LTC3532EDD#PBF [Linear]

LTC3532 - Micropower Synchronous Buck-Boost DC/DC Converter; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C;
LTC3532EDD#PBF
型号: LTC3532EDD#PBF
厂家: Linear    Linear
描述:

LTC3532 - Micropower Synchronous Buck-Boost DC/DC Converter; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C

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LTC3532  
Micropower Synchronous  
Buck-Boost DC/DC Converter  
U
DESCRIPTIO  
FEATURES  
The LTC®3532 is a high efficiency, fixed frequency, buck-  
boost DC/DC converter that operates from input voltages  
above, below or equal to the output voltage. The topology  
incorporated in the IC provides a continuous transfer  
function through all operating modes, making the product  
ideal for single lithium-ion, multicell alkaline or NiMH ap-  
plications where the output voltage is within the battery  
voltage range.  
Single Inductor  
Regulated Output with Input Voltages Above, Below  
or Equal to the Output  
Wide V Range: 2.4V to 5.5V  
IN  
V
OUT  
Range: 2.4V to 5.25V  
Up to 500mA Peak Output Current  
Synchronous Rectification: Up to 95% Efficiency  
Manual or Programmable Automatic Burst Mode®  
Operation  
Output Disconnect in Shutdown  
Programmable Oscillator: 300kHz to 2MHz  
Pin Compatible with LTC3440  
The device includes two 0.36Ω N-channel MOSFET  
switches and two 0.42Ω P-channel switches. Switching  
frequencies up to 2MHz are programmed with an external  
resistor. Quiescent current is only 35μA in Burst Mode  
operation, maximizing battery life in portable applica-  
tions. Automatic Burst Mode operation allows the user  
to program the load current for Burst Mode operation or  
to control it manually.  
Small Thermally Enhanced 10-Lead (3mm × 3mm)  
DFN and 10-Lead MSOP Packages  
U
APPLICATIO S  
Other features include a 1μA shutdown, soft-start control,  
Miniature Hard Disk Drive Power Supply  
thermal shutdown, and peak current limit. The LTC3532 is  
available in a low profile (0.75mm) 10-lead (3mm × 3mm)  
DFN and 10-lead MSOP packages.  
MP3 Players  
Handheld Instruments  
Digital Cameras  
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.  
Burst Mode is a registered trademark of Linear Technology Corporation.  
All other trademarks are the property of their respective owners.  
Handheld Terminals  
U
TYPICAL APPLICATIO  
Miniature Hard Disk Drive Power Supply  
V
OUT  
3.3V  
4.7μH  
V
OUT  
100mA  
TO 500mA  
(PEAK)  
200mV/DIV  
340k  
1k  
SW2  
SW1  
V
IN  
V
Li-Ion  
V
OUT  
FB  
IN  
2.5V TO 4.2V  
SHDN/SS  
BURST  
LTC3532  
33pF  
I
12.1k  
LOAD  
100mA/DIV  
V
C
220pF  
R
GND  
T
3532 TA01b  
100μs/DIV  
V
V
LOAD  
= 3V  
IN  
200k  
43.2k  
200k  
10μF  
= 3.3V  
OUT  
I
= 50mA TO 300mA  
4.7μF  
0.01μF  
3532 TA01  
3532fc  
1
LTC3532  
W W U W  
(Note 1)  
ABSOLUTE AXI U RATI GS  
Maximum Junction Temperature (Note 4)............. 125°C  
Storage Temperature Range  
BURST, V , V , V , FB –0.3V to 6V  
...................................  
IN OUT  
C
R ..................................................................... 0V to 5V  
T
DD ..................................................... –65°C to 125°C  
MSOP ................................................ –65°C to 150°C  
Lead Temperature (Soldering,10 sec)  
SHDN/SS ..................................................... –0.3V to 6V  
SW1, SW2  
DC............................................................ –0.3V to 6V  
Pulsed < 100ns........................................ –0.3V to 7V  
Operating Temperature Range (Note 2).... –40°C to 85°C  
MSOP ............................................................... 300°C  
U
U
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PI CO FIGURATIO  
TOP VIEW  
TOP VIEW  
R
1
2
3
4
5
10  
9
V
T
C
R
1
2
3
4
5
10  
V
C
T
BURST  
SW1  
FB  
BURST  
SW1  
9
8
7
6
FB  
SHDN/SS  
8
SHDN/SS  
V
V
SW2  
GND  
7
6
11  
IN  
OUT  
SW2  
V
V
IN  
MS PACKAGE  
10-LEAD PLASTIC MSOP  
= 125°C  
= 130°C/W 1 LAYER BOARD  
= 100°C/W 4 LAYER BOARD  
GND  
OUT  
T
JMAX  
DD PACKAGE  
θ
JA  
JA  
10-LEAD (3mm × 3mm) PLASTIC DFN  
= 125°C, θ = 43°C/W  
EXPOSED PAD (PIN 11) IS GND, MUST BE CONNECTED TO PCB  
θ
T
JMAX  
JA  
θ
= 45°C/W  
JC  
U
W
U
ORDER I FOR ATIO  
LEAD FREE FINISH  
LTC3532EDD#PBF  
LTC3532EMS#PBF  
TAPE AND REEL  
PART MARKING  
LBXR  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
–40°C to 85°C  
LTC3532EDD#TRPBF  
LTC3532EMS#TRPBF  
10-Lead (3mm × 3mm) Plastic DFN  
10-Lead Plastic MSOP  
LTBXS  
–40°C to 85°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 64.9k, unless otherwise specified.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
2.4  
5.5  
5.25  
1.25  
50  
UNITS  
V
Input Start-Up Voltage  
Input Operating Range  
Output Voltage Adjust Range  
Feedback Voltage  
2.3  
2.4  
2.4  
V
V
1.19  
1.22  
1
V
Feedback Input Current  
Quiescent Current, Burst Mode Operation  
Quiescent Current, Shutdown  
Quiescent Current, Active  
NMOS Switch Leakage  
VFB = 1.22V  
nA  
μA  
μA  
μA  
BURST = 0V  
35  
60  
SHDN = 0V, Not Including Switch Leakage, V  
= 0V  
0.1  
600  
0.1  
1
OUT  
V = 0V, BURST = V (Note 3)  
1000  
5
IN  
C
Switches B and C  
μA  
3532fc  
2
LTC3532  
ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 64.9k, unless otherwise specified.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
0.1  
MAX  
UNITS  
μA  
Ω
PMOS Switch Leakage  
NMOS Switch On Resistance  
PMOS Switch On Resistance  
Input Current Limit  
Switches A and D  
Switches B and C  
Switches A and D  
10  
0.36  
0.42  
1.1  
Ω
0.8  
1.45  
A
Maximum Duty Cycle  
Boost (% Switch C On)  
Buck (% Switch A On)  
70  
100  
88  
%
%
Minimum Duty Cycle  
Frequency Accuracy  
Burst Threshold (Falling)  
Burst Threshold (Rising)  
Burst Current Ratio  
0
%
kHz  
V
575  
740  
0.88  
1.12  
8000  
90  
885  
V
Ratio of IOUT to IBURST  
Error Amp AVOL  
dB  
μA  
μA  
Error Amp Source Current  
Error Amp Sink Current  
SHDN/SS Threshold  
V = 1.4V  
C
15  
V = 2V  
C
310  
When IC is Enabled  
When EA is at Maximum Boost Duty Cycle  
0.4  
1
2.2  
1.5  
1
V
V
SHDN/SS Input Current  
VSHDN = 5.5V  
0.01  
μA  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 2: The LTC3532E is guaranteed to meet performance specifications  
from 0°C to 85°C. Specifications over the –40°C to 85°C operating  
temperature range are assured by design, characterization and correlations  
with statistical process controls.  
Note 3: Current measurements are performed when the outputs are not  
switching.  
Note 4: This IC includes overtemperature protection that is intended  
to protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may result in device degradation or failure.  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C, unless otherwise specified.  
Fixed Frequency and Burst Mode  
Quiescent Current vs VIN  
Efficiency and Power Loss  
vs Load Autoburst Mode  
Efficiency and Power Loss  
vs Load  
100  
1000  
100  
100  
1000  
100  
10  
80  
3.0  
2.5  
75  
70  
65  
60  
55  
50  
45  
40  
EFFICIENCY  
90 BURST EFFICIENCY  
80  
90  
80  
2000kHz  
1500kHz  
2.0  
1.5  
1000kHz  
10  
1
70  
70  
60  
POWER LOSS  
FIXED FREQUENCY  
POWER LOSS  
1
BURST  
60  
1.0  
0.5  
0
POWER LOSS  
0.1  
500kHz  
3V  
3.6V  
4.2V  
50  
50  
40  
FIXED FREQUENCY  
NOT SWITCHING  
4.5  
BURST MODE  
2.5 3.5  
V
= 3.3V  
1
EFFICIENCY  
OUT  
40  
0.1  
0.1  
1000  
0.01  
1000  
1
10  
100  
5.5  
0.1  
10  
100  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
V
(V)  
IN  
3532 G02  
3532 G01  
3532 G03  
3532fc  
3
LTC3532  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
TA = 25°C, unless otherwise specified.  
Peak Current Clamp and Limit  
vs VIN  
Automatic Burst Threshold  
vs RBURST  
Efficiency vs Frequency  
70  
60  
100  
98  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
96  
94  
92  
I
LIMIT  
50  
40  
I
CLAMP  
90  
88  
LEAVE BURST  
ENTER BURST  
30  
20  
10  
86  
84  
82  
80  
V
V
= 3.6V  
V
V
= 3.3V  
250  
IN  
OUT  
OUT  
IN  
V
= 3.3V  
= 3.3V  
= 3.6V  
OUT  
550  
500  
1500  
1000  
FREQUENCY (kHz)  
2000  
2.4  
3.4  
4.4  
5.4  
150  
350  
450  
BURST RESISTOR (kΩ)  
V
(V)  
IN  
3532 G06  
3532 G04  
3532 G05  
Load Transient Response in  
Fixed Frequency Mode  
Frequency vs Temperature  
Feedback Voltage vs Temperature  
1200  
1150  
1100  
1050  
1000  
950  
1.241  
1.236  
1.231  
1.226  
1.221  
1.216  
1.211  
1.206  
1.201  
V
OUT  
200mV/DIV  
I
LOAD  
100mA/DIV  
900  
3535 G09  
100μs/DIV  
850  
C
V
V
= 10μF  
= 3.3V  
OUT  
V
= 3.6V  
IN  
= 3.6V  
IN  
800  
1.196  
OUT  
–5  
–55  
45  
95  
–55  
–5  
TEMPERATURE (°C)  
95  
45  
TEMPERATURE (°C)  
3532 G07  
3532 G08  
Switch Pins Before Entering  
Boost Mode  
Burst Mode to Fixed Frequency  
Transition  
Switch Pins in Buck-Boost Mode  
SW1  
2V/DIV  
V
SW1  
2V/DIV  
OUT  
200mV/DIV  
BURST PIN  
2V/DIV  
SW2  
2V/DIV  
SW2  
2V/DIV  
3532 G10  
3532 G11  
3532 G12  
400μs/DIV  
40ns/DIV  
40ns/DIV  
C
V
V
= 22μF  
= 3.3V  
V
V
I
= 3.3V  
V
V
I
= 2.9V  
OUT  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 3.6V  
= 3.3V  
= 3.3V  
= 100mA  
= 100mA  
LOAD  
LOAD  
3532fc  
4
LTC3532  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
TA = 25°C, unless otherwise specified.  
Switch Pins Before Entering  
Buck Mode  
Output Ripple at 100mA Load  
Burst Mode, Boost  
SW1  
SW1  
2VDIV  
V
V
= 2.4V  
= 3.6V  
IN  
IN  
5V/DIV  
V
OUT  
50mV/DIV  
SW2  
5V/DIV  
V
OUT  
50mV/DIV  
SW2  
2VDIV  
V
OUT  
V
= 4.5V  
100mV/DIV  
IN  
V
OUT  
INDUCTOR  
CURRENT  
500mA/DIV  
50mV/DIV  
3535 G13  
3535 G15  
3535 G14  
40ns/DIV  
4μs/DIV  
400ns/DIV  
V
= 4V  
V
V
I
= 2.4V  
V
= 3.6V  
= 100mA  
= 10μF  
IN  
IN  
OUT  
OUT  
OUT  
VOUT = 3.3V  
= 100mA  
= 3.3V  
= 20mA  
= 22μF  
I
I
C
LOAD  
LOAD  
OUT  
C
OUT  
Burst Mode, Buck-Boost  
Burst Mode, Buck  
SW1  
5V/DIV  
SW1  
5V/DIV  
SW2  
5V/DIV  
SW2  
5V/DIV  
V
OUT  
V
100mV/DIV  
OUT  
100mV/DIV  
INDUCTOR  
CURRENT  
500mA/DIV  
INDUCTOR  
CURRENT  
500mA/DIV  
3535 G17  
340612 G16  
4μs/DIV  
4μs/DIV  
V
V
I
= 4.2V  
V
V
I
= 3.75V  
= 3.3V  
IN  
OUT  
IN  
OUT  
= 3.3V  
= 20mA  
= 22μF  
= 20mA  
= 22μF  
LOAD  
LOAD  
C
C
OUT  
OUT  
U
U
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PI FU CTIO S  
RT (Pin 1): Timing Resistor to Program the Oscillator  
Frequency. The programming range is 300kHz to 2MHz.  
An optional Schottky diode can be connected from SW1  
to ground. Minimize trace length to minimize EMI.  
SW2 (Pin 4): Switch Pin Where the Internal Switches C  
48,000  
f(kHz) =  
andDareConnected.Forapplicationswithoutputvoltages  
RT(kΩ)  
over 4.3V, a Schottky diode is required from SW2 to V  
to ensure SW2 does not exhibit excess voltage.  
OUT  
BURST (Pin 2): Used to Set the Automatic Burst Mode Op-  
erationThreshold. Placearesistorandcapacitorinparallel  
from this pin to ground. See the Applications Information  
sectionforcomponentvalueselection.Formanualcontrol,  
ground the pin to force Burst Mode operation, connect to  
GND (Pin 5): Signal and Power Ground for the IC.  
V
(Pin 6): Output of the Synchronous Rectifier. A lter  
OUT  
capacitor is placed from V  
to GND.  
OUT  
V (Pin 7): Input Supply Pin. Supplies current to the  
IN  
V
to force fixed frequency mode.  
OUT  
inductor through SW1 and supplies internal V for the  
CC  
SW1 (Pin 3): Switch Pin Where the Internal Switches A  
and B are Connected. Connect inductor from SW1 to SW2.  
IC. A ceramic bypass capacitor as close to the V pin and  
IN  
GND (Pin 5) is required.  
3532fc  
5
LTC3532  
U
U
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PI FU CTIO S  
SHDN/SS (Pin 8): Combined Soft-Start and Shutdown.  
Grounding this pin shuts down the IC. Tie to >1.5V to  
enable the IC and >2.4V to ensure the error amp is not  
clampedfromsoft-start.ForBurstModeoperation,thispin  
1.22V • R1+ R2  
(
)
VOUT  
=
R2  
V (Pin10): Error Amp Output: A frequency compensa-  
C
must be pulled up to within 0.5V of V . An RC from the  
IN  
tion network is connected from this pin to the FB pin to  
compensatetheloop.RefertotheApplicationsInformation  
section for component value selection.  
shutdown command signal to this pin will provide a soft-  
start function by limiting the rise time of the V pin.  
C
FB (Pin 9): Feedback Pin. Connect resistor divider tap  
Exposed Pad (Pin11): The exposed pad (DFN Package)  
must be soldered to PCB ground for electrical contact and  
rated thermal performance.  
here. The output voltage can be adjusted from 2.4V to  
5.25V. The feedback reference is typically 1.22V. Set V  
according to the formula:  
OUT  
W
BLOCK DIAGRA  
3
4
SW1  
SW2  
SW D  
V
V
OUT  
IN  
SW A  
7
6
GATE  
DRIVERS  
AND  
ANTICROSS  
CONDUCTION  
SW B  
SW C  
+
REVERSE  
AMP  
+
g
= 1/60k  
m
1A  
1.22V  
+
PEAK CURRENT  
LIMIT  
+
ERROR  
AMP  
+
FB  
9
1.1A  
V
C
PWM  
LOGIC  
PWM COMP  
10  
+
UVLO  
+
V
IN  
2.3V  
AUTOMATIC  
Burst Mode  
SLEEP  
CONTROL AND  
HOLD  
V
C
R
T
1
8
OSC  
BURST  
2
1.22V  
REF  
V
REF  
V
V
CC  
IN  
V
SS  
SHUTDOWN  
SOFT-START  
SHDN/SS  
THERMAL  
SHUTDOWN  
SHUTDOWN  
GND  
5
3532 BD  
3532fc  
6
LTC3532  
U
OPERATIO  
The LTC3532 provides high efficiency, low noise power  
for applications such as portable instrumentation, digital  
cameras, and MP3 players. The LTC proprietary topology  
allows input voltages above, below or equal to the output  
voltagebyproperlyphasingtheoutputswitches. Theerror  
cally 50ns. A second amplifier will begin to source current  
into the FB pin to drop the output voltage once the peak  
input current exceeds 1A typical. This method provides a  
closed loop means of clamping the input current. During  
conditions where V  
is near ground, such as during a  
OUT  
ampoutputvoltageonV determinestheoutputdutycycle  
short-circuit or during startup, this threshold is cut in half  
providing a fold back feature. For this current limit feature  
to be most effective, the Thevenin resistance from FB to  
ground should be greater than 100k.  
C
C
of the switches. Since V is a filtered signal, it provides  
rejectionoffrequencieswellbelowtheswitchingfrequency.  
The low R , low gate charge synchronous switches  
DS(ON)  
provide high frequency pulse width modulation control at  
high efficiency. Schottky diodes across the synchronous  
switch D and synchronous switch B are not required, but  
providealowervoltagedropduringthebreak-before-make  
time (typically 15ns). Schottky diodes will improve peak  
efficiencybytypically1%to2%.Highefficiencyisachieved  
at light loads when Burst Mode operation is entered and  
the IC’s quiescent current drops to a low 35μA.  
Reverse Current Limit  
Duringxedfrequencyoperation,theLTC3532operatesin  
forced continuous conduction mode. The reverse current  
limit amplifier monitors the inductor current from the out-  
put through switch D. Once the negative inductor current  
exceeds 340mA typical, the IC will shut off switch D.  
4-Switch Control  
LOW NOISE FIXED FREQUENCY OPERATION  
Figure1showsasimplifieddiagramofhowthefourinternal  
switchesareconnectedtotheinductor,V ,V  
andGND.  
Oscillator  
IN OUT  
Figure2showstheregionsofoperationfortheLTC3532as  
The frequency of operation is programmed by an external  
a function of the internal control voltage, V . Depending  
CI  
resistor from R to ground, according to the following  
T
on the control voltage, the IC will operate in either buck,  
equation:  
buck/boostorboostmode.TheV voltageisalevelshifted  
CI  
voltage from the output of the error amp (V ) (see Figure  
C
48,000  
f(kHz) =  
5). The four power switches are properly phased so the  
RT(kΩ)  
transfer between operating modes is continuous, smooth  
and transparent to the user. When V approaches V  
IN  
OUT  
Error Amp  
the buck/boost region is reached where the conduction  
time of the 4-switch region is typically 150ns. Referring  
to Figures 1 and 2, the various regions of operation will  
now be described.  
The error amplifier is a voltage mode amplifier. The loop  
compensation components are configured around the  
amplifier(fromFBtoV )toobtainstabilityoftheconverter.  
C
For improved bandwidth, an additional RC feedforward  
network can be placed across the upper feedback divider  
resistor. The voltage on SHDN/SS clamps the error amp  
V
V
IN  
OUT  
7
6
output, V , to provide a soft-start function.  
C
PMOS A  
PMOS D  
SW1  
3
SW2  
4
Internal Current Limit  
TherearetwodifferentcurrentlimitcircuitsintheLTC3532.  
They have internally fixed thresholds which vary inversely  
NMOS B  
NMOS C  
with V . The first circuit is a high speed peak current limit  
IN  
3532 F01  
comparatorthatwillshutoffswitchAifthecurrentexceeds  
1.1A typical. The delay to output of this amplifier is typi-  
Figure 1. Simplified Diagram of Output Switches  
3532fc  
7
LTC3532  
U
OPERATIO  
VOUT  
1– (150ns • f)  
88%  
MAX  
BOOST  
V =  
D
V4 (≈2.05V)  
IN  
A ON, B OFF  
PWM CD SWITCHES  
BOOST REGION  
D
MIN  
The point at which the 4-switch region ends is given by:  
V = V (1 – D) = V (1 – 150ns • f) V  
V3 (≈1.65V)  
V2 (≈1.55V)  
BOOST  
BUCK/BOOST REGION  
FOUR SWITCH PWM  
D
MAX  
IN  
OUT  
OUT  
BUCK  
D ON, C OFF  
PWM AB SWITCHES  
BUCK REGION  
Boost Region (V < V  
)
OUT  
IN  
V1 (≈0.9V)  
0%  
Switch A is always on and switch B is always off dur-  
ing this mode. When the internal control voltage, V , is  
DUTY  
CYCLE  
INTERNAL  
CONTROL  
VOLTAGE, V  
CI  
3532 F02  
above voltage V3, switch pair CD will alternately switch  
to provide a boosted output voltage. This operation is like  
a synchronous boost regulator. The maximum duty cycle  
of the converter is limited to 88% typical and is reached  
CI  
Figure 2. Switch Control vs Internal Control Voltage, VCI  
Buck Region (V > V  
)
IN  
OUT  
when V is above V4.  
CI  
Switch D is always on and switch C is always off dur-  
Burst Mode OPERATION  
ing this mode. When the internal control voltage, V , is  
CI  
above voltage V1, output A begins to switch. During the  
off-time of switch A, synchronous switch B turns on for  
the remainder of the time. Switches A and B will alternate  
like a typical synchronous buck regulator. As the control  
voltage increases, the duty cycle of switch A increases  
until the maximum duty cycle of the converter in buck  
Burst Mode operation occurs when the IC delivers energy  
to the output until it is regulated and then goes into a sleep  
mode where the outputs are off and the IC is consuming  
only 35μA of quiescent current from V . In this mode the  
IN  
output ripple has a variable frequency component that  
depends upon load current, and will typically be about  
2% peak-to-peak. Burst Mode operation ripple can be  
reduced slightly by using more output capacitance (47μF  
or greater). Another method of reducing Burst Mode  
operation ripple is to place a small feedforward capacitor  
mode reaches D  
, given by:  
MAX_BUCK  
D
= 100 – D4  
%
MAX_BUCK  
SW  
where D4 = duty cycle % of the 4-switch range.  
SW  
across the upper resistor in the V  
feedback divider  
OUT  
D4 = (150ns • f) • 100 %  
SW  
network (as in Type III compensation). During the period  
where the device is delivering energy to the output, the  
peak switch current will be equal to 250mA typical and  
the inductor current will terminate at zero current for each  
cycle. In this mode the typical maximum average output  
current is given by:  
where f = operating frequency, Hz.  
Beyond this point the “4-switch,” or buck/boost region  
is reached.  
Buck/Boost or 4-Switch (V ~ V  
)
OUT  
IN  
When the internal control voltage, V , is above voltage  
CI  
0.2 • V  
VOUT + V  
IN  
IOUT(MAX)BURST  
A
V2, switch pair AD remain on for duty cycle D  
,
MAX_BUCK  
IN  
and the switch pair AC begins to phase in. As switch pair  
AC phases in, switch pair BD phases out accordingly.  
When the V voltage reaches the edge of the buck/boost  
CI  
range, at voltage V3, the AC switch pair completely phase  
out the BD pair, and the boost phase begins at duty cycle  
D4 . The input voltage, V , where the 4-switch region  
SW  
IN  
begins is given by:  
3532fc  
8
LTC3532  
U
OPERATIO  
V
V
D
V
V
D
IN  
OUT  
IN  
OUT  
7
6
7
6
V
V
L
dI  
dt  
OUT  
L
+
dI  
dt  
IN  
A
A
≈ –  
L
L
+
250mA  
0mA  
250mA  
0mA  
3
4
3
4
SW1  
SW2  
SW1  
SW2  
B
B
C
C
3532 F04  
3532 F03  
T2  
T1  
5
5
GND  
GND  
Figure 3. Inductor Charge Cycle During Burst Mode Operation  
Figure 4. Inductor Disharge Cycle During Burst Mode Operation  
Note that the peak efficiency during Burst Mode operation  
is less than the peak efficiency during fixed frequency  
because the part enters full-time 4-switch mode (when  
servicing the output) with discontinuous inductor cur-  
rent as illustrated in Figures 3 and 4. During Burst Mode  
operation, the control loop is nonlinear and cannot utilize  
the control voltage from the error amp to determine the  
controlmode,thereforefull-time4-switchmodeisrequired  
to maintain the buck/boost function. The efficiency below  
1mA becomes dominated primarily by the quiescent cur-  
rent. The Burst Mode operation efficiency is given by:  
where R  
is in kΩ and I  
is the load transition  
BURST  
BURST  
current in Amps. For automatic operation, a filter capaci-  
tor should also be connected from BURST to ground to  
prevent ripple on BURST from causing the IC to oscillate  
in and out of Burst Mode operation. The equation for the  
minimum capacitor value is:  
COUT VOUT  
60,000V  
CBURST(MIN)  
where C  
and C are in μF. In the event that  
OUT  
BURST(MIN)  
a load transient causes the feedback pin to drop by more  
than 4% from the regulation value while in Burst Mode  
operation,theICwillimmediatelyswitchtoxedfrequency  
mode and an internal pull-up will be momentarily applied  
to BURST, rapidly charging the BURST capacitor. This  
prevents the IC from immediately reentering Burst Mode  
operation once the output achieves regulation.  
n ILOAD  
EFFICIENCY ≅  
35μA +ILOAD  
where n is typically 88% during Burst Mode operation.  
Automatic Burst Mode Operation Control  
Burst Mode operation can be automatic or manually con-  
trolled with a single pin. In automatic mode, the IC will  
enterBurstModeoperationatlightloadandreturntoxed  
frequency operation at heavier loads. The load current at  
which the mode transition occurs is programmed using  
a single external resistor from the BURST pin to ground,  
according to the following equations:  
Manual Burst Mode Operation  
For manual control of Burst Mode operation, the RC net-  
workconnectedtoBURSTcanbeeliminated.Toforcexed  
frequency mode, BURST should be connected to V . To  
force Burst Mode operation, BURST should be grounded.  
When commanding Burst Mode operation manually, the  
circuit connected to BURST should be able to sink up to  
2mA. For optimum transient response with large dynamic  
loads, the operating mode should be controlled manually  
by the host. By commanding fixed frequency operation  
priortoasuddenincreaseinload,outputvoltagedroopcan  
OUT  
10.5V  
Enter Burst Mode Operation: I =  
RBURST  
7V  
RBURST  
Leave Burst Mode Operation: I =  
3532fc  
9
LTC3532  
U
OPERATIO  
be minimized. Note that if the load current applied during  
forced Burst Mode operation (BURST pin is grounded)  
exceedsthecurrentthatcanbesupplied,theoutputvoltage  
will start to droop and the IC will automatically come out  
of Burst Mode operation and enter fixed frequency mode,  
incorporates an active clamp circuit that holds the voltage  
on V at an optimal voltage during Burst Mode operation.  
C
This minimizes any output transient when returning to  
fixed frequency mode operation. For optimum transient  
response, Type 3 compensation is also recommended  
to broad band the control loop and roll off past the two  
pole response of the output LC filter. (See Closing the  
Feedback Loop.)  
raising V . Once regulation is achieved, the IC will then  
OUT  
enter Burst Mode operation once again, and the cycle will  
repeat,resultinginabout4%outputripple.NotethatBurst  
Mode operation is inhibited during soft-start.  
Soft-Start  
Burst Mode Operation to Fixed Frequency Transient  
Response  
The soft-start function is combined with shutdown. When  
the SHDN/SS pin is brought above 1V typical, the IC is  
enabled but the EA duty cycle is clamped from V . A de-  
C
In Burst Mode operation, the compensation network is  
tailed diagram of this function is shown in Figure 5. The  
not used and V is disconnected from the error amplifier.  
C
components R and C provide a slow ramping voltage  
SS  
SS  
During long periods of Burst Mode operation, leakage  
currents in the external components or on the PC board  
could cause the compensation capacitor to charge (or  
discharge), which could result in a large output transient  
whenreturningtoxedfrequencymodeofoperation,even  
at the same load current. To prevent this, the LTC3532  
on SHDN/SS to provide a soft-start function. To ensure  
that V is not being clamped, SHDN/SS must be raised  
C
above 2.4V. To enable Burst Mode operation, SHDN/SS  
must be raised to within 0.5V of V .  
IN  
V
IN  
ERROR AMP  
15μA  
V
OUT  
1.22V  
+
R1  
FB  
9
C
P1  
R2  
V
C
SOFT-START  
CLAMP  
10  
V
CI  
TO PWM  
COMPARATORS  
SHDN/SS  
R
SS  
ENABLE SIGNAL  
8
3532 F05  
C
SS  
+
CHIP  
ENABLE  
1V  
Figure 5. Soft-Start Circuitry  
3532fc  
10  
LTC3532  
U
W U U  
APPLICATIO S I FOR ATIO  
peak inductor currents in the 1A to 2A region. To minimize  
radiated noise, use a shielded inductor. See Table 1 for a  
suggested list of inductor suppliers.  
R
V
C
1
2
3
4
5
10  
9
T
LTC3532  
BURST  
SW1  
FB  
SHDN/SS  
8
Table 1. Inductor Vendor Information  
SW2  
V
7
IN  
SUPPLIER  
Coilcraft  
Murata  
Sumida  
TDK  
WEB SITE  
www.coilcraft.com  
www.murata.com  
www.sumida.com  
www.component.tdk.com  
www.tokoam.com  
6
GND  
V
OUT  
GND  
3532 F06  
TOKO  
Figure 6. Recommended Component Placement. Traces Carrying  
High Current are Direct. Trace area at FB and VC Pins are Kept  
Low. Lead Length to Battery Should be Kept Short  
Output Capacitor Selection  
The bulk value of the output filter capacitor is set to reduce  
the ripple due to charge into the capacitor each cycle. The  
steady state ripple due to charge is given by:  
Inductor Selection  
The high frequency operation of the LTC3532 allows the  
use of small surface mount inductors. The inductor ripple  
current is typically set to 20% to 40% of the maximum  
inductor current. For a given ripple the inductance terms  
are given as follows:  
% RIPPLE_BOOST =  
IOUT(MAX) (VOUT VIN(MIN)) • 100  
%
2
COUT VOUT • f  
% RIPPLE_BUCK =  
V
IN(MIN) (VOUT – V  
)
IN(MIN)  
LBOOST  
>
H
(VIN(MAX) VOUT ) • 100%  
f • ΔIL VOUT  
1
8LCf2  
V
IN(MAX)  
VOUT (VIN(MAX) VOUT  
)
LBUCK  
>
H
f • ΔIL • V  
IN(MAX)  
where C  
= output filter capacitor in Farads and  
OUT  
f = switching frequency in Hz.  
where f = Operating frequency, Hz  
ΔIL = Maximum allowable inductor ripple current, A  
The output capacitance is usually many times larger than  
theminimumvalueinordertohandlethetransientresponse  
requirements of the converter. As a rule of thumb, the ratio  
of the operating frequency to the unity-gain bandwidth of  
the converter is the amount the output capacitance will  
have to increase from the above calculations in order to  
maintain the desired transient response.  
V
V
V
= Minimum input voltage  
= Maximum input voltage  
IN(MIN)  
IN(MAX)  
= Output voltage  
OUT  
I
= Maximum output load current  
OUT(MAX)  
The other component of ripple is due to the ESR (equiva-  
lent series resistance) of the output capacitor. Low ESR  
capacitors should be used to minimize output voltage  
ripple. For surface mount applications, Taiyo Yuden or  
TDK ceramic capacitors, AVX TPS series tantalum capaci-  
tors or Sanyo POSCAP are recommended. See Table 2 for  
contact information.  
For high efficiency, choose a ferrite inductor with a high  
frequency core material to reduce core losses. The induc-  
tor should have low ESR (equivalent series resistance) to  
reducetheI2Rlosses, andmustbeabletohandlethepeak  
inductorcurrentwithoutsaturating.Moldedchokesorchip  
inductors usually do not have enough core to support the  
3532fc  
11  
LTC3532  
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APPLICATIO S I FOR ATIO  
Table 2. Capacitor Vendor Information  
Operating Frequency Selection  
SUPPLIER  
AVX  
WEB SITE  
Higher operating frequencies allow the use of a smaller  
inductor and smaller input and output filter capacitors,  
thus reducing board area and component height. How-  
ever, higher operating frequencies also increase the IC’s  
total quiescent current due to the gate charge of the four  
switches, as given by:  
www.avxcorp.com  
www.murata.com  
www.sanyovideo.com  
www.t-yuden.com  
www.component.tdk.com  
Murata  
Sanyo  
Taiyo Yuden  
TDK  
Buck: I = (0.125 • V • f) mA  
Input Capacitor Selection  
Q
IN  
Boost: I = [0.06 • (V + V ) • f] mA  
Q
IN  
OUT  
Since V is the supply voltage for the IC, as well as the  
IN  
Buck/Boost: I = [f • (0.19 • V + 0.06 • V )] mA  
Q
IN  
OUT  
inputtothepowerstageoftheconverter,itisrecommended  
wheref=switchingfrequencyinMHz.Thereforefrequency  
selection is a compromise between the optimal efficiency  
and the smallest solution size.  
to place at least a 4.7μF, low ESR ceramic bypass capaci-  
tor close to the V and GND pins. It is also important to  
IN  
minimize any stray resistance from the converter to the  
battery or other power source.  
Closing the Feedback Loop  
The LTC3532 incorporates voltage mode PWM control.  
The control to output gain varies with operation region  
(buck, boost, buck/boost), but is usually no greater than  
15. The output filter exhibits a double pole response, as  
given by:  
Optional Schottky Diodes  
The Schottky diodes across the synchronous switches  
B and D are not required (V  
< 4.3V), but provide a  
OUT  
lower drop during the break-before-make time (typically  
15ns) improving efficiency. Use a surface mount Schottky  
diode such as an MBRM120T3 or equivalent. Do not use  
ordinary rectifier diodes, since the slow recovery times  
will compromise efficiency. For applications with an  
output voltage above 4.3V, a Schottky diode is required  
1
fFILTER  
=
Hz  
POLE  
2 • π • L • COUT  
(in buck mode)  
fFILTER  
from SW2 to V  
.
OUT  
V
IN  
=
Hz  
POLE  
Output Voltage > 4.3V  
2 • VOUT π • L • COUT  
A Schottky diode from SW2 to V  
is required for output  
OUT  
(in boost mode)  
where L is in henrys and C  
voltages over 4.3V. The diode must be located as close to  
the pins as possible in order to reduce the peak voltage on  
SW2 due to the parasitic lead and trace inductance.  
is in farads.  
OUT  
The output filter zero is given by:  
Input Voltage > 4.5V  
1
fFILTER  
=
Hz  
ZERO  
2 • π RESR • COUT  
For applications with input voltages above 4.5V which  
could exhibit an overload or short-circuit condition, a  
2Ω/1nF series snubber is required between SW1 and  
where R  
is the equivalent series resistance of the  
ESR  
output capacitor.  
GND. A Schottky diode from SW1 to V should also be  
IN  
added as close to the pins as possible. For the higher input  
Atroublesomefeatureinboostmodeistheright-halfplane  
zero (RHP), given by:  
voltages, V bypassing becomes more critical; therefore,  
IN  
a ceramic bypass capacitor as close to the V and SGND  
IN  
2
V
pins as possible is also required.  
IN  
fRHPZ  
=
Hz  
2 • π IOUT L • VOUT  
3532fc  
12  
LTC3532  
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APPLICATIO S I FOR ATIO  
The loop gain is typically rolled off before the RHP zero  
frequency.  
the output filter. Referring to Figure 8, the location of the  
poles and zeros are given by:  
A simple Type I compensation network can be incorpo-  
rated to stabilize the loop, but at a cost of reduced band-  
width and slower transient response. To ensure proper  
phase margin using Type I compensation, the loop must  
be crossed over a decade before the LC double pole.  
The unity-gain frequency of the error amplifier with the  
Type I compensation is given by:  
1
fPOLE1  
Hz  
2 • π • 32e3 R1• CP1  
(which is extremely close to DC)  
1
fZERO1  
fZERO2  
fPOLE2  
=
=
=
Hz  
Hz  
Hz  
2 • π RZ • CP1  
1
1
fUG  
=
Hz  
2 • π R1CP1  
2 • π R1• CZ1  
1
referring to Figure 7.  
2 • π RZ • CP2  
Mostapplicationsdemandanimprovedtransientresponse  
toallowasmalleroutputltercapacitor.Toachieveahigher  
bandwidth, Type III compensation is required, providing  
two zeros to compensate for the double-pole response of  
where resistance is in ohms and capacitance is in far-  
ads.  
V
OUT  
1.22V  
+
C
Z1  
R1  
ERROR  
AMP  
V
OUT  
FB  
9
1.22V  
+
ERROR  
AMP  
R1  
FB  
9
C
R2  
P1  
V
C
R
Z
10  
C
C
P2  
R2  
P1  
V
C
3532 F08  
10  
3532 F07  
Figure 7. Error Amplifier with Type l Compensation  
Figure 8. Error Amplifier with Type lll Compensation  
3532fc  
13  
LTC3532  
U
TYPICAL APPLICATIO S  
Three Cell to 3.3V at 300mA Buck-Boost Converter  
With Automatic Burst Mode Operation and Soft-Start  
V
OUT  
L1  
4.7μH  
3.3V  
300mA  
R1  
340k  
R9  
1k  
SW1  
SW2  
SW1  
SW2  
V
IN  
2.7V TO 4.5V  
V
V
IN  
OUT  
FB  
SHDN  
BURST  
FB  
SHDN/SS  
LTC3532  
R7  
200k  
C4  
150pF  
VC  
BURST  
VC  
R6  
12.1k  
R
T
C2  
150pF  
R
GND  
T
C3  
22μF  
C1  
4.7μF  
0.01μF  
R2  
200k  
C5  
4.7nF  
200k  
R4  
86.6k  
3532 TA02  
Li-Ion to 5V Boost Converter with Output Disconnect  
D1  
L1  
2.2μH  
DMBRM 110LT3  
V
OUT  
5V  
300mA  
R1  
412k  
R9  
1k  
SW1  
SW2  
FB  
SW1  
SW2  
V
IN  
2.5V TO 4.2V  
V
IN  
V
OUT  
FB  
SHDN  
SHDN/SS  
LTC3532  
R7  
200k  
C4  
68pF  
V
C
BURST  
BURST  
V
C
R6  
12.1k  
R
C2  
220pF  
T
R
GND  
T
C3  
10μF  
C1  
4.7μF  
R4  
28.7k  
R2  
133k  
C5  
4.7nF  
SD  
3532 TA03  
3532fc  
14  
LTC3532  
U
PACKAGE DESCRIPTIO  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
R = 0.115  
0.38 ± 0.10  
TYP  
6
10  
0.675 ±0.05  
3.50 ±0.05  
2.15 ±0.05 (2 SIDES)  
1.65 ±0.05  
3.00 ±0.10  
(4 SIDES)  
1.65 ± 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
PACKAGE  
OUTLINE  
(DD) DFN 1103  
5
1
0.25 ± 0.05  
0.50 BSC  
0.75 ±0.05  
0.200 REF  
0.25 ± 0.05  
0.50  
BSC  
2.38 ±0.10  
(2 SIDES)  
2.38 ±0.05  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
MS Package  
10-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1661 Rev E)  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 3)  
0.497 ± 0.076  
(.0196 ± .003)  
0.889 ± 0.127  
(.035 ± .005)  
10 9  
8
7 6  
REF  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 4)  
5.23  
(.206)  
MIN  
4.90 ± 0.152  
(.193 ± .006)  
3.20 – 3.45  
(.126 – .136)  
DETAIL “A”  
0° – 6° TYP  
0.254  
(.010)  
GAUGE PLANE  
0.50  
(.0197)  
BSC  
0.305 ± 0.038  
(.0120 ± .0015)  
TYP  
1
2
3
4 5  
0.53 ± 0.152  
(.021 ± .006)  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
RECOMMENDED SOLDER PAD LAYOUT  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.17 – 0.27  
(.007 – .011)  
TYP  
0.1016 ± 0.0508  
(.004 ± .002)  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
0.50  
(.0197)  
BSC  
MSOP (MS) 0307 REV E  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
3532fc  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  
LTC3532  
U
TYPICAL APPLICATIO  
Low Profile Li-Ion to 3.3V at 300mA Converter with Automatic Burst Mode Operation  
V
OUT  
L1  
2.2μH  
3.3V  
300mA  
R1  
340k  
R9  
1k  
SW1  
SW2  
FB  
SW1  
SW2  
V
IN  
2.5V TO 4.2V  
V
V
IN  
OUT  
FB  
SHDN/SS  
LTC3532  
C4  
68pF  
BURST  
V
C
BURST  
V
C
R6  
12.1k  
R
T
C2  
220pF  
R
GND  
T
C3  
10μF  
R3  
200k  
R4  
28.7k  
R2  
200k  
C1  
4.7μF  
C5  
0.01μF  
L1: COILCRAFT LPO6610-222M  
3532 TA04  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC3440  
600mA I , 2MHz, Synchronous Buck- V : 2.5V to 5.5V, V  
: 2.5V to 5.5V, I = 25μA, I = <1μA, MS10/DFN Package  
Q SD  
OUT  
IN  
OUT(RANGE)  
OUT(RANGE)  
OUT(RANGE)  
OUT(RANGE)  
OUT(RANGE)  
Boost DC/DC Converter  
LTC3441  
LTC3442  
LTC3443  
LTC3444  
1.2A I , 1MHz, Synchronous Buck-  
V : 2.4V to 5.5V, V  
IN  
: 2.4V to 5.25V, I = 25μA, I = <1μA, DFN Package  
Q SD  
OUT  
Boost DC/DC Converter  
1.2A I , 2MHz, Synchronous Buck-  
V : 2.4V to 5.5V, V  
IN  
: 2.4V to 5.25V, I = 35μA, I = <1μA, DFN Package  
Q SD  
OUT  
Boost DC/DC Converter  
1.2A I , 600kHz, Synchronous Buck- V : 2.4V to 5.5V, V  
: 2.4V to 5.25V, I = 28μA, I = <1μA, MS10 Package  
Q SD  
OUT  
IN  
Boost DC/DC Converter  
500mA I , 1.5MHz, Synchronous  
V : 2.7V to 5.5V, V  
IN  
: 0.5V to 5.25V, I = <1μA, 3 × 3 DFN Package  
SD  
OUT  
Buck-Boost DC/DC Converter Optimized  
for WCDMA  
LTC3531/  
LTC3531-3.3/  
LTC3531-3  
200mA I , Synchronous Buck-Boost  
V : 1.8V to 5.5V, V  
: 2V to 5.25V, I = 16μA, I = <1μA, SOT-23 and 3 × 3 DFN  
OUT(RANGE) Q SD  
OUT  
IN  
DC/DC Converters in SOT-23  
Packages  
3532fc  
LT 0308 REV C • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
16  
© LINEAR TECHNOLOGY CORPORATION 2006  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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