LTC3252EDE [Linear]

Dual, Low Noise, Inductorless Step-Down DC/DC Converter; 双通道,低噪声,无电感器降压型DC / DC转换器
LTC3252EDE
型号: LTC3252EDE
厂家: Linear    Linear
描述:

Dual, Low Noise, Inductorless Step-Down DC/DC Converter
双通道,低噪声,无电感器降压型DC / DC转换器

转换器 稳压器 开关式稳压器或控制器 电源电路 开关式控制器 电感器 光电二极管
文件: 总12页 (文件大小:288K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3252  
Dual, Low Noise,  
Inductorless Step-Down  
DC/DC Converter  
U
FEATURES  
DESCRIPTIO  
The LTC®3252 is a switched capacitor step-down DC/DC  
converter that produces two adjustable regulated outputs  
from a single 2.7V to 5.5V input. The part uses switched  
capacitor fractional conversion to achieve a typical effi-  
ciency increase of 50% over that of a linear regulator. No  
inductors are required.  
2.7V to 5.5V Input Voltage Range  
No Inductors  
Typical Efficiency 50% Higher than LDOs  
Spread Spectrum Operation  
Low Input and Output Noise  
Shutdown Disconnects Load from VIN  
Dual Adjustable Independent Outputs  
A unique constant frequency, spread spectrum architec-  
ture provides a very low noise regulated output as well as  
low noise at the input. The part also has Burst Mode®  
operationtoprovidehighefficiencyatlowoutputcurrents,  
as well as ultralow current shutdown.  
(Range: 0.9V to 1.6V)  
Output Current: 250mA Each Output  
Low Operating Current: IIN = 60µA Typ  
(35µA with One Output Enabled)  
Low Shutdown Current: IIN = 0.01µA Typ  
Low operating currents (60µA with both outputs enabled,  
35µA with one output enabled) and low external parts  
count make the LTC3252 ideally suited for space-con-  
strained battery-powered applications. The part is short-  
circuit and overtemperature protected and is available in a  
tiny 4mm × 3mm 12-pin DFN package.  
Soft-Start Limits Inrush Current at Turn On  
Short Circuit and Over Temperature Protected  
Available in 4mm × 3mm 12-Pin DFN Package  
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APPLICATIO S  
Handheld Electronic Devices  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Burst Mode is a registered trademark of Linear Technology Corporation.  
Cellular Phones  
Low Voltage Logic Supplies  
DSP Power Supplies  
3.3V to 1.5V Conversion  
U
TYPICAL APPLICATIO  
1.5V and 1.2V Output Voltages with Shutdown  
1.5V/1.2V Efficiency vs Input Voltage  
100  
I
I
(1.5V) = 100mA  
(1.2V) = 100mA  
2
11  
3
5
1
OUT  
OUT  
V
= 1.5V  
OUT  
OUT  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
EN1  
EN2  
OUT1  
FB1  
OFF ON  
OFF ON  
I
250mA  
470k  
510k  
LTC3252-1.5V  
1-CELL  
Li-ION  
OR 3-CELL  
NiMH  
V
4.7µF  
IN  
4
6
4.7µF  
+
+
LTC3252-1.2V  
C1  
C1  
C2  
C2  
LTC3252  
1µF  
1µF  
LDO-1.5V  
LDO-1.2V  
10  
8
9
V
= 1.2V  
250mA  
OUT  
OUT2  
FB2  
I
OUT  
261k  
510k  
7
12  
4.7µF  
GND  
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5  
(V)  
3252 TA01  
V
IN  
3252 TA01a  
3252f  
1
LTC3252  
W W U W  
U
W
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ABSOLUTE AXI U RATI GS  
PACKAGE/ORDER I FOR ATIO  
(Notes 1, 6)  
ORDER PART  
TOP VIEW  
VIN to GND................................................0.3V to 6.0V  
EN1, EN2, FB1, FB2 to GND .......... 0.3V to (VIN + 0.3V)  
IOUT1, IOUT2 (Note 3)........................................... 400mA  
Operating Ambient Temperature Range  
(Note 2) .................................................. 40°C to 85°C  
Storage Temperature Range ................. 65°C to 125°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
NUMBER  
FB1  
EN1  
1
2
3
4
5
6
12 FB2  
11 EN2  
LTC3252EDE  
+
V
10 C2  
IN  
+
C1  
9
8
7
OUT2  
OUT1  
C2  
GND  
DE PART  
MARKING  
C1  
DE PACKAGE  
12-LEAD (4mm × 3mm) PLASTIC DFN  
3252  
EXPOSED PAD IS GROUND  
(MUST BE SOLDERED TO PCB)  
TJMAX = 125°C, θJA = 40°C/W, θJC = 4.3°C/W  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, VOUT1 = VOUT2 = 1.5V, C1 = C2 = 1µF, Cin = COUT1 = COUT2  
4.7µF (all capacitors ceramic) unless otherwise noted.  
=
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Min Operating Voltage  
Max Operating Voltage  
(Note 4)  
2.7  
V
V
IN  
5.5  
I
Operating Current,  
Both Outputs Enabled  
I
= 0mA, V  
= V , V  
= V ,  
60  
35  
100  
µA  
VIN  
OUT  
EN1  
IN EN2  
IN  
2.7V V 5.5V  
IN  
Operating Current,  
I
= 0mA, V  
= 0, V  
= V or V  
= V ,  
60  
µA  
OUT  
EN1  
EN2  
IN  
EN1  
IN  
One Output Enabled  
V
= 0, 2.7V V 5.5V  
EN2  
IN  
Shutdown Current  
V
= 0V, V = 0V, 2.7V V 5.5V  
0.01  
0.8  
1
µA  
V
M0  
M1  
IN  
V
, V  
Feedback Voltage  
I
= 0mA, 2.7V V 5.5V  
0.78  
250  
250  
50  
0.82  
FB1 FB2  
OUT  
IN  
I
I
I
Output Current  
V
V
V
= V  
= V  
mA  
mA  
nA  
OUT1  
OUT2  
FB  
EN1  
EN2  
FB1  
IN  
IN  
Output Current  
FB1, FB2 Input Current  
Output Ripple (OUT1 or OUT2)  
Spread Spectrum Frequency Range  
= V = 0.85V  
50  
FB2  
V
I
= 250mA  
10  
mV  
P-P  
RIPPLE  
OUT  
f
f
Switching Frequency  
Switching Frequency  
0.8  
1.2  
1.0  
1.6  
MHz  
MHz  
MIN  
2.0  
MAX  
V
V
EN1, EN2 Input High Voltage  
EN1, EN2 Input Low Voltage  
EN1, EN2 Input High Current  
EN1, EN2 Input Low Current  
Turn On Time  
2.7V V 5.5V  
0.8  
0.8  
V
V
IH  
IL  
IN  
2.7V V 5.5V  
0.4  
1
IN  
I
I
t
EN1 = V , EN2 = V  
IN  
–1  
–1  
µA  
IH  
IN  
EN1 = 0V, EN2 = 0V  
= 3Ω  
1
µA  
IL  
R
0.8  
0.08  
0.2  
1
ms  
ON  
OUT  
OUT1, OUT2 Load Regulation (Referred to FB pin)  
Line Regulation  
mV/mA  
%/V  
0 I  
250mA or 0 I  
250mA  
OUT2  
OUT1  
R
Open Loop Output Impedance,  
(OUT1 or OUT2)  
V
= 3.0V, I  
= 200mA, V = 0.74V (Note 5)  
1.4  
OL  
IN  
OUT  
FB  
3252f  
2
LTC3252  
ELECTRICAL CHARACTERISTICS  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
Note 4: Minimum operating voltage required for regulation is:  
> 2 • (V + R • I  
of a device may be impaired.  
V
)
OL OUT  
IN  
OUT(MIN)  
Note 2: The LTC3252EDE is guaranteed to meet specified performance  
from 0°C to 70°C. Specifications over the 40°C and 85°C operating  
temperature range are assured by design characterization and correlation  
with statistical process control.  
Note 5: Output not in regulation; R = (V /2 – V )/I .  
OUT OUT  
OL  
IN  
Note 6: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 3: Based on long-term current density limitations.  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
No Load Supply Current vs Supply  
Voltage (One Output Enabled)  
No Load Supply Current vs Supply  
Voltage (Both Outputs Enabled)  
FB Voltage vs Load Current  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.82  
0.81  
0.80  
0.79  
0.78  
0.77  
0.76  
V
IN  
= 3.6V  
25°C  
85°C  
25°C  
85°C  
25°C  
–40°C  
–40°C  
–45°C  
85°C  
2.7  
3.7  
4.2  
(V)  
4.7  
5.2  
2.7  
3.7  
4.2  
(V)  
4.7  
5.2  
0
50  
100  
I
OUT  
150  
(mA)  
200  
250  
3.2  
3.2  
V
V
IN  
IN  
3252 G01  
3252 G02  
3252 G03  
EN1/EN2 Input Threshold Voltage  
vs Supply Voltage  
1.5V Output Voltage vs Supply  
Voltage  
1.5V Output Efficiency vs Output  
Current  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
1.60  
1.58  
1.56  
1.54  
1.52  
1.50  
1.48  
1.46  
1.44  
1.42  
1.40  
100  
80  
60  
40  
20  
0
T
= 25°C  
A
T
= 25°C  
A
25°C  
I
= 50mA  
OUT  
–40°C  
I
= 0mA  
OUT  
V
V
V
V
V
= 3.1V  
= 3.3V  
= 3.6V  
= 4V  
IN  
IN  
IN  
IN  
IN  
I
= 250mA  
85°C  
OUT  
= 5V  
2.7  
3.7  
4.2  
(V)  
4.7  
5.2  
3
3.5  
4
4.5  
5
5.5  
0.1  
1
10  
(mA)  
100  
1000  
3.2  
V
V
IN  
(V)  
I
OUT  
IN  
3252 G04  
3252 G05  
3252 G06  
3252f  
3
LTC3252  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Oscillator Max/Min Frequency vs  
Supply Voltage  
1.2V Output Voltage vs Supply  
Voltage  
1.2V Efficiency vs Load Current  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
1.30  
1.28  
1.26  
1.24  
1.22  
1.20  
1.18  
1.16  
1.14  
1.12  
1.10  
100  
80  
60  
40  
20  
0
T
= 25°C  
A
T
= 25°C  
A
25°C MAX  
–40°C MAX  
I
I
I
= 0mA  
OUT  
OUT  
OUT  
85°C MAX  
= 50mA  
= 250mA  
V
V
V
V
= 2.8V  
= 3.1V  
= 3.5V  
= 4.5V  
IN  
IN  
IN  
IN  
25°C MIN  
–40°C MIN  
85°C MIN  
2.7  
3.7  
4.2  
(V)  
4.7  
5.2  
2.7  
3.7  
4.2  
(V)  
4.7  
5.2  
0.1  
1
10  
(mA)  
100  
1000  
3.2  
3.2  
V
V
IN  
I
OUT  
IN  
3252 G07  
3252 G08  
3252 G09  
Output Current Transient  
Response  
Line Transient Response  
4.5V  
3.5V  
250mA  
20mA  
V
IN  
I
OUT  
V
OUT  
20mV/DIV  
AC  
V
OUT  
10mV/DIV  
AC  
3252 G12  
3252 G11  
V
I
= 1.5V  
= 150mA  
V
V
= 3.6V  
OUT  
OUT  
IN  
OUT  
= 1.5V  
U
U
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PI FU CTIO S  
FB1 (Pin 1): Feedback Input Pin 1. An output divider C1+ (Pin 4): Flying Capacitor 1 Positive Terminal (C1).  
should be connected from OUT1 to FB1 to program the  
output voltage.  
OUT1 (Pin 5): Regulated Output Voltage 1. OUT1 is  
disconnected from VIN when in shutdown. Bypass OUT1  
EN1 (Pin 2): Input Enable Pin 1. When EN1 is high, OUT1 with a low ESR ceramic capacitor to GND (CO1). See  
is enabled. When EN1 is low OUT1 is shut down.  
Output Capacitor Selection section for size requirements.  
VIN (Pin 3): Input Supply Voltage. Operating VIN may be C1(Pin 6): Flying Capacitor 1 Negative Terminal (C1).  
between 2.7V and 5.5V. Bypass VIN with a 4.7µF (1µF  
min) low ESR ceramic capacitor to GND (CIN).  
performance.  
GND (Pin 7): Ground. Connect to a ground plane for best  
3252f  
4
LTC3252  
U
U
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PI FU CTIO S  
C2(Pin 8): Flying Capacitor 2 Negative Terminal (C2).  
EN2 (Pin 11): Input Enable Pin 2. When EN2 is high, OUT2  
is enabled. When EN2 is low OUT2 is shut down.  
OUT2 (Pin 9): Regulated Output Voltage 2. OUT2 is  
disconnected from VIN when in shutdown. Bypass OUT2  
with a low ESR ceramic capacitor to GND (CO2). See  
Output Capacitor Selection section for size requirements.  
FB2 (Pin 12): Feedback Input Pin 2. An output divider  
should be connected from OUT2 to FB2 to program the  
output voltage.  
C2+ (Pin 10): Flying Capacitor 2 Positive Terminal (C2).  
W
W
SI PLIFIED BLOCK DIGRAM  
EN1  
2
EN2  
11  
SWITCH  
CONTROL  
SPREAD SPECTRUM  
OSCILLATOR  
OVERTEMPERATURE  
CHARGE  
PUMP 1  
V
IN  
3
+
4
5
6
C1  
OUT1  
C1  
1
FB1  
+
BURST  
DETECT  
CIRCUIT  
CHARGE  
PUMP 2  
+
10 C2  
9
8
OUT2  
C2  
12 FB2  
+
7
GND  
3252 SBD  
3252f  
5
LTC3252  
U
OPERATIO  
(Refer to Simplified Block Diagram)  
TheLTC3252hastwoswitchedcapacitorchargepumpsto  
step down VIN to two regulated output voltages. The two  
charge pumps operate 180° out of phase to reduce input  
ripple. Regulation is achieved by sensing each output  
voltage through an external resistor divider and modulat-  
ing the charge pump output current based on the error  
signal. A 2-phase nonoverlapping clock activates the two  
chargepumpsrunningthemoutofphasefromeachother.  
On the first phase of the clock current is transferred from  
VIN,throughtheexternalflyingcapacitor1,toOUT1viathe  
switches of charge pump 1. Not only is current being  
delivered to OUT1 on the first phase, but the flying capaci-  
tor is also being charged up. On the second phase of the  
clock, flying capacitor 1 is connected from OUT1 to  
ground, transferring the charge stored during the first  
phase of the clock to OUT1 via the switches of charge  
pump 1. Charge pump 2 operates in the same manner to  
supply current to OUT2, but with the phases of the clock  
reversed relative to charge pump 1. Using this method of  
switching, only half of the output current for each output  
is delivered from VIN, thus achieving a 50% increase in  
efficiency over a conventional LDO. A spread spectrum  
oscillator, which utilizes random switching frequencies  
between 1MHz and 1.6MHz, sets the rate of charging and  
discharging of the flying capacitors. This architecture  
achievesextremelylowoutputnoise.Inputnoiseissignifi-  
cantly reduced compared to conventional charge pumps.  
Theoutputsalsohavealowcurrentburstmodetoimprove  
efficiency even at light loads.  
Short-Circuit/Thermal Protection  
The LTC3252 has built-in short-circuit current limiting as  
well as over temperature protection. During short-circuit  
conditions, internal circuitry automatically limits each  
output to approximately 500mA of current. If fault condi-  
tions (such as shorted outputs) cause excessive self  
heating on chip such that the junction temperature ex-  
ceeds approximately 160°C, the thermal shutdown cir-  
cuitry will disable the charge pumps. The IC resumes  
operation once the junction temperature drops back to  
approximately155°C. TheLTC3252willcycleinandoutof  
thermal shutdown without latchup or damage until the  
overstress condition is removed. Long term overstress  
(IOUT1 or IOUT2 > 400mA, and/or TJ > 125°C) should be  
avoided as it can degrade the performance or shorten the  
life of the part.  
Soft-Start  
To prevent excessive current flow at VIN during start-up,  
the LTC3252 has built-in soft-start circuitry on each out-  
put. When an output is enabled, the soft-start circuitry  
increases the amount of current available from the output  
linearly over a period of approximately 500µs. The soft-  
start circuitry is disabled shortly after the output achieves  
regulation.  
Spread Spectrum Operation  
Switchingregulatorscanbeparticularlytroublesomewhere  
electromagnetic interference (EMI) is concerned. Switch-  
ingregulatorsoperateonacycle-by-cyclebasistotransfer  
power to an output. In most cases, the frequency of  
operation is either fixed or is a constant based on the  
output load. This method of conversion creates large  
componentsofnoiseatthefrequencyofoperation(funda-  
mental) and multiples of the operating frequency (har-  
monics).  
In shutdown mode all circuitry is turned off and the  
LTC3252 draws only leakage current from the VIN supply.  
Furthermore, OUT1 and OUT2 are disconnected from VIN.  
The EN1 and EN2 pins are CMOS inputs with threshold  
voltages of approximately 0.8V to allow regulator control  
with low voltage logic levels. The LTC3252 is in shutdown  
when a logic low is applied to both enable pins. Since the  
mode pins are high impedance CMOS inputs, they should  
neverbeallowedtofloat. Alwaysdrivetheenablepinswith  
valid logic levels.  
3252f  
6
LTC3252  
U
OPERATIO  
(Refer to Simplified Block Diagram)  
Unlikeconventionalbuckconverters,theLTC3252’sinter-  
nal oscillator is designed to produce a clock pulse whose  
period is random on a cycle-by-cycle basis but fixed  
between1MHzand1.6MHz.Thishasthebenefitofspread-  
ing the switching noise over a range of frequencies, thus  
significantly reducing the peak noise. Figures 1 and 2  
show how the spread spectrum feature of the LTC3252  
significantly reduces the peak harmonic noise and virtu-  
ally elliminates harmonics compared to a conventional  
buck converter.  
threshold (30mA typ). When this occurs, the part shuts  
down the internal oscillator and goes into a low current  
operating state. The LTC3252 will remain in the low  
current operating state until either output has dropped  
enough to require another burst of current. The LTC3252  
resumes continuous operation when the load on one or  
both outputs exceeds the internally set threshold. Unlike  
traditional charge pumps where the burst current is highly  
dependant on many factors (i.e., supply, switch strength,  
capacitor selection, etc.), the LTC3252’s burst current is  
set by the burst threshold and hysteresis. This means that  
the output ripple voltage in Burst Mode operation is  
relatively consistent and is typically about 12mV with a  
4.7µFoutputcapacitorona1.5Voutput.Theripplevoltage  
amplitude is a direct function of the output capacitor size.  
BurstModeoperationripplevoltagedoesincreaseslightly  
at lower output voltages due to the increase in loop gain.  
Userscancounteractoutputvoltagerippleincreasethrough  
the use of a slightly larger output capacitor. See Recom-  
mended Output Capacitance guidelines of Figure 3.  
Spread spectrum operation is always enabled but is most  
effective when the LTC3252’s outputs are out of Burst  
Mode operation and the oscillator is running continuously  
(see the Low Current Burst Mode Operation section).  
Low Current Burst Mode Operation  
Toimproveefficiencyatlowoutputcurrents,aBurstMode  
operation function is included in the LTC3252. An output  
current sense is used to detect when the required output  
current of both outputs drop below an internally set  
Figure 1. Conventional Buck Input Noise  
Figure 2. LTC3252 Input Noise  
3252f  
7
LTC3252  
U
OPERATIO  
(Refer to Simplified Block Diagram)  
Output Capacitor Selection  
tance required for good transient response (see the Ce-  
ramic Capacitor Selection Guidelines section).  
The style and value of capacitors used with the LTC3252  
determineseveralimportantparameterssuchasregulator  
control loop stability, output ripple and charge pump  
strength.  
Likewise excessive ESR on the output capacitor will tend  
to degrade the loop stability of the LTC3252. The closed  
loop output impedance of the LTC3252 is approximately:  
The switching nature of the LTC3252 minimizes output  
noise significantly but not completely. What small ripple  
that exists at an output is controlled by the value of output  
capacitordirectly. Increasingthesizeoftheoutputcapaci-  
tor will proportionately reduce the output ripple. The ESR  
(equivalentseriesresistance)oftheoutputcapacitorplays  
the dominant role in output noise. When the LTC3252  
switches between clock phases there is a period where all  
switches are turned off. This “blanking period” shows up  
asaspikeattheoutputandisadirectfunctionoftheoutput  
current times the ESR value. To reduce output noise and  
ripple, it is suggested that a low ESR (<0.08) ceramic  
capacitor be used for the output capacitor. Tantalum and  
aluminum capacitors are not recommended because of  
their high ESR.  
VOUT  
RO = 0.08•  
0.8V  
For example, with the output programmed to 1.5V, the RO  
is 0.15, which produces a 38mV output change for a  
250mA load current step. For stability and good load  
transient response it is important for the output capacitor  
to have 0.1or less of ESR. Ceramic capacitors typically  
have exceptional ESR and combined with a tight board  
layout should yield excellent stability and load transient  
performance.  
Furtheroutputnoisereductioncanbeachievedbyfiltering  
the LTC3252 outputs through a very small series inductor  
as shown in Figure 4. A 10nH inductor will reject the fast  
output transients caused by the blanking period, thereby  
presenting a nearly constant output voltage. For economy  
the 10nH inductor can be fabricated on the PC board with  
about 1cm (0.4") of PC board trace.  
Both the style and value of the output capacitors can  
significantly affect the stability of the LTC3252. As shown  
in the Simplified Block Diagram, the LTC3252 uses a  
control loop to adjust the strength of each charge pump to  
match the current required at the output. The error signal  
of each loop is stored directly on each output capacitor.  
Thus the output capacitors also serve to form the domi-  
nant pole in each control loop. Figure 3 is a graph of the  
recommended output capacitance, and minimum capaci-  
10nH  
V
OUT  
LTC3252  
GND  
OUT  
4.7µF  
0.47µF  
3252 F04  
Figure 4. 10nH Inductor Used for  
Additional Output Noise Reduction  
8
VIN Capacitor Selection  
RECOMMENDED  
CAPACITANCE  
7
6
5
4
3
2
Thelownoise,dualphasearchitectureusedbytheLTC3252  
makes input noise filtering much less demanding than  
conventional charge pump regulators. The LTC3252 input  
current will transition between IOUT1/2 and IOUT2/2 for  
each half cycle of the oscillator. The blanking period  
described in the VOUT section also effects the input. For  
this reason it is recommended that a low ESR 4.7µF (1µF  
min) or greater ceramic capacitor be used for CIN (see the  
Ceramic Capacitor Selection Guidelines section). Alumi-  
num and tantalum capacitors can be used but are not  
MINIMUM  
CAPACITANCE  
0.9  
1
1.1 1.2 1.3 1.4 1.5 1.6  
V
(V)  
OUT  
3252 F03  
Figure 3. Output Capacitance vs Output Voltage  
recommended because of their high ESR.  
3252f  
8
LTC3252  
U
OPERATIO  
(Refer to Simplified Block Diagram)  
Further input noise reduction can be achieved by filtering  
the input through a very small series inductor as shown in  
Figure 5. A 10nH inductor will reject the fast input tran-  
sients caused by the blanking period, thereby presenting  
anearlyconstantloadtotheinputsupply.Foreconomythe  
10nH inductor can be fabricated on the PC board with  
about 1cm (0.4") of PC board trace.  
discussing the specified capacitance value. For example,  
over rated voltage and temperature conditions, a 4.7µF,  
10V, Y5V ceramic capacitor in a 0805 case may not  
provide any more capacitance than a 1µF, 10V, X7R  
available in the same 0805 case. In fact, over bias and  
temperature range, the 1µF, 10V, X7R will provide more  
capacitance than the 4.7µF, 10V, Y5V. The capacitor  
manufacturer’s data sheet should be consulted to deter-  
mine what value of capacitor is needed to ensure mini-  
mum capacitance values are met over operating  
temperature and bias voltage.  
10nH  
V
IN  
V
IN  
SUPPLY  
4.7µF  
LTC3252  
GND  
Below is a list of ceramic capacitor manufacturers and  
how to contact them:  
3252 F05  
Figure 5. 10nH Inductor Used for  
Additional Input Noise Reduction  
AVX  
Kemet  
www.avxcorp.com  
www.kemet.com  
www.murata.com  
www.t-yuden.com  
www.vishay.com  
Flying Capacitor Selection  
Murata  
Taiyo Yuden  
Vishay  
Warning: A polarized capacitor such as tantalum or alumi-  
num should never be used for the flying capacitors since  
their voltages can reverse upon start-up of the LTC3252.  
Ceramic capacitors should always be used for the flying  
capacitors.  
Layout Considerations  
Duetothehighswitchingfrequencyandtransientcurrents  
produced by the LTC3252 careful board layout is neces-  
sary for optimal performance. A true ground plane and  
short connections to all capacitors will improve perfor-  
mance and ensure proper regulation under all conditions.  
Figure 7 shows the suggested layout configuration. Note  
the exposed paddle of the package is ground (GND) and  
must be soldered to the PCB ground.  
The flying capacitors control the strength of the charge  
pump. In order to achieve the rated output current it is  
necessary for the flying capacitor to have at least 0.4µF of  
capacitance over operating temperature with a 2V bias  
(seetheCeramicCapacitorSelectionGuidelines).If100mA  
or less of current is required from an output then its asso-  
ciatedflyingcapacitorminimumcanbereducedto0.15µF.  
Ceramic Capacitor Selection Guidelines  
The flying capacitor pins C1+, C1, C2+ and C2will have  
very high edge rate wave forms. The large dv/dt on these  
pins can couple energy capacitively to adjacent printed  
circuit board runs. Magnetic fields can also be generated  
if the flying capacitors are not close to the LTC3252 (i.e.,  
the loop area is large). To decouple capacitive energy  
transfer, a Faraday shield may be used. This is a grounded  
PC trace between the sensitive node and the LTC3252  
pins. For a high quality AC ground, it should be returned to  
a solid ground plane that extends all the way to the  
LTC3252. Keep the FB traces away from or shielded from  
the flying capacitor traces or degraded performance could  
result.  
Capacitors of different materials lose their capacitance  
withhighertemperatureandvoltageatdifferentrates. For  
example, a ceramic capacitor made of X7R material will  
retainmostofitscapacitancefrom40°Cto85°Cwhereas  
a Z5U or Y5V style capacitor will lose considerable  
capacitance over that range (60% to 80% loss typical).  
Z5U and Y5V capacitors may also have a very strong  
voltage coefficient causing them to lose an additional  
60% or more of their capacitance when the rated voltage  
is applied. Therefore, when comparing different capaci-  
tors it is often more appropriate to compare the amount  
of achievable capacitance for a given case size rather than  
3252f  
9
LTC3252  
U
OPERATIO  
(Refer to Simplified Block Diagram)  
Thermal Management  
IOUT1 = 150mA and OUT1 regulating at 1.5V the measured  
efficiency is 80.6% which is in close agreement with the  
theoretical 83.3% calculation.  
To reduce the maximum junction temperature, a good  
thermal connection to the PC board is recommended.  
Soldering the exposed paddle of the IC to the PCB and  
maintaining a solid ground plane under the device on one  
or more layers of the PC board, the thermal resistance of  
the package can be as small as 40°C/W. By applying the  
suggested thermal management techniques the IC junc-  
tion temperature should never exceed 125°C even under  
worst case operating conditions.  
Programming the LTC3252 Output Voltages (FB1 and  
FB2 Pin)  
EachoutputoftheLTC3252isprogrammedtoanarbitrary  
voltageviaanexternalresistivedivider.Figure7showsthe  
required voltage divider connection. The voltage divider  
ratio is given by the expression:  
RA OUT  
RB 0.8V  
Power Efficiency  
=
1  
The power efficiency (η) of the LTC3252 is approximately  
50% higher than a conventional linear regulator. This  
occurs because the input current for a 2-to-1 step-down  
charge pump is approximately half the output current. For  
an ideal 2-to-1 step-down charge pump the power effi-  
ciency is given by:  
Typical values for total voltage divider resistance can  
range from several ks up to 1M.  
The user may want to consider load regulation when  
setting the desired output voltage. The closed loop output  
impedance of the LTC3252 is approximately:  
POUT  
P
IN  
VOUT IOUT 2VOUT  
OUT  
RO = 0.08•  
0.8V  
η ≡  
=
=
1
V
IN  
V • IOUT  
IN  
2
For a 1.5V output, RO is 0.15, which produces a 38mV  
output change for a 250mA load current step. Thus, the  
user may want to target an unloaded output voltage  
slightly higher than desired to compensate for the output  
load conditions. The output may be programmed for  
regulation voltages of 0.9V to 1.6V.  
TheswitchinglossesandquiescentcurrentoftheLTC3252  
are designed to minimize efficiency loss over the entire  
output current range, causing only a couple % error from  
the theoretical efficiency. For example with VIN = 3.6V,  
R
R
R '  
B
R '  
A
A
B
Since the LTC3252 employs a 2-to-1 charge pump archi-  
tecture, it is not possible to achieve output voltages  
greater than half the available input voltage. The minimum  
VIN supply required for regulation can be determined by  
the following equation:  
1
EN2  
EN1  
V
IN  
LTC3252  
C2  
C
IN  
VIN (MIN) 2 • (VOUT (MIN) + IOUT • ROL)  
C1  
OUT1  
OUT1  
OUT2  
FB2  
OUT2  
R
OUT1  
0.8V  
R ' OUT2  
A
A
B
R
R
R '  
A
A
LTC3252  
=
– 1  
=
– 1  
OUT1  
OUT2  
R
R '  
B
0.8V  
C
C
O2  
O1  
C
O1  
FB1  
C
O2  
R '  
B
B
GND  
GND  
GND  
(CONNECT DIRECTLY TO GROUND PLANE)  
3252 F06  
3252 F07  
Figure 6. Suggested Layout for the LTC3252  
Figure 7. Programming the LTC3252  
3252f  
10  
LTC3252  
U
TYPICAL APPLICATIO  
Li-Ion to 1.5V/1.2V Outputs  
3
2
5
11  
9
V
EN2  
OFF ON  
IN  
OUT2  
1.5V  
EN1  
OUT2  
OFF ON  
1µF  
OUT1  
1.2V  
250mA  
10  
+
OUT1  
C2  
470k  
510k  
1µF  
LTC3252  
250mA  
4
6
1
8
+
261k  
C1  
C2  
4.7µF  
12  
7
C1  
FB2  
4.7µF  
FB1  
GND  
Li-ION  
510k  
4.7µF  
3252 TA02  
U
PACKAGE DESCRIPTIO  
DE/UE Package  
12-Lead Plastic DFN (4mm × 3mm)  
(Reference LTC DWG # 05-08-1695)  
0.58 ±0.05  
3.40 ±0.05  
2.24 ±0.05 (2 SIDES)  
1.70 ±0.05  
PACKAGE OUTLINE  
0.25 ± 0.05  
0.50  
BSC  
3.30 ±0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
0.38 ± 0.10  
4.00 ±0.10  
(2 SIDES)  
R = 0.115  
TYP  
7
12  
R = 0.20  
TYP  
3.00 ±0.10 1.70 ± 0.10  
(2 SIDES)  
(2 SIDES)  
PIN 1  
TOP MARK  
PIN 1  
NOTCH  
(UE12/DE12) DFN 0802  
6
0.25 ± 0.05  
1
0.75 ±0.05  
0.200 REF  
0.50  
BSC  
3.30 ±0.10  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION  
(WGED) IN JEDEC PACKAGE OUTLINE M0-229  
2. ALL DIMENSIONS ARE IN MILLIMETERS  
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
4. EXPOSED PAD SHALL BE SOLDER PLATED  
3252f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
11  
LTC3252  
U
TYPICAL APPLICATIO S  
Fixed 3.3VIN to 1.5VOUT at 300mA  
3-Cell NiMH with Digitally Selectable 1.2V/1.5V Output  
OFF ON  
3
2
5
11  
9
3
2
5
11  
9
V
EN2  
EN2  
IN  
V
EN2  
3.3V  
IN  
I
OUT  
OUT  
250mA  
EN1  
EN1  
OUT2  
4.7µF  
1µF  
1.5V  
EN1  
OUT2  
10  
+
300mA  
10  
OUT1  
C2  
261k  
+
OUT1  
C2  
470k  
510k  
1µF  
LTC3252  
4
6
1
8
4.7µF  
+
1µF  
LTC3252  
4
6
1
8
C1  
C2  
+
C1  
C2  
1µF  
4.7µF  
3-CELL  
NiMH  
12  
7
10µF  
C1  
FB2  
12  
7
C1  
FB2  
FB1  
GND  
EN1 EN2 OUT  
FB1  
GND  
412k  
100k  
OFF  
OFF  
ON  
OFF  
ON  
OFF 1.5V  
0V  
1.2V  
3252 TA03  
ON  
ON  
1.5V  
3252 TA04  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC1514  
50mA, 650kHz, Step-Up/Down Charge Pump  
with Low Battery Comparator  
V
= 2.7V to 10V, V  
= 10µA, S8  
= 3V or 5V, Regulated Output, I = 60µA,  
Q
IN  
OUT  
I
SHDN  
LTC1515  
50mA, 650kHz, Step-Up/Down Charge Pump  
with Power-On Reset  
V
= 2.7V to 10V, V  
= <1µA, S8  
= 3.3V or 5V, Regulated Output, I = 60µA,  
Q
IN  
OUT  
I
SHDN  
LT1776  
500mA (I ), 200kHz, High Efficiency  
Step-Down DC/DC Converter  
90% Efficiency, V = 7.4V to 40V, V Min = 1.24V,  
OUT  
OUT  
IN  
I = 3.2mA, I  
= 30µA, N8, S8  
Q
SHDN  
LTC1911-1.5  
LTC1911-1.8  
LTC3250-1.5  
LTC3251  
250mA, 1.5MHz, High Efficiency  
Step-Down Charge Pump  
75% Efficiency, V = 2.7V to 5.5V, V  
= 1.5V, Regulated Output,  
= 1.8V, Regulated Output,  
= 1.5V, Regulated Output,  
IN  
OUT  
OUT  
OUT  
I = 180µA, I  
= 10µA, MS8  
Q
SHDN  
250mA, 1.5MHz, High Efficiency  
Step-Down Charge Pump  
75% Efficiency, V = 2.7V to 5.5V, V  
IN  
I = 180µA, I  
= 10µA, MS8  
Q
SHDN  
250mA, 1.5MHz, High Efficiency  
Step-Down Charge Pump  
85% Efficiency, V = 3.1V to 5.5V, V  
IN  
I = 35µA, I  
= <1µA, ThinSOT  
Q
SHDN  
500mA, Spread Spectrum, High Efficiency  
Step-Down Charge Pump  
Up to 85% Efficiency, V = 2.7V to 5.5V, V  
= 0.9V to 1.6V,  
IN  
OUT  
I = 8µA, I  
Q
= <1µA, MS10  
SHDN  
LTC3404  
600mA (I ), 1.4MHz, Synchronous  
Step-Down DC/DC Converter  
95% Efficiency, V = 2.7V to 6V, V  
Min = 0.8V,  
Min = 0.8V,  
OUT  
IN  
OUT  
OUT  
I = 10µA, I  
= <1µA, MS8  
Q
SHDN  
LTC3405/LTC3405A 300mA (I ), 1.5MHz, Synchronous  
95% Efficiency, V = 2.7V to 6V, V  
IN  
OUT  
Step-Down DC/DC Converter  
I = 20µA, I  
= <1µA, ThinSOT  
Q
SHDN  
LTC3406/LTC3406B 600mA (I ), 1.5MHz, Synchronous  
95% Efficiency, V = 2.5V to 5.5V, V  
Min = 0.6V,  
Min = 0.8V,  
Min = 0.8V,  
Min = 2.5V,  
OUT  
IN  
OUT  
OUT  
OUT  
OUT  
Step-Down DC/DC Converter  
I = 20µA, I  
= <1µA, ThinSOT  
Q
SHDN  
LTC3411  
LTC3412  
LTC3440  
1.25A (I ), 4MHz, Synchronous Step-Down 95% Efficiency, V = 2.5V to 5.5V, V  
DC/DC Converter  
OUT  
IN  
I = 60µA, I  
= <1µA, MS10  
Q
SHDN  
2.5A (I ), 4MHz, Synchronous Step-Down  
95% Efficiency, V = 2.5V to 5.5V, V  
IN  
OUT  
DC/DC Converter  
I = 60µA, I  
= <1µA, TSSOP-16E  
Q
SHDN  
600mA (I ), 2MHz, Synchronous  
95% Efficiency, V = 2.5V to 5.5V, V  
IN  
OUT  
Buck-Boost DC/DC Converter  
I = <25µA, I  
= 1µA, MS10  
Q
SHDN  
3252f  
LT/TP 0503 1K • PRINTED IN USA  
12 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2003  

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