LTC2625CGN-1#TR [Linear]
LTC2625 - Octal 12-Bit Rail-to-Rail DACs in 16-Lead SSOP; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C;型号: | LTC2625CGN-1#TR |
厂家: | Linear |
描述: | LTC2625 - Octal 12-Bit Rail-to-Rail DACs in 16-Lead SSOP; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C 转换器 数模转换器 光电二极管 |
文件: | 总16页 (文件大小:317K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC2605/LTC2615/LTC2625
Octal 16-/14-/12-Bit
Rail-to-Rail DACs in 16-Lead SSOP
U
DESCRIPTIO
FEATURES
The LTC®2605/LTC2615/LTC2625 are octal 16-, 14-
and 12-bit,2.7Vto5.5Vrail-to-railvoltage-outputDACsin
16-lead narrow SSOP packages. They have built-in
high performance output buffers and are guaranteed
monotonic.
■
Smallest Pin-Compatible Octal DACs:
LTC2605: 16 Bits
LTC2615: 14 Bits
LTC2625: 12 Bits
■
Guaranteed Monotonic Over Temperature
400kHz I2C Interface
Wide 2.7V to 5.5V Supply Range
■
These parts establish new board-density benchmarks
for 16- and 14-bit DACs and advance performance
standards for output drive, crosstalk and load regulation
in single-supply, voltage-output multiples.
The parts use the 2-wire I2C compatible serial interface.
The LTC2605/LTC2615/LTC2625 operate in both the
standard mode (maximum clock rate of 100kHz) and the
fast mode (maximum clock rate of 400kHz).
■
■
Low Power Operation: 250µA per DAC at 3V
■
Individual Channel Power-Down to 1µA, Max
■
Ultralow Crosstalk Between DACs (<10µV)
■
High Rail-to-Rail Output Drive (±15mA, Min)
■
■
■
Double-Buffered Digital Inputs
27 Selectable Addresses
LTC2605/LTC2615/LTC2625: Power-On Reset to
Zero Scale
The LTC2605/LTC2615/LTC2625 incorporate a power-on
■
■
LTC2605-1/LTC2615-1/LTC2625-1: Power-On Reset
reset circuit. During power-up, the voltage outputs rise
lessthan10mVabovezeroscale;andafterpower-up, they
stay at zero scale until a valid write and update take place.
The power-on reset circuit resets the LTC2605-1/
LTC2615-1/LTC2625-1 to midscale. The voltage output
stays at midscale until a valid write and update
takes place.
to Midscale
Tiny 16-Lead Narrow SSOP Package
U
APPLICATIO S
■
Mobile Communications
■
■
■
Process Control and Industrial Automation
Instrumentation
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Automatic Test Equipment
W
BLOCK DIAGRA
GND
1
16
15
V
V
CC
DAC A
DAC H
V
2
OUT A
OUT H
Differential Nonlinearity (LTC2605)
1.0
V
V
= 5V
REF
CC
DAC B
DAC C
DAC G
DAC F
V
V
V
OUT G
V
OUT F
3
4
14
13
OUT B
OUT C
0.8
0.6
= 4.096V
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
DAC D
DAC E
V
V
5
12
OUT D
OUT E
REF
CA0
CA1
6
7
11
10
32-BIT SHIFT REGISTER
2-WIRE INTERFACE
0
16384
32768
CODE
49152
65535
CA2
2605 G02
9
SDA
SCL
8
2605/15/25 BD
2605f
1
LTC2605/LTC2615/LTC2625
W W W
U
(Note 1)
ABSOLUTE AXI U RATI GS
Any Pin to GND........................................... –0.3V to 6V
Any Pin to VCC .............................................–6V to 0.3V
Maximum Junction Temperature .......................... 125°C
Storage Temperature Range ................ –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
Operating Temperature Range
LTC2605C/LTC2615C/LTC2625C ............. 0°C to 70°C
LTC2605C-1/LTC2615C-1/LTC2625C-1 ... 0°C to 70°C
LTC2605I/LTC2615I/LTC2625I ............ –40°C to 85°C
LTC2605I-1/LTC2615I-1/LTC2625I-1 .. –40°C to 85°C
W U
/O
PACKAGE RDER I FOR ATIO
ORDER PART NUMBER
GN PART MARKING
TOP VIEW
LTC2605CGN
LTC2605CGN-1
LTC2605IGN
LTC2605IGN-1
LTC2615CGN
LTC2615CGN-1
LTC2615IGN
2605
1
2
3
4
5
6
7
8
V
V
V
V
V
16
15
14
13
12
11
10
9
GND
CC
26051
2605I
26O5I1
2615
V
V
V
V
OUT H
OUT G
OUT F
OUT E
OUT A
OUT B
OUT C
OUT D
REF
26151
2615I
2615I1
2625
26251
2625I
2625I1
CA0
CA1
SDA
CA2
SCL
LTC2615IGN-1
LTC2625CGN
LTC2625CGN-1
LTC2625IGN
GN PACKAGE
16-LEAD PLASTIC SSOP
= 125°C, θ = 150°C/W
T
JMAX
JA
LTC2625IGN-1
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), VOUT unloaded,
unless otherwise noted.
LTC2625/-1
LTC2615/-1
LTC2605/-1
SYMBOL PARAMETER
DC Performance
Resolution
CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
●
●
●
●
12
12
14
14
16
16
Bits
Bits
LSB
LSB
Monotonicity
(Note 2)
(Note 2)
DNL
INL
Differential Nonlinearity (Note 2)
±0.5
±4
±1
±1
Integral Nonlinearity
Load Regulation
±1
±4 ±16
±18 ±64
V
= V = 5V, Midscale
CC
OUT
OUT
REF
I
I
= 0mA to 15mA Sourcing
= 0mA to 15mA Sinking
●
●
0.02 0.125
0.03 0.125
0.07 0.5
0.10 0.5
0.3
0.4
2
2
LSB/mA
LSB/mA
V
= V = 2.7V, Midscale
OUT
OUT
REF
I
I
CC
= 0mA to 7.5mA Sourcing
= 0mA to 7.5mA Sinking
●
●
0.04 0.25
0.07 0.25
0.15
0.20
1
1
0.6
0.8
4
4
LSB/mA
LSB/mA
ZSE
Zero-Scale Error
Offset Error
Code = 0
(Note 4)
●
●
1.7
±1
±5
9
1.7
±1
±5
9
1.7
±1
±5
9
mV
mV
V
OS
±9
±9
±9
V
OS
Temperature
µV/°C
Coefficient
GE
Gain Error
●
±0.1 ±0.7
±8
±0.1 ±0.7
±8
±0.1 ±0.7
±8
%FSR
Gain Temperature
Coefficient
ppm/°C
2605f
2
LTC2605/LTC2615/LTC2625
E
LECTRICAL CHARACTERISTICS The ● denotes specifications which apply over the full operating
unless otherwise noted. (Note 9)
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), VOUT unloaded,
SYMBOL PARAMETER
PSR Power Supply Rejection
CONDITIONS
MIN
TYP
MAX
UNITS
V
±10%
–80
dB
CC
R
OUT
DC Output Impedance
V
V
= V = 5V, Midscale; –15mA ≤ I ≤ 15mA
OUT
●
●
0.02
0.03
0.15
0.15
Ω
Ω
REF
REF
CC
= V = 2.7V, Midscale; –7.5mA ≤ I
≤ 7.5mA
CC
OUT
DC Crosstalk (Note 10)
Due to Full Scale Output Change (Note 11)
Due to Load Current Change
Due to Powering Down (per Channel)
±10
±3.5
±7
µV
µV/mA
µV
I
Short-Circuit Output Current
V
= 5.5V, V = 5.5V
CC REF
SC
Code: Zero Scale; Forcing Output to V
●
●
15
15
34
34
60
60
mA
mA
CC
Code: Full Scale; Forcing Output to GND
V
= 2.7V, V = 2.7V
CC
REF
Code: Zero Scale; Forcing Output to V
●
●
7.5
7.5
20
27
50
50
mA
mA
CC
Code: Full Scale; Forcing Output to GND
Reference Input
Input Voltage Range
●
●
0
V
V
kΩ
pF
CC
Resistance
Normal Mode
11
16
90
20
Capacitance
I
Reference Current, Power Down Mode DAC Powered Down
●
0.001
1
µA
REF
Power Supply
V
Positive Supply Voltage
Supply Current
For Specified Performance
●
2.7
5.5
V
CC
I
V
V
= 5V (Note 3)
= 3V (Note 3)
●
●
●
●
2.50
2.00
0.38
0.16
4.0
3.2
1.0
1.0
mA
mA
µA
CC
CC
CC
DAC Powered Down (Note 3) V = 5V
CC
CC
DAC Powered Down (Note 3) V = 3V
µA
Digital I/O (Note 9)
V
Low Level Input Voltage
(SDA and SCL)
●
●
0.3V
V
V
IL
CC
V
High Level Input Voltage
(SDA and SCL)
0.7V
CC
IH
V
V
Low Level Input Voltage (CA0 to CA2) See Test Circuit 1
High Level Input Voltage (CA0 to CA2) See Test Circuit 1
●
●
●
0.15V
V
V
IL(CA)
IH(CA)
CC
0.85V
CC
R
R
R
Resistance from CA (n = 0,1,2)
See Test Circuit 2
See Test Circuit 2
See Test Circuit 2
Sink Current = 3mA
10
10
kΩ
INH
INL
INF
OL
n
to V to Set CA = V
CC
CC
n
Resistance from CA (n = 0,1,2)
●
●
kΩ
n
to GND to Set CA = GND
n
Resistance from CA (n = 0,1,2)
2
0
MΩ
n
to V or GND to Set CA = FLOAT
CC
n
V
Low Level Output Voltage
Output Fall Time
●
●
0.4
V
t
t
I
V = V
to V = V
,
20 + 0.1C
250
ns
OF
O
IH(MIN)
O
IL(MAX)
B
C = 10pF to 400pF (Note 7)
B
Pulse Width of Spikes Surpassed
by Input Filter
●
0
50
ns
SP
Input Leakage
0.1V ≤ V ≤ 0.9V
●
●
●
●
1
µA
pF
pF
pF
IN
CC
IN
CC
C
C
C
I/O Pin Capacitance
(Note 12)
10
IN
Capacitance Load for Each Bus Line
400
10
B
External Capacitive Load on
Address Pins CA0, CA1 and CA2
CAn
2605f
3
LTC2605/LTC2615/LTC2625
The ● denotes specifications which apply over the full operating
ELECTRICAL CHARACTERISTICS
unless otherwise noted.
temperature range, otherwise specifications are at TA = 25°C. REF = 4.096V (VCC = 5V), REF = 2.048V (VCC = 2.7V), VOUT unloaded,
LTC2625/-1
LTC2615/-1
LTC2605/-1
SYMBOL PARAMETER
AC Performance
CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
t
Settling Time (Note 5)
±0.024% (±1LSB at 12 Bits)
±0.006% (±1LSB at 14 Bits)
±0.0015% (±1LSB at 16 Bits)
7
7
9
7
9
10
µs
µs
µs
S
Settling Time for 1LSB Step
(Note 6)
±0.024% (±1LSB at 12 Bits)
±0.006% (±1LSB at 14 Bits)
±0.0015% (±1LSB at 16 Bits)
2.7
2.7
4.8
2.7
4.8
5.2
µs
µs
µs
Voltage Output Slew Rate
Capacitive Load Driving
Glitch Impulse
0.80
1000
12
0.80
1000
12
0.80
1000
12
V/µs
pF
At Midscale Transition
nV • s
kHz
Multiplying Bandwidth
180
180
180
e
Output Voltage Noise Density At f = 1kHz
At f = 10kHz
120
100
120
100
120
100
nV/√Hz
nV/√Hz
n
Output Voltage Noise
0.1Hz to 10Hz
15
15
15
µV
P-P
W U
TI I G CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (See Figure 1) (Notes 8, 9)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
= 2.7V to 5.5V
CC
f
t
t
t
t
t
t
t
t
t
t
SCL Clock Frequency
●
●
●
●
●
●
●
●
●
●
●
0
0.6
400
kHz
µs
µs
µs
µs
µs
ns
ns
ns
µs
µs
SCL
Hold Time (Repeated) Start Condition
Low Period of the SCL Clock Pin
High Period of the SCL Clock Pin
Set-Up Time for a Repeated Start Program
Data Hold Time
HD(STA)
LOW
1.3
0.6
HIGH
SU(STA)
HD(DAT)
SU(DAT)
r
0.6
0
0.9
Data Set-Up Time
100
Rise Time of Both SDA and SCL Signals
Fall Time of Both SDA and SCL Signals
Set-Up Time for Stop Condition
Bus Free Time Between a Stop and Start Condition
(Note 7)
(Note 7)
20 + 0.1C
20 + 0.1C
0.6
300
300
B
f
B
SU(STO)
BUF
1.3
Note 1: Absolute maximum ratings are those values beyond which the life
of a device may be impaired.
Note 6: V = 5V, V = 4.096V. DAC is stepped ±1LSB between half
CC REF
scale and half scale – 1. Load is 2kΩ in parallel with 200pF to GND.
Note 7: C = capacitance of one bus line in pF.
Note 2: Linearity and monotonicity are defined from code k to code
L
B
N
N
2 – 1, where N is the resolution and k is given by k = 0.016(2 /V ),
L
L
REF
Note 8: All values refer to V
and V
levels.
IH(MIN)
IL(MAX)
rounded to the nearest whole code. For V = 4.096V and N = 16,
REF
Note 9: These specifications apply to LTC2605/LTC2605-1, LTC2615/
LTC2615-1 and LTC2625/LTC2625-1.
k = 256 and linearity is defined from code 256 to code 65,535.
L
Note 3: SDA, SCL at 0V or V , CA0, CA1 and CA2 floating.
CC
Note 10: DC Crosstalk is measured with V = 5V and V = 4096V, with
CC
REF
Note 4: Inferred from measurement at code 256 (LTC2605/LTC2605-1),
code 64 (LTC2615/LTC2615-1) or code 16 (LTC2625/LTC2625-1) and
at full scale.
the measured DAC at midscale, unless otherwise noted.
Note 11: R = 2kΩ to GND or V
.
CC
L
Note 12: Guaranteed by design and not production tested.
Note 5: V = 5V, V = 4.096V. DAC is stepped 1/4 scale to 3/4 scale
CC
REF
and 3/4 scale to 1/4 scale. Load is 2kΩ in parallel with 200pF to GND.
2605f
4
LTC2605/LTC2615/LTC2625
ELECTRICAL CHARACTERISTICS
Test Circuit 1
Test Circuit 2
V
DD
100Ω
CA
n
R
/R /R
INH INL INF
V
/V
IH(CA ) IL(CA )
n
n
2605/15/25 EC01
2605/15/25 EC02
GND
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2605
Differential Nonlinearity (DNL)
INL vs Temperature
Integal Nonlinearity (INL)
1.0
0.8
32
24
32
24
V
V
= 5V
REF
V
V
= 5V
REF
V
V
= 5V
REF
CC
CC
CC
= 4.096V
= 4.096V
= 4.096V
0.6
16
16
0.4
INL (POS)
INL (NEG)
8
8
0.2
0
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–8
–16
–24
–32
–8
–16
–24
–32
0
16384
32768
CODE
49152
65535
0
16384
32768
CODE
49152
65535
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
2605 G02
2605 G01
2605 G03
INL vs VREF
DNL vs VREF
DNL vs Temperature
1.0
0.8
32
24
1.5
1.0
V
V
= 5V
REF
V
= 5.5V
CC
V
= 5.5V
CC
CC
= 4.096V
0.6
16
0.4
INL (POS)
INL (NEG)
0.5
DNL (POS)
DNL (NEG)
8
0.2
DNL (POS)
DNL (NEG)
0
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–8
–16
–24
–32
–0.5
–1.0
–1.5
–50 –30 –10 10
30
50
70
90
0
1
2
3
4
5
0
1
2
V
3
4
5
TEMPERATURE (°C)
V
(V)
REF
(V)
REF
2605 G04
2605 G05
2605 G06
2605f
5
LTC2605/LTC2615/LTC2625
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2605
Settling to ±1LSB
Settling of Full-Scale Step
V
V
OUT
OUT
100µV/DIV
100µV/DIV
12.3µs
9.7µs
9TH CLOCK
OF 3RD DATA
BYTE
9TH CLOCK OF
3RD DATA BYTE
SCL
2V/DIV
SCR
2V/DIV
2605 G07
2605 G08
2µs/DIV
= 4.096V
1/4-SCALE TO 3/4-SCALE STEP
= 2k, C = 200pF
AVERAGE OF 2048 EVENTS
5µs/DIV
V
= 5V, V
REF
SETTLING TO ±1LSB
V = 5V, V = 4.096V
CC
CODE 512 TO 65535 STEP
AVERAGE OF 2048 EVENTS
CC
REF
R
L
L
LTC2615
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Settling to ±1LSB
8
6
1.0
0.8
V
V
= 5V
REF
V
V
= 5V
REF
CC
CC
= 4.096V
= 4.096V
0.6
4
0.4
V
OUT
2
0.2
100µV/DIV
0
0
9TH CLOCK
OF 3RD DATA
BYTE
SCL
2V/DIV
–0.2
–0.4
–0.6
–0.8
–1.0
–2
–4
–6
–8
8.9µs
2605 G11
2µs/DIV
V
= 5V, V
= 4.096V
REF
CC
1/4-SCALE TO 3/4-SCALE STEP
R
= 2k, C = 200pF
0
4096
8192
CODE
12288
16383
L
L
0
4096
8192
CODE
12288
16383
AVERAGE OF 2048 EVENTS
2605 G09
2605 G10
LTC2625
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Settling to ±1LSB
2.0
1.5
1.0
0.8
V
V
= 5V
REF
V
V
= 5V
REF
CC
CC
= 4.096V
= 4.096V
0.6
1.0
6.8µs
0.4
V
OUT
0.5
0.2
1mV/DIV
0
0
9TH CLOCK
OF 3RD DATA
BYTE
SCL
2V/DIV
–0.2
–0.4
–0.6
–0.8
–1.0
–0.5
–1.0
–1.5
–2.0
2605 G14
2µs/DIV
= 4.096V
V
= 5V, V
REF
CC
1/4-SCALE TO 3/4-SCALE STEP
= 2k, C = 200pF
R
0
1024
2048
CODE
3072
4095
0
1024
2048
CODE
3072
4095
L
L
AVERAGE OF 2048 EVENTS
2605 G12
2605 G13
2605f
6
LTC2605/LTC2615/LTC2625
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2605/LTC2615/LTC2625
Current Limiting
Load Regulation
Offset Error vs Temperature
1.0
0.8
0.10
0.08
3
2
CODE = MIDSCALE
CODE = MIDSCALE
V
V
= V = 5V
CC
REF
REF
0.6
0.06
= V = 3V
CC
0.4
0.04
1
0.2
0.02
0
0
0
V
= V = 5V
CC
REF
–0.2
–0.4
–0.6
–0.8
–1.0
–0.02
–0.04
–0.06
–0.08
–0.10
V
= V = 3V
CC
REF
REF
–1
–2
–3
V
= V = 3V
CC
V
= V = 5V
CC
REF
–35 –25 –15 –5
I
5
15
25
35
–40 –30 –20 –10
I
0
10 20 30 40
–50 –30 –10 10
30
50
70
90
(mA)
(mA)
TEMPERATURE (°C)
OUT
OUT
2606 G16
2605 G15
2605 G17
Zero-Scale Error vs Temperature
Gain Error vs Temperature
Offset Error vs VCC
0.4
0.3
3
2
3
2.5
2.0
1.5
1.0
0.5
0
0.2
1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–1
–2
–3
–50 –30 –10 10
30
50
70
90
2.5
3
3.5
4
4.5
5
5.5
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
V
(V)
TEMPERATURE (°C)
CC
2605 G19
2605 G20
2605 G18
Large-Signal Response
Gain Error vs VCC
ICC Shutdown vs VCC
0.4
0.3
450
400
350
300
250
200
150
100
50
0.2
0.1
V
OUT
0.5V/DIV
0
–0.1
–0.2
–0.3
–0.4
V
= V = 5V
CC
REF
1/4-SCALE TO 3/4-SCALE
2.5µs/DIV
2605 G23
0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
V
(V)
V
(V)
CC
CC
2605 G22
2605 G21
2605f
7
LTC2605/LTC2615/LTC2625
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2605/LTC2615/LTC2625
Headroom at Rails
vs Output Current
Midscale Glitch Impulse
Power-On Reset Glitch
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
5V SOURCING
V
OUT
V
CC
1V/DIV
10mV/DIV
3V SOURCING
4mV PEAK
SCL
2V/DIV
V
OUT
10mV/DIV
5V SINKING
2605 G24
2605 G25
3V SINKING
2.5µs/DIV
250µs/DIV
0
1
2
3
4
5
6
7
8
9
10
I
(mA)
OUT
2605 G26
Multiplying Bandwidth
Supply Current vs Logic Voltage
Power-On Reset to Midscale
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
0
V
= V
CC
REF
V
= 5V
CC
–3
–6
SWEEP SCL
AND SDA 0V
TO V AND
CC
–9
–12
–15
–18
–21
–24
–27
–30
–33
–36
V
TO 0V
CC
1V/DIV
V
CC
V
V
V
= 5V
CC
(DC) = 2V
REF
REF
0
1
2
3
4
5
V
OUT
(AC) = 0.2V
P-P
2605 G28
CODE = FULL SCALE
LOGIC VOLTAGE (V)
2605 G27
500µs/DIV
1k
10k
100k
1M
FREQUENCY (Hz)
2605 G29
Output Voltage Noise,
0.1Hz to 10Hz
Short-Circuit Output Current vs
VOUT (Sinking)
Short-Circuit Output Current vs
VOUT (Sourcing)
0mA
–10mA
–20mA
–30mA
–40mA
–50mA
40mA
30mA
20mA
10mA
0mA
V
OUT
10µV/DIV
V
V
= 5.5V
REF
CODE = 0
V
V
= 5.5V
REF
CC
CC
= 5.6V
= 5.6V
CODE = FULL SCALE
0
1
2
3
4
5
6
7
8
9
10
V
OUT
SWEPT 0V TO V
V
SWEPT V TO 0V
CC
OUT CC
SECONDS
2605 G30
0
1
2
3
4
5
0
1
2
3
4
5
1V/DIV
2605 G32
1V/DIV
2605 G31
2605f
8
LTC2605/LTC2615/LTC2625
U
U
U
PIN FUNCTIONS
GND (Pin 1): Analog Ground.
SDA (Pin 9): Serial Data Bidirectional Pin. Data is shifted
into the SDA pin and acknowledged by the SDA pin. This is
a high impedance pin while data is shifted in. It is an open-
drain N-channel output during acknowledgment. This pin
requires a pull-up resistor or current source to VCC.
VOUT A to VOUT H (Pins 2-5 and 12-15): DAC Analog
Voltage Output. The output range is 0V to VREF
.
REF (Pin 6): Reference Voltage Input. 0V ≤ VREF ≤ VCC.
CA2 (Pin 7): Chip Address Bit 2. Tie this pin to VCC, GND
orleaveitfloatingtoselectanI2Cslaveaddressforthepart
(Table 2).
CA1 (Pin 10): Chip Address Bit 1. Tie this pin to VCC, GND
orleaveitfloatingtoselectanI2Cslaveaddressforthepart
(Table 2).
SCL (Pin 8): Serial Clock Input Pin. Data is shifted into the
SDA pin at the rising edges of the clock. This high
impedance pin requires a pull-up resistor or current
source to VCC.
CA0 (Pin 11): Chip Address Bit 0. Tie this pin to VCC, GND
orleaveitfloatingtoselectanI2Cslaveaddressforthepart
(Table 2).
V
CC (Pin 16): Supply Voltage Input. 2.7V ≤ VCC ≤ 5.5V.
W
BLOCK DIAGRA
GND
1
16
15
V
V
CC
DAC A
DAC H
V
2
OUT A
OUT H
DAC B
DAC C
DAC G
DAC F
V
V
V
OUT G
V
OUT F
3
4
14
13
OUT B
OUT C
DAC D
DAC E
V
OUT D
V
OUT E
5
12
REF
CA0
CA1
6
7
11
10
32-BIT SHIFT REGISTER
2-WIRE INTERFACE
CA2
9
SDA
SCL
8
2605/15/25 BD01
W U
W
TI I G DIAGRA
SDA
t
t
f
SU(DAT)
t
t
t
t
t
t
t
BUF
f
LOW
r
HD(STA)
SP
r
SCL
t
t
t
SU(STO)
HD(STA)
SU(STA)
t
t
S
S
P
S
HD(DAT)
HIGH
2605/15/25 TD01
ALL VOLTAGE LEVELS REFER TO V
AND V LEVELS
IL(MAX)
IH(MIN)
Figure 1
2605f
9
LTC2605/LTC2615/LTC2625
U
OPERATIO
Power-On Reset
where k is the decimal equivalent of the binary DAC input
code, N is the resolution and VREF is the voltage at REF
(Pin 6).
The LTC2605/LTC2615/LTC2625 clear the outputs to
zero scale when power is first applied, making system
initialization consistent and repeatable. The LTC2605-1/
LTC2615-1/LTC2625-1setthevoltageoutputstomidscale
when power is first applied.
Serial Digital Interface
The LTC2605/LTC2615/LTC2625 communicate with a
host using the standard 2-wire digital interface. The
Timing Diagram (Figure 1) shows the timing relationship
of the signals on the bus. The two bus lines, SDA and SCL,
must be high when the bus is not in use. External pull-up
resistors or current sources are required on these lines.
The value of these pull-up resistors is dependent on the
power supply and can be obtained from the I2C specifica-
tions. For an I2C bus operating in the fast mode, an active
pull-up will be necessary if the bus capacitance is greater
than 200pF.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero
outputs from the DAC during this time. The LTC2605/
LTC2615/LTC2625 contain circuitry to reduce the
power-on glitch: the analog outputs typically rise less
than 10mV above zero scale during power on if the
power supply is ramped to 5V in 1ms or more. In general,
the glitch amplitude decreases as the power supply ramp
time is increased. See Power-On Reset Glitch in the
Typical Performance Characteristics section.
The LTC2605/LTC2615/LTC2625 are receive-only (slave)
devices. The master can write to the LTC2605/LTC2615/
LTC2625. The LTC2605/LTC2615/LTC2625 do not
respond to a read from the master.
Power Supply Sequencing
The voltage at REF (Pin 6) should be kept within the range
–0.3V ≤ VREF ≤ VCC + 0.3V (see Absolute Maximum
Ratings). Particular care should be taken to observe these
limitsduringpowersupplyturn-onandturn-offsequences,
when the voltage at VCC (Pin 16) is in transition.
The START (S) and STOP (P) Conditions
When the bus is not in use, both SCL and SDA must be
high. A bus master signals the beginning of a communica-
tion to a slave device by transmitting a START condition.
ASTARTconditionisgeneratedbytransitioningSDAfrom
high to low while SCL is high.
Transfer Function
The digital-to-analog transfer function is
k
2
⎛
⎜
⎝
⎞
⎟
⎠
VOUT(IDEAL)
=
V
REF
When the master has finished communicating with the
slave, it issues a STOP condition. A STOP condition is
generatedbytransitioningSDAfromlowtohighwhileSCL
is high. The bus is then free for communication with
another I2C device.
N
Table 1.
ADDRESS (n)*
COMMAND*
A3 A2 A1 A0
C3 C2 C1 C0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
1
DAC A
DAC B
DAC C
DAC D
DAC E
DAC F
DAC G
DAC H
All DACs
0
0
0
0
0
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Write to Input Register n
Update (Power Up) DAC Register n
Write to Input Register n, Update (Power Up) All n
Write to and Update (Power Up) n
Power Down n
No Operation
*Address and command codes not shown are reserved and should not be used.
2605f
10
LTC2605/LTC2615/LTC2625
U
OPERATIO
WRITE WORD PROTOCOL FOR LTC2605/LTC2615/LTC2625
S
W
A
1ST DATA BYTE
A
2ND DATA BYTE
INPUT WORD
A
A
P
SLAVE ADDRESS
3RD DATA BYTE
INPUT WORD (LTC2605)
A3 A2
1ST DATA BYTE
INPUT WORD (LTC2615)
A3 A2
1ST DATA BYTE
INPUT WORD (LTC2625)
A3 A2
1ST DATA BYTE
A0
A0
A0
D12
D6
D4
D2
D0
X
C3
C1
A1
A1
A1
D15 D14 D13
D11 D10 D9 D8
D5 D4 D3 D2 D1
3RD DATA BYTE
C2
C0
D7
D5
D3
2ND DATA BYTE
C3
C1
D13 D12 D11
D10
D9 D8 D7 D6
D3 D2 D1 D0
3RD DATA BYTE
X
C2
C0
2ND DATA BYTE
C3
C1
D11 D10 D9
D8
D7 D6 D5 D4
D1 D0
X
X
X
X
C2
C0
2605/2615/2625 O01
2ND DATA BYTE
3RD DATA BYTE
Figure 2
maximum capacitive load allowed on the address pins
(CA0, CA1 and CA2) is 10pF.
Acknowledge
The Acknowledge signal is used for handshaking between
the master and the slave. An Acknowledge (active LOW)
generated by the slave lets the master know that the latest
byte of information was received. The Acknowledge
related clock pulse is generated by the master. The master
releases the SDA line (HIGH) during the Acknowledge
clock pulse. The slave-receiver must pull down the SDA
during the Acknowledge clock pulse so that it remains a
stableLOWduringtheHIGHperiodofthisclockpulse.The
LTC2605/LTC2615/LTC2625 respond to a write by a mas-
ter in this manner. The LTC2605/LTC2615/LTC2625 do
not acknowledge a read (it retains SDA HIGH during the
period of the Acknowledge clock pulse).
Write Word Protocol
The master initiates communication with the LTC2605/
LTC2615/LTC2625 with a START condition and a 7-bit
slave address followed by the Write bit (W) = 0. The
LTC2605/LTC2615/LTC2625acknowledgesbypullingthe
SDA pin low at the 9th clock if the 7-bit slave address
matches the address of the parts (set by CA0, CA1 and
CA2) or the global address. The master then transmits
three bytes of data. The LTC2605/LTC2615/LTC2625
acknowledgeseachbyteofdatabypullingtheSDAlinelow
at the 9th clock of each data byte transmission. After
receiving three complete bytes of data, the LTC2605/
LTC2615/LTC2625 executes the command specified in
the 24-bit input word.
Chip Address
The state of CA0, CA1 and CA2 decides the slave address
of the part. The pins CA0, CA1 and CA2 can be each set to
any one of three states: VCC, GND or FLOAT. This results
in 27 selectable addresses for the part. The addresses
corresponding to the states of CA0, CA1 and CA2 and the
global address are shown in Table 2.
If more than three data bytes are transmitted after a valid
7-bit slave address, the LTC2605/LTC2615/LTC2625 do
not acknowledge the extra bytes of data (SDA is high
during the 9th clock).
TheformatofthethreedatabytesisshowninFigure2.Thefirst
byte of the input word consists of the 4-bit command and 4-
bit DAC address. The next two bytes consist of the 16-bit data
word. The 16-bit data word consists of the 16-, 14- or 12-bit
input code, MSB to LSB, followed by 0, 2 or 4 don’t care bits
In addition to the address selected by the address pins, the
partsalsorespondtoaglobaladdress. Thisaddressallows
a common write to all LTC2605, LTC2615 and LTC2625
parts to be accomplished with one 3-byte write transaction
on the I2C bus. The global address is a 7-bit hardwired
address and is not selectable by CA0, CA1 and CA2. The
2
(LTC2605, LTC2615 and LTC2625 respectively). A typical I C
write transaction is shown in Figure 3.
2605f
11
LTC2605/LTC2615/LTC2625
U
OPERATIO
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 1. The first four commands in the table
consist of write and update operations. A write operation
loads the 16-bit data word from the 32-bit shift register
into the input register of the selected DAC, n. An update
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DACifithadbeeninpower-downmode. Thedatapathand
registers are shown in the block diagram.
Power Down Mode
For power-constrained applications, power-down mode
can be used to reduce the supply current whenever less
than eight outputs are needed. When in power-down, the
buffer amplifiers and reference inputs are disabled and
drawessentiallyzerocurrent.TheDACoutputsareputinto
a high-impedance state, and the output pins are passively
pulled to ground through individual 90k resistors. When
all eight DACs are powered down, the bias generation
circuit is also disabled. Input- and DAC- registers are not
disturbed during power-down.
Any channel or combination of channels can be put into
power-down mode by using command 0100b in
combination with the appropriate DAC address, (n). The
16-bit data word is ignored. The supply and reference
currents are reduced by approximately 1/8 for each DAC
powereddown;theeffectiveresistanceatREF(Pin6)rises
accordingly, becoming a high-impedance input (typically
>1GΩ) when all eight DACs are powered down.
Table 2. Slave Address Map
CA2
GND GND
GND GND FLOAT
GND GND
CA1
CA0 SA6 SA5 SA4 SA3 SA2 SA1 SA0
GND
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
V
CC
GND FLOAT GND
GND FLOAT FLOAT
GND FLOAT
V
CC
GND
GND
GND
V
CC
V
CC
V
CC
GND
Normal operation can be resumed by executing any com-
mand which includes a DAC update, as shown in Table 1.
The selected DAC is powered up as its voltage output
is updated.
FLOAT
V
CC
FLOAT GND
FLOAT GND FLOAT
FLOAT GND
GND
V
There is an initial delay as the DAC powers up before it
begins its usual settling behavior. If less than eight DACs
are in a powered-down state prior to the updated
command, the power-up delay is 5µs. If, on the other
hand, all eight DACs are powered down, then the bias
generation circuit is also disabled and must be restarted.
In this case, the power-up delay is greater: 12µs for
VCC = 5V, 30µs for VCC = 3V.
CC
FLOAT FLOAT GND
FLOAT FLOAT FLOAT
FLOAT FLOAT
V
CC
FLOAT
FLOAT
FLOAT
V
CC
V
CC
V
CC
GND
FLOAT
V
CC
V
V
V
V
V
V
V
V
V
GND
GND FLOAT
GND
GND
CC
CC
CC
CC
CC
CC
CC
CC
CC
V
CC
Voltage Outputs
FLOAT GND
FLOAT FLOAT
Each of the eight rail-to-rail amplifiers contained in these
parts has guaranteed load regulation when sourcing or
sinking up to 15mA at 5V (7.5mA at 3V).
FLOAT
V
CC
V
CC
V
CC
V
CC
GND
FLOAT
Load regulation is a measure of the amplifier’s ability
to maintain the rated voltage accuracy over a wide range
ofloadconditions.Themeasuredchangeinoutputvoltage
per milliampere of forced load current change is
expressed in LSB/mA.
V
CC
GLOBAL ADDRESS
2605f
12
LTC2605/LTC2615/LTC2625
U
OPERATIO
DC output impedance is equivalent to load regulation and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifier’s DC output
impedance is 0.020Ω when driving a load well away from
the rails.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continu-
ous and uninterrupted plane, except for necessary lead
pads and vias, with signal traces on another layer.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by the
30Ω typical channel resistance of the output devices;
e.g., when sinking 1mA, the minimum output voltage =
30Ω • 1mA = 30mV. See the graph Headroom at Rails vs
OutputCurrentintheTypicalPerformanceCharacteristics
section.
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.020Ω), and will degrade DC crosstalk.
Note that the LTC2605/LTC2615/LTC2625 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
The amplifiers are stable driving capacitive loads of up
to 1000pF.
Board Layout
The excellent load regulation and DC crosstalk perfor-
mance of these devices is achieved in part by keeping
“signal” and “power” grounds separated internally and by
reducing shared internal resistance to just 0.005Ω.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is
limited to voltages within the supply range.
The GND pin functions both as the node to which the
reference and output voltages are referred and as a return
path for power currents in the device. Because of this,
careful thought should be given to the grounding scheme
and board layout in order to ensure rated performance.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown in
Figure 4b. Similarly, limiting can occur near full scale
when the REF pin is tied to VCC. If VREF = VCC and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at VCC as shown in Figure 4c. No full-scale
limiting can occur if VREF is less than VCC – FSE.
The PC board should have separate areas for the analog
anddigitalsectionsofthecircuit.Thiskeepsdigitalsignals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimalcapacitiveandresistiveinteractionwitheach other.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting
can occur.
2605f
13
LTC2605/LTC2615/LTC2625
U
OPERATIO
2605f
14
LTC2605/LTC2615/LTC2625
U
OPERATIO
POSITIVE
FSE
V
REF
= V
CC
V
= V
CC
REF
OUTPUT
VOLTAGE
OUTPUT
VOLTAGE
INPUT CODE
(c)
OUTPUT
VOLTAGE
0
32, 768
65, 535
INPUT CODE
(a)
0V
NEGATIVE
OFFSET
INPUT CODE
(b)
2605/15/25 O05
Figure 4. Effects of Rail-to-Rail Operation on a DAC Transfer Curve. (a) Overall Transfer Function, (b) Effect
of Negative Offset for Codes Near Zero Scale, (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
U
PACKAGE DESCRIPTIO
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 .005
.009
(0.229)
REF
16 15 14 13 12 11 10 9
.254 MIN
.150 – .165
.229 – .244
.150 – .157**
(5.817 – 6.198)
(3.810 – 3.988)
.0165 .0015
.0250 TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
5
6
7
8
.015 .004
(0.38 0.10)
× 45°
.053 – .068
(1.351 – 1.727)
.004 – .0098
(0.102 – 0.249)
.007 – .0098
(0.178 – 0.249)
0 – 8 TYP
.016 – .050
(0.406 – 1.270)
.0250
(0.635)
BSC
.008 – .012
(0.203 – 0.305)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
GN16 (SSOP) 0502
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
2605f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
15
LTC2605/LTC2615/LTC2625
U
TYPICAL APPLICATIO
Demonstration Circuit—LTC2428 20-Bit ADC Measures Key Performance Parameters
ADDRESS SELECTION
V
V
V
V
V
CC
CC
CC
CC
REF
C1
0.1µF
C2
0.1µF
6
16
REF
V
CC
11
10
7
2
TP3
CA0
CA1
CA2
V
V
V
A
B
C
D
E
OUT
OUT
OUT
OUT
DAC A
3
4
TP4
DAC B
5
V
V
CC
12
13
14
15
TP5
DAC C
V
OUT
10k
10k
V
F
OUT
9
8
TP6
DAC D
SDA
SCL
V
V
G
H
2
OUT
OUT
I C
BUS
DAC OUTPUTS
TP7
DAC E
V
REF
V
V
CC
CC
GND
1
U2
LTC2605CGN
TP8
DAC F
C4
0.1µF
C5
0.1µF
TP9
DAC G
R5
7.5k
JP1
R8
22
ON/OFF
3
TP10
DAC H
C10
100pF
2
DISABLE
ADC
V
IN
7
4
3
2
8
U4
1
LT1236ACS8-5
V
V
MUXOUT ADCIN FS
CC CC
SET
2
6
V
REF
V
IN
V
OUT
1
9
CH0
5V
TP11
REF
23
R6
7.5k
10 CH1
11 CH2
12 CH3
13 CH4
14 CH5
15 CH6
17 CH7
GND
4
CSADC
V
2
3
4.096V
20
25
19
21
24
CS
C7
4.7µF
6.3V
C6
0.1µF
CSMUX
SCK
JP2
REF
V
4-/8-CHANNEL
MUX
20-BIT
+
SCK
SPI
BUS
ADC
CLK
U5
D
IN
LT1461ACS8-4
–
2
3
6
SD0
V
CC
V
V
OUT
IN
1
26
SHDN
GND
5V
TP12
FO
REF
5
ZS
SET
V
CC
2
3
GND GND GND GND GND GND GND
16 18 22 27 28
R7
7.5k
C9
0.1µF
C8 REGULATOR
4
1µF
16V
JP3
1
6
U3
LTC2428CG
TP13
GND
V
CC
2605 TA01
5V
RELATED PARTS
PART NUMBER
DESCRIPTION
Quad 12-Bit Rail-to-Rail Output DACs with Added Functionality
COMMENTS
LTC1458: V = 4.5V to 5.5V, V
LTC1458/LTC1458L
= 0V to 4.096V
OUT
OUT
CC
LTC1458L: V = 2.7V to 5.5V, V
= 0V to 2.5V
CC
LTC1654
Dual 14-Bit Rail-to-Rail V
DAC
Programmable Speed/Power, 3.5µs/750µA, 8µs/450µA
= 5V(3V), Low Power, Deglitched
OUT
LTC1655/LTC1655L
LTC1657/LTC1657L
LTC1660/LTC1665
LTC1821
Single 16-Bit V
DAC with Serial Interface in SO-8
V
CC
OUT
Parrallel 5V/3V 16-Bit V
DAC
Low Power, Deglitched, Rail-to-Rail V
OUT
OUT
Octal 10-/8-Bit V
DAC in 16-Pin Narrow SSOP
V
= 2.7V to 5.5V, Micropower, Rail-to-Rail Output
CC
OUT
Parallel 16-Bit Voltage Output DAC
Octal 16-/14-/12-Bit V DACs in 16-Lead SSOP
Precision 16-Bit Settling in 2µs for 10V Step
250µA per DAC, 2.5V–5.5V Supply Range, Rail-to-Rail
Output, SPI Interface
LTC2600/LTC2610/
LTC2620
OUT
LTC2601/LTC2611/
LTC2621
Single 16-/14-/12-Bit V
DACs in 10-Lead DFN
300µA per DAC, 2.5V–5.5V Supply Range, Rail-to-Rail
Output, SPI Interface
OUT
LTC2602/LTC2612/
LTC2622
Dual 16-/14-/12-Bit V
DACs in 8-Lead MSOP
300µA per DAC, 2.5V–5.5V Supply Range, Rail-to-Rail
Output, SPI Interface
OUT
LTC2604/LTC2614/
LTC2624
Quad 16-/14-/12-Bit V
DACs in 16-Lead SSOP
250µA per DAC, 2.5V–5.5V Supply Range, Rail-to-Rail
OUT
Output, SPI Interface
2
LTC2606/LTC2616/
LTC2626
Single 16-/14-/12-Bit V
DACs with I C Interface in 10-Lead DFN 270µA per DAC, 2.7V–5.5V Supply Range, Rail-to-Rail
OUT
2
Output, I C Interface
2605f
LT/LWI/TP 0405 500 • PRINTED IN THE USA
16 LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
●
●
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005
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