LTC3448 [Linear]

1.5MHz/2.25MHz, 600mA Synchronous Step-Down Regulator with LDO Mode; 为1.5MHz / 2.25MHz的, 600mA同步降压型稳压器, LDO模式
LTC3448
型号: LTC3448
厂家: Linear    Linear
描述:

1.5MHz/2.25MHz, 600mA Synchronous Step-Down Regulator with LDO Mode
为1.5MHz / 2.25MHz的, 600mA同步降压型稳压器, LDO模式

稳压器
文件: 总20页 (文件大小:274K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3448  
1.5MHz/2.25MHz, 600mA  
Synchronous Step-Down  
Regulator with LDO Mode  
U
FEATURES  
DESCRIPTIO  
TheLTC®3448isahighefficiency,monolithic,synchronous  
buck regulator using a constant frequency, current mode  
architecture. Supplycurrentduringoperationisonly32µA  
(linearregulatormode)anddropsto<1µAinshutdown.The  
2.5V to 5.5V input voltage range makes the LTC3448 ide-  
ally suited for single Li-Ion battery-powered applications.  
100% duty cycle provides low dropout operation, extend-  
ingbatterylifeinportablesystems.Atmoderateoutputload  
levels, PWMpulseskippingmodeoperationprovidesvery  
low output ripple voltage for noise sensitive applications.  
High Efficiency: Up to 96%  
Very Low Quiescent Supply Current: 32µA During  
Linear Regulator Operation  
600mA Output Current (Buck Converter)  
Optionally Operates as Linear Regulator Below  
3mA—External or Automatic ON/OFF  
2.5V to 5.5V Input Voltage Range  
1.5MHz or 2.25MHz Constant Frequency Operation  
or External Synchronization  
No Schottky Diode Required  
Low Dropout Operation: 100% Duty Cycle  
0.6V Reference Allows Low Output Voltages  
Shutdown Mode Draws <1µA Supply Current  
Current Mode Operation for Excellent Line and  
Load Transient Response  
The LTC3448 automatically switches into linear regulator  
operation at very low load currents to maintain <5mVP-P  
output voltage ripple. Supply current in this mode is  
typically 32µA. The switch to linear regulator mode occurs  
atathresholdof3mA.Linearregulatoroperationcanbeset  
to on, off or automatic turn on/off.  
Overtemperature Protected  
Low Profile (3mm × 3mm) 8-Lead DFN and 8-Lead  
MSOP PackagesU  
Switching frequency is selectable at either 1.5MHz or  
2.25MHz, allowing the use of small surface mount induc-  
tors and capacitors.  
APPLICATIO S  
Cellular Telephones  
The internal synchronous switch increases efficiency and  
eliminates the need for an external Schottky diode. Low  
output voltages are easily supported with the 0.6V feed-  
back reference voltage. The LTC3448 is available in a low  
profile 3mm × 3mm DFN package or thermally enhanced  
8-lead MSOP.  
Personal Information Appliances  
Wireless and DSL Modems  
Digital Still Cameras  
MP3 Players  
Portable Instruments  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
All other trademarks are the property of their respective owners.  
Protected by U.S. Patents including 5481178, 6580258, 6304066, 6127815,  
6498466, 6611131. Others pending.  
U
Efficiency and Power Loss vs Load Current  
TYPICAL APPLICATIO  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
V
V
A
= 3.6V  
IN  
OUT  
= 1.5V  
1.5V High Efficiency Regulator with Automatic LDO Mode  
T
= 25°C  
0.1  
2.2µH  
EFFICIENCY  
V
V
OUT  
1.5V  
IN  
2.5V TO 5.5V  
V
SW  
OUT  
LTC3448  
MODE  
IN  
RUN  
POWER LOSS  
C
0.01  
0.001  
0.0001  
V
OUT  
4.7µF  
C
IN  
4.7µF  
474k  
316k  
22pF  
FREQ  
SYNC  
V
FB  
GND  
0.0001  
0.001  
0.01  
0.1  
1
3448 TA01a  
23448 TA01b  
LOAD CURRENT (A)  
3448f  
1
LTC3448  
W W  
U W  
ABSOLUTE AXI U RATI GS (Note 1)  
VOUT (LDO) Source Current .................................. 25mA  
Peak SW Sink and Source Current ........................ 1.3A  
Operating Temperature Range (Note 2) .. 40°C to 85°C  
Junction Temperature (Notes 3, 7) ...................... 125°C  
Storage Temperature Range ................ 65°C to 125°C  
Lead Temperature (Soldering, 10 sec)  
Input Supply Voltage .................................. 0.3V to 6V  
RUN, SYNC Voltages ................... 0.3V to (VIN + 0.3V)  
MODE Voltage ............................. 0.3V to (VIN + 0.3V)  
FREQ, VFB Voltages...................... 0.3V to (VIN + 0.3V)  
SW Voltage .................................. 0.3V to (VIN + 0.3V)  
V
OUT Voltage................................ 0.3V to (VIN + 0.3V)  
MSOP Only ...................................................... 300°C  
P-Channel Switch Source Current (DC) ............. 800mA  
N-Channel Switch Sink Current (DC) ................. 800mA  
U W  
U
PACKAGE/ORDER I FOR ATIO  
ORDER PART  
NUMBER  
ORDER PART  
TOP VIEW  
NUMBER  
TOP VIEW  
V
1
2
3
4
8
7
6
5
RUN  
SYNC  
FREQ  
SW  
FB  
V
1
2
3
4
8 RUN  
7 SYNC  
6 FREQ  
5 SW  
FB  
LTC3448EMS8E  
LTC3448EDD  
V
OUT  
V
OUT  
MODE  
V
9
9
MODE  
IN  
V
IN  
MS8E PACKAGE  
8-LEAD PLASTIC MSOP  
DD PART MARKING  
LBMJ  
MS8 PART MARKING  
LTBMK  
DD PACKAGE  
TJMAX = 125°C, θJA = 40°C/ W  
EXPOSED PAD (PIN 9) IS GND  
MUST BE SOLDERED TO PCB  
8-LEAD (3mm × 3mm) PLASTIC DFN  
TJMAX = 125°C, θJA = 43°C/ W  
EXPOSED PAD (PIN 9) IS GND  
MUST BE SOLDERED TO PCB  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are TA = 25°C. VIN = 3.6V unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
Feedback Current  
±30  
nA  
VFB  
V
Regulated Feedback Voltage  
(Note 4)  
T = 25°C  
0.5880  
0.5865  
0.5850  
0.6  
0.6  
0.6  
0.6120  
0.6135  
0.6150  
V
V
V
FB  
A
0°C T 85°C  
A
–40°C T 85°C  
A
V  
V  
Reference Voltage Line Regulation  
Output Overvoltage Lockout  
V
= 2.5V to 5.5V (Note 4)  
IN  
0.2  
0.4  
%/V  
FB  
V  
V  
= V  
= (V  
– V  
FB  
15  
2.5  
35  
5.8  
55  
9.2  
mV  
%
OVL  
OVL  
OVL  
OVL  
– V ) • 100/V  
OVL  
OUT  
OUT  
V  
Output Voltage Line Regulation  
Peak Inductor Current  
V
= 2.5V to 5.5V (LDO)  
0.1  
1
0.8  
1.3  
%/V  
A
OUT  
IN  
I
V
= 0.5V or V = 90%,  
OUT  
0.7  
PK  
FB  
Duty Cycle < 35%  
LDO, 1mA to 10mA  
(Note 9)  
V
V
V
Output Voltage Load Regulation  
Maximum Output Voltage  
Input Voltage Range  
0.5  
%/V  
V
LOADREG  
OUT(MAX)  
IN  
V
– 0.7 V – 0.3  
IN  
IN  
2.5  
5.5  
V
3448f  
2
LTC3448  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are TA = 25°C. VIN = 3.6V unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
Input DC Bias Current  
Active Mode (Pulse Skip, No LRO)  
V
V
V
= 3.6V (Note 5)  
S
IN  
FB  
FB  
= 0.5V or V  
= 0.5V or V  
= 90%, I  
= 90%, I  
= 0A, 1.5MHz  
= 0A, 2.25MHz  
250  
275  
375  
400  
µA  
µA  
OUT  
OUT  
LOAD  
LOAD  
Linear Regulator Operation (LRO)  
Shutdown  
I
I  
32  
43  
1
µA  
µA  
LOAD  
LDO(ON)  
V
= 0V, V = 5.5V  
0.1  
RUN  
IN  
f
f
Oscillator Frequency  
FREQ = Low, V = 3.6V  
FREQ = High  
1.2  
1.8  
1.5  
2.25  
1.8  
2.7  
MHz  
MHz  
OSC  
IN  
Synchronization Frequency  
(Note 6)  
1.5  
>4  
MHz  
V
SYNC  
V
SYNC Activation Input Threshold  
1
1.3  
TH(SYNC)  
R
R
R
R
of P-Channel FET  
of N-Channel FET  
I
I
= 100mA  
0.4  
PFET  
NFET  
LSW  
DS(ON)  
DS(ON)  
SW  
SW  
= –150mA  
0.35  
±0.01  
I
SW Leakage  
V
= 0V, V = 0V or 5V, V = 5V  
±1  
µA  
V
RUN  
SW  
IN  
V
V
RUN Threshold High  
RUN Threshold Low  
1.5  
RUNH  
RUNL  
RUN  
0.3  
V
I
RUN Leakage Current  
FREQ Threshold High  
FREQ Threshold Low  
FREQ Leakage Current  
MODE Threshold High  
MODE Threshold Low  
MODE Leakage Current  
SYNC Leakage Current  
LRO ON Load Current Threshold  
LRO OFF Load Current Threhold  
±0.01  
±0.01  
±1  
µA  
V
V
V
V – 1  
IN  
FREQH  
FREQL  
FREQ  
1
V
I
±1  
µA  
V
V
V
V – 0.15  
IN  
MODEH  
MODEL  
MODE  
0.12  
±1  
±1  
5
V
I
I
I
I
±0.1  
±0.01  
3
µA  
µA  
mA  
mA  
SYNC  
2.2mH Inductor (Note 8)  
LDO(ON)  
LDO(OFF)  
8
11  
17  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 6: 4MHz operation is guaranteed by design but is not production  
tested and is subject to duty cycle limitations.  
Note 2: The LTC3448E is guaranteed to meet performance specifications  
from 0°C to 70°C. Specifications over the –40°C to 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 7: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature is active. Continu-  
ous operation above the specified maximum operating junction tempera-  
ture may impair device reliability.  
Note 3: T is calculated from the ambient temperature T and power  
J
A
dissipation P according to the following formula:  
Note 8: The load current below which the switching regulator turns off and  
the LDO turns on is, to first order, inversely proportional to the value of  
the inductor. This effect is covered in more detail in the Operation section.  
This parameter is not production tested but is guaranteed by design.  
D
T = T + (P )(43°C/W)  
J
A
D
Note 4: The LTC3448 is tested in a proprietary test mode that connects  
to the output of the error amplifier.  
V
FB  
Note 9: For 2.5V < V < 2.7V the output voltage is limited to V – 0.7V  
IN  
IN  
Note 5: Dynamic supply current is higher due to the gate charge being  
delivered at the switching frequency. LRO is “linear regulator operation.”  
to ensure regulation in linear regulator mode. This parameter is not  
production tested but is guaranteed by design.  
3448f  
3
LTC3448  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
(From Figure1a Except for the Resistive Divider Resistor Values)  
Efficiency vs Load Current  
Efficiency vs Load Current  
Efficiency vs Input Voltage  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
A
= 1.8V  
V
A
= 1.2V  
V
= 1.5V  
OUT  
= 25°C  
OUT  
OUT  
T = 25°C  
A
I
= 100mA  
= 600mA  
OUT  
T
T
= 25°C  
I
= 30mA  
OUT  
I
OUT  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
IN  
IN  
IN  
2
3
4
5
6
0.0001  
0.001  
0.01  
0.1  
1
0.0001  
0.001  
0.01  
0.1  
1
LOAD CURRENT (A)  
LOAD CURRENT (A)  
INPUT VOLTAGE (V)  
23448 G02  
23448 G03  
3448 G01  
Efficiency vs Load Current  
(Switcher Only)  
Oscillator Frequency  
vs Temperature  
Reference Voltage  
vs Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.615  
0.610  
0.605  
0.600  
1.70  
V
= 3.6V  
V
= 3.6V  
V
V
A
= 2.7V  
= 2.5V  
= 25°C  
IN  
IN  
IN  
OUT  
1.65  
1.60  
T
1.55  
1.50  
1.45  
1.40  
1.35  
0.595  
0.590  
0.585  
1.30  
50  
TEMPERATURE (°C)  
100 125  
–25  
0
50  
75 100 125  
–50 –25  
0
25  
75  
–50  
25  
0.0001  
0.001  
0.01  
0.1  
1
LOAD CURRENT (A)  
TEMPERATURE (°C)  
23448 G04  
3448 G05  
3448 G06  
Oscillator Frequency  
vs Supply Voltage  
RDS(ON) vs Input Voltage  
Output Voltage vs Load Current  
1.525  
1.520  
1.515  
1.510  
1.505  
1.500  
1.495  
1.490  
1.485  
1.480  
1.475  
0.40  
0.38  
0.36  
0.34  
0.32  
0.30  
0.28  
0.26  
0.24  
0.22  
0.20  
1.8  
1.7  
V
A
= 3.6V  
T
= 25°C  
IN  
= 25°C  
T
= 25°C  
A
A
T
MAIN  
SWITCH  
1.6  
1.5  
SYNCHRONOUS  
SWITCH  
1.4  
1.3  
1.2  
0.0001  
0.001  
0.01  
0.1  
1
2
3
4
5
6
4
6
2
3
5
LOAD CURRENT (A)  
SUPPLY VOLTAGE (V)  
INPUT VOLTAGE (V)  
3448 G08  
3448 G07  
3448 G09  
3448f  
4
LTC3448  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
(From Figure1a Except for the Resistive Divider Resistor Values)  
Dynamic Supply Current  
vs Supply Voltage  
Dynamic Supply Current  
vs Temperature  
RDS(ON) vs Temperature  
0.6  
0.5  
0.4  
0.3  
340  
320  
300  
320  
300  
280  
260  
I
= 0A  
V
I
= 3.6V  
= 0A  
LOAD  
A
IN  
LOAD  
T
= 25°C  
2.25MHz  
280  
260  
240  
220  
200  
2.25MHz  
1.5MHz  
0.2  
0.1  
0
1.5MHz  
240  
220  
200  
MAIN SWITCH  
2.5V  
SYNCH SWITCH  
2.5V  
3.6V  
4.2V  
3.6V  
4.2V  
50  
0
TEMPERATURE (°C)  
100 125  
–50 –25  
25  
75  
3
4
6
2
5
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
SUPPLY VOLTAGE (V)  
3448 G10  
3448 G11  
3448 G12  
Start-Up from Shutdown  
Switch Leakage vs Temperature  
Switch Leakage vs Input Voltage  
10  
1
350  
300  
RUN = 0V  
V
= 5.5V  
IN  
T
= 25°C  
RUN = 0V  
A
MAIN  
SWITCH  
RUN  
5V/DIV  
250  
200  
150  
100  
50  
V
SYNCHRONOUS  
SWITCH  
OUT  
1V/DIV  
MAIN  
0.1  
0.01  
SWITCH  
I
L
500mA/DIV  
SYNCHRONOUS  
SWITCH  
3448 G15  
V
V
LOAD  
= 3.6V  
40µs/DIV  
IN  
= 1.5V  
OUT  
I
= 600mA  
0.001  
0
0
1
2
3
4
5
6
50  
100 125  
–50 –25  
0
25  
75  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
3448 G14  
3448 G13  
Load Step  
Load Step  
V
V
OUT  
OUT  
200mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
I
LOAD  
I
LOAD  
250mA/DIV  
100mA/DIV  
I
I
L
L
500mA/DIV  
500mA/DIV  
3448 G16  
3448 G17  
V
V
= 3.6V  
10µs/DIV  
V
V
= 3.6V  
IN  
10µs/DIV  
IN  
= 1.5V  
= 1.5V  
OUT  
OUT  
I
= 100µA TO 200mA  
= 10µF  
I
= 50mA TO 600mA  
LOAD  
C
LOAD  
C
= 10µF  
OUT  
OUT  
3448f  
5
LTC3448  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
(From Figure 1a Except for the Resistive Divider Resistor Values)  
External Mode Control (Constant  
1mA Load)  
Load Step  
V
OUT  
V
OUT  
LDO  
20mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
I
LOAD  
MODE PIN  
2V/DIV  
250mA/DIV  
I
L
500mA/DIV  
3448 G19  
3448 G18  
V
T
= 1.5V  
OUT  
A
200µs/DIV  
V
V
LOAD  
= 3.6V  
10µs/DIV  
IN  
= 25°C  
= 1.5V  
OUT  
I
= 100mA TO 600mA  
U
U
U
PI FU CTIO S  
VFB (Pin 1): Feedback Pin. This pin receives the feedback  
voltage from an external resistive divider across the  
output.  
VIN (Pin 4): Main Supply Pin. This pin must be closely  
decoupled to GND with a 2.2µF or greater ceramic  
capacitor.  
VOUT (Pin 2): Output Pin. This pin connects to an external  
resistor divider and the linear regulator output. Connect  
externally to the inductor and the output capacitor. The  
internal linear regulator will supply current up to the  
ILDO(OFF) current.Loadcurrentsabovethataresuppliedby  
thebuckregulator.Internalcircuitryautomaticallyenables  
the buck switching regulator at load currents higher than  
the ILDO(OFF). The minimum required capacitance on this  
pin is 2µF.  
SW (Pin 5): Switch Node Connection to Inductor. This pin  
connects to the drains of the internal main and synchro-  
nous power MOSFET switches.  
FREQ (Pin 6): Frequency Select. Switching frequency is  
set to 1.5MHz when FREQ = 0V and to 2.25MHz when  
FREQ = VIN. Do not float this pin.  
SYNC (Pin 7): External Synchronization Pin. The oscilla-  
tion frequency can be synchronized to an external oscilla-  
tor applied to this pin. For external frequencies above  
2.2MHz, pull FREQ high.  
MODE (Pin 3): Linear Regulator Control. Grounding this  
pin turns off the linear regulator. Setting this pin to VIN  
turnsonthelinearregulatorregardlessoftheloadcurrent.  
Tying this pin midrange (i.e., to VOUT) will place the linear  
regulator in auto mode, where turn on/off is a function of  
the load current. In applications where MODE is externally  
driven high or low, this pin should be held low for 50µs  
after the RUN pin is pulled high.  
RUN (Pin 8): Run Control Input. Forcing this pin above  
1.5V enables the part. Forcing this pin below 0.3V shuts  
down the device. In shutdown, all functions are disabled  
drawing <1µA supply current. Do not leave RUN floating.  
Exposed Pad (Pin 9): Ground. This pin must be soldered  
to PCB.  
3448f  
6
LTC3448  
U
U
W
FU CTIO AL DIAGRA  
SYNC  
7
MODE  
3
FREQ  
6
SLOPE  
COMP  
LDO CONTROL  
LOGIC  
V
IN  
OSC  
V
OUT  
LDO  
DRIVE  
V
4
2
IN  
+
+
5  
0.6V  
+
V
I
FB  
COMP  
EA  
1
OSC  
Q
Q
S
R
V
IN  
SWITCHING  
LOGIC  
RS LATCH  
ANTI-  
SHOOT-  
THRU  
AND  
RUN  
8
BLANKING  
CIRCUIT  
0.6V REF  
SW  
5
OVDET  
+
0.6V + OVL  
+
SHUTDOWN  
I
RCMP  
9
GND  
3448 F01  
Figure 1  
U
OPERATIO  
(Refer to Functional Diagram)  
Main Control Loop  
comparator OVDET guards against transient overshoots  
5.8%byturningoffthemainswitchandkeepingitoffuntil  
the fault is removed.  
The LTC3448 uses a constant frequency, current mode,  
step-down architecture. Both the main (P-channel MOS-  
FET)andsynchronous(N-channelMOSFET)switchesare  
internal. During normal operation, the internal top power  
MOSFET is turned on each cycle when the oscillator sets  
theRSlatch, andturnedoffwhenthecurrentcomparator,  
ICOMP, resets the RS latch. The peak inductor current at  
which ICOMP resets the RS latch, is controlled by the  
output of error amplifier EA. When the load current  
increases, it causes a slight decrease in the feedback  
voltage FBINT relative to the 0.6V reference, which in turn,  
causes the EA amplifier’s output voltage to increase until  
the average inductor current matches the new load cur-  
rent. While the top MOSFET is off, the bottom MOSFET is  
turned on until either the inductor current starts to re-  
verse, as indicated by the current reversal comparator  
IRCMP, or the beginning of the next clock cycle. The  
Pulse Skipping Mode Operation  
At light loads, the inductor current may reach zero or  
reverse on each pulse. The bottom MOSFET is turned off  
by the current reversal comparator, IRCMP, and the switch  
voltage will ring. This is discontinuous mode operation,  
and is normal behavior for the switching regulator. At very  
light loads, the LTC3448 will automatically skip pulses to  
maintain output regulation.  
Low Ripple LDO Mode Operation  
At load currents below ILDO(ON), and when enabled, the  
LTC3448 will switch into very low ripple, linear regulating  
operation(LRO). Inthismode, thecurrentissourcedfrom  
3448f  
7
LTC3448  
U
OPERATIO  
(Refer to Functional Diagram)  
theVOUT pinandboththemainandsynchronousswitches  
are turned off. The control loop is stabilized by the load  
capacitor and requires a minimum value of 2µF. The  
LTC3448 will change back to switching mode and turn off  
the LDO when the load current exceeds approximately  
11mA.  
Some applications may be able to anticipate the transition  
from high to low and low to high load currents. In these  
cases it may be desirable to switch between modes by  
controlling the MODE pin with a processor signal. In these  
applications it is important that the MODE pin is pulled  
high no earlier than 50µs after the RUN pin is pulled high.  
This will ensure proper start-up of internal reference  
circuitry.  
When MODE is connected to an intermediate voltage level  
(i.e.,VOUT),thisswitchoverisautomatic.IfMODEispulled  
high to VIN, the LDO remains on and the switcher off  
regardless of the load current. The LDO is capable of  
providing a maximum of approximately 15mA before the  
load regulation will degrade to unacceptable levels. If  
MODE is pulled to GND, the switcher remains on and the  
LDO off regardless of the load current.  
The load current ILDO(ON) below which the switcher will  
automaticallyturnoffandtheLDOturnonisindependent  
of the external capacitor, and to first order, independent  
ofsupplyandoutputvoltage. Thereisaninverserelation-  
ship between ILDO(ON) and the value of the inductor.  
These dependencies are shown in Figures 2 and 3.  
Automatic operation with inductor values below 1µH is  
not recommended.  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
= 1.2V  
OUT  
At the low load currents at which the switcher to linear  
regulator transition occurs, the switcher is operating in  
pulse skipping mode. During each switching cycle in this  
mode, while the synchronous switch (bottom MOSFET) is  
on, the inductor current decays until the reverse current  
comparator is triggered. At this occurrence, the bottom  
MOSFET is turned off. Ideally, this occurs when the  
inductorcurrentispreciselyzero.Inreality,becauseofon-  
chip delays, this current will be negative at higher output  
voltages.  
V
= 1.5V  
OUT  
V
= 1.8V  
OUT  
T
= 25°C  
A
L = 2.2µH  
4
(V)  
2
3
5
6
V
IN  
3448 F02  
The internal algorithm which controls the LDO turn-on  
load current level makes certain assumptions about the  
amount of charge transferred to the output on each  
switching cycle. These assumptions are no longer met  
when the inductor current begins to reverse. This causes  
theloadcurrentatwhichthetransitiontakesplacetomove  
to lower levels at higher output voltages. For this reason  
use of the LDO auto mode is not recommended for output  
levels above 2V. For output voltages above 2V, the MODE  
pin should be driven externally.  
Figure 2. ILDO(ON) vs VIN, VOUT  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
V
A
= 3.6V  
= 1.5V  
= 25°C  
IN  
OUT  
T
Short-Circuit Protection  
When the output is shorted to ground, the main switch  
cycle will be skipped, and the synchronous switch will  
remain on for a longer duration. This allows the inductor  
current more time to decay, thereby preventing runaway.  
0
2
6
8
10  
12  
4
INDUCTOR VALUE (µH)  
3448 F03  
Figure 3. ILDO(ON) vs LOUT  
3448f  
8
LTC3448  
U
OPERATIO  
(Refer to Functional Diagram)  
1200  
1000  
800  
600  
400  
200  
0
(see Typical Performance Characteristics). Therefore, the  
user should calculate the power dissipation when the  
LTC3448isusedat100%dutycyclewithlowinputvoltage  
(See Thermal Considerations in the Applications Informa-  
tion section).  
V
V
= 1.8V  
= 1.5V  
OUT  
V
= 2.5V  
OUT  
OUT  
Low Supply Operation  
The LTC3448 will operate with input supply voltages as  
low as 2.5V, but the maximum allowable output current is  
reduced at this low voltage. Figure 4 shows the reduction  
in the maximum output current as a function of input  
voltage for various output voltages.  
2.5  
3.5  
4.0  
4.5  
5.0  
5.5  
3.0  
SUPPLY VOLTAGE (V)  
3448 F04  
Figure 4. Maximum Output Current vs Input Voltage  
Slope Compensation and Inductor Peak Current  
Slope compensation provides stability in constant fre-  
quencyarchitecturesbypreventingsub-harmonicoscilla-  
tions at high duty cycles. It is accomplished internally by  
adding a compensating ramp to the inductor current  
signal at duty cycles in excess of 40%. This normally  
results in a reduction of maximum inductor peak current  
for duty cycles >40%. However, the LTC3448 uses a  
patent-pending scheme that counteracts this compensat-  
ing ramp, which allows the maximum inductor peak  
current to remain unaffected throughout all duty cycles.  
Dropout Operation  
Astheinputsupplyvoltagedecreasestoavalueapproach-  
ing the output voltage, the duty cycle increases toward the  
maximumon-time.Furtherreductionofthesupplyvoltage  
forcesthemainswitchtoremainonformorethanonecycle  
untilitreaches100%dutycycle.Theoutputvoltagewillthen  
be determined by the input voltage minus the voltage drop  
across the P-channel MOSFET and the inductor.  
Animportantdetailtorememberisthatatlowinputsupply  
voltages, the RDS(ON) of the P-channel switch increases  
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APPLICATIO S I FOR ATIO  
The basic LTC3448 application circuit is shown on the first  
page of this data sheet. External component selection is  
driven by the load requirement and begins with the selec-  
VOUT  
V
IN  
1
IL =  
VOUT 1−  
(1)  
f L  
( )( )  
tion of L followed by CIN and COUT  
.
The DC current rating of the inductor should be at least  
equal to the maximum load current plus half the ripple  
current to prevent core saturation. Thus, a 720mA rated  
inductorshouldbeenoughformostapplications(600mA  
+ 120mA). For better efficiency, choose a low DC-resis-  
tance inductor.  
Inductor Selection  
For most applications, the value of the inductor will fall in  
the range of 1µH to 4.7µH. Its value is chosen based on the  
desired ripple current. Large value inductors lower ripple  
current and small value inductors result in higher ripple  
currents. Higher VIN or VOUT also increases the ripple  
currentasshowninequation1. Areasonablestartingpoint  
for setting ripple current is IL = 240mA (40% of 600mA).  
If the LTC3448 is to be used in auto LDO mode, inductor  
values less than 1µH should not be used.  
3448f  
9
LTC3448  
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APPLICATIO S I FOR ATIO  
Inductor Core Selection  
temperature than required. Always consult the manufac-  
turer if there is any question.  
Different core materials and shapes will change the size/  
current and price/current relationship of an inductor.  
Toroid or shielded pot cores in ferrite or permalloy mate-  
rials are small and don’t radiate much energy, but gener-  
ally cost more than powdered iron core inductors with  
similarelectricalcharacteristics. Thechoiceofwhichstyle  
inductor to use often depends more on the price vs size  
requirements and any radiated field/EMI requirements  
than on what the LTC3448 requires to operate. Table 1  
shows some typical surface mount inductors that work  
well in LTC3448 applications.  
The selection of COUT is driven by the required effective  
series resistance (ESR). Typically, once the ESR require-  
ment for COUT has been met, the RMS current rating  
generally far exceeds the IRIPPLE(P-P) requirement. In any  
case, if LDO mode is enabled, the value of COUT must have  
a minimum value of 2µF to ensure loop stability. The  
output ripple VOUT is determined by:  
1
VOUT ≅ ∆IL ESR +  
8fCOUT  
Table 1. Representative Surface Mount Inductors  
where f = operating frequency, COUT = output capacitance  
and IL = ripple current in the inductor. For a fixed output  
voltage, the output ripple is highest at maximum input  
voltage since IL increases with input voltage.  
PART  
NUMBER  
VALUE  
(µH)  
DCR  
MAX DC  
SIZE  
3
(MAX) CURRENT (A) W × L × H (mm )  
Sumida  
CDRH3D16  
1.5  
2.2  
3.3  
4.7  
0.043  
0.075  
0.110  
0.162  
1.55  
1.20  
1.10  
0.90  
3.8 × 3.8 × 1.8  
Aluminum electrolytic and dry tantalum capacitors are  
bothavailableinsurfacemountconfigurations.Inthecase  
oftantalum,itiscriticalthatthecapacitorsaresurgetested  
for use in switching power supplies. An excellent choice is  
the AVX TPS series of surface mount tantalum. These are  
specially constructed and tested for low ESR so they give  
the lowest ESR for a given volume. Other capacitor types  
include Sanyo POSCAP, Kemet T510 and T495 series, and  
Sprague 593D and 595D series. Consult the manufacturer  
for other specific recommendations.  
Sumida  
CMD4D06  
2.2  
3.3  
4.7  
0.116  
0.174  
0.216  
0.950  
0.770  
0.750  
3.5 × 4.3 × 0.8  
2.5 × 3.2 × 2.0  
2.5 × 3.2 × 2.0  
Coilcraft  
ME3220  
2.2  
3.3  
4.7  
0.104  
0.138  
0.190  
1.8  
1.3  
1.2  
Murata  
LQH3C  
1.0  
2.2  
4.7  
0.060  
0.097  
0.150  
1.00  
0.79  
0.65  
CIN and COUT Selection  
Using Ceramic Input and Output Capacitors  
In continuous mode, the source current of the top MOS-  
FET is a square wave of duty cycle VOUT/VIN. To prevent  
large voltage transients, a low ESR input capacitor sized  
for the maximum RMS current must be used. The maxi-  
mum RMS capacitor current is given by:  
Higher values, lower cost ceramic capacitors are now  
becoming available in smaller case sizes. Their high ripple  
current, high voltage rating and low ESR make them ideal  
for switching regulator applications. Because the  
LTC3448’s control loop does not depend on the output  
capacitor’s ESR for stable operation, ceramic capacitors  
can be used freely to achieve very low output ripple and  
small circuit size.  
1/2  
VOUT V VOUT  
(
IN  
)
]
[
CIN required IRMS IOMAX  
V
IN  
However, care must be taken when ceramic capacitors are  
usedattheinputandtheoutput.Whenaceramiccapacitor  
is used at the input and the power is supplied by a wall  
adapter through long wires, a load step at the output can  
induce ringing at the input, VIN. At best, this ringing can  
This formula has a maximum at VIN = 2VOUT, where  
IRMS = IOUT/2. This simple worst-case condition is com-  
monly used for design. Note that the capacitor  
manufacturer’s ripple current ratings are often based on  
2000hoursoflife.Thismakesitadvisabletofurtherderate  
the capacitor, or choose a capacitor rated at a higher  
couple to the output and be mistaken as loop instability. At  
3448f  
10  
LTC3448  
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APPLICATIO S I FOR ATIO  
U
worst, a sudden inrush of current through the long wires loss dominates the efficiency loss at low load currents,  
can potentially cause a voltage spike at VIN, large enough whereas the I2R loss dominates the efficiency loss at  
to damage the part.  
medium to high load currents. At very low load currents  
with the part operating in LDO mode, efficiency can be  
dominated by I2R losses in the pass transistor and is a  
strong function of (VIN – VOUT). In a typical efficiency plot,  
the efficiency curve at very low load currents can be  
misleading since the actual power lost is of little conse-  
quence as illustrated in Figure 6.  
When choosing the input and output ceramic capacitors,  
choose the X5R or X7R dielectric formulations. These  
dielectrics have the best temperature and voltage charac-  
teristics of all the ceramics for a given value and size.  
Output Voltage Programming  
1
The output voltage is set by tying VFB to a resistive divider  
according to the following formula:  
V
= 3.6V  
IN  
FREQ = 0V  
LDOCNTRL = V  
OUT(AUTO)  
0.1  
0.01  
R2  
R1  
VOUT = 0.6V 1+  
(2)  
The external resistive divider is connected to the output,  
allowing remote voltage sensing as shown in Figure 5.  
0.001  
0.0001  
1.2V  
1.5V  
1.8V  
0.6V V  
5.5V  
OUT  
0.0001  
0.001  
0.01  
0.1  
1
R2  
LOAD CURRENT (A)  
V
FB  
3448 F06  
LTC3448  
R1  
Figure 6. Power Loss vs Load Current  
GND  
3448 F05  
1. The VIN quiescent current is due to two components:  
the DC bias current as given in the Electrical Character-  
istics and the internal main switch and synchronous  
switch gate charge currents. The gate charge current  
results from switching the gate capacitance of the  
internal power MOSFET switches. Each time the gate is  
switched from high to low to high again, a packet of  
charge, dQ, moves from VIN to ground. The resulting  
dQ/dtisthecurrentoutofVIN thatistypicallylargerthan  
the DC bias current and proportional to frequency. Both  
the DC bias and gate charge losses are proportional to  
VIN and thus their effects will be more pronounced at  
higher supply voltages.  
2. I2R losses are calculated from the resistances of the  
internal switches, RSW, and external inductor RL. In  
continuous mode, the average output current flowing  
through inductor L is “chopped” between the main  
switch and the synchronous switch. Thus, the series  
resistance looking into the SW pin is a function of both  
Figure 5. Setting the LTC3448 Output Voltage  
Efficiency Considerations  
The efficiency of a switching regulator is equal to the  
output power divided by the input power times 100%. It is  
oftenusefultoanalyzeindividuallossestodeterminewhat  
is limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
Efficiency = 100% – (L1 + L2 + L3 + ...)  
whereL1, L2, etc. aretheindividuallossesasapercentage  
of input power.  
Although all dissipative elements in the circuit produce  
losses, two main sources usually account for most of the  
losses in LTC3448 circuits: VIN quiescent current and I2R  
losses. When in switching mode, VIN quiescent current  
3448f  
11  
LTC3448  
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APPLICATIO S I FOR ATIO  
top and bottom MOSFET RDS(ON) and the duty cycle  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
(DC) as follows:  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
The junction temperature, TJ, is given by:  
TJ = TA + TR  
The RDS(ON) for both the top and bottom MOSFETs can  
be obtained from the Typical Performance Characteris-  
tics curves. Thus, to obtain I2R losses, simply add RSW  
to RL and multiply the result by the square of the  
average output current.  
where TA is the ambient temperature.  
As an example, consider the LTC3448 in dropout at an  
input voltage of 2.7V, a load current of 600mA and an  
ambient temperature of 70°C. From the typical perfor-  
mance graph of switch resistance, the RDS(ON) of the  
P-channel switch at 70°C is approximately 0.52. There-  
fore, power dissipated by the part is:  
3. At load currents below the selected threshold the  
LTC3448 will switch into low ripple LDO mode if en-  
abled. In this case the losses are due to the DC bias  
currents as given in the electrical characteristics and  
I2R losses due to the (VIN – VOUT) voltage drop across  
the internal pass transistor.  
PD = ILOAD2 • RDS(ON) = 187.2mW  
For the 3mm × 3mm DFN package, the θJA is 43°C/W.  
Other losses when in switching operation, including CIN  
andCOUTESRdissipativelossesandinductorcorelosses,  
generally account for less than 2% total additional loss.  
Thus, the junction temperature of the regulator is:  
TJ = 85°C + (0.1872)(43) = 93°C  
which is well below the maximum junction temperature of  
125°C.  
Thermal Considerations  
The LTC3448 requires the package backplane metal (GND  
pin)tobewellsolderedtothePCboard.ThisgivestheDFN  
andMSOPpackagesexceptionalthermalproperties,mak-  
ing it difficult in normal operation to exceed the maximum  
junction temperature of the part. In most applications the  
LTC3448 does not dissipate much heat due to its high  
efficiency.InapplicationswheretheLTC3448isrunningat  
highambienttemperaturewithlowsupplyvoltageandhigh  
duty cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part if it  
isnotwellthermallygrounded. Ifthejunctiontemperature  
reachesapproximately150°C,bothpowerswitcheswillbe  
turned off and the SW node will become high impedance.  
Note that at higher supply voltages, the junction tempera-  
ture is lower due to reduced switch resistance RDS(ON).  
Checking Transient Response  
The regulator loop response can be checked by looking at  
the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an amount  
equal to (ILOAD • ESR), where ESR is the effective series  
resistance of COUT. ILOAD also begins to charge or dis-  
chargeCOUT, whichgeneratesafeedbackerrorsignal. The  
regulator loop then acts to return VOUT to its steady-state  
value.DuringthisrecoverytimeVOUT canbemonitoredfor  
overshoot or ringing that would indicate a stability prob-  
lem. For a detailed explanation of switching control loop  
theory, see Application Note 76.  
To avoid the LTC3448 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The tempera-  
ture rise is given by:  
A second, more severe transient is caused by switching in  
loads with large (>1µF) supply bypass capacitors. The  
dischargedbypasscapacitorsareeffectivelyputinparallel  
TR = PDθJA  
3448f  
12  
LTC3448  
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APPLICATIO S I FOR ATIO  
U
with COUT, causing a rapid drop in VOUT. No regulator can 2. Does the VFB pin connect directly to the feedback  
deliver enough current to prevent this problem if the load  
switch resistance is low and it is driven quickly. The only  
solution is to limit the rise time of the switch drive so that  
the load rise time is limited to approximately (25 • CLOAD).  
Thus, a 10µF capacitor charging to 3.3V would require a  
250µs rise time, limiting the charging current to about  
130mA.  
resistors? The resistive divider R1/R2 must be con-  
nected between the (+) plate of COUT and ground.  
3. Does the (+) plate of CIN connect to VIN as closely as  
possible? This capacitor provides the AC current to the  
internal power MOSFETs.  
4. Keep the switching node, SW, away from the sensitive  
V
FB node.  
PC Board Layout Checklist  
5. Keepthe()platesofCIN andCOUT ascloseaspossible.  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3448. These items are also illustrated graphically in  
Figures 7 and 8. Check the following in your layout:  
Design Example  
As a design example, assume the LTC3448 is used in a  
single lithium-ion battery-powered cellular phone  
application. The VIN will be operating from a maximum of  
4.2V down to about 2.7V. The load current requirement  
is a maximum of 0.6A but most of the time it will be in  
standbymode, requiringonly2mA. Efficiencyatbothlow  
1. The power traces, consisting of the GND trace, the SW  
trace and the VIN trace should be kept short, direct and  
wide.  
L
5
2
3
4
8
V
V
V
SW  
OUT  
IN  
OUT  
IN  
RUN  
V
C
OUT  
C
IN  
MODE  
LTC3448  
R
FB2  
R
FB1  
C
FF  
6
7
1
FREQ  
SYNC  
V
FB  
GND  
3448 F07  
9
Figure 7. LTC3448 Layout Design  
3448 F08  
Figure 8. LTC3448 Layout  
3448f  
13  
LTC3448  
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APPLICATIO S I FOR ATIO  
and high load currents is important. Output voltage is  
1.8V. With this information we can calculate L using  
Equation (1),  
CIN will require an RMS current rating of at least 0.3A ≅  
ILOAD(MAX)/2 at temperature and COUT will require an ESR  
of less than 0.25. In most cases, a ceramic capacitor will  
satisfy this requirement.  
1
VOUT  
V
IN  
L =  
VOUT 1−  
For the feedback resistors, choose R1 = 316k. R2 can  
then be calculated from Equation (2) to be:  
(3)  
f IL  
( )(  
)
Substituting VOUT = 1.8V, VIN = 4.2V, IL = 240mA and  
V
0.6  
OUT  
R2 =  
1 R1= 632k  
f = 1.5MHz in Equation (3) gives:  
Figure 9 shows the complete circuit along with its effi-  
ciency curve.  
1.8V  
1.5MHz(240mA)  
1.8V  
4.2V  
L =  
1−  
= 2.86µH  
A 2.2µH inductor works well for this application. For best  
efficiency choose a 720mA or greater inductor with less  
than 0.2series resistance.  
100  
V
V
A
= 3.6V  
= 1.8V  
= 25°C  
IN  
OUT  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
T
2.2µH*  
V
IN  
V
OUT  
1.8V  
5
2
4
8
2.7V  
V
SW  
OUT  
LTC3448  
MODE  
IN  
RUN  
C
OUT  
TO 5.5V  
C
IN  
V
15µF  
4.7µF  
CER  
CER  
3
1
22pF 632k  
316k  
6
7
FREQ  
SYNC  
V
FB  
GND  
9
3448 F09a  
C
C
: TAIYO YUDEN JMK212BJ475MG  
0.0001  
0.001  
0.01  
0.1  
1
IN  
: TAIYO YUDEN JMK212BJ475MG  
OUT  
LOAD CURRENT (A)  
*MURATA LQH32CN2R2M11  
3448 F09b  
Figure 9b  
Figure 9a  
V
OUT  
V
OUT  
100mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
I
LOAD  
250mA/DIV  
I
LOAD  
100mA/DIV  
I
I
L
L
500mA/DIV  
500mA/DIV  
3448 F09c  
3448 F09d  
V
= 3.6V  
20µs/DIV  
V
= 3.6V  
20µs/DIV  
IN  
IN  
V
I
= 1.8V  
V
OUT  
I
= 1.8V  
OUT  
= 100µA TO 200mA  
= 50mA TO 600mA  
LOAD  
LOAD  
Figure 9d  
Figure 9c  
3448f  
14  
LTC3448  
U
TYPICAL APPLICATIO S  
Single Li-Ion 1.5V/600mA Regulator for  
High Efficiency and Small Footprint  
Efficiency vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
A
= 1.5V  
OUT  
= 25°C  
T
2.2µH*  
V
IN  
5
2
V
OUT  
1.5V  
4
8
2.7V  
V
SW  
OUT  
LTC3448  
MODE  
IN  
TO 5.5V  
C
IN  
C
RUN  
V
OUT  
4.7µF  
15µF  
CER  
474k  
216k  
3
1
22pF  
6
7
FREQ  
SYNC  
V
FB  
GND  
9
V
IN  
V
IN  
V
IN  
= 2.7V  
= 3.6V  
= 4.2V  
3448 TA03  
C
C
: TAIYO YUDEN CERAMIC JMK212BJ475MG  
IN  
: TAIYO YUDEN CERAMIC JMK212BJ475MG  
OUT  
0.0001  
0.001  
0.01  
0.1  
1
*MURATA LQH32CN2R2M33  
LOAD CURRENT (A)  
23448 G03  
Load Step  
Load Step  
V
OUT  
V
OUT  
100mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
I
LOAD  
250mA/DIV  
I
LOAD  
100mA/DIV  
I
L
I
L
500mA/DIV  
500mA/DIV  
3448 TA06  
3448 TA05  
V
= 3.6V  
20µs/DIV  
V
= 3.6V  
20µs/DIV  
IN  
IN  
V
I
= 1.5V  
V
I
= 1.5V  
OUT  
OUT  
= 50mA TO 600mA  
= 100µA TO 200mA  
LOAD  
LOAD  
Note: Performance data measured on the LTC3448 with external resistors  
3448f  
15  
LTC3448  
U
TYPICAL APPLICATIO S  
Single Li-Ion 1.2V/600mA Regulator for  
High Efficiency and Small Footprint  
Efficiency vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.2µH*  
V
IN  
V
= 1.2V  
OUT  
5
2
4
8
V
OUT  
2.7V  
V
SW  
OUT  
LTC3448  
MODE  
IN  
T
= 25°C  
A
1.2V  
C
OUT  
TO 5.5V  
C
IN  
RUN  
V
10µF  
4.7µF  
CER  
CER  
316k  
316k  
3
1
22pF  
6
7
FREQ  
SYNC  
V
FB  
GND  
9
3448 TA07  
C
C
: TAIYO YUDEN JMK212BJ475MG  
: TAIYO YUDEN JMK212BJ475MG  
*MURATA LQH32CN2R2M33  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
OUT  
IN  
IN  
IN  
0.0001  
0.001  
0.01  
0.1  
1
LOAD CURRENT (A)  
23448 G02  
Load Step  
Load Step  
V
V
OUT  
OUT  
100mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
I
LOAD  
100mA/DIV  
I
LOAD  
250mA/DIV  
I
L
I
L
500mA/DIV  
500mA/DIV  
3448 TA10  
3448 TA09  
V
= 3.6V  
20µs/DIV  
V
V
I
= 3.6V  
20µs/DIV  
IN  
IN  
V
OUT  
I
= 1.2V  
= 1.2V  
OUT  
= 50mA TO 600mA  
= 100µA TO 200mA  
LOAD  
LOAD  
3448f  
16  
LTC3448  
U
TYPICAL APPLICATIO S  
Single Li-Ion 2.5V/600mA Regulator with 1.8MHz External  
Synchronization and External MODE  
2.2µH  
V
OUT  
V
5
2
4
8
IN  
2.5V  
V
SW  
OUT  
LTC3448  
IN  
2.5V TO 5.5V  
C
C
OUT 600mA  
IN  
RUN  
V
4.7µF  
10µF  
CER  
C
CER  
FF  
1.58M  
500k  
22pF  
TO  
3
6
7
µPROCESSOR  
MODE  
1
CONTROL  
FREQ  
SYNC  
V
FB  
TO 0V TO 1.3V  
OR GREATER 1.8MHz  
EXTERNAL CLOCK  
GND  
9
3448 TA12  
Load Step  
Load Step  
V
V
OUT  
OUT  
100mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
LDOCNTRL  
2V/DIV  
LDOCNTRL  
2V/DIV  
I
LOAD  
250mA/DIV  
I
LOAD  
250mA/DIV  
3448 TA12c  
3448 TA12b  
V
V
I
= 3.6V  
40µs/DIV  
V
V
I
= 3.6V  
40µs/DIV  
IN  
OUT  
IN  
OUT  
= 2.5V  
= 100µA TO 600mA  
= 2.5V  
= 100µA TO 300mA  
LOAD  
LOAD  
Single Li-Ion 1.2V/600mA Regulator with 2.5MHz External Synchronization  
2.2µH  
V
OUT  
V
5
2
4
8
IN  
1.2V  
V
SW  
OUT  
LTC3448  
IN  
2.5V TO 5.5V  
C
C
OUT 600mA  
IN  
RUN  
V
4.7µF  
10µF  
CER  
C
CER  
FF  
316k  
22pF  
3
1
MODE  
6
7
FREQ  
SYNC  
V
FB  
TO 0V TO 1.3V OR  
GREATER 2.5MHz  
EXTERNAL CLOCK  
316k  
GND  
9
3448 TA13  
3448f  
17  
LTC3448  
U
PACKAGE DESCRIPTIO  
DD Package  
8-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1698)  
0.675 ±0.05  
3.5 ±0.05  
2.15 ±0.05 (2 SIDES)  
1.65 ±0.05  
PACKAGE  
OUTLINE  
0.25 ± 0.05  
0.50  
BSC  
2.38 ±0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
R = 0.115  
0.38 ± 0.10  
TYP  
5
8
3.00 ±0.10  
(4 SIDES)  
1.65 ± 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(NOTE 6)  
(DD8) DFN 1203  
4
1
0.25 ± 0.05  
0.75 ±0.05  
0.200 REF  
0.50 BSC  
2.38 ±0.10  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION  
ON TOP AND BOTTOM OF PACKAGE  
3448f  
18  
LTC3448  
U
PACKAGE DESCRIPTIO  
MS8E Package  
8-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1662)  
BOTTOM VIEW OF  
EXPOSED PAD OPTION  
2.06 ± 0.102  
(.081 ± .004)  
1
1.83 ± 0.102  
(.072 ± .004)  
0.889 ± 0.127  
(.035 ± .005)  
2.794 ± 0.102  
(.110 ± .004)  
5.23  
(.206)  
MIN  
3.20 – 3.45  
(.126 – .136)  
2.083 ± 0.102  
(.082 ± .004)  
8
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 3)  
0.52  
(.0205)  
REF  
0.65  
(.0256)  
BSC  
0.42 ± 0.038  
(.0165 ± .0015)  
TYP  
8
7 6 5  
RECOMMENDED SOLDER PAD LAYOUT  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 4)  
4.90 ± 0.152  
(.193 ± .006)  
DETAIL “A”  
0.254  
(.010)  
0° – 6° TYP  
GAUGE PLANE  
1
2
3
4
0.53 ± 0.152  
(.021 ± .006)  
1.10  
(.043)  
MAX  
0.86  
(.034)  
REF  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.22 – 0.38  
(.009 – .015)  
TYP  
0.127 ± 0.076  
(.005 ± .003)  
0.65  
(.0256)  
BSC  
MSOP (MS8E) 0603  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
3448f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
19  
LTC3448  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
90% Efficiency, V = 3.6V to 25V, V  
LT1616  
500mA (I ), 1.4MHz, High Efficiency Step-Down  
1.25V, I = 1.9mA,  
Q
OUT  
IN  
OUT  
OUT  
OUT  
OUT  
DC/DC Converter  
I
= <1µA, ThinSOT Package  
SD  
LT1776  
500mA (I ), 200kHz, High Efficiency Step-Down  
90% Efficiency, V = 7.4V to 40V, V  
I
1.24V, I = 3.2mA,  
Q
OUT  
IN  
DC/DC Converter  
= 30µA, N8, S8 Packages  
SD  
LTC1877  
600mA (I ), 550kHz, Synchronous Step-Down  
95% Efficiency, V = 2.7V to 10V, V  
I
0.8V, I = 10µA,  
Q
OUT  
IN  
DC/DC Converter  
= <1µA, MS8 Package  
SD  
LTC1879  
1.2A (I ), 550kHz, Synchronous Step-Down  
95% Efficiency, V = 2.7V to 10V, V  
I
0.8V, I = 15µA,  
OUT  
IN  
Q
DC/DC Converter  
= <1µA, TSSOP-16 Package  
SD  
LTC3403  
600mA (I ), 1.5MHz, Synchronous Step-Down  
DC/DC Converter with Bypass Transistor  
96% Efficiency, V = 2.5V to 5.5V, V  
I = 20µA, I = <1µA, DFN Package  
Q SD  
= Dynamically Adjustable,  
OUT  
IN  
OUT  
OUT  
OUT  
OUT  
OUT  
LTC3405/LTC3405A  
LTC3406  
300mA (I ), 1.5MHz, Synchronous Step-Down  
96% Efficiency, V = 2.5V to 5.5V, V  
0.8V, I = 20µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, ThinSOT Package  
SD  
600mA (I ), 1.5MHz, Synchronous Step-Down  
96% Efficiency, V = 2.5V to 5.5V, V  
0.6V, I = 20µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, ThinSOT Package  
SD  
LTC3406B-2  
LTC3407/LTC3407-2  
LTC3409  
600mA (I ), 2.25MHz, Synchronous Step-Down  
96% Efficiency, V = 2.5V to 5.5V, V  
0.6V, I = 300µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, ThinSOT Package  
SD  
Dual 600mA/800mA (I ), 1.5MHz/2.25MHz,  
96% Efficiency, V = 2.5V to 5.5V, V  
0.6V, I = 40µA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converter  
I
= <1µA, MS10, DFN Packages  
SD  
600mA Low V Buck Regulator  
95% Efficiency, V = 1.6V to 5.5V, I = 65µA  
IN  
IN  
Q
I
= <1µA, DFN Package  
SD  
LTC3411  
1.25A (I ), 4MHz, Synchronous Step-Down  
DC/DC Converter  
95% Efficiency, V = 2.5V to 5.5V, V  
0.8V, I = 60µA,  
Q
OUT  
IN  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
I
= <1µA, MS Package  
SD  
LTC3412  
2.5A (I ), 4MHz, Synchronous Step-Down  
95% Efficiency, V = 2.5V to 5.5V, V  
0.8V, I = 60µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, TSSOP-16E Package  
SD  
LTC3440  
600mA (I ), 2MHz, Synchronous Buck-Boost  
95% Efficiency, V = 2.5V to 5.5V, V  
2.5V, I = 25µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, MS Package  
SD  
LTC3441  
1.2A (I ), 1MHz, Synchronous Buck-Boost  
95% Efficiency, V = 2.4V to 5.5V, V  
2.4V to 5.25V, I = 25µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, DFN Package  
SD  
LTC3442  
1.2A (I ), 2MHz, Synchronous Buck-Boost  
95% Efficiency, V = 2.4V to 5.5V, V  
2.4V to 5.25V, I = 35µA,  
Q
OUT  
IN  
DC/DC Converter  
I
= <1µA, DFN Package  
SD  
LTC3443  
1.2A (I ), 600kHz, Synchronous Buck-Boost  
95% Efficiency, V = 2.4V to 5.5V, V  
2.4V to 5.25V, I = 28µA,  
OUT  
IN  
Q
DC/DC Converter  
I
= <1µA, DFN Package  
SD  
3448f  
LT/TP 0505 500 • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
© LINEAR TECHNOLOGY CORPORATION 2005  

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