LTC2614/
LTC2624
Quad 16-/14-/12-Bit V
Octal 16-/14-/12-Bit V
250µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail
Output, SPI Serial Interface
OUT
2
LTC2605/LTC2615/
LTC2625
DACs with I C Interface
250µA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail
OUT
2
Output, I C Interface
2
LTC2606/LTC2616/
LTC2626
16-/14-/12-Bit V
DACs with I C Interface
270µA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail
OUT
2
Output, I C Interface
2
LTC2609/LTC2619/
LTC2629
Quad 16-/14-/12-Bit V
DACs with I C Interface
250µA Range per DAC, 2.7V to 5.5V Supply Range,
OUT
Rail-to-Rail Output with Separate V Pins for Each DAC
REF
26071727fa
LT 0110 REV A • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
ꢁ0
●
●
LINEAR TECHNOLOGY CORPORATION 2005
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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