LTC3532EDD#PBF [Linear]
LTC3532 - Micropower Synchronous Buck-Boost DC/DC Converter; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C;型号: | LTC3532EDD#PBF |
厂家: | Linear |
描述: | LTC3532 - Micropower Synchronous Buck-Boost DC/DC Converter; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C 转换器 |
文件: | 总16页 (文件大小:351K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3532
Micropower Synchronous
Buck-Boost DC/DC Converter
U
DESCRIPTIO
FEATURES
The LTC®3532 is a high efficiency, fixed frequency, buck-
boost DC/DC converter that operates from input voltages
above, below or equal to the output voltage. The topology
incorporated in the IC provides a continuous transfer
function through all operating modes, making the product
ideal for single lithium-ion, multicell alkaline or NiMH ap-
plications where the output voltage is within the battery
voltage range.
■
Single Inductor
■
Regulated Output with Input Voltages Above, Below
or Equal to the Output
■
Wide V Range: 2.4V to 5.5V
IN
■
■
■
■
V
OUT
Range: 2.4V to 5.25V
Up to 500mA Peak Output Current
Synchronous Rectification: Up to 95% Efficiency
Manual or Programmable Automatic Burst Mode®
Operation
Output Disconnect in Shutdown
Programmable Oscillator: 300kHz to 2MHz
Pin Compatible with LTC3440
The device includes two 0.36Ω N-channel MOSFET
switches and two 0.42Ω P-channel switches. Switching
frequencies up to 2MHz are programmed with an external
resistor. Quiescent current is only 35μA in Burst Mode
operation, maximizing battery life in portable applica-
tions. Automatic Burst Mode operation allows the user
to program the load current for Burst Mode operation or
to control it manually.
■
■
■
■
Small Thermally Enhanced 10-Lead (3mm × 3mm)
DFN and 10-Lead MSOP Packages
U
APPLICATIO S
Other features include a 1μA shutdown, soft-start control,
■
Miniature Hard Disk Drive Power Supply
thermal shutdown, and peak current limit. The LTC3532 is
available in a low profile (0.75mm) 10-lead (3mm × 3mm)
DFN and 10-lead MSOP packages.
■
MP3 Players
■
Handheld Instruments
■
Digital Cameras
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
■
Handheld Terminals
U
TYPICAL APPLICATIO
Miniature Hard Disk Drive Power Supply
V
OUT
3.3V
4.7μH
V
OUT
100mA
TO 500mA
(PEAK)
200mV/DIV
340k
1k
SW2
SW1
V
IN
V
Li-Ion
V
OUT
FB
IN
2.5V TO 4.2V
SHDN/SS
BURST
LTC3532
33pF
I
12.1k
LOAD
100mA/DIV
V
C
220pF
R
GND
T
3532 TA01b
100μs/DIV
V
V
LOAD
= 3V
IN
200k
43.2k
200k
10μF
= 3.3V
OUT
I
= 50mA TO 300mA
4.7μF
0.01μF
3532 TA01
3532fc
1
LTC3532
W W U W
(Note 1)
ABSOLUTE AXI U RATI GS
Maximum Junction Temperature (Note 4)............. 125°C
Storage Temperature Range
BURST, V , V , V , FB –0.3V to 6V
...................................
IN OUT
C
R ..................................................................... 0V to 5V
T
DD ..................................................... –65°C to 125°C
MSOP ................................................ –65°C to 150°C
Lead Temperature (Soldering,10 sec)
SHDN/SS ..................................................... –0.3V to 6V
SW1, SW2
DC............................................................ –0.3V to 6V
Pulsed < 100ns........................................ –0.3V to 7V
Operating Temperature Range (Note 2).... –40°C to 85°C
MSOP ............................................................... 300°C
U
U
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PI CO FIGURATIO
TOP VIEW
TOP VIEW
R
1
2
3
4
5
10
9
V
T
C
R
1
2
3
4
5
10
V
C
T
BURST
SW1
FB
BURST
SW1
9
8
7
6
FB
SHDN/SS
8
SHDN/SS
V
V
SW2
GND
7
6
11
IN
OUT
SW2
V
V
IN
MS PACKAGE
10-LEAD PLASTIC MSOP
= 125°C
= 130°C/W 1 LAYER BOARD
= 100°C/W 4 LAYER BOARD
GND
OUT
T
JMAX
DD PACKAGE
θ
JA
JA
10-LEAD (3mm × 3mm) PLASTIC DFN
= 125°C, θ = 43°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE CONNECTED TO PCB
θ
T
JMAX
JA
θ
= 45°C/W
JC
U
W
U
ORDER I FOR ATIO
LEAD FREE FINISH
LTC3532EDD#PBF
LTC3532EMS#PBF
TAPE AND REEL
PART MARKING
LBXR
PACKAGE DESCRIPTION
TEMPERATURE RANGE
–40°C to 85°C
LTC3532EDD#TRPBF
LTC3532EMS#TRPBF
10-Lead (3mm × 3mm) Plastic DFN
10-Lead Plastic MSOP
LTBXS
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 64.9k, unless otherwise specified.
PARAMETER
CONDITIONS
MIN
TYP
MAX
2.4
5.5
5.25
1.25
50
UNITS
V
●
●
●
●
Input Start-Up Voltage
Input Operating Range
Output Voltage Adjust Range
Feedback Voltage
2.3
2.4
2.4
V
V
1.19
1.22
1
V
Feedback Input Current
Quiescent Current, Burst Mode Operation
Quiescent Current, Shutdown
Quiescent Current, Active
NMOS Switch Leakage
VFB = 1.22V
nA
μA
μA
μA
BURST = 0V
35
60
SHDN = 0V, Not Including Switch Leakage, V
= 0V
0.1
600
0.1
1
OUT
V = 0V, BURST = V (Note 3)
1000
5
IN
C
Switches B and C
μA
3532fc
2
LTC3532
ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 64.9k, unless otherwise specified.
PARAMETER
CONDITIONS
MIN
TYP
0.1
MAX
UNITS
μA
Ω
PMOS Switch Leakage
NMOS Switch On Resistance
PMOS Switch On Resistance
Input Current Limit
Switches A and D
Switches B and C
Switches A and D
10
0.36
0.42
1.1
Ω
0.8
1.45
A
●
●
Maximum Duty Cycle
Boost (% Switch C On)
Buck (% Switch A On)
70
100
88
%
%
●
●
Minimum Duty Cycle
Frequency Accuracy
Burst Threshold (Falling)
Burst Threshold (Rising)
Burst Current Ratio
0
%
kHz
V
575
740
0.88
1.12
8000
90
885
V
Ratio of IOUT to IBURST
Error Amp AVOL
dB
μA
μA
Error Amp Source Current
Error Amp Sink Current
SHDN/SS Threshold
V = 1.4V
C
15
V = 2V
C
310
●
When IC is Enabled
When EA is at Maximum Boost Duty Cycle
0.4
1
2.2
1.5
1
V
V
SHDN/SS Input Current
VSHDN = 5.5V
0.01
μA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3532E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlations
with statistical process controls.
Note 3: Current measurements are performed when the outputs are not
switching.
Note 4: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
U W
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C, unless otherwise specified.
Fixed Frequency and Burst Mode
Quiescent Current vs VIN
Efficiency and Power Loss
vs Load Autoburst Mode
Efficiency and Power Loss
vs Load
100
1000
100
100
1000
100
10
80
3.0
2.5
75
70
65
60
55
50
45
40
EFFICIENCY
90 BURST EFFICIENCY
80
90
80
2000kHz
1500kHz
2.0
1.5
1000kHz
10
1
70
70
60
POWER LOSS
FIXED FREQUENCY
POWER LOSS
1
BURST
60
1.0
0.5
0
POWER LOSS
0.1
500kHz
3V
3.6V
4.2V
50
50
40
FIXED FREQUENCY
NOT SWITCHING
4.5
BURST MODE
2.5 3.5
V
= 3.3V
1
EFFICIENCY
OUT
40
0.1
0.1
1000
0.01
1000
1
10
100
5.5
0.1
10
100
LOAD CURRENT (mA)
LOAD CURRENT (mA)
V
(V)
IN
3532 G02
3532 G01
3532 G03
3532fc
3
LTC3532
U W
TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C, unless otherwise specified.
Peak Current Clamp and Limit
vs VIN
Automatic Burst Threshold
vs RBURST
Efficiency vs Frequency
70
60
100
98
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
96
94
92
I
LIMIT
50
40
I
CLAMP
90
88
LEAVE BURST
ENTER BURST
30
20
10
86
84
82
80
V
V
= 3.6V
V
V
= 3.3V
250
IN
OUT
OUT
IN
V
= 3.3V
= 3.3V
= 3.6V
OUT
550
500
1500
1000
FREQUENCY (kHz)
2000
2.4
3.4
4.4
5.4
150
350
450
BURST RESISTOR (kΩ)
V
(V)
IN
3532 G06
3532 G04
3532 G05
Load Transient Response in
Fixed Frequency Mode
Frequency vs Temperature
Feedback Voltage vs Temperature
1200
1150
1100
1050
1000
950
1.241
1.236
1.231
1.226
1.221
1.216
1.211
1.206
1.201
V
OUT
200mV/DIV
I
LOAD
100mA/DIV
900
3535 G09
100μs/DIV
850
C
V
V
= 10μF
= 3.3V
OUT
V
= 3.6V
IN
= 3.6V
IN
800
1.196
OUT
–5
–55
45
95
–55
–5
TEMPERATURE (°C)
95
45
TEMPERATURE (°C)
3532 G07
3532 G08
Switch Pins Before Entering
Boost Mode
Burst Mode to Fixed Frequency
Transition
Switch Pins in Buck-Boost Mode
SW1
2V/DIV
V
SW1
2V/DIV
OUT
200mV/DIV
BURST PIN
2V/DIV
SW2
2V/DIV
SW2
2V/DIV
3532 G10
3532 G11
3532 G12
400μs/DIV
40ns/DIV
40ns/DIV
C
V
V
= 22μF
= 3.3V
V
V
I
= 3.3V
V
V
I
= 2.9V
OUT
IN
OUT
IN
OUT
IN
OUT
= 3.6V
= 3.3V
= 3.3V
= 100mA
= 100mA
LOAD
LOAD
3532fc
4
LTC3532
U W
TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C, unless otherwise specified.
Switch Pins Before Entering
Buck Mode
Output Ripple at 100mA Load
Burst Mode, Boost
SW1
SW1
2VDIV
V
V
= 2.4V
= 3.6V
IN
IN
5V/DIV
V
OUT
50mV/DIV
SW2
5V/DIV
V
OUT
50mV/DIV
SW2
2VDIV
V
OUT
V
= 4.5V
100mV/DIV
IN
V
OUT
INDUCTOR
CURRENT
500mA/DIV
50mV/DIV
3535 G13
3535 G15
3535 G14
40ns/DIV
4μs/DIV
400ns/DIV
V
= 4V
V
V
I
= 2.4V
V
= 3.6V
= 100mA
= 10μF
IN
IN
OUT
OUT
OUT
VOUT = 3.3V
= 100mA
= 3.3V
= 20mA
= 22μF
I
I
C
LOAD
LOAD
OUT
C
OUT
Burst Mode, Buck-Boost
Burst Mode, Buck
SW1
5V/DIV
SW1
5V/DIV
SW2
5V/DIV
SW2
5V/DIV
V
OUT
V
100mV/DIV
OUT
100mV/DIV
INDUCTOR
CURRENT
500mA/DIV
INDUCTOR
CURRENT
500mA/DIV
3535 G17
340612 G16
4μs/DIV
4μs/DIV
V
V
I
= 4.2V
V
V
I
= 3.75V
= 3.3V
IN
OUT
IN
OUT
= 3.3V
= 20mA
= 22μF
= 20mA
= 22μF
LOAD
LOAD
C
C
OUT
OUT
U
U
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PI FU CTIO S
RT (Pin 1): Timing Resistor to Program the Oscillator
Frequency. The programming range is 300kHz to 2MHz.
An optional Schottky diode can be connected from SW1
to ground. Minimize trace length to minimize EMI.
SW2 (Pin 4): Switch Pin Where the Internal Switches C
48,000
f(kHz) =
andDareConnected.Forapplicationswithoutputvoltages
RT(kΩ)
over 4.3V, a Schottky diode is required from SW2 to V
to ensure SW2 does not exhibit excess voltage.
OUT
BURST (Pin 2): Used to Set the Automatic Burst Mode Op-
erationThreshold. Placearesistorandcapacitorinparallel
from this pin to ground. See the Applications Information
sectionforcomponentvalueselection.Formanualcontrol,
ground the pin to force Burst Mode operation, connect to
GND (Pin 5): Signal and Power Ground for the IC.
V
(Pin 6): Output of the Synchronous Rectifier. A filter
OUT
capacitor is placed from V
to GND.
OUT
V (Pin 7): Input Supply Pin. Supplies current to the
IN
V
to force fixed frequency mode.
OUT
inductor through SW1 and supplies internal V for the
CC
SW1 (Pin 3): Switch Pin Where the Internal Switches A
and B are Connected. Connect inductor from SW1 to SW2.
IC. A ceramic bypass capacitor as close to the V pin and
IN
GND (Pin 5) is required.
3532fc
5
LTC3532
U
U
U
PI FU CTIO S
SHDN/SS (Pin 8): Combined Soft-Start and Shutdown.
Grounding this pin shuts down the IC. Tie to >1.5V to
enable the IC and >2.4V to ensure the error amp is not
clampedfromsoft-start.ForBurstModeoperation,thispin
1.22V • R1+ R2
(
)
VOUT
=
R2
V (Pin10): Error Amp Output: A frequency compensa-
C
must be pulled up to within 0.5V of V . An RC from the
IN
tion network is connected from this pin to the FB pin to
compensatetheloop.RefertotheApplicationsInformation
section for component value selection.
shutdown command signal to this pin will provide a soft-
start function by limiting the rise time of the V pin.
C
FB (Pin 9): Feedback Pin. Connect resistor divider tap
Exposed Pad (Pin11): The exposed pad (DFN Package)
must be soldered to PCB ground for electrical contact and
rated thermal performance.
here. The output voltage can be adjusted from 2.4V to
5.25V. The feedback reference is typically 1.22V. Set V
according to the formula:
OUT
W
BLOCK DIAGRA
3
4
SW1
SW2
SW D
V
V
OUT
IN
SW A
7
6
GATE
DRIVERS
AND
ANTICROSS
CONDUCTION
SW B
SW C
–
+
REVERSE
AMP
+
g
= 1/60k
m
–
1A
1.22V
+
–
PEAK CURRENT
LIMIT
–
+
ERROR
AMP
+
–
FB
9
1.1A
V
C
PWM
LOGIC
PWM COMP
10
–
+
UVLO
+
–
V
IN
2.3V
AUTOMATIC
Burst Mode
SLEEP
CONTROL AND
HOLD
V
C
R
T
1
8
OSC
BURST
2
1.22V
REF
V
REF
V
V
CC
IN
V
SS
SHUTDOWN
SOFT-START
SHDN/SS
THERMAL
SHUTDOWN
SHUTDOWN
GND
5
3532 BD
3532fc
6
LTC3532
U
OPERATIO
The LTC3532 provides high efficiency, low noise power
for applications such as portable instrumentation, digital
cameras, and MP3 players. The LTC proprietary topology
allows input voltages above, below or equal to the output
voltagebyproperlyphasingtheoutputswitches. Theerror
cally 50ns. A second amplifier will begin to source current
into the FB pin to drop the output voltage once the peak
input current exceeds 1A typical. This method provides a
closed loop means of clamping the input current. During
conditions where V
is near ground, such as during a
OUT
ampoutputvoltageonV determinestheoutputdutycycle
short-circuit or during startup, this threshold is cut in half
providing a fold back feature. For this current limit feature
to be most effective, the Thevenin resistance from FB to
ground should be greater than 100k.
C
C
of the switches. Since V is a filtered signal, it provides
rejectionoffrequencieswellbelowtheswitchingfrequency.
The low R , low gate charge synchronous switches
DS(ON)
provide high frequency pulse width modulation control at
high efficiency. Schottky diodes across the synchronous
switch D and synchronous switch B are not required, but
providealowervoltagedropduringthebreak-before-make
time (typically 15ns). Schottky diodes will improve peak
efficiencybytypically1%to2%.Highefficiencyisachieved
at light loads when Burst Mode operation is entered and
the IC’s quiescent current drops to a low 35μA.
Reverse Current Limit
Duringfixedfrequencyoperation,theLTC3532operatesin
forced continuous conduction mode. The reverse current
limit amplifier monitors the inductor current from the out-
put through switch D. Once the negative inductor current
exceeds 340mA typical, the IC will shut off switch D.
4-Switch Control
LOW NOISE FIXED FREQUENCY OPERATION
Figure1showsasimplifieddiagramofhowthefourinternal
switchesareconnectedtotheinductor,V ,V
andGND.
Oscillator
IN OUT
Figure2showstheregionsofoperationfortheLTC3532as
The frequency of operation is programmed by an external
a function of the internal control voltage, V . Depending
CI
resistor from R to ground, according to the following
T
on the control voltage, the IC will operate in either buck,
equation:
buck/boostorboostmode.TheV voltageisalevelshifted
CI
voltage from the output of the error amp (V ) (see Figure
C
48,000
f(kHz) =
5). The four power switches are properly phased so the
RT(kΩ)
transfer between operating modes is continuous, smooth
and transparent to the user. When V approaches V
IN
OUT
Error Amp
the buck/boost region is reached where the conduction
time of the 4-switch region is typically 150ns. Referring
to Figures 1 and 2, the various regions of operation will
now be described.
The error amplifier is a voltage mode amplifier. The loop
compensation components are configured around the
amplifier(fromFBtoV )toobtainstabilityoftheconverter.
C
For improved bandwidth, an additional RC feedforward
network can be placed across the upper feedback divider
resistor. The voltage on SHDN/SS clamps the error amp
V
V
IN
OUT
7
6
output, V , to provide a soft-start function.
C
PMOS A
PMOS D
SW1
3
SW2
4
Internal Current Limit
TherearetwodifferentcurrentlimitcircuitsintheLTC3532.
They have internally fixed thresholds which vary inversely
NMOS B
NMOS C
with V . The first circuit is a high speed peak current limit
IN
3532 F01
comparatorthatwillshutoffswitchAifthecurrentexceeds
1.1A typical. The delay to output of this amplifier is typi-
Figure 1. Simplified Diagram of Output Switches
3532fc
7
LTC3532
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OPERATIO
VOUT
1– (150ns • f)
88%
MAX
BOOST
V =
D
V4 (≈2.05V)
IN
A ON, B OFF
PWM CD SWITCHES
BOOST REGION
D
MIN
The point at which the 4-switch region ends is given by:
V = V (1 – D) = V (1 – 150ns • f) V
V3 (≈1.65V)
V2 (≈1.55V)
BOOST
BUCK/BOOST REGION
FOUR SWITCH PWM
D
MAX
IN
OUT
OUT
BUCK
D ON, C OFF
PWM AB SWITCHES
BUCK REGION
Boost Region (V < V
)
OUT
IN
V1 (≈0.9V)
0%
Switch A is always on and switch B is always off dur-
ing this mode. When the internal control voltage, V , is
DUTY
CYCLE
INTERNAL
CONTROL
VOLTAGE, V
CI
3532 F02
above voltage V3, switch pair CD will alternately switch
to provide a boosted output voltage. This operation is like
a synchronous boost regulator. The maximum duty cycle
of the converter is limited to 88% typical and is reached
CI
Figure 2. Switch Control vs Internal Control Voltage, VCI
Buck Region (V > V
)
IN
OUT
when V is above V4.
CI
Switch D is always on and switch C is always off dur-
Burst Mode OPERATION
ing this mode. When the internal control voltage, V , is
CI
above voltage V1, output A begins to switch. During the
off-time of switch A, synchronous switch B turns on for
the remainder of the time. Switches A and B will alternate
like a typical synchronous buck regulator. As the control
voltage increases, the duty cycle of switch A increases
until the maximum duty cycle of the converter in buck
Burst Mode operation occurs when the IC delivers energy
to the output until it is regulated and then goes into a sleep
mode where the outputs are off and the IC is consuming
only 35μA of quiescent current from V . In this mode the
IN
output ripple has a variable frequency component that
depends upon load current, and will typically be about
2% peak-to-peak. Burst Mode operation ripple can be
reduced slightly by using more output capacitance (47μF
or greater). Another method of reducing Burst Mode
operation ripple is to place a small feedforward capacitor
mode reaches D
, given by:
MAX_BUCK
D
= 100 – D4
%
MAX_BUCK
SW
where D4 = duty cycle % of the 4-switch range.
SW
across the upper resistor in the V
feedback divider
OUT
D4 = (150ns • f) • 100 %
SW
network (as in Type III compensation). During the period
where the device is delivering energy to the output, the
peak switch current will be equal to 250mA typical and
the inductor current will terminate at zero current for each
cycle. In this mode the typical maximum average output
current is given by:
where f = operating frequency, Hz.
Beyond this point the “4-switch,” or buck/boost region
is reached.
Buck/Boost or 4-Switch (V ~ V
)
OUT
IN
When the internal control voltage, V , is above voltage
CI
0.2 • V
VOUT + V
IN
IOUT(MAX)BURST
≈
A
V2, switch pair AD remain on for duty cycle D
,
MAX_BUCK
IN
and the switch pair AC begins to phase in. As switch pair
AC phases in, switch pair BD phases out accordingly.
When the V voltage reaches the edge of the buck/boost
CI
range, at voltage V3, the AC switch pair completely phase
out the BD pair, and the boost phase begins at duty cycle
D4 . The input voltage, V , where the 4-switch region
SW
IN
begins is given by:
3532fc
8
LTC3532
U
OPERATIO
V
V
D
V
V
D
IN
OUT
IN
OUT
7
6
7
6
V
V
L
dI
dt
OUT
L
+
dI
dt
IN
A
A
≈ –
L
≈
L
+
–
–
250mA
0mA
250mA
0mA
3
4
3
4
SW1
SW2
SW1
SW2
B
B
C
C
3532 F04
3532 F03
T2
T1
5
5
GND
GND
Figure 3. Inductor Charge Cycle During Burst Mode Operation
Figure 4. Inductor Disharge Cycle During Burst Mode Operation
Note that the peak efficiency during Burst Mode operation
is less than the peak efficiency during fixed frequency
because the part enters full-time 4-switch mode (when
servicing the output) with discontinuous inductor cur-
rent as illustrated in Figures 3 and 4. During Burst Mode
operation, the control loop is nonlinear and cannot utilize
the control voltage from the error amp to determine the
controlmode,thereforefull-time4-switchmodeisrequired
to maintain the buck/boost function. The efficiency below
1mA becomes dominated primarily by the quiescent cur-
rent. The Burst Mode operation efficiency is given by:
where R
is in kΩ and I
is the load transition
BURST
BURST
current in Amps. For automatic operation, a filter capaci-
tor should also be connected from BURST to ground to
prevent ripple on BURST from causing the IC to oscillate
in and out of Burst Mode operation. The equation for the
minimum capacitor value is:
COUT • VOUT
60,000V
CBURST(MIN)
≥
where C
and C are in μF. In the event that
OUT
BURST(MIN)
a load transient causes the feedback pin to drop by more
than 4% from the regulation value while in Burst Mode
operation,theICwillimmediatelyswitchtofixedfrequency
mode and an internal pull-up will be momentarily applied
to BURST, rapidly charging the BURST capacitor. This
prevents the IC from immediately reentering Burst Mode
operation once the output achieves regulation.
n •ILOAD
EFFICIENCY ≅
35μA +ILOAD
where n is typically 88% during Burst Mode operation.
Automatic Burst Mode Operation Control
Burst Mode operation can be automatic or manually con-
trolled with a single pin. In automatic mode, the IC will
enterBurstModeoperationatlightloadandreturntofixed
frequency operation at heavier loads. The load current at
which the mode transition occurs is programmed using
a single external resistor from the BURST pin to ground,
according to the following equations:
Manual Burst Mode Operation
For manual control of Burst Mode operation, the RC net-
workconnectedtoBURSTcanbeeliminated.Toforcefixed
frequency mode, BURST should be connected to V . To
force Burst Mode operation, BURST should be grounded.
When commanding Burst Mode operation manually, the
circuit connected to BURST should be able to sink up to
2mA. For optimum transient response with large dynamic
loads, the operating mode should be controlled manually
by the host. By commanding fixed frequency operation
priortoasuddenincreaseinload,outputvoltagedroopcan
OUT
10.5V
Enter Burst Mode Operation: I =
RBURST
7V
RBURST
Leave Burst Mode Operation: I =
3532fc
9
LTC3532
U
OPERATIO
be minimized. Note that if the load current applied during
forced Burst Mode operation (BURST pin is grounded)
exceedsthecurrentthatcanbesupplied,theoutputvoltage
will start to droop and the IC will automatically come out
of Burst Mode operation and enter fixed frequency mode,
incorporates an active clamp circuit that holds the voltage
on V at an optimal voltage during Burst Mode operation.
C
This minimizes any output transient when returning to
fixed frequency mode operation. For optimum transient
response, Type 3 compensation is also recommended
to broad band the control loop and roll off past the two
pole response of the output LC filter. (See Closing the
Feedback Loop.)
raising V . Once regulation is achieved, the IC will then
OUT
enter Burst Mode operation once again, and the cycle will
repeat,resultinginabout4%outputripple.NotethatBurst
Mode operation is inhibited during soft-start.
Soft-Start
Burst Mode Operation to Fixed Frequency Transient
Response
The soft-start function is combined with shutdown. When
the SHDN/SS pin is brought above 1V typical, the IC is
enabled but the EA duty cycle is clamped from V . A de-
C
In Burst Mode operation, the compensation network is
tailed diagram of this function is shown in Figure 5. The
not used and V is disconnected from the error amplifier.
C
components R and C provide a slow ramping voltage
SS
SS
During long periods of Burst Mode operation, leakage
currents in the external components or on the PC board
could cause the compensation capacitor to charge (or
discharge), which could result in a large output transient
whenreturningtofixedfrequencymodeofoperation,even
at the same load current. To prevent this, the LTC3532
on SHDN/SS to provide a soft-start function. To ensure
that V is not being clamped, SHDN/SS must be raised
C
above 2.4V. To enable Burst Mode operation, SHDN/SS
must be raised to within 0.5V of V .
IN
V
IN
ERROR AMP
15μA
V
OUT
1.22V
+
–
R1
FB
9
C
P1
R2
V
C
SOFT-START
CLAMP
10
V
CI
TO PWM
COMPARATORS
SHDN/SS
R
SS
ENABLE SIGNAL
8
3532 F05
C
SS
+
–
CHIP
ENABLE
1V
Figure 5. Soft-Start Circuitry
3532fc
10
LTC3532
U
W U U
APPLICATIO S I FOR ATIO
peak inductor currents in the 1A to 2A region. To minimize
radiated noise, use a shielded inductor. See Table 1 for a
suggested list of inductor suppliers.
R
V
C
1
2
3
4
5
10
9
T
LTC3532
BURST
SW1
FB
SHDN/SS
8
Table 1. Inductor Vendor Information
SW2
V
7
IN
SUPPLIER
Coilcraft
Murata
Sumida
TDK
WEB SITE
www.coilcraft.com
www.murata.com
www.sumida.com
www.component.tdk.com
www.tokoam.com
6
GND
V
OUT
GND
3532 F06
TOKO
Figure 6. Recommended Component Placement. Traces Carrying
High Current are Direct. Trace area at FB and VC Pins are Kept
Low. Lead Length to Battery Should be Kept Short
Output Capacitor Selection
The bulk value of the output filter capacitor is set to reduce
the ripple due to charge into the capacitor each cycle. The
steady state ripple due to charge is given by:
Inductor Selection
The high frequency operation of the LTC3532 allows the
use of small surface mount inductors. The inductor ripple
current is typically set to 20% to 40% of the maximum
inductor current. For a given ripple the inductance terms
are given as follows:
% RIPPLE_BOOST =
IOUT(MAX) •(VOUT – VIN(MIN)) • 100
%
2
COUT • VOUT • f
% RIPPLE_BUCK =
V
IN(MIN) •(VOUT – V
)
IN(MIN)
LBOOST
>
H
(VIN(MAX) – VOUT ) • 100%
f • ΔIL • VOUT
1
•
8LCf2
V
IN(MAX)
VOUT •(VIN(MAX) – VOUT
)
LBUCK
>
H
f • ΔIL • V
IN(MAX)
where C
= output filter capacitor in Farads and
OUT
f = switching frequency in Hz.
where f = Operating frequency, Hz
ΔIL = Maximum allowable inductor ripple current, A
The output capacitance is usually many times larger than
theminimumvalueinordertohandlethetransientresponse
requirements of the converter. As a rule of thumb, the ratio
of the operating frequency to the unity-gain bandwidth of
the converter is the amount the output capacitance will
have to increase from the above calculations in order to
maintain the desired transient response.
V
V
V
= Minimum input voltage
= Maximum input voltage
IN(MIN)
IN(MAX)
= Output voltage
OUT
I
= Maximum output load current
OUT(MAX)
The other component of ripple is due to the ESR (equiva-
lent series resistance) of the output capacitor. Low ESR
capacitors should be used to minimize output voltage
ripple. For surface mount applications, Taiyo Yuden or
TDK ceramic capacitors, AVX TPS series tantalum capaci-
tors or Sanyo POSCAP are recommended. See Table 2 for
contact information.
For high efficiency, choose a ferrite inductor with a high
frequency core material to reduce core losses. The induc-
tor should have low ESR (equivalent series resistance) to
reducetheI2Rlosses, andmustbeabletohandlethepeak
inductorcurrentwithoutsaturating.Moldedchokesorchip
inductors usually do not have enough core to support the
3532fc
11
LTC3532
U
W U U
APPLICATIO S I FOR ATIO
Table 2. Capacitor Vendor Information
Operating Frequency Selection
SUPPLIER
AVX
WEB SITE
Higher operating frequencies allow the use of a smaller
inductor and smaller input and output filter capacitors,
thus reducing board area and component height. How-
ever, higher operating frequencies also increase the IC’s
total quiescent current due to the gate charge of the four
switches, as given by:
www.avxcorp.com
www.murata.com
www.sanyovideo.com
www.t-yuden.com
www.component.tdk.com
Murata
Sanyo
Taiyo Yuden
TDK
Buck: I = (0.125 • V • f) mA
Input Capacitor Selection
Q
IN
Boost: I = [0.06 • (V + V ) • f] mA
Q
IN
OUT
Since V is the supply voltage for the IC, as well as the
IN
Buck/Boost: I = [f • (0.19 • V + 0.06 • V )] mA
Q
IN
OUT
inputtothepowerstageoftheconverter,itisrecommended
wheref=switchingfrequencyinMHz.Thereforefrequency
selection is a compromise between the optimal efficiency
and the smallest solution size.
to place at least a 4.7μF, low ESR ceramic bypass capaci-
tor close to the V and GND pins. It is also important to
IN
minimize any stray resistance from the converter to the
battery or other power source.
Closing the Feedback Loop
The LTC3532 incorporates voltage mode PWM control.
The control to output gain varies with operation region
(buck, boost, buck/boost), but is usually no greater than
15. The output filter exhibits a double pole response, as
given by:
Optional Schottky Diodes
The Schottky diodes across the synchronous switches
B and D are not required (V
< 4.3V), but provide a
OUT
lower drop during the break-before-make time (typically
15ns) improving efficiency. Use a surface mount Schottky
diode such as an MBRM120T3 or equivalent. Do not use
ordinary rectifier diodes, since the slow recovery times
will compromise efficiency. For applications with an
output voltage above 4.3V, a Schottky diode is required
1
fFILTER
=
Hz
POLE
—
2 • π • L • COUT
(in buck mode)
fFILTER
from SW2 to V
.
OUT
V
IN
=
Hz
POLE
Output Voltage > 4.3V
—
2 • VOUT • π • L • COUT
A Schottky diode from SW2 to V
is required for output
OUT
(in boost mode)
where L is in henrys and C
voltages over 4.3V. The diode must be located as close to
the pins as possible in order to reduce the peak voltage on
SW2 due to the parasitic lead and trace inductance.
is in farads.
OUT
The output filter zero is given by:
Input Voltage > 4.5V
1
fFILTER
=
Hz
ZERO
—
2 • π •RESR • COUT
For applications with input voltages above 4.5V which
could exhibit an overload or short-circuit condition, a
2Ω/1nF series snubber is required between SW1 and
where R
is the equivalent series resistance of the
ESR
output capacitor.
GND. A Schottky diode from SW1 to V should also be
IN
added as close to the pins as possible. For the higher input
Atroublesomefeatureinboostmodeistheright-halfplane
zero (RHP), given by:
voltages, V bypassing becomes more critical; therefore,
IN
a ceramic bypass capacitor as close to the V and SGND
IN
2
V
pins as possible is also required.
IN
fRHPZ
=
Hz
2 • π •IOUT •L • VOUT
3532fc
12
LTC3532
U
W U U
APPLICATIO S I FOR ATIO
The loop gain is typically rolled off before the RHP zero
frequency.
the output filter. Referring to Figure 8, the location of the
poles and zeros are given by:
A simple Type I compensation network can be incorpo-
rated to stabilize the loop, but at a cost of reduced band-
width and slower transient response. To ensure proper
phase margin using Type I compensation, the loop must
be crossed over a decade before the LC double pole.
The unity-gain frequency of the error amplifier with the
Type I compensation is given by:
1
fPOLE1
≅
Hz
2 • π • 32e3 •R1• CP1
(which is extremely close to DC)
1
fZERO1
fZERO2
fPOLE2
=
=
=
Hz
Hz
Hz
2 • π •RZ • CP1
1
1
fUG
=
Hz
2 • π •R1• CP1
2 • π •R1• CZ1
1
referring to Figure 7.
2 • π •RZ • CP2
Mostapplicationsdemandanimprovedtransientresponse
toallowasmalleroutputfiltercapacitor.Toachieveahigher
bandwidth, Type III compensation is required, providing
two zeros to compensate for the double-pole response of
where resistance is in ohms and capacitance is in far-
ads.
V
OUT
1.22V
+
–
C
Z1
R1
ERROR
AMP
V
OUT
FB
9
1.22V
+
–
ERROR
AMP
R1
FB
9
C
R2
P1
V
C
R
Z
10
C
C
P2
R2
P1
V
C
3532 F08
10
3532 F07
Figure 7. Error Amplifier with Type l Compensation
Figure 8. Error Amplifier with Type lll Compensation
3532fc
13
LTC3532
U
TYPICAL APPLICATIO S
Three Cell to 3.3V at 300mA Buck-Boost Converter
With Automatic Burst Mode Operation and Soft-Start
V
OUT
L1
4.7μH
3.3V
300mA
R1
340k
R9
1k
SW1
SW2
SW1
SW2
V
IN
2.7V TO 4.5V
V
V
IN
OUT
FB
SHDN
BURST
FB
SHDN/SS
LTC3532
R7
200k
C4
150pF
VC
BURST
VC
R6
12.1k
R
T
C2
150pF
R
GND
T
C3
22μF
C1
4.7μF
0.01μF
R2
200k
C5
4.7nF
200k
R4
86.6k
3532 TA02
Li-Ion to 5V Boost Converter with Output Disconnect
D1
L1
2.2μH
DMBRM 110LT3
V
OUT
5V
300mA
R1
412k
R9
1k
SW1
SW2
FB
SW1
SW2
V
IN
2.5V TO 4.2V
V
IN
V
OUT
FB
SHDN
SHDN/SS
LTC3532
R7
200k
C4
68pF
V
C
BURST
BURST
V
C
R6
12.1k
R
C2
220pF
T
R
GND
T
C3
10μF
C1
4.7μF
R4
28.7k
R2
133k
C5
4.7nF
SD
3532 TA03
3532fc
14
LTC3532
U
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
0.38 ± 0.10
TYP
6
10
0.675 ±0.05
3.50 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
PACKAGE
OUTLINE
(DD) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
0.75 ±0.05
0.200 REF
0.25 ± 0.05
0.50
BSC
2.38 ±0.10
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.497 ± 0.076
(.0196 ± .003)
0.889 ± 0.127
(.035 ± .005)
10 9
8
7 6
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
5.23
(.206)
MIN
4.90 ± 0.152
(.193 ± .006)
3.20 – 3.45
(.126 – .136)
DETAIL “A”
0° – 6° TYP
0.254
(.010)
GAUGE PLANE
0.50
(.0197)
BSC
0.305 ± 0.038
(.0120 ± .0015)
TYP
1
2
3
4 5
0.53 ± 0.152
(.021 ± .006)
0.86
(.034)
REF
1.10
(.043)
MAX
RECOMMENDED SOLDER PAD LAYOUT
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.1016 ± 0.0508
(.004 ± .002)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
0.50
(.0197)
BSC
MSOP (MS) 0307 REV E
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3532fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC3532
U
TYPICAL APPLICATIO
Low Profile Li-Ion to 3.3V at 300mA Converter with Automatic Burst Mode Operation
V
OUT
L1
2.2μH
3.3V
300mA
R1
340k
R9
1k
SW1
SW2
FB
SW1
SW2
V
IN
2.5V TO 4.2V
V
V
IN
OUT
FB
SHDN/SS
LTC3532
C4
68pF
BURST
V
C
BURST
V
C
R6
12.1k
R
T
C2
220pF
R
GND
T
C3
10μF
R3
200k
R4
28.7k
R2
200k
C1
4.7μF
C5
0.01μF
L1: COILCRAFT LPO6610-222M
3532 TA04
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC3440
600mA I , 2MHz, Synchronous Buck- V : 2.5V to 5.5V, V
: 2.5V to 5.5V, I = 25μA, I = <1μA, MS10/DFN Package
Q SD
OUT
IN
OUT(RANGE)
OUT(RANGE)
OUT(RANGE)
OUT(RANGE)
OUT(RANGE)
Boost DC/DC Converter
LTC3441
LTC3442
LTC3443
LTC3444
1.2A I , 1MHz, Synchronous Buck-
V : 2.4V to 5.5V, V
IN
: 2.4V to 5.25V, I = 25μA, I = <1μA, DFN Package
Q SD
OUT
Boost DC/DC Converter
1.2A I , 2MHz, Synchronous Buck-
V : 2.4V to 5.5V, V
IN
: 2.4V to 5.25V, I = 35μA, I = <1μA, DFN Package
Q SD
OUT
Boost DC/DC Converter
1.2A I , 600kHz, Synchronous Buck- V : 2.4V to 5.5V, V
: 2.4V to 5.25V, I = 28μA, I = <1μA, MS10 Package
Q SD
OUT
IN
Boost DC/DC Converter
500mA I , 1.5MHz, Synchronous
V : 2.7V to 5.5V, V
IN
: 0.5V to 5.25V, I = <1μA, 3 × 3 DFN Package
SD
OUT
Buck-Boost DC/DC Converter Optimized
for WCDMA
LTC3531/
LTC3531-3.3/
LTC3531-3
200mA I , Synchronous Buck-Boost
V : 1.8V to 5.5V, V
: 2V to 5.25V, I = 16μA, I = <1μA, SOT-23 and 3 × 3 DFN
OUT(RANGE) Q SD
OUT
IN
DC/DC Converters in SOT-23
Packages
3532fc
LT 0308 REV C • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
16
●
●
© LINEAR TECHNOLOGY CORPORATION 2006
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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