LTC3409AEDD#TRPBF [Linear]

LTC3409A - 600mA Low VIN Buck Regulator in 3mm x 3mm DFN; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C;
LTC3409AEDD#TRPBF
型号: LTC3409AEDD#TRPBF
厂家: Linear    Linear
描述:

LTC3409A - 600mA Low VIN Buck Regulator in 3mm x 3mm DFN; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C

稳压器
文件: 总20页 (文件大小:210K)
中文:  中文翻译
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LTC3602  
2.5A, 10V, Monolithic  
Synchronous Step-Down  
Regulator  
FEATURES  
DESCRIPTION  
TheLTC®3602isahighefficiency,monolithicsynchronous,  
step-downDC/DCconverterutilizingaconstant-frequency,  
currentmodearchitecture.Itoperatesfromaninputvoltage  
range of 4.5V to 10V and provides an adjustable regulated  
output voltage from 0.6V to 9.5V while delivering up to  
2.5A of output current. The internal synchronous power  
switch with 65mΩ on-resistance increases efficiency  
and eliminates the need for an external Schottky diode.  
The switching frequency can either be set by an external  
resistororsynchronizedtoanexternalclock. OPTI-LOOP®  
compensationallowsthetransientresponsetobeoptimized  
over a wide range of loads and output capacitors.  
n
Wide Input Voltage Range: 4.5V to 10V  
n
2.5A Output Current  
n
Low R  
Internal Switches: 65mΩ and 90mΩ  
DS(ON)  
n
n
n
n
n
n
n
n
n
Programmable Frequency: 300kHz to 3MHz  
Low Quiescent Current: 75μA  
0.6V 1ꢀ Reference Allows Low Output Voltage  
99ꢀ Maximum Duty Cycle  
Adjustable Burst Mode® Clamp  
Synchronizable to External Clock  
Power Good Output Voltage Monitor  
Overtemperature Protection  
Available in 16-Lead Exposed TSSOP and  
4mm × 4mm QFN Packages  
The LTC3602 can be configured for either Burst Mode op-  
erationorforcedcontinuousoperation.Forcedcontinuous  
operation reduces noise and RF interference, while Burst  
Mode operation provides the high efficiency at light loads.  
In Burst Mode operation, external control of the burst  
clamp level allows the output voltage ripple to be adjusted  
according to the requirements of the application.  
APPLICATIONS  
n
Point-of-Load Supplies  
n
Portable Instruments  
n
Server Backplane Power  
Battery-Powered Devices  
n
, LT, LTC, LTM, Burst Mode and OPTI-LOOP are registered trademarks of Linear  
Technology Corporation. All other trademarks are the property of their respective owners.  
TYPICAL APPLICATION  
3.3V, 2.5A, 1MHz Step-Down Regulator  
Efficiency and Power Loss vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
10000  
1000  
100  
10  
V
IN  
V
= 7V  
IN  
4.5V TO 10V  
EFFICIENCY  
22μF  
1μF  
PV  
INTV  
IN  
CC  
RUN  
BOOST  
POWER LOSS  
0.22μF  
2.2μH  
R
T
V
3.3V  
2.5A  
OUT  
105k  
PGOOD  
TRACK/SS  
SW  
LTC3602  
100μF  
4.32k  
1nF  
I
PGND  
TH  
1
10  
SYNC/MODE  
V
FB  
0.01  
0.1  
1
475k  
22pF  
LOAD CURRENT (A)  
3602 TA01b  
105k  
3602 TA01  
3602fb  
1
LTC3602  
ABSOLUTE MAXIMUM RATINGS  
(Note 1)  
Input Supply Voltage (PV ).......................0.3V to 11V  
Peak SW Sink and Source Current (Note 7).............6.5A  
Operating Temperature Range (Note 2)....–40°C to 85°C  
Junction Temperature (Notes 5, 6)........................ 125°C  
Lead Temperature  
IN  
SW (DC)...................................... –0.3V to (PV + 0.3V)  
IN  
BOOST ................................. (V –0.3V) to (V + 6V)  
SW  
SW  
RUN ...........................................................0.3V to 11V  
All Other Pins...............................................0.3V to 6V  
(Soldering, FE Package 10 seconds)................. 300°C  
PIN CONFIGURATION  
TOP VIEW  
TOP VIEW  
20 19 18 17 16  
SYNC/MODE  
PGOOD  
1
2
3
4
5
6
7
8
16 INTV  
CC  
15 PV  
IN  
PGND  
PV  
PV  
1
2
3
4
5
15  
14  
13  
12  
11  
IN  
IN  
R
14 BOOST  
13 SW  
T
PGND  
I
TH  
17  
PGND  
INTV  
21  
8
CC  
V
FB  
12 SW  
PGND  
SYNC/MODE  
RUN  
11 SW  
TRACK/SS  
PGOOD  
TRACK/SS  
PGND  
10 PGND  
6
7
9 10  
9
PGND  
FE PACKAGE  
16-LEAD PLASTIC TSSOP  
UF PACKAGE  
20-LEAD (4mm s 4mm) PLASTIC QFN  
T
= 125°C, θ = 38°C/W, θ = 10°C/W  
JA JC  
EXPOSED PAD (PIN 17) IS SGND, MUST BE SOLDERED TO PCB  
JMAX  
T
= 125°C, θ = 37°C/W, θ = 10°C/W  
JA JC  
JMAX  
EXPOSED PAD (PIN 21) IS SGND, MUST BE SOLDERED TO PCB  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC3602EFE#PBF  
LTC3602IFE#PBF  
LTC3602EUF#PBF  
LTC3602IUF#PBF  
TAPE AND REEL  
PART MARKING*  
3602FE  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
LTC3602EFE#TRPBF  
LTC3602IFE#TRPBF  
LTC3602EUF#TRPBF  
LTC3602IUF#TRPBF  
16-Lead Plastic TSSOP  
–40°C to 85°C  
–40°C to 85°C  
–40°C to 85°C  
–40°C to 85°C  
3602FE  
16-Lead Plastic TSSOP  
3602  
20-Lead (4mm × 4mm) Plastic QFN  
20-Lead (4mm × 4mm) Plastic QFN  
3602  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 8.4V unless otherwise specified.  
SYMBOL  
PV  
PARAMETER  
CONDITIONS  
MIN  
4.5  
TYP  
MAX  
10  
UNITS  
V
Operating Voltage Range  
Regulated Feedback Voltage  
Feedback Voltage Line Regulation  
Feedback Voltage Load Regulation  
IN  
l
l
V
I
TH  
= 0.7V (Note 3)  
0.594  
0.6  
0.005  
0.02  
0.606  
V
FB  
V
I
= 5V to 10V, I = 0.7V  
ꢀ/V  
ΔV  
ΔV  
IN  
TH  
FB(LINEREG)  
= 0.36V to 0.84V  
0.1  
TH  
FB(LOADREG)  
3602fb  
2
LTC3602  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 8.4V unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
10  
MAX  
12  
UNITS  
Power Good Range  
ΔV  
PGOOD  
PGOOD  
R
Power Good Resistance  
FB Input Bias Current  
Transconductance Amplifier g  
11  
18  
Ω
I
10  
nA  
FB  
g
1.7  
ms  
m
m
I
S
Supply Current  
Active Mode  
Sleep Mode  
Shutdown  
(Note 4)  
500  
75  
0.2  
700  
100  
1
μA  
μA  
μA  
INTV  
V
LDO Output Voltage  
CC  
4.8  
0.4  
5
90  
5.2  
V
ns  
CC  
t
Minimum Controllable ON-Time  
RUN Pin ON Threshold  
TRACK/SS Pull-Up Current  
Oscillator Frequency  
ON, MIN  
l
V
RUN  
V
Rising  
0.7  
1.25  
1
1
V
RUN  
I
f
f
μA  
TRACK/SS  
OSC  
R = 105k  
0.8  
0.3  
1.2  
3
MHz  
MHz  
T
SYNC Capture Range  
SYNC  
R
Top Switch On-Resistance  
Bottom Switch On-Resistance  
90  
67  
mΩ  
mΩ  
DS(ON)  
I
I
Peak Current Limit  
3.8  
4.1  
4.5  
0.1  
4.2  
700  
5.2  
1
A
μA  
V
LIM  
Switch Leakage Current  
LSW  
V
V
INTV Undervoltage Lockout  
INTV Ramping Up  
4.3  
UVLO  
CC  
CC  
INTV Undervoltage Lockout Hysteresis  
mV  
UVLO, HYS  
CC  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 4: Dynamic supply current is higher due to the internal gate charge  
being delivered at the switching frequency.  
Note 5: T is calculated from the ambient temperature T and the power  
J
A
dissipation as follows: T = T + (P )(θ C/W).  
J
A
D
JA  
Note 2: The LTC3602E is guaranteed to meet performance specifications  
from 0°C to 85°C. Specifications over the –40°C to 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 6: This IC includes overtemperature protection that is intended  
to protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 3: The LTC3602 is tested in a feedback loop that adjusts V to  
FB  
achieve a specified error amplifier output voltage (I ).  
TH  
Note 7: This limit indicates the current density limitations of the internal  
metallization and it is not tested in production.  
TYPICAL PERFORMANCE CHARACTERISTICS  
Burst Mode Operation  
Load Step Transient Forced Continuous  
V
V
= 7V  
OUT  
LOAD = 50mA  
V
V
= 7V  
IN  
= 3.3V  
OUT  
IN  
= 3.3V  
OUTPUT  
VOLTAGE  
100mV/DIV  
OUTPUT  
VOLTAGE  
50mV/DIV  
LOAD  
CURRENT  
1A/DIV  
INDUCTOR  
CURRENT  
500mA/DIV  
3602 G02  
3602 G01  
10μs/DIV  
10μs/DIV  
3602fb  
3
LTC3602  
TYPICAL PERFORMANCE CHARACTERISTICS  
Switch On-Resistance  
Switch On-Resistance  
vs Temperature  
VREF vs Temperature  
vs Input Voltage  
95  
90  
0.6008  
0.6006  
0.6004  
0.6002  
140  
120  
V
– V = INTV  
SW  
V
= 8.4V  
V
= 8.4V  
BOOST  
CC  
IN  
IN  
TOP  
85  
80  
75  
70  
65  
100  
80  
60  
40  
20  
TOP  
BOTTOM  
0.6000  
0.5998  
0.5996  
BOTTOM  
60  
0
4
5
6
7
8
9
10  
50  
TEMPERATURE (°C)  
100 125  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
–50  
25  
75  
–25  
0
INPUT VOLTAGE (V)  
3602 G03  
3602 G04  
3602 G05  
PVIN Leakage Current  
vs Input Voltage  
Frequency vs ROSC  
Frequency vs Input Voltage  
7
6
5
4
3
2
1
0
3500  
3000  
1020  
1015  
1010  
1005  
R
= 105k  
V
= 0V  
OSC  
RUN  
2500  
2000  
1500  
1000  
500  
1000  
995  
990  
985  
980  
0
5
6
8
4
9
200  
(k)  
300 350  
7
0
50  
100 150  
R
250  
4
5
6
7
8
9
10  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
OSC  
3602 G08  
3602 G07  
3602 G06  
Quiescent Current  
vs Input Voltage  
Quiescent Current  
vs Temperature  
Frequency vs Temperature  
600  
500  
400  
300  
200  
100  
0
600  
500  
400  
300  
200  
100  
0
1020  
1015  
1010  
1005  
R
OSC  
= 105k  
ACTIVE  
ACTIVE  
1000  
995  
990  
985  
980  
SLEEP  
SLEEP  
4
5
6
7
8
9
10  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
INPUT VOLTAGE (V)  
3602 G10  
3602 G09  
3602 G11  
3602fb  
4
LTC3602  
TYPICAL PERFORMANCE CHARACTERISTICS  
Minimum Peak Inductor Current  
vs Burst Clamp Voltage  
Maximum Peak Inductor Current  
vs Duty Cycle  
Efficiency vs Load Current,  
Burst Mode Operation  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
100  
95  
90  
85  
80  
75  
70  
5
4
3
FIGURE 6 CIRCUIT  
V
= 5V  
IN  
V
= 9V  
IN  
2
1
0
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
0.01  
0.1  
1
10  
0
10 20 30 40 50 60 70 80 90 100  
BURST CLAMP VOLTAGE (V)  
LOAD CURRENT (A)  
DUTY CYCLE (%)  
3602 G13  
3602 G12  
3602 G14  
Efficiency vs Load Current,  
Forced Continuous  
Efficiency vs Input Voltage  
Efficiency vs Frequency  
100  
95  
90  
85  
80  
75  
70  
100  
98  
96  
94  
92  
90  
88  
86  
84  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
FIGURE 6 CIRCUIT  
FIGURE 6 CIRCUIT  
FIGURE 6 CIRCUIT  
V
LOAD  
= 7V  
IN  
I
= 1A  
I
= 1A  
LOAD  
V
= 5V  
IN  
I
= 2.5A  
LOAD  
2.2μH  
1μH  
V
= 9V  
IN  
4.7μH  
4
5
6
7
8
9
10  
0.01  
0.1  
1
10  
0
500 1000 1500 2000 2500 3000  
FREQUENCY (kHz)  
INPUT VOLTAGE (V)  
LOAD CURRENT (A)  
3602 G17  
3602 G16  
3602 G15  
5V LDO Output Voltage  
vs Temperature  
TRACK/SS Current  
vs Temperature  
Load Regulation  
0.10  
0.00  
5.10  
5.08  
5.06  
5.04  
5.02  
5.00  
4.98  
4.96  
4.94  
4.92  
4.90  
1.40  
1.35  
1.30  
1.25  
1.20  
1.15  
1.10  
FIGURE 6 CIRCUIT  
V
= 7V  
IN  
–0.10  
–0.20  
50  
75 100 125  
0
0.5  
1 1.5  
LOAD CURRENT (A)  
2
2.5  
3
–50  
0
25  
–25  
50  
TEMPERATURE (oC)  
125  
–50  
0
25  
75 100  
–25  
TEMPERATURE (oC)  
3602 G19  
3602 G18  
3602 G20  
3602fb  
5
LTC3602  
PIN FUNCTIONS  
SYNC/MODE (Pin 1/Pin 4): Mode Select and External  
Clock Synchronization Input.  
FE/UF Package  
be programmed by connecting a capacitor between this  
pin and ground. Leave this pin floating to use the internal  
1ms soft-start clamp. Do not tie this pin to INTV or to  
CC  
PGOOD (Pin 2/Pin 5): Power Good Output. Open-drain  
logic output that is pulled to ground when the output volt-  
age is not within 10ꢀ of regulation point.  
PV .  
IN  
PGND (Pins 8, 9, 10/Pins 12, 13, 14, 15): Power  
Ground.  
R (Pin 3/Pin 6): Frequency Set Pin.  
T
SW (Pins 11, 12, 13/Pins 16, 17, 18, 19): Switch Node  
Connection to the Inductor.  
I
(Pin 4/Pin 7): Error Amplifier Compensation Point.  
(Pin 5/Pin 8): Feedback Pin.  
TH  
V
FB  
BOOST (Pin 14/Pin 20): Bootstrapped Supply to the Top  
Side Floating Gate Driver.  
SGND (Pin 17/Pin 9, Pin 21): Signal Ground.  
RUN (Pin 6/Pin 10): Run Control Input. This pin may be  
PV (Pin 15/Pins 1,2): Power Input Supply. Decouple  
IN  
tied to PV to enable the chip.  
this pin with a capacitor to PGND  
IN  
TRACK/SS(Pin7/Pin11):TrackingInputfortheController  
INTV (Pin 16/Pin 3): Output of Internal 5V LDO.  
CC  
or Optional External Soft-Start Input. This pin allows the  
Exposed Pad (Pin 17/Pin 21): SGND. Exposed pad is  
signal ground and must be soldered to the PCB.  
start-up of V  
to “track” the external voltage at this pin  
OUT  
usinganexternalresistordivider.Anexternalsoft-startcan  
BLOCK DIAGRAM  
I
TH  
BOOST  
INTV  
PV  
IN  
CC  
1μA  
0.6V  
VOLTAGE  
REFERENCE  
SLOPE  
COMPENSATION  
RECOVERY  
TRACK/SS  
1ms  
SOFT-START  
BCLAMP  
+
ERROR  
AMPLIFIER  
BURST  
COMPARATOR  
+
+
+
MAIN  
I-COMPARATOR  
+
V
FB  
SYNC/MODE  
SW  
SW  
+
0.54V  
+
SLOPE  
COMPENSATION  
OSILLATOR  
OVER-CURRENT  
SW  
COMPARATOR  
+
+
LOGIC  
PGND  
PGND  
PGND  
0.66V  
REVERSE  
COMPARATOR  
PGOOD  
+
R
T
RUN  
SYNC/MODE  
3602 BD  
3602fb  
6
LTC3602  
OPERATION  
Main Control Loop  
Burst Mode Operation  
Connecting the SYNC/MODE pin to a voltage in the range  
of 0.42V to 1V enables Burst Mode operation. In Burst  
Mode operation, the internal power MOSFETs operate  
intermittently at light loads. This increases efficiency by  
minimizing switching losses. During Burst Mode opera-  
tion, the minimum peak inductor current is externally set  
by the voltage on the SYNC/MODE pin and the voltage  
TheLTC3602isamonolithic,constant-frequency,current-  
mode step-down DC/DC converter. During normal opera-  
tion, theinternaltoppowerswitch(N-channelMOSFET)is  
turned on at the beginning of each clock cycle. Current in  
the inductor increases until the current comparator trips  
and turns off the top power MOSFET. The peak inductor  
current at which the current comparator shuts off the top  
on the I pin is monitored by the burst comparator to  
power switch is controlled by the voltage on the I pin.  
TH  
TH  
determine when sleep mode is enabled and disabled.  
When the average inductor current is greater than the  
load current, the voltage on the I pin drops. As the I  
The error amplifier adjusts the voltage on the I pin by  
TH  
comparing the feedback signal from a resistor divider on  
the V pin with an internal 0.6V reference. When the load  
TH  
TH  
FB  
voltage falls below 330mV, the burst comparator trips and  
current increases, it causes a reduction in the feedback  
enables sleep mode. During sleep mode, the top power  
voltage relative to the reference. The error amplifier raises  
MOSFET is held off and the I pin is disconnected from  
the I voltage until the average inductor current matches  
TH  
TH  
theoutputoftheerroramplifier.Themajorityoftheinternal  
circuitry is also turned off to reduce the quiescent current  
to 75μA while the load current is solely supplied by the  
the new load current. When the top power MOSFET shuts  
off, the synchronous power switch (N-channel MOSFET)  
turns on until either the bottom current limit is reached or  
the beginning of the next clock cycle. The bottom current  
limit is set at –2.5A for forced continuous mode and 0A  
for Burst Mode operation.  
output capacitor. When the output voltage drops, the I  
TH  
pin is reconnected to the output of the error amplifier and  
the top power MOSFET along with all the internal circuitry  
is switched back on. This process repeats at a rate that  
is dependent on the load demand. Pulse-skipping opera-  
tion is implemented by connecting the SYNC/MODE pin  
to ground. This forces the burst clamp level to be at 0V.  
As the load current decreases, the peak inductor current  
The operating frequency is externally set by an external  
resistor connected between the R pin and ground. The  
T
practical switching frequency can range from 300kHz to  
3MHz.  
Overvoltage and undervoltage comparators will pull the  
PGOOD output low if the output voltage comes out of  
regulation by 7.5ꢀ. In an overvoltage condition, the top  
powerMOSFETisturnedoffandthebottompowerMOSFET  
isswitchedonuntileithertheovervoltageconditionclears  
or the bottom MOSFET’s current limit is reached.  
will be determined by the voltage on the I pin until the  
TH  
I
voltage drops below 330mV. At this point, the peak  
TH  
inductor current is determined by the minimum on-time  
of the current comparator. If the load demand is less than  
the average of the minimum on-time inductor current,  
switching cycles will be skipped to keep the output volt-  
age in regulation.  
Forced Continuous Mode  
Frequency Synchronization  
ConnectingtheSYNC/MODEpintoINTV willdisableBurst  
CC  
Mode operation and force continuous current operation.  
At light loads, forced continuous mode operation is less  
efficientthanBurstModeoperation,butmaybedesirablein  
some applications where it is necessary to keep switching  
harmonics out of a signal band. The output voltage ripple  
is minimized in this mode.  
TheinternaloscillatoroftheLTC3602canbesynchronized  
to an external clock connected to the SYNC/MODE pin.  
The frequency of the external clock can be in the range of  
300kHz to 3MHz. For this application, the oscillator timing  
resistor should be chosen to correspond to a frequency  
that is 25ꢀ lower than the synchronization frequency.  
When synchronized, the LTC3602 will operate in pulse-  
skipping mode.  
3602fb  
7
LTC3602  
OPERATION  
Dropout Operation  
Overtemperature Protection  
Whentheinputsupplyvoltagedecreasestowardtheoutput  
voltage, the duty cycle increases toward the maximum  
on-time. Furtherreductionofthesupplyvoltageforcesthe  
top switch to remain on for more than one cycle until it  
attempts to stay on continuously. In order to replenish the  
voltage on the floating BOOST supply capacitor, however,  
the topswitch isforced offand the bottomswitchisforced  
onforapproximately85nseverysixteenclockcycles. This  
achieves an effective duty cycle that can exceed 99ꢀ. The  
output voltage will then be primarily determined by the  
input voltage minus the voltage drop across the upper  
internal N-channel MOSFET and the inductor.  
When using the LTC3602 in an application circuit, care  
must be taken not to exceed any of the ratings speci-  
fied in the Absolute Maximum Ratings section. As an  
added safeguard, however, the LTC3602 does incorporate  
an overtemperature shutdown feature. If the junction  
temperature reaches approximately 150°C, both power  
switches will be turned off and the SW node will become  
high impedance. After the part has cooled to below 115°C,  
it will restart.  
Voltage Tracking and Soft-Start  
Some microprocessors and DSP chips need two power  
supplieswithdifferentvoltagelevels. Thesesystemsoften  
requirevoltagesequencingbetweenthecorepowersupply  
and the I/O power supply. Without proper sequencing,  
latch-up failure or excessive current draw may occur that  
could result in damage to the processor’s I/O ports or the  
I/O ports of a supporting system device such as memory,  
an FPGA or a data converter. To ensure that the I/O loads  
are not driven until the core voltage is properly biased,  
tracking of the core supply and the I/O supply voltage is  
necessary.  
Slope Compensation and Inductor Peak Current  
Slope compensation provides stability in constant-fre-  
quency architectures by preventing subharmonic oscilla-  
tions at duty cycles greater than 50ꢀ. It is accomplished  
internally by adding a compensating ramp to the inductor  
current signal at duty cycles in excess of 30ꢀ. Normally,  
the maximum inductor peak current is reduced when  
slope compensation is added. In the LTC3602, however,  
slope compensation recovery is implemented to reduce  
the variation of the maximum inductor peak current (and  
therefore the maximum available output current) over the  
range of duty cycles.  
Voltage tracking is enabled by applying a ramp voltage to  
the TRACK/SS pin. When the voltage on the TRACK pin  
is below 0.6V, the feedback voltage will regulate to this  
tracking voltage. When the tracking voltage exceeds 0.6V,  
tracking is disabled and the feedback voltage will regulate  
to the internal reference voltage.  
Short-Circuit Protection  
When the output is shorted to ground, the inductor cur-  
rent decays very slowly during a single switching cycle.  
To prevent current runaway from occurring, a secondary  
current limit is imposed on the inductor current. If the  
inductor valley current increases to more than 4.5A, the  
top power MOSFET will be held off and switching cycles  
will be skipped until the inductor current is reduced.  
The TRACK/SS pin is also used to implement an external  
soft-start function. A 1.2μA current is sourced from this  
pin so that an external capacitor may be added to create  
a smooth ramp. If this ramp is slower than the internal  
1ms soft-start, then the output voltage will track this ramp  
during start up instead. Leave this pin floating to use the  
internal 1ms soft-start ramp. Do not tie the TRACK/SS  
pin to INTV or to PV .  
CC  
IN  
3602fb  
8
LTC3602  
APPLICATIONS INFORMATION  
ThebasicLTC3602applicationcircuitisshownonthefront  
page of this data sheet. External component selection is  
determined by the maximum load current and begins with  
theselectionoftheinductorvalueandoperatingfrequency  
A reasonable starting point for selecting the ripple current  
is ΔI = 0.4(I  
), where I  
is the maximum output  
L
MAX  
MAX  
current. The largest ripple current occurs at the highest  
V . To guarantee that the ripple current stays below a  
IN  
followed by C and C  
.
specified maximum, the inductor value should be chosen  
IN  
OUT  
according to the following equation:  
Operating Frequency  
⎞ ⎛  
VOUT  
VOUT  
V
IN(MAX)  
Selection of the operating frequency is a tradeoff between  
efficiency and component size. High frequency operation  
allows the use of smaller inductor and capacitor values.  
Operation at lower frequencies improves efficiency by  
reducing internal gate charge and switching losses but  
requires larger inductance values and/or capacitance to  
maintainlowoutputripplevoltage.Theoperatingfrequency  
oftheLTC3602isdeterminedbyanexternalresistorthatis  
L =  
• 1–  
⎟ ⎜  
fΔI  
L(MAX) ⎠ ⎝  
The inductor value will also have an effect on Burst Mode  
operation. The transition from low current operation  
begins when the peak inductor current falls below a level  
set by the burst clamp. Lower inductor values result in  
higher ripple current which causes this to occur at lower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values will cause the burst frequency  
to increase.  
connectedbetweentheR pinandground.Thevalueofthe  
T
resistor sets the ramp current that is used to charge and  
dischargeaninternaltimingcapacitorwithintheoscillator  
and can be calculated by using the following equation:  
1.15 • 1011  
Inductor Core Selection  
ROSC  
=
– 10k  
f(Hz)  
Once the value for L is known, the type of inductor must  
be selected. High efficiency converters generally cannot  
affordthecorelossfoundinlowcostpowderedironcores,  
forcing the use of the more expensive ferrite cores. Actual  
core loss is independent of core size for a fixed inductor  
value but it is very dependent on the inductance selected.  
As the inductance increases, core losses decrease. Un-  
fortunately, increased inductance requires more turns of  
wire and therefore copper losses will increase.  
Although frequencies as high as 3MHz are possible, the  
minimum on-time of the LTC3602 imposes a minimum  
limit on the operating duty cycle. The minimum on-time  
is typically 90ns. Therefore, the minimum duty cycle is  
equal to 100 • 90ns • f(Hz).  
Inductor Selection  
For a given input and output voltage, the inductor value  
and operating frequency determine the ripple current. The  
Ferrite designs have very low core losses and are pre-  
ferred at high switching frequencies, so design goals can  
concentrate on copper loss and preventing saturation.  
Ferrite core material saturates “hard,” which means that  
inductancecollapsesabruptlywhenthepeakdesigncurrent  
is exceeded. This results in an abrupt increase in inductor  
ripple current and consequent output voltage ripple. Do  
not allow the core to saturate!  
ripplecurrentΔI increaseswithhigherV anddecreases  
L
IN  
with higher inductance.  
V
fL  
VOUT  
OUT  
ΔIL =  
• 1–  
V
IN  
Having a lower ripple current reduces the ESR losses  
in the output capacitors and the output voltage ripple.  
Highest efficiency operation is achieved at low frequency  
with small ripple current. This, however, requires a large  
inductor.  
Different core materials and shapes will change the  
size/current and price/current relationship of an inductor.  
Toroid or shielded pot cores in ferrite or permalloy ma-  
terials are small and do not radiate energy but generally  
cost more than powdered iron core inductors with similar  
3602fb  
9
LTC3602  
APPLICATIONS INFORMATION  
characteristics. The choice of which style inductor to use  
mainly depends on the price vs size requirements and any  
radiated field/EMI requirements. New designs for surface  
mount inductors are available from Coiltronics, Coilcraft,  
Toko and Sumida.  
density than other types. Tantalum capacitors have the  
highest capacitance density but it is important to only  
use types that have been surge tested for use in switching  
power supplies. Aluminum electrolytic capacitors have  
significantly higher ESR but can be used in cost-sensitive  
applications provided that consideration is given to ripple  
currentratingsandlongtermreliability.Ceramiccapacitors  
have excellent low ESR characteristics but can have a high  
voltage coefficient and audible piezoelectric effects. The  
high Q of ceramic capacitors with trace inductance can  
also lead to significant ringing.  
C and C  
Selection  
IN  
OUT  
The input capacitance, C , is needed to filter the trapezoi-  
IN  
dal current at the source of the top MOSFET. To prevent  
large ripple voltage, a low ESR input capacitor sized for  
the maximum RMS current should be used. RMS current  
is given by:  
Using Ceramic Input and Output Capacitors  
VOUT  
V
VOUT  
Higher values, lower cost ceramic capacitors are now  
becoming available in smaller case sizes. Their high ripple  
current, high voltage rating and low ESR make them ideal  
for switching regulator applications. However, care must  
be taken when these capacitors are used at the input and  
output. When a ceramic capacitor is used at the input and  
thepowerissuppliedbyawalladapterthroughlongwires,  
a load step at the output can induce ringing at the input,  
IN  
IRMS =IOUT(MAX)  
–1  
V
IN  
This formula has a maximum at V = 2V , where  
IN  
OUT  
I
= I /2. This simple worst-case condition is com-  
RMS  
OUT  
monlyusedfordesignbecauseevensignificantdeviations  
do not offer much relief. Note that ripple current ratings  
from capacitor manufacturers are often based on only  
2000 hours of life which makes it advisable to further  
derate the capacitor, or choose a capacitor rated at a  
higher temperature than required. Several capacitors may  
also be paralleled to meet size or height requirements in  
the design.  
V . At best, this ringing can couple to the output and be  
IN  
mistaken as loop instability. At worst, a sudden inrush  
of current through the long wires can potentially cause a  
voltage spike at V large enough to damage the part.  
IN  
Output Voltage Programming  
The selection of C  
is determined by the effective series  
OUT  
The output voltage is set by an external resistive divider  
according to the following equation:  
resistance(ESR)thatisrequiredtominimizevoltageripple  
and load step transients, as well as the amount of bulk  
capacitance that is necessary to ensure that the control  
loop is stable. Loop stability can be checked by viewing  
the load transient response as described in a later section.  
R2  
R1  
VOUT = 0.6V • 1+  
The output ripple, ΔV , is determined by:  
OUT  
The resistive divider allows the V pin to sense a fraction  
FB  
of the output voltage as shown in Figure 1.  
1
ΔVOUT ≤ ΔIL • ESR+  
8fCOUT  
V
OUT  
R2  
The output ripple is highest at maximum input voltage  
V
since ΔI increases with input voltage. Multiple capacitors  
FB  
L
LTC3602  
R1  
placed in parallel may be needed to meet the ESR and  
RMScurrenthandlingrequirements.Drytantalum,special  
polymer,aluminumelectrolyticandceramiccapacitorsare  
all available in surface mount packages. Special polymer  
capacitors offer very low ESR but have lower capacitance  
SGND  
3602 F01  
Figure 1. Setting the Output Voltage  
3602fb  
10  
LTC3602  
APPLICATIONS INFORMATION  
Burst Clamp Programming  
Pulse-skipping,whichisacompromisebetweenlowoutput  
voltage ripple and efficiency, can be implemented by con-  
If the voltage on the SYNC/MODE pin is less than INTV  
CC  
necting the SYNC/MODE pin to ground. This sets I  
to  
BURST  
by 1V or more, Burst Mode operation is enabled. During  
Burst Mode operation, the voltage on the SYNC/MODE  
pin determines the burst clamp level. This level sets the  
0A. Inthiscondition, thepeakinductorcurrentislimitedby  
the minimum on-time of the current comparator and the  
lowest output voltage ripple is achieved while still opera-  
ting discontinuously. During very light output loads,  
pulse-skipping allows only a few switching cycles to be  
skipped while maintaining the output voltage in regulation.  
minimumpeakinductorcurrent,I  
,foreachswitching  
BURST  
cycle according to the following equation:  
IBURST  
VBURST  
=
+ 0.42V  
6A / V  
is the voltage on the SYNC/MODE pin. I  
Frequency Synchronization  
V
can  
BURST  
BURST  
The LTC3602’s internal oscillator can be synchronized  
to an external clock signal. During synchronization, the  
top MOSFET turn-on is locked to the falling edge of the  
externalfrequencysource.Thesynchronizationfrequency  
range is 300kHz to 3MHz. Synchronization only occurs if  
the external frequency is greater than the frequency set by  
be programmed in the range of 0A to 3.5A, which cor-  
responds to a V range of 0.42V to 1V. As the output  
BURST  
load current drops, the peak inductor current decreases  
to keep the output voltage in regulation. When the output  
load current demands a peak inductor current that is less  
than I  
, the burst clamp will force the peak inductor  
BURST  
the R resistor. Because slope compensation is generated  
T
current to remain equal to I  
regardless of further  
BURST  
by the oscillator’s internal ramp, the external frequency  
should be set 25ꢀ higher than the frequency set by the  
reductions in the load current. Since the average inductor  
current is therefore greater than the output load current,  
R resistor to ensure that adequate slope compensation  
T
the voltage on the I pin will decrease. When the I  
TH  
TH  
is present. When synchronized, the LTC3602 will operate  
in pulse-skipping mode.  
voltage drops to 330mV, sleep mode is enabled in which  
both power MOSFETs are shut off along with most of the  
circuitry to minimize power consumption. All circuitry is  
turned back on and the power MOSFETs begin switching  
againwhentheoutputvoltagedropsoutofregulation. The  
INTV Regulator  
CC  
TheLTC3602featuresanintegratedP-channellowdropout  
value for I  
is determined by the desired amount of  
linear regulator (LDO) that supplies power to the INTV  
BURST  
CC  
output voltage ripple. As the value of I  
increases, the  
supply pin from the PV pin. This LDO supply has been  
BURST  
IN  
sleep time between pulses and the output voltage ripple  
designed to deliver up to 35mA of load current for the  
powering of the internal gate drivers and other internal  
circuitry.Asmallexternalloadmayalsobeappliedprovided  
increases. The burst clamp voltage, V  
, can be set  
BURST  
by a resistor divider from the INTV pin. Alternatively,  
CC  
the SYNC/MODE pin may be tied directly to the V pin to  
that the total current from the INTV supply does not  
FB  
CC  
set V  
= 0.6V (I  
= 1A), or through an additional  
exceed 35mA. The INTV pin should be bypassed with  
BURST  
BURST  
CC  
divider resistor (R3) to set V  
Figure 2).  
= 0.46V to 0.6V (see  
no less than a 0.22μF ceramic capacitor. A 1μF ceramic  
capacitor is suitable for most applications.  
BURST  
R2  
V
OUT  
INTV  
FB  
CC  
LTC3602  
R2  
R1  
LTC3602  
R3 (OPTIONAL)  
SYNC/MODE  
SGND  
SYNC/MODE  
R1  
SGND  
3602 F02  
V
= 0.46V TO 1V  
V
= 0.46V TO 0.6V  
BURST  
BURST  
Figure 2. Programing the Burst Clamp  
3602fb  
11  
LTC3602  
APPLICATIONS INFORMATION  
Topside MOSFET Driver Supply (BOOST Pin)  
voltage of the converter. To use the default, internal 1ms  
soft-start ramp, leave the TRACK/SS pin floating. Do not  
The LTC3602 uses a bootstrapped supply to power the  
gate of the internal topside MOSFET (Figure 3). When the  
topside MOSFET is off and the SW pin is low, diode D  
tietheTRACK/SSpintoINTV ortoPV . Toincreasethe  
CC  
IN  
soft-start time above 1ms, place a cap on the TRACK/SS  
pin. A 1.2μA internal pull-up current will charge this cap,  
resulting in a soft-start ramp time given by:  
BST  
charges capacitor C  
to the voltage on the INTV sup-  
BST  
CC  
ply. In order to turn on the topside MOSFET, the voltage on  
the BOOST pin is then applied to its gate. As the topside  
0.6  
tSS =CSS •  
1.2µA  
MOSFET turns on, the SW pin rises to the PV voltage  
IN  
and the BOOST pin rises to PV + INTV , thereby keep-  
IN  
CC  
ing the MOSFET fully enhanced. For most applications, a  
0.22μFceramiccapacitorisappropriateforC . Schottky  
When the LTC3602 detects a fault condition (either  
undervoltage lockout or overtemperature), the TRACK/SS  
pin is quickly pulled to ground and the internal soft-start  
timer is also reset. This ensures an orderly restart when  
using an external soft-start capacitor.  
BST  
diode D should have a reverse breakdown voltage that  
BST  
is greater than PV  
.
IN(MAX)  
INTV  
CC  
Toimplementtracking,aresistordividerisplacedbetween  
D
C
LTC3602  
an external supply (V ) and the TRACK/SS pin as shown  
BST  
X
C
in Figure 5a. This technique can be used to cause V  
ratiometrically track the V supply (Figure 5b), according  
to  
INTVCC  
BOOST  
OUT  
X
BST  
to the following:  
SW  
3602 F03  
VOUT  
VX  
RTA RA +RB  
=
Figure 3. Topside MOSFET Supply  
RA RTA +RTB  
Run and Soft-Start/Tracking Functions  
For coincident tracking, as shown in Figure 5c, (V  
X
=
OUT  
V during start-up),  
The LTC3602 has a low power shutdown mode which is  
controlled by the RUN pin. Pulling the RUN pin below 0.7V  
puts the LTC3602 into a low quiescent current shutdown  
R
TA  
= R , R = R  
A TB B  
Note that the 1.2μA current that is sourced from the  
TRACK/SS pin will cause a slight offset in the voltage seen  
mode (I < 1μA). When the RUN pin is greater than 0.7V,  
Q
thecontrollerisenabled.TheRUNpincanbedrivendirectly  
on the TRACK/SS pin and consequently on the V  
volt-  
OUT  
from logic as shown in Figure 4.  
ageduringtracking. ThisV  
current is given by:  
offsetduetotheTRACK/SS  
OUT  
Soft-start and tracking are implemented by limiting the  
effective reference voltage as seen by the error amplifier.  
Ramping up the effective reference into the error amp in  
turn causes a smooth and controlled ramp on the output  
RTARTA RA +RB  
VOS,TRK =(1.2µA)•  
RTA +RTB  
RA  
For most applications, this offset is small and has minimal  
effect on tracking performance. For improved tracking ac-  
3.3V OR 5V  
PV  
IN  
LTC3602  
RUN  
LTC3602  
RUN  
4.7MΩ  
curacy, reduce the parallel impedance of R and R .  
TA  
TB  
3602 F04  
Figure 4. RUN Pin Interfacing  
3602fb  
12  
LTC3602  
APPLICATIONS INFORMATION  
V
OUT  
TheV operatingcurrentlossdominatestheefficiencyloss  
IN  
2
at very low load currents whereas the I R loss dominates  
R
B
V
X
the efficiency loss at medium to high load currents.  
V
FB  
R
TB  
TA  
LTC3602  
TRACK/SS  
R
A
1.TheV operatingcurrentcomprisesthreecomponents:  
IN  
The DC Supply Current as given in the electrical char-  
acteristics, the internal MOSFET gate charge currents  
and the internal topside MOSFET transition losses. The  
MOSFET gate charge current results from switching the  
gatecapacitanceoftheinternalpowerMOSFETswitches.  
R
3602 F05a  
Figure 5a. Using the TRACK/SS Pin to Track VX  
The gates of these switches are driven from the INTV  
CC  
V
X
supply. Each time the gate is switched from high to  
low to high again, a packet of charge dQ moves from  
INTV to ground. The resulting dQ/dt is the current  
CC  
V
OUT  
out of INTV that is typically larger than the DC bias  
CC  
current. In continuous mode, the gate charge current  
can be approximated by I  
= f(9.5nC). Since the  
IN  
GATECHG  
INTV voltage is generated from V by a linear regula-  
CC  
TIME  
tor, the current that is internally drawn from the INTV  
CC  
(5b) Ratiometric Tracking  
supply can be treated as V current for the purposes  
IN  
of efficiency considerations.  
V
V
X
Transition losses apply only to the internal topside  
MOSFET and become more prominent at higher input  
voltages. Transition losses can be estimated from:  
OUT  
2
Transition Loss = (1.7) V • I  
• (120pF) • f  
O(MAX)  
IN  
2
2. I R losses are calculated from the resistances of the  
internal switches, R and external inductor R . In  
SW  
L
3602 F05b,c  
continuous mode, the average output current flowing  
through inductor L is “chopped” between the main  
switch and the synchronous switch. Thus, the series  
resistance looking into the SW pin is a function of both  
TIME  
(5c) Coincident Tracking  
Efficiency Considerations  
top and bottom MOSFET R  
(DC) as follows:  
and the duty cycle  
DS(ON)  
Theefficiencyofaswitchingregulatorisequaltotheoutput  
power divided by the input power times 100ꢀ. It is often  
useful to analyze individual losses to determine what is  
limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
R
= (R )(DC) + (R )(1 – DC)  
DS(ON)TOP DS(ON)BOT  
SW  
The R  
for both the top and bottom MOSFETs can  
DS(ON)  
beobtainedfromtheTypicalPerformanceCharacteristics  
2
curves. Thus, to obtain I R losses, simply add R to  
SW  
Efficiency = 100ꢀ – (L1 + L2 + L3 + ...)  
R and multiply the result by the square of the average  
L
output current:  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
2
2
I R Loss = I (R + R )  
O
SW  
L
Although all dissipative elements in the circuit produce  
Other losses, including C and C  
ESR dissipative  
IN  
OUT  
losses, two main sources usually account for most of the  
losses and inductor core losses, generally account for  
2
losses: V operating current and I R losses.  
less than 2ꢀ of the total power loss.  
IN  
3602fb  
13  
LTC3602  
APPLICATIONS INFORMATION  
Thermal Considerations  
Checking Transient Response  
Inmostapplications,theLTC3602doesnotdissipatemuch  
heatduetoitshighefficiency.But,inapplicationswherethe  
LTC3602 is running at high ambient temperature with low  
supply voltage and high duty cycles, such as in dropout,  
the heat dissipated may exceed the maximum junction  
temperatureofthepart.Ifthejunctiontemperaturereaches  
approximately 150°C, both power switches will be turned  
off and the SW node will become high impedance.  
The regulator loop response can be checked by looking  
at the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, V  
immediately shifts by an amount  
OUT  
equal to ΔI  
•(ESR), where ESR is the effective series  
LOAD  
resistance of C . ΔI  
also begins to charge or dis-  
OUT  
LOAD  
chargeC ,generatingafeedbackerrorsignalusedbythe  
OUT  
regulator to return V  
to its steady-state value. During  
can be monitored for overshoot  
OUT  
this recovery time, V  
OUT  
To prevent the LTC3602 from exceeding the maximum  
junctiontemperature,theuserwillneedtodosomethermal  
analysis. The goal of the thermal analysis is to determine  
whether the power dissipated exceeds the maximum  
junction temperature of the part. The temperature rise is  
given by:  
or ringing that would indicate a stability problem. The I  
TH  
pinexternalcomponentsandoutputcapacitorshowninthe  
frontpageapplicationwillprovideadequatecompensation  
for most applications.  
Design Example  
T = (P ) • (θ )  
R
D
JA  
As a design example, consider using the LTC3602 in  
where P is the power dissipated by the regulator and θ  
an application with the following specifications: V  
=
D
JA  
IN  
is the thermal resistance from the junction of the die to  
8.4V, V  
= 3.3V, I  
= 2.5A, I  
= 100mA,  
OUT  
OUT(MAX)  
OUT(MIN)  
the ambient temperature.  
f= 1MHz. Because efficiency is important at both high and  
low load current, Burst Mode operation will be utilized.  
First, calculate the timing resistor:  
The junction temperature, T , is given by:  
J
T = T + T  
R
J
A
1.151011  
where T is the ambient temperature.  
ROSC  
=
10k =105k  
A
1MHz  
As an example, consider the LTC3602 in dropout at an  
input voltage of 8V, a load current of 2.5A and an ambi-  
ent temperature of 70°C. From the Typical Performance  
Next, calculate the inductor value for about 40ꢀ ripple  
current at maximum V :  
IN  
graph of Switch Resistance, the R  
of the top switch  
DS(ON)  
at 70°C is approximately 120mΩ. Therefore, power dis-  
sipated by the part is:  
3.3V  
3.3V  
8.4V  
L=  
• 1–  
=2µH  
1MHz 1A  
(
)( )  
2
2
P = (I  
)(R  
) = (2.5A) (120mΩ) = 0.75W  
DS(ON)  
D
LOAD  
Using a 2.2μH inductor results in a maximum ripple cur-  
rent of:  
For the TSSOP package, the θ is 38°C/W. Thus the junc-  
JA  
tion temperature of the regulator is:  
3.3V  
3.3V  
8.4V  
T = 70°C + (0.75W)(38°C/W) = 98.5°C  
J
ΔIL =  
• 1–  
= 0.91A  
1MHz 2.2µH  
(
)(  
)
which is below the maximum junction temperature of  
125°C.  
C
will be selected based on the ESR that is required  
OUT  
to satisfy the output voltage ripple requirement and the  
bulk capacitance needed for loop stability. In this applica-  
tion, a tantalum capacitor will be used to provide the bulk  
3602fb  
14  
LTC3602  
APPLICATIONS INFORMATION  
capacitance and a ceramic capacitor in parallel to lower  
PC Board Layout Checklist  
the total effective ESR. For this design, a 100μF ceramic  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3602. Check the following in your layout:  
capacitor will be used. C should be sized for a maximum  
IN  
current rating of:  
3.3V  
8.4V  
8.4V  
3.3V  
1. A ground plane is recommended. If a ground plane layer  
is not used, the signal and power grounds should be  
segregated with all small signal components returning  
to the SGND pin at one point which is then connected  
to the PGND pin close to the LTC3602.  
IRMS = 2.5A •  
–1=1.22ARMS  
Decoupling the PV pin with a 22μF ceramic capacitor is  
IN  
adequate for most applications.  
The output voltage can now be programmed by choosing  
the values of R1 and R2. Chose R1 = 105k and calculate  
R2 as:  
2.Connectthe(+)terminaloftheinputcapacitor(s),C ,as  
IN  
closeaspossibletothePV pin.Thiscapacitorprovides  
IN  
the AC current into the internal power MOSFETs.  
VOUT  
R2=R1  
–1 = 472.5k  
3. Keep the switching node, SW, away from all sensitive  
small signal nodes.  
0.6V  
4.Floodallunusedareasonalllayerswithcopper.Flooding  
with copper will reduce the temperature rise of power  
components. You can connect the copper areas to any  
DC net (PV , INTV , V , PGND, SGND, or any other  
Choose a standard value of R2 = 475k. The voltage on  
the MODE pin will be set to 0.6V by tying the MODE pin  
to the FB pin. This will set the burst current equal to ap-  
proximately 1A. Figure 6 shows a complete schematic for  
this design example.  
IN  
CC OUT  
DC rail in your system).  
V
IN  
8.4V  
C
VCC  
C
IN  
1μF  
22μF  
R
PG  
SYNC/MODE  
PGOOD  
INTV  
CC  
200k  
PGOOD  
PV  
IN  
R
OSC  
D1  
C
105k  
R
I
BOOST  
T
C
ITH  
R
4.32k  
BST  
ITH  
1nF  
0.22μF  
LTC3602  
SW  
SW  
TH  
V
L1  
2.2μH  
FB  
V
3.3V  
2.5A  
R1  
105k  
OUT  
RUN  
SW  
TRACK/SS  
PGND  
PGND  
PGND  
R2  
475k  
C
FB  
22pF  
C
OUT  
100μF  
3602 F06  
L1: VISHAY IHLP2525CZER2R2MO1  
C
C
: TAIYO YUDEN TMK325BJ226MM-T  
OUT:  
IN  
TDK C3225X5ROJ107M  
Figure 6. 8.4V to 3.3V, 2.5A Regulator at 1MHz, Burst Mode Operation  
3602fb  
15  
LTC3602  
TYPICAL APPLICATIONS  
1.8V, 2.5A Regulator at 1MHz, Burst Mode Operation  
V
IN  
5V to 10V  
C
VCC  
C
IN  
R3  
845k  
R
PG  
200k  
1μF  
22μF  
SYNC/MODE  
PGOOD  
INTV  
CC  
PGOOD  
R4  
137k  
PV  
IN  
R
OSC  
D1  
105k  
R
I
BOOST  
T
C
ITH  
C
R
BST  
ITH  
1nF  
0.22μF  
4.32k  
LTC3602  
SW  
SW  
TH  
V
L1  
1μH  
FB  
V
1.8V  
2.5A  
R1  
105k  
OUT  
RUN  
SW  
TRACK/SS  
PGND  
PGND  
PGND  
C
R2  
210k  
FB  
C
OUT  
22pF  
100μF  
s 2  
L1: VISHAY IHLP2525CZER1R0MO1  
3602 TA02  
C
C
: TAIYO YUDEN TMK325BJ226MM-T  
IN  
OUT:  
TAIYO YUDEN AMK316BJ107ML  
Efficinecy vs Load Current  
100  
95  
90  
85  
80  
75  
V
V
= 5V  
IN  
= 8.4V  
IN  
V
= 10V  
IN  
70  
0.01  
0.1  
1
10  
LOAD CURRENT (A)  
3602 TA02b  
3602fb  
16  
LTC3602  
TYPICAL APPLICATIONS  
3.3V, 2.5A Regulator at 2MHz, Forced Continuous, Small Size  
V
IN  
10V  
C
VCC  
C
IN  
1μF  
22μF  
R
PG  
SYNC/MODE  
PGOOD  
INTV  
CC  
200k  
PGOOD  
PV  
IN  
R
OSC  
D1  
C
47.5k  
R
I
BOOST  
T
C
ITH  
R
2.94k  
BST  
ITH  
470pF  
0.22μF  
LTC3602  
SW  
SW  
TH  
V
L1  
1μH  
FB  
V
3.3V  
2.5A  
R1  
105k  
OUT  
RUN  
SW  
TRACK/SS  
PGND  
PGND  
PGND  
C
FB  
R2  
475k  
10pF  
C
OUT  
47μF  
L1: VISHAY IHLP1616ABER1R0M01  
3602 TA04  
C
C
: TAIYO YUDEN EMK316BJ226ML-T  
IN  
OUT:  
MURATA GRM3ICR60J476ME19  
2.5V, 2.5A Regulator, Synchronized to 1.8MHz  
1.8MHz  
V
IN  
EXT. CLK  
8.4V  
C
VCC  
C
IN  
1μF  
22μF  
R
200k  
PG  
SYNC/MODE  
PGOOD  
INTV  
CC  
PGOOD  
PV  
IN  
R
OSC  
D1  
C
69.8k  
R
I
BOOST  
T
C
ITH  
R
2.94k  
BST  
ITH  
470pF  
0.22μF  
LTC3602  
SW  
SW  
TH  
V
L1  
1μH  
FB  
R1  
105k  
V
2.5V  
2.5A  
OUT  
RUN  
SW  
TRACK/SS  
PGND  
PGND  
PGND  
C
FB  
R2  
332k  
22pF  
C
OUT  
100μF  
L1: VISHAY IHLP2525CZER1R0M01  
3602 TA05  
C
C
: TAIYO YUDEN TMK325BJ226MM-T  
IN  
OUT:  
TDK C3225X5ROJ107M  
3602fb  
17  
LTC3602  
PACKAGE DESCRIPTION  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663)  
Exposed Pad Variation BA  
4.90 – 5.10*  
(.193 – .201)  
2.74  
(.108)  
2.74  
(.108)  
16 1514 13 12 1110  
9
6.60 p 0.10  
2.74  
(.108)  
4.50 p 0.10  
6.40  
(.252)  
BSC  
SEE NOTE 4  
2.74  
(.108)  
0.45 p 0.05  
1.05 p0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT  
1.10  
(.0433)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0.25  
REF  
0o – 8o  
0.65  
(.0256)  
BSC  
0.09 – 0.20  
(.0035 – .0079)  
0.50 – 0.75  
(.020 – .030)  
0.05 – 0.15  
(.002 – .006)  
0.195 – 0.30  
FE16 (BA) TSSOP 0204  
(.0077 – .0118)  
TYP  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
3602fb  
18  
LTC3602  
PACKAGE DESCRIPTION  
UF Package  
20-Lead Plastic QFN (4mm × 4mm)  
(Reference LTC DWG # 05-08-1710 Rev A)  
0.70 p 0.05  
4.50 p 0.05  
3.10 p 0.05  
2.45 p 0.05  
2.00 REF  
2.45 p 0.05  
PACKAGE OUTLINE  
0.25 p 0.05  
0.50 BSC  
PIN 1 NOTCH  
R = 0.20 TYP  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
BOTTOM VIEW—EXPOSED PAD  
OR 0.35 s 45o  
CHAMFER  
R = 0.05  
TYP  
R = 0.115  
TYP  
0.75 p 0.05  
4.00 p 0.10  
19 20  
0.40 p 0.10  
PIN 1  
TOP MARK  
(NOTE 6)  
1
2
2.45 p 0.10  
2.00 REF  
4.00 p 0.10  
2.45 p 0.10  
(UF20) QFN 01-07 REV A  
0.200 REF  
0.25 p 0.05  
0.50 BSC  
0.00 – 0.05  
NOTE:  
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220  
VARIATION (WGGD-1)—TO BE APPROVED  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
3602fb  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
19  
LTC3602  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
96ꢀ Efficiency, V : 2.7V to 10V, V  
LTC1877  
600mA (I ), 550kHz, Synchronous Step-Down DC/DC Converter  
= 0.8V,  
= 0.8V,  
OUT  
IN  
OUT(MIN)  
I = 10μA, I <1μA, MS8 Package  
Q
SD  
LTC1879  
LTC3404  
1.2A (I ), 550kHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.7V to 10V, V  
IN  
OUT  
OUT(MIN)  
I = 15μA, I <1μA, TTSOP-16 Package  
Q
SD  
600mA (I ), 1.4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.7V to 6V, V  
SD  
= 0.8V, I = 10μA,  
OUT(MIN) Q  
OUT  
IN  
I
<1μA, MS8 Package  
LTC3405/LTC3405A 300mA (I ), 1.5MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V  
OUT(MIN)  
= 0.8V,  
= 0.6V,  
= 0.6V,  
OUT  
IN  
I = 20μA, I <1μA, ThinSOTTM Package  
Q
SD  
LTC3406/LTC3406B 600mA (I ), 1.5MHz, Synchronous Step-Down DC/DC Converter  
96ꢀ Efficiency, V : 2.5V to 5.5V, V  
IN OUT(MIN)  
OUT  
I = 20μA, I <1μA, ThinSOT Package  
Q
SD  
LTC3407/LTC3407-2 Dual 600mA/810mA (I ), 1.5MHz, Synchronous Step-Down DC/DC 95ꢀ Efficiency, V : 2.5V to 5.5V, V  
OUT(MIN)  
OUT  
IN  
Converter  
I = 40μA, I <1μA, MS10E and 3mm × 3mm DFN Packages  
Q SD  
LTC3409  
LTC3411  
LTC3412  
LTC3413  
LTC3414  
LTC3416  
LTC3418  
LTC3430  
LTC3441  
LTC3533  
LTC3548  
LTC3610  
600mA, 2.6MHz, Low (V Synchronous Step-Down DC/DC  
95ꢀ Efficiency, V : 1.6V to 5.5V, I = 65μA,  
IN Q  
IN)  
Converter  
I
<1μA, 3mm × 3mm DFN Package  
SD  
1.25A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V  
= 0.8V,  
OUT  
IN  
OUT(MIN)  
I = 60μA, I <1μA, MS10 and 3mm × 3mm DFN Packages  
Q
SD  
2.5A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V  
= 0.8V,  
OUT  
IN  
OUT(MIN)  
I = 60μA, I <1μA, TSSOP-16E Package  
Q
SD  
3A (I  
Sink/Source), 2MHz, Monolithic Synchronous Regulator for 90ꢀ Efficiency, V : 2.25V to 5.5V, V  
= V  
,
REF/2  
OUT  
IN  
OUT(MIN)  
DDR/QDR Memory Termination  
I = 280μA, I <1μA, TSSOP-16E Package  
Q SD  
4A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V = 0.8V,  
OUT(MIN)  
OUT  
IN  
I = 64μA, I <1μA, TSSOP-20E Package  
Q
SD  
4A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.25V to 5.5V, V  
OUT(MIN)  
= 0.8V,  
= 0.8V,  
OUT  
IN  
I = 64μA, I <1μA, TSSOP-20E Package  
Q
SD  
8A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 2.25V to 5.5V, V  
IN OUT(MIN)  
OUT  
I = 380μA, I <1μA, QFN Package  
Q
SD  
60V, 2.75A (I ), 200kHz, High Efficiency Step-Down DC/DC  
90ꢀ Efficiency, V : 5.5V to 60V, V  
= 1.2V,  
OUT  
IN  
OUT(MIN)  
Converter  
I = 2.5mA, I = 25μA, TSSOP-16E Package  
Q SD  
1.2A (I ), 1MHz, Synchronous Buck-Boost DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V : 2.5V to 5.5V,  
IN OUT  
OUT  
I = 25μA, I <1μA, DFN Package  
Q
SD  
2A, 2MHz, Wide Input Voltage Synchronous Buck-Boost DC/DC  
Converter  
96ꢀ Efficiency, V : 1.8V to 5.5V, I = 40μA, I <1μA,  
IN  
Q
SD  
3mm × 4mm DFN Package  
400mA/800mA Dual Synchronous Buck-Boost DC/DC Converter  
95ꢀ Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
IN  
OUT(MIN)  
I = 40μA, I <1μA, MS8E and DFN Packages  
Q
SD  
12A, 24V, Synchronous Step-Down DC/DC Converter  
95ꢀ Efficiency, V : 4V to 24V, V  
= 0.6V, Fast  
IN  
OUT(MIN)  
SD  
Transient Response, I = 900μA, I <15μA, 9mm × 9mm  
Q
QFN Package  
LTC3611  
10A, 36V, Synchronous Step-Down DC/DC Converter  
V : 4V to 32V, Fast Transient Response, I = 900μA,  
SD  
IN  
Q
I
<15μA, 9mm × 9mm QFN Package  
ThinSOT is a trademark of Linear Technology Corporation.  
3602fb  
LT 0408 REV B • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
© LINEAR TECHNOLOGY CORPORATION 2008  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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